TXU0204QWBQARQ1 [TI]
汽车四通道固定多向电平转换器 | BQA | 14 | -40 to 125;
| 型号： | TXU0204QWBQARQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 汽车四通道固定多向电平转换器 | BQA | 14 | -40 to 125 转换器 电平转换器 |
| 文件： | 总38页 (文件大小：2129K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TXU0204-Q1
ZHCSMY0B – APRIL 2021 – REVISED MARCH 2022
具有施密特触发输入和三态输出的 TXU0204-Q1 汽车类 4 位定向电压电平转换
器
1 特性
2 应用
•
•
•
符合面向汽车应用的 AEC-Q100 标准
•
•
•
•
•
消除缓慢或嘈杂输入信号
采用具有可润湿侧翼的 QFN (WBQA) 封装
完全可配置的双电源轨设计允许各个端口在 1.1V 至
5.5V 范围内运行
驱动指示 LED 或蜂鸣器
机械开关去抖
通用 I/O 电平转换
推挽电平转换（UART、SPI、JTAG 等等）
•
在 3.3V 至 5.0V 范围内，支持最高 200Mbps 的速
率
施密特触发输入可实现慢速和高噪声输入
带集成静态下拉电阻器的输入阻止通道流动
高驱动强度（在 5V 时最高 12mA）
低功耗
3 说明
•
•
•
•
TXU0204-Q1 是一款 4 位双电源同相定向电压电平转
换器件。Ax 引脚以 VCCA 逻辑电平为基准，OE 引脚可
以 VCCA 或 VCCB 逻辑电平为基准，Bx 引脚以 VCCB
逻
辑电平为基准。A 端口能够接受 1.1V 至 5.5V 的输入
电压，而 B 端口也可接受 1.1V 至 5.5V 的输入电压。
如果 OE 相对于任一电源设为高电平，可能会发生从 A
到 B 或从 B 到 A 的定向数据传输。OE 设为低电平
时，所有输出引脚均处于高阻抗状态。请参阅器件功能
模式，简要了解控制逻辑的运行。
– 最大值 3µA (25°C)
– 最大值 6µA（-40°C 至 125°C）
VCC 隔离和 VCC 断开 (Ioff-float) 特性
– 如果任何一个 VCC 输入低于 100mV 或已断开，
则所有输出均禁用且处于高阻抗状态
Ioff 支持局部断电模式运行
•
•
•
器件信息(1)
带有 VCC(MIN) 电路的控制逻辑 (OE) 允许从端口 A
或 B 进行控制
引脚排列兼容 TXB 系列电平转换器
在支持常见应用的其他型号中可用：TXU0104-
Q1、TXU0304-Q1
器件型号
封装
VQFN (14)
TSSOP (14)
封装尺寸（标称值）
3.00mm × 2.50mm
5.00mm × 4.40mm
•
•
TXU0204-Q1WBQA
TXU0204-Q1PW
•
•
•
工作温度范围为 –40°C 至 +125°C
闩锁性能超过 100mA，符合 JESD 78 II 类规范
ESD 保护性能超过 JESD 22 规范要求
– 2500V 人体放电模型
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
– 1500V 充电器件模型
VCC(MIN)
VCCA
VCCB
OE
B1Y
B2Y
B3
A1
A2
A3Y
A4Y
B4
GND
TXU0204-Q1 功能方框图
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SCES931
TXU0204-Q1
ZHCSMY0B – APRIL 2021 – REVISED MARCH 2022
www.ti.com.cn
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Related Products.............................................................3
6 Pin Configuration and Functions—TXU0204-Q1 .........4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings............................................................... 5
7.3 Recommended Operating Conditions.........................6
7.4 Thermal Information....................................................6
7.5 Electrical Characteristics.............................................7
7.6 Switching Characteristics: Tsk, TMAX ..........................9
7.7 Switching Characteristics, VCCA = 1.2 ± 0.1 V.......... 10
7.8 Switching Characteristics, VCCA = 1.5 ± 0.1 V.......... 11
7.9 Switching Characteristics, VCCA = 1.8 ± 0.15 V........ 12
7.10 Switching Characteristics, VCCA = 2.5 ± 0.2 V........ 13
7.11 Switching Characteristics, VCCA = 3.3 ± 0.3 V........ 14
7.12 Switching Characteristics, VCCA = 5.0 ± 0.5 V........ 15
7.13 Operating Characteristics....................................... 16
7.14 Typical Characteristics............................................17
8 Parameter Measurement Information..........................18
8.1 Load Circuit and Voltage Waveforms........................18
9 Detailed Description......................................................20
9.1 Overview...................................................................20
9.2 Functional Block Diagram.........................................20
9.3 Feature Description...................................................21
9.4 Device Functional Modes..........................................24
10 Application and Implementation................................25
10.1 Application Information........................................... 25
10.2 Typical Application.................................................. 25
11 Power Supply Recommendations..............................26
12 Layout...........................................................................27
12.1 Layout Guidelines................................................... 27
12.2 Layout Example...................................................... 27
13 Device and Documentation Support..........................28
13.1 Device Support....................................................... 28
13.2 Documentation Support.......................................... 28
13.3 接收文档更新通知................................................... 28
13.4 支持资源..................................................................28
13.5 Trademarks.............................................................28
13.6 Electrostatic Discharge Caution..............................28
13.7 术语表..................................................................... 28
14 Mechanical, Packaging, and Orderable
Information.................................................................... 28
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision A (May 2021) to Revision B (March 2022)
Page
•
添加了 WBQA 封装和支持信息...........................................................................................................................1
Changes from Revision * (April 2021) to Revision A (May 2021)
Page
•
将数据表状态从预告信息 更改为量产数据 .........................................................................................................1
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5 Related Products
TXU0x04-Q1
Automotive 4-
TXU0x04-Q1 are 4-bit, dual-supply noninverting fixed direction voltage level translators.
These devices are compatible to the TXB0104-Q1 with the same pinout allowing for a drop
Bit Unidirectional in replacement. The OE pin can be referenced to either VCCA or VCCB logic levels allowing
Voltage-Level
Translators
for one of the TXU0x04-Q1 devices to be used for fixed direction, high drive applications
which the TXB0104-Q1 is not recommended to support.
TXU0104-Q1
TXU0104-Q1 is a 4-bit, dual-supply noninverting fixed direction voltage level translators with
all 4 channels in the same direction commonly used for GPIO translation.
VCC(MIN)
VCCA
VCCB
OE
B1Y
B2Y
B3Y
B4Y
A1
A2
A3
A4
GND
图 5-1. TXU0104-Q1 Functional Block Diagram
TXU0304-Q1
TXU0304-Q1 is a 4-bit, dual-supply noninverting fixed direction voltage level translators with
1 channel in the opposing direction commonly used for GPIO, SPI, and I2S translation.
