UC2849 [TI]

Secondary Side Average Current Mode Controller; 二次侧平均电流模式控制器
UC2849
型号: UC2849
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Secondary Side Average Current Mode Controller
二次侧平均电流模式控制器

控制器
文件: 总11页 (文件大小:544K)
中文:  中文翻译
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UC1849  
UC2849  
UC3849  
Secondary Side Average Current Mode Controller  
FEATURES  
DESCRIPTION  
The UC1849 family of average current mode controllers accurately accom-  
plishes secondary side average current mode control. The secondary side  
output voltage is regulated by sensing the output voltage and differentially  
sensing the AC switching current. The sensed output voltage drives a volt-  
age error amplifier.The AC switching current, monitored by a current sense  
resistor, drives a high bandwidth, low offset current sense amplifier. The  
outputs of the voltage error amplifier and current sense amplifier differential-  
ly drive a high bandwidth, integrating current error amplifier. The sawtooth  
waveform at the current error amplifier output is the amplified and inverted  
inductor current sensed through the resistor. This inductor current down-  
slope compared to the PWM ramp achieves slope compensation, which  
gives an accurate and inherent fast transient response to changes in load.  
Practical Secondary Side Control  
of Isolated Power Supplies  
1MHz Operation  
Differential AC Switching Current  
Sensing  
Accurate Programmable  
Maximum Duty Cycle  
Multiple Chips Can be  
Synchronized to Fastest  
Oscillator  
Wide Gain Bandwidth Product  
(70MHz, Acl>10) Current Error  
and Current Sense Amplifiers  
The UC1849 features load share, oscillator synchronization, undervoltage  
lockout, and programmable output control. Multiple chip operation can be  
achieved by connecting up to ten UC1849 chips in parallel.The SHARE bus  
and CLKSYN bus provide load sharing and synchronization to the fastest  
oscillator respectively. The UC1849 is an ideal controller to achieve high  
power, secondary side average current mode control.  
Up to Ten Devices Can Easily  
Share a Common Load  
BLOCK DIAGRAM  
Pin numbers refer to 24-pin packages.  
UDG-94110  
7/95  
UC1849  
UC2849  
UC3849  
ABSOLUTE MAXIMUM RATINGS  
Junction Temperature . . . . . . . . . . . . . . . . . . .65°C to +150°C  
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . .+300°C  
All voltages with respect to VEE except where noted; all currents  
are positive into, negative out of the specified terminal.  
Consult Packaging Section of Databook for thermal limitations  
and considerations of packages.  
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20V  
Output Current Source or Sink . . . . . . . . . . . . . . . . . . . . . .0.3A  
Analog Input Voltages . . . . . . . . . . . . . . . . . . . . . . .0.3V to 7V  
ILIM, KILL, SEQ, ENBL, RUN . . . . . . . . . . . . . . . .0.3V to 7 V  
CLKSYN Current Source . . . . . . . . . . . . . . . . . . . . . . . . .12mA  
RUN Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15mA  
SEQ Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA  
RDEAD Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA  
Share Bus Voltage (voltage with respect to GND) . . .0V to 6.2V  
ADJ Voltage (voltage with respect to GND) . . . . . .0.9V to 6.3V  
VEE (voltage with respect to GND) . . . . . . . . . . . . . . . . .1.5V  
Storage Temperature . . . . . . . . . . . . . . . . . . .65°C to +150°C  
RECOMMENDED OPERATING CONDITIONS  
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8V to20V  
Sink/Source Output Current . . . . . . . . . . . . . . . . . . . . . .250mA  
Timing Resistor (RT) . . . . . . . . . . . . . . . . . . . . . . . . .1k to 200k  
Timing Capacitor (CT) . . . . . . . . . . . . . . . . . . . . . .75pF to 2nF  
CONNECTION DIAGRAMS  
DIL-24, SOIC-24,TSSOP-24 (Top View)  
J or N, DW, PW Packages  
PLCC-28 (Top View)  
Q Package  
ELECTRICAL CHARACTERISTICS Unless otherwise stated these specifications apply for TA = 55°C to +125°C for  
UC1849; 40°C to +85°C for UC2849; and 0°C to +70°C for UC3849;VCC = 12V, VEE = GND, Output no load, CT = 345pF, RT =  
4530, RDEAD = 511, RCLKSYN = 1k, TA = TJ.  
