UA79M08 [TI]

NEGATIVE-VOLTAGE REGULATORS;
UA79M08
型号: UA79M08
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

NEGATIVE-VOLTAGE REGULATORS

文件: 总13页 (文件大小:622K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
µ
ꢀꢁ ꢂ ꢃ ꢄ ꢄ ꢅ ꢆꢇ ꢈ ꢆꢅ  
ꢉꢆꢊ ꢀꢋ ꢈꢌ ꢆꢍꢌꢎ ꢏꢋꢀꢊ ꢆ ꢇꢆꢊ ꢐ ꢏꢀꢋꢎ ꢇꢅ  
SLVS060K − JUNE 1976 − REVISED APRIL 2005  
D
D
D
3-Terminal Regulators  
D
D
D
High Power-Dissipation Capability  
Output Current Up To 500 mA  
No External Components  
Internal Short-Circuit Current Limiting  
Output Transistor Safe-Area Compensation  
µA79M05, µA79M08 . . . KTP PACKAGE  
µA79M05 . . . KC (TO-220) PACKAGE  
(TOP VIEW)  
(TOP VIEW)  
OUTPUT  
INPUT  
OUTPUT  
INPUT  
COMMON  
COMMON  
µA79M05 . . . KCS (TO-220) PACKAGE  
(TOP VIEW)  
OUTPUT  
INPUT  
COMMON  
description/ordering information  
This series of fixed-negative-voltage integrated-circuit voltage regulators is designed to complement the  
µA78M00 series in a wide range of applications. These applications include on-card regulation for elimination  
of noise and distribution problems associated with single-point regulation. Each of these regulators delivers up  
to 500 mA of output current. The internal current-limiting and thermal-shutdown features of these regulators  
essentially make them immune to overload. In addition to use as fixed-voltage regulators, these devices can  
be used with external components to obtain adjustable output voltages and currents, and also as the  
power-pass element in precision regulators.  
ORDERING INFORMATION  
V
O
(NOM)  
(V)  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
J
PowerFLEX(KTP)  
TO-220 (KC)  
Reel of 3000  
Tube of 50  
Tube of 20  
Reel of 3000  
µA79M05CKTPR  
µA79M05CKC  
µA79M05C  
−5  
−8  
0°C to 125°C  
µA79M05C  
µA79M08C  
TO-220, short shoulder (KCS)  
PowerFLEX (KTP)  
µA79M05CKCS  
µA79M08CKTPR  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerFLEX is a trademark of Texas Instruments.  
ꢋꢟ  
Copyright 2005, Texas Instruments Incorporated  
ꢛ ꢟ ꢜ ꢛꢔ ꢕꢩ ꢗꢖ ꢚ ꢢꢢ ꢠꢚ ꢘ ꢚ ꢙ ꢟ ꢛ ꢟ ꢘ ꢜ ꢤ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
µꢀꢁ ꢂꢃ ꢄ ꢄ ꢅꢆ ꢇꢈ ꢆ ꢅ  
ꢉꢆ ꢊ ꢀꢋ ꢈ ꢌꢆꢍ ꢌꢎꢏꢋꢀꢊ ꢆ ꢇꢆ ꢊ ꢐꢏꢀꢋꢎ ꢇꢅ  
SLVS060K − JUNE 1976 − REVISED APRIL 2005  
schematic  
COMMON  
4.5 kΩ  
to 6.3 kΩ  
1.7 kΩ  
to 18 kΩ  
OUTPUT  
0.1 Ω  
0.2 Ω  
INPUT  
Resistor values shown are nominal.  
absolute maximum ratings over virtual junction temperature range (unless otherwise noted)  
Input voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 V  
I
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
J
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C  
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
package thermal data (see Note 1)  
θ
JP  
PACKAGE  
BOARD  
θ
JC  
θ
JA  
PowerFLEX (KTP)  
High K, JESD 51-5  
19°C/W  
28°C/W  
1.4°C/W  
TO-220 (KC/KCS)  
High K, JESD 51-5  
17°C/W  
19°C/W  
3°C/W  
NOTE 1: Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable ambient  
JA  
J
A
temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.  