VCC(MIN)
VCCA
VCCB
OE
B1Y
B2Y
B3Y
B4
A1
A2
A3
A4Y
GND
图 5-2. TXU0304-Q1 Functional Block Diagram
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6 Pin Configuration and Functions—TXU0204-Q1
VCCA
14
13
12
11
10
9
1
2
3
4
5
6
7
VCCB
A1
B1Y
B2Y
B3
2
3
4
5
6
13
12
11
10
9
A1
A2
B1Y
B2Y
B3
A2
A3Y
A4Y
Thermal
Pad
A3Y
A4Y
NC
B4
B4
NC
NC
NC
8
OE
GND
图 6-1. PW Package, 14-Pin TSSOP Transparent
图 6-2. WBQA Package, 14-Pin VQFN Transparent
(Top View)
(Top View)
表 6-1. TXU0204-Q1 Pin Functions
PIN
TYPE(1)
DESCRIPTION
PW,
WBQA
NAME
A1
2
3
I
I
Input A1. Referenced to VCCA
Input A2. Referenced to VCCA
.
.
A2
A3Y
A4Y
B1Y
B2Y
B3
4
O
O
O
O
I
Output A3. Referenced to VCCA
Output A4. Referenced to VCCA
Output B1. Referenced to VCCB
Output B2. Referenced to VCCB
.
.
.
.
5
13
12
11
10
7
Input B3. Referenced to VCCB
Input B4. Referenced to VCCB
Ground
.
.
B4
I
GND
NC
—
—
6, 9
No internal connection.
Output Enable. Pull to GND to place all outputs in high-impedance mode. Pull to VCCA or VCCB to
enable all outputs.
OE
8
I
VCCA
VCCB
1
—
—
A-port supply voltage. 1.1 V ≤ VCCA ≤ 5.5 V
B-port supply voltage. 1.1 V ≤ VCCB ≤ 5.5 V
14
Thermal pad. May be left floating or grounded (recommended for best thermal and mechanical
integrity).
Thermal Pad
(1) I = inpu, O = output
—
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
–0.5
MAX UNIT
VCCA
VCCB
Supply voltage A
Supply voltage B
6.5
6.5
6.5
6.5
6.5
6.5
6.5
V
V
I/O Ports (A Port)
I/O Ports (B Port)
OE
VI
Input Voltage(2)
V
A Port
Voltage applied to any output in the high-impedance or power-off
state(2)
VO
VO
V
V
B Port
A Port
–0.5 VCCA + 0.5
–0.5 VCCB + 0.5
–20
Voltage applied to any output in the high or low state(2) (3)
B Port
IIK
IOK
IO
Input clamp current
VI < 0
mA
mA
Output clamp current
VO < 0
–20
Continuous output current
Continuous current through VCC or GND
Junction Temperature
–25
25 mA
100 mA
150 °C
150 °C
–100
Tj
Tstg
Storage temperature
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure beyond the limits listed in Recommended Operating Conditions. may affect device
reliability.
(2) The input voltage and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The output positive-voltage rating may be exceeded up to 6.5 V maximum if the output current rating is observed.
7.2 ESD Ratings
VALUE
±2500
±1500
UNIT
Human body model (HBM), per AEC Q100-002(1)
Charged device model (CDM), per AEC Q100-011
V(ESD)
Electrostatic discharge
V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification
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MAX UNIT
ZHCSMY0B – APRIL 2021 – REVISED MARCH 2022
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1) (2) (3)
MIN
1.08
1.08
VCCA
VCCB
Supply voltage A
Supply voltage B
5.5
5.5
–1.5
–3
V
V
VCCO = 1.1 V
VCCO = 1.4 V
VCCO = 1.65 V
VCCO = 2.3 V
VCCO = 3 V
–4.5
–8
IOH
High-level output current
mA
–10
–12
1.5
3
VCCO = 4.5 V
VCCO = 1.1 V
VCCO = 1.4 V
VCCO = 1.65 V
VCCO = 2.3 V
VCCO = 3 V
4.5
8
IOL
Low-level output current
Input voltage (3)
mA
10
VCCO = 4.5 V
12
VI
0
0
5.5
VCCO
5.5
V
V
Active State
Tri-State
Operating free-air temperature
VO
TA
Output voltage
0
–40
125 °C
(1) VCCI is the VCC associated with the input port.
(2) VCCO is the VCC associated with the output port.
(3) All control inputs and data I/Os of this device have weak pulldowns to ensure the line is not floating when undefined external to the
device. The input leakage from these weak pulldowns is defined by the II specification indicated under Electrical Characteristics.
