概述
规格参数
数据手册UC2878DWP 概述
Phase Shift Resonant Controller 移相谐振控制器 开关式稳压器或控制器
UC2878DWP 规格参数
| 是否Rohs认证： | 不符合 | 生命周期： | Obsolete |
| 零件包装代码： | SOIC | 包装说明： | PLASTIC, SOIC-28 |
| 针数： | 28 | Reach Compliance Code： | not_compliant |
| ECCN代码： | EAR99 | HTS代码： | 8542.39.00.01 |
| 风险等级： | 5.92 | Is Samacsys： | N |
| 其他特性： | CAN ALSO WORK IN CURRENT MODE | 模拟集成电路 - 其他类型： | SWITCHING CONTROLLER |
| 控制模式： | VOLTAGE-MODE | 控制技术： | RESONANT CONTROL |
| 最大输入电压： | 20 V | 最小输入电压： | 11 V |
| 标称输入电压： | 12 V | JESD-30 代码： | R-PDSO-G28 |
| 长度： | 17.905 mm | 功能数量： | 1 |
| 端子数量： | 28 | 最高工作温度： | 85 °C |
| 最低工作温度： | -25 °C | 最大输出电流： | 3 A |
| 封装主体材料： | PLASTIC/EPOXY | 封装代码： | SOP |
| 封装等效代码： | SOP28,.4 | 封装形状： | RECTANGULAR |
| 封装形式： | SMALL OUTLINE | 峰值回流温度（摄氏度）： | NOT SPECIFIED |
| 认证状态： | Not Qualified | 座面最大高度： | 2.64 mm |
| 子类别： | Switching Regulator or Controllers | 表面贴装： | YES |
| 切换器配置： | PHASE-SHIFT | 最大切换频率： | 1000 kHz |
| 技术： | BIPOLAR | 温度等级： | OTHER |
| 端子形式： | GULL WING | 端子节距： | 1.27 mm |
| 端子位置： | DUAL | 处于峰值回流温度下的最长时间： | NOT SPECIFIED |
| 宽度： | 7.5 mm | Base Number Matches： | 1 |
UC2878DWP 数据手册
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INFO
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
available
Phase Shift Resonant Controller
FEATURES
DESCRIPTION
• Zero to 100% Duty Cycle Control
The UC1875 family of integrated circuits implements control of a bridge
power stage by phase-shifting the switching of one half-bridge with respect
to the other, allowing constant frequency pulse-width modulation in combi-
nation with resonant, zero-voltage switching for high efficiency performance
at high frequencies. This family of circuits may be configured to provide
control in either voltage or current mode operation, with a separate
over-current shutdown for fast fault protection.
• Programmable Output Turn-On Delay
• Compatible with Voltage or Current
Mode Topologies
• Practical Operation at Switching
Frequencies to 1MHz
A programmable time delay is provided to insert a dead-time at the turn-on
of each output stage. This delay, providing time to allow the resonant
switching action, is independently controllable for each output pair (A-B,
C-D).
• Four 2A Totem Pole Outputs
• 10MHz Error Amplifier
• Undervoltage Lockout
With the oscillator capable of operation at frequencies in excess of 2MHz,
overall switching frequencies to 1MHz are practical. In addition to the stan-
dard free running mode, with the CLOCKSYNC pin, the user may configure
these devices to accept an external clock synchronization signal, or may
lock together up to 5 units with the operational frequency determined by
the fastest device.
• Low Startup Current –150µA
• Outputs Active Low During UVLO
• Soft-Start Control
• Latched Over-Current Comparator
With Full Cycle Restart
Protective features include an undervoltage lockout which maintains all out-
puts in an active-low state until the supply reaches a 10.75V threshold.
1.5V hysteresis is built in for reliable, boot-strapped chip supply.
Over-current protection is provided, and will latch the outputs in the OFF
state within 70nsec of a fault. The current-fault circuitry implements
• Trimmed Reference
full-cycle restart operation.
(continued)
BLOCK DIAGRAM
UDG-95073
SLUS229B - JULY 1999 - REVISED JUNE 2004
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
DESCRIPTION (cont.)
