TUSB319IDRFRQ1 [TI]
汽车类 USB Type-C DFP 端口控制器 | DRF | 8 | -40 to 85;
| 型号： | TUSB319IDRFRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 汽车类 USB Type-C DFP 端口控制器 | DRF | 8 | -40 to 85 控制器 |
| 文件： | 总20页 (文件大小：1011K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TUSB319-Q1
SLLSEV4 –FEBRUARY 2017
TUSB319-Q1 USB Type-C DFP Port Controller
1 Features
3 Description
The TUSB319-Q1 is a USB Type-C Downstream
Facing Port (DFP) controller. The TUSB319-Q1
monitors the USB Type-C Configuration Channel
(CC) lines to determine when an USB device is
attached. If an Upstream Facing Port (UFP) device is
attached, the TUSB319-Q1 drives an open drain
output ID that can be used in the system to apply
VBUS power. The device also communicates the
selectable VBUS current sourcing capability to the
UFP via the CC lines.
1
•
•
Meets USB Type-C™ Specifications
Supports DFP (Host/Source) Applications with up
to 15W Power
•
Supports Type-C Current Mode Advertisement up
to 3 A (Default, 1.5 A, 3 A)
•
•
Provides Type-C Plug Orientation
Channel Configuration (CC)
–
–
Attach of USB Port Detection
Cable Orientation Detection
Device Information(1)
•
•
•
•
•
VBUS Detection
PART NUMBER
PACKAGE
BODY SIZE (NOM)
Supply Voltage: 3.8 V to 5.5 V
Low Current Consumption
2.00 mm x 2.00 mm
0.5 mm pitch
TUSB319-Q1
WSON (8)
2 x 2 mm WSON Package with 0.5 mm Pitch
Industrial Temperature Range of –40°C to 85°C
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
2 Applications
•
•
•
Wall-charger
Automotive Car Charger, USB Port
DFP Port for Desktop, Notebooks, All-in-One
SPACER
SPACER
Simplified Schematic
ꢀë
VBUS Switch
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TUSB319-Q1
Type-C
CC Controller
DFP
//1
//2
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TUSB319-Q1
SLLSEV4 –FEBRUARY 2017
www.ti.com
Table of Contents
7.4 Device Functional Modes.......................................... 9
Application and Implementation ........................ 10
8.1 Application Information............................................ 10
8.2 Typical Application .................................................. 10
8.3 Initialization Set Up ................................................ 12
Power Supply Recommendations...................... 12
1
2
3
4
5
6
Features.................................................................. 1
8
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics.......................................... 6
Detailed Description .............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
9
10 Layout................................................................... 12
10.1 Layout Guidelines ................................................. 12
10.2 Layout Example .................................................... 12
11 Device and Documentation Support ................. 13
11.1 Receiving Notification of Documentation Updates 13
11.2 Community Resources.......................................... 13
11.3 Trademarks........................................................... 13
11.4 Electrostatic Discharge Caution............................ 13
11.5 Glossary................................................................ 13
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 13
4 Revision History
DATE
REVISION
NOTES
February 2017
*
Initial release.
2
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5 Pin Configuration and Functions
DRF Package
8-Pin WSON
Top View
1
8
7
6
5
CC1
VDD
GND
ID
CC2
CURRENT_MODE
2
3
4
Thermal
Pad
VBUS_DET
DIR
Not to scale
Pin Functions
PIN
TYPE
DESCRIPTION
NAME
NO.
(1)
CC2
1
I/O
Type-C configuration channel signal 2
Advertise VBUS current. This 3-level input is used to control Type-C current advertisement.
The pin can be dynamically set.
L - Default Current is 500 mA for USB 2.0 and 900 mA for USB 3.1. Pull-down to GND or
leave unconnected.
CURRENT_MODE
2
I
M - Medium current is 1.5 A. Pull-up to TUSB319-Q1 VDD with 500-kΩ resistor.
H - High current is 3 A. Pull-up to TUSB319-Q1 VDD with 10-kΩ resistor.
5-V to 28-V system VBUS input voltage. One 900-kΩ external resistor required between
system VBUS and VBUS_DET pin.
VBUS_DET
DIR
3
4
I
Type-C plug orientation. This open drain output indicates the detected plug orientation: Type-
C plug position 2 (H); Type-C plug position 1 (L).
O
(1)
ID
5
6
7
8
O
G
Open drain output; asserted low when the CC pins detect device attachment.
