TXS0101DBVTG4 [TI]
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS; 1位双向电压电平转换为漏极开路应用
| 型号： | TXS0101DBVTG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN APPLICATIONS |
| 文件： | 总18页 (文件大小：591K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TXS0101
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES638–OCTOBER 2007
1
FEATURES
DBV, DCK, OR DRL PACKAGE
2
•
Available in the Texas Instruments NanoFree™
(TOP VIEW)
Package
VCCA
GND
A
VCCB
OE
B
1
2
3
6
5
4
•
•
1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on
B port (VCCA ≤ VCCB
)
VCC Isolation Feature – If Either VCC Input Is at
GND, Both Ports Are in the High-Impedance
State
YZP PACKAGE
(BOTTOM VIEW)
•
•
•
Ioff Supports Partial-Power-Down Mode
Operation
3 4
A
GND
VCCA
B
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
2
5
OE
VCCB
1 6
ESD Protection Exceeds JESD 22
–
A Port
abc
abc
abc
abc
abc
–
–
–
2500-V Human-Body Model (A114-B)
200-V Machine Model (A115-A)
1500-V Charged-Device Model (C101)
–
B Port
–
–
–
8-kV Human-Body Model (A114-B)
200-V Machine Model (A115-A)
1500-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This one-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to
track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. The B port is designed to track VCCB. VCCA
must be less than or equal to VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for
low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(3)
_ _ _2G_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
Reel of 3000
TXS0101YZPR
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
TXS0101DBVR
TXS0101DBVT
TXS0101DCKR
TXS0101DCKT
TXS0101DRLR
TXS0101DRLT
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-563) – DRL
2G_
–40°C to 85°C
NFF_
2G_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TXS0101
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES638–OCTOBER 2007
PIN DESCRIPTION
NO. NAME
FUNCTION
1
2
3
4
5
6
VCCA A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB
GND Ground
A
B
Input/output A. Referenced to VCCA
Input/output B. Referenced to VCCB
.
.
OE
Output enable. Pull OE low to place all outputs in 3-state mode. Referenced to VCCA.
VCCB B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V
TYPICAL OPERATING CIRCUIT
1.8 V
3.3 V
V
CCA
V
CCB
1.8 V
3.3 V
System
Controller
System
OE
Data
GND
A
B
Data
GND
GND
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
MAX
UNIT
V
VCCA
VCCB
Supply voltage range
Supply voltage range
4.6
6.5
4.6
6.5
4.6
6.5
V
A port
VI
Input voltage range(2)
V
V
V
B port, OE
A port
Voltage range applied to any output
VO
VO
in the high-impedance or power-off state(2)
B port
A port
–0.5 VCCA + 0.5
Voltage range applied to any output in the high or low state(2)(3)
B port
–0.5 VCCB + 0.5
IIK
IOK
IO
Input clamp current
VI < 0
–50
–50
±50
±100
165
259
142
123
mA
mA
mA
mA
Output clamp current
VO < 0
Continuous output current
Continuous current through VCCA, VCCB, or GND
DBV package
DCK package
DRL package
YZP package
θJA
Package thermal impedance(4)
°C/W
°C
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
2
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TXS0101
TXS0101
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES638–OCTOBER 2007
Thermal Impedance Ratings
UNIT
DBV package
DCK package
DRL package
YEP/YZP package
165
259
142
123
θJA
Package thermal impedance(1)
°C/W
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)(2)
VCCA
VCCB
MIN
MAX UNIT
VCCA
1.65
3.6
V
Supply voltage(3)
VCCB
2.3
5.5
1.65 V to 1.95 V
VCCI – 0.2
VCCI
A-port I/Os
2.3 V to 5.5 V
2.3 V to 5.5 V
2.3 V to 3.6 V
VCCI – 0.4
VCCI
VIH
High-level input voltage
Low-level input voltage
V
B-port I/Os
OE input
VCCI – 0.4
VCCI
1.65 V to 3.6 V
VCCA × 0.65
5.5
A-port I/Os
B-port I/Os
OE input
0
0
0
0.15
VIL
1.65 V to 3.6 V
1.65 V to 3.6 V
2.3 V to 5.5 V
2.3 V to 5.5 V
0.15
V
VCCA × 0.35
A-port I/Os,
push-pull driving
10
10
Input transition rise or fall
rate
Δt/Δv
B-port I/Os,
push-pull driving
ns/V
Control Input
10
85
TA
Operating free-air temperature
–40
°C
(1) VCCI is the supply associated with the input port.
