TXU0104PWR [TI]

四通道单向电平转换器 | PW | 14 | -40 to 125;


型号：	TXU0104PWR
厂家：	TEXAS INSTRUMENTS
描述：	四通道单向电平转换器 \| PW \| 14 \| -40 to 125 转换器电平转换器
文件：	总44页 (文件大小：2709K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TXU0104

ZHCSNW3A –MAY 2021 –REVISED SEPTEMBER 2021

具有施密特触发输入和三态输出的TXU0104 4 位定向电压电平转换器

1 特性

2 应用

• 完全可配置的双电源轨设计可允许各个端口在1.1V

至5.5V 范围内运行

• 在3.3V 至5.0V 范围内，支持最高200Mbps 的速

率

• 消除缓慢或嘈杂输入信号

• 驱动指示LED 或蜂鸣器

• 机械开关去抖

• 通用I/O 电平转换

• 推挽电平转换（UART、SPI、JTAG 等等）

• 施密特触发输入可实现慢速和高噪声输入

• 带集成静态下拉电阻器的输入阻止通道流动

• 高驱动强度（在5V 时最高12mA）

• 低功耗

3 说明

TXU0104 是一款 4 位双电源同相定向电压电平转换器

件。Ax 引脚以 V_CCA逻辑电平为基准，OE 引脚可以

– 最大值2.5µA (25°C)

_CCA或 V_CCB逻辑电平为基准，Bx 引脚以 V_CCB逻辑

– 最大值6µA（-40°C 至125°C）

• V_CC隔离和V_CC断开(I_off-float) 特性

电平为基准。A 端口能够接受 1.1V 至 5.5V 的输入电

压，而 B 端口也可接受 1.1V 至 5.5V 的输入电压。如

果 OE 相对于任一电源设为高电平，可能会发生从 A

到 B 或从 B 到 A 的定向数据传输。OE 设为低电平

时，所有输出引脚均处于高阻抗状态。请参阅器件功能

模式，简要了解控制逻辑运行。

– 如果任何一个V_CC输入低于100mV 或已断开，

则所有输出均禁用且处于高阻抗状态

• I_off支持局部断电模式运行

• 带有V_CC(MIN)电路的控制逻辑(OE) 允许从端口A

或B 进行控制

• 引脚排列兼容TXB 系列电平转换器

• 在支持常见应用的其他型号中可用：TXU0204、

TXU0304

• 工作温度范围为–40°C 至+125°C

• 闩锁性能超过100mA，符合JESD 78 II 类规范

• ESD 保护性能超过JESD 22 规范要求

器件信息⁽¹⁾

封装尺寸（标称值）

器件型号

TXU0104BQA

TXU0104PW

TXU0104RUT

TXU0104DTR

封装

VQFN (14)

TSSOP (14)

UQFN (12)

X2SON (12)

3.00mm × 2.50mm

5.00mm × 4.40mm

2.00mm × 1.70mm

1.70 mm × 1.00 mm

– 2500V 人体放电模型

– 1500V 充电器件模型

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

V_CC(MIN)

V_CCA

V_CCB

B1Y

B2Y

B3Y

B4Y

GND

TXU0104 功能方框图

本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问

www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。

English Data Sheet: SCES937

TXU0104

www.ti.com.cn

ZHCSNW3A –MAY 2021 –REVISED SEPTEMBER 2021

Table of Contents

9 Detailed Description......................................................20

9.1 Overview...................................................................20

9.2 Functional Block Diagram.........................................20

9.3 Feature Description...................................................21

9.4 Device Functional Modes..........................................23

10 Application and Implementation................................24

10.1 Application Information........................................... 24

10.2 Typical Application.................................................. 24

11 Power Supply Recommendations..............................25

12 Layout...........................................................................25

12.1 Layout Guidelines................................................... 25

12.2 Layout Example...................................................... 26

13 Device and Documentation Support..........................27

13.1 Device Support....................................................... 27

13.2 Documentation Support.......................................... 27

13.3 接收文档更新通知................................................... 27

13.4 支持资源..................................................................27

13.5 Trademarks.............................................................27

13.6 Electrostatic Discharge Caution..............................27

13.7 术语表..................................................................... 27

14 Mechanical, Packaging, and Orderable

1 特性................................................................................... 1

2 应用................................................................................... 1

3 说明................................................................................... 1

4 Revision History.............................................................. 2

5 Related Products.............................................................3

6 Pin Configuration and Functions—TXU0104 ...............4

7 Specifications.................................................................. 5

7.1 Absolute Maximum Ratings ....................................... 5

7.2 ESD Ratings .............................................................. 5

7.3 Recommended Operating Conditions ........................6

7.4 Thermal Information ...................................................6

7.5 Electrical Characteristics ............................................7

7.6 Switching Characteristics: T_sk, T_MAX..........................9

7.7 Switching Characteristics, V_CCA= 1.2 ± 0.1 V.......... 10

7.8 Switching Characteristics, V_CCA= 1.5 ± 0.1 V.......... 11

7.9 Switching Characteristics, V_CCA= 1.8 ± 0.15 V........ 12

7.10 Switching Characteristics, V_CCA= 2.5 ± 0.2 V........ 13

7.11 Switching Characteristics, V_CCA= 3.3 ± 0.3 V........ 14

7.12 Switching Characteristics, V_CCA= 5.0 ± 0.5 V........ 15

7.13 Operating Characteristics....................................... 16

7.14 Typical Characteristics............................................17

8 Parameter Measurement Information..........................18

8.1 Load Circuit and Voltage Waveforms........................18

Information.................................................................... 27

4 Revision History

注：以前版本的页码可能与当前版本的页码不同

Changes from Revision * (May 2021) to Revision A (September 2021)

Page

• 将TXU0104BQA、TXU0104RUT 和TXU0104DTR 的状态从产品预发布更改为量产数据............................. 1

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ZHCSNW3A –MAY 2021 –REVISED SEPTEMBER 2021

5 Related Products

TXU0x04 4-Bit

Unidirectional

Voltage-Level

Translators

TXU0x04 are 4-bit, dual-supply noninverting fixed direction voltage level translators. These

devices are compatible to the TXB0104 with the same pinout allowing for a drop in

replacement. The OE pin can be referenced to either V_CCAor V_CCBlogic levels allowing for

one of the TXU0x04 devices to be used for fixed direction, high drive applications which the

TXB0104 is not recommended to support.

TXU0204

TXU0204 is a 4-bit, dual-supply noninverting fixed direction voltage level translators with 2

channels in the opposing direction commonly used for GPIO, UART, and JTAG translation.

V_CC(MIN)

V_CCA

V_CCB

B1Y

B2Y

A3Y

A4Y

GND

图5-1. TXU0204 Functional Block Diagram

TXU0304

TXU0304 is a 4-bit, dual-supply noninverting fixed direction voltage level translators with 1

channel in the opposing direction commonly used for GPIO, SPI, and I2S translation.

