TXB0108DQSR [TI]
8-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO-DIRECTION SENSING AND 15-kV ESD PROTECTION; 具有自动方向感应和15 kV ESD保护的8位双向电压电平转换器
| 型号： | TXB0108DQSR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 8-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO-DIRECTION SENSING AND 15-kV ESD PROTECTION |
| 文件： | 总24页 (文件大小：705K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TXB0108
www.ti.com
SCES643B –NOVEMBER 2006–REVISED FEBRUARY 2010
8-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
WITH AUTO-DIRECTION SENSING AND ±15-kV ESD PROTECTION
Check for Samples: TXB0108
1
FEATURES
GXY OR ZXY PACKAGE
•
1.2 V to 3.6 V on A Port and 1.65 to 5.5 V on
B Port (VCCA ≤ VCCB
(BOTTOM VIEW)
)
1
2
3
4
5
•
VCC Isolation Feature – If Either VCC Input Is at
GND, All Outputs Are in the High-Impedance
State
D
C
•
•
•
OE Input Circuit Referenced to VCCA
B
A
Low Power Consumption, 4-mA Max ICC
Ioff Supports Partial-Power-Down Mode
Operation
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
TERMINAL ASSIGNMENTS
(20-Ball GXY/ZXY Package)
ESD Protection Exceeds JESD 22
1
2
3
4
5
B8
–
A Port
D
C
B
A
VCCB
B1
B2
B3
A3
A2
B4
B5
A5
A4
B6
B7
A7
A6
–
–
2000-V Human-Body Model (A114-B)
1000-V Charged-Device Model (C101)
GND
OE
A8
A1
VCCA
–
B Port
–
–
±15-kV Human-Body Model (A114-B)
1000-V Charged-Device Model (C101)
DQS PACKAGE
(TOP VIEW)
PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
1
2
3
4
20
19
18
17
A1
A2
A3
A4
VCCA
OE
A5
A6
A7
A8
B1
1
2
20
19
18
17
16
15
14
13
12
11
A1
VCCA
A2
B1
VCCB
B2
B3
B4
B5
B6
B7
B2
1
20
B3
3
B4
19
18
17
16
15
14
13
12
2
3
4
5
6
7
8
9
VCCA
VCCB
5
6
16
15
14
13
12
11
VCCB
GND
B5
4
A2
A3
A4
A5
A6
A7
A8
B2
B3
B4
B5
B6
B7
B8
A3
5
A4
7
6
A5
8
B6
7
9
A6
B7
10
B8
8
A7
9
A8
B8
10
OE
GND
10
11
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2010, Texas Instruments Incorporated
TXB0108
SCES643B –NOVEMBER 2006–REVISED FEBRUARY 2010
www.ti.com
DESCRIPTION/ORDERING INFORMATION
This 8-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB
accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation
between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB
.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
The TXB0101 is designed so that the OE input circuit is supplied by VCCA
.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
Table 1. ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TXB0108RGYR
TOP-SIDE MARKING
YE08
QFN – RGY
Reel of 1000
SON – DQS
Reel of 2000
Reel of 2000
Reel of 2500
Reel of 2500
TXB0108DQSR
5MR
–40°C to 85°C
TSSOP – PW
TXB0108PWR
YE08
YE08
YE08
VFBGA – GXY
VFBGA – ZXY (Pb-free)
TXB0108GXYR
TXB0108ZXYR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
PIN DESCRIPTION
NO.
(DQS, PW,
RGY)
NAME
FUNCTION
1
2
3
4
5
6
7
8
9
A1
VCCA
A2
Input/output 1. Referenced to VCCA
.
A-port supply voltage. 1.1 V ≤ VCCA ≤ 3.6 V, VCCA ≤ VCCB
.
Input/output 2. Referenced to VCCA
Input/output 3. Referenced to VCCA
Input/output 4. Referenced to VCCA
Input/output 5. Referenced to VCCA
Input/output 6. Referenced to VCCA
Input/output 7. Referenced to VCCA
Input/output 8. Referenced to VCCA
.
.
.
.
.
.
.
A3
A4
A5
A6
A7
A8
Output enable. Pull OE low to place all outputs in 3-state mode.
10
OE
Referenced to VCCA
.
