TXS02612_10_技术文档

TXS02612

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SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

SDIO PORT EXPANDER WITH VOLTAGE-LEVEL TRANSLATION

1

FEATURES

•

6-to-12 Demultiplexer/Multiplexer Allows SDIO

Port Expansion

•

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

Built-in Level Translator Eliminates Voltage

Mismatch Between Baseband and SD Card or

SDIO Peripheral

ESD Performance A Port

–

2000-V Human-Body Model (A114-B)

100-V Machine Model (A115-A)

•

V_CCA, V_CCB0, and V_CCB1Each Operate Over Full

1.1-V to 3.6-V Range

1500-V Charged-Device Model (C101)

•

±8-kV Contact Discharge IEC 61000-4-2 ESD

Performance (B Port)

DESCRIPTION/ORDERING INFORMATION

The TXS02612 is designed to interface the cell phone baseband with external SDIO peripherals. The device

includes a 6-channel SPDT switch with voltage-level translation capability. This allows a single SDIO port to be

interfaced with two SDIO peripherals. The TXS02612 has three separate supply rails that operate over the full

range of 1.1 V to 3.6 V. This allows the baseband and SDIO peripherals to operate at different supply voltages if

required.

The select (SEL) input is used to choose between the B0 port and B1 port. When SEL = Low, B0 port is

selected; when SEL = High, B1 port is selected. SEL is referenced to V_CCA. For the unselected B port, the clock

output is held low, whereas the data and command I/Os are pulled high to their respective V_CCBthrough a 70-kΩ

resistor (±30% tolerance).

ORDERING INFORMATION⁽¹⁾

T_A

PACKAGE⁽²⁾

ORDERABLE PART NUMBER

TOP-SIDE MARKING

YJ612

MicroStar Junior™ BGA

Reel of 3000

TXS02612ZQSR

(VFBGA) – ZQS

QFN – RTW

–40°C to 85°C

TXS02612RTWR

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

RTW PACKAGE

(TOP VIEW)

Table 1. ZQS PACKAGE TERMINAL

ZQS PACKAGE

(TOP VIEW)

ASSIGNMENTS

1

2

3

4

5

1

3

2 4 5

A

B

C

D

E

DAT2A

DAT3A

CMDA

DAT0A

DAT1A

SEL

DAT3_B0

DAT2_B0

GND

CMD_B0

V_CCB0

V_{CC B1}

DAT1_B1

CMD_B1

CLK_B0

DAT0_B0

DAT1_B0

DAT0_B1

CLK_B1

A

B

C

D

E

24 23 22 21 20 19

DAT2A

GND

1

2

3

4

5

6

18 DAT0

17 VCC

B0

V_CCA

CLKA

B1

Exposed

Center Pad

DAT3A

CMDA

16 DAT1

15 DAT1

14 DAT0

13 CLK

GND

B0

B1

DAT2_B1

DAT3_B1

V

CCA

DAT0A

For RTW, if the exposed

center pad is used, it must

be connected to ground

or electrically open.

B1

7

8

9 10 11 12

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

TXS02612

SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

www.ti.com

APPLICATION BLOCK DIAGRAM

V

CCB0

V

CCB0

CCA

V

CCB1

CCA

DAT0

B0

DAT0A

DAT1A

DAT2A

DAT3A

CMDA

DAT0

DAT1

B1

B0

DAT1

B1

DAT2

B0

SD/MMC

Memory Card

DAT2

DAT3

B1

B0

SDIO Port

DAT3

B1

CMD

B0

CMD

B1

CLK

B0

CLKA

SEL

Clock

Logic

Digital Baseband

or Apps

Processor

V

CCB1

CLK

B1

TXS02612

NOTE:

Switch positions shown in this

diagram are for the case when

SEL = Low

SDIO Peripheral

(Bluetooth,

WLAN, DTV, etc)

2

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SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

PIN ASSIGNMENTS

RTW PACKAGE ZQS PACKAGE

NAME

FUNCTION

TYPE

PIN NO.

BALL NO.

1

3

A1

DAT2A

DAT3A

CMDA

DAT0A

DAT1A

SEL

Data bit 2. Referenced to V_CCA

Data bit 3. Referenced to V_CCA

.