V_CC(MIN)

V_CCA

V_CCB

B1Y

B2Y

B3Y

A4Y

GND

图5-2. TXU0304 Functional Block Diagram

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ZHCSNW3A –MAY 2021 –REVISED SEPTEMBER 2021

6 Pin Configuration and Functions—TXU0104

V_CCA

V_CCB

B1Y

B2Y

B3Y

B4Y

B1Y

B2Y

B3Y

B4Y

Thermal

Pad

GND

图6-1. PW 14-Pin TSSOP Top View

图6-2. BQA Package 14-Pin VQFN Transparent Top

View

V_CCA

11 V_CCB

V_CCA

11 V_CCB

B1Y

B2Y

B3Y

B4Y

B2Y

B3Y

B4Y

GND

图6-4. DTR Package 12-Pin X2SON Transparent

图6-3. RUT Package 12-Pin UQFN Transparent Top

Top View

View

表6-1. TXU0104 Pin Functions

I/O

DESCRIPTION

Name

PW, BQA

RUT, DTR

Input A1. Referenced to V_CCA

Input A2. Referenced to V_CCA

Input A3. Referenced to V_CCA

Input A4. Referenced to V_CCA

B1Y

B2Y

B3Y

B4Y

GND

—

Output B1. Referenced to V_CCB

Output B2. Referenced to V_CCB

Output B3. Referenced to V_CCB

Output B4. Referenced to V_CCB

Ground

6, 9

No internal connection.

Output Enable. Pull to GND to place all outputs in high-impedance mode. Pull

to V_CCAor V_CCBto enable all outputs.

V_CCA

V_CCB

PAD

A-port supply voltage. 1.1 V ≤V_CCA≤5.5 V

—

B-port supply voltage. 1.1 V ≤V_CCB≤5.5 V

Thermal pad. May be grounded (recommended) or left floating.

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

–0.5

–20

MAX UNIT

V_CCA

V_CCB

Supply voltage A

Supply voltage B

6.5

I/O Ports (A Port)

I/O Ports (B Port)

6.5

V_I

Input Voltage⁽²⁾

6.5

A Port

6.5

Voltage applied to any output in the high-impedance or power-off

state⁽²⁾

V_O

B Port

6.5

A Port

V_CCA+ 0.5

V_CCB+ 0.5

Voltage applied to any output in the high or low state^{(2) (3)}

B Port

I_IK

I_OK

I_O

Input clamp current

V_I< 0

Output clamp current

V_O< 0

–20

Continuous output current

Continuous current through V_CCor GND

Junction Temperature

25 mA

100 mA

150 °C

–25

–100

T_j

T_stg

Storage temperature

–65

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure beyond the limits listed in Recommended Operating Conditions. may affect device

reliability.

(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.

(3) The output positive-voltage rating may be exceeded up to 6.5 V maximum if the output current rating is observed.

7.2 ESD Ratings

VALUE

±2500

±1500

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

V_(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC specification JESD22-C101⁽²⁾

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

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MAX UNIT

ZHCSNW3A –MAY 2021 –REVISED SEPTEMBER 2021

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted) ^{(1) (2) (3)}

MIN

1.08

V_CCA

V_CCB

Supply voltage A

Supply voltage B

5.5

V_CCO= 1.1 V

V_CCO= 1.4 V

V_CCO= 1.65 V

V_CCO= 2.3 V

V_CCO= 3 V

–1.5

–3

–4.5

–8

–10

–12

1.5

I_OH

High-level output current

V_CCO= 4.5 V

V_CCO= 1.1 V

V_CCO= 1.4 V

V_CCO= 1.65 V

V_CCO= 2.3 V

V_CCO= 3 V

4.5

I_OL

Low-level output current

Input voltage ⁽³⁾

V_CCO= 4.5 V

V_I

5.5

Active State

Tri-State

Operating free-air temperature

V_CCO

5.5

V_O

T_A

Output voltage

125 °C

–40

(1) V_CCIis the V_CCassociated with the input port.

(2) V_CCOis the V_CCassociated with the output port.

(3) All control inputs and data I/Os of this device have weak pulldowns to ensure the line is not floating when undefined external to the

device. The input leakage from these weak pulldowns is defined by the I_Ispecification indicated under Electrical Characteristics.

7.4 Thermal Information

TXU0104

THERMAL METRIC⁽¹⁾

PW (TSSOP)

14 PINS

BQA (WQFN)

14 PINS

RUT (UQFN)

12 PINS

DTR (X2SON)

12 PINS

UNIT

Junction-to-ambient thermal

resistance

R_θJA

R_θJC(top)

R_θJB

Y_JT

135.8

65.0

78.8

15.6

78.2

N/A

87.2

90.0

56.0

9.8

171.9

100.4

97.1

10.9

95.5

N/A

176.6

84.1

99.1

2.6

°C/W

Junction-to-case (top) thermal

resistance

Junction-to-board thermal

resistance

Junction-to-top characterization

parameter

Junction-to-board characterization

parameter

Y_JB

56.0

33.0

98.9

N/A

R_θ

Junction-to-case (bottom) thermal

resistance

JC(bottom)

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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ZHCSNW3A –MAY 2021 –REVISED SEPTEMBER 2021

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)^{(1) (2)}

Operating free-air temperature (T_A)

PARAMETER

TEST CONDITIONS

V_CCA

V_CCB

25°C

MIN TYP MAX MIN TYP MAX MIN TYP MAX

UNIT

–40°C to 85°C

–40°C to 125°C

1.1 V

0.44

0.60

0.76

1.08

1.48

2.19

2.65

0.44

0.60

0.76

1.08

1.48

2.19

2.65

0.17

0.28

0.35

0.56

0.89

1.51

1.88

0.17

0.28

0.35

0.56

0.89

1.51

1.88

0.2

0.88 0.44

0.98 0.60

1.13 0.76

1.56 1.08

1.92 1.48

2.74 2.19

3.33 2.65

0.88 0.44

0.98 0.60

1.13 0.76

1.56 1.08

1.92 1.48

2.74 2.19

3.33 2.65

0.48 0.17

0.59 0.28

0.69 0.35

0.97 0.56

1.5 0.89

0.88

0.98

1.13

1.56

1.92

2.74

3.33

0.88

0.98

1.13

1.56

1.92

2.74

3.33

0.48

0.59

0.69

0.97

1.5

1.4 V

1.65 V

2.3 V

3 V

1.4 V

1.65 V

2.3 V

3 V

Data Inputs

(Ax, Bx)

(Referenced to V_CCI

)

4.5 V

5.5 V

1.1 V

1.4 V

1.65 V

4.5 V

5.5 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

Positive-

going input-

threshold

voltage

V_T+

(Referenced to V_CCA2.3 V

or V_CCB)