11
12
13
14
15
16
17
18
19
20
GND
B8
Ground
Input/output 8. Referenced to VCCB
Input/output 7. Referenced to VCCB
Input/output 6. Referenced to VCCB
Input/output 5. Referenced to VCCB
Input/output 4. Referenced to VCCB
Input/output 3. Referenced to VCCB
Input/output 2. Referenced to VCCB
.
.
.
.
.
.
.
B7
B6
B5
B4
B3
B2
VCCB
B1
B-port supply voltage. 1.65 V ≤ VCCB ≤ 5.5 V.
Input/output 1. Referenced to VCCB
.
2
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Product Folder Link(s): TXB0108
TXB0108
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SCES643B –NOVEMBER 2006–REVISED FEBRUARY 2010
TYPICAL OPERATING CIRCUIT
1.8 V
3.3 V
V
CCB
V
CCA
OE
TXB0108
1.8 -V
System
Controller
A1
A2
B1
B2
3.3-V
System
A3
A4
A5
A6
A7
A8
B3
B4
B5
B6
B7
B8
Data
Data
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
MAX
4.6
UNIT
VCCA
VCCB
VI
Supply voltage range
Supply voltage range
Input voltage range(2)
V
V
V
V
6.5
6.5
VO
Voltage range applied to any output in the high-impedance or power-off state(2)
6.5
A inputs
Voltage range applied to any output in the high or low state(2) (3)
B inputs
–0.5 VCCA + 0.5
VO
V
–0.5 VCCB + 0.5
IIK
IOK
IO
Input clamp current
VI < 0
–50
–50
±50
±100
TBD
78
mA
mA
mA
mA
Output clamp current
VO < 0
Continuous output current
Continuous current through VCCA, VCCB, or GND
DQS package
GXY/ZXY package(4)
PW package(4)
RGY package(5)
qJA
Package thermal impedance
Storage temperature range
°C/W
°C
83
37
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
(5) The package thermal impedance is calculated in accordance with JESD 51-5.
Copyright © 2006–2010, Texas Instruments Incorporated
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MAX UNIT
Recommended Operating Conditions(1) (2)
VCCA
VCCB
MIN
VCCA
1.2
3.6
V
Supply voltage
VCCB
1.65
5.5
Data inputs
VCCI x 0.65(3)
VCCI
VIH
VIL
High-level input voltage
Low-level input voltage
1.2 V to 3.6 V
1.65 V to 5.5 V
1.65 V to 5.5 V
V
OE
VCCA x 0.65
5.5
Data inputs
OE
1.2 V to 5.5 V
1.2 V to 3.6 V
1.2 V to 3.6 V
0
0
VCCI x 0.35(3)
V
VCCA x 0.35
40
A-port inputs
1.65 V to 5.5 V
1.65 V to 3.6 V
4.5 V to 5.5 V
Input transition
rise or fall rate
Δt/Δv
40 ns/V
30
B-port inputs
1.2 V to 3.6 V
TA
Operating free-air temperature
–40
85
°C
(1) The A and B sides of an unused data I/O pair must be held in the same state, i.e., both at VCCI or both at GND.
(2) VCCA must be less than or equal to VCCB and must not exceed 3.6 V.
(3) VCCI is the supply voltage associated with the input port.
