TUSB322IRWBR_技术文档

Support &

Community

Product

Folder

Order

Now

Tools &

Software

Technical

Documents

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

TUSB322I USB Type-C™配置通道逻辑和端口控制（支持 VCONN）

1 特性

2 应用

1

•

USB Type-C™规范 1.1

向后兼容 USB Type-C 规范 1.0

支持高达 3A 的电流通告和检测

模式配置

•

主机、设备、双角色端口应用

•

移动电话

平板电脑和笔记本电脑

USB 外设

–

仅主机 - 下行端口 (DFP)/源设备（仅限 I²C 模

式）

仅器件 – 上行端口 (UFP)/接收设备（仅限 I²C

模式）

3 说明

TUSB322I 器件可在 USB Type-C 端口上实现 Type-C

生态系统所需的配置通道 (CC) 逻辑。TUSB322I 器件

使用 CC 引脚来确定端口的连接状态和电缆方向，以

及进行角色检测和 Type-C 电流模式控制。TUSB322I

器件可配置为下行端口 (DFP)、上行端口 (UFP) 或双

角色端口 (DRP)，因此成为任何应用的理想选择。

双角色端口 – DRP

•

通道配置 (CC)

–

V

USB 端口连接检测

电缆方向检测

角色检测

根据 Type-C 规范，TUSB322I 器件会交替配置为

DFP 或 UFP。CC 逻辑块通过监视 CC1 和 CC2 引脚

上的上拉或下拉电阻，以确定何时连接了 USB 端口、

电缆的方向以及检测到的角色。CC 逻辑根据检测到的

角色来确定 Type-C 电流模式为默认、中等还是高。该

逻辑通过实施 V_BUS检测来确定端口在 UFP 和 DRP

模式下是否连接成功。当检测到有源电缆

Type-C 电流模式（默认、中等和高）+u

_BUS检测

•

I²C 或 GPIO 控制

针对有源电缆提供 VCONN 支持

外部开关电缆检测与

方向控制

通过 I²C 实现角色配置控制

电源电压：4.5V 至 5.5V

低电流消耗

•

时，TUSB322I 将为 VCONN 供电。

该器件能够在宽电源范围内工作，并且具有较低功耗。

TUSB322I 器件可在工业级温度范围内工作。

工业温度范围：–40°C 至 85°C

器件信息⁽¹⁾

器件型号

TUSB322I

封装

封装尺寸（标称值）

X2QFN (12)

1.60mm x 1.60mm

(1) 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品

附录。

空白

简化原理图

VDD

示例应用

VCONN

VBUS

Detection

VBUS_DET

CC Logic

for Mode

Configuration

and Detection

CC1

CC2

EN_N

ADDR

DIR

ID

SDA/OUT1

SCL/OUT2

Controller

INT_N/OUT3

GND

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SLLSEO5

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

7.5 Programming........................................................... 15

7.6 Register Maps......................................................... 16

Application and Implementation ........................ 20

8.1 Application Information............................................ 20

8.2 Typical Application .................................................. 20

8.3 Initialization Set Up ................................................ 27

Power Supply Recommendations...................... 27

1

2

3

4

5

6

特性.......................................................................... 1

应用.......................................................................... 1

说明.......................................................................... 1

修订历史记录 ........................................................... 2

Pin Configuration and Functions......................... 3

Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics........................................... 5

6.6 Timing Requirements................................................ 6

6.7 Switching Characteristics.......................................... 7

Detailed Description .............................................. 8

7.1 Overview ................................................................... 8

7.2 Functional Block Diagram ......................................... 8

7.3 Feature Description................................................... 8

7.4 Device Functional Modes........................................ 13

8

9

10 Layout................................................................... 27

10.1 Layout Guidelines ................................................. 27

10.2 Layout Example .................................................... 27

11 器件和文档支持 ..................................................... 28

11.1 文档支持................................................................ 28

11.2 接收文档更新通知 ................................................. 28

11.3 社区资源................................................................ 28

11.4 商标....................................................................... 28

11.5 静电放电警告......................................................... 28

11.6 Glossary................................................................ 28

12 机械、封装和可订购信息....................................... 28

7

4 修订历史记录

注：之前版本的页码可能与当前版本有所不同。

Changes from Revision B (September 2016) to Revision C

Page

•

Changed R_VBUSvalues From: MIN = 891, TYP = 900, MAX = 909 KΩ To: MIN = 855, TYP = 887, MAX = 920 KΩ ........... 6

Changes from Revision A (May 2016) to Revision B

Page

•

Changed pins CC1 and CC2 values From: MIN = –0.3 MAX = V_DD+ 0.3 To: MIN –0.3 MAX = 6 in the Absolute

Maximum Ratings................................................................................................................................................................... 4

Changes from Original (October 2015) to Revision A

Page

•

Added Shutdown current consumption to Electrical Characteristics table. ............................................................................ 5

2

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

5 Pin Configuration and Functions

RWB Package

12-Pin X2QFN

Top View

1

2

VBUS_DET

3

12

VDD

DIR

4

5

6

11

10

9

EN_N

GND

ID

ADDR

INT_N/OUT3

7

8

Pin Functions

I/O

DESCRIPTION

NAME

CC1

NO.

1

I/O

Type-C configuration channel signal 1

Type-C configuration channel signal 2

CC2

2

5-V to 28-V V_BUSinput voltage. V_BUSdetection determines UFP attachment. One 900-kΩ

external resistor required between system V_BUSand VBUS_DET pin.

VBUS_DET

3

4

I

DIR of plug. The open drain output indicates the detected plug orientation: Type-C plug

position 2 (H); Type-C plug position 1 (L).

DIR

O

Tri-level input pin to indicate I²C address or GPIO mode:

H - I²C is enabled and I²C 7-bit address is 0x67.

NC - GPIO mode (I²C is disabled)

ADDR

5

I

L - I²C is enabled and I²C 7-bit address is 0x47.

ADDR pin should be pulled up to V_DDif high configuration is desired

The INT_N/OUT3 is a dual-function pin. When used as the INT_N, the pin is an open drain

output in I²C control mode and is an active low interrupt signal for indicating changes in I²C

registers. When used as OUT3, the pin is in audio accessory detect in GPIO mode: no

detection (H), audio accessory connection detected (L).

The SDA/OUT1 is a dual-function pin. When I²C is enabled (ADDR pin is high or low), this

pin is the I²C communication data signal. When in GPIO mode (ADDR pin is NC), this pin is

an open drain output for communicating Type-C current mode detect when the TUSB322I

device is in UFP mode: default current mode detected (H); medium or high current mode

detected (L).

INT_N/OUT3

SDA/OUT1

6

7

O

I/O

The SCL/OUT2 is a dual function pin. When I²C is enabled (ADDR pin is high or low), this

pin is the I²C communication clock signal. When in GPIO mode (ADDR pin is NC), this pin is

an open drain output for communicating Type-C current mode detect when the TUSB322I

device is in UFP mode: default or medium current mode detected (H); high current mode

detected (L).

SCL/OUT2

ID

8

9

I/O

O

Open drain output; asserted low when the CC pins detect device attachment when port is a

source (DFP), or dual-role (DRP) acting as source (DFP).

GND

EN_N

V_DD

10

11

12

G

I

Ground

EN_N. Active low enable.

Positive supply voltage

P

3

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.3

–65

MAX

UNIT

Supply voltage

Control pins

V_DD

6

V

ADDR, ID, DIR, INT_N/OUT3, EN_N

CC1, CC2

V_DD+ 0.3

6

V_DD+ 0.3

4

V

SDA/OUT1, SCL/OUT2

VBUS_DET

Storage temperature, T_stg

150

°C

(1) Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods can affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

±3000

V_(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

C101⁽²⁾

±1500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

4.5

4

NOM

MAX

5.5

UNIT

V

V_DD

Supply voltage

5

V_BUS

System V_BUSvoltage

28

V

DC voltage range for control lines: ADDR, ID, DIR, INT_N/OUT3, SDA/OUT1,

SCL/OUT2, EN_N, CC1, and CC2.

