TWL6040A3ZBHR [TI]
TWL6040 8-Channel Low-Power Audio Codec for Portable Applications;
| 型号： | TWL6040A3ZBHR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | TWL6040 8-Channel Low-Power Audio Codec for Portable Applications |
| 文件： | 总12页 (文件大小：749K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TWL6040
SWCS052B –AUGUST 2010–REVISED AUGUST 2014
TWL6040 8-Channel Low-Power Audio Codec for Portable Applications
1 Device Overview
1.1 Features
1
• Four Audio Digital-to-Analog Converter (DAC)
Channels
• Dual Phase-Locked Loops (PLLs) for Flexible
Clock Support:
• Stereo Capless Headphone Drivers:
– Up to 104-dB DR
– 32-kHz Sleep Clock Input for System Low-
Power Playback Mode
– 12-, 19.2-, 26-, and 38.4-MHz System Clock
Input
– Power Tune for Performance and Power
Consumption Tradeoff
• Accessory Plug and Unplug Detection, Accessory
Button Press Detection
• Integrated Power Supplies:
• Stereo 8 Ω, 1.5 W per Channel Speaker Drivers
• Differential Earpiece Driver
• Stereo Line-Out
• Two Audio Analog-to-Digital Converter (ADC)
Channels:
– 96-dBA SNR
• Four Audio Inputs:
– Three Differential Microphone Inputs
– Stereo Line-In and FM Input
• Two Vibrator and Haptics Feedback Channels:
– Differential H-Bridge Drivers
– Negative Charge Pump for Capless Headphone
Driver
– Two Low Dropout Voltage Regulators (LDOs)
for High Power Supply Rejection Ratio (PSRR)
• I2C Control
• Thermal Protection:
– Host Interrupt
• Power Supplies:
– Analog: 2.1 V
– Digital I/O: 1.8 V
– Battery: 2.3 to 5.5 V
• Package 6-mm × 6-mm 120-Pin PBGA
• Two Low-Noise Analog Microphone Bias Outputs
• Two Digital Microphone Bias Outputs
• Analog Low-Power Loop from Line-in to
Headphone and Speaker Outputs
1.2 Applications
•
•
Mobile and Smart Phones
MP3 Players
•
Handheld Devices
1.3 Description
The TWL6040 device is an audio coder/decoder (codec) with a high level of integration providing analog
audio codec functions for portable applications, as shown in Figure 1-1. The device contains multiple
audio analog inputs and outputs, as well as microphone biases and accessory detection. The device is
connected to the OMAP™ 4 host processor through a proprietary PDM interface for audio data
communication enabling partitioning with optimized power consumption and performance. Multichannel
audio data is multiplexed to a single wire for downlink (PDML) and uplink (PDMUL).
The OMAP4 device provides the TWL6040 device with five PDM audio-input channels (DL0–DL4).
Channels DL0–DL3 are connected to four parallel DAC channels multiplexed to stereo headphone (HSL,
HSR), stereo speaker (HFL, HFR), and earpiece (EAR) or stereo line outputs (AUXL, AUXR).
The stereo headphone path has a low-power (LP) mode operating from a 32-kHz sleep clock to enable
more than 100 hours of MP3 playback time. Very-high dynamic range of 104 dBA is achieved when using
the system clock input and DAC path high-performance (HP) mode. Class-AB headphone drivers provide
a 1-Vrms capability output and are ground centered for capless connection to a headphone, thus enabling
system size and cost reduction. The earpiece driver is a differential class-AB driver with 2 Vrms capability
to a typical 32-Ω load or 1.4 Vrms to a typical 16-Ω load.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of
development. Subject to change or discontinuance without notice.
TWL6040
SWCS052B –AUGUST 2010–REVISED AUGUST 2014
www.ti.com
Stereo speaker path has filterless class-D outputs with 1.5-W capability per channel. Output power
maximization supply connections to an external boost is supported. Speaker drivers also support hearing
aid coil loads. For vibrator and haptic feedback support, the TWL6040 has two PWM channels with
independent input signals from DL4 or inter-integrated circuit (I2C).
Vibrator drivers are differential H-bridge outputs, enabling fast acceleration and deceleration of vibrator
motor. An external driver for a hearing aid coil or a piezo speaker requiring high voltage can be connected
to line outputs.
The TWL6040 supports three differential microphone inputs (MMIC, HMIC, and SMIC) and a stereo line-
input (AFML, AFMR) multiplexed to two parallel ADCs. The PDM output from the ADCs is transmitted to
the OMAP4 processor through UL0 and UL1. AFML, AFMR inputs can also be looped to analog outputs
(LB0, LB1).
Two LDOs provide a voltage of 2.1 V to bias analog microphones (MBIAS and HBIAS). The maximum
output current is 2 mA for each analog bias, allowing up to two microphones on one bias. Two LDOs
provide a voltage of 1.8 V/1.85 V to bias digital microphones (DBIAS1 and DBIAS2). One bias generator
can bias several digital microphones at the same time, with a total maximum output current of 10 mA.
The TWL6040 has an integrated negative charge pump (NCP) and two LDOs (HS LDO and LS LDO) for
high PSRR. The only external supply needed is 2.1 V, which is available from the 2.1-V DC-DC of the
TWL6030 power-management IC (PMIC) in the OMAP4 system. By powering audio from low-noise 2.1-V
DC-DC of low power consumption, high dynamic range and high output swing at headset output are
achieved. All other supply inputs can be directly connected to battery or system 1.8-V I/O.
