TXB0101_15 [TI]
1-Bit Bidirectional Level-Shifting and Voltage Translator;
| 型号： | TXB0101_15 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1-Bit Bidirectional Level-Shifting and Voltage Translator |
| 文件： | 总22页 (文件大小：837K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TXB0101
www.ti.com........................................................................................................................................... SCES639A–JANUARY 2007–REVISED NOVEMBER 2008
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION
1
FEATURES
2
•
•
•
Available in the Texas Instruments NanoFree™
Package
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
1.2 V to 3.6 V on A Port and
ESD Protection Exceeds JESD 22
1.65 V to 5.5 V on B Port (VCCA ≤ VCCB
)
–
A Port
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
–
–
–
2000-V Human-Body Model (A114-B)
250-V Machine Model (A115-A)
1500-V Charged-Device Model (C101)
•
•
•
OE Input Circuit Referenced to VCCA
–
B Port
Low Power Consumption, 5-µA Max ICC
–
–
–
15-kV Human-Body Model (A114-B)
Ioff Supports Partial-Power-Down Mode
Operation
250-V Machine Model (A115-A)
1500-V Charged-Device Model (C101)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
C1
B1
A1
C2
B2
A2
3
2
1
4
5
6
A
GND
VCCA
B
1
2
3
6
5
4
VCCA
VCCB
OE
1
2
3
6
5
4
VCCA
GND
A
VCCB
OE
1
2
3
6
5
4
VCCA
GND
A
VCCB
OE
OE
VCCB
GND
A
B
B
B
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This 1-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB
.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
TXB0101
SCES639A–JANUARY 2007–REVISED NOVEMBER 2008........................................................................................................................................... www.ti.com
ORDERING INFORMATION(1)
ORDERABLE
PART NUMBER
TOP-SIDE
TA
PACKAGE(2)
MARKING(3)(4)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOP – DRL
Reel of 3000
TXB0101YZPR(5)
27_
Reel of 4000
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
TXB0101DRLR(5)
TXB0101DBVR
TXB0101DBVT
TXB0101DCKR(5)
TXB0101DCKT(5)
27R
NFC_
NFC_
27_
–40°C to 85°C
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
27_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
(4) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
(5) Package preview
PIN DESCRIPTION
NO. NAME
FUNCTION
1
2
3
4
VCCA A-port supply voltage. 1.2 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB
GND Ground
A
B
Input/output A. Referenced to VCCA
Input/output B. Referenced to VCCB
.
.
3-state output enable. Pull OE low to place all outputs in 3-state mode.
Referenced to VCCA
5
6
OE
.
VCCB B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V
TYPICAL OPERATING CIRCUIT
1.8 V
3.3 V
V
CCA
V
CCB
1.8-V
3.3-V
System
Controller
System
OE
TXB0101
GND
Data
GND
A
B
Data
GND
2
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0101
TXB0101
www.ti.com........................................................................................................................................... SCES639A–JANUARY 2007–REVISED NOVEMBER 2008
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
MAX UNIT
VCCA Supply voltage range
VCCB Supply voltage range
4.6
V
6.5
VI
Input voltage range(2)
6.5
6.5
V
V
VO
Voltage range applied to any output in the high-impedance or power-off state(2)
A port
B port
VI < 0
VO < 0
–0.5 VCCA + 0.5
VO
Voltage range applied to any output in the high or low state(2)(3)
V
–0.5 VCCB + 0.5
IIK
IOK
IO
Input clamp current
–50
–50
±50
±100
165
259
142
123
mA
mA
mA
mA
Output clamp current
Continuous output current
Continuous current through VCCA, VCCB, or GND
DBV package
DCK package
DRL package
YZP package
θJA
Package thermal impedance(4)
°C/W
°C
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)(2)
VCCA
VCCB
MIN
MAX UNIT
VCCA
VCCB
1.2
3.6
V
Supply voltage
1.65
5.5
Data inputs
OE
1.2 V to 3.6 V
1.2 V to 3.6 V
1.2 V to 5.5 V
1.2 V to 3.6 V
1.2 V to 3.6 V
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 3.6 V
4.5 V to 5.5 V
VCCI × 0.65(3)
VCCI
VIH
VIL
High-level input voltage
Low-level input voltage
V
VCCA × 0.65
5.5
Data inputs
OE
0
0
VCCI × 0.35(3)
V
VCCA × 0.35
40
A-port inputs
Input transition
rise or fall rate
Δt/Δv
40 ns/V
30
B-port inputs
1.2 V to 3.6 V
TA
Operating free-air temperature
–40
85
°C
(1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.
