UC2826 [TI]
Secondary Side Average Current Mode Controller; 二次侧平均电流模式控制器型号: | UC2826 |
厂家: | TEXAS INSTRUMENTS |
描述: | Secondary Side Average Current Mode Controller |
文件: | 总11页 (文件大小:507K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
UC1826
UC2826
UC3826
Secondary Side Average Current Mode Controller
FEATURES
DESCRIPTION
The UC1826 family of average current mode controllers accurately
accomplishes secondary side average current mode control. The sec-
ondary side output voltage is regulated by sensing the output voltage
and differentially sensing the AC switching current. The sensed output
voltage drives a voltage error amplifier.The AC switching current, mon-
itored by a current sense resistor, drives a high bandwidth, low offset
current error amplifier. The output of the voltage error amplifier can be
used to drive the current amplifier which filters the measured inductor
current. Fast transient response is accomplished by utilizing voltage
feedforward in generating the PWM ramp.
•
Practical Secondary Side Control of
Isolated Power Supplies
•
•
1MHz Operation
Tailored Loop Bandwidth Provides
Excellent Noise Immunity
•
•
•
•
Voltage Feedforward Provides
Superior Transient Response
Accurate Programmable Maximum
Duty Cycle
The UC1826 features load share, oscillator synchronization, undervolt-
age lockout, and programmable output control. Multiple chip operation
can be achieved by connecting up to ten UC1826 chips in parallel.The
SHARE bus and CLKSYN bus provide load sharing and synchroniza-
tion to the fastest oscillator respectively.With its tailored bandwidth, the
UC1826 provides excellent noise immunity and is an ideal controller to
achieve high power, secondary side average current mode control.
Multiple Chips Can be Synchronized
to Fastest Oscillator
Wide Gain Bandwidth Product
(70MHz, Acl>10) Current Error
Amplifier
•
Up to Ten Devices Can Easily Share
a Common Load
BLOCK DIAGRAM
Pin Numbers refer to 24-pin packages.
UDG-95013
7/95
UC1826
UC2826
UC3826
ABSOLUTE MAXIMUM RATINGS
Storage Temperature . . . . . . . . . . . . . . . . . . . .−65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . .−65°C to +150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . .+300°C
All voltages with respect to VEE except where noted; all currents
are positive into, negative out of the specified terminal.
Consult Packaging Section of Databook for thermal limitations
and considerations of packages.
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20V
Output Current Source or Sink . . . . . . . . . . . . . . . . . . . . . .0.3A
Analog Input Voltages . . . . . . . . . . . . . . . . . . . . . . .−0.3V to 7V
ILIM, KILL, SEQ, ENBL, RUN, PWRSEN, PWROK . . . .−0.3V to 7V
CLKSYN Current Source . . . . . . . . . . . . . . . . . . . . . . . . .20mA
RUN Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA
SEQ Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA
RDEAD Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA
RAMP Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA
Share Bus Voltage (voltage with respect to GND) . . .0V to 6.2V
ADJ Voltage (voltage with respect to GND) . . . . . .0.9V to 6.3V
VEE (voltage with respect to GND) . . . . . . . . . . . . . . . . . .−1.5V
RECOMMENDED OPERATING CONDITIONS
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8V to 20V
Sink/Source Output Current . . . . . . . . . . . . . . . . . . . . . .250mA
Timing Resistor RT . . . . . . . . . . . . . . . . . . . . . . . . . .1k to 200k
Timing Capacitor CT . . . . . . . . . . . . . . . . . . . . . . . .75pF to 2nF
CONNECTION DIAGRAMS
DIL-24, SOIC-24,TSSOP-24 (Top View)
J or N, DW, PW Packages
PLCC-28 (Top View)
Q Package
ELECTRICAL CHARACTERISTICS Unless otherwise stated these specifications apply for TA = −55°C to +125°C for
UC1826; −40°C to +85°C for UC2826; and 0°C to +70°C for UC3826;VCC = 12V, VEE = GND, Output no load, CT = 345pF,
RT = 4kΩ, RDEAD = 1000Ω, CRAMP = 345pF, RRAMP = 35.2kΩ, RCLKSYN = 1k, TA = TJ.
