UC1725_12 [TI]

Isolated High Side FET Driver;
UC1725_12
型号: UC1725_12
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Isolated High Side FET Driver

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UC1725  
UC2725  
UC3725  
Isolated High Side FET Driver  
FEATURES  
DESCRIPTION  
Receives Both Power and Signal Across The UC1725 and its companion chip, the UC1724, provide all the nec-  
the Isolation Boundary  
essary features to drive an isolated MOSFET transistor from a TTL in-  
put signal. A unique modulation scheme is used to transmit both power  
and signals across an isolation boundary with a minimum of external  
components.  
9 to 15 Volt High Level Gate Drive  
Under-voltage Lockout  
Protection circuitry, including under-voltage lockout, over-current shut-  
down, and gate voltage clamping provide fault protection for the MOS-  
FET. High level gate drive is guaranteed to be greater than 9 volts and  
less than 15 volts under all conditions.  
Programmable Over-current Shutdown  
and Restart  
Output Enable Function  
Uses include isolated off-line full bridge and half bridge drives for driv-  
ing motors, switches, and any other load requiring full electrical isola-  
tion.  
The UC1725 is characterized for operation over the full military tem-  
perature range of -55°C to +125°C while the UC2725 and UC3725 are  
characterized for -25°C to +85°C and 0°C to +70°C respectively.  
BLOCK DIAGRAM  
UDG-92051-1  
1/94  
UC1725  
UC2725  
UC3725  
CONNECTION DIAGRAMS  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage (pin 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V  
Power inputs (pins 7 & 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V  
Output current, source or sink (pin 2)  
DC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5A  
Pulse (0.5 us) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0A  
Enable and Current limit inputs (pins 4 & 6). . . . . . . . -0.3 to 6V  
Power Dissipation at TA 25°C (DIL-8) . . . . . . . . . . . . . . . . 1W  
Power Dissipation at TA 25°C (SO-14) . . . . . . . . . . . . 725mW  
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300°C  
PACKAGE PIN FUNCTION  
PLCC-20 (Top View)  
Q Package  
FUNCTION  
PIN  
N/C  
1
ISENSE  
N/C  
Timing  
Enable  
N/C  
Input A  
N/C  
Input B  
Gnd  
2
3-5  
6
7
8-9  
11  
12-14  
15  
16  
Note 1: Unless otherwise indicated, voltages are referenced to  
ground and currents are positive into, negative out of, the speci-  
fied terminals (pin numbers refer to DIL-8 package).  
Note 2: See Unitrode Integrated Circuits databook for  
information regarding thermal specifications and limitations of  
packages.  
VCC  
17  
N/C  
Output  
18-19  
20  
DIL-8 (Top View)  
J Or N Package  
SOIC-16 (Top View)  
DW Package  
DIL-16 (Top View)  
JE Or NE Package  
(Unless otherwise stated, these specifications apply for -55°CTA+125°C for  
UC1725; -25°CTA+85°C for UC2725; 0°CTA+70°C for UC3725; VCC (pin 3) =  
0 to 15V, RT=10k, CT=2.2nf, TA =TJ, pin numbers refer to DIL-8 package.)  
ELECTRICAL CHARACTERISTICS:  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP MAX UNITS  
POWER INPUT SECTION (PINS 7 & 8)  
Forward Diode Drop, Schottky Rectifier  
IF = 50ma  
.55  
1.1  
.7  
V
V
IF = 500ma  
1.5  
CURRENT LIMIT SECTION (PIN 4)  
Input bias current  
VPIN4 = OV  
-1  
-10  
0.6  
µA  
V
Threshold voltage  
0.4  
0.5  
100  
Delay to outputs  
VPIN4 = 0 to 1V  
250  
ns  
TIMING SECTION (PIN 5)  
Output Off Time  
27  
6.3  
1.9  
30  
7.0  
2.0  
33  
7.7  
2.3  
µs  
V
Upper Mono Threshold  
Lower Mono Threshold  
HYSTERESIS AMPLIFIER (PINS 7 & 8)  
Input Open Circuit Voltage  
Input Impedance  
V
Inputs (pins 7 & 8), Open Circuited, TA= 25°C  
TA = 25°C  
7.0  
23  
Vcc/2  
28  
8.0  
33  
V
kΩ  
V
Hysteresis  
26.5 2 Vcc 30.5  
*
Delay to Outputs  
VPIN7 - VPIN8 = VCC + 1V  
100  
300  
ns  
2
UC1725  
UC2725  
UC3725  
(Unless otherwise stated, these specifications apply for -55°CTA+125°C for UC1725;  
-25°CTA+85°C for UC2725; 0°CTA+70°C for UC3725; VCC (pin 3) = 0 to 15V, Rt=10k,  
CT=2.2nf, TA =TJ, pin numbers refer to DIL-8 package.)  
ELECTRICAL  
CHARACTERISTICS (cont.)  
PARAMETER  
ENABLE SECTION (PIN 6)  
High Level Input Voltage  
Low Level Input Voltage  