3 V

4.5 V

5.5 V

1.1 V

1.4 V

4.5 V

5.5 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.65 V

Data Inputs

(Ax, Bx)

(Referenced to V_CCI

2.3 V

3 V

)

4.5 V

5.5 V

1.1 V

1.4 V

1.65 V

4.5 V

5.5 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.97 1.51

2.4 1.88

1.97

2.4

Negative-

going input-

threshold

voltage

V_T-

0.48 0.17

0.59 0.28

0.69 0.35

0.97 0.56

1.5 0.89

0.48

0.59

0.69

0.97

1.5

(Referenced to V_CCA2.3 V

or V_CCB)

3 V

4.5 V

5.5 V

1.1 V

1.4 V

4.5 V

5.5 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.97 1.51

2.46 1.88

1.97

2.46

0.4

0.2

0.25

0.3

0.5 0.25

0.5

1.65 V

0.55

0.3

0.65 0.38

0.72 0.46

0.93 0.58

1.06 0.69

0.41 0.15

0.55

0.65

0.72

0.93

1.06

0.41

0.5

Data Inputs

(Ax, Bx)

(Referenced to V_CCI

2.3 V

3 V

0.38

0.46

0.58

0.69

0.15

0.2

)

4.5 V

5.5 V

1.1 V

1.4 V

1.65 V

4.5 V

5.5 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

Input-

threshold

hysteresis

(V_T+–V_T-)

ΔV_T

0.5

0.2

0.23

0.32

0.39

0.57

0.69

0.55 0.23

0.65 0.32

0.72 0.39

0.97 0.57

1.18 0.69

0.55

0.65

0.72

0.97

1.18

(Referenced to V_CCA2.3 V

or V_CCB)

3 V

4.5 V

5.5 V

4.5 V

5.5 V

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7.5 Electrical Characteristics (continued)

over operating free-air temperature range (unless otherwise noted)^{(1) (2)}

Operating free-air temperature (T_A)

25°C

MIN TYP MAX MIN TYP MAX MIN TYP MAX

PARAMETER

TEST CONDITIONS

V_CCA

V_CCB

UNIT

–40°C to 85°C

–40°C to 125°C

V_CCO

–

0.1

V_CCO

–

0.1

1.1V –

5.5V

1.1V –

5.5V

I_OH= –0.1 mA

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

0.82

I_OH= –0.5 mA

I_OH= –3 mA

I_OH= –4.5 mA

I_OH= –8 mA

I_OH= –10 mA

I_OH= –12 mA

High-level

output

V_OH

voltage ⁽³⁾

1.2

1.7

2.2

3.7

1.2

1.7

2.2

3.7

4.5 V

1.1V –

5.5V

1.1V –

5.5V

I_OL= 0.1 mA

0.1

I_OL= 0.5 mA

I_OL= 3 mA

I_OL= 4.5 mA

I_OL= 8 mA

I_OL= 10 mA

I_OL= 8 mA

I_OL= 12 mA

1.1 V

1.4 V

1.65 V

2.3 V

3 V

1.1 V

1.4 V

1.65 V

2.3 V

3 V

0.27

0.35

0.45

0.7

0.27

0.35

0.45

0.7

Low-level

output

V_OL

voltage ⁽⁴⁾

0.8

4.5 V

0.55

0.8

0.55

0.8

1.1V –

5.5V

1.1V –

5.5V

-0.1

1.5 -0.1

µA

V_I= V_CCor GND

Input leakage

current

I_I

Data Inputs

(Ax, Bx)

V_I= V_CCIor GND

1.1V –

5.5V

1.1V –

5.5V

1.5

–0.1

–2

A Port or B Port

V_Ior V_O= 0 V - 5.5

0 V

0 V - 5.5 V

1.5

2.5

–1.5

–2

–2.5

Partial power

down current

I_off

µA

0 V - 5.5 V 0 V

Floating⁽⁵⁾

0 V - 5.5 V

Floating

supply Partial A Port or B Port

power down V_Ior V_O= GND

current

I_off-float

0 V - 5.5 V Floating⁽⁵⁾

1.5

2.5

–1.5

–2

–2.5

A or B Port:

Tri-state

V_I= V_CCIor GND

1.1V –

5.5V

1.1V –

5.5V

I_OZ

0.3

1.5

µA

–0.3

–1

–2

output current V_O= V_CCOor GND

OE = GND

1.1V –

5.5V

1.1V –

5.5V

2.5

V_I= V_CCIor GND

I_O= 0

0 V

5.5 V

0 V

–0.3

–1

V_CCAsupply

current

I_CCA

5.5 V

1.5

V_I= GND

I_O= 0

5.5 V

Floating⁽⁵⁾

1.5

1.1V –

5.5V

1.1V –

5.5V

1.5

2.5

1.5

V_I= V_CCIor GND

I_O= 0

0 V

5.5 V

0 V

V_CCBsupply

current

I_CCB

µA

5.5 V

–0.3

–1

V_I= GND

I_O= 0

Floating⁽⁵⁾

5.5 V

1.5

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7.5 Electrical Characteristics (continued)

over operating free-air temperature range (unless otherwise noted)^{(1) (2)}

Operating free-air temperature (T_A)

PARAMETER

TEST CONDITIONS

V_CCA

V_CCB

25°C

MIN TYP MAX MIN TYP MAX MIN TYP MAX

UNIT

–40°C to 85°C

–40°C to 125°C

Combined

supply

current

I_CCA

I_CCB

V_I= V_CCIor GND

I_O= 0

1.1V –

5.5V

1.1V –

5.5V

2.5

µA

Control Input

Capacitance

C_i

V_I= 3.3 V or GND

3.3 V

2.75

3.5

OE = GND, V_O

Data I/O

Capacitance

C_io

1.65V DC +1 MHz

-16 dBm sine wave

(1) V_CCIis the V_CCassociated with the input port

(2) V_CCOis the V_CCassociated with the output port

(3) Tested at V_I= V_T+(MAX)

(4) Tested at V_I= V_T-(MIN)

(5) Floating is defined as a node that is both not actively driven by an external device and has leakage not exeeding 10nA

7.6 Switching Characteristics: T_sk, T_MAX

over operating free-air temperature range (unless otherwise noted)

Operating free-air

temperature (T_A)