D
J
A
JA  
J
For packages with exposed thermal pads, such as QFN, PowerPAD, or PowerFLEX, θ is defined as the thermal resistance between the die  
JP  
junction and the bottom of the exposed pad.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
µ
ꢀꢁ ꢂ ꢃ ꢄ ꢄ ꢅ ꢆꢇ ꢈ ꢆꢅ  
ꢉꢆꢊ ꢀꢋ ꢈꢌ ꢆꢍꢌꢎ ꢏꢋꢀꢊ ꢆ ꢇꢆꢊ ꢐ ꢏꢀꢋꢎ ꢇꢅ  
SLVS060K − JUNE 1976 − REVISED APRIL 2005  
recommended operating conditions  
MIN  
−7  
MAX  
−25  
−25  
500  
125  
UNIT  
µA79M05C  
µA79M08C  
V
Input voltage  
V
I
−10.5  
I
O
Output current  
mA  
T
J
Operating virtual junction temperature  
0
°C  
electrical characteristics at specified virtual junction temperature, V = −10 V, I = 350 mA, T = 25°C  
I
O
J
(unless otherwise noted)  
µA79M05C  
PARAMETER  
UNIT  
V
TEST CONDITIONS  
MIN  
−4.8  
TYP  
MAX  
−5  
−5.2  
−5.25  
50  
Output voltage  
V = −7 V to −25 V,  
I
O
= 5 mA to 350 mA  
I
T = 0°C to 125°C  
−4.75  
J
V = −7 V to −25 V  
I
7
3
Input voltage regulation  
Ripple rejection  
mV  
dB  
V = −8 V to −18 V  
I
30  
I
I
= 100 mA,  
= 300 mA  
T = 0°C to 125°C  
J
50  
54  
V = −8 V to −18 V,  
I
f = 120 Hz  
O
60  
75  
50  
O
I
I
= 5 mA to 500 mA  
= 5 mA to 350 mA  
100  
O
Output voltage regulation  
mV  
O
Temperature coefficient  
of output voltage  
I
O
= 5 mA,  
T = 0°C to 125°C  
J
−0.4  
mV/°C  
Output noise voltage  
Dropout voltage  
Bias current  
f = 10 Hz to 100 kHz  
125  
1.1  
1
µV  
V
2
0.4  
0.4  
mA  
V = −8 V to −18 V,  
I
T = 0°C to 125°C  
J
Bias current change  
mA  
I
O
= 5 mA to 350 mA,  
T = 0°C to 125°C  
J
Short-circuit output current  
Peak output current  
V = −30 V  
I
140  
mA  
A
0.65  
Pulse-testing techniques maintain T as close to T as possible. Thermal effects must be taken into account separately. All characteristics are  
measured with a 2-µF capacitor across the input and a 1-µF capacitor across the output.  
J
A
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
µꢀꢁ ꢂꢃ ꢄ ꢄ ꢅꢆ ꢇꢈ ꢆ ꢅ  
ꢉꢆ ꢊ ꢀꢋ ꢈ ꢌꢆꢍ ꢌꢎꢏꢋꢀꢊ ꢆ ꢇꢆ ꢊ ꢐꢏꢀꢋꢎ ꢇꢅ  
SLVS060K − JUNE 1976 − REVISED APRIL 2005  
electrical characteristics at specified virtual junction temperature, V = −19 V, I = 350 mA, T = 25°C  
I
O
J
(unless otherwise noted)  
µA79M08C  
PARAMETER  
UNIT  
V
TEST CONDITIONS  
MIN  
−7.7  
−7.6  
TYP  
MAX  
−8  
−8.3  
−8.4  
80  
Output voltage  
V = −10.5 V to −25 V,  
I
O
= 5 mA to 350 mA  
I
T = 0°C to 125°C  
J
V = −10.5 V to −25 V  
I
8
4
Input voltage regulation  
Ripple rejection  
mV  
dB  
V = −11 V to −21 V  
I
50  
I
I
= 100 mA,  
= 300 mA  
T = 0°C to 125°C  
J
50  
54  
V = −11.5 V to −21.5 V,  
I
f = 120 Hz  
O
59  
90  
60  
O
I
I
= 5 mA to 500 mA  
= 5 mA to 350 mA  
160  
O
Output voltage regulation  
mV  
O
Temperature coefficient  
of output voltage  
I
O
= 5 mA,  
T = 0°C to 125°C  
J
−0.6  
mV/°C  
Output noise voltage  
Dropout voltage  
Bias current  
f = 10 Hz to 100 kHz  
= 5 mA  
200  
1.1  
1
µV  
V
I
O
2
0.4  
0.4  
mA  
V = −10.5 V to −25 V,  
I
T = 0°C to 125°C  
J
Bias current change  
mA  
I
O
= 5 mA to 350 mA,  
T = 0°C to 125°C  
J
Short-circuit output current  
Peak output current  
V = −30 V  
I
140  
mA  
A
0.65  
Pulse-testing techniques maintain T as close to T as possible. Thermal effects must be taken into account separately. All characteristics are  
measured with a 2-µF capacitor across the input and a 1-µF capacitor across the output.  