7.4 Thermal Information
TXU0204
THERMAL METRIC(1)
PW (TSSOP)
14 PINS
BQA (WQFN)
14 PINS
RUT (UQFN)
12 PINS
DTR (X2SON)
12 PINS
UNIT
Junction-to-ambient thermal
resistance
RθJA
135.8
65.0
78.8
15.6
78.2
N/A
87.2
90.0
56.0
9.8
171.9
100.4
97.1
10.9
95.5
N/A
176.6
84.1
99.1
2.6
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal
resistance
RθJC(top)
RθJB
Junction-to-board thermal
resistance
Junction-to-top characterization
parameter
YJT
Junction-to-board characterization
parameter
YJB
56.0
33.0
98.9
N/A
Junction-to-case (bottom) thermal
resistance
RθJC(bottom)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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7.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)(1) (2)
Operating free-air temperature (TA)
25°C –40°C to 85°C –40°C to 125°C UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
PARAMETER
TEST CONDITIONS
VCCA
VCCB
1.1 V
1.1 V
0.44
0.60
0.76
1.08
1.48
2.19
2.65
0.44
0.60
0.76
1.08
1.48
2.19
2.65
0.17
0.28
0.35
0.56
0.89
1.51
1.88
0.17
0.28
0.35
0.56
0.89
1.51
1.88
0.2
0.88 0.44
0.98 0.60
1.13 0.76
1.56 1.08
1.92 1.48
2.74 2.19
3.33 2.65
0.88 0.44
0.98 0.60
1.13 0.76
1.56 1.08
1.92 1.48
2.74 2.19
3.33 2.65
0.48 0.17
0.59 0.28
0.69 0.35
0.97 0.56
1.5 0.89
0.88
0.98
1.13
1.56
1.92
2.74
3.33
0.88
0.98
1.13
1.56
1.92
2.74
3.33
0.48
0.59
0.69
0.97
1.5
1.4 V
1.65 V
2.3 V
3 V
1.4 V
1.65 V
2.3 V
3 V
Data Inputs
(Ax, Bx)
(Referenced to VCCI
V
V
V
V
V
V
)
4.5 V
5.5 V
1.1 V
1.4 V
1.65 V
4.5 V
5.5 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
Positive-
going input-
threshold
voltage
VT+
OE
(Referenced to VCCA 2.3 V
or VCCB)
3 V
4.5 V
5.5 V
1.1 V
1.4 V
4.5 V
5.5 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.65 V
Data Inputs
(Ax, Bx)
(Referenced to VCCI
2.3 V
3 V
)
4.5 V
5.5 V
1.1 V
1.4 V
1.65 V
4.5 V
5.5 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.97 1.51
2.4 1.88
1.97
2.4
Negative-
going input-
threshold
voltage
VT-
0.48 0.17
0.59 0.28
0.69 0.35
0.97 0.56
1.5 0.89
0.48
0.59
0.69
0.97
1.5
OE
(Referenced to VCCA 2.3 V
or VCCB)
3 V
4.5 V
5.5 V
1.1 V
1.4 V
4.5 V
5.5 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.97 1.51
2.46 1.88
1.97
2.46
0.4
0.4
0.2
0.25
0.3
0.5 0.25
0.5
1.65 V
0.55
0.3
0.65 0.38
0.72 0.46
0.93 0.58
1.06 0.69
0.41 0.15
0.55
0.65
0.72
0.93
1.06
0.41
0.5
Data Inputs
(Ax, Bx)
(Referenced to VCCI
2.3 V
3 V
0.38
0.46
0.58
0.69
0.15
0.2
)
4.5 V
5.5 V
1.1 V
1.4 V
1.65 V
4.5 V
5.5 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
Input-
threshold
hysteresis
(VT+ – VT-)
ΔVT
0.5
0.2
0.23
0.32
0.39
0.57
0.69
0.55 0.23
0.65 0.32
0.72 0.39
0.97 0.57
1.18 0.69
0.55
0.65
0.72
0.97
1.18
OE
(Referenced to VCCA 2.3 V
or VCCB)
3 V
4.5 V
5.5 V
4.5 V
5.5 V
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7.5 Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)(1) (2)
Operating free-air temperature (TA)
25°C –40°C to 85°C –40°C to 125°C UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
PARAMETER
TEST CONDITIONS
VCCA
VCCB
VCCO
– 0.1
VCCO
– 0.1
IOH = –0.1 mA
1.1V – 5.5V 1.1V – 5.5V
IOH = –0.5 mA
IOH = –3 mA
IOH = –4.5 mA
IOH = –8 mA
IOH = –10 mA
IOH = –12 mA
IOL = 0.1 mA
IOL = 0.5 mA
IOL = 3 mA
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
0.82
1
0.82
1
High-level
output
VOH
V
1.2
1.7
2.2
3.7
1.2
1.7
2.2
3.7
voltage (3)
4.5 V
4.5 V
1.1V – 5.5V 1.1V – 5.5V
0.1
0.27
0.35
0.45
0.7
0.1
0.27
0.35
0.45
0.7
1.1 V
1.4 V
1.65 V
2.3 V
3 V
1.1 V
1.4 V
1.65 V
2.3 V
3 V
Low-level
output
IOL = 4.5 mA
IOL = 8 mA
VOL
V
voltage (4)
IOL = 10 mA
IOL = 8 mA
0.8
0.8
4.5 V
4.5 V
4.5 V
4.5 V
0.55
0.8
0.55
0.8
IOL = 12 mA
OE
1.1V – 5.5V 1.1V – 5.5V
-0.1
1.5 -0.1
1.5 –0.1
1.5 -0.1
2
2
µA
µA
VI = VCC or GND
Input leakage
current
II
Data Inputs
(Ax, Bx)
1.1V – 5.5V 1.1V – 5.5V –0.1
1.5
–2
VI = VCCI or GND
A Port or B Port
VI or VO = 0 V - 5.5
V
0 V
0 V - 5.5 V
–1.5
–1.5
–1.5
1.5
1.5
1.5
–2
–2
–2
2
2
2
–2.5
–2.5
–2.5
2.5
2.5
2.5
Partial power
down current
Ioff
µA
µA
0 V - 5.5 V 0 V
Floating
Floating(5)
0 V - 5.5 V
supply Partial A Port or B Port
power down VI or VO = GND
current
Ioff-float
0 V - 5.5 V Floating(5)
–1.5
1.5
–2
2
–2.5
2.5
A or B Port:
Tri-state
VI = VCCI or GND
IOZ
1.1V – 5.5V 1.1V – 5.5V –0.3
1.1V – 5.5V 1.1V – 5.5V
0.3
1.5
–1
1
–2
2
6
µA
µA
output current VO = VCCO or GND
OE = GND
2.5
VI = VCCI or GND
IO = 0
0 V
5.5 V
0 V
–0.3
–0.3
–1
–1
–1
–1
VCCA supply
current
ICCA
5.5 V
1
1.5
7
3
VI = GND
IO = 0
5.5 V
Floating(5)
1.5
15
1.1V – 5.5V 1.1V – 5.5V
1.5
1
2.5
1.5
6
3
VI = VCCI or GND
IO = 0
0 V
5.5 V
0 V
VCCB supply
current
ICCB
µA
5.5 V
VI = GND
IO = 0
Floating(5)
5.5 V
1.5
2.5
7
3
15
6
Combined
supply
current
ICCA
ICCB
+
VI = VCCI or GND
IO = 0
1.1V – 5.5V 1.1V – 5.5V
µA
pF
Control Input