PARAMETER

TEST CONDITIONS

V_CCI

V_CCO

UNIT

-40°C to 125°C

MIN TYP MAX

3.0 V - 3.6 V

1.65 V - 1.95 V

1.1 V - 1.3 V

1.65 V - 1.95 V

1.1 V - 1.3 V

4.5 V - 5.5 V

3.0 V - 3.6 V

1.65 V - 1.95 V

3.0 V - 3.6 V

1.65 V - 1.95 V

1.1 V - 1.3 V

1.65 V - 1.95 V

1.1 V - 1.3 V

4.5 V - 5.5 V

3.0 V - 3.6 V

1.65 V - 1.95 V

4.5 V - 5.5 V

3.0 V - 3.6 V

1.65 V - 1.95 V

3.0 V - 3.6 V

1.65 V - 1.95 V

1.1 V - 1.3 V

1.65 V - 1.95 V

1.1 V - 1.3 V

4.5 V - 5.5 V

3.0 V - 3.6 V

1.65 V - 1.95 V

3.0 V - 3.6 V

1.65 V - 1.95 V

1.1 V - 1.3 V

1.65 V - 1.95 V

1.1 V - 1.3 V

200

150

100

125

Up Translation

Down Translation

Up Translation

Down Translation

50% Duty Cycle

Input

One channel

switching

20% of pulse >

0.7*V_CCO

T_MAX- Maximum

Data Rate

Mbps

20% of pulse <

0.3*V_CCO

Timing skew

between any

switching outputs on

the rising or falling

edge

t_sk- Output skew

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ZHCSNW3A –MAY 2021 –REVISED SEPTEMBER 2021

7.7 Switching Characteristics, V_CCA= 1.2 ± 0.1 V

See 图8-1 and 表8-1 for test circuit and loading. See 图8-2, 图8-3, and 图8-4 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

Test

Conditions

PARAMETER

FROM

1.2 ± 0.1 V

1.5 ± 0.1 V

1.8 ± 0.15 V

2.5 ± 0.2 V

3.3 ± 0.3 V

5.0 ± 0.5 V

UNIT

MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

3.3

5.7

96 0.5

60 3.0

43 0.5

39 1.4

37 0.5

33 0.5

32 0.5

28 0.5

70 0.5

45 1.5

137 28.4

131 45.4

104 22.1

104 36.5

232 21.7

173 32.0

130 8.2

97 14.5

30 0.5

27 0.5

69 0.5

44 1.3

143 18.7

134 31.8

112 20.1

107 33.8

235 22.7

177 34.2

130 8.4

97 14.8

Propagation

delay

t_pd

t_dis

t_en

3.3

95 1.9

80 0.5

75 0.5

5.7

60 4.1

51 2.9

48 1.8

28.8

133 28.5

133 43.3

150 27.6

149 43.2

237 22.1

156 33.3

237 14.3

143 23.0

130 28.4

130 43.7

117 25.8

120 40.8

229 21.4

167 32.0

152 11.2

116 18.6

133 28.8

130 44.7

110 22.5

113 36.8

230 21.3

169 31.7

140 8.8

107 15.4

211

140

181

111

244

187

132

103

-40°C to 125°C 43.3

-40°C to 85°C 32.5

-40°C to 125°C 48.3

-40°C to 85°C 24.1

-40°C to 125°C 34.9

-40°C to 85°C 21.3

-40°C to 125°C 29.8

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7.8 Switching Characteristics, V_CCA= 1.5 ± 0.1 V

See 图8-1 and 表8-1 for test circuit and loading. See 图8-2, 图8-3, and 图8-4 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

Test

Conditions

PARAMETER

FROM

1.2 ± 0.1 V

1.5 ± 0.1 V

1.8 ± 0.15 V

2.5 ± 0.2 V

3.3 ± 0.3 V

5.0 ± 0.5 V

UNIT

MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

1.9

4.1

80 0.5

51 1.6

43 0.5

39 1.6

91 19.0

95 32.6

127 21.7

130 36.7

102 14.4

102 25.2

175 12.7

135 21.0

31 0.5

82 18.8

86 32.8

91 19.9

95 34.7

86 13.5

89 24.1

80 9.1

81 16.8

25 0.5

28 0.5

81 19.2

85 33.4

82 16.3

86 30.2

88 12.7

91 22.8

69 6.1

71 12.5

19 0.5

20 0.5

26 0.5

82 19.6

87 34.2

71 15.9

75 29.8

90 12.6

93 22.8

57 4.9

60 10.8

17 0.5

18 0.5

25 0.5

83 12.2

88 24.6

71 13.7

75 26.6

92 13.2

96 23.5

53 4.5

56 10.4

100

Propagation

delay

t_pd

t_dis

t_en

0.5

3.0

20.0

-40°C to 125°C 34.9

-40°C to 85°C 27.4

-40°C to 125°C 44.4

-40°C to 85°C 14.9

-40°C to 125°C 25.5

-40°C to 85°C 17.9

-40°C to 125°C 26.6

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7.9 Switching Characteristics, V_CCA= 1.8 ± 0.15 V

See 图8-1 and 表8-1 for test circuit and loading. See 图8-2, 图8-3, and 图8-4 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

Test

Conditions

PARAMETER

FROM

1.2 ± 0.1 V

1.5 ± 0.1 V

1.8 ± 0.15 V

2.5 ± 0.2 V

3.3 ± 0.3 V

5.0 ± 0.5 V

UNIT

MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

0.5

2.9

75 0.5

48 0.5

37 0.5

33 0.5

79 14.7

83 28.0

121 18.7

123 34.0

88 9.5

87 19.0

177 10.4

135 18.7

28 0.5

25 0.5

67 14.5

71 26.6

81 16.5

86 30.3

66 9.4

69 18.9

75 8.1

77 15.5

22 0.5

23 0.5

22 0.5

23 0.5

65 14.3

69 27.5

71 12.8

76 26.2

63 8.6

67 17.6

58 4.9

60 11.0

17 0.5

19 0.5

20 0.5

65 14.4

70 27.2

60 12.5

64 25.3

65 8.2

68 17.1

46 3.3

49 8.7

14 0.5

15 0.5

19 0.5

66 8.5

71 20.0

58 9.8

62 21.8

66 8.1

70 17.1

42 2.2

44 7.3

Propagation

delay

t_pd

t_dis

t_en

0.5

1.4

17.2

-40°C to 125°C 30.9

-40°C to 85°C 25.4

-40°C to 125°C 41.7

-40°C to 85°C 10.9

-40°C to 125°C 20.3

-40°C to 85°C 16.7

-40°C to 125°C 25.1

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7.10 Switching Characteristics, V_CCA= 2.5 ± 0.2 V

See 图8-1 and 表8-1 for test circuit and loading. See 图8-2, 图8-3, and 图8-4 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