(2) VCCA must be less than or equal to VCCB and must not exceed 3.6 V.
(3) VCCI is the supply voltage associated with the input port.
Copyright © 2007–2008, Texas Instruments Incorporated
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Product Folder Link(s): TXB0101
TXB0101
SCES639A–JANUARY 2007–REVISED NOVEMBER 2008........................................................................................................................................... www.ti.com
Electrical Characteristics(1)(2)
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25°C
TYP
–40°C to 85°C
TEST
CONDITIONS
PARAMETER
VCCA
VCCB
UNIT
V
MIN
MAX
MIN
MAX
1.2 V
1.1
VOHA
IOH = –20 µA
IOL = 20 µA
1.4 V to 3.6 V
1.2 V
VCCA – 0.4
0.9
VOLA
V
1.4 V to 3.6 V
0.4
VOHB
VOLB
II
IOH = –20 µA
IOL = 20 µA
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
0 V to 5.5 V
0 V
VCCB – 0.4
V
V
0.4
±2
±2
±2
±2
OE
1.2 V to 3.6 V
0 V
±1
±1
±1
±1
µA
A port
B port
A or B port
Ioff
µA
µA
0 V to 3.6 V
1.2 V to 3.6 V
1.2 V
IOZ
OE = GND
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
0 V
0.06
3.4
1.4 V to 3.6 V
3.6 V
3
2
VI = VCCI or GND,
IO = 0
ICCA
µA
µA
0 V
5.5 V
–2
1.2 V
1.65 V to 5.5 V
1.65 V to 5.5 V
0 V
1.4 V to 3.6 V
3.6 V
5
–2
2
VI = VCCI or GND,
IO = 0
ICCB
0 V
5.5 V
1.2 V
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
3.5
VI = VCCI or GND,
IO = 0
ICCA + ICCB
µA
µA
1.4 V to 3.6 V
1.2 V
8
3
VI = VCCI or GND,
IO = 0,
OE = GND
0.05
ICCZA
1.4 V to 3.6 V
1.2 V
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
VI = VCCI or GND,
IO = 0,
OE = GND
3.3
ICCZB
µA
1.4 V to 3.6 V
1.2 V to 3.6 V
5
Ci
OE
2.5
5
3
6
pF
pF
A port
B port
Cio
1.2 V to 3.6 V
1.65 V to 5.5 V
11
13
(1) VCCI is the supply voltage associated with the input port.
(2) VCCO is the supply voltage associated with the output port.
Timing Requirements
TA = 25°C, VCCA = 1.2 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
UNIT
TYP
20
TYP
20
TYP
20
TYP
20
Data rate
Mbps
ns
tw
Pulse duration
Data inputs
50
50
50
50
Timing Requirements
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
Data rate
40
40
40
40 Mbps
ns
tw
Pulse duration
Data inputs
25
25
25
25
4
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Product Folder Link(s): TXB0101
TXB0101
www.ti.com........................................................................................................................................... SCES639A–JANUARY 2007–REVISED NOVEMBER 2008
Timing Requirements
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
Data rate
60
60
60
60 Mbps
ns
tw
Pulse duration
Data inputs
17
17
17
17
Timing Requirements
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
100
MIN
MAX
100
MIN
MAX
Data rate
100 Mbps
ns
tw
Pulse duration
Data inputs
10
10
10
Timing Requirements
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
100
MIN
MAX
Data rate
100
Mbps
ns
tw
Pulse duration
Data inputs
10
10
Switching Characteristics
TA = 25°C, VCCA = 1.2 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
FROM
PARAMETER
TO
(OUTPUT)
UNIT
ns
(INPUT)
TYP
6.9
7.4
1
TYP
5.7
6.4
1
TYP
5.3
6
TYP
5.5
5.8
1
A
B
A
A
B
A
B
tpd
B
1
ten
OE
OE
µs
1
1
1
1
18
20
4.2
2.1
20
15
17
4.2
1.5
20
14
16
4.2
1.2
20
14
16
4.2
1.1
20
tdis
ns
trA, tfA
trB, tfB
A-port rise and fall times
B-port rise and fall times
ns
ns
Max data rate
Mbps
Copyright © 2007–2008, Texas Instruments Incorporated
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Product Folder Link(s): TXB0101
TXB0101
SCES639A–JANUARY 2007–REVISED NOVEMBER 2008........................................................................................................................................... www.ti.com