Capacitance
Ci
VI = 3.3 V or GND
3.3 V
3.3 V
2.75
3
3.5
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7.5 Electrical Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)(1) (2)
Operating free-air temperature (TA)
25°C –40°C to 85°C –40°C to 125°C UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX
PARAMETER
TEST CONDITIONS
VCCA
VCCB
OE = GND, VO
1.65V DC +1 MHz
-16 dBm sine wave
=
Data I/O
Capacitance
Cio
3.3 V
3.3 V
3
4
4
pF
(1) VCCI is the VCC associated with the input port
(2) VCCO is the VCC associated with the output port
(3) Tested at VI = VT+(MAX)
(4) Tested at VI = VT-(MIN)
(5) Floating is defined as a node that is both not actively driven by an external device and has leakage not exeeding 10nA
7.6 Switching Characteristics: Tsk, TMAX
over operating free-air temperature range (unless otherwise noted)
Operating free-air
temperature (TA)
PARAMETER
TEST CONDITIONS
VCCI
VCCO
UNIT
-40°C to 125°C
MIN TYP MAX
3.0 V - 3.6 V
1.65 V - 1.95 V
1.1 V - 1.3 V
1.65 V - 1.95 V
1.1 V - 1.3 V
1.1 V - 1.3 V
4.5 V - 5.5 V
4.5 V - 5.5 V
4.5 V - 5.5 V
3.0 V - 3.6 V
3.0 V - 3.6 V
1.65 V - 1.95 V
3.0 V - 3.6 V
1.65 V - 1.95 V
1.1 V - 1.3 V
1.65 V - 1.95 V
1.1 V - 1.3 V
1.1 V - 1.3 V
4.5 V - 5.5 V
4.5 V - 5.5 V
4.5 V - 5.5 V
3.0 V - 3.6 V
3.0 V - 3.6 V
1.65 V - 1.95 V
4.5 V - 5.5 V
4.5 V - 5.5 V
4.5 V - 5.5 V
3.0 V - 3.6 V
3.0 V - 3.6 V
1.65 V - 1.95 V
3.0 V - 3.6 V
1.65 V - 1.95 V
1.1 V - 1.3 V
1.65 V - 1.95 V
1.1 V - 1.3 V
1.1 V - 1.3 V
4.5 V - 5.5 V
4.5 V - 5.5 V
4.5 V - 5.5 V
3.0 V - 3.6 V
3.0 V - 3.6 V
1.65 V - 1.95 V
3.0 V - 3.6 V
1.65 V - 1.95 V
1.1 V - 1.3 V
1.65 V - 1.95 V
1.1 V - 1.3 V
1.1 V - 1.3 V
200
150
30
100
30
20
125
50
10
50
10
10
3
Up Translation
Down Translation
Up Translation
Down Translation
50% Duty Cycle
Input
One channel
switching
20% of pulse >
0.7*VCCO
TMAX - Maximum
Data Rate
Mbps
20% of pulse <
0.3*VCCO
10
42
8
42
45
3
Timing skew
between any
switching outputs on
the rising or falling
edge
tsk - Output skew
ns
10
42
8
42
45
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7.7 Switching Characteristics, VCCA = 1.2 ± 0.1 V
See 图 8-1 and 表 8-1 for test circuit and loading. See 图 8-2, 图 8-3, and 图 8-4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
1.2 ± 0.1 V
1.5 ± 0.1 V
1.8 ± 0.15 V
2.5 ± 0.2 V
3.3 ± 0.3 V
5.0 ± 0.5 V
UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
3.3
5.7
96 0.5
60 3.0
43 0.5
39 1.4
37 0.5
33 0.5
32 0.5
28 0.5
70 0.5
45 1.5
137 28.4
131 45.4
104 22.1
104 36.5
232 21.7
173 32.0
130 8.2
97 14.5
30 0.5
27 0.5
69 0.5
44 1.3
143 18.7
134 31.8
112 20.1
107 33.8
235 22.7
177 34.2
130 8.4
97 14.8
31
26
A
B
A
A
B
A
B
Propagation
delay
tpd
tdis
ten
ns
3.3
95 1.9
80 0.5
75 0.5
69
B
5.7
60 4.1
51 2.9
48 1.8
44
28.8
133 28.5
133 43.3
150 27.6
149 43.2
237 22.1
156 33.3
237 14.3
143 23.0
130 28.4
130 43.7
117 25.8
120 40.8
229 21.4
167 32.0
152 11.2
116 18.6
133 28.8
130 44.7
110 22.5
113 36.8
230 21.3
169 31.7
140 8.8
107 15.4
211
140
181
111
244
187
132
103
OE
OE
OE
OE
-40°C to 125°C 43.3
-40°C to 85°C 32.5
-40°C to 125°C 48.3
-40°C to 85°C 24.1
-40°C to 125°C 34.9
-40°C to 85°C 21.3
-40°C to 125°C 29.8
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7.8 Switching Characteristics, VCCA = 1.5 ± 0.1 V
See 图 8-1 and 表 8-1 for test circuit and loading. See 图 8-2, 图 8-3, and 图 8-4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
1.2 ± 0.1 V
1.5 ± 0.1 V
1.8 ± 0.15 V
2.5 ± 0.2 V
3.3 ± 0.3 V
5.0 ± 0.5 V
UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
1.9
4.1
80 0.5
51 1.6
43 0.5
39 1.6
91 19.0
95 32.6
127 21.7
130 36.7
102 14.4
102 25.2
175 12.7
135 21.0
31 0.5
31 0.5
31 0.5
31 0.5
82 18.8
86 32.8
91 19.9
95 34.7
86 13.5
89 24.1
80 9.1
81 16.8
25 0.5
25 0.5
28 0.5
28 0.5
81 19.2
85 33.4
82 16.3
86 30.2
88 12.7
91 22.8
69 6.1
71 12.5
19 0.5
20 0.5
26 0.5
26 0.5
82 19.6
87 34.2
71 15.9
75 29.8
90 12.6
93 22.8
57 4.9
60 10.8
17 0.5
18 0.5
25 0.5
25 0.5
83 12.2
88 24.6
71 13.7
75 26.6
92 13.2
96 23.5
53 4.5
56 10.4
15
16
24
24
87
92
70
74
97
100
54
57
A
B
A
A
B
A
B
Propagation
delay
tpd
tdis
ten
ns
0.5
B
3.0
20.0
OE
OE
OE
OE
-40°C to 125°C 34.9
-40°C to 85°C 27.4
-40°C to 125°C 44.4
-40°C to 85°C 14.9
-40°C to 125°C 25.5
-40°C to 85°C 17.9
-40°C to 125°C 26.6
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7.9 Switching Characteristics, VCCA = 1.8 ± 0.15 V
See 图 8-1 and 表 8-1 for test circuit and loading. See 图 8-2, 图 8-3, and 图 8-4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
1.2 ± 0.1 V
1.5 ± 0.1 V
1.8 ± 0.15 V
2.5 ± 0.2 V
3.3 ± 0.3 V
5.0 ± 0.5 V
UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
0.5
2.9
75 0.5
48 0.5
37 0.5
33 0.5
79 14.7
83 28.0
121 18.7
123 34.0
88 9.5
87 19.0
177 10.4
135 18.7
28 0.5
28 0.5
25 0.5
25 0.5