Test

Conditions

PARAMETER

FROM

1.2 ± 0.1 V

1.5 ± 0.1 V

1.8 ± 0.15 V

2.5 ± 0.2 V

3.3 ± 0.3 V

5.0 ± 0.5 V

UNIT

MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

0.5

1.8

70 0.5

45 0.5

32 0.5

28 0.5

65 10.5

68 21.8

112 16.5

115 30.9

80 5.9

74 13.5

183 9.2

139 17.2

26 0.5

19 0.5

20 0.5

51 9.0

55 19.7

74 14.0

79 27.1

50 5.1

53 12.4

74 6.0

76 13.0

20 0.5

17 0.5

51 8.1

50 18.2

61 9.0

66 21.6

44 4.7

47 12.0

54 4.0

57 9.8

14 0.5

43 8.4

47 18.6

46 9.1

51 20.5

39 4.4

42 11.5

36 2.1

38 7.1

12 0.5

13 0.5

44 5.0

48 15.0

44 6.4

48 16.8

40 3.7

43 10.8

31 0.5

33 4.7

Propagation

delay

t_pd

t_dis

t_en

0.5

12.9

-40°C to 125°C 24.9

-40°C to 85°C 23.2

-40°C to 125°C 38.7

-40°C to 85°C 7.9

-40°C to 125°C 15.6

-40°C to 85°C 16.3

-40°C to 125°C 24.4

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7.11 Switching Characteristics, V_CCA= 3.3 ± 0.3 V

See 图8-1 and 表8-1 for test circuit and loading. See 图8-2, 图8-3, and 图8-4 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

Test

Conditions

PARAMETER

FROM

1.2 ± 0.1 V

1.5 ± 0.1 V

1.8 ± 0.15 V

2.5 ± 0.2 V

3.3 ± 0.3 V

5.0 ± 0.5 V

UNIT

MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

0.5

1.5

69 0.5

44 0.5

30 0.5

27 0.5

62 10.1

65 20.6

109 15.7

111 29.5

85 4.2

72 10.9

192 8.9

144 16.7

25 0.5

17 0.5

18 0.5

47 8.7

51 18.4

71 13.2

75 25.4

45 3.0

47 9.3

76 5.4

78 12.2

19 0.5

14 0.5

15 0.5

42 6.9

46 15.7

59 8.5

63 19.2

37 2.4

40 8.2

55 2.6

57 8.0

13 0.5

12 0.5

39 6.6

40 15.3

42 7.6

46 18.5

31 2.2

33 8.1

34 1.8

36 6.6

11 0.5

39 6.9

39 15.9

38 4.7

42 14.2

30 1.7

32 7.5

27 0.5

29 3.7

Propagation

delay

t_pd

t_dis

t_en

0.5

12.9

-40°C to 125°C 24.0

-40°C to 85°C 22.7

-40°C to 125°C 37.6

-40°C to 85°C 6.6

-40°C to 125°C 13.6

-40°C to 85°C 16.3

-40°C to 125°C 24.3

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7.12 Switching Characteristics, V_CCA= 5.0 ± 0.5 V

See 图8-1 and 表8-1 for test circuit and loading. See 图8-2, 图8-3, and 图8-4 for measurement waveforms.

B-Port Supply Voltage (V_CCB

)

Test

Conditions

PARAMETER

FROM

1.2 ± 0.1 V

1.5 ± 0.1 V

1.8 ± 0.15 V

2.5 ± 0.2 V

3.3 ± 0.3 V

5.0 ± 0.5 V

UNIT

MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

-40°C to 125°C

-40°C to 85°C

0.5

1.3

69 0.5

44 0.5

31 0.5

26 0.5

58 7.7

61 17.0

109 5.9

111 29.2

102 2.8

81 8.8

212 8.8

158 16.7

24 0.5

15 0.5

16 0.5

42 5.9

46 14.5

69 13.2

73 24.6

44 1.2

46 6.5

82 4.8

83 11.7

18 0.5

19 0.5

12 0.5

13 0.5

36 4.2

40 11.8

56 8.4

60 18.1

33 0.5

36 4.7

58 1.6

60 6.9

13 0.5

10 0.5

11 0.5

Propagation

delay

t_pd

t_dis

t_en

0.5

10 0.5

31 3.4

33 10.4

40 6.9

43 16.4

25 0.5

27 4.2

35 0.5

37 4.7

10.8

30 2.8

31 9.6

36 3.7

39 12.2

22 0.5

24 4.4

26 0.5

28 3.5

-40°C to 125°C 20.8

-40°C to 85°C 9.7

-40°C to 125°C 37.4

-40°C to 85°C 6.0

-40°C to 125°C 12.4

-40°C to 85°C 16.7

-40°C to 125°C 24.8

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7.13 Operating Characteristics

T_A= 25℃⁽¹⁾

Supply Voltage (V_CCB= V_CCA

)

PARAMETER

Test Conditions 1.2 ± 0.1V 1.5 ± 0.1V 1.8 ± 0.15V 2.5 ± 0.2V 3.3 ± 0.3V 5.0 ± 0.5V UNIT

TYP

A to B: outputs enabled

A to B: outputs disabled

B to A: outputs enabled

B to A: outputs disabled

A to B: outputs enabled

A to B: outputs disabled

B to A: outputs enabled

B to A: outputs disabled

A Port

CL = 0, RL = Open

f = 10 MHz

(2)

C_pdA

t_rise= t_fall= 1 ns

B Port

CL = 0, RL = Open

f = 10 MHz

(3)

C_pdB

t_rise= t_fall= 1 ns

(1) See the CMOS Power Consumption and C_pdCalculation application report for additional information about how power dissipation

capacitance affects power consumption.

(2) A-Port power dissipation capacitance per transceiver.

(3) B-Port power dissipation capacitance per transceiver.

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7.14 Typical Characteristics

4.75

4.5

4.25

1.95

1.8

1.65

1.5

3.75

3.5

3.25

V_CC= 5.0V

V_CC= 3.3V

V_CC= 2.5V

1.35

1.2

2.75

2.5

2.25

1.05

0.9

V_CC= 1.8V

V_CC= 1.5V

V_CC= 1.2V

1.75

1.5

0.75

0.8

1.6

2.4

3.2

4.8

5.6

6.4

7.2

I_OH- Output High Current (mA)

图7-1. Typical (T_A=25°C) Output High Voltage (V_OH) vs Source

Current (I_OH

图7-2. Typical (T_A=25°C) Output High Voltage (V_OH) vs Source

Current (I_OH

)

0.35

0.325

0.3

0.35

0.325

0.3

V_CC= 2.5V

V_CC= 3.3V

V_CC= 5.0V

V_CC= 1.2V

V_CC= 1.5V

V_CC= 1.8V

0.275

0.25

0.225

0.2

0.275

0.25

0.225

0.2

0.175

0.15

0.125

0.1

0.175

0.15

0.125

0.1

0.075

0.05

0.025

0.075

0.05

0.025

0.8

1.6

2.4

3.2

4.8

5.6

6.4

7.2

I_OL- Output Low Current (mA)

图7-3. Typical (T_A=25°C) Output Low Voltage (V_OL) vs Sink

Current (I_OL

图7-4. Typical (T_A=25°C) Output Low Voltage (V_OL) vs Sink

Current (I_OL

)