0

5.5

V

VCONTR

OL

DC voltage range for VBUSDET

0

4.75

–40

4

5.5

85

V

VCONN Supply for active cable (With V_DDat 5 V)

T_AOperating free-air temperature

TUSB322I

25

°C

6.4 Thermal Information

TUSB322I

RWB (X2QFN)

12 PINS

169.3

THERMAL METRIC⁽¹⁾

UNIT

R_θJA

Junction-to-ambient thermal resistance

°C/W

R_θJC(top)

R_θJB

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

68.1

83.4

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

2.2

ψ_JB

83.4

R_θJC(bot)

N/A

(1) For more information about traditional and new thermal metrics, see the Semiconductor and C Package Thermal Metrics application

report, SPRA953.

4

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

TEST

CONDITIONS

PARAMETER

MIN

TYP

MAX

UNIT

Power Consumption

Leakage current when VDD is supplied but the device is

I_{SHUTDOWN_UFP}

0.04

70

µA

not enabled. (VDD = 5 V, EN_N = H)

Current consumption in unattached mode when port is

I_{UNATTACHED_UFP}

unconnected and waiting for connection. (V_DD= 5 V, ADDR

= NC, MODE_SELECT = 2'b01)

Current consumption in active mode. (V_DD= 5 V, ADDR =

NC, MODE_SELECT = 2'b01)

I_{ACTIVE_UFP}

70

CC1 and CC2 Pins

R_{CC_DB}

Pulldown resistor when in dead-battery mode.

Pulldown resistor when in UFP or DRP mode.

4.1

4.6

5.1

6.1

5.6

kΩ

R_{CC_D}

Voltage level range for detecting a DFP attach when

configured as a UFP and DFP is advertising default current

source capability.

V_{UFP_CC_USB}

0.25

0.7

0.61

1.16

2.04

1.64

2.74

0.25

0.45

0.84

V

Voltage level range for detecting a DFP attach when

configured as a UFP and DFP is advertising medium (1.5

A) current source capability.

V_{UFP_CC_MED}

Voltage level range for detecting a DFP attach when

configured as a UFP and DFP is advertising high (3 A)

current source capability.

V_{UFP_CC_HIGH}

1.31

1.51

2.46

0.15

0.35

0.76

Voltage threshold for detecting a UFP attach when

configured as a DFP and advertising default current source

capability.

V_{TH_DFP_CC_USB}

V_{TH_DFP_CC_MED}

V_{TH_DFP_CC_HIGH}

V_{TH_AC_CC_USB}

V_{TH_AC_CC_MED}

V_{TH_AC_CC_HIGH}

1.6

2.6

0.2

0.4

0.8

Voltage threshold for detecting a UFP attach when

configured as a DFP and advertising medium current (1.5

A) source capability.

Voltage threshold for detecting a UFP attach when

configured as a DFP and advertising high current (3.0 A)

source capability.

Voltage threshold for detecting a active cable attach when

configured as a DFP and advertising default current

source.

Voltage threshold for detecting a active cable attach when

configured as a DFP and advertising medium current (1.5

A) source.

Voltage threshold for detecting a active cable attach when

configured as a DFP and advertising high current (3.0 A)

source.

Default mode pullup current source when operating in DFP

or DRP mode.

I_{CC_DEFAULT_P}

I_{CC_MED_P}

64

166

304

80

180

330

96

194

356

µA

Medium (1.5 A) mode pullup current source when

operating in DFP or DRP mode.

High (3 A) mode pullup current source when operating in

DFP or DRP mode.⁽¹⁾

I_{CC_HIGH_P}

Control Pins: EN_N, ADDR, INT/OUT3, DIR, ID

V_IL

V_IM

V_IH

I_IH

Low-level control signal input voltage, (EN_N, ADDR)

0.4

0.56 × V_DD

V_DD

V

Mid-level control signal input voltage (ADDR)

High-level control signal input voltage (EN_N, ADDR)

High-level input current

0.28 × V_DD

V_DD– 0.3

–20

V

20

µA

I_IL

Low-level input current

–10

10

V_DD= 0 V; ID = 5

V

I_{ID_LEAKAGE}

Current leakage on ID pin.

10

µA

R_{EN_N}

R_pu

Internal pull-up resistance for EN_N.

Internal pullup resistance (ADDR)

Internal pulldown resistance (ADDR)

1.1

588

1.1

MΩ

kΩ

R_pd

MΩ

Low-level signal output voltage (open-drain) (INT_N/OUT3,

ID)

V_OL

I_OL= –1.6 mA

0.4

V

(1) V_DDmust be 3.5 V or greater to advertise 3 A current.

5

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

Electrical Characteristics (continued)

over operating free-air temperature range (unless otherwise noted)

TEST

CONDITIONS

PARAMETER

MIN

TYP

MAX

UNIT

External pullup resistor on open drain IOs (INT_N/OUT3,

ID)

R_{p_ODext}

R_{p_TLext}

200

4.7

kΩ

Tri-level input external pullup resistor (ADDR)

(2)

I²C - SDA/OUT1, SCL/OUT2 can operate from 1.8 or 3.3 V (±10%) when ADDR pin is low or high.

Supply range for I²C (SDA/OUT1, SCL/OUT2)

V_{DD_I2C}

1.65

1.05

1.8

3.6

V

V_IH

V_IL

High-level signal voltage

Low-level signal voltage

0.4

V_OL

Low-level signal output voltage (open drain)

I_OL= –1.6 mA

VBUS_DET IO Pins (Connected to System V_BUSsignal)

V_{BUS_THR}

R_VBUS

V_BUSthreshold range

2.95

855

3.3

887

95

3.8

V

External resistor between V_BUSand VBUS_DET pin

Internal pulldown resistance for VBUS_DET

920

KΩ

R_{VBUS_PD}

DIR pin (Open Drain IO)

V_OL

Low-level signal output voltage

I_OL= –1.6 mA

0.4

V

VCONN

R_ON

On resistance of the VCONN power FET

Voltage tolerance on VCONN power FET

Voltage to pass through VCONN power FET

1.25

5.5

Ω

V

V_TOL

V_PASS

5.5

VCONN current limit; VCONN is disconnected above the

value

I_VCONN

C_BULK

225

10

300

375

200

mA

uF

Bulk capacitance on VCONN; placed on V_DDsupply

(2) When using 3.3 V for I²C, customer must ensure V_DDis above 3.0 V at all times.

6.6 Timing Requirements

MIN

NOM

MAX

UNIT

I²C (SDA, SCL)

t_SU:DAT

t_HD;DAT

t_SU:STA

t_HD:STA

t_SU:STO

t_VD;DAT

t_VD;ACK

t_BUF

Data setup time

100

10

ns

µs

kHz

ns

pF

Data hold time

Set-up time, SCL to start condition

Hold time, (repeated) start condition to SCL

Set up time for stop condition

0.6

Data valid time

0.9

Data valid acknowledge time

Bus free time between a stop and start condition

SCL clock frequency; I²C mode for local I²C control

Rise time of both SDA and SCL signals

Fall time of both SDA and SCL signals

1.3

f_SCL

400

300

400

100

t_r

t_f

C_{BUS_100KHZ}Total capacitive load for each bus line when operating at ≤ 100 KHz

C_{BUS_400KHZ}Total capacitive load for each bus line when operating at 400 KHz.

6

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

6.7 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN TYP MAX

UNIT

ms

Power on default of CC1 and CC2 voltage debounce

t_{CCCB_DEFAULT}

DEBOUNCE register = 2'b00

168

2

time

Debounce of VBUS_DET pin after valid V_{BUS_THR}

t_{DRP_DUTY_CY}Power-on default of percentage of time DRP advertises DRP_DUTY_CYCLE register

t_{VBUS_DB}

ms

30%

DFP during a T_DRP

= 2'b00

CLE

The period TUSB322I in DFP mode completes a DFP to

UFP and back advertisement.