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.4
MAX
12.9
14.2
1
MIN
1.2
MAX
10.1
12
MIN
1.1
MAX
10
MIN
0.8
MAX
A
B
B
A
A
B
A
B
9.9
13.7
1
tpd
ten
tdis
ns
µs
ns
0.9
0.7
0.4
11.7
1
0.3
1
OE
OE
1
1
1
1
5.9
5.4
1.4
0.9
40
31
5.7
4.9
1.4
0.6
40
25.9
22.8
5.1
3.2
5.6
4.8
1.4
0.5
40
23
5.7
4.9
1.4
0.4
40
22.4
19.5
5.1
2.7
30.3
5.1
4.5
20
trA, tfA
trB, tfB
A-port rise and fall times
B-port rise and fall times
5.1
2.8
ns
ns
Max data rate
Mbps
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.6
MAX
11
MIN
1.4
MAX
7.7
8.4
1
MIN
1.3
1
MAX
6.8
7.6
1
MIN
1.2
MAX
A
B
B
A
A
B
A
B
6.5
7.1
1
tpd
ten
tdis
ns
µs
ns
1.5
12
1.3
0.9
1
OE
OE
1
1
1
1
5.9
5.4
1
31
5.1
4.4
1.1
0.6
60
21.3
20.8
4.1
3.2
5
4.2
1.1
0.5
60
19.3
17.9
4.1
2.8
5
4.3
1.1
0.4
60
17.4
16.3
4.1
2.7
30.3
4.2
4.5
trA, tfA
trB, tfB
A-port rise and fall times
B-port rise and fall times
ns
ns
0.9
60
Max data rate
Mbps
6
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Product Folder Link(s): TXB0101
TXB0101
www.ti.com........................................................................................................................................... SCES639A–JANUARY 2007–REVISED NOVEMBER 2008
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.1
MAX
MIN
1
MAX
MIN
0.9
MAX
A
B
B
A
A
B
A
B
6.3
6.6
1
5.2
5.1
1
4.7
4.4
1
tpd
ten
tdis
ns
µs
ns
1.2
1.1
0.9
OE
OE
1
1
1
5.1
4.4
0.8
0.7
100
21.3
20.8
3
4.6
3.8
0.8
0.5
100
15.2
16
3
4.6
3.9
0.8
0.4
100
13.2
13.9
3
trA, tfA
trB, tfB
A-port rise and fall times
B-port rise and fall times
ns
ns
3
2.8
2.7
Max data rate
Mbps
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
0.9
1
MAX
MIN
0.8
MAX
A
B
B
A
A
B
A
B
4.7
4.9
1
4
4.5
1
tpd
ten
tdis
ns
µs
ns
0.9
OE
OE
1
1
4.6
3.8
0.7
0.5
100
15.2
16
4.3
3.4
0.7
0.4
100
12.1
13.2
2.5
2.7
trA, tfA
trB, tfB
A-port rise and fall times
B-port rise and fall times
2.5
2.3
ns
ns
Max data rate
Mbps
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TXB0101
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Operating Characteristics
TA = 25°C
VCCA
1.2 V
5 V
1.2 V
1.8 V
1.5 V
1.8 V
1.8 V
VCCB
2.5 V
2.5 V
2.5 V
5 V
3.3 V
PARAMETER
TEST CONDITIONS
UNIT
3.3 V
to
1.8 V
5 V
TYP
TYP
TYP
TYP
TYP
TYP
TYP
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
A-port input, B-port output
B-port input, A-port output
7.8
12
8
11
8
11
7
11
7
11
8
11
8
11
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = VCCA
(outputs enabled)
CpdA
CpdB
CpdA
CpdB
pF
pF
38.1
25.4
0.01
0.01
0.01
0.01
28
29
29
29
29
30
18
17
17
18
20
21
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.02
0.03
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = GND
(outputs disabled)
8
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Product Folder Link(s): TXB0101
TXB0101
www.ti.com........................................................................................................................................... SCES639A–JANUARY 2007–REVISED NOVEMBER 2008
PRINCIPLES OF OPERATION
Applications
The TXB0101 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another.
Architecture
The TXB0101 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0101 can maintain a high or low,
but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts
flowing the opposite direction.
The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns
on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly,
during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up
the high-to-low transition. The typical output impedance during output transition is 70 Ω at VCCO = 1.2 V to 1.8 V,
50 Ω at VCCO = 1.8 V to 3.3 V, and 40 Ω at VCCO = 3.3 V to 5 V.