4
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SCES643B –NOVEMBER 2006–REVISED FEBRUARY 2010
Electrical Characteristics(1) (2)
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25°C
TYP
–40°C to 85°C
TEST
CONDITIONS
PARAMETER
VCCA
VCCB
UNIT
V
MIN
MAX
MIN
MAX
1.2 V
1.1
VOHA
IOH = –20 mA
1.4 V to 3.6 V
1.2 V
VCCA – 0.4
0.9
VOLA
IOL = 20 mA
V
1.4 V to 3.6 V
0.4
VOHB
VOLB
II
IOH = –20 mA
IOL = 20 mA
1.65 V to 5.5 V
1.65 V to 5.5 V
1.65 V to 5.5 V
0 V to 5.5 V
0 V
VCCB – 0.4
V
V
0.4
±2
±2
±2
±2
OE
1.2 V to 3.6 V
0 V
±1
±1
±1
±1
mA
A port
B port
A or B port
Ioff
mA
mA
0 V to 3.6 V
1.2 V to 3.6 V
1.2 V
IOZ
OE = GND
1.65 V to 5.5 V
0.06
3.4
1.65 V to 5.5 V
1.4 V to 3.6 V
3.6 V
5
2
VI = VCCI or GND,
IO = 0
ICCA
mA
mA
0 V
0 V
5.5 V
–2
1.2 V
1.65 V to 5.5 V
1.4 V to 3.6 V
3.6 V
5
–2
2
VI = VCCI or GND,
IO = 0
ICCB
0 V
0 V
5.5 V
1.2 V
3.5
VI = VCCI or GND,
IO = 0
ICCA + ICCB
1.65 V to 5.5 V
1.65 V to 5.5 V
mA
mA
1.4 V to 3.6 V
1.2 V
10
5
VI = VCCI or GND,
IO = 0,
OE = GND
0.05
ICCZA
1.4 V to 3.6 V
1.2 V
VI = VCCI or GND,
IO = 0,
OE = GND
3.3
ICCZB
1.65 V to 5.5 V
mA
1.4 V to 3.6 V
1.2 V to 3.6 V
5
CI
OE
1.65 V to 5.5 V
1.65 V to 5.5 V
5
5
8
5.5
6.5
10
pF
pF
A port
B port
Cio
1.2 V to 3.6 V
(1) VCCI is the supply voltage associated with the input port.
(2) VCCO is the supply voltage associated with the output port.
Timing Requirements
TA = 25°C, VCCA = 1.2 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
UNIT
TYP
20
TYP
20
TYP
20
TYP
20
Data rate
Mbps
ns
tw
Pulse duration
Data inputs
50
50
50
50
Timing Requirements
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
Data rate
50
50
50
50 Mbps
ns
tw
Pulse duration
Data inputs
20
20
20
20
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Timing Requirements
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
Data rate
52
60
60
60 Mbps
ns
tw
Pulse duration
Data inputs
19
17
17
17
Timing Requirements
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
70
MIN
MAX
100
MIN
MAX
Data rate
100 Mbps
ns
tw
Pulse duration
Data inputs
14
10
10
Timing Requirements
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
100
MIN
MAX
Data rate
100
Mbps
ns
tw
Pulse duration
Data inputs
10
10
Switching Characteristics
TA = 25°C, VCCA = 1.2 V
VCCB = 1.8 V
VCCB = 2.5 V
VCCB = 3.3 V
VCCB = 5 V
FROM
PARAMETER
TO
(OUTPUT)
UNIT
ns
(INPUT)
TYP
9.5
9.2
1
TYP
7.9
8.8
1
TYP
7.6
8.4
1
TYP
8.5
8
A
B
A
A
B
A
B
tpd
B
1
ten
OE
OE
ms
1
1
1
1
20
20
4.1
5
17
16
4.4
5
17
15
4.1
5.1
1.9
20
18
15
3.9
5.1
7
tdis
ns
trA, tfA
trB, tfB
A-port rise and fall times
B-port rise and fall times
Channel-to-channel skew
ns
ns
tSK(O)
2.4
20
1.7
20
ns
Max data rate
20
Mbps
6
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TXB0108
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SCES643B –NOVEMBER 2006–REVISED FEBRUARY 2010
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.5 V ± 0.1 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.4
MAX
12.9
14.2
1
MIN
1.2
MAX
10.1
12
MIN
1.1
MAX
10
MIN
0.8
MAX
A
B
B
A
A
B
A
B
9.9
13.7
1
tpd
ten
tdis
ns
ms
ns
0.9
0.7
0.4
11.7
1
0.3
1
OE
OE
1
1
1
1
6.6
6.6
0.8
1
33
6.4
5.8
0.8
0.7
25.3
25.6
6.3
4.9
1.9
6.1
5.5
0.8
0.7
23.1
22.1
6.3
4.6
1.6
5.9
5.6
0.8
0.6
24.6
20.6
6.3
4.6
1.3
35.6
6.5
7.3
2.6
trA, tfA
trB, tfB
A-port rise and fall times
ns
ns
B-port rise and fall times
Channel-to-channel skew
tSK(O)
ns
Max data rate
