UA741UFKB [TI]
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS; 通用运算放大器型号: | UA741UFKB |
厂家: | TEXAS INSTRUMENTS |
描述: | GENERAL-PURPOSE OPERATIONAL AMPLIFIERS |
文件: | 总19页 (文件大小:478K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
µA741M . . . J PACKAGE
Short-Circuit Protection
(TOP VIEW)
Offset-Voltage Null Capability
Large Common-Mode and Differential
Voltage Ranges
NC
NC
OFFSET N1
IN–
NC
NC
NC
V
OUT
OFFSET N2
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
No Frequency Compensation Required
Low Power Consumption
No Latch-Up
CC+
IN+
V
–
CC
Designed to Be Interchangeable With
Fairchild µA741
NC
8
µA741M . . . JG PACKAGE
µA741C, µA741I . . . D, P, OR PW PACKAGE
(TOP VIEW)
description
The µA741 is a general-purpose operational
amplifier featuring offset-voltage null capability.
OFFSET N1
IN–
NC
V
OUT
1
2
3
4
8
7
6
5
The high common-mode input voltage range and
the absence of latch-up make the amplifier ideal
for voltage-follower applications. The device is
short-circuit protected and the internal frequency
compensation ensures stability without external
components. A low value potentiometer may be
connected between the offset null inputs to null
out the offset voltage as shown in Figure 2.
CC+
IN+
V
OFFSET N2
CC–
µA741M . . . U PACKAGE
(TOP VIEW)
NC
OFFSET N1
IN–
NC
NC
V
OUT
OFFSET N2
The µA741C is characterized for operation from
0°C to 70°C. The µA741I is characterized for
operation from –40°C to 85°C.The µA741M is
characterized for operation over the full military
temperature range of –55°C to 125°C.
1
2
3
4
5
10
9
8
CC+
IN+
7
V
6
CC–
symbol
µA741M . . . FK PACKAGE
(TOP VIEW)
OFFSET N1
+
–
IN +
OUT
IN –
OFFSET N2
3
2
1
20 19
18
NC
V
NC
IN–
NC
4
5
6
7
8
17
16
15
14
CC+
NC
OUT
NC
IN+
NC
9 10 11 12 13
NC – No internal connection
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
FORM
(Y)
SMALL
OUTLINE
(D)
CHIP
CARRIER
(FK)
CERAMIC
DIP
CERAMIC
DIP
PLASTIC
DIP
FLAT
PACK
(U)
T
A
TSSOP
(PW)
(J)
(JG)
(P)
0°C to 70°C
–40°C to 85°C
–55°C to 125°C
µA741CD
µA741ID
µA741CP µA741CPW
µA741IP
µA741Y
µA741MFK
µA741MJ
µA741MJG
µA741MU
The D package is available taped and reeled. Add the suffix R (e.g., µA741CDR).
schematic
V
CC+
IN–
IN+
OUT
OFFSET N1
OFFSET N2
V
CC–
Component Count
Transistors
Resistors
Diode
22
11
1
Capacitor
1
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
µA741Y chip information
This chip, when properly assembled, displays characteristics similar to the µA741C. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
CC+
(7)
(3)
(2)
(7)
(6)
IN+
+
–
(6)
OUT
IN–
OFFSET N1
OFFSET N2
(4)
(1)
(5)
(8)
V
CC–
45
(5)
(4)
(1)
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T max = 150°C.
J
(2)
(3)
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
36
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
µA741C
18
µA741I
22
µA741M
22
UNIT
Supply voltage, V
Supply voltage, V
(see Note 1)
(see Note 1)
V
V
V
V
V
CC+
–18
–22
–22
CC–
Differential input voltage, V (see Note 2)
ID
±15
±30
±30
Input voltage, V any input (see Notes 1 and 3)
I
±15
±15
±15
Voltage between offset null (either OFFSET N1 or OFFSET N2) and V
±15
±0.5
±0.5
CC–
Duration of output short circuit (see Note 4)
unlimited
unlimited
unlimited
Continuous total power dissipation
See Dissipation Rating Table
–40 to 85 –55 to 125
Operating free-air temperature range, T
0 to 70
°C
°C
°C
°C
°C
A
Storage temperature range
–65 to 150 –65 to 150 –65 to 150
Case temperature for 60 seconds
FK package
260
300
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
J, JG, or U package
D, P, or PW package
260
260
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the midpoint between V
2. Differential voltages are at IN+ with respect to IN–.
and V
.
