UC1708_08 [TI]
DUAL NON-INVERTING POWER DRIVER; 双非反相电源驱动器
| 型号： | UC1708_08 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL NON-INVERTING POWER DRIVER |
| 文件： | 总16页 (文件大小：579K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UC1708
UC2708
UC3708
www.ti.com
SLUS171C–MARCH 1997–REVISED SEPTEMBER 2007
DUAL NON-INVERTING POWER DRIVER
1
FEATURES
•
•
•
•
•
•
High-Speed, Power MOSFET Compatible
Efficient High Frequency Operation
Low Cross-Conduction Current Spike
Enable and Shutdown Functions
Wide Input Voltage Range
•
3.0A Peak Current Totem Pole Output
•
•
•
•
5 to 35V Operation
25ns Rise and Fall Times
25ns Propagation Delays
Thermal Shutdown and Under-Voltage
Protection
ESD Protection to 2kV
DESCRIPTION
The UC1708 family of power drivers is made with a high-speed, high-voltage, Schottky process to interface
control functions and high-power switching devices – particularly power MOSFETs. Operating over a 5 V to 35 V
supply range, these devices contain two independent channels. The A and B inputs are compatible with TTL and
CMOS logic families, but can withstand input voltages as high as VIN. Each output can source or sink up to 3 A
as long as power dissipation limits are not exceeded.
Although each output can be activated independently with its own inputs, they can be forced low in common
through the action of either a digital high signal at the Shutdown terminal or by forcing the Enable terminal low.
The Shutdown terminal will only force the outputs low, it will not effect the behavior of the rest of the device. The
Enable terminal effectively places the device in under-voltage lockout, reducing power consumption by as much
as 90%. During under-voltage and disable (Enable terminal forced low) conditions, the outputs are held in a
self-biasing, low-voltage, state.
The UC3708 and UC2708 are available in plastic 8-pin MINI DIP and 16-pin bat-wing DIP packages for
commercial operation over a 0°C to 70°C temperature range and industrial temperature range of –25°C to 85°C
respectively. For operation over a –55°C to 125°C temperature range, the UC1708 is available in hermetically
sealed 8-pin MINI CDIP, 16 pin CDIP and 20 pin CLCC packages. Surface mount devices are also available.
BLOCK DIAGRAM
VIN
5.6 V
Reg
Internal
Bias
Enable
Logic Gnd
Output A
Thermal
Shutdown
Pwr Gnd A
Input A
Output B
Input B
Shutdown
Pwr Gnd B
NOTE: Shutdown feature is not available in J or N packages only.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1997–2007, Texas Instruments Incorporated
UC1708
UC2708
UC3708
www.ti.com
SLUS171C–MARCH 1997–REVISED SEPTEMBER 2007
CONNECTION DIAGRAMS
DIL-8 (Top View)
J Or N Package
SOIC-16 (Top View)
DW Package
Pwr Gnd A
NC
Enable
Input A
NC
Output A
VIN
Input A
Output A
Enable
Gnd
VIN
Logic Gnd
NC
Input B
Output B
NC
NC
VIN
Shutdown
Input B
NC
Output B
Pwr Gnd B
DIL-16 (Top View)
JE Or NE Package
CLCC-20 (Top View)
L Package
NC
Input A
Pwr Gnd A
Output A
VIN
3
2
1
20 19
VIN
NC
NC
18
Enable
ENABLE
4
5
17
16
15
14
LOGIC GND
Logic Gnd
Logic Gnd
Shutdown
Input B
Logic Gnd
NC
NC
6
7
8
Logic Gnd
VIN
NC
VIN
SHUTDOWN
Output B
9
10 11 12 13
NC
Pwr Gnd B
Note: In JE package, Pin 4 is Logic Ground.
Pins 5, 12, and 13 are no connect.