I/O

B1

4

C1

D1

E1

Command bit. Referenced to V_CCA

.

I/O

6

Data bit 0. Referenced to V_CCA

Data bit 1. Referenced to V_CCA

.

I/O

7

I/O

24

A2

Select pin to choose between B0 and B1. Referenced to V_CCA

Depopulated

.

Input

B2

5

C2

D2

E2

V_CCA

CLKA

A-port supply voltage. 1.1 V ≤ V_CCA≤ 3.6 V.

Power

Input

I/O

9

Clock input A. Referenced to V_CCA.

8

DAT2_B1

DAT3_B0

DAT2_B0

GND

Data bit 2. Referenced to V_CCB1

Data bit 3. Referenced to V_CCB0

Data bit 2. Referenced to V_CCB0

Ground

.

22

23

2

A3

I/O

B3

I/O

C3

D3

E3

11

10

20

21

17

15

12

19

18

16

14

13

GND

Ground

DAT3_B1

CMD_B0

V_CCB0

Data bit 3. Referenced to V_CCB1

.

I/O

A4

Command bit. Referenced to V_CCB0.

B4

B0-port supply voltage. 1.1 V ≤ V_CCB0≤ 3.6 V.

B1-port supply voltage. 1.1 V ≤ V_CCB1≤ 3.6 V.

Power

I/O

C4

D4

E4

V_CCB1

DAT1_B1

CMD_B1

CLK_B0

DAT0_B0

DAT1_B0

DAT0_B1

CLK_B1

Data bit 1. Referenced to V_CCB1

.

Command bit. Referenced to V_CCB1

.

I/O

A5

Clock output. Referenced to V_CCB0

.

Output

I/O

B5

Data bit 0. Referenced to V_CCB0

Data bit 1. Referenced to V_CCB0

Data bit 0. Referenced to V_CCB1

.

C5

D5

E5

I/O

Clock output. Referenced to V_CCB1

.

Output

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TXS02612

SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

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SIMPLIFIED INTERNAL STRUCTURE

V

CCBx

CCA

SPEED-UP

CIRCUITRY A-to-B

GATE

R

1

(see Note A)

2

(see Note A)

Bx-Port

A-Port

(Data or

Command)

SPEED-UP

CIRCUITRY B-to-A

Simplified Architecture of Command and Each Data Path

V

CCB0

V

CCB0

P-ch

N-ch

CLKA

CLK

TRANSLATOR

B0

GND

V

CCB1

V

CCB1

P-ch

N-ch

TRANSLATOR

CLK

B1

SEL

GND

Simplified Architecture of the Clock Path

A. R₁and R₂resistor values are determined based upon the logic level applied to the A port or B port, as follows:

R₁and R₂= 40 kΩ when a logic level low is applied to the A port or B port.

R₁and R₂= 4 kΩ when a logic level high is applied to the A port or B port.

R₁and R₂= 70 kΩ when the port is deselected.

4

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SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

FUNCTION TABLE

Clock Channel

SEL

L

CLKB0

Active

Low

CLKB1

OPERATION

CLKA to CLKB0

CLKA to CLKB1

Low

Active

H

Data and Command Channel

SEL

L

DATxB0 or CMDxB0

Active

DATxB1 or CMDxB1

Disabled, pulled to V_CCB1through 70 kΩ DATxA to DATxB0, CMDA to CMDB0

Active DATxA to DATxB1, CMDA to CMDB1

OPERATION

H

Disabled, pulled to V_CCB0through 70 kΩ

ABSOLUTE MAXIMUM RATINGS^{(1) (2)}

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

V_CCA

V_CCB0Supply voltage range⁽²⁾

V_CCB1

–0.5

4.6

V

A port, B0 port,

B1 port, control inputs

V_I

Input voltage range

–0.5

V_CCx+ 0.5

V

Voltage range applied to any output in the high-impedance or

power-off state

A port, B0 port,

B1 port

V_O

I_IK

Input clamp current

Output clamp current

V_I< 0

–50

mA

I_OK

I_CC

I_GND

T_stg

V_O< 0

/

Continuous current through V_CCA, V_CCB0, V_CCB1, or GND

Storage temperature range

±100

150

mA

°C

–65

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

PACKAGE THERMAL IMPEDANCE

PARAMETER

UNIT

RTW package

ZQS package

66

q_JA

Package thermal impedance

°C/W

171.6

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TXS02612

SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

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RECOMMENDED OPERATING CONDITIONS