Additional features include an error amplifier with band-
width in excess of 7MHz, a 5V reference, provisions for
soft-starting, and flexible ramp generation and slope com-
pensation circuitry.
Device
UVLO
Turn-On
10.75
15.25V
10.75V
15.25V
UVLO
Turn-Off
9.25V
9.25V
9.25V
9.25V
Delay
Set
Yes
Yes
No
UC1875
UC1876
UC1877
UC1878
These devices are available in 20-pin DIP, 28-pin
“bat-wing” SOIC and 28 lead power PLCC plastic pack-
ages for operation over both 0°C to 70°C and –25°C to
+85°C temperature ranges; and in hermetically sealed
cerdip, surface mount, and ceramic leadless chip carrier
packages for –55°C to +125°C operation.
No
CONNECTION DIAGRAMS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VC, VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . 20V
Output Current, Source or Sink
Dil-20 (Top View) J
or N Package
DC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5A
Pulse (0.5µs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3A
Analog I/0s
(Pins 1, 2, 3, 4, 5, 6, 7, 15, 16, 17, 18, 19) . . . . –0.3 to 5.3V
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature. . . . . . . . . . . . . . . . . . . –55°C to +150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . +300°C
Note: Pin references are to 20 pin packages. All voltages are
with respect to ground. Currents are positive into, neg-
ative out of, device terminals. Consult Unitrode
databook for information regarding thermal specifica-
tions and limitations of packages.
SOIC-28, (Top View)
DWP Package
CLCC-28 (Top View) L Package
VIN
PWRGND
OUTB
VC
OUTC
OUTD
OUTA
4
3
2
1
28 27 26
N/C
N/C
5
25
24
23
22
21
20
19
N/C
6
DELAYSET C-D
DELAYSET A-B
FREQSET
CLOCKSYNC
SLOPE
7
SS
8
CS+
EA+
E/A-
N/C
9
10
11
RAMP
12 13 14 15 16 17 18
N/C
N/C
N/C
E/A OUT
VREF
N/C
GND
2
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
PLCC-28 (Top View)
QP Package
ELECTRICAL CHARACTERISTICS:Unless otherwise stated, –55°C < TA < 125°C for the UC1875/6/7/8, –25°C < TA
85°C for the UC2875/6/7/8 and 0°C < TA < 70°C for the UC3875/6/7/8, VC = VIN = 12V, RFREQSET = 12kΩ, CFREQSET = 330pF,
SLOPE = 12kΩ, CRAMP = 200pF, CDELAYSET A-B = CDELAYSET C-D = 0.01µF, IDELAYSET A-B = IDELAYSET C-D = –500µA, TA = TJ.
<
R
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNITS
Undervoltage Lockout
Start Threshold
UC1875/UC1877
10.75 11.75
15.25
V
V
V
V
UC1876/UC1878
UC1875/UC1877
UC1876/UC1878
UVLO Hysteresis
0.5
1.25
6.0
2.0
Supply Current
IIN Startup
VIN = 8V, VC = 20V, RSLOPE open, IDELAY = 0
VIN = 8V, VC = 20V, RSLOPE open, IDELAY = 0
150
10
600
100
44
µA
µA
IC Startup
IIN
30
mA
mA
IC
15
30
Voltage Reference
Output Voltage
Line Regulation
Load Regulation
Total Variation