2
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Copyright © 1997–2007, Texas Instruments Incorporated
Product Folder Link(s): UC1708 UC2708 UC3708
UC1708
UC2708
UC3708
www.ti.com
SLUS171C–MARCH 1997–REVISED SEPTEMBER 2007
ABSOLUTE MAXIMUM RATINGS(1)
VALUE
UNIT
V
Supply Voltage, VIN
35
Steady-State
0.5
3
A
Output Current (Each Output, Source or Sink)
Peak Transient
A
Ouput Voltage
–0.3 to (VIN + 0.3)
–0.3 to 6.2
–0.3 to (VIN + 0.3)
150
V
Enable and Shutdown Inputs
A and B Inputs
Operating Junction Temperature(2)
Storage Temperature Range
Lead Temperature (Soldering, 10 Seconds)
V
V
°C
°C
°C
–65 to 150
300
(1) All voltages are with respect to Logic Gnd pin. All currents are positive into, negative out of, device terminals.r
(2) Consult Unitrode Integrated Circuits databook for information regarding thermal specifications and limitations of packages.
ELECTRICAL CHARACTERISTICS
Unless otherwise stated, VIN=10V to 35V, and these specifications apply for: –55°C<TA<125°C for the UC1708,
–25°C<TA<85°C for the UC2708, and 0°C<TA<70°C for the UC3708, TA = TJ
PARAMETER
TEST CONDITIONS
Outputs low
MIN
TYP
18
14
1
MAX
26
UNIT
VIN
Supply current
Outputs high
Enable = 0 V
18
mA
4
A, B and shutdown inputs low level
A, B and shutdown inputs high level
A, B Input current low
0.8
V
V
2.0
–1
VA,B = 0.4V
–0.6
mA
A
A, B Input current high
VA,B = 2.4V
–200
50
200
100
500
1.5
200
200
3.6
3.4
2.0
2.5
0.5
2.5
A, B Input leakage current high
Shutdown input current low
VA,B = 35.3V
A
VSHUTDOWN = 0.4V
VSHUTDOWN = 2.4V
VSHUTDOWN = 6.2V
VENABLE = 0V
20
170
A
A
Shutdown input current high
0.6
mA
A
Enable input current low
Enable input current high
Enable threshold rising
Enable threshold falling
–600
1.0
–460
VENABLE = 6.2V
A
2.8
2.4
V
V
VIN
–
IOUT = –50mA
IOUT = –500mA
IOUT = 50mA
IOUT = 500mA
V
Output High Saturation
VOUT
V
V
VOUT
Output Low Saturation
Thermal Shutdown
V
155
°C
Copyright © 1997–2007, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): UC1708 UC2708 UC3708
UC1708
UC2708
UC3708
www.ti.com
SLUS171C–MARCH 1997–REVISED SEPTEMBER 2007
SWITCHING CHARACTERISTICS (see Figure 1)
(VIN = 20V, delays measured to 10% output change.)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
FROM A,B INPUT TO OUTPUT:
CL = 0pF
25
25
25
25
25
55
25
25
40
40
25
25
35
15
25
40
40
45
40
50
45
75
80
50
85
55
40
45
50
20
45
55
ns
ns
UC1708
CL = 1000pF
Rise Time Delay (TPLH)
10% to 90% Rise (TTLH)
UC2708/UC3708
UC1708
CL = 2200pF
CL = 0pF
ns
ns
ns
UC2708/UC3708
UC1708
CL = 1000pF(1)
UC2708/UC3708
UC1708
CL = 2200pF
ns
ns
UC2708/UC3708
CL = 0pF
Fall Time Delay (TPHL)
90% to 10% Fall (TTHL)
CL = 1000pF(1)
CL = 2200pF
CL = 0pF
CL = 1000pF(1)
ns
CL = 2200pF
(1) These parameters, specified at 1000pF, although ensured over recommended operating conditions, are not tested in production.
SWITCHING CHARACTERISTICS (see Figure 1)
(VIN = 20V, delays measured to 10% output change.)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
FROM SHUTDOWN INPUT TO OUTPUT:
CL = 0pF
25
30
30
35
35
50
25
25
40
40
25
30
35
25
25
40
23
38
75
80
75
85
75
75
80
50
85
55
45
50
55
20
45
55
25
45
ns
ns
UC1708
CL = 1000pF(1)
Rise Time Delay (TPLH)
UC2708/UC3708
UC1708
CL = 2200pF
CL = 0pF
ns
ns
ns
UC2708/UC3708
UC1708
CL = 1000pF(1)
10% to 90% Rise (TTLH)
Fall Time Delay (TPHL)
UC2708/UC3708
UC1708
CL = 2200pF
ns
ns
UC2708/UC3708
CL = 0pF
CL = 1000pF(1)
CL = 2200pF
CL = 0pF
90% to 10% Fall (TTHL)
Total Supply Current
CL = 1000pF(1)
ns
CL = 2200pF
F = 200kHz, 50% duty cycle, both channels; CL = 0pF
F = 200kHz, 50% duty cycle, both channels; CL = 2200pF
mA
(1) These parameters, specified at 1000pF, although ensured over recommended operating conditions, are not tested in production.
