UC1847J883B [TI]

Current Mode PWM Controller; 电流模式PWM控制器
UC1847J883B
型号: UC1847J883B
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Current Mode PWM Controller
电流模式PWM控制器

开关 信息通信管理 控制器
文件: 总15页 (文件大小:3273K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Jul-2010  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
Purchase Samples  
Purchase Samples  
5962-86806012A  
5962-8680601EA  
UC1846J  
ACTIVE  
ACTIVE  
ACTIVE  
LCCC  
CDIP  
CDIP  
FK  
J
20  
16  
16  
1
1
1
TBD  
TBD  
TBD  
POST-PLATE N / A for Pkg Type  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
J
Contact TI Distributor  
or Sales Office  
UC1846J/80257  
UC1846J/80364  
UC1846J/80619  
UC1846J883B  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
CDIP  
CDIP  
J
J
J
J
16  
16  
16  
16  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
A42  
Call TI  
Samples Not Available  
Samples Not Available  
Samples Not Available  
Call TI  
Call TI  
1
1
N / A for Pkg Type  
Contact TI Distributor  
or Sales Office  
UC1846L883B  
ACTIVE  
LCCC  
FK  
20  
TBD  
POST-PLATE N / A for Pkg Type  
Contact TI Distributor  
or Sales Office  
UC1847J  
UC1847J883B  
UC1847L  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
ACTIVE  
CDIP  
CDIP  
LCCC  
LCCC  
SOIC  
J
J
16  
16  
20  
20  
16  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Replaced by UC1846J  
Replaced by UC1846J883B  
Samples Not Available  
FK  
FK  
DW  
UC1847L883B  
UC2846DW  
Replaced by UC1846L883B  
Request Free Samples  
40  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
UC2846DWG4  
UC2846DWTR  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
DW  
DW  
16  
16  
Green (RoHS  
& no Sb/Br)  
Request Free Samples  
Purchase Samples  
2000  
Green (RoHS  
& no Sb/Br)  
UC2846DWTR/81265  
UC2846DWTR/81265G4  
UC2846DWTRG4  
OBSOLETE  
OBSOLETE  
ACTIVE  
SOIC  
SOIC  
SOIC  
DW  
DW  
DW  
16  
16  
16  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Samples Not Available  
Samples Not Available  
Purchase Samples  
2000  
1
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
UC2846J  
UC2846N  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
PDIP  
PDIP  
J
16  
16  
16  
TBD  
A42 N / A for Pkg Type  
Contact TI Distributor  
or Sales Office  
N
N
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
Request Free Samples  
UC2846NG4  
25  
Green (RoHS  
& no Sb/Br)  
Request Free Samples  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Jul-2010  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
UC2846QTR  
UC2846QTRG3  
UC2847DW  
UC2847DWG4  
UC2847N  
PLCC  
PLCC  
SOIC  
SOIC  
PDIP  
PDIP  
SOIC  
SOIC  
SOIC  
SOIC  
CDIP  
PDIP  
PDIP  
PLCC  
PLCC  
PLCC  
PLCC  
SOIC  
FN  
FN  
DW  
DW  
N
20  
20  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
20  
20  
20  
20  
16  
1000  
1000  
40  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Purchase Samples  
Green (RoHS  
& no Sb/Br)  
CU SN  
Purchase Samples  
Purchase Samples  
Purchase Samples  
Purchase Samples  
Purchase Samples  
Request Free Samples  
Request Free Samples  
Purchase Samples  
Purchase Samples  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
40  
Green (RoHS  
& no Sb/Br)  
25  
Green (RoHS  
& no Sb/Br)  
UC2847NG4  
UC3846DW  
UC3846DWG4  
UC3846DWTR  
UC3846DWTRG4  
UC3846J  
N
25  
Green (RoHS  
& no Sb/Br)  
DW  
DW  
DW  
DW  
J
40  
Green (RoHS  
& no Sb/Br)  
40  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
1
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TBD  
A42  
N / A for Pkg Type  
Contact TI Distributor  
or Sales Office  
UC3846N  
N
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU N / A for Pkg Type  
CU NIPDAU N / A for Pkg Type  
Request Free Samples  
Request Free Samples  
Purchase Samples  
Purchase Samples  
Purchase Samples  
Purchase Samples  
Request Free Samples  
UC3846NG4  
UC3846Q  
N
25  
Green (RoHS  
& no Sb/Br)  
FN  
FN  
FN  
FN  
DW  
46  
Green (RoHS  
& no Sb/Br)  
CU SN  
CU SN  
CU SN  
CU SN  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
UC3846QG3  
UC3846QTR  
UC3846QTRG3  
UC3847DW  
46  
Green (RoHS  
& no Sb/Br)  
1000  
1000  
40  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Jul-2010  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
UC3847DWG4  
UC3847DWTR  
SOIC  
SOIC  
SOIC  
DW  
DW  
DW  
16  
16  
16  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
Request Free Samples  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
Purchase Samples  
Purchase Samples  
UC3847DWTRG4  
Green (RoHS  
& no Sb/Br)  
UC3847J  
UC3847N  
OBSOLETE  
ACTIVE  
CDIP  
PDIP  
J
16  
16  
TBD  
Call TI  
Call TI  
Samples Not Available  
Request Free Samples  
N
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU N / A for Pkg Type  
UC3847NG4  
ACTIVE  
PDIP  
N
16  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU N / A for Pkg Type  
Request Free Samples  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
23-Jul-2010  
OTHER QUALIFIED VERSIONS OF UC1846, UC1847, UC2846, UC2846M, UC3846, UC3846M, UC3847 :  
Catalog: UC3846, UC3847, UC2846, UC3846M, UC3846  
Enhanced Product: UC1846-EP, UC1846-EP  
Military: UC2846M, UC1846, UC1847  
Space: UC1846-SP, UC1846-SP  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Enhanced Product - Supports Defense, Aerospace and Medical Applications  
Military - QML certified for Military and Defense Applications  
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application  
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jul-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
UC2846DWTR  
UC2846QTR  
UC3846DWTR  
UC3846QTR  
SOIC  
PLCC  
SOIC  
PLCC  
DW  
FN  
16  
20  
16  
20  
2000  
1000  
2000  
1000  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
16.4  
10.85 10.8  
10.3 10.3  
10.85 10.8  
10.3 10.3  
2.7  
4.9  
2.7  
4.9  
12.0  
12.0  
12.0  
12.0  
16.0  
16.0  
16.0  
16.0  
Q1  
Q1  
Q1  
Q1  
DW  
FN  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
23-Jul-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
UC2846DWTR  
UC2846QTR  
UC3846DWTR  
UC3846QTR  
SOIC  
PLCC  
SOIC  
PLCC  
DW  
FN  
16  
20  
16  
20  
2000  
1000  
2000  
1000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
33.0  
33.0  
33.0  
DW  
FN  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
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by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
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Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
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TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
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