PARAMETER
Current Error Amplifier
TEST CONDITIONS
MIN
TYP
MAX UNITS
Ib
0.5
3
3
5
µA
mV
mV
dB
MHz
V
Vio
TA = +25°C
0.75
Over Temperature
Avo
60
45
90
70
GBW (Note 2)
Acl = 10, RIN = 1k, CC = 15pF, f = 200kHz (Note 1)
Vol
IO = 1mA, Voltage above VEE
IO = 0mA
0.5
3.8
3.5
Voh
V
IO = −1mA
V
Voltage Error Amplifier
Ib
0.5
90
3
5
µA
mV
dB
Vio
Avo
60
2
UC1826
UC2826
UC3826
ELECTRICAL CHARACTERISTICS (cont.) Unless otherwise stated these specifications apply for TA = −55°C to
+125°C for UC1826; −40°C to +85°C for UC2826; and 0°C to +70°C for UC3826;VCC = 12V, VEE = GND, Output no load, CT =
345pF, RT = 4kΩ, RDEAD = 1000Ω, CRAMP = 345pF, RRAMP = 35.2kΩ, RCLKSYN = 1k, TA = TJ.
PARAMETER
Voltage Error Amplifier (cont.)
GBW (Note 2)
TEST CONDITION
MIN
TYP
MAX UNITS
f = 200kHz
7
MHz
Vol
IO = 175mA, Volts above VEE
ILIM = 3V
0.6
3.15
100
V
V
Voh
2.85
3
Voh-ILIM
Tested ILIM = 0.5V, 1.0V, 2.0V
−100
mV
2X Amplifier and Share Amplifier
V offset (b; y = mx + b)
GAIN (m; y = mx + b)
GBW (Note 2)
RSHARE
20
mV
V
Slope with AVOUT = 1V and 2V
1.98
2.02
100
200
0
kHZ
kΩ
mV
V
VCC = 0, VSHARE/ISHARE
Total Offset
Vol
Negative supply is VEE, GND Open,VAO = GND
VAO = Voltage Amp Vol, Volts above VEE
IO = 0mA, ILIM = 3V, VAO = Voltage Amp Voh
IO = −1mA, ILIM = 3V, VAO = Voltage Amp Voh
−75
0.2
5.7
5.7
75
0.6
6.3
6.3
0.45
6
Voh
V
6
V
Adjust Amplifier
Vio
gm
Vol
40
60
−0.1
1
80
−0.3
1.1
mV
mS
V
IO = −2µA to 2µA, CADJ = 0.1µF
IOUT = 0
0.9
0.85
5.7
IOUT = 2µA
1
1.15
6.3
V
Voh
IOUT = 0, VSHARE = 6.5V
IOUT = −2µA, VSHARE = 6.5V
6
V
5.7
6
6.3
V
Oscillator
Frequency
450
72
2
500
76
550
80
kHz
%
Max Duty Cycle
OSC Ramp Amplitude
Ramp Saturation
Clock Driver/SYNC (CLKSYN)
Vol
2.2
2.4
0.8
V
IO = 10mA, OSC = 0V
0.44
V
0.02
3.6
3.5
25
0.2
V
V
Voh
RCLKSYN = 200Ω
V
ISOURCE
mA
k
RCLKSYN
VCC = 0, VCLKSYN/ICLKSYN
10
VTH
1.5
V
VREF Comparator
Turn-on Threshold
4.65
0.4
V
V
Hysteresis
VCC Comparator
Turn-on Threshold
Hysteresis
7.9
8.4
0.4
8.9
0.4
V
V
PWR Sense Comparator
Voltage Threshold
1.25
0.3
4
V
V
V
Vol
IO = 1mA
Voh
IO = −100µA
KILL Comparator
Voltage Threshold
3
V
3
UC1826
UC2826
UC3826
ELECTRICAL CHARACTERISTICS (cont.) Unless otherwise stated these specifications apply for TA = −55°C to
+125°C for UC1826; −40°C to +85°C for UC2826; and 0°C to +70°C for UC3826;VCC = 12V, VEE = GND, Output no load, CT =
345pF, RT = 4kΩ, RDEAD = 1000Ω, CRAMP = 345pF, RRAMP = 35.2kΩ, RCLKSYN = 1k, TA = TJ.