4
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Copyright © 1997–2007, Texas Instruments Incorporated
Product Folder Link(s): UC1708 UC2708 UC3708
UC1708
UC2708
UC3708
www.ti.com
SLUS171C–MARCH 1997–REVISED SEPTEMBER 2007
20 V
4.3 V
INPUT
Input
50%
50%
47 mF
10 mF
0 V
12 V
MPF
6660
20 V
UC1708
90%
10%
90%
AC Input
LH0063
Output
47 W
50 W
OUTPUT
0 V
PWR
GND
10%
50 W
C
L
200 kHz
tr ³0.5 V/RS
tf ³0.5/RS
Duty Cycle - 50%
TP
HL
TP
LH
TT
HL
TT
LH
Logic
Gnd
Figure 1. AC Test Circuit and Switching Time Waveforms
V
Enable
IN
5.6 V
To A/B
Output
8 kW
450 mA
2.5 pF
A/B
Input
Shutdown
5.6 V
Internal
Bias
10 kW
500 W
Under
Voltage
Lockout
10 kW
5.6 V
To A/B
Output
5.6 V
NOTE: Shutdown feature available only in JE, NE or DW Packages.
Figure 2. Equivalent Input Circuits
Copyright © 1997–2007, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): UC1708 UC2708 UC3708
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
CDIP
LCCC
CDIP
CDIP
CDIP
CDIP
CDIP
CDIP
LCCC
Drawing
FK
J
5962-0051401Q2A
5962-0051401QEA
5962-0051401QPA
5962-0051401V2A
5962-0051401VEA
5962-0051401VPA
UC1708J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
20
16
8
1
1
1
1
1
1
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE N / A for Pkg Type
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
JG
FK
J
20
16
8
POST-PLATE N / A for Pkg Type
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
JG
JG
JG
J
A42
8
A42 SNPB
A42 SNPB
A42 SNPB
A42 SNPB
UC1708J883B
UC1708JE
8
16
16
20
UC1708JE883B
UC1708L883B
UC2708D
J
FK
UTR
DW
POST-PLATE N / A for Pkg Type
Call TI Call TI
UC2708DW
SOIC
SOIC
SOIC
SOIC
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC2708DWG4
UC2708DWTR
ACTIVE
ACTIVE
ACTIVE
DW
DW
DW
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC2708DWTRG4
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC2708J
UC2708JE
UC2708N
OBSOLETE
OBSOLETE
ACTIVE
UTR
UTR
P
TBD
TBD
Call TI
Call TI
Call TI
Call TI
PDIP
PDIP
PDIP
PDIP
8
16
16
8
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UC2708NE
UC2708NEG4
UC2708NG4
ACTIVE
ACTIVE
ACTIVE
N
N
P
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UC2708Q
OBSOLETE
ACTIVE
UTR
DW
TBD
Call TI
Call TI
UC3708DW
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
PDIP
PDIP
16
16
16
16
8
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC3708DWG4
UC3708DWTR
UC3708DWTRG4
UC3708N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DW
DW
DW
P
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UC3708NE
N
16
16
8
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UC3708NEG4
UC3708NG4
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
P
50 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2008
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
UC3708Q
OBSOLETE
UTR
TBD
Call TI
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
UC2708DWTR
UC3708DWTR
SOIC
SOIC
DW
DW
16
16
2000
2000
330.0
330.0
16.4
16.4
10.85
10.85
10.8
10.8
2.7
2.7
12.0
12.0
16.0
16.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
29-Jul-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
UC2708DWTR
UC3708DWTR
SOIC
SOIC
DW
DW
16
16
2000
2000
346.0
346.0
346.0
346.0
33.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.430 (10,92)
MAX
0.010 (0,25)
M
0.015 (0,38)
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
Logic
Military
Power Mgmt
Microcontrollers
RFID
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
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