Time from EN_N low and V_DDactive to I²C access

available

t_DRP

50

26

75

49

100

ms

t_{I2C_EN}

100

95

ms

t_{SOFT_RESET}

Soft reset duration

VBUS

V_{BUS_THR}

T_{VBUS_DB}

0V

Figure 1. VBUS Detect and Debounce

7

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

7 Detailed Description

7.1 Overview

The USB Type-C ecosystem operates around a small form factor connector and cable that is flippable and

reversible. Due to the nature of the connector, a scheme is required to determine the connector orientation.

Additional schemes are required to determine when a USB port is attached and the acting role of the USB port

(DFP, UFP, DRP), as well as to communicate Type-C current capabilities. These schemes are implemented over

the CC pins according to the USB Type-C specifications. The TUSB322I device provides Configuration Channel

(CC) logic for determining USB port attach and detach, role detection, cable orientation, and Type-C current

mode. The TUSB322I device also contains several features such as VCONN sourcing, USB3.1 mux direction

control, mode configuration, and low standby current, all of which make the TUSB322I device ideal for source or

sinks in USB2.0 or USB3.1 applications.

7.2 Functional Block Diagram

VDD

VCONN

CC1

ADDR

Connection

and

Cable

Digital Controller

CSR

EN_N

Detection

I2C

SDA/OUT1

SCL/OUT2

CC2

DIR_CTRL

DIR Logic

DIR

GND

900K 1ꢀ

7.3 Feature Description

7.3.1 Cables, Adapters, and Direct Connect Devices

Type-C Specification 1.1 defines several cables, plugs, and receptacles to be used to attach ports. The

TUSB322I device supports all cables, receptacles, and plugs. The TUSB322I device does not support any USB

feature which requires USB Power Delivery communications over CC lines, such as e-marking or alternate

mode.

8

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

Feature Description (continued)

7.3.1.1 USB Type-C Receptacles and Plugs

Below is list of Type-C receptacles and plugs supported by the TUSB322I device:

•

USB Type-C receptacle for USB2.0 and USB3.1 and full-featured platforms and devices

USB full-featured Type-C plug

USB2.0 Type-C plug

7.3.1.2 USB Type-C Cables

Below is a list of Type-C cables types supported by the TUSB322I device:

•

USB full-featured Type-C cable with USB3.1 full-featured plug

USB2.0 Type-C cable with USB2.0 plug

Captive cable with either a USB full-featured plug or USB2.0 plug

7.3.1.3 Legacy Cables and Adapters

The TUSB322I device supports legacy cable adapters as defined by the Type-C Specification. The cable adapter

must correspond to the mode configuration of the TUSB322I device.

To System VBUS detection

VBUS

9ꢁꢁKΩ 1ꢀ

Rp (56k 5ꢀ%

VBUS_DET

TUSB322

CC

Rd (5.1k 1ꢁꢀ%

Legacy Host Adapter

Figure 2. Legacy Adapter Implementation Circuit

7.3.1.4 Direct Connect Devices

The TUSB322I device supports the attaching and detaching of a direct-connect device.

7.3.1.5 Audio Adapters

Additionally, the TUSB322I device supports audio adapters for audio accessory mode, including:

•

Passive Audio Adapter

Charge Through Audio Adapter

7.3.2 Port Role Configuration

The TUSB322I default operation is dual-role port (DRP). The TUSB322I will always default to DRP operation

anytime EN_N is asserted from high to low or I2C_SOFT_RESET bit is set. But the TUSB322I can be configured

as DFP-only or UFP-only through changing the default state of the MODE_SELECT register. DFP-only and UFP-

only mode is not available in GPIO mode. Table 1 lists the supported features in each mode:

9

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

Feature Description (continued)

Table 1. Supported Features for the TUSB322I Device by Mode

SUPPORTED

FEATURES

DFP-Only

Yes

UFP-Only

Yes

DFP

Yes

Port attach and

detach

Cable orientation

(through I²C)

Yes

Cable orientation

through DIR pin

Yes

Current advertisement

Current detection

Yes

—

Yes (DFP)

Yes (UFP)

Yes

Accessory modes

(audio and debug)

Yes

Active cable detection

Try.SRC

Yes

—

Yes (DFP)

Yes (UFP)

Yes (DFP)

Yes

Try.SNK

—

VCONN

I²C / GPIO

Yes

—

Yes

Legacy cables

V_BUSdetection

Yes

Yes (UFP)

7.3.2.1 Downstream Facing Port (DFP) - Source

The TUSB322I device can be configured as a DFP-only device by changing the MODE_SELECT register default

setting. In DFP mode, the TUSB322I device constantly presents Rps on both CC. In DFP mode, the TUSB322I

device initially advertises default USB Type-C current. The Type-C current can be adjusted through I²C if the

system is required to increase the amount advertised. The TUSB322I device adjusts the Rps to match the

desired Type-C current advertisement. As a DFP, the TUSB322I monitors the voltage level on CC pins looking

for the Rd termination of a UFP. When a UFP is detected and TUSB322I is in the Attached.SRC state, the

TUSB322I will supply VCONN on the CC pin that has Ra.

The following list describes the steps for enabling DFP-only.

1. Write a 1'b1 to DISABLE_TERM register (address 0x0A bit 0)

2. Write a 2'b10 to MODE_SELECT register (address 0x0A bits 5:4)

3. Write a 1'b0 to DISABLE_TERM register (address 0x0A bit 0)

When configured as a DFP, the TUSB322I can operate with older USB Type-C 1.0 devices except for a USB

Type-C 1.0 DRP device. The TUSB322I cannot operate with a USB Type-C 1.0 DRP device. The limitation is a

result of a backwards compatibility problem between USB Type-C 1.1 DFP and a USB Type-C 1.0 DRP.

7.3.2.2 Upstream Facing Port (UFP) - Sink

The TUSB322I device can be configured as a UFP-only by changing the MODE_SELECT register default

setting. In UFP mode, the TUSB322I device constantly presents pulldown resistors (Rd) on both CC pins. The

TUSB322I device monitors the CC pins for the voltage level corresponding to the Type-C mode current

advertisement by the connected DFP. The TUSB322I device debounces the CC pins and wait for V_BUSdetection

before successfully attaching. As a UFP, the TUSB322I device detects and communicates the advertised current

level of the DFP to the system through the I²C CURRENT_MODE_DETECT register once in the Attached.SNK

state.

Steps for enabling UFP-only:

1. Write a 1'b1 to DISABLE_TERM register (address 0x0A bit 0).

2. Write a 2'b01 to MODE_SELECT register (address 0x0A bits 5:4)

3. Write a 1'b0 to DISABLE_TERM register (address 0x0A bit 0).

10

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

7.3.2.3 Dual Role Port (DRP)

The TUSB322I default operation is a dual-role port controller. As a DRP, the TUSB322I can operate as a UFP

(sink) or a DFP (source). In DFP mode, the TUSB322I toggles between presenting as a DFP (Rp on both CC

pins) and presenting as a UFP (Rd on both CC pins).

When presenting as a DFP, the TUSB322I monitors the voltage level on the CC pins looking for the Rd

termination of a UFP. When a UFP is detected and TUSB322I is in the Attached.SRC state, the TUSB322I will

pull the ID pin low to indicate to the system the port is attached to a sink (UFP). Additionally, when a UFP is

detected, the TUSB322I will supply VCONN on the unconnected CC pin if Ra is also detected. In DFP mode, the

TUSB322I will initially advertise default USB Type-C current. The Type-C Current can be adjusted through I2C if

the system wishes to increase the amount advertised. TUSB322I will adjust the Rps to match the desired Type-C

Current advertisement. In GPIO mode, the TUSB322I will only advertise default Type C current.

When presenting as a UFP, the TUSB322I monitors the CC pins for the voltage level corresponding to the Type-

C mode current advertisement by the connected DFP. The TUSB322I will debounce the CC pins and wait for

VBUS detection before successfully attaching. As a UFP, the TUSB322I will detect and communicate the DFP’s

advertised current level to the system through the OUT1 and OUT2 GPIOs (if in GPIO mode) or through the I2C

CURRENT_MODE_DETECT register once in the Attached.SNK state.