PARAMETER
Sequence Comparator
TEST CONDITION
MIN
TYP
MAX UNITS
Voltage Threshold
SEQ SAT
2.5
V
V
IO = 10mA
IO = 10mA
0.25
Enable Comparator
Voltage Threshold
RUN SAT
2.5
0.2
V
V
Reference
VREF
TA = 25°C
4.95
4.9
5
5.05
5.1
15
V
VCC = 15V
10 < VCC < 20
0 < IO < 10mA
VREF = 0V
V
Line Regulation
Load Regulation
Short Circuit I
Output Stage
Rise Time
3
3
mV
mV
mA
15
30
60
90
CL = 100pF
CL = 100pF
10
10
20
20
ns
ns
V
Fall Time
Voh
VCC > 11V, IO = −10mA
IO = −200mA
8.0
7.8
8.4
8.8
V
Vol
IO = 200mA
3.0
0.5
V
IO = 10mA
V
Virtual Ground
VGND − VEE
VEE is externally supplied, GND is floating
and used as Signal GND.
0.2
0.75
21
V
Icc
Icc (run)
30
mA
Note 1: Guaranteed by design. Not 100% tested in production.
Note 2: Unless otherwise specified all voltages are with respect to GND. Currents are positive into, negative out of the
specified terminal.
PIN DESCRIPTIONS
ADJ: The output of the transconductance (gm = −0.1mS) the current amplifier gain. This pin needs a 0.1µF capaci-
amplifier adjusts the control voltage to maintain equal cur- tor to compensate the amplifier.
rent sharing. The chip sensing the highest output current
CA-, CA+: The inverting and non-inverting inputs to the
will have its output clamped to 1V. A resistor divider
current error amplifier. This amplifier needs a capacitor
between VREF and ADJ drives the control voltage (VA+)
between CA- and CAO to set its dominant pole.
for the voltage amplifier. Each slave unit’s ADJ voltage
CAO: The output of the current error amplifier which is
internally clamped to 4V. It is internally connected to the
inverting input of the PWM comparator.
increases (to a maximum of 6V) its control voltage (VA+)
until its load current is equal to the master. The 60mV
input offset on the gm amplifier guarantees that the unit
sensing the highest load current is chosen as the master.
The 60mV offset is guaranteed by design to be greater
than the inherent offset of the gm amplifier and the buffer
amplifier. While the 60mV offset represents an error in
current sharing, the gain of the current and 2X amplifiers
reduces it to only 30mV. The total current sense gain is
CLKSYN: The clock and synchronization pin for the
oscillator. This is a bidirectional pin that can be used to
synchronize several chips to the fastest oscillator. Its
input synchronization threshold is 1.4V. The CLKSYN
voltage is 3.6V when the oscillator capacitor CT is being
discharged, otherwise it is 0V.
4
UC1826
UC2826
UC3826
PIN DESCRIPTIONS (cont.)
ENBL: The active low input with a 2.5V threshold VCC and GND to accomplish feedforward. The PWM
enables the output to switch. SEQ and RUN are driven output drives this pin. When the output is high, the tran-
low when ENBL is above its 2.5V threshold.
sistor is off enabling the charging of the RAMP capacitor.
When the output transitions low, the transistor is turned
on discharging the RAMP capacitor. The voltage at
RAMP rises from 0.2V to near 4V at maximum duty
cycle. Although this is an exponential ramp at high VCC
voltage the ramp appears linear.
GND: The signal ground used for the voltage sense
amplifier, current error amplifier, current error amplifier,
voltage reference, 2X amplifier, and share amplifier. The
output sink transistor is wired directly to this pin.
KILL: The active low input with a 3.0V threshold stops
the output from switching. Once this function is activated
RUN must be cycled low by driving KILL above 3.0V and
either resetting the power to the chip (VCC) or resetting
the ENBL signal.
RDEAD: The pin that programs the maximum duty cycle
by connecting a resistor between it and OSC. The maxi-
mum duty cycle is decreased by increasing this resistor
value which increases the discharge time. The dead
time, the time when the output is low, is 2 RDEAD CT.