0.22

0.2

1.8

1.6

1.4

1.2

V_CC= 1.2 V

V_CC= 1.5 V

V_CC= 1.8 V

V_CC= 2.5 V

V_CC= 3.3 V

V_CC= 5 V

0.18

0.16

0.14

0.12

0.1

0.8

0.6

0.4

0.2

0.08

0.06

0.04

0.02

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

0.5

1.5

2.5

3.5

4.5

V_IN- Input Voltage (V)

图7-6. Typical (T_A=25°C) Supply Current (I_CC) vs Input Voltage

(V_IN

图7-5. Typical (T_A=25°C) Supply Current (I_CC) vs Input Voltage

(V_IN

)

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8 Parameter Measurement Information

8.1 Load Circuit and Voltage Waveforms

Unless otherwise noted, generators supply all input pulses that have the following characteristics:

• f = 1 MHz

• Z_O= 50 Ω

• Δt/ΔV ≤1 ns/V

Measurement Point

2 x V_CCO

R_L

Output Pin

Under Test

Open

(1)

GND

C_L

R_L

A. C_Lincludes probe and jig capacitance.

图8-1. Load Circuit

表8-1. Load Circuit Conditions

Parameter

V_CCO

R_L

C_L

S₁

V_TP

N/A

t_pd

Propagation (delay) time

5 pF

Open

1.1 V –5.5 V

1.1 V –1.6 V

1.65 V –2.7 V

3.0 V –5.5 V

1.1 V –1.6 V

1.65 V –2.7 V

3.0 V –5.5 V

10 kΩ

2 × V_CCO

GND

0.1 V

0.15 V

0.3 V

0.1 V

0.15 V

0.3 V

t_en, t_disEnable time, disable time

GND

(1)

V_CCI

(1)

V_CCI

100 kHz

Input A, B

V_CCI/ 2

Input A, B

500 ps/V œ 1 s/V

0 V

V_OH

(2)

V_OH

t_pd

(2)

Ensure Monotonic

Rising and Falling Edge

Output B, A

(2)

V_OL

Output B, A

V_CCI/ 2

(2)

V_OL

1. V_CCIis the supply pin associated with the input port.

2. V_OHand V_OLare typical output voltage levels that occur

with specified R_L, C_L, and S₁

1. V_CCIis the supply pin associated with the input port.

2. V_OHand V_OLare typical output voltage levels that occur

with specified R_L, C_L, and S₁

图8-3. Input Transition Rise and Fall Rate

图8-2. Propagation Delay

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V_CCA

V_CCA/ 2

GND

t_dis

t_en

(3)

V_CCO

Output⁽¹⁾

V_CCO/ 2

V_OL+ V_TP

(4)

V_OL

(4)

V_OH

V_OH- V_TP

Output⁽²⁾

V_CCO/ 2

GND

A. 1. Output waveform on the condition that input is driven to a valid Logic Low.

2. Output waveform on the condition that input is driven to a valid Logic High.

3. V_CCOis the supply pin associated with the output port.

4. V_OHand V_OLare typical output voltage levels with specified R_L, C_L, and S₁.

图8-4. Enable Time And Disable Time

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9 Detailed Description

9.1 Overview

The TXU0104 is a 4-bit translating transceiver that uses two individually configurable power-supply rails. The

device is operational with V_CCAand V_CCBsupplies as low as 1.1 V and as high as 5.5 V. Additionally, the device

can be operated with V_CCA= V_CCB. The A port is designed to track V_CCA, and the B port is designed to track

V_CCB

The TXU0104 device is designed for asynchronous communication between data buses, and transmits data with

fixed direction from the A bus to the B bus on some channels and from the B bus to the A bus on the remaining

channels. The output-enable input (OE) is used to disable the outputs so the buses are effectively isolated. The

output-enable pin of the TXU0104 (OE) can be referenced to either V_CCAor V_CCB. The OE pin can be left floating

or externally pulled down to ground to ensure the high-impedance state of the level shifter outputs during power

up or power down.

This device is fully specified for partial-power-down applications using the I_offcurrent. The I_offprotection circuitry

ensures that no excessive current is drawn from or sourced into an input or output while the device is powered

down.

The VCC isolation or VCC disconnect feature ensures that if either VCC is less than 100 mV or disconnected

with the complementary supply within recommended operating conditions, outputs are disabled and set to the

high-impedance state while the supply current is maintained. The I_off-floatcircuitry ensures that no excessive

current is drawn from or sourced into an input or output while the supply is floating.

Glitch-free power supply sequencing allows either supply rail to be powered on or off in any order while providing

robust power sequencing performance.

9.2 Functional Block Diagram

V_CC(MIN)

V_CCA

V_CCB

B1Y

B2Y

B3Y

B4Y

GND

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9.3 Feature Description

9.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns

Standard CMOS inputs are high impedance and are typically modeled as a resistor in parallel with the input

capacitance given in the Electrical Characteristics. The worst case resistance is calculated with the maximum

input voltage, given in the Absolute Maximum Ratings, and the maximum input leakage current, given in the

Electrical Characteristics, using ohm's law (R = V ÷ I).

The Schmitt-trigger input architecture provides hysteresis as defined by ΔV_Tin the Electrical Characteristics,

which makes this device extremely tolerant to slow or noisy inputs. Driving the inputs slowly will increase

dynamic current consumption of the device. See Understanding Schmitt Triggers for additional information

regarding Schmitt-trigger inputs.

9.3.1.1 Inputs with Integrated Static Pull-Down Resistors

This device has 5 MΩ typical integrated weak pull-downs for each input. This feature allows all inputs to be left

floating without the concern for unstable outputs or increased current consumption. This also helps to reduce

external component count for applications where not all channels are used or need to be fixed low. If an external

pull-up is required, it should be no larger than 1 MΩto avoid contention with the 5 MΩinternal pull-down.

9.3.2 Control Logic (OE) with V_CC(MIN)Circuitry

The output-enable input (OE) is used to disable the outputs so the buses are effectively isolated. The output-

enable pin of the TXU0x04 has V_CC(MIN)circuitry, which allows the OE pin to operate with the lower supply

voltage. The Over-Voltage Tolerant Inputs feature allows the OE pin to operate with the higher supply voltage.

This combination means that the enable pin can be referenced to either V_CCAor V_CCBsupply. Multiple

permutations of each device are possible since the controller can be placed on either the A or B port and can still

control the enable pin.

9.3.3 Balanced High-Drive CMOS Push-Pull Outputs

A balanced output allows the device to sink and source similar currents. The high drive capability of this device

creates fast edges into light loads, so routing and load conditions should be considered to prevent ringing.

Additionally, the outputs of this device are capable of driving larger currents than the device can sustain without

being damaged. Absolute Maximum Ratings defines the electrical and thermal limits that must be followed at all

times.