67 14.5
71 26.6
81 16.5
86 30.3
66 9.4
69 18.9
75 8.1
77 15.5
22 0.5
23 0.5
22 0.5
23 0.5
65 14.3
69 27.5
71 12.8
76 26.2
63 8.6
67 17.6
58 4.9
60 11.0
17 0.5
17 0.5
19 0.5
20 0.5
65 14.4
70 27.2
60 12.5
64 25.3
65 8.2
68 17.1
46 3.3
49 8.7
14 0.5
15 0.5
19 0.5
19 0.5
66 8.5
71 20.0
58 9.8
62 21.8
66 8.1
70 17.1
42 2.2
44 7.3
12
13
18
19
68
73
55
59
69
73
39
42
A
B
A
A
B
A
B
Propagation
delay
tpd
tdis
ten
ns
0.5
B
1.4
17.2
OE
OE
OE
OE
-40°C to 125°C 30.9
-40°C to 85°C 25.4
-40°C to 125°C 41.7
-40°C to 85°C 10.9
-40°C to 125°C 20.3
-40°C to 85°C 16.7
-40°C to 125°C 25.1
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7.10 Switching Characteristics, VCCA = 2.5 ± 0.2 V
See 图 8-1 and 表 8-1 for test circuit and loading. See 图 8-2, 图 8-3, and 图 8-4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
1.2 ± 0.1 V
1.5 ± 0.1 V
1.8 ± 0.15 V
2.5 ± 0.2 V
3.3 ± 0.3 V
5.0 ± 0.5 V
UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
0.5
1.8
70 0.5
45 0.5
32 0.5
28 0.5
65 10.5
68 21.8
112 16.5
115 30.9
80 5.9
74 13.5
183 9.2
139 17.2
26 0.5
26 0.5
19 0.5
20 0.5
51 9.0
55 19.7
74 14.0
79 27.1
50 5.1
53 12.4
74 6.0
76 13.0
20 0.5
20 0.5
17 0.5
17 0.5
51 8.1
50 18.2
61 9.0
66 21.6
44 4.7
47 12.0
54 4.0
57 9.8
14 0.5
14 0.5
14 0.5
14 0.5
43 8.4
47 18.6
46 9.1
51 20.5
39 4.4
42 11.5
36 2.1
38 7.1
12 0.5
12 0.5
13 0.5
13 0.5
44 5.0
48 15.0
44 6.4
48 16.8
40 3.7
43 10.8
31 0.5
33 4.7
9
10
13
13
45
49
39
43
41
44
27
29
A
B
A
A
B
A
B
Propagation
delay
tpd
tdis
ten
ns
0.5
B
0.5
12.9
OE
OE
OE
OE
-40°C to 125°C 24.9
-40°C to 85°C 23.2
-40°C to 125°C 38.7
-40°C to 85°C 7.9
-40°C to 125°C 15.6
-40°C to 85°C 16.3
-40°C to 125°C 24.4
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7.11 Switching Characteristics, VCCA = 3.3 ± 0.3 V
See 图 8-1 and 表 8-1 for test circuit and loading. See 图 8-2, 图 8-3, and 图 8-4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
1.2 ± 0.1 V
1.5 ± 0.1 V
1.8 ± 0.15 V
2.5 ± 0.2 V
3.3 ± 0.3 V
5.0 ± 0.5 V
UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
0.5
1.5
69 0.5
44 0.5
30 0.5
27 0.5
62 10.1
65 20.6
109 15.7
111 29.5
85 4.2
72 10.9
192 8.9
144 16.7
25 0.5
25 0.5
17 0.5
18 0.5
47 8.7
51 18.4
71 13.2
75 25.4
45 3.0
47 9.3
76 5.4
78 12.2
19 0.5
19 0.5
14 0.5
15 0.5
42 6.9
46 15.7
59 8.5
63 19.2
37 2.4
40 8.2
55 2.6
57 8.0
13 0.5
13 0.5
12 0.5
12 0.5
39 6.6
40 15.3
42 7.6
46 18.5
31 2.2
33 8.1
34 1.8
36 6.6
11 0.5
11 0.5
11 0.5
11 0.5
39 6.9
39 15.9
38 4.7
42 14.2
30 1.7
32 7.5
27 0.5
29 3.7
8
9
A
B
A
A
B
A
B
Propagation
delay
tpd
tdis
ten
ns
0.5
10
10
40
40
34
36
30
33
22
24
B
0.5
12.9
OE
OE
OE
OE
-40°C to 125°C 24.0
-40°C to 85°C 22.7
-40°C to 125°C 37.6
-40°C to 85°C 6.6
-40°C to 125°C 13.6
-40°C to 85°C 16.3
-40°C to 125°C 24.3
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7.12 Switching Characteristics, VCCA = 5.0 ± 0.5 V
See 图 8-1 and 表 8-1 for test circuit and loading. See 图 8-2, 图 8-3, and 图 8-4 for measurement waveforms.
B-Port Supply Voltage (VCCB
)
Test
Conditions
PARAMETER
FROM
TO
1.2 ± 0.1 V
1.5 ± 0.1 V
1.8 ± 0.15 V
2.5 ± 0.2 V
3.3 ± 0.3 V
5.0 ± 0.5 V
UNIT
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
-40°C to 125°C
-40°C to 85°C
0.5
1.3
69 0.5
44 0.5
31 0.5
26 0.5
58 7.7
61 17.0
109 5.9
111 29.2
102 2.8
81 8.8
212 8.8
158 16.7
24 0.5
24 0.5
15 0.5
16 0.5
42 5.9
46 14.5
69 13.2
73 24.6
44 1.2
46 6.5
82 4.8
83 11.7
18 0.5
19 0.5
12 0.5
13 0.5
36 4.2
40 11.8
56 8.4
60 18.1
33 0.5
36 4.7
58 1.6
60 6.9
13 0.5
13 0.5
10 0.5
11 0.5
8
8
A
B
A
A
B
A
B
Propagation
delay
tpd
tdis
ten
ns
0.5
9
0.5
8
9
0.5
0.5
8
B
0.5
10 0.5
31 3.4
33 10.4
40 6.9
43 16.4
25 0.5
27 4.2
35 0.5
37 4.7
8
10.8
30 2.8
31 9.6
36 3.7
39 12.2
22 0.5
24 4.4
26 0.5
28 3.5
26
29
29
31
21
23
19
21
OE
OE
OE
OE
-40°C to 125°C 20.8
-40°C to 85°C 9.7
-40°C to 125°C 37.4
-40°C to 85°C 6.0
-40°C to 125°C 12.4
-40°C to 85°C 16.7
-40°C to 125°C 24.8
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7.13 Operating Characteristics
TA = 25℃ (1)
Supply Voltage (VCCB = VCCA
)
PARAMETER
Test Conditions 1.2 ± 0.1V 1.5 ± 0.1V 1.8 ± 0.15V 2.5 ± 0.2V 3.3 ± 0.3V 5.0 ± 0.5V UNIT
TYP
2
TYP
2
TYP
2
TYP
2
TYP
2
TYP
3
A to B: outputs enabled
A to B: outputs disabled
B to A: outputs enabled
B to A: outputs disabled
A to B: outputs enabled
A to B: outputs disabled
B to A: outputs enabled
B to A: outputs disabled
A Port
CL = 0, RL = Open
f = 10 MHz
2
2
2
2
2
3
(2)
CpdA
pF
pF
12
2
12
2
12
2
13
2
13
2
16
3
trise = tfall = 1 ns
12
2
12
2
12
2
13
2
13
2
16
3
B Port
CL = 0, RL = Open
f = 10 MHz
(3)
CpdB
2
2
2
2
2
3
trise = tfall = 1 ns
2
2
2
2
2
3
(1) See the CMOS Power Consumption and Cpd Calculation application report for additional information about how power dissipation
capacitance affects power consumption.