50
50
50
50
Mbps
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 1.8 V
± 0.15 V
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.6
MAX
11
MIN
1.4
MAX
7.7
8.4
1
MIN
1.3
MAX
6.8
7.6
1
MIN
1.2
MAX
A
B
B
A
A
B
A
B
6.5
7.1
1
tpd
ten
tdis
ns
ms
ns
1.5
12
1.2
0.8
0.5
1
OE
OE
1
1
1
1
5.9
6.1
0.7
1
26.7
33.9
5.1
7.3
0.8
5.6
5.2
0.7
0.7
21.6
23.7
5
5.4
5
18.9
19.9
5
4.8
5
18.7
17.6
5
trA, tfA
trB, tfB
A-port rise and fall times
1
0.7
0.6
ns
ns
B-port rise and fall times
Channel-to-channel skew
5
0.7
3.9
0.6
3.8
0.6
tSK(O)
0.7
ns
Max data rate
52
60
60
60
Mbps
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Switching Characteristics
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
1.1
1
MAX
MIN
1
MAX
MIN
0.9
MAX
4.7
A
B
B
A
A
B
A
B
6.4
7
5.3
5.6
1
tpd
ten
tdis
ns
ms
ns
0.6
0.3
4.4
1
1
OE
OE
1
1
1
5
4.8
0.8
0.6
16.9
21.8
3.6
4.9
0.4
4.9
4.5
0.6
0.7
15
4.5
4.4
0.5
0.6
13.8
15.2
3.5
3.2
0.3
17.9
3.6
3.9
0.3
trA, tfA
trB, tfB
A-port rise and fall times
ns
ns
B-port rise and fall times
Channel-to-channel skew
tSK(O)
ns
Max data rate
70
100
100
Mbps
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
0.9
MAX
MIN
0.8
MAX
A
B
B
A
A
B
A
B
4.9
5.4
1
4
4
tpd
ten
tdis
ns
ms
ns
0.5
0.2
1
OE
OE
1
1
4.5
4.1
0.5
0.7
13.9
17.3
3
4.1
4
12.4
14.4
3
trA, tfA
trB, tfB
A-port rise and fall times
0.5
0.6
ns
ns
B-port rise and fall times
Channel-to-channel skew
3.9
0.4
3.2
0.3
tSK(O)
ns
Max data rate
100
100
Mbps
8
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SCES643B –NOVEMBER 2006–REVISED FEBRUARY 2010
Operating Characteristics
TA = 25°C
VCCA
1.2 V
5 V
1.2 V
1.8 V
1.5 V
1.8 V
1.8 V
VCCB
2.5 V
2.5 V
2.5 V
5 V
3.3 V
PARAMETER
TEST CONDITIONS
UNIT
3.3 V
to
1.8 V
5 V
TYP
TYP
TYP
TYP
TYP
TYP
TYP
A-port input, B-port output
CpdA
9
12
8
11
7
11
7
11
7
11
7
11
8
11
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
B-port input, A-port output
pF
pF
OE = VCCA
(outputs enabled)
A-port input, B-port output
CpdB
35
26
27
27
27
27
28
B-port input, A-port output
26
19
18
18
18
20
21
A-port input, B-port output
CpdA
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.01
0.03
0.03
CL = 0, f = 10 MHz,
tr = tf = 1 ns,
OE = GND
(outputs disabled)
B-port input, A-port output
A-port input, B-port output
CpdB
B-port input, A-port output
Copyright © 2006–2010, Texas Instruments Incorporated
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9
Product Folder Link(s): TXB0108
TXB0108
SCES643B –NOVEMBER 2006–REVISED FEBRUARY 2010
www.ti.com
PRINCIPLES OF OPERATION
Applications
The TXB0108 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another.
Architecture
The TXB0108 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0108 can maintain a high or low,
but are designed to be weak, so that they can be overdriven by an external driver when data on the bus starts
flowing the opposite direction.
The output one shots detect rising or falling edges on the A or B ports. During a rising edge, the one shot turns
on the PMOS transistors (T1, T3) for a short duration, which speeds up the low-to-high transition. Similarly,
during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for a short duration, which speeds up
the high-to-low transition. The typical output impedance during output transition is 70Ω at VCCO = 1.2 V to 1.8 V,
50Ω at VCCO = 1.8 V to 3.3 V and 40Ω at VCCO = 3.3 V to 5 V.
