UC1835J [TI]
High Efficiency Regulator Controller; 高效率稳压器控制器型号: | UC1835J |
厂家: | TEXAS INSTRUMENTS |
描述: | High Efficiency Regulator Controller |
文件: | 总10页 (文件大小:735K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
UC1835 UC1836
UC2835 UC2836
UC3835 UC3836
High Efficiency Regulator Controller
DESCRIPTION
FEATURES
The UC1835/6 families of linear controllers are optimized for the de-
sign of low cost, low dropout, linear regulators. Using an external pass
element, dropout voltages of less than 0.5V are readily obtained.
These devices contain a high gain error amplifier, a 250mA output
driver, and a precision reference. In addition, current sense with fold-
back provides for a 2.5A peak output current dropping to less than
0.5A at short circuit.
•
Complete Control for a High Current,
Low Dropout, Linear Regulator
•
•
Fixed 5V or Adjustable Output Voltage
Accurate 2.5A Current Limiting with
Foldback
•
•
Internal Current Sense Resistor
These devices are available in fixed, 5V, (UC1835), or adjustable,
(UC1836), versions. In the fixed 5 volt version, the only external parts
required are an external pass element, an output capacitor, and a com-
pensation capacitor. On the adjustable version the output voltage can
be set anywhere from 2.5V to 35V with two external resistors.
Remote Sense for Improved Load
Regulation
•
•
External Shutdown
Under-Voltage Lockout and Reverse
Voltage Protection
Additional features of these devices include under-voltage lockout for
predictable start-up, thermal shutdown and short circuit current limiting
to protect the driver device. On the fixed voltage version, a reverse
voltage comparator minimizes reverse load current in the event of a
negative input to output differential.
•
•
Thermal Shutdown Protection
8 Pin Mini-Dip Package
(Surface Mount also Available)
BLOCK DIAGRAM
Note: Pin numbers refer to 8-Pin DIL Package
8/94
UC1835 UC1836
UC2835 UC2836
UC3835 UC3836
ABSOLUTE MAXIMUM RATINGS (Note 1)
Input Supply Voltage (+VIN) . . . . . . . . . . . . . . . . –1.0V to + 40V
Driver Output Current (Sink or Source) . . . . . . . . . . . . . 600mA
Driver Source to Sink Voltage . . . . . . . . . . . . . . . . . . . . . + 40V
Maximum Current Through Sense Resistor. . . . . . . . . . . . . . 4A
VOUT Sense Input Voltage . . . . . . . . . . . . . . . . . . –.3V to + 40V
Power Dissipation at TA = 25°C (Note 2) . . . . . . . . . . . 1000mW
Power Dissipation at TC = 25°C (Note 2). . . . . . . . . . . 2000mW
Operating Junction Temperature. . . . . . . . . . . -55°C to +150°C
Storage Temperature. . . . . . . . . . . . . . . . . . . . -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . 300°C
Note 1: Voltages are referenced to ground, (Pin 3). Currents are
positive into, negative out of, the specified terminals.
Consult Packaging Section of Databook for thermal
considerations and limitations of packages.
CONNECTION DIAGRAMS
DIL-8, SOIC-8 (TOP VIEW)
N or J Package, D Package
PLCC-20, LCC-20
(TOP VIEW)
Q, L Packages
PACKAGE PIN FUNCTION
FUNCTION
PIN
1
N/C
+VIN
+VIN
N/C
2
3
4
Compensation/
Shutdown
5
N/C
6
Ground
7
N/C
8
N/C
9
SOIC-16 (TOP VIEW)
DW Package
Driver Source
N/C
10
11
12
13
14
15
16
17
18
19
20
VOUT Sense
N/C
N/C
Driver Sink
N/C
Current Limit (-)
N/C
Sense Resistor Out
Sense Resistor Out
ELECTRICAL CHARACTERISTICS:
Unless otherwise stated, specifications hold for TA = 0°C to + 70°C for the
UC3835/6, –25°C to + 85°C for the UC2835/6, and –55°C to +125°C for the
UC1835/6, +VIN = 6V, Driver Source= 0V, Driver Sink = 5V, TA = TJ.
PARAMETER
Input Supply
TEST CONDITIONS
MIN. TYP. MAX. UNITS
Supply Current
+VIN = 6V
2.75
3.75
4.4
4.0
6.0
4.9
0.35
20
mA
mA
V
+VIN = 40V
UVLO Threshold
Threshold Hysteresis
Reverse Current
+VIN Low to High, VOUT Sense = 0V
3.9
0.1
V
+VIN = -1.0V, Driver Sink Open
6.0
mA
Regulating Voltage and Error Amplifier (UC1835 Family Only)
Regulating Level at VOUT Sense (VREG)
Driver Current = 10mA, TJ = 25°C
4.94
4.9
5.0
5.06
5.1
40
V
Over Temperature
V
Line Regulation
+VIN = 5.2V + 35V
15
6.0
125
1.3
200
mV
mV
µA
mS
µA
Load Regulation
Driver Current = 0 to 250mA
VOUT Sense = 5.0V
25
Bias Current at VOUT Sense
Error Amp Transconductance
Maximum Compensation Output Current
75
0.8
90
210
2.0
260
±100µA at Compensation/Shutdown Pin
Sink or Source, Driver Source Open
2
UC1835 UC1836
UC2835 UC2836
UC3835 UC3836
ELECTRICAL CHARACTERISTICS:
Unless otherwise stated, specifications hold for TA = 0°C to + 70°C for the
UC3835/6, –25°C to + 85°C for the UC2835/6, and –55°C to +125°C for the
UC1835/6, +VIN = 6V, Driver Source= 0V, Driver Sink = 5V, TA = TJ.