(2) A-Port power dissipation capacitance per transceiver.
(3) B-Port power dissipation capacitance per transceiver.
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7.14 Typical Characteristics
5
4.75
4.5
4.25
4
1.95
1.8
1.65
1.5
3.75
3.5
3.25
3
VCC = 5.0V
VCC = 3.3V
VCC = 2.5V
1.35
1.2
2.75
2.5
2.25
2
1.05
0.9
VCC = 1.8V
VCC = 1.5V
VCC = 1.2V
1.75
1.5
0.75
0
3
6
9
12
15
18
21
24
0
0.8
1.6
2.4
3.2
4
4.8
5.6
6.4
7.2
8
IOH - Output High Current (mA)
IOH - Output High Current (mA)
图 7-1. Typical (TA=25°C) Output High Voltage (VOH) vs Source
Current (IOH
图 7-2. Typical (TA=25°C) Output High Voltage (VOH) vs Source
Current (IOH
)
)
0.35
0.325
0.3
0.35
0.325
0.3
VCC = 2.5V
VCC = 3.3V
VCC = 5.0V
VCC = 1.2V
VCC = 1.5V
VCC = 1.8V
0.275
0.25
0.225
0.2
0.275
0.25
0.225
0.2
0.175
0.15
0.125
0.1
0.175
0.15
0.125
0.1
0.075
0.05
0.025
0
0.075
0.05
0.025
0
0
3
6
9
12
15
18
21
24
0
0.8
1.6
2.4
3.2
4
4.8
5.6
6.4
7.2
8
IOL - Output Low Current (mA)
IOL - Output Low Current (mA)
图 7-3. Typical (TA=25°C) Output Low Voltage (VOL) vs Sink
Current (IOL
图 7-4. Typical (TA=25°C) Output Low Voltage (VOL) vs Sink
Current (IOL
)
)
0.22
0.2
2
1.8
1.6
1.4
1.2
1
VCC = 1.2 V
VCC = 1.5 V
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
VCC = 5 V
0.18
0.16
0.14
0.12
0.1
0.8
0.6
0.4
0.2
0
0.08
0.06
0.04
0.02
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
VIN - Input Voltage (V)
VIN - Input Voltage (V)
图 7-6. Typical (TA=25°C) Supply Current (ICC) vs Input Voltage
(VIN
图 7-5. Typical (TA=25°C) Supply Current (ICC) vs Input Voltage
(VIN
)
)
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8 Parameter Measurement Information
8.1 Load Circuit and Voltage Waveforms
Unless otherwise noted, generators supply all input pulses that have the following characteristics:
•
•
•
f = 1 MHz
ZO = 50 Ω
Δt/ΔV ≤ 1 ns/V
Measurement Point
2 x VCCO
Open
RL
S1
Output Pin
Under Test
(1)
GND
CL
RL
A. CL includes probe and jig capacitance.
图 8-1. Load Circuit
表 8-1. Load Circuit Conditions
Parameter
VCCO
RL
CL
S1
VTP
N/A
tpd
Propagation (delay) time
1.1 V – 5.5 V
1.1 V – 1.6 V
1.65 V – 2.7 V
3.0 V – 5.5 V
1.1 V – 1.6 V
1.65 V – 2.7 V
3.0 V – 5.5 V
10 kΩ
10 kΩ
10 kΩ
10 kΩ
10 kΩ
10 kΩ
10 kΩ
5 pF
5 pF
5 pF
5 pF
5 pF
5 pF
5 pF
Open
2 × VCCO
2 × VCCO
2 × VCCO
GND
0.1 V
0.15 V
0.3 V
0.1 V
0.15 V
0.3 V
ten, tdis Enable time, disable time
ten, tdis Enable time, disable time
GND
GND
(1)
VCCI
(1)
VCCI
100 kHz
Input A, B
VCCI / 2
VCCI / 2
Input A, B
500 ps/V œ 1 s/V
0 V
0 V
VOH
(2)
VOH
tpd
tpd
(2)
Ensure Monotonic
Rising and Falling Edge
Output B, A
(2)
VOL
Output B, A
VCCI / 2
VCCI / 2
(2)
VOL
1. VCCI is the supply pin associated with the input port.
2. VOH and VOL are typical output voltage levels that occur
with specified RL, CL, and S1
1. VCCI is the supply pin associated with the input port.
2. VOH and VOL are typical output voltage levels that occur
with specified RL, CL, and S1
图 8-3. Input Transition Rise and Fall Rate
图 8-2. Propagation Delay
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VCCA
GND
OE
VCCA / 2
VCCA / 2
tdis
ten
(3)
VCCO
Output(1)
VCCO / 2
VOL + VTP
(4)
VOL
(4)
VOH
VOH - VTP
Output(2)
VCCO / 2
GND
1. Output waveform on the condition that input is driven to a valid Logic Low.
2. Output waveform on the condition that input is driven to a valid Logic High.
3. VCCO is the supply pin associated with the output port.
4. VOH and VOL are typical output voltage levels with specified RL, CL, and S1.
图 8-4. Enable Time And Disable Time
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9 Detailed Description
9.1 Overview
The TXU0204-Q1 is a 4-bit translating transceiver that uses two individually configurable power-supply rails. The
device is operational with VCCA and VCCB supplies as low as 1.1 V and as high as 5.5 V. Additionally, the device
can be operated with VCCA = VCCB. The A port is designed to track VCCA, and the B port is designed to track
VCCB
.