The TUSB322I supports two optional Type-C DRP features called Try.SRC and Try.SNK. Products supporting

dual-role functionality can have a requirement to be a source (DFP) or a sink (UFP) when connected to another

dual-role capable product. For example, a dual-role capable notebook can be used as a source when connected

to a tablet, or a cell phone could be a sink when connected to a notebook or tablet. When standard DRP

products (products which don’t support either Try.SRC or Try.SNK) are connected together, the role (UFP or

DFP) outcome is not predetermined. These two optional DRP features provide a means for dual-role capable

products to connect to another dual-role capable product in the role desired. Try.SRC and Try.SNK are only

available when TUSB322I is configured in I2C mode. When operating in GPIO mode, the TUSB322I will always

operate as a standard DRP.

The Try.SRC feature of the TUSB322I device provides a means for a DRP product to connect as a DFP when

connected to another DRP product that doesn’t implement Try.SRC. When two products which implement

Try.SRC are connected together, the role outcome of either UFP or DFP is the same as a standard DRP.

Try.SRC is enabled by changing I2C register SOURCE_PREF to 2’b11. Once the register is changed to 2’b11,

the TUSB322I will always attempt to connect as a DFP when attached to another DRP capable device.

7.3.3 Type-C Current Mode

When a valid cable detection and attach have been completed, the DFP has the option to advertise the level of

Type-C current a UFP can sink. The default current advertisement for the TUSB322I device is 500 mA (for

USB2.0) or 900 mA (for USB3.1). If a higher level of current is available, the I²C registers can be written to

provide medium current at 1.5 A or high current at 3 A. When the CURRENT_MODE_ADVERTISE register has

been written to advertise higher than default current, the DFP adjusts the Rps for the specified current level. If a

DFP advertises 3 A, it ensures that the V_DDof the TUSB322I device is 3.5 V or greater. Table 2 lists the Type-C

current advertisements in GPIO an I²C modes.

Table 2. Type-C Current Advertisement for GPIO and I²C Modes

GPIO MODE (ADDR PIN IN NC)

I²C MODE (ADDR PIN H, L)

TYPE-C CURRENT

UFP IN DRP MODE

DFP IN DRP MODE

UFP

DFP

500 mA

(USB2.0)

900 mA

(USB3.1)

I²C register default is 500

or 900 mA

Default

Only advertisement

N/A

Current mode detected

and output through OUT1

/ OUT2

Current mode detected

and read through I²C

register

Medium - 1.5 A

Advertisement selected

through writing I²C

register

High - 3 A

7.3.4 Accessory Support

The TUSB322I device supports audio and debug accessories in UFP, DFP mode and DRP mode. Audio and

debug accessory support is provided through reading of I²C registers. Audio accessory is also supported through

GPIO mode with INT_N/OUT3 pin (audio accessory is detected when INT_N/OUT3 pin is low).

11

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

7.3.4.1 Audio Accessory

Audio accessory mode is supported through two types of adapters. First, the passive audio adapter can be used

to convert the Type-C connector into an audio port. To effectively detect the passive audio adapter, the

TUSB322I device must detect a resistance that is less than Ra on both of the CC pins.

Secondly, a charge through audio adapter can be used. The primary difference between a passive and charge

through adapter is that the charge through adapter supplies 500 mA of current over VBUS. The charge through

adapter contains a receptacle and a plug. The plug acts as a DFP and supplies V_BUSwhen the plug detects a

connection.

When the TUSB322I device is configured in GPIO mode, OUT3 pin determines if an audio accessory is

connected. When an audio accessory is detected, the OUT3 pin is pulled low.

7.3.4.2 Debug Accessory

Debug is an additional state supported by USB Type-C. The specification does not define a specific user

scenario for this state, but the end user could use debug accessory mode to enter a test state for production

specific to the application. Charge through debug accessory is not supported by TUSB322I when in DRP or UFP

mode. The TUSB322I when configured as a DFP-only or as a DRP acting as a DFP will detect a debug

accessory which presents Rd on both CC1 and CC2 pins. The TUSB322I will set ACCESSORY_CONNECTED

register to 3'b110 to indicate a UFP debug accessory. The TUSB322I when configured as a UFP-only or as a

DRP acting as a UFP will detect a debug accessory which presents Rp on both CC1 and CC2 pins. The

TUSB322I will set ACCESSORY_CONNECTED register to 3b'111 to indicate a DFP debug accessory.

7.3.5 I²C and GPIO Control

The TUSB322I device can be configured for I²C communication or GPIO outputs using the ADDR pin. The

ADDR pin is a tri-level control pin. When the ADDR pin is left floating (NC), the TUSB322I device is in GPIO

output mode. When the ADDR pin is pulled high or pulled low, the TUSB322I device is in I²C mode.

All outputs for the TUSB322I device are open drain configuration.

The OUT1 and OUT2 pins are used to output the Type-C current mode when in GPIO mode. Additionally, the

OUT3 pin is used to communicate the audio accessory mode in GPIO mode. Table 3 lists the output pin settings.

See for more information on the pins and their uses.

Table 3. Simplified Operation for OUT1 and OUT2

OUT1

OUT2

DESCRIPTION

H

L

H

L

Default current in unattached state

Default current in attached state

Medium current (1.5 A) in attached state

High current (3.0 A) in attached state

H

L

When operating in I²C mode, the TUSB322I device uses the SCL and SDA lines for clock and data and the

INT_N pin to communicate a change in I²C registers, or an interrupt, to the system. The INT_N pin is pulled low

when the TUSB322I device updates the registers with new information. The INT_N pin is open drain. The

INTERRUPT_STATUS register will be set when the INT_N pin is pulled low. To clear the INTERRUPT_STATUS

register, the end user writes to I²C.

When operating in GPIO mode, the OUT3 pin is used in place of the INT_N pin to determine if an audio

accessory is detected and attached. The OUT3 pin is pulled low when an audio accessory is detected.

NOTE

When using the 3.3-V supply for I²C, the end user must ensure that the V_DDis 3 V and

above. Otherwise the I²C can back power the device.

7.3.6 V_BUSDetection

The TUSB322I device supports V_BUSdetection according to the Type-C Specification. V_BUSdetection is used to

determine the attachment and detachment of a UFP and to determine the entering and exiting of accessary

modes. V_BUSdetection is also used to successfully resolve the role in DRP mode.

12

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

The system V_BUSvoltage must be routed through a 900-kΩ resistor to the VBUS_DET pin on the TUSB322I

device.

7.3.7 Cable Orientation and External MUX Control

The TUSB322I device has the ability to control an external/discrete MUX using the DIR pin. The TUSB322I

detects the cable orientation by monitoring the voltage on the CC pins. When a voltage level within the proper

threshold is detected on CC1, the DIR pin is pulled low. When a voltage level within the proper threshold is

detected on CC2, the DIR is pulled high. The DIR pin is an open drain output. The I²C communicates the cable

orientation status for the TUSB322I device.

7.3.8 VCONN Support for Active Cables

The TUSB322I device supplies VCONN to active cables when configured in DFP mode or in DRP acting as a

DFP mode. VCONN is provided only when the unconnected CC pin is terminated to a resistance, Ra, and after a

UFP is detected and the Attached.SRC state is entered. When in DFP mode or in DRP acting as a DFP mode, a

5-V source must be connected to the VDD pin of the TUSB322I device after Attached.SRC. VCONN is supplied

from VDD through a low resistance power FET out to the unconnected CC pin. VCONN is removed when a

detach event is detected and the active cable is removed.

7.4 Device Functional Modes

The TUSB322I device has four functional modes. Table 4 lists these modes:

Table 4. USB Type-C States According to TUSB322I Functional Modes

MODES

GENERAL BEHAVIOR

MODE

STATES⁽¹⁾

Unattached.SNK

UFP-Only

AttachWait.SNK

Toggle Unattached.SNK → Unattached.SRC

AttachedWait.SRC or AttachedWait.SNK

Unattached.SRC

USB port unattached. ID, PORT

operational. I²C on.

Unattached

DRP

DFP-Only

AttachWait.SRC

Attached.SNK

UFP-Only

DRP

Audio Accessory

Debug Accessory

Attached.SNK

Attached.SRC

USB port attached. All GPIOs

operational. I²C on.