V
CCA
V
CCB
One
T1
Shot
4k
One
T2
Shot
A
B
One
T3
Shot
4k
One
T4
Shot
Figure 1. Architecture of TXB0108 I/O Cell
Input Driver Requirements
Typical IIN vs VIN characteristics of the TXB0108 are shown in Figure 2. For proper operation, the device driving
the data I/Os of the TXB0108 must have drive strength of at least ±2 mA.
10
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Copyright © 2006–2010, Texas Instruments Incorporated
Product Folder Link(s): TXB0108
TXB0108
www.ti.com
SCES643B –NOVEMBER 2006–REVISED FEBRUARY 2010
I
IN
V /4 kW
T
V
IN
–(V – V )/4 kW
D
T
A. V is the input threshold voltage of the TXB0108 (typically V /2).
T
CCI
B.
V
D
is the supply voltage of the external driver.
Figure 2. Typical IIN vs VIN Curve
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first. The TXB0108 has circuitry that disables all
output ports when either VCC is switched off (VCCA/B = 0 V).
Enable and Disable
The TXB0108 has an OE input that is used to disable the device by setting OE = low, which places all I/Os in the
high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when OE goes low and when the
outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
The TXB0108 is designed to drive capacitive loads of up to 70 pF. The output drivers of the TXB0108 have low
dc drive strength. If pullup or pulldown resistors are connected externally to the data I/Os, their values must be
kept higher than 50 kΩ to ensure that they do not contend with the output drivers of the TXB0108.
For the same reason, the TXB0108 should not be used in applications such as I2C or 1-Wire where an
open-drain driver is connected on the bidirectional data I/O. For these applications, use a device from the TI
TXS01xx series of level translators.
Copyright © 2006–2010, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): TXB0108
TXB0108
SCES643B –NOVEMBER 2006–REVISED FEBRUARY 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION
2 × V
CCO
S1
50 kW
Open
From Output
Under Test
From Output
Under Test
15 pF
1 MW
15 pF
50 kW
TEST
/t
S1
2 × V
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
t
PZL PLZ
CCO
t
/t
Open
PHZ PZH
V
CCI
Input
V
CCI
/2
V
CCI
/2
0 V
t
t
PLH
PHL
t
w
V
V
OH
0.9 y V
CCO
V
CCI
Output
V
/2
V
/2
CCO
CCO
0.1 y V
CCO
V
CCI
/2
V
CCI
/2
OL
Input
t
f
t
r
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
A. C includes probe and jig capacitance.
L
B. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.
O
C. The outputs are measured one at a time, with one transition per measurement.
D.
E.
F.
t
V
V
and t
are the same as t .
PLH
PHL pd
is the V associated with the input port.
CC
CCI
is the V associated with the output port.
CCO
CC
G. All parameters and waveforms are not applicable to all devices.
Figure 3. Load Circuits and Voltage Waveforms
12
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Product Folder Link(s): TXB0108
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TXB0108DQSR
TXB0108PWR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
USON
TSSOP
TSSOP
VQFN
DQS
PW
20
20
20
20
20
20
3000
2000
2000
3000
3000
2500
Green (RoHS
& no Sb/Br)
Call TI
Level-1-260C-UNLIM
Request Free Samples
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
Request Free Samples
Request Free Samples
Request Free Samples
Request Free Samples
TXB0108PWRG4
TXB0108RGYR
TXB0108RGYRG4
TXB0108ZXYR
PW
Green (RoHS
& no Sb/Br)
RGY
RGY
ZXY
Green (RoHS
& no Sb/Br)
Call TI
Call TI
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
VQFN
Green (RoHS
& no Sb/Br)
BGA
MICROSTAR
JUNIOR
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
14-Oct-2010
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Apr-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TXB0108DQSR
TXB0108PWR
TXB0108RGYR
USON
TSSOP
VQFN
DQS
PW
20
20
20
3000
2000
3000
177.8
330.0
330.0
12.4
16.4
12.4
2.21
6.95
3.8
4.22
7.1
0.81
1.6
4.0
8.0
8.0
12.0
16.0
12.0
Q1
Q1
Q1
RGY
4.8
1.6
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
1-Apr-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TXB0108DQSR
TXB0108PWR
TXB0108RGYR
USON
TSSOP
VQFN
DQS
PW
20
20
20
3000
2000
3000
202.0
346.0
355.0
201.0
346.0
350.0
28.0
33.0
50.0
RGY
Pack Materials-Page 2
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