J
A
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Mar-2008  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
7704001HA  
UA79M05CKC  
UA79M05CKCE3  
UA79M05CKCS  
OBSOLETE  
CFP  
U
10  
3
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
CU SN  
Call TI  
OBSOLETE TO-220  
OBSOLETE TO-220  
KC  
Call TI  
KC  
3
Call TI  
ACTIVE  
TO-220  
KCS  
3
50  
50  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
UA79M05CKCSE3  
ACTIVE  
TO-220  
KCS  
3
Pb-Free  
(RoHS)  
CU SN  
N / A for Pkg Type  
UA79M05CKTPR  
UA79M05CKTPRG3  
UA79M05CKVURG3  
OBSOLETE  
OBSOLETE  
ACTIVE  
PFM  
PFM  
PFM  
KTP  
KTP  
KVU  
2
2
3
TBD  
TBD  
Call TI  
Call TI  
CU SN  
Call TI  
Call TI  
2500 Green (RoHS &  
no Sb/Br)  
Level-3-260C-168 HR  
UA79M05MUB  
UA79M08CKC  
OBSOLETE  
CFP  
U
10  
3
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
CU SN  
Call TI  
OBSOLETE TO-220  
KC  
Call TI  
UA79M08CKTPR  
UA79M08CKTPRG3  
UA79M08CKVURG3  
OBSOLETE  
OBSOLETE  
ACTIVE  
PFM  
PFM  
PFM  
KTP  
KTP  
KVU  
2
Call TI  
2
Call TI  
3
2500 Green (RoHS &  
no Sb/Br)  
Level-3-260C-168 HR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
UA79M05CKVURG3  
UA79M08CKVURG3  
PFM  
PFM  
KVU  
KVU  
3
3
2500  
2500  
330.0  
330.0  
16.4  
16.4  
6.9  
6.9  
10.5  
10.5  
2.7  
2.7  
8.0  
8.0  
16.0  
16.0  
Q2  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
UA79M05CKVURG3  
UA79M08CKVURG3  
PFM  
PFM  
KVU  
KVU  
3
3
2500  
2500  
340.0  
340.0  
340.0  
340.0  
38.0  
38.0  
Pack Materials-Page 2  
MECHANICAL DATA  
MPSF001F – JANUARY 1996 – REVISED JANUARY 2002  
KTP (R-PSFM-G2)  
PowerFLEX PLASTIC FLANGE-MOUNT PACKAGE  
0.080 (2,03)  
0.070 (1,78)  
0.243 (6,17)  
0.233 (5,91)  
0.228 (5,79)  
0.218 (5,54)  
0.050 (1,27)  
0.040 (1,02)  
0.130 (3,30) NOM  
0.010 (0,25) NOM  
Thermal Tab  
(See Note C)  
0.215 (5,46)  
0.287 (7,29)  
0.277 (7,03)  
NOM  
0.247 (6,27)  
0.237 (6,02)  
0.381 (9,68)  
0.371 (9,42)  
0.100 (2,54)  
0.090 (2,29)  
0.032 (0,81) MAX  
Seating Plane  
0.004 (0,10)  
0.090 (2,29)  
0.180 (4,57)  
0.005 (0,13)  
0.001 (0,02)  
0.031 (0,79)  
0.025 (0,63)  
0.010 (0,25)  
M
0.047 (1,19)  
0.037 (0,94)  
0.010 (0,25) NOM  
Gage Plane  
0.010 (0,25)  
2°ā6°  
4073388/M 01/02  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. The center lead is in electrical contact with the thermal tab.  
D. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15).  
E. Falls within JEDEC TO-252 variation AC.  
PowerFLEX is a trademark of Texas Instruments.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2008, Texas Instruments Incorporated  

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