Noise Voltage
Long Term Stability
Short Circuit Current
TJ = +25°C
4.92
4.9
5
1
5
5.08
10
V
mV
mV
V
11 < VIN < 20V
IVREF = –10mA
20
Line, Load, Temperature
10Hz to 10kHz
5.1
50
2.5
60
µVrms
mV
mA
TJ = 125°C, 1000 hours
VREF = 0V, TJ = 25°C
3
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
ELECTRICAL CHARACTERISTICS:Unless otherwise stated, –55°C < TA < 125°C for the UC1875/6/7/8, –25°C < TA
<
85°C for the UC2875/6/7/8 and 0°C < TA < 70°C for the UC3875/6/7/8, VC = VIN = 12V, RFREQSET = 12kΩ, CFREQSET = 330pF,
R
SLOPE = 12kΩ, CRAMP = 200pF, CDELAYSET A-B = CDELAYSET C-D = 0.01µF, IDELAYSET A-B = IDELAYSET C-D = –500µA, TA = TJ.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNITS
Error Amplifier
Offset Voltage
5
0.6
90
15
3
mV
µA
Input Bias Current
AVOL
1V < VE/AOUT < 4V
60
75
85
1
dB
CMRR
1.5V < VCM < 5.5V
11V < VIN < 20V
VE/AOUT = 1V
95
dB
PSRR
100
2.5
–1.3
4.7
0.5
11
dB
Output Sink Current
Output Source Current
Output Voltage High
Output Voltage Low
Unity Gain BW
mA
mA
V
VE/AOUT = 4V
–0.5
5
I
E/AOUT = –0.5mA
4
0
7
6
IE/AOUT = 1mA
(Note 8)
1
V
MHz
V/µsec
Slew Rate
(Note 8)
11
PWM Comparator
Ramp Offset Voltage
Zero Phase Shift Voltage
PWM Phase Shift (Note1) and (Note 7)
TJ = 25°C (Note 3)
(Note 4)
1.3
0.9
99.5
0.5
5
V
V
0.55
98
0
VE/AOUT > (Ramp Peak + Ramp Offset)
102
2
%
VE/AOUT < Zero Phase Shift Voltage
VE/AOUT < 1V
%
Output Skew (Note 1) and (Note 7)
Ramp to Output Delay, (Note 8)
±20
100
125
nsec
nsec
nsec
UC3875/6/7/8 (Note 6)
65
UC1875/6/7/8, UC2875/6/7/8 (Note 6)
65
Oscillator
Initial Accuracy
TJ = 25°C
0.85
0.80
1
1.15
2
MHz
%
Voltage Stability
11V < VIN < 20V
Line, Temperature
TJ = 25°C
0.2
Total Variation
1.20
MHz
V
Sync Pin Threshold
Clock Out Peak
3.8
4.3
3.3
30
TJ = 25°C
V
Clock Out Low
TJ = 25°C
V
Clock Out Pulse Width
Maximum Frequency, (Note 7)
Ramp Generator/Slope Compensation
Ramp Current, Minimum
Ramp Current, Maximum
Ramp Valley
R
CLOCKSYNC = 3.9kΩ
FREQSET = 5kΩ
100
–14
4.1
nsec
MHz
R
2
ISLOPE = 10µA, VFREQSET = VREF
SLOPE = 1mA, VFREQSET = VREF
–11
µA
mA
V
I
–0.8 –0.95
0
Ramp Peak - Clamping Level
Current Limit
RFREQSET = 100kΩ
CS+ = 3V
3.8
V
Input Bias
V
2
5
µA
V
Threshold Voltage
Delay to Output, (Note 8)
2.4
2.5
85
85
2.6
125
150
UC3875/6/7/8
nsec
nsec
UC1875/6/7/8, UC2875/6/7/8
4
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
ELECTRICAL CHARACTERISTICS:Unless otherwise stated, –55°C < TA < 125°C for the UC1875/6/7/8, –25°C < TA
85°C for the UC2875/6/7/8 and 0°C < TA < 70°C for the UC3875/6/7/8, VC = VIN = 12V, RFREQSET = 12kΩ, CFREQSET = 330pF,
SLOPE = 12kΩ, CRAMP = 200pF, CDELAYSET A-B = CDELAYSET C-D = 0.01µF, IDELAYSET A-B = IDELAYSET C-D = –500µA, TA = TJ.