(1)

V_CCA

V_CCBx

MIN

MAX

UNIT

V_CCA

V_CCB0Supply voltage

V_CCB1

1.1

3.6

V

A-port I/Os

B-port I/Os

SEL, CLKA

A-port I/Os

B-port I/Os

SEL, CLKA

V_CCI– 0.2

V_CCI

V_IH

High-level input voltage

1.1 V to 3.6 V

V_CCI– 0.2

V_CCI

V

V_CCA× 0.65 V

3.6

0

0.15

V_IL

Low-level input voltage

0.15

V_CCA× 0.35

Δt/Δv Input transition rise or fall rate CLK, SEL

T_AOperating free-air temperature

(1) V_CCBxrefers to V_CCB0and V_CCB1

10

85

ns/V

°C

–40

.

ELECTRICAL CHARACTERISTICS

over recommended operating free-air temperature range (unless otherwise noted)

T_A= 25°C

TYP

T_A= –40°C to 85°C

PARAMETER

TEST CONDITIONS

V_CCA

V_CCBx

UNIT

MIN

0.74

MAX

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

V_CCA× 0.67

V_OHA

(DATA &

CMD)

I_OH= –20 mA,

V_IBx≥ V_CCBx– 0.2 V

V

I_OL= 135 mA, V_IBx≤ 0.15 V

I_OL= 180 mA, V_IBx≤ 0.15 V

I_OL= 220 mA, V_IBx≤ 0.15 V

I_OL= 300 mA, V_IBx≤ 0.15 V

I_OL= 620 mA, V_IBx≤ 0.15 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

0.35

0.45

0.55

0.70

V_OLA

(DATA &

CMD)

V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

0.74

V_CCBx× 0.67

0.74

V_OHB

(DATA &

CMD)

I_OH= –20 mA,

V_IAx≥ V_CCAx– 0.2 V

I_OH= – 0.5 mA

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

I_OH= – 1 mA

1.05

V_OHCLKB

I_OH= – 2 mA

1.2

I_OH= – 4 mA

1.75

I_OH= – 8 mA

2.3

I_OL= 135 mA, V_IAx≤ 0.15 V

I_OL= 180 mA, V_IAx≤ 0.15 V

I_OL= 220 mA, V_IAx≤ 0.15 V

I_OL= 300 mA, V_IAx≤ 0.15 V

I_OL= 620 mA, V_IAx≤ 0.15 V

I_OL= 0.5 mA

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

0.35

0.45

0.55

0.70

0.35

0.45

0.55

0.7

V_OLB

(DATA &

CMD)

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

I_OL= 1 mA

V_OLCLKB

I_OL= 2 mA

I_OL= 4 mA

I_OL= 8 mA

6

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SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

ELECTRICAL CHARACTERISTICS (continued)

over recommended operating free-air temperature range (unless otherwise noted)

