TX7516 [TI]

16 通道五级变送器;


型号：	TX7516
厂家：	TEXAS INSTRUMENTS
描述：	16 通道五级变送器
文件：	总9页 (文件大小：893K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TX7516

ZHCSO76A –JUNE 2021 –REVISED MARCH 2022

带有T/R 开关和片上波束成形器的TX7516 五级16 通道发送器

1 特性

2 应用

• 发送器支持：

• 超声波成像系统

• 压电式驱动器

• 探头内置超声波成像

– 16 通道五级脉冲发生器和有源发送/接收(T/R)

开关

• 五级脉冲发生器：

3 说明

– 输出电压最大值：±100V

TX7516 是一款适用于超声成像系统的高度集成、高性

能发送器解决方案。该器件共设有 16 个脉冲发生器电

路、16 个发送/接收开关（称为 T/R 或 TR 开关），并

支持片上和片外波束形成器 (TxBF)。该器件还集成片

上浮动电源，可减少所需高压电源的数量。

– 输出电压最小值：±1V

– 输出电流最大值：2A

– 支持4A 输出电流模式。

– 真正归零以将输出电压对地放电

– 第二谐波在5 MHz 频率下为-45 dBc

– –3 dB 带宽，1 kΩ|| 240 pF 负载

• 20 MHz（针对±100V 电源）

• 25 MHz（针对±70V 电源）

• 35 MHz（针对4A 模式下的±100V 电源）

– 集成抖动：频率为100 Hz 至20 kHz 时的测量

值为100 fs

TX7516 有一个脉冲发生器电路，可生成五级高压脉冲

（高达 ±100V），这些脉冲用于激发超声波传感器的

多个通道。该器件共支持 16 个输出。输出电流最大值

为2A。

该器件可用作许多应用的发射器解决方案，比如超声成

像、无损检测、声纳、激光雷达、海洋导航系统、大脑

成像系统等。

– CW 模式近端相位噪声：5 MHz 信号（1 kHz 偏

移）时为–154 dBc/Hz

– 接收功率极低：1mW/ch

器件信息

封装⁽¹⁾

封装尺寸（标称值）

器件型号

TX7516

• 有源发送/接收(T/R) 开关，具有：

FC-BGA (144)

10.0mm × 10.0mm

– 8Ω导通电阻

– 导通和关断时间：100 ns

– 瞬态干扰：10 mV_pp

• 片上波束形成器，具有：

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

A- and B-Group

Pulser

– 基于通道的T/R 开关控制

– 延迟分辨率：半个波束形成器时钟周期，不低于

2 ns

– 最大延迟：2¹⁴个波束形成器时钟周期

– 波束形成器时钟速度最大值：320 MHz

– 每通道模式控制，具有2K 不同级别。

– 全局和局部重复模式，为横波成像启用长持续时

间模式

Integrated

Passives

Floating

Supply

T/R

Switch

Pulser

RX_1

OUT_1

Delay

Profile

Thermal

Shutdown

Pulser

On-chip

Transmit

Beamforming

Temperature

Sensor

Pattern

Profile

T/R

Switch

Pulser

Error Flag Register

RX_16

– 支持120 个延迟分布

• 高速（最大值：400 MHz）双通道LVDS 串行编程

接口。

OUT_16

Pulser

High Speed SPI Interface

with Error Detection

– 低编程时间：针对延迟用户更新，< 500 ns

– 32 位校验和功能可检测错误的SPI 写入

• 支持CMOS 串行编程接口（不高于50 MHz）

• 内部温度传感器和自动热关断

• 无需特定电源时序

简化方框图

• 错误标志寄存器，用于检测故障情况

• 用于浮动电源和偏置电压的集成无源器件

• 小型封装：FC-BGA-144 (10mm × 10mm)，间距为

0.8mm

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SLOSE40

TX7516

www.ti.com.cn

ZHCSO76A –JUNE 2021 –REVISED MARCH 2022

Table of Contents

6.2 Receiving Notification of Documentation Updates......4

6.3 支持资源......................................................................4

6.4 Trademarks.................................................................4

6.5 Electrostatic Discharge Caution..................................4

6.6 术语表......................................................................... 4