PARAMETER  
Current Sense Amplifier  
Ib  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
0.5  
3
3
5
µA  
mV  
mV  
dB  
MHz  
V
Vio  
TA = +25°C  
Over Temperature  
Avo  
60  
90  
7
GBW (Note 2)  
Acl = 1, RIN = 1k, CC = 15pF, f = 200kHz (Note 1)  
Io = 1mA, Voltage above VEE  
Io = 0mA  
4.5  
Vol  
0.5  
3.8  
3.5  
80  
80  
Voh  
V
Io = 1mA  
V
CMRR  
0.2 < Vcm < 8V  
dB  
dB  
PSRR  
10V < VCC < 20V  
Current Error Amplifier  
Ib  
0.5  
3
3
µA  
Vio  
20  
mV  
2
UC1849  
UC2849  
UC3849  
ELECTRICAL CHARACTERISTICS Unless otherwise stated these specifications apply for TA = 55°C to +125°C for  
UC1849; 40°C to +85°C for UC2849; and 0°C to +70°C for UC3849;VCC = 12V, VEE = GND, Output no load, CT = 345pF, RT =  
4530, RDEAD = 511, RCLKSYN = 1k, TA = TJ.  
PARAMETER  
Current Error Amplifier (cont.)  
Avo  
TEST CONDITION  
MIN  
TYP  
MAX UNITS  
60  
90  
7
dB  
MHz  
V
GBW (Note 2)  
Acl = 1, RIN = 1k, CC=15pF, f=200kHz (Note 1)  
IO = 1mA, Voltage above VEE  
IO = 0mA  
4.5  
Vol  
0.5  
3.8  
3.5  
80  
80  
Voh  
V
IO = 1mA  
V
CMRR  
0.2 < Vcm < 8V  
dB  
dB  
PSRR  
10V < VCC < 20V  
Voltage Error Amplifier  
Ib  
0.5  
2
3
5
µA  
mV  
dB  
MHz  
V
Vio  
Avo  
60  
90  
7
GBW (Note 2)  
f = 200kHz  
4.5  
Vol  
IO = 175µA, Volts above VEE  
ILIM > 3V  
0.3  
3
0.6  
3.15  
100  
Voh  
2.85  
V
Voh - ILIM  
Tested ILIM = 0.5V, 1.0V, 2.0V  
0.2 < Vcm < 8V  
100  
mV  
dB  
dB  
CMRR  
80  
80  
PSRR  
10V < VCC < 20V  
2X Amplifier and Share Amplifier  
V offset (b; y = mx + b)  
GAIN (m; y = mx + b)  
GBW (Note 2)  
RSHARE  
20  
mV  
V
Slope with AVOUT = 1V and 2V  
1.98  
2.02  
100  
200  
0
kHZ  
k
VCC = 0, VSHARE/ISHARE  
Total Offset  
Vol  
Negative supply is VEE, GND Open, VAO = GND  
VAO = Voltage Amplifier Vol, Volts above VEE  
IO = 0mA, ILIM = 3V, VAO = Voltage Amp Voh  
IO = 1mA, ILIM = 3V, VAO = Voltage Amp Voh  
75  
0.2  
5.7  
5.7  
75  
0.6  
6.3  
6.3  
mV  
V
0.45  
6
Voh  
V
6
V
Adjust Amplifier  
Vio  
gm  
Vol  
40  
60  
1  
1
80  
mV  
mS  
V
IOUT= 10µA to 10µA, VOUT = 3.5V, CADJ = 1µF  
IOUT = 0  
0.9  
0.85  
5.7  
1.1  
1.15  
6.3  
IOUT = 50µA  
1
V
Voh  
IOUT = 0, VSHARE = 6.5V  
IOUT = 50µA, VSHARE = 6.5V  
6
V
5.7  
6
6.3  
V
Oscillator  
Frequency  
450  
80  
2
500  
85  
550  
90  
kHz  
%
Max Duty Cycle  
OSC Ramp Amplitude  
2.5  
2.8  
V
Clock Driver/SYNC (CLKSYN)  
Vol  
0.02  
3.6  
3.2  
25  
0.2  
V
V
Voh  
RCLKSYN = 200Ω  
V
ISOURCE  
RCLKSYN  
VTH  
mA  
k
VCC = 0, VCLKSYN/ICLKSYN  
10  
1.5  
V
3
UC1849  
UC2849  
UC3849  
ELECTRICAL CHARACTERISTICS (cont)Unless otherwise stated these specifications apply for TA = 55°C to +125°C  
for UC1849; 40°C to +85°C for UC2849; and 0°C to +70°C for UC3849;VCC = 12V, VEE = GND, Output no load, CT = 345pF,  
RT = 4530, RDEAD = 511, RCLKSYN = 1k, TA = TJ.  