T_A= 25°C

T_A= –40°C to 85°C

MIN MAX

PARAMETER

TEST CONDITIONS

V_CCA

V_CCBx

UNIT

TYP

±1

SEL, CLKA

±2

I_I

1.1 V to 3.6 V

mA

DAT, CMD

±1

1.1 V to 3.6 V

3.6 V

1.1 V to 3.6 V

0 V

12

V_I= V_O= Open, I_O= 0,

SEL, CLK = High or Low

I_CCA

12

mA

0 V

3.6 V

–1

1.1 V to 3.6 V

3.6 V

1.1 V to 3.6 V

0 V

24

I_CCB0or

I_CCB1

V_I= V_O= Open, I_O= 0,

SEL, CLK = High or Low

–12

24

0 V

3.6 V

C_i

SEL, CLKA

A port

3.3 V

2.5

7

3.5

7.5

10

pF

C_io

3.3 V

B port

9.5

TIMING REQUIREMENTS

T_A= 25°C, V_CCA= 1.2 V

V_CCB= 1.2 V V_CCB= 1.5 V V_CCB= 1.8 V

V_CCB= 2.5 V

TYP

V_CCB= 3.3 V

TYP

UNIT

TYP

60

2

TYP

80

2

TYP

120

2

Push-pull driving

Command

120

2

120

2

Mbps

MHz

Open-drain driving

Push-pull driving

Data

rate

Clock

Data

30

60

17

40

80

13

60

120

8

60

120

8

120 Mbps

8

Push-pull

CLK

driving

Open-drain

CMD

500

ns

Pulse

duration

t_w

driving

Data

CMD

17

13

8

Push-pull

driving

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TXS02612

SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

www.ti.com

TIMING REQUIREMENTS

over recommended operating free-air temperature range, V_CCA= 1.5 V ± 0.1 V (unless otherwise noted)

V_CCB= 1.5 V

± 0.1 V

V_CCB= 1.8 V

± 0.15 V

V_CCB= 2.5 V

± 0.2 V

V_CCB= 3.3 V

± 0.3 V

V_CCB= 1.2 V

UNIT

TYP

MIN MAX

Push-pull driving

Open-drain driving

Push-pull driving

60

2

80

120

2

Command

Mbps

MHz

2

Data

rate

Clock

Data

30

60

17

40

60

80

120

8

120

8

120 Mbps

Push-pull

CLK

13

8

driving

Open-drain

CMD

500

Pulse

duration

t_w

ns

driving

Data

CMD

17

13

8

Push-pull

driving

TIMING REQUIREMENTS

over recommended operating free-air temperature range, V_CCA= 1.8 V ± 0.15 V (unless otherwise noted)

V_CCB= 1.5 V

± 0.1 V

V_CCB= 1.8 V

± 0.15 V

V_CCB= 2.5 V

± 0.2 V

V_CCB= 3.3 V

± 0.3 V

V_CCB= 1.2 V

UNIT

TYP

MIN MAX

Push-pull driving

Open-drain driving

Push-pull driving

60

2

80

120

2

Command

Mbps

MHz

2

Data

rate

Clock

Data

30

60

17

40

60

80

120

8

120

120 Mbps

Push-pull

CLK

13

8

driving

Open-drain

CMD

500

Pulse

duration

t_w

ns

driving

Data

CMD

17

13

8

Push-pull

driving

8

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SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

TIMING REQUIREMENTS

over recommended operating free-air temperature range, V_CCA= 2.5 V ± 0.2 V (unless otherwise noted)

V_CCB= 1.5 V

± 0.1 V

V_CCB= 1.8 V

± 0.15 V

V_CCB= 2.5 V

± 0.2 V

V_CCB= 3.3 V

± 0.3 V

V_CCB= 1.2 V

UNIT

TYP

MIN MAX

Push-pull driving

Open-drain driving

Push-pull driving

60

2

80

120

2

Command

Mbps

MHz

2

Data

rate

Clock

Data

30

60

17

40

60

80

120

8

120

8

120 Mbps

Push-pull

CLK

13

8

driving

Open-drain

CMD

500

Pulse

duration

t_w

ns

driving

Data

CMD

17

13

8

Push-pull

driving

TIMING REQUIREMENTS

over recommended operating free-air temperature range, V_CCA= 3.3 V ± 0.3 V (unless otherwise noted)

V_CCB= 1.5 V

± 0.1 V

V_CCB= 1.8 V

± 0.15 V

V_CCB= 2.5 V

± 0.2 V

V_CCB= 3.3 V

± 0.3 V

V_CCB= 1.2 V

UNIT

TYP

MIN MAX

Push-pull driving

Open-drain driving

Push-pull driving

60

2

80

120

2

Command

Mbps

MHz

2

Data

rate

Clock

Data

30

60

17

40

60

80

120

8

120

8

120 Mbps

Push-pull

CLK

13

8

driving

Open-drain

CMD

500

Pulse

duration

t_w

ns

driving

Data

CMD

17

13

8

Push-pull

driving

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TXS02612

SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

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SWITCHING CHARACTERISTICS

T_A= 25°C, V_CCA= 1.2 V

V_CCB= 1.2 V

TYP

5.9

V_CCB= 1.5 V

TYP

4.8

V_CCB= 1.8 V

TYP

4.4

V_CCB= 2.5 V

TYP

4

V_CCB= 3.3 V

FROM

(INPUT) (OUTPUT)