Active

Audio accessory

Debug accessory

Attached.SRC

DFP-Only

Audio accessory

Debug accessory

No operation.

V_DDnot available.

Dead battery

Shutdown

DRP

Default device state to UFP/SNK with Rd.

No operation.

V_DDavailable and EN_N pin high

(1) Required; not in sequential order.

7.4.1 Unattached Mode

Unattached mode is the primary mode of operation for the TUSB322I device, because a USB port can be

unattached for a lengthy period of time. In unattached mode, V_DDis available, and all IOs and I²C are

operational. After the TUSB322I device is powered up, the part enters unattached mode until a successful attach

has been determined. Initially, right after power up, the TUSB322I device comes up as an Unattached.SNK. The

TUSB322I device toggles between the UFP and the DFP if configured as a DRP.

13

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

7.4.2 Active Mode

Active mode is defined as the port being attached. In active mode, all GPIOs are operational, and I²C is read /

write (R/W). When in active mode, the TUSB322I device communicates to the AP that the USB port is attached.

This communication happens through the ID pin if TUSB322I is configured as a DFP or DRP connect as source.

If TUSB322I is configured as a UFP or a DRP connected as a sink, the OUT1/OUT2 and INT_N/OUT3 pins are

used. The TUSB322I device exits active mode under the following conditions:

•

Cable unplug

V_BUSremoval if attached as a UFP

Dead battery; system battery or supply is removed

EN_N is floated or pulled high.

7.4.3 Shutdown Mode

Shutdown mode for TUSB322I is defined as follows:

•

Supply voltage available and EN_N pin is high or floating.

EN_N pin has internal pullup resistor

The TUSB322I device is off, but still maintains the Rd on the CC pins.

7.4.4 Dead Battery Mode

During dead battery mode, V_DDis not available. CC pins always default to pulldown resistors in dead battery

mode. Dead battery mode means:

•

TUSB322I in UFP with 5.1 kΩ ± 20% Rd; cable connected and providing charge

TUSB322I in UFP with 5.1 kΩ ± 20% Rd; nothing connected (application could be off or have a discharged

battery)

NOTE

When V_DDis off, the TUSB322I non-failsafe pins (DIR, VBUS_DET, ADDR, OUT[3:1] pins)

could back-drive the TUSB322I device if not handled properly. When necessary to pull

these pins up, TI recommends pulling up DIR, ADDR, and INT_N/OUT3 to the device’s

V_DDsupply. The VBUS_DET must be pulled up to V_BUSthrough a 900-kΩ resistor.

14

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

7.5 Programming

For further programmability, the TUSB322I device can be controlled using I²C. The TUSB322I device local I²C

interface is available for reading/writing after T_{I2C_EN}when the device is powered up. The SCL and SDA terminals

are used for I²C clock and I²C data respectively. If I²C is the preferred method of control, the ADDR pin must be

set accordingly.

Table 5. TUSB322I I²C Addresses

TUSB322I I²C Target Address

ADDR pin

Bit 7 (MSB)

Bit 6

Bit 5

Bit 4

Bit 3

Bit 2

Bit 1

Bit 0 (W/R)

H

L

1

0

1

0/1

The following procedure should be followed to write to TUSB322I I²C registers:

1. The master initiates a write operation by generating a start condition (S), followed by the TUSB322I 7-bit

address and a zero-value R/W bit to indicate a write cycle

2. The TUSB322I device acknowledges the address cycle

3. The master presents the sub-address (I²C register within the TUSB322I device) to be written, consisting of

one byte of data, MSB-first

4. The TUSB322I device acknowledges the sub-address cycle

5. The master presents the first byte of data to be written to the I²C register

6. The TUSB322I device acknowledges the byte transfer

7. The master can continue presenting additional bytes of data to be written, with each byte transfer completing

with an acknowledge from the TUSB322I device

8. The master terminates the write operation by generating a stop condition (P)

The following procedure should be followed to read the TUSB322I I²C registers:

1. The master initiates a read operation by generating a start condition (S), followed by the TUSB322I 7-bit

address and a one-value R/W bit to indicate a read cycle

2. The TUSB322I device acknowledges the address cycle

3. The TUSB322I device transmits the contents of the memory registers MSB-first starting at register 00h or last

read sub-address+1. If a write to the T I²C register occurred prior to the read, then the TUSB322I device

starts at the sub-address specified in the write.

4. The TUSB322I device waits for either an acknowledge (ACK) or a not-acknowledge (NACK) from the master

after each byte transfer; the I²C master acknowledges reception of each data byte transfer

5. If an ACK is received, the TUSB322I device transmits the next byte of data

6. The master terminates the read operation by generating a stop condition (P)

The following procedure should be followed for setting a starting sub-address for I²C reads:

1. The master initiates a write operation by generating a start condition (S), followed by the TUSB322I 7-bit

address and a zero-value R/W bit to indicate a read cycle

2. The TUSB322I device acknowledges the address cycle

3. The master presents the sub-address (I²C register within the TUSB322I device) to be read, consisting of one

byte of data, MSB-first

4. The TUSB322I device acknowledges the sub-address cycle

5. The master terminates the read operation by generating a stop condition (P)

NOTE

If no sub-addressing is included for the read procedure, then the reads start at register

offset 00h and continue byte-by-byte through the registers until the I²C master terminates

the read operation. If a I²C address write occurred prior to the read, then the reads start at

the sub-address specified by the address write.

15

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

7.6 Register Maps

7.6.1 CSR Registers

Table 6. CSR Registers

Offset

Reset

Register Name

Section

[0x00, 0x54, 0x55, 0x53,

0x42, 0x33, 0x32, 0x32]

0x07 through 0x00

Device Identification

Device Identification Register

0x08

0x09

0x0A

0xA0

0x00

0x20

0x00

0x02

Connection Status

Connection Status and Control

General Control

Connection Status Register

Connection Status and Control Register

General Control Register

Device Revision

Device Revision Register

7.6.1.1 Device Identification Register (offset = 0x07 through 0x00) [reset = 0x00, 0x54, 0x55, 0x53, 0x42,

0x33, 0x32, 0x32]

Figure 3. Device Identification Register

7

6

5

4

3

2

1

0

DEVICE_ID

R-0

LEGEND: R = Read only; -n = value after reset

Table 7. Device Identification Register Field Descriptions

Bit

Field

Type

Reset

Description

For the TUSB322I device these fields return a string of ASCII

characters returning TUSB322I

Addresses 0x07 - 0x00 = {0x00, 0x54, 0x55, 0x53, 0x42, 0x33,

0x32, 0x32}

7-0

DEVICE_ID

R

7.6.1.2 Connection Status Register (offset = 0x08) [reset = 0x00]

Figure 4. Connection Status Register

7

6

5

4

3

2

1

0

CURRENT_MODE_ADVERTISE

CURRENT_MODE_DETECT

ACCESSORY_CONNECTED

ACTIVE_CABL

E_DETECTION

RW

RU

LEGEND: R/W = Read/Write; R/U = Read/Update

Table 8. Connection Status Register Field Descriptions

Bit

Field

Type

Reset

Description

2'b00

These bits are programmed by the application to raise the

current advertisement from default.

00 – Default (500 mA / 900 mA) initial value at startup

7-6

CURRENT_MODE_ADVERTISE

R

01 – Mid (1.5 A)

10 – High (3 A)

11 – Reserved

2'b00

These bits are set when a UFP determines the Type-C Current

mode.

00 – Default (value at start up)

01 – Medium

5-4

CURRENT_MODE_DETECT

RU

10 – Charge through accessory – 500 mA

11 – High

16

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

Table 8. Connection Status Register Field Descriptions (continued)

Bit

Field

Type

Reset

Description

2'b00

These bits are read by the application to determine if an

accessory was attached.

000 – No accessory attached (default)

001 – Reserved

010 – Reserved

011 – Reserved

3-1

ACCESSORY_CONNECTED

RU

100 – Audio accessory

101 – Audio charged thru accessory

110 – Debug accessory when TUSB322I is connected as a

DFP.

111 – Debug accessory when TUSB322I is connected as a

UFP.