·
·
ILIM: A voltage on this pin programs the voltage error
amplifier’s Voh clamp. The voltage error amplifier output
represents the average output current.The Voh clamp con-
sequently limits the output current. If ILIM is tied to VREF, it
defaults to 3.0V. A voltage less than 3.0V connected to
ILIM clamps the voltage error amplifier at this voltage and
consequently limits the maximum output current.
The CT capacitance should be increased by approxi-
mately 40pF to account for parasitic capacitance.
RUN: This is an open collector logic output that signifies
when the chip is operational. RUN is pulled high to VREF
through an external resistor when VCC is greater than
8.4V, VREF is greater than 4.65V, SEQ is greater than
2.5V, and KILL lower than 3.0V. RUN connected to the
VA+ pin and to a capacitor to ground adds an RC rise
time on the VA+ pin initiating a soft start.
OSC:The oscillator ramp (not to be confused with PWM
ramp) pin has a capacitor CT to ground and two resistors
in series RT and RDEAD to VREF. The total resistance of
RT and RDEAD divided by VREF − VOSC sets exponential
charge current. The oscillator charges from 1.2V to 3.4V
until the output transitions low. At this time an open col-
lector transistor is turned on and discharges the CT
capacitor through RDEAD.
SEQ: The sequence pin allows the sequencing of startup
for multiple units. A resistor between VREF and SEQ and
a capacitor between SEQ and GND create a unique RC
rise time for each unit which sequences the output startup.
SHARE:The nearly DC voltage representing the average
output current. This pin is wired directly to all SHARE
pins and is the load share bus.
The charge time is approximately TCHARGE = 2(RT +
RDEAD) CT when the RDEAD resistor is used.
·
VA-, VA+: The inverting and non-inverting inputs to the
voltage error amplifier.
The dead time is approximately TDISCHARGE = 2
CT.
·
RDEAD
·
1
VAO: The output of the voltage error amplifier. Its Voh is
clamped with the ILIM pin.
(1) Frequency ≈
TCHARGE + TDISCHARGE
TCHARGE
VCC: The input voltage to the chip. The chip is opera-
tional between 8.4V and 20V.
(2) Maximum Duty Cycle ≈
TCHARGE + TDISCHARGE
VEE: The negative supply voltage to the chip which pow-
ers the lower voltage rail for all amplifiers. The chip is
operational if VEE is connected to GND or if GND is
floating. When voltage is applied externally to VEE, GND
becomes a virtual ground because of an internal diode
between VEE and GND. The GND current flows through
the forward biased diode and out VEE. GND is always
the signal ground from which the voltage reference and
all amplifier inputs are referenced.
The CT capacitance should be increased by approxi-
mately 40pF to account for parasitic capacitance.
OUT: The output of the PWM driver. It has an upper
clamp of 8.5V. The peak current sink and source are
250mA. All UVLO, SEQ, ENBL, and KILL logic either
enable or disable the output driver.
PWRSEN: This pin is the input to the PWROK comparator.
PWROK: The output pin from the PWROK comparator. It
has a 300µA current source output when driven high.
VREF: The reference voltage equal to 5.0V.
RAMP: An open collector that can sink 20mA to dis-
charge the oscillator capacitor. An RC is tied between
5
UC1826
UC2826
UC3826
UDG-95014-1
Figure 1. Oscillator Block with External Connections
CIRCUIT DESCRIPTION:
PWM Oscillator: The chip has two pins that set RC time delay of 2
CT
(RDEAD + RT). After exceeding this
· ·
constants. The resistor and capacitor tied to RAMP cre- threshold, the RS flip-flop is set driving CLKSYN high
ate the ramp used as the input to the PWM comparator. and RDEAD low which discharges CT. At this time and
When the output pin OUT is high, RAMP charges until it open collector transistor is turned on and discharges CT
passes the PWM comparator threshold. The output is
then driven low and RAMP is discharged. The resistors
and capacitor on the OSC pin are used to set the PWM shown in Figure 2. Equations to attain frequency and
capacitor through RDEAD with a RC time delay of 2
·
CT
RDEAD. The oscillator and ramp waveforms are
·
operating frequency and its maximum duty cycle.
maximum duty cycle are listed under the OSC pin
description.