PARAMETER  
VREF Comparator  
TEST CONDITION  
MIN  
TYP  
MAX UNITS  
Turn-on threshold  
4.65  
0.4  
V
V
Hysteresis  
VCC Comparator  
Turn-on Threshold  
Hysteresis  
7.9  
8.3  
0.4  
8.7  
V
V
KILL Comparator  
Voltage Threshold  
Sequence Comparator  
Voltage Threshold  
3
V
2.5  
V
V
SEQ SAT  
Enable Comparator  
Voltage Threshold  
RUN SAT  
IO = 10mA  
IO = 10mA  
0.25  
2.5  
V
V
0.25  
Reference  
VREF  
TA = 25°C  
4.95  
4.9  
5
5.05  
5.1  
15  
V
VREF  
VCC = 15V  
10 < VCC < 20  
0 < Io < 10mA  
VREF = 0V  
V
Line Regulation  
Load Regulation  
Short Circuit I  
Output Stage  
Rise Time  
3
3
mV  
mV  
mA  
15  
30  
60  
90  
CL = 100pF  
CL = 100pF  
10  
10  
20  
20  
ns  
ns  
V
Fall Time  
Voh  
VCC > 11V, IO = 10mA  
IO = 200mA  
8.0  
7.8  
8.4  
8.8  
V
Vol  
IO = 200mA  
3.0  
0.5  
V
IO = 10mA  
V
Virtual Ground  
VGND-VEE  
VEE is externally supplied, GND is floating  
and used as Signal GND.  
0.2  
0.75  
21  
V
Icc  
Icc (run)  
30  
mA  
Note 1: If a closed loop gain greater than 1 is used, the possible GBW will increase by a factor of ACL + 10; where ACL is the  
closed loop gain.  
Note 2: Guaranteed by design. Not 100% tested in production.  
Note 3: Unless otherwise specified all voltages are with respect to GND. Currents are positive into, negative out of the  
specified terminal.  
PIN DESCRIPTIONS  
ter. The 60mV offset guarantees by design to be greater  
than the inherent offset of the gm amplifier and the buffer  
amplifier. While the 60mV offset represents an error in  
current sharing, the gain of the current and 2X amplifiers  
reduces it to only 30mV. This pin needs a 1µF capacitor  
to compensate the amplifier.  
ADJ: The output of the transconductance (gm = 1mS)  
amplifier adjusts the control voltage to maintain equal  
current sharing.The chip sensing the highest output cur-  
rent will have its output clamped to 1V. A resistor divider  
between VREF and ADJ drives the control voltage (VA+)  
for the voltage amplifier. Each slave unit’s ADJ voltage  
increases (to a maximum of 6V) its control voltage (VA+)  
until its load current is equal to the master. The 60mV  
input offset on the gm amplifier guarantees that the unit  
sensing the highest load current is chosen as the mas-  
CA-: The inverting input to the current error amplifier.  
