TSU8111YFPR [TI]
具有双集成 USB2.0 开关和配件检测功能的单节 USB 充电器 | YFP | 20 | -40 to 85;
| 型号： | TSU8111YFPR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有双集成 USB2.0 开关和配件检测功能的单节 USB 充电器 | YFP | 20 | -40 to 85 开关 |
| 文件： | 总6页 (文件大小：184K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TSU8111
www.ti.com
SCDS335 –SEPTEMBER 2012
SINGLE CELL CHARGER AND USB SP2T SWITCH
SUPPORT USB AND UART
Check for Samples: TSU8111
1
FEATURES
–
Thermal Regulation and Thermal Shutdown
Protection for Output Current Control
•
Fully Compliant USB Single Cell Charger
•
ESD Performance Tested Per JESD 22
–
–
Input Voltage Dynamic Power Management
–
12-kV Human-Body Model
VBUS/DP_CON/DM_CON/ID_CON
50mA Integrated Low Dropout Linear
Regulator (LDO)
–
2-kV Human-Body Model
All Other Pins
–
–
–
1% Charge Voltage Regulation Accuracy
8% Charge Current Accuracy
•
•
IEC ESD Performance
VBUS/DP_CON/DM_CON/ID_CON to GND
Programmable Charging Current Limit up
to 950mA for Wall Adapters
–
±4-kV Contact Discharge (IEC 61000-4-2)
•
•
Switch Matrix
Surge Protection on VBUS/DP_CON/DM_CON
–
USB & UART Path Support USB 2.0 High
Speed
–
USB connector pins without external
component
Charger Detection
–
–
–
–
USB BCDv1.1 Compliant
VBUS Detection
APPLICATIONS
•
•
•
•
•
Cell Phones & Smart Phones
Tablet PCs
Data Contact Detection
Primary & Secondary Detection
Digital Cameras & Camcorders
GPS Navigation Systems
•
Additional Features
–
–
I2C interface With Host Processor
Micro USB interface with
USB/UART/Audio/Video
Switches Controlled by Automatic
Detection or Manual Control
TYPICAL APPLICATION DIAGRAM
–
–
Interrupts Generated for Plug/Unplug
Support Control Signals Used In
Manufacturing (JIG, BOOT)
BATTERY
IEC ESD
VLDO
VBAT
outside
VBUS
inside
•
•
Compatible Accessories
VBUS
CHG IC
DP_CON
DP_CON
DM_CON
DP_HT
USB
–
–
–
USB Chargers (DCP, CDP)
USB Data Port
TSU8111
DM_CON
DM_HT
USB2.0 High
Speed
ID_CON
ID_CON
TxD
RxD
UART
Factory Cable
Additional Protection
I2C
Control
–
28V VBUS Rating With Over-voltage
Protection
WHITE SPACE
Table 1. ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TSU8111YFPR
TOP-SIDE MARKING
–40°C to 85°C WCSP 0.4-mm pitch – YFP
Tape and reel
A8
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TSU8111
SCDS335 –SEPTEMBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DESCRIPTION
The TSU8111 is a differential high performance automated SP2T switch with impedance detection and integrated
Li-Ion linear charger device targeted at space-limited portable applications. The switch features impedance
detection which supports the detection of various accessories that are attached through DP, DM and ID. The
charger detection satisfies USB charger specification v1.1. VBUS has 28V tolerance to avoid external protection.
The device operates from either a USB port or dedicated charger and supports charge currents up to 950mA.
Power for this device is supplied through VBAT of the system or through VBUS when attached.
The switch is controlled by automatic detection logic or through I2C manually. JIG and BOOT pins are used
when a USB, UART JIG cable is used to test in the development and manufacturing. TSU8111 has open-drain
JIG output (active low).
BLOCK DIAGRAM
VDDIO
I2C
Interface
LOW
DROPOUT
REGULATOR
VLDO
VBAT
SCL
SDA
CHARGER
IC
I2C Interface
&
INTB
Hardware
Control
Switches
JIG
USB_DP
USB_DM
State Machine
Switch
Ctrl
BOOT
TxD
RxD
Buffers and/or
Comparators
VBUS
DP
DM
ID
Charger
Accessory
ID
Detection
Sources
And
Detection
ADC
Comp’s
SWITCH MATRIX
TSU8111 SWITCH
MATRIX
DM_HT
VBUS
USB
DP_HT
DM_CON
DP_CON
ID_CON
Micro
USB
TxD
RxD
UART
2
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
To request full datasheet, please send an e‐mail to:
signal‐switches@list.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package Qty
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
(1)
(2)
(3)
(4)
TSU8111YFPR
ACTIVE
DSBGA
YFP
20
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
A8
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
D: Max = 2.14 mm, Min = 2.08 mm
E: Max = 1.76 mm, Min =1.699 mm
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明