1'b0

This flag indicates that an active cable has been plugged into

the Type-C connector. When this field is set, an active cable is

detected.

0

ACTIVE_CABLE_DETECTION

RU

7.6.1.3 Connection Status and Control Register (offset = 0x09) [reset = 0x20]

Figure 5. Connection Status and Control Register

7

6

5

4

3

2

1

0

ATTACHED_STATE

CABLE_DIR

INTERRUPT_S VCONN_FAUL

DRP_DUTY_CYCLE

DISABLE_UFP

_ACCESSORY

TATUS

T

RU

RCU

RW

LEGEND: R/W = Read/Write; R/U = Read/Update; R/C/U = Read/Clear/Update

Table 9. Connection Status and Control Register Field Descriptions

Bit

Field

Type

Reset

Description

2'b00

This is an additional method to communicate attach other than

the ID pin. These bits can be read by the application to

determine what was attached.

00 – Not attached (default)

01 – Attached.SRC (DFP)

10 – Attached.SNK (UFP)

11 – Attached to an accessory

7-6

ATTACHED_STATE

RU

1'b1

1'b0

Cable orientation. The application can read these bits for cable

orientation information.

5

4

3

CABLE_DIR

RU

0 – CC1

1 – CC2 (default)

The INT pin is pulled low whenever a CSR changes. When a

CSR change has occurred this bit should be held at 1 until the

application clears it.

INTERRUPT_STATUS

VCONN_FAULT

RCU

0 – Clear

1 – Interrupt (When INT_N is pulled low, this bit will be 1.

This bit is 1 whenever any CSR are changed)

1'b0

VCONN_FAULT Bit is set whenever a VCONN over-current limit

is triggered.

0 - No fault. (default)

1 - Interrupt (INT_N is asserted low)

17

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

Table 9. Connection Status and Control Register Field Descriptions (continued)

Bit

Field

Type

Reset

Description

2'b00

Percentage of time that a DRP advertises DFP during tDRP

00 – 30% (default)

01 – 40%

2-1

DRP_DUTY_CYCLE

RW

10 – 50%

11 – 60%

1'b0

Setting this field will disable UFP accessory support.

0 – UFP accessory support enabled (Default)

1 – UFP accessory support disabled

0

DISABLE_UFP_ACCESSORY

RW

7.6.1.4 General Control Register (offset = 0x0A) [reset = 0x00]

Figure 6. General Control Register

7

6

5

4

3

2

1

0

DEBOUNCE

RW

MODE_SELECT

I²C_SOFT_RE

SET

SOURCE_PREF

DISABLE_TER

M

RW

RSU

RW

LEGEND: R/W = Read/Write; R/S/U = Read/Set/Update

Table 10. General Control Register Field Descriptions

Bit

Field

Type

Reset

Description

2'b00

The nominal amount of time the TUSB322I device debounces

the voltages on the CC pins.

00 – 168ms (default)

01 – 118ms

7-6

DEBOUNCE

RW

10 – 134ms

11 – 152ms

2'b00

This register can be written to set the TUSB322I device mode

operation. The ADDR pin must be set to I²C mode.

00 – DRP mode (start from unattached.SNK) (default)

01 – UFP mode (unattached.SNK)

5-4

MODE_SELECT

I²C_SOFT_RESET

SOURCE_PREF

RW

RSU

RW

10 – DFP mode(unattached.SRC)

11 – DRP mode(start from unattached.SNK)

1'b0

This register resets the digital logic. The bit is self-clearing. A

write of 1 starts the reset. The following registers can be

affected after setting this bit:

CURRENT_MODE_DETECT

ACTIVE_CABLE_DETECTION

ACCESSORY_CONNECTED

ATTACHED_STATE

3

CABLE_DIR

2'b00

This field controls the TUSB322I behavior when configured as a

DRP.

00 – Standard DRP (default)

01 – DRP will perform Try.SNK

10 – Reserved

2-1

11 – DRP will perform Try.SRC

18

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

Table 10. General Control Register Field Descriptions (continued)

Bit

Field

Type

Reset

Description

1'b0

This field will disable the termination on CC pins and transition

the CC state machine to the disabled state.

0 – Termination enabled according TUSB322I mode of

operation (default)

0

DISABLE_TERM

RW

1 – Termination disabled and state machine held in disable

state.

7.6.1.5 Device Revision Register (offset = 0xA0) [reset = 0x02]

Figure 7. Device Revision Register

7

6

5

4

3

2

1

0

REVISION

R

LEGEND: R = Read only

Table 11. Device Revision Register Field Descriptions

Bit

Field

Type

Reset

Description

Revision of TUSB322I. Defaults to 0x02.

7-0

REVISION

R

'h02

19

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TUSB322I device is a Type-C configuration channel logic and port controller. The TUSB322I device can

detect when a Type-C device is attached, what type of device is attached, the orientation of the cable, and power

capabilities (both detection and broadcast). The TUSB322I device can be used in a source application (DFP) or

in a sink application (UFP).

8.2 Typical Application

20

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

Typical Application (continued)

8.2.1 DRP in I²C Mode

Figure 8 shows the TUSB322I device configured as a DRP in I²C mode.

USB VBUS Switch

(optional BC 1.2 support for legacy)

SCL

SDA

DM_OUT

DM

DP

DM_IN

DP_IN

VOUT

DP_OUT

System VBUS

VIN

EN

PS_EN

FAULT#

PS_FAULT#

VBUS

I2C I/O

1.8V or 3.3V

VDD_5V

150uF

DM

DP

VCONN bulk

cap

100uF

100nF

VBUS

900K

200K

A12 B^B21

4.7K

RXP2

RXN2

TXP2

TXN2

VBUS_DET

A11

A10

A9

B2

B3

B4

B5

CC1

INT_N/OUT3

INT#

CC2

CC1

A8

USB3

A7

B6

B7

B8

TUSB322

and

CC2

ID

SCL

SDA

A6

A5

PMIC

SCL/OUT2

SDA/OUT1

A4

A3

A2

A1

B9

B10

B11

TXN1

TXP1

RXN1

RXP1

1uF

B12

VCC_3.3V

10K

100nF

SEL

TXP2

TXN2

B0P

B0N

RXP2

RXN2

100nF

B1P

B1N

A0P

A0N

SSTXP

SSTXN

100nF

TXN1

TXP1

A1P

A1N

SSRXP

SSRXN

C0P

C0N

RXN1

RXP1

100nF

C1P

C1N

OEN

Figure 8. DRP in I²C Mode Schematic

8.2.1.1 Design Requirements

For the design example, use the parameters listed in Table 12.

Table 12. Design Requirements for DRP in I²C Mode

DESIGN PARAMETER

VALUE

5 V

V_DD(4.5 to 5.5 V)

I²C

Mode (I²C or GPIO)

ADDR pin must be pulled down or pulled up

0x47

I²C address (0x67 or 0x47)

ADDR pin must be pulled low or tied to GND

DRP

Type-C port type (UFP, DFP, or DRP)

VCONN Support

MODE_SELECT register = 2'b00.

Yes

21

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

8.2.1.2 Detailed Design Procedure

The TUSB322I device supports a V_DDin the range of 4.5 V to 5.5 V. In this particular use case, 5 V is connected

to the V_DDpin. Because VCONN support is required for a DRP, the 5 V on V_DDmeets the USB Type-C VCONN

requirement of 4.75 V to 5.5 V. A 100-nF capacitor is placed near V_DD. Also, a 100-µF capacitor is used to meet

the USB Type-C bulk capacitance requirement of 10 µF to 220 µF.

The TUSB322I device is placed into I²C mode by either pulling the ADDR pin high or low. In this case, the ADDR

pin is tied to GND which results in a I²C address of 0x47. The SDA and SCL must be pulled up to either 1.8 V or

3.3 V. When pulled up to 3.3 V, the V_DDsupply must be at least 3 V to keep from back-driving the I²C interface.

The INT_N/OUT3 pin is used to notify the PMIC when a change in the TUSB322I I²C registers occurs. This pin is

an open drain output and requires an external pullup resistor. The pin should be pulled up to V_DDusing a 200-kΩ

resistor.