9.3.4 Partial Power Down (I_off)

The inputs and outputs for this device enter a high-impedance state when the device is powered down, inhibiting

current backflow into the device. The I_offin the Electrical Characteristics specifies the maximum leakage into or

out of any input or output pin on the device.

9.3.5 VCC Isolation and V_CCDisconnect

The outputs for this device are disabled and enter a high-impedance state when either supply is <100 mV or left

floating (disconnected), with the complementary supply within recommended operating conditions. It is

recommended that the inputs are kept low before floating (disconnecting) either supply.

The I_{CCx(floating)}in the Electrical Characteristics specifies the maximum supply current. The I_off(float)in the

Electrical Characteristics specifies the maximum leakage into or out of any input or output pin on the device.

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V_CCA

V_CCB

Supply disconnected

I_CCBmaintained

V_CC(MIN)

V_CCA

V_CCB

Hi-Z

B1Y

Disabled

I_off(float)

GND

图9-1. V_CCDisconnect Feature

9.3.6 Over-Voltage Tolerant Inputs

Input signals to this device can be driven above the supply voltage so long as they remain below the maximum

input voltage value specified in the Recommended Operating Conditions.

9.3.7 Glitch-Free Power Supply Sequencing

Either supply rail may be powered on or off in any order without producing a glitch on the inputs or outputs (that

is, where the output erroneously transitions to VCC when it should be held low or vice versa). Glitches of this

nature can be misinterpreted by a peripheral as a valid data bit, which could trigger a false device reset of the

peripheral, a false device configuration of the peripheral, or even a false data initialization by the peripheral.

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9.3.8 Negative Clamping Diodes

图9-2 depicts the inputs and outputs to this device that have negative clamping diodes.

CAUTION

Voltages beyond the values specified in the Absoulte Maximum Ratings table can cause damage to

the device. The input negative-voltage and output voltage ratings may be exceeded if the input and

output clamp-current ratings are observed.

V_CCAV_CCB

Device

Input or I/O

configured

as input

Level

Shifter

I/O configured

as output

-I_IK

-I_OK

GND

图9-2. Electrical Placement of Clamping Diodes for Each Input and Output

9.3.9 Fully Configurable Dual-Rail Design

The V_CCAand V_CCBpins can be supplied at any voltage from 1.1 V to 5.5 V, making the device suitable for

translating between any of the voltage nodes (1.2 V, 1.5 V, 1.8 V, 3.3 V, and 5.0 V).

9.3.10 Supports High-Speed Translation

The TXU0104 device can support high data-rate applications. The translated signal data rate can be up to 200

Mbps when the signal is translated from 3.3 V to 5.0 V.

9.4 Device Functional Modes

表9-1. Function Table

CONTROL INPUTS

Port Status

OPERATION

Input

Output

Unidirectional non-inverting

voltage translation

Unidirectional non-inverting

voltage translation

Hi-Z

Isolation

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10 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification, and TI

does not warrant its accuracy or completeness. TI’s customers are responsible for determining

suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

10.1 Application Information

The TXU0104 device can be used in level-translation applications for interfacing devices or systems operating at

different interface voltages with one another. The TXU0104 device is ideal for use in applications where a push-

pull driver is connected to the data Inputs. The max data rate can be up to 200 Mbps when device translates a

signal from 3.3 V to 5.0 V.

10.2 Typical Application

1.2 V

5.0 V

0.1 µF

System

Controller

V_CCA

V_CCB

GPIO1

GPIO2

GPIO3

GPIO4

GPIO5

B1Y

TXU0104

B2Y

B3Y

B4Y

GND

图10-1. TXU0104 LED Driver Application

10.2.1 Design Requirements

Use the parameters listed in 表10-1 for this design example.

表10-1. Design Parameters

DESIGN PARAMETERS

EXAMPLE VALUES

1.1 V to 5.5 V

Input voltage range

Output voltage range

1.1 V to 5.5 V

10.2.2 Detailed Design Procedure

To begin the design process, determine the following:

• Input voltage range

– Use the supply voltage of the device that is driving the TXU0104 device to determine the input voltage

range. For a valid logic-high, the value must exceed the positive-going input-threshold voltage (V_T+) of the

input port. For a valid logic low the value must be less than the negative-going input-threshold voltage

(V_T-) of the input port.

• Output voltage range

– Use the supply voltage of the device that the TXU0104 device is driving to determine the output voltage

range.

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10.2.3 Application Curve

图10-2. Up Translation at 1 MHz (1.2 V to 5 V)

11 Power Supply Recommendations

Always apply a ground reference to the GND pins first. This device is designed for glitch free power sequencing

without any supply sequencing requirements such as ramp order or ramp rate.

Glitch-Free Power Supply Sequencing describes how this device was designed with various power supply

sequencing methods in mind to help prevent unintended triggering of downstream devices.

12 Layout

12.1 Layout Guidelines

To ensure reliability of the device, following common printed-circuit board layout guidelines are recommended:

• Use bypass capacitors on the power supply pins and place them as close to the device as possible. A 0.1 µF

capacitor is recommended, but transient performance can be improved by having 1 µF and 0.1 µF capacitors

in parallel as bypass capacitors.

• The high drive capability of this device creates fast edges into light loads so routing and load conditions

should be considered to prevent ringing.

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12.2 Layout Example

Legend

Via to V_CCA

Via to V_CCB

Via to GND

Copper Traces

TXU0104DTR

01005

0.1µF

01005

0.1µF

V_CCA

V_CCB

A 1

B1Y

B2Y

B3Y

B4Y

8 mil

GND

图12-1. Layout Example –TXU0104

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13 Device and Documentation Support

13.1 Device Support

13.1.1 Regulatory Requirements

No statutory or regulatory requirements apply to this device.

There are no special characteristics for this product.

13.2 Documentation Support

13.2.1 Related Documentation

• Texas Instruments, Understanding Schmitt Triggers application report

• Texas Instruments, CMOS Power Consumption and C_pdCalculation application report

13.3 接收文档更新通知

要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新进行注册，即可每周接收产品信息更

改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

13.4 支持资源

TI E2E^™支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解

答或提出自己的问题可获得所需的快速设计帮助。

链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅

TI 的《使用条款》。

13.5 Trademarks

TI E2E^™is a trademark of Texas Instruments.