GND
VDD
Ground
P
3.8-V to 5-V power
(1)
CC1
I/O
Type-C configuration channel signal 1
(1) CC1, CC2 and ID pins are failsafe with leakage current defined in the Electrical Characteristics.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–65
MAX
6
UNIT
Supply voltage
VDD
V
CC1, CC2, CURRENT_MODE, ID, DIR
VBUS_DET
6
Control pins
V
4
Storage temperature, Tstg
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
±3000
±1500
UNIT
Human-body model (HBM), per AEC Q100-002(1)
Charged-device model (CDM), per AEC Q100-0111
V(ESD)
Electrostatic discharge
V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
3.8
NOM
MAX
5.5
6
UNIT
V
VDD
Supply voltage range
VDD(transient)
VDD(ramp)
VBUS
Transient voltage (with maximum width of 5 ms)
VDD ramp time
3.5
V
40
mS
V
System VBUS voltage
0
5
28
VBUS_DET
TA
VBUS_DET threshold voltage on the pin
Operating free air temperature range
Junction temperature
3.8
85
V
–40
–40
25
°C
°C
TJ
105
6.4 Thermal Information
TUSB319-Q1
DRF (WSON)
8 PINS
92.7
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
66.6
40.8
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bot) thermal resistance
3.4
ψJB
46.3
RθJC(bot)
43.5
(1) For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application
report.
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6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
TEST
CONDITIONS
PARAMETER
MIN
TYP
MAX
UNIT
Active
105
105
140
140
µA
µA
Device average power consumption
Unattached
CC1 and CC2 Pins
ICC(DEFAULT_P)
ICC(MED_P)
Default mode pullup current source.
64
166
304
80
180
330
96
194
356
µA
µA
µA
Medium (1.5 A) mode pullup current source.
High (3 A) mode pullup current source.
ICC(HIGH_P)
VDD = 0 V,
CC1, CC2 = 5 V
I(FS,CC)
Fail safe current (CC1, CC2)
1
µA
Control Pins: CURRENT_MODE, DIR, ID
VIL
VIM
VIH
IIH
Low-level control signal input voltage, (CURRENT_MODE)
0.4
V
V
Mid-level control signal input voltage (CURRENT_MODE)
High-level control signal input voltage (CURRENT_MODE)
High-level input current
0.28 × VDD
VDD - 0.3
–1
0.56 × VDD
V
1
1
µA
µA
IIL
Low-level input current
–1
VDD = 0 V,
ID = 5 V
I(FS,ID)
Fail safe current (ID)
1
µA
RPD(CUR)
VOL
Internal pulldown resistance for CURRENT_MODE pin
Low-level signal output voltage (open-drain) (ID and DIR)
External pullup resistor on open drain IOs (ID and DIR)
275
kΩ
V
IOL = –1.6 mA
0.4
Rp(ODext)
200
500
kΩ
External pull-up resistor on CURRENT_MODE pin to
advertise 1.5-A current
Rp(cm_med)
Rp(cm_high)
kΩ
kΩ
External pull-up resistor on CURRENT_MODE pin to
advertise 3-A current
10
VBUS_DET IO Pins (Connected to System VBUS signal through external resistor)
VBUS(THR)
VBUS_DET(THR)
RVBUS
VBUS threshold range
2.4
236
850
3.3
315
900(1)
4.2
394
910
V
VBUS_DET pin threshold
mV
KΩ
KΩ
External resistor between VBUS and VBUS_DET pin
Internal pulldown resistance for VBUS_DET
RVBUS(PD)
95
(1) If smaller RVBUS is desired add an additional resistor from VBUS_DET pin to GND in parallel to internal 95K resistor keeping the same
ratio of pull-up and pull-down resistors.
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6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
TYP
168
2
MAX
UNIT
ms
tCCCB_DEFAULT
tVBUS_DB
Port attachment debounce time
Debounce of VBUS_DET pin after valid VBUS_THR (See Figure 1.)
ms
V
VBUS
V
BUS_THR
t
VBUS_DB
0 V
Time
Figure 1. VBUS Detect and Debounce
6
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7 Detailed Description
7.1 Overview
The USB Type-C ecosystem operates around a small form factor connector and cable that is flippable and
reversible. Because of the nature of the connector, a scheme is needed to determine the connector orientation.