The TXU0204-Q1 device is designed for asynchronous communication between data buses, and transmits data
with fixed direction from the A bus to the B bus on some channels and from the B bus to the A bus on the
remaining channels. The output-enable input (OE) is used to disable the outputs so the buses are effectively
isolated. The output-enable pin of the TXU0204-Q1 (OE) can be referenced to either VCCA or VCCB. The OE pin
can be left floating or externally pulled down to ground to ensure the high-impedance state of the level shifter
outputs during power up or power down.
This device is fully specified for partial-power-down applications using the Ioff current. The Ioff protection circuitry
ensures that no excessive current is drawn from or sourced into an input or output while the device is powered
down.
The VCC isolation or VCC disconnect feature ensures that if either VCC is less than 100 mV or disconnected
with the complementary supply within recommended operating conditions, outputs are disabled and set to the
high-impedance state while the supply current is maintained. The Ioff-float circuitry ensures that no excessive
current is drawn from or sourced into an input or output while the supply is floating.
Glitch-free power supply sequencing allows either supply rail to be powered on or off in any order while providing
robust power sequencing performance.
9.2 Functional Block Diagram
VCC(MIN)
VCCA
VCCB
OE
B1Y
B2Y
B3
A1
A2
A3Y
A4Y
B4
GND
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9.3 Feature Description
9.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
Standard CMOS inputs are high impedance and are typically modeled as a resistor in parallel with the input
capacitance given in the Electrical Characteristics. The worst case resistance is calculated with the maximum
input voltage, given in the Absolute Maximum Ratings, and the maximum input leakage current, given in the
Electrical Characteristics, using ohm's law (R = V ÷ I).
The Schmitt-trigger input architecture provides hysteresis as defined by ΔVT in the Electrical Characteristics,
which makes this device extremely tolerant to slow or noisy inputs. Driving the inputs slowly will increase
dynamic current consumption of the device. See Understanding Schmitt Triggers for additional information
regarding Schmitt-trigger inputs.
9.3.1.1 Inputs with Integrated Static Pull-Down Resistors
This device has 5 MΩ typical integrated weak pull-downs for each input. This feature allows all inputs to be left
floating without the concern for unstable outputs or increased current consumption. This also helps to reduce
external component count for applications where not all channels are used or need to be fixed low. If an external
pull-up is required, it should be no larger than 1 MΩ to avoid contention with the 5 MΩ internal pull-down.
9.3.2 Control Logic (OE) with VCC(MIN) Circuitry
The output-enable input (OE) is used to disable the outputs so the buses are effectively isolated. The output-
enable pin of the TXU0x04-Q1 has VCC(MIN) circuitry, which allows the OE pin to operate with the lower
supply voltage. The Over-Voltage Tolerant Inputs feature allows the OE pin to operate with the higher supply
voltage. This combination means that the enable pin can be referenced to either VCCA or VCCB supply. Multiple
permutations of each device are possible since the controller can be placed on either the A or B port and can still
control the enable pin.
9.3.3 Balanced High-Drive CMOS Push-Pull Outputs
A balanced output allows the device to sink and source similar currents. The high drive capability of this device
creates fast edges into light loads, so routing and load conditions should be considered to prevent ringing.
Additionally, the outputs of this device are capable of driving larger currents than the device can sustain without
being damaged. Absolute Maximum Ratings defines the electrical and thermal limits that must be followed at all
times.
9.3.4 Partial Power Down (Ioff)
The inputs and outputs for this device enter a high-impedance state when the device is powered down, inhibiting
current backflow into the device. The Ioff in the Electrical Characteristics specifies the maximum leakage into or
out of any input or output pin on the device.
9.3.5 VCC Isolation and VCC Disconnect
The outputs for this device are disabled and enter a high-impedance state when either supply is <100 mV
or left floating (disconnected), with the complementary supply within recommended operating conditions. It is
recommended that the inputs are kept low before floating (disconnecting) either supply.
The ICCx(floating) in the Electrical Characteristics specifies the maximum supply current. The Ioff(float) in the
Electrical Characteristics specifies the maximum leakage into or out of any input or output pin on the device.
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VCCA
VCCB
Supply disconnected
ICCB maintained
VCC(MIN)
VCCA
VCCB
OE
Hi-Z
A1
Hi-Z
B1Y
Disabled
Ioff(float)
Ioff(float)
GND
图 9-1. VCC Disconnect Feature
9.3.6 Over-Voltage Tolerant Inputs
Input signals to this device can be driven above the supply voltage so long as they remain below the maximum
input voltage value specified in the Recommended Operating Conditions.
9.3.7 Glitch-Free Power Supply Sequencing
Either supply rail may be powered on or off in any order without producing a glitch on the inputs or outputs (that
is, where the output erroneously transitions to VCC when it should be held low or vice versa). Glitches of this
nature can be misinterpreted by a peripheral as a valid data bit, which could trigger a false device reset of the
peripheral, a false device configuration of the peripheral, or even a false data initialization by the peripheral.
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9.3.8 Negative Clamping Diodes
图 9-2 depicts the inputs and outputs to this device that have negative clamping diodes.
CAUTION
Voltages beyond the values specified in the Absoulte Maximum Ratings table can cause damage to
the device. The input negative-voltage and output voltage ratings may be exceeded if the input and
output clamp-current ratings are observed.
VCCA VCCB
Device
Input or I/O
configured
as input
Level
Shifter
I/O configured
as output
-IIK
-IOK
GND
图 9-2. Electrical Placement of Clamping Diodes for Each Input and Output
9.3.9 Fully Configurable Dual-Rail Design
The VCCA and VCCB pins can be supplied at any voltage from 1.1 V to 5.5 V, making the device suitable for
translating between any of the voltage nodes (1.2 V, 1.5 V, 1.8 V, 3.3 V, and 5.0 V).
9.3.10 Supports High-Speed Translation
The TXU0204-Q1 device can support high data-rate applications. The translated signal data rate can be up to
200 Mbps when the signal is translated from 3.3 V to 5.0 V.
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9.3.11 Wettable Flanks
This device includes wettable flanks for at least one package. See the Features section on the front page of the
data sheet for which packages include this feature.
Package
Package
Solder
Standard Lead
We able Flank Lead
Pad
PCB
图 9-3. Simplified Cutaway View of Wettable-Flank QFN Package and Standard QFN Package After
Soldering
Wettable flanks help improve side wetting after soldering, which makes QFN packages easier to inspect with
automatic optical inspection (AOI). A wettable flank can be dimpled or step-cut to provide additional surface area
for solder adhesion which assists in reliably creating a side fillet as shown in 图 9-3. Please see the mechanical
drawing for additional details.