V
CCA
V
CCB
One
T1
Shot
4k
One
T2
Shot
A
B
One
T3
Shot
4k
One
T4
Shot
Figure 1. Architecture of TXB0101 I/O Cell
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Product Folder Link(s): TXB0101
TXB0101
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Input Driver Requirements
Typical IIN vs VIN characteristics of the TXB0101 are shown in Figure 2. For proper operation, the device driving
the data I/Os of the TXB0101 must have drive strength of at least ±2 mA.
IIN
VT/4 kΩ
VIN
–(VD – VT)/4 kΩ
A. VT is the input threshold voltage of the TXB0101 (typically VCCI/2.
B. VD is the supply voltage of the external driver.
Figure 2. Typical IIN vs VIN Curve
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first. The TXB0101 has circuitry that disables all
output ports when either VCC is switched off (VCCA/B = 0 V).
Enable and Disable
The TXB0101 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the
high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the
outputs are actually disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for
the one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
The TXB0101 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0101 have low
dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be
kept higher than 50 kΩ to ensure that they do not contend with the output drivers of the TXB0101.
For the same reason, the TXB0101 should not be used in applications such as I2C or 1-Wire where an
open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI
TXS01xx series of level translators.
10
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TXB0101
TXB0101
www.ti.com........................................................................................................................................... SCES639A–JANUARY 2007–REVISED NOVEMBER 2008
PARAMETER MEASUREMENT INFORMATION
2 × V
CCO
S1
50 kW
Open
From Output
Under Test
From Output
Under Test
15 pF
1 MW
15 pF
50 kW
TEST
/t
S1
2 × V
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
t
PZL PLZ
CCO
t
/t
Open
PHZ PZH
V
CCI
Input
V
CCI
/2
V
CCI
/2
0 V
t
t
PLH
PHL
t
w
V
V
OH
0.9 y V
CCO
V
CCI
Output
V
/2
V
/2
CCO
CCO
0.1 y V
CCO
V
CCI
/2
V
CCI
/2
OL
Input
t
f
t
r
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
A. C includes probe and jig capacitance.
L
B. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.
O
C. The outputs are measured one at a time, with one transition per measurement.
D.
E.
F.
t
V
V
and t
are the same as t .
PLH
PHL pd
is the V associated with the input port.
CC
CCI
is the V associated with the output port.
CCO
CC
G. All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuits and Voltage Waveforms
Copyright © 2007–2008, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): TXB0101
PACKAGE OPTION ADDENDUM
www.ti.com
22-Dec-2008
PACKAGING INFORMATION
Orderable Device
TXB0101DBVR
TXB0101DBVRG4
TXB0101DBVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SC70
SC70
SC70
SC70
SOT
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DRL
DRL
DRL
DRL
YZP
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TXB0101DBVTG4
TXB0101DCKR
TXB0101DCKRG4
TXB0101DCKT
TXB0101DCKTG4
TXB0101DRLR
TXB0101DRLRG4
TXB0101DRLT
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TXB0101DRLTG4
TXB0101YZPR
SOT
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DSBGA
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
22-Dec-2008
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Sep-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TXB0101DBVR
TXB0101DBVT
TXB0101DCKR
TXB0101DCKT
TXB0101DRLR
TXB0101DRLT
TXB0101YZPR
SOT-23
SOT-23
SC70
DBV
DBV
DCK
DCK
DRL
DRL
YZP
6
6
6
6
6
6
6
3000
250
180.0
180.0
179.0
179.0
180.0
180.0
180.0
9.2
9.2
8.4
8.4
9.2
9.2
8.4
3.23
3.23
2.2
3.17
3.17
2.5
1.37
1.37
1.2
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q1
3000
250
SC70
2.2
2.5
1.2
SOT
4000
250
1.78
1.78
1.02
1.78
1.78
1.52
0.69
0.69
0.63
SOT
DSBGA
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Sep-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TXB0101DBVR
TXB0101DBVT
TXB0101DCKR
TXB0101DCKT
TXB0101DRLR
TXB0101DRLT
TXB0101YZPR
SOT-23
SOT-23
SC70
DBV
DBV
DCK
DCK
DRL
DRL
YZP
6
6
6
6
6
6
6
3000
250
202.0
202.0
195.0
195.0
202.0
202.0
220.0
201.0
201.0
200.0
200.0
201.0
201.0
220.0
28.0
28.0
45.0
45.0
28.0
28.0
34.0
3000
250
SC70
SOT
4000
250
SOT
DSBGA
3000
Pack Materials-Page 2
D: Max = 918 µm, Min = 858 µm
E: Max = 1418 µm, Min = 1358 µm
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