7 Mechanical, Packaging, and Orderable Information....4

7.1 Mechanical Data......................................................... 5

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 说明（续）.........................................................................3

6 Device and Documentation Support..............................4

6.1 Document Support......................................................4

4 Revision History

注：以前版本的页码可能与当前版本的页码不同

Changes from Revision * (June 2021) to Revision A (March 2022)

Page

• 将器件状态从预告信息更改为量产数据.............................................................................................................1

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5 说明（续）

TX7516（在此数据表中被称为器件）是一款用于激发超声传感器的高度集成发送器解决方案。器件集成了 16 个

脉冲发生器和16 个T/R 开关、片上波束形成器和图形发生器。

脉冲发生器电路产生五级高压脉冲（高达 ±100V），输出电流最大值为 2A。当脉冲发生器发射高压脉冲时，T/R

开关关闭，保护低压接收电路不受损坏。当传感器接收回波信号时，T/R 开关导通并将传感器连接到接收器。T/R

开关的开/关操作由器件中内置的片上波束形成引擎控制。T/R 开关在导通状态下提供8Ω 的阻抗。

超声波传输依靠定义传输方向的不同的延迟值来激发多个传感器元件。这种操作被称为传输波束形成。TX7516 支

持不同通道的交错式脉冲，从而实现传输波束形成。

在片上波束形成器模式下，不同通道脉冲的延迟分布会存储在器件内。器件支持的传输波束形成器延迟分辨率为

一个波束形成器时钟周期，延迟不超过2¹⁴个波束形成器时钟周期。内部图形发生器依据分布 RAM 中的图形分布

生成输出脉冲图形。每个通道都有自己的 RAM，长度为960 字节。图形具有全局和局部重复特征。此功能可用于

生成长图形，并可用于横波成像。

这些图形分布和延迟分布是使用高速 (400MHz) 串行外设接口写入的。高速写入可能容易出错。因此，该器件具

有校验和功能来检测SPI 写入中的错误。

为防止器件因配置不当而损坏，内部错误标志寄存器可检测故障情况并自动将器件配置为关断模式。

该器件集成了浮动电源和内部偏置电压所需的所有去耦电容器。这显著减少了所需外部电容器数量。TX7516 采用

144 引脚10mm × 10mm FC-BGA 封装（ALH 封装），额定工作温度范围为0°C 至70°C。

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6 Device and Documentation Support

6.1 Document Support

表6-1. Terms Commonly Used in the Data Sheet

Abbreviation

PRT

Comment

Pulse Repetition Time. Represent TR_BF_SYNC period

Pulse Repetition Frequency. Represent TR_BF_SYNC frequency

Duration in which T/R switch of all the channels are in ON state

PRF

Receive Mode

High voltage supplies

AVDDP_HV_A, AVDDP_HV_B, AVDDM_HV_A, and AVDDM_HV_B

are collectively referred as high voltage supplies

High voltage supplies

AVDDP_5, AVDDM_5, and AVDDP_1P8 supplies are collectively

referred as low voltage supplies

A-side supplies

B-side supplies

SPI

AVDDP_HV_A and AVDDM_HV_A is referred as A-side supplies

AVDDP_HV_A and AVDDM_HV_A is referred as B-side supplies

Serial program interface

6.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

6.3 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

6.4 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

6.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

6.6 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this datasheet, refer to the left-hand navigation.

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7.1 Mechanical Data

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PACKAGE OPTION ADDENDUM

www.ti.com

20-Oct-2022

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TX7516ALH

ACTIVE

FCCSP

ALH

144

240

RoHS & Green

SNAGCU

Level-3-260C-168 HR

0 to 70

TX7516

Samples

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

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TX7516 [TI]

相关型号：

TX7516ALH

TX78-49-13

TX78-49-16

TX78/13-H2-A142

TX78/13-H2-A16

TX78/13-H2-A30

TX78/13-H2-A68

TX78/13-M2-A142

TX78/13-M2-A16

TX78/13-M2-A225

TX78/13-M2-A30

TX78/13-M2-A68