TO

TEST

CONDITIONS

PARAMETER

UNIT

TYP

4.46

140

4

Push-pull driving

Open-drain driving

Push-pull driving

Open-drain driving

Push-pull driving

CMDA

CMDB

CMDA

238

5.6

214

4.8

192

4.4

159

4.1

227

5.5

201

4.1

176

3.6

137

3.2

114

3

t_PD

ns

CLKA

DATA

DATB

SEL

CLKB

DATB

DATA

B-Port

5.8

4.8

4.4

4.2

6.8

4

Push-pull driving

5.6

4.8

4.4

4.1

Push-pull driving

13

11

10

9.4

9.1

5.7

1.5

1.3

2.6

1.5

1

t_rA

t_rB

t_fA

t_fB

A-port rise time

B-port rise time

4.8

5.1

5.3

6.1

3.8

2.9

1.9

CLKA

CLKB

A-port fall time

B-port fall time

5.2

3.4

2.6

1.7

ns

3.4

2.8

2.6

4.2

3

2.3

1.7

CLKA

CLKB

ChA-to-ChB skew

ChB-to-ChA skew

3.1

2.1

1.6

1.2

0.4

0.3

0.4

1.7

0.3

t_sk(O)

ns

Channel-to-Clock

skew

1.68

1.5

Push-pull driving

Open-drain driving

Push-pull driving

60

2

80

2

120

2

120

2

120

2

Command

Mbps

Max data rate

Clock

Data

30

60

40

80

60

MHz

120

Mbps

10

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SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

SWITCHING CHARACTERISTICS

over operating free-air temperature range, V_CCA= 1.5 V ± 0.1 V (unless otherwise noted)

V_CCB= 1.2 V

V_CCB= 1.5 V

± 0.1 V

V_CCB= 1.8 V

± 0.15 V

V_CCB= 2.5 V

± 0.2 V

V_CCB= 3.3 V

± 0.3 V

FROM

(INPUT) (OUTPUT)

TO

TEST

CONDITIONS

PARAMETER

UNIT

TYP

5.1

MIN

MAX

MIN

MAX

MIN

MAX

MIN MAX

Push-pull driving

Open-drain driving

Push-pull driving

Open-drain driving

Push-pull driving

13

777

10.6

616

13.1

13

9

756

9.2

560

9.8

9

8

684

8.5

433

6

7.5

758

8.2

375

5.2

7.8

8.4

18

CMDA

CMDB

CMDA

210

4.5

200

4.7

t_PD

ns

CLKA

DATA

DATB

SEL

CLKB

DATB

DATA

B-Port

5.1

8

Push-pull driving

4.5

11

9.3

21

8.8

19

Push-pull driving

9.5

26

t_rA

t_rB

t_fA

t_fB

A-port rise time

B-port rise time

2.7

1.5

1.7

1

5.8

1.7

1.3

0.9

0.8

5.9

6.6

4.9

3.4

5.2

3.2

0.58

0.23

1.68

1.7

1

6

1.8

0.8

1.3

0.6

0.5

6.1

2.9

3.3

8.2

4.3

3.2

3.9

2.2

0.63

0.22

1.82

ns

CLKA

CLKB

A-port fall time

B-port fall time

5.2

6.4

0.9

0.6

0.5

2.5

2.4

3.9

3.3

3.7

1.1

0.9

6.3

3.2

CLKA

CLKB

ChA-to-ChB skew

ChB-to-ChA skew

3.1

4.1

1.9

0.32

0.27

1.47

0.47

0.24

1.66

0.63

0.22

1.77

t_sk(O)

ns

Channel-to-Clock

skew

Push-pull driving

Open-drain driving

Push-pull driving

60

2

80

2

120

2

120

2

120

2

Command

Mbps

Max data rate

Clock

Data

30

60

40

80

60

60 MHz

120

120 Mbps

Submit Documentation Feedback

11

TXS02612

SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

www.ti.com

SWITCHING CHARACTERISTICS

over operating free-air temperature range, V_CCA= 1.8 V ± 0.15 V (unless otherwise noted)