This amplifier needs a capacitor between CA- and CAO  
to set its dominant pole.  
4
UC1849  
UC2849  
UC3849  
PIN DESCRIPTIONS (cont.)  
CAO: The output of the current error amplifier which is  
internally clamped to 4V. It is internally connected to the  
inverting input of the PWM comparator.  
The dead time is approximately TDISCHARGE = 2  
CT.  
·
RDEAD  
·
1
(1) Frequency ≈  
CS-, CS+: The inverting and non-inverting inputs to the  
current sense amplifier. This amplifier is not internally  
compensated so the user must compensate externally to  
attain the highest GBW for the application.  
TCHARGE + TDISCHARGE  
TCHARGE  
(2) Maximum Duty Cycle ≈  
TCHARGE + TDISCHARGE  
The CT capacitance should be increased by approxi-  
mately 40pF to account for parasitic capacitance.  
CLKSYN: The clock and synchronization pin for the  
oscillator. This is a bidirectional pin that can be used to  
synchronize several chips to the fastest oscillator. Its  
input synchronization threshold is 1.4V. The CLKSYN  
voltage is 3.6V when the oscillator capacitor (CT) is  
being discharged, otherwise it is 0V. If the recommended  
synchronization circuit is not used, a 1k or lower value  
resistor from CLKSYN to GND may be needed to  
increase fall time on CLKSYN pin.  
OUT: The output of the PWM driver. It has an upper  
clamp of 8.5V. The peak current sink and source are  
250mA. All UVLO, SEQ, ENBL, and KILL logic either  
enable or disable the output driver.  
RDEAD: The pin that programs the maximum duty cycle  
by connecting a resistor between it and OSC. The maxi-  
mum duty cycle is decreased by increasing this resistor  
value which increases the discharge time. The dead  
time, the time when the output is low, is 2 RDEAD  
CSO: The output of the current sense amplifier which is  
internally clamped to 4V.  
·
·
CT. The CT capacitance should be increased by approxi-  
mately 40pF to account for parasitic capacitance.  
ENBL: The active low input with a 2.5V threshold  
enables the output to switch. SEQ and RUN are driven  
low when ENBL is above its 2.5V threshold.  
RT: This pin programs the charge time of the oscillator  
ramp.The charge current is  
GND: The signal ground used for the voltage sense  
amplifier, current sense amplifier, current error amplifier,  
voltage reference, 2X amplifier, and share amplifier. The  
output sink transistor is wired directly to this pin.  
VREF  
2
RT  
·
The charge time is approximately TCHARGE RT  
CT  
·
KILL: The active low input with a 3.0V threshold stops  
the output from switching. Once this function is activated  
RUN must be cycled low by driving KILL above 3.0V and  
either resetting the power to the chip (VCC) or resetting  
the ENBL signal.  
when the RDEAD resistor is used.  
The dead time is approximately TDISCHARGE 2  
·
RDEAD CT.  
·
RUN: This is an open collector logic output that signifies  
when the chip is operational. RUN is pulled high to VREF  
through an external resistor when VCC is greater than  
8.4V, VREF is greater than 4.65V, SEQ is greater than  
2.5V, and KILL lower than 3.0V. RUN connected to the  
VA+ pin and to a capacitor to ground adds an RC rise  
time on the VA+ pin initiating a soft start.  
ILIM: A voltage on this pin programs the voltage error  
amplifier’s Voh clamp. The voltage error amplifier output  
represents the average output current.The Voh clamp con-  
sequently limits the output current. If ILIM is tied to VREF, it  
defaults to 3.0V. A voltage less than 3.0V connected to  
ILIM clamps the voltage error amplifier at this voltage and  
consequently limits the maximum output current.  
SEQ: The sequence pin allows the sequencing of startup  
for multiple units. A resistor between VREF and SEQ and  
a capacitor between SEQ and GND creates a unique RC  
rise time for each unit which sequences the output start-  
up.  