(2) VCCO is the supply associated with the output port.
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
Copyright © 2007, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TXS0101
TXS0101
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES638–OCTOBER 2007
Electrical Characteristics(1)(2)(3)
over recommended operating free-air temperature range (unless otherwise noted)
TA = 25°C
–40°C to 85°C
VCCA × 0.67
TEST
CONDITIONS
PARAMETER
VOHA
VOLA
VOHB
VOLB
II
VCCA
VCCB
UNIT
MIN TYP MAX
MIN MAX
IOH = –20 μA,
VIB ≥ VCCB – 0.4 V
1.65 V to 3.6 V
1.65 V to 3.6 V
1.65 V to 3.6 V
1.65 V to 3.6 V
2.3 V to 5.5 V
2.3 V to 5.5 V
2.3 V to 5.5 V
2.3 V to 5.5 V
V
V
V
V
IOL = 1 mA,
VIB ≤ 0.15 V
0.4
IOH = –20 μA,
VIA ≥ VCCA – 0.2 V
VCCB × 0.67
IOL = 1 mA,
VIA ≤ 0.15 V
0.4
OE
1.65 V to 3.6 V
0 V
1.65 V to 5.5 V
0 to 5.5 V
0 V
±1
±1
±1
±1
±2
±2
±2
±2
2.4
2.2
-1
μA
μA
μA
μA
A port
B port
A or B port
Ioff
0 to 3.6 V
1.65 V to 3.6 V
1.65 V to VCCB
3.6 V
IOZ
2.3 V to 5.5 V
2.3 V to 5.5 V
0 V
VI = VO = open,
IO = 0
ICCA
μA
μA
0 V
5.5 V
1.65 V to VCCB
3.6 V
2.3 V to 5.5 V
0 V
12
-1
VI = VO = open,
IO = 0
ICCB
0 V
5.5 V
1
VI = VCCI
IO = 0
,
ICCA + ICCB
1.65 V to VCCB
3.3 V
2.3 V to 5.5 V
3.3 V
14.4
3.5
μA
CI
OE
2.5
5
pF
A-port
B-port
6
Cio
3.3 V
3.3 V
pF
6
7.5
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.
Timing Requirements
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN MAX
MIN
MAX
MIN
MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
21
22
1
24
1
Data rate
Mbps
ns
1
47
45
41
tw
Pulse duration
Data inputs
500
500
500
Timing Requirements
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V
± 0.2 V
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN MAX
MIN
MAX
MIN
MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
20
22
1
24
1
Data rate
Mbps
ns
1
50
45
41
tw
Pulse duration
Data inputs
500
500
500
4
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TXS0101
TXS0101
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES638–OCTOBER 2007
Timing Requirements
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
± 0.3 V
VCCB = 5 V
± 0.5 V
UNIT
MIN
MAX
23
MIN
MAX
24
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Data rate
Mbps
ns
1
1D
43
41
tw
Pulse duration
Data inputs
500
500
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)
VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
± 0.2 V ± 0.3 V ± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
PARAMETER
UNIT
MIN
2.3
45
MAX MIN MAX MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
5.3
8.8
5.4
9.6
7.1
208
4.5
4.4
4.5
140
200
40
6.8
10
tPHL
tPLH
tPHL
tPLH
2.4
36
2.6
A
B
B
A
ns
6.8
7.5
260
4.4
27 198
4.7
1.9
45
5.3
1.1
36
1.2
4
ns
5.3
0.5
175
200
50
27 102
200
ten
OE
OE
A or B
A or B
ns
ns
tdis
35
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
3.2
38
1.1
34
1.9
4.4
2.2
6.9
21
1
9.5
2.3
30
1
9.3
132
9.1
106
6
2
22
1
7.6
95
trA
A-port rise time
ns
ns
165
10.8
145
5.9
7.6
76
trB
B-port rise time
A-port fall time
B-port fall time
23
1.9
4.3
2.2
7.5
22
1
10
1.4 13.3
4.2 6.1
2.6 16.2
tfA
6.9
6.4
16.2
16.2
ns
13.8
13.8
tfB
7
24
1
16.2
Max data rate
Mbps
Copyright © 2007, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TXS0101
TXS0101
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES638–OCTOBER 2007
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)
VCCB = 2.5 V VCCB = 3.3 V VCCB = 5 V
± 0.2 V ± 0.3 V ± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