CC–
CC+
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 V, whichever is less.
4. The output may be shorted to ground or either power supply. For the µA741M only, the unlimited duration of the short circuit applies
at (or below) 125°C case temperature or 75°C free-air temperature.
DISSIPATION RATING TABLE
T
≤ 25°C
DERATING
FACTOR
DERATE
ABOVE T
T
= 70°C
T
= 85°C
T = 125°C
A
A
A
A
PACKAGE
POWER RATING
POWER RATING POWER RATING POWER RATING
A
D
FK
J
500 mW
5.8 mW/°C
11.0 mW/°C
11.0 mW/°C
8.4 mW/°C
N/A
64°C
105°C
105°C
90°C
N/A
464 mW
500 mW
500 mW
500 mW
500 mW
336 mW
432 mW
377 mW
500 mW
500 mW
500 mW
500 mW
N/A
N/A
500 mW
275 mW
275 mW
210 mW
N/A
500 mW
JG
P
500 mW
500 mW
PW
U
525 mW
4.2 mW/°C
5.4 mW/°C
25°C
57°C
N/A
500 mW
351 mW
135 mW
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
electrical characteristics at specified free-air temperature, V
= ±15 V (unless otherwise noted)
CC±
µA741C
TYP
µA741I, µA741M
TEST
CONDITIONS
†
PARAMETER
UNIT
T
A
MIN
MAX
6
MIN
TYP
MAX
25°C
Full range
25°C
1
1
5
6
V
IO
Input offset voltage
V
V
V
= 0
= 0
= 0
mV
mV
nA
O
O
O
7.5
∆V
IO(adj)
Offset voltage adjust range
Input offset current
±15
±15
25°C
20
200
300
500
800
20
200
500
I
IO
Full range
25°C
80
±13
±14
±13
200
80
±13
±14
±13
200
500
I
IB
Input bias current
V
O
= 0
nA
V
Full range
25°C
1500
±12
±12
±12
±12
±10
±10
20
±12
±12
±12
±12
±10
±10
50
Common-mode input
voltage range
V
ICR
OM
Full range
25°C
R
R
R
R
R
= 10 kΩ
≥ 10 kΩ
= 2 kΩ
≥ 2 kΩ
≥ 2 kΩ
= ±10 V
L
L
L
L
L
O
Full range
25°C
Maximum peak output
voltage swing
V
V
Full range
25°C
Large-signal differential
voltage amplification
A
VD
V/mV
V
Full range
25°C
15
25
r
r
Input resistance
Output resistance
Input capacitance
0.3
2
75
0.3
2
75
MΩ
Ω
i
V
O
= 0, See Note 5
25°C
o
C
25°C
1.4
90
1.4
90
pF
i
25°C
70
70
70
70
Common-mode rejection
ratio
CMRR
V
V
= V
min
dB
IC
ICR
Full range
25°C
30
150
150
±40
2.8
30
150
150
±40
2.8
Supply voltage sensitivity
k
= ±9 V to ±15 V
µV/V
mA
SVS
CC
(∆V /∆V
IO CC
)
Full range
25°C
I
I
Short-circuit output current
±25
±25
OS
25°C
1.7
1.7
Supply current
V
V
= 0, No load
= 0, No load
mA
CC
O
Full range
25°C
3.3
3.3
50
85
50
85
P
D
Total power dissipation
mW
O
Full range
100
100
†
All characteristics are measured under open-loop conditions with zero common-mode input voltage unless otherwise specified. Full range for
the µA741C is 0°C to 70°C, the µA741I is –40°C to 85°C, and the µA741M is –55°C to 125°C.