V_CCB= 1.2 V

V_CCB= 1.5 V

± 0.1 V

V_CCB= 1.8 V

± 0.15 V

V_CCB= 2.5 V

± 0.2 V

V_CCB= 3.3 V

± 0.3 V

FROM

(INPUT) (OUTPUT)

TO

TEST

CONDITIONS

PARAMETER

UNIT

TYP

4.8

183

4

MIN

MAX

MIN

MAX

MIN

MAX

MIN MAX

Push-pull driving

Open-drain driving

Push-pull driving

Open-drain driving

Push-pull driving

12

726

9

8

715

7

6

686

6.4

5.7

780

6

CMDA

CMDB

CMDA

175

4.5

4.7

4.1

8.2

2

565

13

563

9

441

5.4

392

4.5

5.8

6.3

14

t_PD

ns

CLKA

DATA

DATB

SEL

CLKB

DATB

DATA

B-Port

12

8.4

7.5

17

6

Push-pull driving

9

6.4

Push-pull driving

22

14.8

4.5

t_rA

t_rB

t_fA

t_fB

A-port rise time

B-port rise time

1.1

1.7

0.8

1

4

1.1

1.2

1.3

0.7

0.9

0.8

4.3

6.2

4.9

2.8

3.5

3.2

0.48

0.23

1.46

1.2

1

1.3

0.8

0.7

0.6

0.5

4.6

3.1

6.2

5.2

1.8

3.5

3.1

0.33

0.28

1.51

7.9

6.4

3.2

5.6

4.1

0.45

0.24

1.58

4.3

ns

CLKA

CLKB

A-port fall time

B-port fall time

0.9

0.7

0.6

0.5

3.2

2.5

1.7

2.6

1.9

3

CLKA

CLKB

ChA-to-ChB skew

ChB-to-ChA skew

0.9

2.2

1.9

0.53

0.23

1.56

0.67

0.22

1.48

t_sk(O)

ns

Channel-to-Clock

skew

Push-pull driving

Open-drain driving

Push-pull driving

60

2

80

2

120

2

120

2

120

2

Command

Mbps

Max data rate

Clock

Data

30

60

40

80

60

60 MHz

120

120 Mbps

12

Submit Documentation Feedback

TXS02612

www.ti.com

SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

SWITCHING CHARACTERISTICS

over operating free-air temperature range, V_CCA= 2.5 V ± 0.2 V (unless otherwise noted)

V_CCB= 1.2 V

V_CCB= 1.5 V

± 0.1 V

V_CCB= 1.8 V

± 0.15 V

V_CCB= 2.5 V

± 0.2 V

V_CCB= 3.3 V

± 0.3 V

FROM

(INPUT) (OUTPUT)

TO

TEST

CONDITIONS

PARAMETER

UNIT

TYP

4.4

143

3.8

137

4.1

4.4

7

MIN

MAX

MIN

MAX

MIN

MAX

MIN MAX

Push-pull driving

Open-drain driving

Push-pull driving

Open-drain driving

Push-pull driving

11

544

7.6

434

12

7.4

596

5.5

444

8

4.4

605

4.2

3.8

669

3.7

372

3.8

3.7

9

CMDA

CMDB

CMDA

414

4.8

t_PD

ns

CLKA

DATA

DATB

SEL

CLKB

DATB

DATA

B-Port

11

7

4.5

Push-pull driving

8

5.5

13

4.1

Push-pull driving

18

10.5

2.6

t_rA

t_rB

t_fA

t_fB

A-port rise time

B-port rise time

1.4

6.3

5.2

1.1

3.6

3.1

0.41

2.11

0.75

1.91

1.67

0.58

1.04

0.92

2.2

7.7

6.4

1.9

5.4

4.2

0.43

0.24

1.47

0.74

1.34

1.27

0.58

0.87

0.79

2.2

6.1

4.9

2

1.06

0.95

0.9

0.7

0.83

0.76

0.57

0.49

2.8

3.2

4.2

ns

CLKA

CLKB

A-port fall time

B-port fall time

3.2

2.6

0.61

0.66

0.56

1.9

4.3

3.2

0.39

0.2

1.3

3.4

3

CLKA

CLKB

ChA-to-ChB skew

ChB-to-ChA skew

2.2

1.9

0.59

0.19

1.25

0.68

0.18

1.21

t_sk(O)