PARAMETER
UNIT
MIN
1.7
43
MAX MIN MAX MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
3.2
6.3
3.5
250
3
3.7
6
3.8
5.8
4.4
tPHL
tPLH
tPHL
tPLH
2
36
2.1
A
B
B
A
ns
4.1
206
3.6
4.2
1.6
140
200
40
27 190
4.3
1.8
44
4.7
2.5
170
200
50
1.6
37
1.2
4
1
ns
27 103
200
ten
OE
OE
A or B
A or B
ns
ns
tdis
35
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
2.8
34
1.3
35
1.9
4.4
2.2
5.1
20
1
7.4
149
8.3
151
5.7
6.9
7.8
8.8
2.1
28
0.9
24
1.4
4.3
2.4
5.4
22
1
6.6
121
7.2
112
5.5
6.2
6.7
9.4
0.9
24
5.6
89
trA
A-port rise time
ns
ns
0.4
12
6.1
81
trB
B-port rise time
A-port fall time
B-port fall time
0.8
4.2
2.6
5.3
5.8
6.6
tfA
ns
tfB
ns
5.4 10.4
24
1
Max data rate
Mbps
6
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TXS0101
TXS0101
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES638–OCTOBER 2007
Switching Characteristics
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)
VCCB = 3.3 V
VCCB = 5 V
± 0.5 V
FROM
(INPUT)
TO
(OUTPUT)
TEST
CONDITIONS
± 0.3 V
PARAMETER
UNIT
MIN
1.3
36
1
MAX MIN MAX
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
2.4
4.2
4.2
204
2.5
124
2.5
139
200
40
3.1
4.6
4.4
165
3.3
97
tPHL
tPLH
tPHL
tPLH
1.4
28
1
A
B
B
A
ns
ns
2.6
105
200
35
3
3
ten
OE
OE
A or B
A or B
ns
ns
tdis
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
Push-pull driving
Open-drain driving
2.3
25
1.6
26
1.4
4.3
2.3
5
5.6
116
6.4
116
5.4
6.1
7.4
7.6
1.9
19
0.6
14
1
4.8
85
trA
A-port rise time
B-port rise time
A-port fall time
B-port fall time
ns
ns
7.4
72
trB
5
tfA
ns
4.2
2.4
4.8
24
1
5.7
7.6
8.3
tfB
ns
23
1
Max data rate
Mbps
PRINCIPLES OF OPERATION
Applications
The TXS0101 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another. The TXS0101 is ideal for use in applications where an open-drain
driver is connected to the data I/Os. The TXB0101 can also be used in applications where a push-pull driver is
connected to the data I/Os, but the TXB0102 might be a better option for such push-pull applications.
Architecture
The TXS0101 architecture (see Figure 1) does not require a direction-control signal to control the direction of
data flow from A to B or from B to A.
Copyright © 2007, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): TXS0101
TXS0101
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES638–OCTOBER 2007
VCCB
VCCA
One-
shot
One-
shot
T1
T2
10k
10k
Gate Bias
A
B
Figure 1. Architecture of a TXS01xx Cell
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shot
turns on the PMOS transistors (T1,T2) for a short duration, which speeds up the low-to-high transition.
Input Driver Requirements
The fall time (tfA, tfB) of a signal depends on the output impedance of the external device driving the data I/Os of
the TXS0101. Similarly, the tPHL and max data rates also depend on the output impedance of the external driver.
The values for tfA, tfB, tPHL, and maximum data rates in the data sheet assume that the output impedance of the
external driver is less than 50 Ω.
Power Up
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not
damage the device, so any power supply can be ramped up first.
Enable and Disable
The TXS0101 has an OE input that is used to disable the device by setting OE low, which places all I/Os in the
Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs
actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the
one-shot circuitry to become operational after OE is taken high.