PARAMETER
TEST CONDITIONS
MIN. TYP. MAX. UNITS
Regulating Voltage and Error Amplifier (UC1836 Family Only)
Regulating Level at VOUT Sense (VREG)
Driver Current = 10mA, TJ = 25°C
2.47
2.45
2.5
2.53
2.55
20
V
Over Temperature
V
Line Regulation
+VIN = 5.2V to 35V
6.0
3.0
mV
mV
µA
mS
µA
Load Regulation
Driver Current = 0 to 250mA
VOUT Sense =2.5V
15
Bias Current at VOUT Sense
Error Amp Transconductance
Maximum Compensation Output Current
-1.0
0.8
90
-0.2
1.3
±100µA at Compensation/Shutdown Pin
Sink or Source, Driver Source Open
2.0
200
260
Driver
Maximum Current
250
140
500
2.0
mA
V
Saturation Voltage
Driver Current = 250mA, Driver Sink
Compensation/Shutdown=0.45V
In UVLO
2.8
300
10
Pull-Up Current at Driver Sink
Driver Sink Leakage
250
µA
µA
µA
°C
In Reverse Voltage (UC1835 Family Only)
10
Thermal Shutdown
165
Foldback Current Limit
Current Limit Levels at Sense Resistor Out
VOUT Sense = (0.99) VREG
VOUT Sense = (0.5) VREG
VOUT Sense = 0V
2.2
1.3
0.25
12
2.5
1.5
0.4
24
2.8
1.7
0.55
42
A
A
A
Current Limit Amp Tansconductance
±100µA at Compensation/Shutdown,
mS
VOUT Sense = (0.9) VREG
Limiting Voltage at Current Limit (-)
(Note 2)
VOUT Sense = (0.9) VREG
Volts Below +VIN, TJ = 25°C
80
100
40
140
mV
Sense Resistor Value (Note 3)
VOUT Sense = (0.9) VREG,
mΩ
IOUT = IA, TJ = 25°C
Note 2: This voltage has a positive temperature coefficient of approximately 3500ppm/°C.
Note 3: This resistance has a positive temperature coefficient of approximately 3500ppm/°C.
The total resistance from Pin 1 to Pin 8 will include an additional 60 to 100mΩ of package resistance.
APPLICATION AND OPERATION INFORMATION
UC 1835 − Typical configurations for a 2A,
UC1836 − Typical Configuration for a 2A,
Low Dropout 5V Regulator
Low Dropout Adjustable Regulator
Note 4: Suggested Pass devices are TIP 32B. (Dropout Voltage ≤0.75V) or, D45H, (Dropout Voltage ≤0.5V), or equivalents.
3
UC1835 UC1836
UC2835 UC2836
UC3835 UC3836
APPLICATION AND OPERATION INFORMATION (cont.)
UC1835/6 Foldback Current Limiting
UC3835/36 TYPICAL APPLICATIONS
Typical Output Current vs VIN and VOUT
Low Current Application
using the UC3836 internal drive transistor
of the UC3836 internal drive transistor
for PDISS = 0.5W (approx.)
High Current Application
using drive transistor Q2 to increase Q1 base drive
and reduce UC3836 power dissipation
Parallel Pass Transistors
can be added for high current or
high power dissipation applications
EQUATIONS:
R1 = 0.100 V/IOUT (MAX)
R2 = (VOUT - 2.5V/1mA)
R3 = ((VIN - VBE - VSAT)*BETA(min))/IOUT (max)
UNITRODE INTEGRATED CIRCUITS
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 • FAX 603-424-3460
4
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
5962-9065002PA
UC1835J
ACTIVE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
CDIP
CDIP
JG
JG
JG
FK
JG
JG
L
8
8
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
A42
Call TI
Call TI
UC1835J883B
UC1835L883B
UC1836J
CDIP
8
Call TI
LCCC
CDIP
20
8
Call TI
1
1
N / A for Pkg Type
N / A for Pkg Type
Call TI
UC1836J883B
UC1836L
ACTIVE
CDIP
8
A42
OBSOLETE
OBSOLETE
ACTIVE
TO/SOT
TO/SOT
SOIC
20
20
8
Call TI
Call TI
UC1836L883B
UC2835D
L
Call TI
D
75
75
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2835DG4
ACTIVE
SOIC
D
8
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
UC2835J
UC2835N
OBSOLETE
ACTIVE
CDIP
PDIP
JG
P
8
8
TBD
Call TI
Call TI
50
50
75
75
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
UC2835NG4
UC2836D
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
P
D
D
8
8
8
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
UC2836DG4
Green (RoHS
& no Sb/Br)
UC2836DW
UC3835N
OBSOLETE
ACTIVE
SOIC
PDIP
DW
P
16
8
TBD
Call TI
Call TI
50
50
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
UC3835NG4
UC3836D
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
SOIC
P
D
D
D
8
8
8
8
Green (RoHS
& no Sb/Br)
75
Green (RoHS
& no Sb/Br)
UC3836DG4
UC3836DTR
75
Green (RoHS
& no Sb/Br)
2500
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
Status (1)
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
UC3836DTRG4
UC3836N
SOIC
PDIP
PDIP
D
P
P
8
8
8
2500
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Green (RoHS
& no Sb/Br)
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
UC3836NG4
50
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1835, UC1836, UC3835, UC3836 :
Catalog: UC3835, UC3836
•
Military: UC1835, UC1836
•
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
5-Sep-2011
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
•
Military - QML certified for Military and Defense Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
UC3836DTR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 35.0
UC3836DTR
D
8
2500
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明