NOTE 5: This typical value applies only at frequencies above a few hundred hertz because of the effects of drift and thermal feedback.
operating characteristics, V
= ±15 V, T = 25°C
CC±
A
µA741C
TYP
0.3
µA741I, µA741M
PARAMETER
TEST CONDITIONS
UNIT
MIN
MAX
MIN
TYP
0.3
MAX
t
Rise time
µs
r
V
C
= 20 mV,
= 100 pF,
R = 2 kΩ,
L
See Figure 1
R = 2 kΩ,
L
I
L
Overshoot factor
5%
5%
V
C
= 10 V,
I
SR
Slew rate at unity gain
0.5
0.5
V/µs
= 100 pF,
See Figure 1
L
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
electrical characteristics at specified free-air temperature, V
otherwise noted)
= ±15 V, T = 25°C (unless
CC±
A
µA741Y
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
1
MAX
V
Input offset voltage
V
V
V
V
= 0
= 0
= 0
= 0
6
mV
mV
nA
nA
V
IO
∆V
O
O
O
O
Offset voltage adjust range
Input offset current
±15
20
IO(adj)
I
I
200
500
IO
Input bias current
80
IB
V
Common-mode input voltage range
±12
±12
±10
20
±13
±14
±13
200
2
ICR
OM
R
R
R
= 10 kΩ
= 2 kΩ
≥ 2 kΩ
L
L
L
V
Maximum peak output voltage swing
V
A
VD
Large-signal differential voltage amplification
Input resistance
V/mV
MΩ
Ω
r
r
0.3
i
Output resistance
V
O
= 0,
= V
See Note 5
75
o
C
Input capacitance
1.4
90
pF
i
CMRR
Common-mode rejection ratio
V
V
min
ICR
70
dB
IC
k
Supply voltage sensitivity (∆V /∆V
)
= ±9 V to ±15 V
30
150
±40
2.8
85
µV/V
mA
mA
mW
SVS
IO
CC
CC
I
I
Short-circuit output current
Supply current
±25
1.7
50
OS
V
V
= 0,
No load
No load
CC
O
P
D
Total power dissipation
= 0,
O
†
All characteristics are measured under open-loop conditions with zero common-mode voltage unless otherwise specified.
NOTE 5: This typical value applies only at frequencies above a few hundred hertz because of the effects of drift and thermal feedback.
operating characteristics, V ± = ±15 V, T = 25°C
CC
A
µA741Y
TYP
0.3
PARAMETER
TEST CONDITIONS
= 20 mV, = 2 kΩ,
UNIT
MIN
MAX
t
r
Rise time
µs
V
C
R
L
I
L
= 100 pF, See Figure 1
Overshoot factor
5%
V
C
= 10 V,
= 100 pF, See Figure 1
R = 2 kΩ,
L
I
L
SR
Slew rate at unity gain
0.5
V/µs
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
PARAMETER MEASUREMENT INFORMATION
V
I
–
+
OUT
IN
0 V
INPUT VOLTAGE
WAVEFDORM
C
= 100 pF
L
R
= 2 kΩ
L
TEST CIRCUIT
Figure 1. Rise Time, Overshoot, and Slew Rate
APPLICATION INFORMATION
Figure 2 shows a diagram for an input offset voltage null circuit.
+
–
IN+
OUT
OFFSET N2
IN–
OFFSET N1
10 kΩ
To V
CC–
Figure 2. Input Offset Voltage Null Circuit
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
†
TYPICAL CHARACTERISTICS
INPUT OFFSET CURRENT
vs
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
400
350
300
250
200
150
100
100
90
80
70
60
50
V
CC+
V
CC–
= 15 V
= –15 V
V
V
= 15 V
= –15 V
CC+
CC–
40
30
20
50
0
10
0
–60 –40 –20
0
20 40 60 80 100 120 140
–60 –40 –20
0
20 40 60 80 100 120 140
T
A
– Free-Air Temperature – °C
T
A
– Free-Air Temperature – °C
Figure 3
Figure 4
MAXIMUM PEAK OUTPUT VOLTAGE
vs
LOAD RESISTANCE
±14
V
V
T
A
= 15 V
= –15 V
= 25°C
CC+
CC–
±13
±12
±11
±10
±9
±8
±7
±6
±5
±4
0.1
0.2
0.4
0.7
1
2
4
7
10
R
– Load Resistance – kΩ
L
Figure 5
†
Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices.