The ID pin is used to indicate when a connection has occurred if the TUSB322I device is a DFP while configured

for DRP. An OTG USB controller can use this pin to determine when to operate as a USB Host or USB Device.

When this pin is driven low, the OTG USB controller functions as a host and then enables V_BUS. The Type-C

standard requires that a DFP not enable V_BUSuntil the V_BUSis in the Attached.SRC state. If the ID pin is not low

but V_BUSis detected, then the OTG USB controller functions as a device. The ID pin is open drain output and

requires an external pullup resistor. The ID pin should be pulled up to V_DDusing a 200-kΩ resistor.

The DIR pin is used to control the mux for connecting the USB3 SS signals to the appropriate pins on the USB

Type-C receptacle. In this particular case, a HD3SS3212 is used as the mux. To minimize crossing in routing the

USB3 SS signals to the USB Type C connector, the connection of CC1 and CC2 to the TUSB322I is swapped.

When swapping the CC1 and CC2 connection, the CABLE_DIR register will also be reversed (0 = CC2 and 1 =

CC1).

The VBUS_DET pin must be connected through a 900-kΩ resistor to V_BUSon the Type-C that is connected. This

large resistor is required to protect the TUSB322I device from large V_BUSvoltage that is possible in present day

systems. This resistor along with internal pulldown keeps the voltage observed by the TUSB322I device in the

recommended range.

The USB2 specification requires the bulk capacitance on V_BUSbased on UFP or DFP. When operating the

TUSB322I device in a DRP mode, it alternates between UFP and DFP. If the TUSB322I device connects as a

UFP, the large bulk capacitance must be removed.

Table 13. USB2 Bulk Capacitance Requirements

PORT CONFIGURATION

Downstream facing port (DFP)

Upstream facing port (UFP)

MIN

120

1

MAX

UNIT

µF

10

µF

8.2.1.3 Application Curves

Figure 9. Application Curve for DRP in I²C Mode

22

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

8.2.2 DFP in I²C Mode

Figure 10 shows the TUSB322I device configured as a DFP in I²C mode.

USB VBUS Switch

(optional BC 1.2 support for legacy)

SCL

SDA

DM_OUT

DM

DP

DM_IN

DP_IN

VOUT

DP_OUT

System VBUS

VIN

EN

PS_EN

FAULT#

PS_FAULT#

VBUS

I2C I/O

1.8V or 3.3V

VDD_5V

150uF

DM

DP

VCONN bulk

cap

100uF

100nF

VBUS

900K

200K

A12 B^B21

4.7K

RXP2

RXN2

TXP2

TXN2

VBUS_DET

A11

A10

A9

B2

B3

B4

B5

CC1

INT_N/OUT3

INT#

CC2

CC1

A8

USB3

A7

B6

B7

B8

TUSB322

and

CC2

ID

SCL

SDA

A6

A5

PMIC

SCL/OUT2

SDA/OUT1

A4

A3

A2

A1

B9

B10

B11

TXN1

TXP1

RXN1

RXP1

1uF

B12

VCC_3.3V

10K

100nF

SEL

TXP2

TXN2

B0P

B0N

RXP2

RXN2

100nF

B1P

B1N

A0P

A0N

SSTXP

SSTXN

100nF

TXN1

TXP1

A1P

A1N

SSRXP

SSRXN

C0P

C0N

RXN1

RXP1

100nF

C1P

C1N

OEN

Figure 10. DFP in I²C Mode Schematic

8.2.2.1 Design Requirements

For the design example, use the parameters listed in Table 14:

Table 14. Design Requirements for DFP in I²C Mode

DESIGN PARAMETER

VALUE

5 V

V_DD(4.5 V to 5.5 V)

I²C

Mode (I²C or GPIO)

ADDR pin must be pulled down or pulled up

0x47

I²C address (0x61 or 0x60)

ADDR pin must be pulled low or tied to GND

DFP

Type-C port type (UFP, DFP, or DRP)

VCONN Support

MODE_SELECT = 2'b10

Yes

23

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

8.2.2.2 Detailed Design Procedure

The TUSB322I device supports a V_DDin the range of 4.5 V to 5.5 V. In this particular case, V_DDis set to 5 V. A

100-nF capacitor is placed near V_DD. Also, a 100-µF capacitor is used to meet the USB Type-C bulk capacitance

requirement of 10 µF to 220 µF.

The TUSB322I device is placed into I²C mode by either pulling the ADDR pin high or low. In this particular case,

the ADDR pin is tied to GND which results in a I²C address of 0x47. The SDA and SCL must be pulled up to

either 1.8 V or 3.3 V. When pulled up to 3.3 V, the V_DDsupply must be at least 3 V to keep from back-driving the

I²C interface.

The INT_N/OUT3 pin is used to notify the PMIC when a change in the TUSB322I I²C registers occurs. This pin is

an open drain output and requires an external pullup resistor. The pin should be pulled up to V_DDusing a 200-kΩ

resistor.

The DIR pin is used to control the mux for connecting the USB3 SS signals to the appropriate pins on the USB

Type-C receptacle. In this particular case, a HD3SS3212 is used as the mux. To minimize crossing in routing the

USB3 SS signals to the USB Type C connector, the connection of CC1 and CC2 to the TUSB322I is swapped.

When swapping the CC1 and CC2 connection, the CABLE_DIR register will also be reversed (0 = CC2 and 1 =

CC1).

The Type-C port mode is determined by the state of the MODE_SELECT register. When the MODE_SELECT

register is 2'b10, the TUSB322I device is in DFP mode. The TUSB322I will exit the DFP mode if the

MODE_SELECT register is changed, I2C_SOFT_RESET is set, or EN_N pin is transitioned from high to low.

The VBUS_DET pin must be connected through a 900-kΩ resistor to V_BUSon the Type-C that is connected. This

large resistor is required to protect the TUSB322I device from large V_BUSvoltage that is possible in present day

systems. This resistor along with internal pulldown keeps the voltage observed by the TUSB322I device in the

recommended range.

The USB2 specification requires the bulk capacitance on V_BUSbased on UFP or DFP. When operating the

TUSB322I device in a DFP mode, a bulk capacitance of at least 120 µF is required. In this particular case, a 150-

µF capacitor was chosen.

8.2.2.3 Application Curves

Figure 11. Application Curve for DFP in I²C Mode

24

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

8.2.3 UFP in I²C Mode

Figure 12 shows the TUSB322I device configured as a UFP in I²C mode.

USB VBUS Switch

(optional BC 1.2 support for legacy)

SCL

SDA

DM_OUT

DM

DP

DM_IN

DP_IN

VOUT

DP_OUT

System VBUS

VIN

EN

PS_EN

FAULT#

PS_FAULT#

VBUS

I2C I/O

1.8V or 3.3V

VDD_5V

150uF

DM

DP

VCONN bulk

cap

100uF

100nF

VBUS

900K

200K

A12 B^B21

4.7K

RXP2

RXN2

TXP2

TXN2

VBUS_DET

A11

A10

A9

B2

B3

B4

B5

CC1

INT_N/OUT3

INT#

CC2

CC1

A8

USB3

A7

B6

B7

B8

TUSB322

and

CC2

ID

SCL

SDA

A6

A5

PMIC

SCL/OUT2

SDA/OUT1

A4

A3

A2

A1

B9

B10

B11

TXN1

TXP1

RXN1

RXP1

1uF

B12

VCC_3.3V

10K

100nF

SEL

TXP2

TXN2

B0P

B0N

RXP2

RXN2

100nF

B1P

B1N

A0P

A0N

SSTXP

SSTXN

100nF

TXN1

TXP1

A1P

A1N

SSRXP

SSRXN

C0P

C0N

RXN1

RXP1

100nF

C1P

C1N

OEN

Figure 12. UFP in I²C Mode Schematic

8.2.3.1 Design Requirements

For the design example, use the parameters listed in Table 15:

Table 15. Design Requirements for UFP in I²C Mode

DESIGN PARAMETER

VALUE

5 V

V_DD(4.5 V to 5.5 V)

I²C

Mode (I²C or GPIO)

ADDR pin must be pulled down or pulled up

0x47

I²C address (0x61 or 0x60)

ADDR pin must be pulled low or tied to GND

UFP

Type-C port type (UFP, DFP, or DRP)

VCONN Support

MODE_SELECT = 2'b01

No

25

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

8.2.3.2 Detailed Design Procedure

The TUSB322I device supports a V_DDin the range of 4.5 V to 5.5 V. In this particular case, V_DDis set to 5 V. A

100-nF capacitor is placed near V_DD

.