9.4 Device Functional Modes
表 9-1. Function Table
CONTROL INPUTS
Port Status
OPERATION
OE
Input
Output
H
L
L
Unidirectional non-inverting
voltage translation
H
L
H
X
H
Unidirectional non-inverting
voltage translation
Hi-Z
Isolation
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10 Application and Implementation
备注
以下应用部分中的信息不属于 TI 器件规格的范围，TI 不担保其准确性和完整性。TI 的客 户应负责确定
器件是否适用于其应用。客户应验证并测试其设计，以确保系统功能。
10.1 Application Information
The TXU0204-Q1 device can be used in level-translation applications for interfacing devices or systems
operating at different interface voltages with one another. The TXU0204-Q1 device is ideal for use in applications
where a push-pull driver is connected to the data Inputs. The maximum data rate can be up to 200 Mbps when
the device translates a signal from 3.3 V to 5.0 V.
10.2 Typical Application
5.0 V
1.2 V
0.1 µF
0.1 µF
BLE Module
Switch/Router
ASIC Chipset
VCCB
VCCA
RX
TX
A1
B1Y
RTS
RTS
RX
A2
B2Y
B3
TXU0204-Q1
GND
A3Y
A4Y
TX
CTS
B4
CTS
GPIO
OE
图 10-1. TXU0204-Q1 UART Interface Application
10.2.1 Design Requirements
Use the parameters listed in 表 10-1 for this design example.
表 10-1. Design Parameters
DESIGN PARAMETERS
EXAMPLE VALUES
1.1 V to 5.5 V
Input voltage range
Output voltage range
1.1 V to 5.5 V
10.2.2 Detailed Design Procedure
To begin the design process, determine the following:
•
Input voltage range
– Use the supply voltage of the device that is driving the TXU0204-Q1 device to determine the input voltage
range. For a valid logic-high, the value must exceed the positive-going input-threshold voltage (VT+) of the
input port. For a valid logic low the value must be less than the negative-going input-threshold voltage
(VT-) of the input port.
•
Output voltage range
– Use the supply voltage of the device that the TXU0204-Q1 device is driving to determine the output
voltage range.
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10.2.3 Application Curve
图 10-2. Up Translation at 1 MHz (1.2 V to 5 V)
11 Power Supply Recommendations
Always apply a ground reference to the GND pins first. This device is designed for glitch free power sequencing
without any supply sequencing requirements such as ramp order or ramp rate.
Glitch-Free Power Supply Sequencing describes how this device was designed with various power supply
sequencing methods in mind to help prevent unintended triggering of downstream devices.
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12 Layout
12.1 Layout Guidelines
To ensure reliability of the device, it is recommended to follow common printed-circuit board layout guidelines:
•
Use bypass capacitors on the power supply pins and place them as close to the device as possible. A 0.1 µF
capacitor is recommended, but transient performance can be improved by having 1 µF and 0.1 µF capacitors
in parallel as bypass capacitors.
•
The high drive capability of this device creates fast edges into light loads, so routing and load conditions
should be considered to prevent ringing.
12.2 Layout Example
GND VCCB
Recommend GND flood fill for
improved signal isolation, noise
reduction, and thermal dissipation
Bypass capacitor
placed close to the
device
VCCA
0.1 F
0.1 F
VCCA
A1
Unused
inputs left
floating
14
13
12
11
10
9
VCCB
1
2
3
4
5
6
7
Unused
output left
floating
B1Y
B2Y
B3
A2
TXU0204-Q1
A3Y
A4Y
NC
B4
NC
OE
Avoid 90°
corners for
signal lines
GND
8
图 12-1. Layout Example – TXU0204-Q1
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13 Device and Documentation Support
13.1 Device Support
13.1.1 Regulatory Requirements
No statutory or regulatory requirements apply to this device.
There are no special characteristics for this product.
13.2 Documentation Support
13.2.1 Related Documentation
•
•
Texas Instruments, Understanding Schmitt Triggers application report
Texas Instruments, CMOS Power Consumption and Cpd Calculation application report
13.3 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
13.4 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅 TI
的《使用条款》。
13.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
13.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
13.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TXU0204QPWRQ1
ACTIVE
ACTIVE
TSSOP
WQFN
PW
14
14
2000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
TXU204Q
TX0204
TXU0204QWBQARQ1
BQA
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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OTHER QUALIFIED VERSIONS OF TXU0204-Q1 :
Catalog : TXU0204
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
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3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TXU0204QPWRQ1
TSSOP
WQFN
PW
14
14
2000
3000
330.0
180.0
12.4
12.4
6.9
2.8
5.6
3.3
1.6
1.1
8.0
4.0
12.0
12.0
Q1
Q1
TXU0204QWBQARQ1
BQA
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
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3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TXU0204QPWRQ1
TSSOP
WQFN
PW
14
14
2000
3000
356.0
210.0
356.0
185.0
35.0
35.0
TXU0204QWBQARQ1
BQA
Pack Materials-Page 2
GENERIC PACKAGE VIEW
BQA 14
2.5 x 3, 0.5 mm pitch
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4227145/A
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PACKAGE OUTLINE
BQA0014B
WQFN - 0.8 mm max height
S
C
A
L
E
4
.
5
0
0
PLASTIC QUAD FLATPACK - NO LEAD
2.6
2.4
B
A
PIN 1 INDEX AREA
3.1
2.9
0.1 MIN
(0.13)
A
-
A
3
5
.
0
0
0
SECTION A-A
TYPICAL
0.8
0.6
C
SEATING PLANE
0.08 C
0.05
0.00
1
0.1
2X 0.5
(0.2) TYP
SYMM
7
8
EXPOSED
THERMAL PAD
6
9
(0.16)
TYP
SYMM
15
A
A
1.5 0.1
2X 2
8X 0.5
13
2
0.3
0.2
14X
PIN 1 ID
1
14
0.1
C A B
0.5
0.3
0.05
14X
4227062/B 09/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
BQA0014B
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1)
SYMM
SEE SOLDER MASK
DETAIL
14
1
14X (0.6)
2
14X (0.25)
13
10X (0.5)
(0.5)
15
SYMM
(2.8)
(1.5)
6
9
(R0.05) TYP
(
0.2) TYP
VIA
7
8
(2.3)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4227062/B 09/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
BQA0014B
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.95)
14
1
14X (0.6)
14X (0.25)
2
13
(2.8)
10X (0.5)
15
SYMM
(1.38)
(R0.05) TYP
6
9
7
8
SYMM
(2.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 20X
EXPOSED PAD 15
87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4227062/B 09/2021
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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相关型号：
TXVPPR1510E
Rectifier Diode, Schottky, 1 Phase, 1 Element, 15A, 100V V(RRM), Silicon, HERMETIC SEALED, SMD0.5, 3 PIN
MICROSEMI
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