Additional schemes are needed to determine when a USB port is attached and the acting role of the USB port
(DFP, UFP), as well as to communicate Type-C current capabilities. These schemes are implemented over the
CC pins according to the USB Type-C specifications. The TUSB319-Q1 device provides Configuration Channel
(CC) logic for determining USB port attach and detach, cable orientation, and Type-C current mode for DFP
applications.
7.1.1 Cables, Adapters, and Direct Connect Devices
Type-C Specifications defines several cables, plugs and receptacles to be used to attach ports. The TUSB319-
Q1 device supports all cables, receptacles, and plugs. The device does not support e-marking.
7.1.1.1 USB Type-C Receptacles and Plugs
Below is list of Type-C receptacles and plugs supported by the device:
•
•
•
USB Type-C receptacle for USB2.0 and USB3.1 and full-featured platforms and devices
USB full-featured Type-C plug
USB2.0 Type-C plug
7.1.1.2 USB Type-C Cables
Below is a list of Type-C cables types supported by the device:
•
•
•
USB full-featured Type-C cable with USB3.1 full-featured plug
USB2.0 Type-C cable with USB2.0 plug
Captive cable with either a USB full-featured plug or USB2.0 plug
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7.2 Functional Block Diagram
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7.3 Feature Description
Table 1. Supported Features for the TUSB319-Q1 Device by Mode
SUPPORTED FEATURES
Port attach and detach
Cable orientation
DFP
Yes
Yes
Yes
Yes
Current advertisement
Legacy cables
7.3.1 Downstream Facing Port (DFP) - Source
The TUSB319-Q1 is a DFP device; it presents the appropriate Rp resistors on both CC pins, based on the state
of the CURRENT_MODE pin to advertise the desired current level (USB-standard, 1.5 A and 3 A).
The TUSB319-Q1 can operate with older USB Type-C 1.0 devices except for a USB Type-C 1.0 DRP device.
This limitation is a result of backwards compatibility problem between USB Type-C 1.1 DFP and a USB Type-C
1.0 DRP.
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7.3.2 Type-C Current Mode
The TUSB319-Q1 device supports both advertising Type-C current by means of the CURRENT_MODE pin,
which allows the CC controller to advertise 500 mA (for USB2.0) or 900 mA (for USB3.1) if CURRENT_MODE
pin is left unconnected or pulled to GND. If a higher level of current is required, the CURRENT_MODE can be
pulled up to VDD through a 500-kΩ resistor to advertise medium current at 1.5 A or pulled up to VDD through a
10-kΩ resistor to advertise high current at 3 A. Table 2 lists the Type-C current advertisements and detection.
Table 2. Type-C Current Advertisement and Detection
TYPE-C CURRENT
500 mA (USB2.0)
900 mA (USB3.1)
Medium - 1.5 A
High - 3 A
CURRENT ADVERTISEMENT
Default
CURRENT_MODE = L
CURRENT_MODE = M
CURRENT_MODE = H
7.3.3 VBUS Detection
The TUSB319-Q1 device supports VBUS detection according to the Type-C Specification. The system VBUS
voltage must be routed through a 900-kΩ resistor to the VBUS_DET pin on the TUSB319-Q1. When voltage on
VBUS_DET pin is below the VBUS(THR) and Rd is detected on either CC1 or CC2, the TUSB319 assumes system
VBUS is at vSafe0V (VBUS < 800 mV) and will assert ID low.
If VBUS_DET pin is left unconnected system needs to ensure that the VBUS level is below vSafe0V before
VBUS is enabled.
7.3.4 Cable Orientation
The TUSB319-Q1 detects the cable orientation by monitoring the voltage on the CC pins. When a voltage level
within the proper threshold is detected on CC1, the DIR pin is pulled low. When a voltage level within the proper
threshold is detected on CC2, the DIR is pulled high. The DIR pin is an open drain output.
7.4 Device Functional Modes
The TUSB319-Q1 device has two functional modes. Table 3 lists these modes:
Table 3. USB Type-C States According to TUSB319-Q1 Functional Modes
MODES
GENERAL BEHAVIOR
USB port unattached.
USB port attached.
STATES(1)
Unattached.SRC
AttachWait.SRC
Attached.SRC
Unattached
Active
(1) Required; not in sequential order.
7.4.1 Unattached Mode
Unattached mode is the primary mode of operation for the TUSB319-Q1 device, because a USB port can be
unattached for a lengthy period of time. In unattached mode, all IOs are operational. After the TUSB319-Q1
device is powered up, the part enters unattached mode until a successful attach has been determined.