The TUSB322I device is placed into I²C mode by either pulling the ADDR pin high or low. In this case, the ADDR

pin is tied to GND which results in a I²C address of 0x47. The SDA and SCL must be pulled up to either 1.8 V or

3.3 V. When pulled up to 3.3 V, the V_DDsupply must be at least 3 V to keep from back-driving the I²C interface.

The INT_N/OUT3 pin is used to notify the PMIC when a change in the TUSB322I I²C registers occurs. This pin is

an open drain output and requires an external pullup resistor. The pin should be pulled up to V_DDusing a 200-kΩ

resistor.

The DIR pin is used to control the mux for connecting the USB3 SS signals to the appropriate pins on the USB

Type-C receptacle. In this particular case, a HD3SS3212 is used as the mux. To minimize crossing in routing the

USB3 SS signals to the USB Type C connector, the connection of CC1 and CC2 to the TUSB322I is swapped.

When swapping the CC1 and CC2 connection, the CABLE_DIR register will also be reversed (0 = CC2 and 1 =

CC1).

The Type-C port mode is determined by the state of the MODE_SELECT register. When the MODE_SELECT

register is 2'b01, the TUSB322I device is in UFP mode. The TUSB322I will exit the UFP mode if the

MODE_SELECT register is changed, I2C_SOFT_RESET is set, or EN_N pin is transitioned from high to low.

The VBUS_DET pin must be connected through a 900-kΩ resistor to V_BUSon the Type-C that is connected. This

large resistor is required to protect the TUSB322I device from large V_BUSvoltage that is possible in present day

systems. This resistor along with internal pulldown keeps the voltage observed by the TUSB322I device in the

recommended range.

The USB2 specification requires the bulk capacitance on V_BUSbased on UFP or DFP. When operating the

TUSB322I device in a UFP mode, a bulk capacitance between 1 µF to 10 µF is required. In this particular case,

a 1-µF capacitor was chosen.

8.2.3.3 Application Curves

Figure 13. Application Curve for UFP in I²C Mode

26

TUSB322I

www.ti.com.cn

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

8.3 Initialization Set Up

The general power-up sequence for the TUSB322I device (EN_N tied to GND) is as follows:

1. System is powered off (device has no V_DD). The TUSB322I device is configured internally in UFP mode with

Rds on CC pins (dead battery).

2. V_DDramps – POR circuit.

3. I²C supply ramps up.

4. The TUSB322I device enters unattached.SNK and functions as a DRP. If DRP is not the desired mode of

operation, then software must change MODE_SELECT register to desired mode (UFP or DFP).

5. The TUSB322I device monitors the CC pins as a DFP and V_BUSfor attach as a UFP.

6. The TUSB322I device enters active mode when attach has been successfully detected.

9 Power Supply Recommendations

The TUSB322I device has a wide power supply range from 4.5 to 5.5 V. The TUSB322I device can be run off of

a system power such as a battery.

10 Layout

10.1 Layout Guidelines

1. An extra trace (or stub) is created when connecting between more than two points. A trace connecting pin A6

to pin B6 will create a stub because the trace also has to go to the USB Host. Ensure that:

–

A stub created by short on pin A6 (DP) and pin B6 (DP) at Type-C receptacle does not exceed 3.5 mm.

A stub created by short on pin A7 (DM) and pin B7 (DM) at Type-C receptacle does not exceed 3.5 mm.

2. A 100-nF capacitor should be placed as close as possible to the TUSB322I V_DDpin.

10.2 Layout Example

Figure 14. TUSB322I Layout

27

TUSB322I

ZHCSES9C –OCTOBER 2015–REVISED MAY 2017

www.ti.com.cn

11 器件和文档支持

11.1 文档支持

11.1.1 相关文档

请参阅如下相关文档：

•

应用报告《半导体和 IC 封装热指标》，SPRA953

11.2 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。请单击右上角的通知我进行注册，即可收到任意产品

信息更改每周摘要。有关更改的详细信息，请查看任意已修订文档中包含的修订历史记录。

11.3 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.4 商标

E2E is a trademark of Texas Instruments.

USB Type-C is a trademark of USB Implementers Forum.

All other trademarks are the property of their respective owners.

11.5 静电放电警告

这些装置包含有限的内置 ESD 保护。存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损

伤。

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 机械、封装和可订购信息

以下页面包括机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据发生变化时，我们可能不

会另行通知或修订此文档。如欲获取此产品说明书的浏览器版本，请参见左侧的导航栏。

28

PACKAGE MATERIALS INFORMATION

www.ti.com

8-Jan-2021

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0

B0

K0

P1

W

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TUSB322IRWBR

X2QFN

RWB

12

3000

180.0

8.4

1.8

0.61

4.0

8.0

Q2

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

8-Jan-2021

*All dimensions are nominal

Device

Package Type Package Drawing Pins

X2QFN RWB 12

SPQ

Length (mm) Width (mm) Height (mm)

213.0 191.0 35.0

TUSB322IRWBR

3000

Pack Materials-Page 2

PACKAGE OUTLINE

RWB0012A

X2QFN - 0.4 mm max height

SCALE 6.500

PLASTIC QUAD FLATPACK - NO LEAD

1.65

1.55

B

A

PIN 1 INDEX AREA

1.65

1.55

C

0.4 MAX

SEATING PLANE

0.05 C

2X 1.2

SYMM

(0.13)

TYP

0.05

0.00

6X 0.4

3

6

2

1

7

8

SYMM

2X

0.4

8X

0.2

12

9

0.25

0.15

12X

0.6

4X

0.4

0.07

0.05

C B A

C

4221631/B 07/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

RWB0012A

X2QFN - 0.4 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(1.3)

6X (0.4)

9

12

4X (0.7)

2X (0.4)

1

8

SYMM

(1.5)

7

2

8X (0.5)

3

6

SYMM

(R0.05) TYP

12X (0.2)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:30X

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

METAL

SOLDER MASK

OPENING

EXPOSED METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4221631/B 07/2017

NOTES: (continued)

3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).

www.ti.com

EXAMPLE STENCIL DESIGN

RWB0012A

X2QFN - 0.4 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(1.3)

6X (0.4)

12

9

4X (0.67)

2X (0.4)

1

2

8

SYMM

(1.5)

7

8X

METAL

8X (0.5)

3

6

(R0.05) TYP

SYMM

12X (0.2)

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

PADS 1,2,7 & 8

96% PRINTED SOLDER COVERAGE BY AREA

SCALE:50X

4221631/B 07/2017

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

重要声明和免责声明

TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没

有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。

这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可

将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他 TI 知识产权或任何第三方知

识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。

TI 提供的产品受 TI 的销售条款 (https:www.ti.com.cn/zh-cn/legal/termsofsale.html) 或 ti.com.cn 上其他适用条款/TI 产品随附的其他适用条款

的约束。TI 提供这些资源并不会扩展或以其他方式更改 TI 针对 TI 产品发布的适用的担保或担保免责声明。IMPORTANT NOTICE

邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122


型号：	TUSB322IRWBR
厂家：	TEXAS INSTRUMENTS
描述：	支持 VCONN 的 USB Type-C 配置通道逻辑和端口控制 \| RWB \| 12 \| -40 to 85 接口集成电路
文件：	总35页 (文件大小：1636K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TUSB322IRWBR [TI]

相关型号：

TUSB3410

TUSB3410-Q1

TUSB3410IRHB

TUSB3410IRHBG4

TUSB3410IRHBR

TUSB3410IRHBRG4

TUSB3410IRHBT

TUSB3410IVF

TUSB3410IVFG4

TUSB3410IVFQ1

TUSB3410RHB

TUSB3410RHBG4