OSC: The oscillator ramp pin which has a capacitor (CT)  
to ground and a resistor (RDEAD) to the RDEAD pin pro-  
grams its maximum duty cycle by programming a mini-  
mum dead time. The ramp oscillates between 1.2V to  
3.4V when an RDEAD resistor is used. The maximum  
duty cycle can be increased by connecting RDEAD to  
OSC which changes the oscillator ramp to vary between  
0.2V and 3.5V. In order to guarantee zero duty cycle in  
this configuration VEE should not be connected to GND.  
SHARE:The nearly DC voltage representing the average  
output current. This pin is wired directly to all SHARE  
pins and is the load share bus.  
VA+, VA-: The inverting and non-inverting inputs to the  
voltage error amplifier.  
The charge time is approximately TCHARGE = RT  
when the RDEAD resistor is used.  
CT  
·
VAO: The output of the voltage error amplifier. Its Voh is  
clamped with the ILIM pin.  
5
UC1849  
UC2849  
UC3849  
PIN DESCRIPTIONS (cont.)  
VCC: The input voltage of the chip. The chip is opera- tual ground because of an internal diode between VEE  
tional between 8.4V and 20V.  
and GND. The GND current flows through the forward  
biased diode and out VEE. GND is always the signal  
ground from which the voltage reference and all amplifier  
inputs are referenced.  
VEE: The negative supply to the chip which powers the  
lower voltage rail for all amplifiers.The chip is operational  
if VEE is connected to GND or if GND is floating. When  
voltage is applied externally to VEE, GND becomes a vir- VREF: The reference voltage equal to 5.0V.  
UDG-94111-1  
Figure 1. Oscillator Block with External Connections  
nized to the highest free running frequency by connect-  
ing 100pF capacitors in series with each CLKSYN pin  
and connecting the other side of the capacitors together  
forming the CLKSYN bus. The CLKSYN bus is then  
pulled down to ground with a resistance of approximately  
10k. Referring to Figure1, the synchronization threshold  
is 1.4V. The oscillator blanks any synchronization pulse  
that occurs when OSC is below 2.5V. This allows units,  
once they discharge below 2.5V, to continue through the  
CIRCUIT BLOCK DESCRIPTION:  
PWM Oscillator:The oscillator block diagram with exter-  
nal connections is shown in Figure 1. A resistor (RT) con-  
nected to pin RT sets the linear charge current;  
2.5V  
RT .  
IRT ≈  
The timing capacitor (CT) is linearly charged with the  
charge current forcing the OSC pin to charge to a 3.4V  
threshold. After exceeding this threshold, the RS flip-flop  
is set driving CLKSYN high and RDEAD low which dis-  
charges CT. This discharge time with the RC time delay  
of 2 CT RDEAD is the minimum output low time. OSC  
· ·  
continues to discharge until it reaches a 1.2V threshold  
and resets the RS flip-flop which repeats the charging  
sequence as shown in Figure 2. Equations to approxi-  
mate frequency and maximum duty cycle are listed  
under the OSC pin description. Figure 3 and 4 graphs  
show measured variation of frequency and maximum  
duty cycle with varying RT, CT, and RDEAD component  
values.  
UDG-94112  
As shown in Figure 5, several oscillators are synchro-  
Figure 2. Oscillator and PWM Output Waveform  
6
UC1849  
UC2849  
UC3849  
CIRCUIT BLOCK DESCRIPTION (cont.)  
Figure 3. Output Frequency  
UDG-94113  
Figure 5. Oscillator Synchronization  
Connection Diagram  
Figure 4. Maximum Duty Cycle  
current discharge and subsequent charge cycles whether  
or not other units on the CLKSYN bus are still synchro-  
nizing. This requires the frequency of all free running  
oscillators to be within 40% of each other to guarantee  
synchronization.  
Grounds, Voltage Sensing and Current Sensing: The  
voltage is sensed directly at the load. Proper load sharing  
requires the same sensed voltage for each power supply  
connected in parallel. Referring to Figure 6, the positive  
sense voltage (VSP) connects to the voltage error ampli-  
fier inverting terminal (VA-), the return lead for the on-  
chip reference is used as the negative sense (VSM).The  
current is sensed across the shunt resistor, RS.  