Pullup or Pulldown Resistors on I/O Lines
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup
resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O
to VCCA or VCCB (in parallel with the internal 10-kΩ resistors).
8
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TXS0101
TXS0101
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR
FOR OPEN-DRAIN APPLICATIONS
www.ti.com
SCES638–OCTOBER 2007
PARAMETER MEASUREMENT INFORMATION
V
CCI
V
CCO
V
CCI
V
CCO
LVC4T65
IN
LVC4T65
IN
OUT
OUT
1 MW
1 MW
15 pF
15 pF
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
AN OPEN-DRAIN DRIVER
DATA RATE, PULSE DURATION, PROPAGATION DELAY,
OUTPUT RISE AND FALL TIME MEASUREMENT USING
A PUSH-PULL DRIVER
2 × V
CCO
S1
50 kW
Open
From Output
Under Test
15 pF
50 kW
TEST
/t
S1
2 × V
t
PZL PLZ
CCO
LOAD CIRCUIT FOR ENABLE/DISABLE
TIME MEASUREMENT
t
/t
Open
PHZ PZH
t
w
V
CCI
V
CCA
V
/2
V
/2
Output
Control
(low-level
enabling)
Input
CCI
CCI
V /2
CCA
V /2
CCA
0 V
VOLTAGE WAVEFORMS
PULSE DURATION
0 V
t
PLZ
t
PZL
V
V
CCO
Output
Waveform 1
V
CCI
V
V
/2
CCO
Input
V
/2
V
/2
CCO
CCO
0.1 y V
CCO
S1 at 2 × V
CCO
OL
0 V
(see Note B)
t
PHZ
t
t
t
PLH
PHL
PZH
Output
Waveform 2
S1 at GND
V
OH
0.9 y V
V
OH
CCO
0.9 y V
CCO
/2
Output
V
CCO
/2
V
CCO
/2
CCO
(see Note B)
0.1 y V
CCO
0 V
V
OL
t
f
t
r
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.
O
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
H.
I.
t
t
t
V
V
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
are the same as t
PZH
en
are the same as t .
pd
PHL
is the V associated with the input port.
CC
CCI
is the V associated with the output port.
CCO
CC
J. All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuit and Voltage Waveforms
Copyright © 2007, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): TXS0101
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jan-2008
PACKAGING INFORMATION
Orderable Device
TXS0101DBVR
TXS0101DBVRG4
TXS0101DBVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
6
6
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DRL
DRL
YZP
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TXS0101DBVTG4
TXS0101DCKR
TXS0101DCKRG4
TXS0101DCKT
TXS0101DCKTG4
TXS0101DRLR
TXS0101DRLRG4
TXS0101YZPR
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT
4000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
WCSP
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
3-Jan-2008
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2008
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
180
180
179
179
180
180
(mm)
TXS0101DBVR
TXS0101DBVT
TXS0101DCKR
TXS0101DCKT
TXS0101DRLR
TXS0101YZPR
DBV
DBV
DCK
DCK
DRL
YZP
6
6
6
6
6
6
SITE 35
SITE 35
SITE 48
SITE 48
SITE 35
SITE 12
9
9
8
8
9
8
3.23
3.23
2.2
3.17
3.17
2.5
1.37
1.37
1.2
4
4
4
4
4
4
8
8
8
8
8
8
Q3
Q3
Q3
Q3
Q3
Q1
2.2
2.5
1.2
1.78
1.02
1.78
1.52
0.69
0.66
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
12-Feb-2008
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TXS0101DBVR
TXS0101DBVT
TXS0101DCKR
TXS0101DCKT
TXS0101DRLR
TXS0101YZPR
DBV
DBV
DCK
DCK
DRL
YZP
6
6
6
6
6
6
SITE 35
SITE 35
SITE 48
SITE 48
SITE 35
SITE 12
202.0
202.0
220.0
220.0
202.0
220.0
201.0
201.0
205.0
205.0
201.0
220.0
28.0
28.0
50.0
50.0
28.0
0.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated
相关型号：
TXS0101_08
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS
TI
TXS0101_10
1-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS
TI
©2020 ICPDF网 联系我们和版权申明