The oscillator block diagram with external wiring is
shown in Figure 1. OSC has a capacitor (CT) to ground
and two resistors in series (RT and RDEAD) to VREF.The
As shown in Figure 3, several oscillators are synchro-
nized to the highest free running frequency by connect-
total resistance of RT and RDEAD divided by VREF − ing 100pF capacitors in series with each CLKSYN pin
VOSC sets the exponential charge current. The oscillator
and connecting the other side of the capacitors together
charges from 1.2V to a 3.4V threshold with an RC time forming the CLKSYN bus. The CLKSYN bus is then
pulled down to ground with a resistance of approximately
10k. Referring to Figure 1, the synchronization threshold
is 1.4V. The oscillator blanks any synchronization pulse
3.0-
that occurs when OSC is below 2.5V. This allows units,
once they discharge below 2.5V, to continue through the
OSC
1.0
current discharge and subsequent charge cycles
whether or not other units on the CLKSYN bus are still
CLKSYN
synchronizing.This requires the frequency of all free run-
ning oscillators to be within 40% of each other to guaran-
OUT
tee synchronization.
CAO
Grounds, Voltage Sensing and Current Sensing: The
RAMP
voltage is sensed directly at the load. Proper load shar-
ing requires the same sensed voltage for each power
supply connected in parallel. Referring to Figure 4, the
Figure 2. Oscillator and PWM Output Waveform
6
UC1826
UC2826
UC3826
CIRCUIT BLOCK DESCRIPTION (cont.)
Figure 4 shows one recommended voltage and current
sensing scheme when VEE is connected to GND. The
signal ground is the negative sense point for the output
voltage and the positive sense point for the output cur-
rent. VEE is the negative supply for the current sense
amplifier. When it is separated from GND, it extends the
current sense amplifier’s common mode input voltage
range to include VEE which is approximately −0.7V
below ground.The resistor RADJ is used for load sharing.
The unit which is the master will force VADJ to 1.0V.
Therefore, the regulated voltage being sensed is actually
RADJ
· (R1 + RADJ
VSP − VSM = (VREF − VADJ)
+ VADJ
)
VSM = 0V, VADJ = 1V (master), VREF = 5V
RADJ
VSP = 4
(
)
+ 1V
·
R1 + RADJ
The voltage at ADJ on the slave chips will increase forc-
ing their load currents to increase to match the master.
UDG-95015
The AC frequency response of the voltage error amplifier
is shown in Figure 5.
Figure 3. Oscillator Synchronization
Connection Diagram
positive sense voltage (VSP) connects to the voltage
error amplifier inverting terminal (VA-), the return lead for
the on-chip reference is used as the negative sense
(VSM). The current is sensed across the shunt resistor,
RS. The voltage across the shunt resistor is level shifted
up so that the maximum voltage across Rs corresponds
to the voltage error amplifier Voh.
m ≈
Figure 5. AC Frequency Response of the Voltage
Error Amplifier
Startup and Shutdown: Isolated power up can be
accomplished using the UCC1889. Application Note
U-149 is available for additional information.
The UC1826 offers several features that enhance startup
and shutdown. Soft start is accomplished by connecting
RUN to VA+ and a capacitor to ground. The resulting RC
rise time on the VA+ pin initiates a soft start. It can also
be accomplished by connecting RUN to ILIM.When RUN
is low it will command zero load current, guaranteeing a
soft start. The undervoltage lockout (UVLO) is a logical
AND of ENBL < 2.5V, SEQ > 2.5V, VCC > 8.4V and
UDG-95016
Figure 4.Voltage and Current Sense VEE Tied to GND
7
UC1826
UC2826
UC3826
CIRCUIT BLOCK DESCRIPTION (cont.)
VREF > 4.65V.The block diagram shows that the thresh- Current Control Loop: The current error amplifier (CEA)
olds are set by comparators. By placing an RC divider on needs its loop compensated externally. The zero crossing
the SEQ pin, the enabling of multiple chips can be can be calculated with Equation 3.
sequenced with different RC time constants. Similarly,
different RC time constants on the ENBL pins can
1
(3) Frequency (0dB) =
2π RINV
CCOMP
·
sequence shutdown. The UVLO keeps the output from
switching; however the internal reference starts up with
VCC less than 8.4V. The KILL input shuts down the
switching of the chip. This can be used in conjunction
with an overvoltage comparator for overvoltage protec-
tion. In order to restart the chip after KILL has been initi-
ated, the chip must be powered down and then back up.