Two integrated PLLs enable operation from a 12-, 19.2-, 26-, and 38.4-MHz system clock (MCLK) or, in
LP playback mode, from a 32-kHz sleep clock (CLK32K). The frequency plan is based on a 48-kS/s audio
data rate for all channels, and host processor uses sample-rate converters to interface with different
sample rates (for example, 44.1 kHz). In the specific case of low-power audio playback, the TWL6040
supports the 44.1-kS/s and 48-kS/s rates. Transitions between sample rates or input clocks are seamless.
Accessory plug and unplug detections are supported (PLUGDET). Some headsets have a manual switch
for submitting send/end signal to the terminal through the microphone input pin. This feature is supported
by a periodic accessory button press detection to minimize current consumption in sleep mode. Detection
cycle properties can be programmed according to system requirements.
Table 1-1. Device Information(1)
PART NUMBER
PACKAGE
ZQZ (120)
ZQZ (120)
BODY SIZE (NOM)
6.00 mm × 6.00 mm
6.00 mm × 6.00 mm
TWL6040A2
TWL6040A3
(1) For more information, see Section 3, Mechanical Packaging and Orderable Information.
2
Device Overview
Copyright © 2010–2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TWL6040
TWL6040
www.ti.com
SWCS052B –AUGUST 2010–REVISED AUGUST 2014
1.4 Functional Block Diagram
Figure 1-1 shows the system block diagram of the TWL6040 device.
MMICP
MicAmpL
VDDAMBIAS
HBIAS
AAFL
MMICN
HMICP
HMICN
HMBIAS
MMBIAS
DMBIAS1
DMBIAS2
ADCL
1
GNDAMIC
0:30 dB
MBIAS
VDDUL
VSSUL
Uplink
VDDDMBIAS
MicAmpR
AAFR
DBIAS1
SMICP
SMICN
ADCR
GNDDMIC
1
DBIAS2
0:30 dB
LineInAmpR
UL0
UL1
DL0
DL1
DL2
DL3
DL4
PDMDN
PDMUP
LB1
AFMR
LineInAmpL
PDM
interface
PDMCLK
PDMCLKLB
PDMFRAME
GPO1(2,3)
LB0
AFML
GNDVCM
–18:24 dB
EarDrv
VDDEAR
EARP
Interface
EARN
VSSEAR
–24:6 dB
HSLDrv
2
SDA
SCL
I C
registers
HSL
HSDACL
HSDACR
PBKG
1
VDDHS
VSSHS
GNDHS
–30:0 dB
HSRDrv
VDDV2V1
VDDLDO
HS LDO
LS LDO
HSR
VSSLDOIN
VSSLDO
VDDDL
VSSDL
AUXLP
AUXLN
AUXRP
AUXRN
1
–30:0 dB
GNDLDO
VDDREGNCP
CFLYP
Negative
charge
pump
GNDNCP
CFLYN
Downlink
NCPOUT
NCPFB
PGAL
VDDHFL
HFLP
HFLDrv
Power
HFLN
HFDACL
1
REF
REFP
GNDHFL
Reference
temp
sense
–52:6 dB
PGAR
REFN
VDDHFR
HFRP
HFRDrv
VIBLDrv
GNDREF
PLUGDET
ACCONN
HFRN
Accessory
connector
detection
HFDACR
1
GNDHFR
–52:6 dB
PCM
VDDVIO
PDM
to
PCM
VDDVIBL
VIBLP
VDDPLL
MCLK
1
8
1
to
PWM
VIBLN
8
HP PLL
LP PLL
1
8
GNDVIBL
CLK32K
VSSPLL
VDDVIBR
VIBRP
VIBRDrv
PCM
to
PWM
Clock system
8
8
1
1
VIBRN
8
Osc
GNDVIBR
SWCS044-001
Figure 1-1. Simplified Block Diagram
Copyright © 2010–2014, Texas Instruments Incorporated
Device Overview
3
Submit Documentation Feedback
Product Folder Links: TWL6040
TWL6040
SWCS052B –AUGUST 2010–REVISED AUGUST 2014
www.ti.com
For the complete TWL60xx data sheet (SWCS044), contact your TI sales representative.
4
Device Overview
Copyright © 2010–2014, Texas Instruments Incorporated
Submit Documentation Feedback
Product Folder Links: TWL6040
TWL6040
www.ti.com
SWCS052B –AUGUST 2010–REVISED AUGUST 2014
2 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (January 2012) to Revision B
Page
•
Changed document to standard TI format ........................................................................................ 1
Copyright © 2010–2014, Texas Instruments Incorporated
Revision History
5
Submit Documentation Feedback
Product Folder Links: TWL6040
TWL6040
SWCS052B –AUGUST 2010–REVISED AUGUST 2014
www.ti.com
3 Mechanical Packaging and Orderable Information
3.1 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
6
Mechanical Packaging and Orderable Information
Submit Documentation Feedback
Product Folder Links: TWL6040
Copyright © 2010–2014, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
14-Nov-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
2500
2500
(1)
(2)
(3)
(4/5)
(6)
TWL6040A3ZBHR
TWL6040A3ZQZR
PREVIEW
NFBGA
ZBH
120
120
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 85
-40 to 85
6040A3ZBH
TWL6040A3
NRND
BGA
ZQZ
Green (RoHS
& no Sb/Br)
SNAGCU
MICROSTAR
JUNIOR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Nov-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TWL6040A3ZQZR
BGA MI
CROSTA
R JUNI
OR
ZQZ
120
2500
330.0
16.4
6.3
6.3
1.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Nov-2019
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
336.6 336.6 31.8
TWL6040A3ZQZR
BGA MICROSTAR
JUNIOR
ZQZ
120
2500
Pack Materials-Page 2
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