Input Bias Current  
TEST CONDITIONS  
MIN  
TYP MAX UNITS  
2.1  
1.4  
1.4  
V
V
.8  
-250  
-500  
µA  
OUTPUT SECTION  
Output Low Level  
IOUT = 20mA  
IOUT = 200mA  
IOUT = -20mA  
0.35  
0.6  
0.5  
2.5  
V
V
Output High Level  
13  
12  
13.5  
13.4  
14  
V
IOUT = -200mA  
VCC = 30V, Iout = -20mA  
CT = 1nf  
V
15  
60  
V
Rise/Fall Time  
30  
ns  
UNDER VOLTAGE LOCKOUT  
UVLO Low Saturation  
Start-up Threshold  
20mA, VCC = 8V  
0.8  
12  
1.5  
V
V
V
11.2  
.75  
12.6  
1.12  
Threshold Hysteresis  
TOTAL STANDBY CURRENT  
Supply Current  
1.0  
12  
16  
ma  
APPLICATION AND OPERATION INFORMATION  
INPUTS: Figure 1 shows the rectification and detection  
scheme used in the UC1725 to derive both power and  
signal information from the input waveform. Vcc is gener-  
ated by peak detecting the input signal via the internal  
bridge rectifier and storing on a small external capacitor,  
C1. Note that this capacitor is also used to bypass high  
pulse currents in the output stage, and therefore should  
be placed direclty between pins 1 and 3 using minimal  
lead lengths.  
add a damping resistor across the transformer secondary  
to minimize ringing and eliminate false triggering of the  
hysteresis amplifier as shown in Figure 3.  
UDG-92048  
FIGURE 2 - Input Waveform (DIL-8 Pin 7 - Pin 8)  
UDG-92047  
FIGURE 1 - Input Stage  
Signal detection is performed by the internal hysteresis  
comparator which senses the polarity of the input signal  
as shown in Figure 2. This is accomplished by setting  
(resetting) the comparator only if the input signal ex-  
ceeds Vcc (-Vcc). In some cases it may be necessary to  
UDG-92049  
FIGURE 3 - Signal Detection  
3
UC1725  
UC2725  
UC3725  
capacitor and resistor as shown in Figure 4. This, in turn,  
controls the output off time according to the formula:  
TOFF= 1.28 RC.  
If current limit feature is not required, simply ground pin 4  
and leave pin 5 open.  
OUTPUT: Gate drive to the power FET is provided by a  
totem pole output stage capable of sourcing and sinking  
currents in excess of 1 amp. The undervoltage lockout  
circuit guarantees that the high level output will never be  
less than 9 volts. In addition, during undervoltage lock-  
out, the output stage will actively sink current to eliminate  
the need for an external gate to source resistor. High  
level output is also clamped to 15 volts. Under high ca-  
pacitive loading however, the output may overshoot 2 to  
3 volts, due to the drivers’ inabitlity to switch from full to  
zero output current instantaneously. In a practical circuit  
this is not normally a concern. A few ohms of series gate  
resistance is normally required to prevent parasitic oscil-  
lations, and will also eliminate overshoot at the gate.  
UDG-92050  
FIGURE 4 - Current Limit  
CURRENT LIMIT AND TIMING: Current sensing and  
shutdown can be implemented directly at the output us-  
ing the scheme shown in Figure 4. Alternatively, a current  
transformer can be used in place of RSENSE. A small RC  
filter in series with the input (pin 4) is generally needed to  
eliminate the leading edge current spike caused by  
parasitic circuit capacitances being charged during turn  
on. Due to the speed of the current sense circuit, it is  
very important to ground CF directly to Gnd as shown to  
eliminate false triggering of the one shot caused by  
ground drops.  
ENABLE: An enable pin is provided as a fast, digital in-  
put that can be used in a number of applications to di-  
rectly switch the output. Figure 6 shows a simple means  
of providing a fast, high voltage translation by using a  
small signal, high voltage transistor in a cascode configu-  
ration. Note that the UC1725 is still used to provide  
power, drive and protection circuitry for the power FET.  
One shot timing is easily programmed using an external  
UDG-92052  
UDG-92053  
FIGURE 6 - Using Enable Pin as a High Speed Input  
Path  
FIGURE 5 - Output Circuit  
UNITRODE INTEGRATED CIRCUITS  
7 CONTINENTAL BLVD. MERRIMACK, NH 03054  
TEL. (603) 424-2410 FAX (603) 424-3460  
4
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1999, Texas Instruments Incorporated  

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