A pulse on the ENBL pin also accomplishes this without
actually removing voltage to the VCC pin.
RINV is the input resistance at the inverting terminal CA-
CCOMP is the capacitance between CA- and CAO.
Although it is only unity gain stable for a BW of 7MHz,
the amplifier is typically configured with a differential gain
of at least 10, allowing the amplifier to operate with suffi-
cient phase margin at a GBW of 70MHz. A closed loop
gain of 10 attenuates the output by 20.8dB
1
20.8 = 20log
·
Load Sharing: Load sharing is accomplished similarly to
the UC1907 except it has the added constraint of using
the sensed current for average current mode control.The
sensed current for the UC1826 has an AC component
that is amplified and then averaged. The voltage error
amplifier represents this average current. The voltage
error amplifier output is the current command signal and
its voltage represents the average output load current.
The ILIM pin programs the upper clamp voltage of this
amplifier and consequently the maximum load current. A
gain of 2 amplifier connected between the voltage error
amplifier output and the share amplifier input increases
the current share resolution and noise margin. The aver-
age current is used as an input to a source only load
share buffer amplifier. The output of this amplifier is the
current share bus. The IC with the highest sensed cur-
rent will have the highest voltage on the current share
bus and consequently act as the master.The 60mV input
offset guarantees that the unit sensing the highest load
current is chosen as the master.
11
to the inverting terminal assuring stability. The amplifier’s
gain fed back into the inverting terminal is less than unity
at 7MHz, where the phase margin begins to roll off. See
Figure 6 for a typical Bode plot.
β
−
m
The adjust amplifier is used by the remaining (slave) ICs
to adjust their respective references high in order to bal-
ance each IC’s load current.The master’s ADJ pin will be
at its 1.0V clamp and connected back to the non-invert-
ing voltage error amplifier input through a high value
resistor. This requires the user to initially calculate the
control voltage with the ADJ pin at 1.0V.
Figure 6. Current Error Amplifier Bode Plot
The current error amplifier bandwidth is rolled off and
controlled by the voltage error amplifier output.The maxi-
mum load current is limited to approximately the maxi-
mum voltage across the shunt resistor (maximum of
200mV) divided by RS:
VREF can be adjusted 150mV to 300mV which compen-
sates for 5% unit to unit reference mismatch and external
resistor mismatch. RADJ will typically be 10 to 30 times
larger than R1.This also attenuates the overall variation of
the ADJ clamp of 1V ±100mV by a factor of 10 to 30, con-
tributing only a 3mV to 10mV additional delta to VREF.
Refer to the UC3907 Application Note U-130 for further
information on parallel power supply load sharing.
VRs
(4) IMAXload =
RS
ILIM sets the maximum current limit by setting the Voh
clamp on the voltage error amplifier. If ILIM is not set to
limit the Voh to be equal to the maximum voltage across
RS, VAO must be attenuated to match the maximum volt-
8
UC1826
UC2826
UC3826
CIRCUIT BLOCK DESCRIPTION (cont.)
age VRS across the shunt resistor. By attenuating the Design Example: Figure 7 is an open loop test that lets
maximum voltage at VAO to be equal to VRS, the current the user test the circuit blocks discussed without having
control loop keeps the load from exceeding its current to build an entire control loop. The pulse width can be
limit. If the ILIM pin is connected to VREF, the Voh is set
varied by either the VADJ or the VISENSE inputs. Figure 8
at 3.0V. The maximum current limit clamp can be shows an isolated power supply using the UC1826 sec-
reduced by reducing the voltage on ILIM to less than ondary side average current mode controller.
3.0V as described in the ILIM pin description.
UDG-95017-1
Figure 7. Open Loop Circuit
9
UC1826
UC2826
UC3826
UNITRODE INTEGRATED CIRCUITS
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. 603-424-2410 • FAX 603-424-3460
10
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TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER’S RISK.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI’s publication of information regarding any third
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.
Copyright 1999, Texas Instruments Incorporated
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