ns

Channel-to-Clock

skew

Push-pull driving

Open-drain driving

Push-pull driving

60

2

80

2

120

2

120

2

120

2

Command

Mbps

Max data rate

Clock

Data

30

60

40

80

60

60 MHz

120

120 Mbps

Submit Documentation Feedback

13

TXS02612

SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

www.ti.com

SWITCHING CHARACTERISTICS

over operating free-air temperature range, V_CCA= 3.3 V ± 0.3 V (unless otherwise noted)

V_CCB= 1.2 V

V_CCB= 1.5 V

± 0.1 V

V_CCB= 1.8 V

± 0.15 V

V_CCB= 2.5 V

± 0.2 V

V_CCB= 3.3 V

± 0.3 V

FROM

(INPUT) (OUTPUT)

TO

TEST

CONDITIONS

PARAMETER

UNIT

TYP

4.4

116

4.2

112

4.1

4.3

7.9

6.4

1.1

6.2

5.2

1

MIN

MAX

MIN

MAX

MIN

MAX

MIN MAX

Push-pull driving

Open-drain driving

Push-pull driving

Open-drain driving

Push-pull driving

11

432

7.5

349

12

7

477

5.4

4.1

506

3.8

347

4.4

4

3.3

533

3

CMDA

CMDB

CMDA

363

7.8

324

3.5

3.8

3

t_PD

ns

CLKA

DATA

DATB

SEL

CLKB

DATB

DATA

B-Port

11

6.8

Push-pull driving

7.8

16

5.4

3.4

8.8

1.7

4.2

3.3

1.6

3.2

2.2

0.57

0.19

1.22

Push-pull driving

11.5

1.8

7.6

t_rA

t_rB

t_fA

t_fB

A-port rise time

B-port rise time

0.57

1.96

1.67

0.53

0.95

0.92

1.7

7.7

6.4

1.6

5.2

4.1

0.36

0.3

1.61

0.57

1.43

1.26

0.52

0.8

0.56

0.95

0.91

0.53

0.63

0.56

0.53

0.71

0.76

0.56

0.58

0.49

1.8

3.1

6.1

ns

CLKA

CLKB

A-port fall time

B-port fall time

4.9

2.5

1.6

3.4

3.1

0.39

0.45

1.7

4.1

2.9

CLKA

CLKB

ChA-to-ChB skew

ChB-to-ChA skew

0.79

3.2

1.9

0.39

0.19

1.34

0.65

0.18

1.14

t_sk(O)

ns

Channel-to-Clock

skew

Push-pull driving

Open-drain driving

Push-pull driving

60

2

80

2

120

2

120

2

120

2

Command

Mbps

Max data rate

Clock

Data

30

60

40

80

60

60 MHz

120

120 Mbps

OPERATING CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

V_CCA

1.2 V

1.5 V 1.8 V

V_CCB

2.5 V 3.3 V

PARAMETER

TEST CONDITIONS

UNIT

1.2 V

TYP

14.5

20.7

23.2

14.1

0.1

1.5 V 1.8 V

TYP

12.9

20.7

23.4

12.2

0.1

TYP

12.1

21

TYP

13.4

22

TYP

15

A-port input, B-port output

B-port input, A-port output

A-port input, B-port output

B-port input, A-port output

A-port input, B-port output

C_pdA

C_L= 0, f = 10 MHz,

t_r= t_r= 1 ns,

OE = outputs enabled

23.2

25.5

14.4

0.1

Data

and

CMD

23.6

11.5

0.1

24.5

12.9

0.1

pF

C_pdB

OE = outputs disabled

C_pdA

C_pdB

C_L= 0, f = 10 MHz,

t_r= t_r= 1 ns,

OE = outputs enabled

0.4

0.5

0.7

Clock

B-port input, A-port output

14

13.9

13.8

13.7

14

Submit Documentation Feedback

TXS02612

www.ti.com

SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

POWER-UP CONSIDERATIONS

The following power-up sequence for this TXS02612 SDIO port expander with voltage-level translator should be

followed to ensure proper operation and to avoid any unnecessary excessive supply current, bus contention,

oscillations, or other anomalies caused by improperly biased device pins. The following power-up sequence

should be used to safe-guard against these problems:

1. Connect the ground pin of the device first before any power-supply voltage is applied.

2. Connect and power up V_CCA, which internally powers up the SEL control logic of the TXS02612.

3. Depending on the port to be chosen, the SEL pin can be high or low. If SEL high is needed (i.e., A port to

B₁port), ramp the SEL pin with the V_CCApower supply. Otherwise, keep SEL Low.