Figure 6 shows one recommended voltage and current  
sensing scheme when VEE is connected to GND. The  
signal ground is the negative sense point for the output  
voltage and the positive sense point for the output cur-  
rent. The voltage offset on the current sense amplifier is  
not needed if VEE is separated from GND. VEE is the  
negative supply for the current sense amplifier.When it is  
separated from GND, it extends the current sense ampli-  
fier’s common mode input voltage range to include VEE  
which is approximately 0.7V below ground. The resistor  
RADJ is used for load sharing. The unit which is the mas-  
ter will force VADJ to 1.0V. Therefore, the regulated volt-  
age being sensed is actually  
UDG-94114  
Figure 6.Voltage and Current Sense VEE Tied to GND  
RADJ  
VSP VSM = (VREF VADJ)  
+ VADJ  
· (R1 + RADJ  
)
VSM = 0V, VADJ = 1V (master), VREF = 5V  
RADJ  
VSP = 4  
(
)
+ 1V  
·
R1 + RADJ  
7
UC1849  
UC2849  
UC3849  
CIRCUIT BLOCK DESCRIPTION (cont.)  
The ADJ pin voltage on the slave chips will increase forc- voltage error amplifier output is the current command  
ing their load currents to increase to match the master.  
signal representing the average output load current. The  
ILIM pin programs the upper clamp voltage of this ampli-  
fier and consequently the maximum load current. A gain  
of 2 amplifier connected between the voltage error ampli-  
fier output and the share amplifier input increases the  
current share resolution and noise margin. The average  
current is used as an input to a source only load share  
buffer amplifier. The output of this amplifier is the current  
share bus. The IC with the highest sensed current will  
have the highest voltage on the current share bus and  
consequently act as the master. The 60mV input offset  
guarantees that the unit sensing the highest load current  
is chosen as the master.  
The AC frequency response of the voltage error amplifier  
is shown in Figure 7.  
The adjust amplifier is used by the remaining (slave) ICs  
to adjust their respective references high in order to bal-  
ance each IC’s load current.The master’s ADJ pin will be  
at its 1.0V clamp and connected back to the non-invert-  
ing voltage error amplifier input through a high value  
resistor. This requires the user to initially calculate the  
control voltage with the ADJ pin at 1.0V.  
m ≈  
Figure 7. AC Frequency Response of the Voltage  
Error Amplifier  
VREF can be adjusted 150mV to 300mV which compen-  
sates for 5% unit to unit reference mismatch and external  
Startup and Shutdown: Isolated power up can be resistor mismatch. RADJ will typically be 10 to 30 times  
accomplished using the UCC1889. Application Note U- larger than R1.This also attenuates the overall variation of  
149 is available for additional information.  
the ADJ clamp of 1V ±100mV by a factor of 10 to 30, con-  
tributing only a 3mV to 10mV additional delta to VREF.  
Refer to the UC3907 Application Note U-130 for further  
information on parallel power supply load sharing.  
The UC1849 offers several features that enhance startup  
and shutdown. Soft start is accomplished by connecting  
RUN to VA+ and a capacitor to ground.The resulting RC  
rise time on the VA+ pin initiates a soft start. It can also Current Control Loop: The current sense amplifier (CSA)  
be accomplished by connecting RUN to ILIM.When RUN is designed specifically for the task of sensing and amplify-  
is low it will command zero load current, guaranteeing a ing the inductor ripple current at frequencies up to 1MHz.  
soft start. The undervoltage lockout (UVLO) is a logical The CSA’s input offset voltage (VIO) is trimmed to less  
AND of ENBL < 2.5V, SEQ > 2.5V, VCC > 8.4V and than 1mV to minimize error of the average current signal.  