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
TYPICAL CHARACTERISTICS
OPEN-LOOP SIGNAL DIFFERENTIAL
VOLTAGE AMPLIFICATION
vs
MAXIMUM PEAK OUTPUT VOLTAGE
vs
SUPPLY VOLTAGE
FREQUENCY
400
200
100
±20
±18
V
R
T
A
= ±10 V
= 2 kΩ
= 25°C
O
L
V
V
R
= 15 V
= –15 V
= 10 kΩ
= 25°C
CC+
CC–
L
±16
±14
T
A
±12
±10
40
±8
±6
±4
20
10
±2
0
100
1k
10k
100k
1M
0
2
4
6
8
10 12 14 16 18 20
V
CC±
– Supply Voltage – V
f – Frequency – Hz
Figure 6
Figure 7
OPEN-LOOP LARGE-SIGNAL DIFFERENTIAL
VOLTAGE AMPLIFICATION
vs
FREQUENCY
110
V
V
V
R
T
A
= 15 V
= –15 V
= ±10 V
= 2 kΩ
100
90
80
70
60
CC+
CC–
O
L
= 25°C
50
40
30
20
10
0
–10
1
10
100
1k
10k 100k
1M
10M
f – Frequency – Hz
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
µA741, µA741Y
GENERAL-PURPOSE OPERATIONAL AMPLIFIERS
SLOS094B – NOVEMBER 1970 – REVISED SEPTEMBER 2000
TYPICAL CHARACTERISTICS
COMMON-MODE REJECTION RATIO
OUTPUT VOLTAGE
vs
vs
FREQUENCY
ELAPSED TIME
100
90
80
70
60
50
40
30
20
28
24
20
16
12
V
V
B
= 15 V
= –15 V
= 10 kΩ
= 25°C
CC+
CC–
S
T
A
90%
8
4
0
V
V
= 15 V
= –15 V
= 2 kΩ
= 100 pF
CC+
CC–
L
L
10%
R
C
T
10
0
t
= 25°C
r
A
–4
1
100
10k
1M
100M
0
0.5
1
1.5
2
2.5
f – Frequency – Hz
t – Time − µs
Figure 8
Figure 9
VOLTAGE-FOLLOWER
LARGE-SIGNAL PULSE RESPONSE
8
6
V
V
R
C
T
A
= 15 V
= –15 V
= 2 kΩ
= 100 pF
CC+
CC–
L
L
4
= 25°C
V
O
2
0
V
I
–2
–4
–6
–8
0
10 20 30 40 50 60 70 80 90
t – Time – µs
Figure 10
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
PACKAGING INFORMATION
Orderable Device
UA741CD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UA741CDE4
UA741CDG4
UA741CDR
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UA741CDRE4
UA741CDRG4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UA741CJG
UA741CJG4
UA741CP
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
PDIP
JG
JG
P
8
8
8
TBD
TBD
Call TI
Call TI
Call TI
Call TI
50
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
UA741CPE4
UA741CPSR
ACTIVE
ACTIVE
ACTIVE
PDIP
SO
P
8
8
8
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
PS
PS
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UA741CPSRE4
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
UA741MFKB
UA741MJ
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
LCCC
CDIP
CDIP
CDIP
CDIP
FK
J
20
14
14
8
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
UA741MJB
UA741MJG
UA741MJGB
J
JG
JG
8
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.430 (10,92)
MAX
0.010 (0,25)
M
0.015 (0,38)
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete. All products are sold
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent
TI deems necessary to support this warranty. Except where mandated by government requirements, testing
of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible
for their products and applications using TI components. To minimize the risks associated with customer
products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,
or process in which TI products or services are used. Information published by TI regarding third-party
products or services does not constitute a license from TI to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or
other intellectual property of the third party, or a license from TI under the patents or other intellectual
property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not
responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service
and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Amplifiers
Data Converters
DSP
Interface
Applications
Audio
Automotive
Broadband
Digital Control
Military
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Logic
Power Mgmt
Microcontrollers
Low Power Wireless
power.ti.com
microcontroller.ti.com
www.ti.com/lpw
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明