4. Apply V_CCB0and V_CCB1only after the V_CCApower supply is applied.

Submit Documentation Feedback

15

TXS02612

SCES682C –DECEMBER 2008–REVISED FEBRUARY 2009

www.ti.com

PARAMETER MEASUREMENT INFORMATION

V

CCI

V

CCO

V

CCI

V

CCO

DUT

IN

OUT

1 MΩ

15 pF

DATA RATE, PULSE DURATION, PROPAGATION DELAY,

OUTPUT RISE AND FALL TIME MEASUREMENT USING

AN OPEN-DRAIN DRIVER

DATA RATE, PULSE DURATION, PROPAGATION DELAY,ENABLE/DISABLE

OUTPUT RISE AND FALL TIME MEASUREMENT USING

A PUSH-PULL DRIVER

t

w

V

CCI

V

CCI

/2

V

CCI

/2

Input

0 V

VOLTAGE WAVEFORMS

PULSE DURATION

V

CCA

Output

Control

V

CCI

V /2

CCA

V /2

CCA

V /2

CCO

Input

V /2

CCO

(low-level

enabling)

0 V

V

0 V

t

PLH

PHL

t

PLZ

PZL

Output

Waveform 1

V

OH

CCO

0.8 x V

CCO

V

/2

CCO

Output

V

/2

V

CCI

/2

CCI

CMD and DATA

(see Note B)

0.2 x V

0.2 x

V

CCO

V

OL

V

OL

t

r

f

VOLTAGE WAVEFORMS

PROPAGATION DELAY TIMES

ENABLE AND DISABLE TIMES

NOTES:

A.

C

L

includes probe and jig capacitance.

B. Waveform 1 is for an output with internal conditions such that the output is lo,wexcept when disabled by the output control.

Waveform

C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50Ω, dv/dt≥ 1 V/ns.

O

D. The outputs are measured one at a time, with one transition per measurement.

E.

F.

t

and t

P HZ dis

and t

are the same as t .

P LZ

P ZL

P LH

are the same as t .

en

P ZH

G.

H.

I.

and t are the same as t .

P HL pd

V

is the V

associated with the input port.

CC

CCI

is the V

associated with the output port.

CC

CCO

J. All parameters and waveforms are not applicable to all devices.

Figure 1. Load Circuit and Voltage Waveforms

16

Submit Documentation Feedback

PACKAGE OPTION ADDENDUM

www.ti.com

4-Feb-2010

PACKAGING INFORMATION

Orderable Device

TXS02612RTWR

TXS02612ZQSR

Status ⁽¹⁾

ACTIVE

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

QFN

RTW

24

3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR

no Sb/Br)

BGA MI

CROSTA

R JUNI

OR

ZQS

24

2500 Green (RoHS &

no Sb/Br)

SNAGCU

Level-1-260C-UNLIM

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

4-Feb-2010

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

A0

B0

K0

P1

W

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TXS02612ZQSR

BGA MI

CROSTA

R JUNI

OR

ZQS

24

2500

330.0

12.4

3.3

1.6

8.0

12.0

Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

4-Feb-2010

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

340.5 338.1 20.6

TXS02612ZQSR

BGA MICROSTAR

JUNIOR

ZQS

24

2500

Pack Materials-Page 2

IMPORTANT NOTICE

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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard

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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265


型号：	TXS02612_10
厂家：	TEXAS INSTRUMENTS
描述：	SDIO PORT EXANDER WITH VOLTAGE-LEVEL TRANSLATION 与电压电平转换SDIO端口EXANDER
文件：	总24页 (文件大小：600K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TXS02612_10 [TI]

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