VREF > 4.65V.The block diagram shows that the thresh- This amplifier is not internally compensated allowing the  
olds are set by comparators. By placing an RC divider on user to optimally choose the zero crossing bandwidth.  
the SEQ pin, the enabling of multiple chips can be  
sequenced with different RC time constants. Similarly,  
1
(3) Frequency (0dB) =  
2π RINV  
CCOMP  
·
different RC time constants on the ENBL pins can  
sequence shutdown. The UVLO keeps the output from  
switching; however the internal reference starts up with  
VCC less than 8.4V. The KILL input shuts down the  
switching of the chip. This can be used in conjunction  
with an overvoltage comparator for overvoltage protec-  
tion. In order to restart the chip after KILL has been initi-  
ated, the chip must be powered down and then back up.  
A pulse on the ENBL pin also accomplishes this without  
actually removing voltage to the VCC pin.  
RINV is the input resistance at the inverting terminal CS-  
CCOMP is the capacitance between CS- and CSO.  
Although it is only unity gain stable for a GBW of 7MHz,  
the amplifier is typically configured with a differential gain  
of at least 10, allowing the amplifier to operate at 70MHz  
with sufficient phase margin. A closed loop gain of 10  
attenuates the output by 20.8dB.  
1
20.8 = 20log  
·
11  
Load Sharing: Load sharing is accomplished similar to  
the UC1907. The sensed current for the UC1849 has an  
AC component that is amplified and then averaged. The  
to the inverting terminal assuring stability. The amplifier’s  
gain fed back into the inverting terminal is less than unity  
8
UC1849  
UC2849  
UC3849  
CIRCUIT BLOCK DESCRIPTION (cont.)  
at 7MHz, where the phase margin begins to roll off. See  
Figure 8 for typical Bode plot.  
VILIM  
VRS.  
(5)  
CSGAIN =  
The current error amplifier (CEA) also needs its loop  
compensated by the user with the same criteria as the  
current sense amplifier. This amplifier is essentially the  
same wide bandwidth amplifier without the input offset  
voltage trim.The zero crossing can also be approximate-  
ly calculated with Equation 3. The gain bandwidth of the  
current loop is optimized by matching the inductor  
downslope (Vo/L) to the oscillator ramp slope (Vs  
fs).  
·
Subharmonic oscillation problems are avoided by keep-  
ing the amplified inductor downslope less than the oscil-  
lator ramp slope.  
β
m
The following equation determines the current error  
amplifier gain (GCA):  
Vs fs  
·
(6) GCA =  
;
(Vo/L)  
·
RS  
·
CSGAIN  
Figure 8. Current Sense Amplifier and Current Error  
Amplifier Bode Plot  
where CSGAIN and RS are defined by equations  
4 and 5,  
The gain of the differential current sense amplifier  
(CSGAIN) is calculated by knowing the maximum load  
current. The maximum voltage across the shunt resistor  
(RS) divided by RS is the maximum load current. By  
amplifying the voltage across RS, VRS, to be equal to the  
voltage error amplifier Voh, the current control loop keeps  
the load from exceeding its current limit. Voh is set at  
3.0V if ILIM is connected to VREF.The maximum current  
limit clamp can be reduced by reducing the voltage at  
ILIM to less than 3.0V as described in the ILIM pin  
description.  
Vs is the oscillator peak to peak voltage,  
fs is the oscillator frequency,  
Vo is the output voltage,  
and L is the inductance.  
Additional Information about average current mode con-  
trol can be found in Unitrode Application Note U-140.  
Design Example: Figure 9 is an open loop test that lets  
the user test the circuit blocks discussed without having  
to build an entire control loop. The pulse width can be  
varied by either the VADJ or the VISENSE inputs. Figure 10  
shows an isolated power supply using the UC1849 sec-  
ondary side average current mode controller.  
VRS  
(4)  
RS =  
Max ILOAD  
UDG-94115-1  
Figure 9. Open Loop Circuit  
9
UC1849  
UC2849  
UC3849  
UDG-94116-1  
Figure 10. UC1849 Application Diagram  
UNITRODE INTEGRATED CIRCUITS  
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054  
TEL. 603-424-2410 • FAX 603-424-3460  
10  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1999, Texas Instruments Incorporated  

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