所有商标均为其各自所有者的财产。

13.6 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

13.7 术语表

TI 术语表

本术语表列出并解释了术语、首字母缩略词和定义。

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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重要声明和免责声明

TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没

有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。

这些资源可供使用TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可

将这些资源用于研发本资源所述的TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他TI 知识产权或任何第三方知

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TI 提供的产品受TI 的销售条款(https:www.ti.com/legal/termsofsale.html) 或ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI

提供这些资源并不会扩展或以其他方式更改TI 针对TI 产品发布的适用的担保或担保免责声明。重要声明

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

PACKAGE OPTION ADDENDUM

www.ti.com

5-Oct-2021

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TXU0104BQAR

TXU0104DTRR

TXU0104PWR

TXU0104RUTR

ACTIVE

WQFN

X2QFN

TSSOP

UQFN

BQA

DTR

3000 RoHS & Green

2000 RoHS & Green

3000 RoHS & Green

NIPDAU

Level-1-260C-UNLIM

-40 to 125

TX0104

NIPDAU

1KJ

TXU0104

1J4

RUT

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

5-Oct-2021

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TXU0104 :

Automotive : TXU0104-Q1

•

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

•

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

16-Jun-2023

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TXU0104BQAR

TXU0104DTRR

TXU0104PWR

TXU0104RUTR

WQFN

X2QFN

TSSOP

UQFN

BQA

DTR

3000

2000

3000

180.0

330.0

180.0

12.4

9.5

2.8

0.93

6.9

3.3

1.49

5.6

1.1

0.43

1.6

4.0

2.0

8.0

4.0

12.0

8.0

12.4

9.5

12.0

8.0

RUT

1.9

2.2

0.7

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

16-Jun-2023

TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TXU0104BQAR

TXU0104DTRR

TXU0104PWR

TXU0104RUTR

WQFN

X2QFN

TSSOP

UQFN

BQA

DTR

3000

2000

3000

210.0

189.0

356.0

189.0

185.0

356.0

185.0

35.0

36.0

35.0

36.0

RUT

Pack Materials-Page 2

GENERIC PACKAGE VIEW

BQA 14

2.5 x 3, 0.5 mm pitch

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

This image is a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4227145/A

www.ti.com

PACKAGE OUTLINE

WQFN - 0.8 mm max height

PLASTIC QUAD FLAT PACK-NO LEAD

BQA0014A

2.6

2.4

3.1

2.9

PIN 1 INDEX AREA

0.8

0.7

SEATING PLANE

0.08 C

0.05

0.00

1.1

0.9

(0.2) TYP

2X 0.5

8X 0.5

SYMM

1.6

1.4

0.3

14X

0.2

0.1

PIN 1 ID

(OPTIONAL)

C A B

0.5

0.3

SYMM

14X

0.05

4224636/A 11/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.

www.ti.com

EXAMPLE BOARD LAYOUT

WQFN - 0.8 mm max height

BQA0014A

PLASTIC QUAD FLAT PACK-NO LEAD

(2.3)

(1)

2X (0.5)

8X (0.5)

2X (0.5)

SYMM

(2)

(1.5) (2.8)

14X (0.25)

14X (0.6)

(Ø0.2) VIA

TYP

SYMM

(R0.05) TYP

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 20X

0.07 MAX

ALL AROUND

METAL UNDER

SOLDER MASK

0.07 MIN

ALL AROUND

METAL

EXPOSED METAL

SOLDER MASK

OPENING

SOLDER MASK

OPENING

EXPOSED METAL

NON-SOLDER MASK

SOLDER MASK

DEFINED

(PREFERRED)

4224636/A 11/2018

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271)

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

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EXAMPLE STENCIL DESIGN

WQFN - 0.8 mm max height

BQA0014A

PLASTIC QUAD FLAT PACK-NO LEAD

(2.3)

(0.95)

2X (0.5)

8X (0.5)

SYMM

(2)

(1.38) (2.8)

14X (0.25)

14X (0.6)

SYMM

(R0.05) TYP

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

EXPOSED PAD

88% PRINTED COVERAGE BY AREA

SCALE: 20X

4224636/A 11/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

PACKAGE OUTLINE

RUT0012A

UQFN - 0.55 mm max height

SCALE 6.800

PLASTIC QUAD FLATPACK - NO LEAD

1.8

1.6

0.6

0.4

PIN 1 INDEX AREA

0.25

(0.15)

0.15

2.1

1.9

PIN 1 ID

OPTIONAL TERMINAL & PIN 1 ID

0.55 MAX

SEATING PLANE

0.08 C

0.05

0.00

SYMM

(0.15) TYP

10X 0.4

SYMM

1.6

0.25

0.15

12X

PIN 1 ID

(OPTIONAL)

0.6

0.4

12X

0.1

C B A

0.05

4220310/A 11/2016

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

RUT0012A

UQFN - 0.55 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

SYMM

12X (0.7)

(R0.05) TYP

12X (0.2)

SYMM

(1.7)

8X (0.4)

(1.4)

LAND PATTERN EXAMPLE

SCALE:30X

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

METAL

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4220310/A 11/2016

NOTES: (continued)

3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).

www.ti.com

EXAMPLE STENCIL DESIGN

RUT0012A

UQFN - 0.55 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

SYMM

12X (0.7)

(R0.05) TYP

12X (0.2)

SYMM

(1.7)

8X (0.4)

(1.4)

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SCALE: 30X

4220310/A 11/2016

NOTES: (continued)

4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

PACKAGE OUTLINE

X2QFN - 0.4 mm max height

PLASTIC QUAD FLATPACK-NO LEAD

DTR0012A

1.1

0.9

1.8

1.6

PIN 1 ID

(0.127) TYP

0.4

0.3

SEATING PLANE

0.04

0.00

0.08 C

0.22

0.12

(0.127) TYP

(0.24) TYP

0.25

0.44

0.25

0.15

A B

0.1

0.15

0.05

(0.2) TYP

0.28

0.18

1.38

0.73

(0.2)

TYP

(0.2) TYP

PIN 1 ID

0.31

0.21

0.26

0.16

0.1

C A B

0.05

4226527/B 04/2021

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

www.ti.com

EXAMPLE BOARD LAYOUT

X2QFN - 0.4 mm max height

PLASTIC QUAD FLATPACK-NO LEAD

DTR0012A

(1.03)

(1)

(0.44)

PKG

(R0.05) TYP

4X (0.2)

(0.69)

(0.37)

(0.2) TYP

PKG

(1.7)

4X (0.23)

(0.2) TYP

4X (0.2)

4X (0.37)

4X (0.26)

4X (0.4)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 40X

0.05 MAX

ALL AROUND

0.05 MAX

ALL AROUND

SOLDER MASK

METAL

OPENING

METAL UNDER

SOLDER MASK

OPENING

EXPOSED METAL

SOLDER MASK

DEFINED

NON- SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

4226527/B 04/2021

NOTES: (continued)

3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).

4. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

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EXAMPLE STENCIL DESIGN

X2QFN - 0.4 mm max height

PLASTIC QUAD FLATPACK-NO LEAD

DTR0012A

(1.06)

(1.03)

(0.44)

PKG

(R0.05) TYP

4X (0.2)

(0.69)

(0.37)

(0.22) TYP

PKG

(1.73)

4X (0.23)

(0.22) TYP

4X (0.2)

4X (0.34)

4X (0.26)

4X (0.37)

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SCALE: 40X

4226527/B 04/2021

NOTES: (continued)

Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

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