7.4.2 Active Mode
Active mode is defined as the port being attached. When in active mode, the TUSB319-Q1 device communicates
to the system that the USB port is attached. This happens through the ID pin. The TUSB319-Q1 device exits
active mode when the cable is unplugged.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The TUSB319-Q1 device is a Type-C configuration channel logic and port controller. The TUSB319-Q1 device
can detect when a Type-C device is attached, what type of device is attached, the orientation of the cable, and
power capabilities, this power capabilities are sourcing only since the TUSB319-Q1 device can be used in a
source application (DFP) only.
8.2 Typical Application
8.2.1 DFP Mode
Figure 2 shows the TUSB319-Q1 on a DFP port with USB3 functionality.
USB VBUS Switch 5V 3A
Power Source
VIN
VOUT
EN#
150 µF
VDD_5V
10µF
100 nF
VBUS
VCC_3.3V
900 kꢀ
A12
A11
A10
A9
B1
B2
10 kꢀ
VBUS_DET
B3
200 kW
B4
CURRENT_MODE
A8
B5
CC1
CC2
TUSB319-Q1
A7
B6
ID
A6
B7
A5
B8
A4
B9
VCC_3.3V
A3
B10
B11
B12
A2
A1
200 kW
1 kꢀ
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Figure 2. DFP Mode Schematic
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Typical Application (continued)
8.2.1.1 Design Requirements
For this design example, use the parameters listed in Table 4:
Table 4. Design Requirements for DFP Mode
DESIGN PARAMETER
VDD (3.8 V to 5.5 V)
VALUE
5 V
Advertised Type-C Current (Default, 1.5 A, 3 A)
3 A
8.2.1.2 Detailed Design Procedure
The TUSB319-Q1 device supports a VDD in the range of 3.8 V to 5.5 V. In this particular case, VDD is set to 5 V.
A 100-nF capacitor is placed near VDD
.
The TUSB319-Q1 current advertisement is determined by the state of the CURRENT_MODE pin. In this
particular example, 3 A advertisement is desired so the CURRENT_MODE pin is pulled high to VDD through 10-
kΩ resistor.
The VBUS_DET pin must be connected through a 900-kΩ resistor to VBUS on the Type-C that is connected. This
large resistor is required to protect the TUSB319-Q1 device from large VBUS voltage that is possible in present
day systems. This resistor along with internal pulldown keeps the voltage observed by the TUSB319-Q1 device
in the recommended range.
The USB2 specification requires the bulk capacitance on VBUS of at least 120 µF. In this particular case, a 150-
µF capacitor was chosen.
TUSB319-Q1 does not provide VBUS discharge and requires an external solution either through switched
resistor pull-down as shown in Figure 2 or elsewhere in the system.
8.2.1.3 Application Curve
Figure 3. CC Detection
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8.3 Initialization Set Up
The general power-up sequence for the TUSB319-Q1 device is as follows:
1. System is powered off (device has no VDD).
2. VDD ramps – POR circuit.
3. The TUSB319-Q1 device enters unattached mode.
4. The TUSB319-Q1 device monitors the CC pins.
5. The TUSB319-Q1 device enters active mode when attach has been successfully detected.
9 Power Supply Recommendations
The TUSB319-Q1 device has a wide power supply range from 3.8 V to 5.5 V.
10 Layout
10.1 Layout Guidelines
1. An extra trace (or stub) is created when connecting between more than two points. A trace connecting pin A6
to pin B6 will create a stub because the trace also has to go to the USB Host. Ensure that:
–
–
A stub created by short on pin A6 (DP) and pin B6 (DP) at Type-C receptacle does not exceed 3.5 mm.
A stub created by short on pin A7 (DM) and pin B7 (DM) at Type-C receptacle does not exceed 3.5 mm.
2. A 100-nF capacitor should be placed as close as possible to the VDD pin.
10.2 Layout Example
Figure 4. Example Layout
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TUSB319IDRFRQ1
ACTIVE
WSON
DRF
8
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 85
T319
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TUSB319IDRFRQ1
WSON
DRF
8
3000
180.0
8.4
2.3
2.3
1.15
4.0
8.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Aug-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
WSON DRF
SPQ
Length (mm) Width (mm) Height (mm)
210.0 185.0 35.0
TUSB319IDRFRQ1
8
3000
Pack Materials-Page 2
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