<
R
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNITS
Soft-Start/Reset Delay
Charge Current
V
V
SOFTSTART = 0.5V
SOFTSTART = 1V
–20
120
4.3
–9
230
4.7
300
–3
µA
µA
V
Discharge Current
Restart Threshold
Discharge Level
mV
Output Drivers
Output Low Level
IOUT = 50mA
0.2
1.2
1.5
1.7
0.4
2.6
2.5
2.6
V
V
V
V
I
I
OUT = 500mA
OUT = –50mA
Output High Level
IOUT = –500mA
Delay Set (UC1875 and UC1876 only)
Delay Set Voltage
IDELAY = –500µA
2.3
2.4
2.6
V
Delay Time, (Note 8)
I
DELAY = –250µA (Note 5) (UC3875/6/7/8,
150
250
400
nsec
UC2875/6/7/8)
IDELAY = –250µA (Note 5) (UC1875/6/7/8)
150
250
600
nsec
200
Note 1: Phase shift percentage (0% = 0°, 100% = 180°) is defined as θ =
fined in Figure 1. At 0% phase shift, F is the output skew.
Φ%, where q is the phase shift, and F and T are de-
T
Note 2: Delay time is defined as delay = T (1/2–(duty cycle)), where T is defined in Fig. 1.
Note 3: Ramp offset voltage has a temperature coefficient of about –4mV/°C.
Note 4: Zero phase shift voltage has a temperature coefficient of about –2mV/°C.
62 .5 •10–12
Note 5: Delay time can be programmed via resistors from the delay set pins to ground. Delay time ≅
sec. Where
IDELAY
Delay set voltage
I
=
The recommended range for I
is 25mA £ I
£ 1mA
DELAY
DELAY
DELAY
RDELAY
Note 6: Ramp delay to output time is defined in Fig. 2.
°
Note 7: Not production tested at -55 C.
Duty Cycle = t/T
(A to C) = T
Period = T
T
(B to D) = Φ
DHL
DHL
UDG-95074
UDG-95075
Phase Shift, Output Skew & Delay Time Definitions
Figure 1
Figure 2
5
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
PIN DESCRIPTIONS
CLOCKSYNC (bi-directional clock and synchronizationpin, any bypass capacitor on the VREF pin, bypass ca-
pin):Used as an output, this pin provides a clock signal. pacitors on VIN and the ramp capacitor, on the RAMP
As an input, this pin provides a synchronization point. In pin, should be connected directly to the ground plane
its simplest usage, multiple devices, each with their own near the signal ground pin.
local oscillator frequency, may be connected together by
OUTA-OUTD (outputs A-D):The outputs are 2A to-
the CLOCKSYNC pin and will synchronize on the fastest
tem-pole drivers optimized for both MOSFET gates and
oscillator. This pin may also be used to synchronize the
level-shifting transformers. The outputs operate as pairs
device to an external clock, provided the external signal
with a nominal 50% duty-cycle. The A-B pair is intended
is of higher frequency than the local oscillator. A resistor
to drive one half-bridge in the external power stage and
load may be needed on this pin to minimize the clock
is syncronized with the clock waveform. The C-D pair
pulse width.
will drive the other half-bridge with switching phase
E/AOUT (error amplifier outputT):his is is the gain stage shifted with respect to the A-B outputs.
for overall feedback control. Error amplifier output volt-
age levels below 1 volt will force 0° phase shift. Since the
PWRGND (power ground):VC should be bypassed with
a ceramic capacitor from the VC pin to the section of the
error amplifier has a relatively low current drive capabil-
ground plane that is connected to PWRGND. Any re-
ity, the output may be overridden by driving with a suffi-
quired bulk reservoir capacitor should parallel this one.
Power ground and signal ground may be joined at a sin-
ciently low impedance source.
CS+ (current sense):The non-inverting input to the cur- gle point to optimize noise rejection and minimize DC
rent-fault comparator whose reference is set internally to drops.
a fixed 2.5V (separate from VREF). When the voltage at
this pin exceeds 2.5V the current-fault latch is set, the
RAMP (voltage ramp):This pin is the input to the PWM
comparator. Connect a capacitor from here to GND. A
outputs are forced OFF and a SOFT-START cycle is initi-
voltage ramp is developed at this pin with a slope:
ated. If a constant voltage above 2.5V is applied to this
S ense Voltage
dV
pin the outputs are disabled from switching and held in a
low state until the CS+ pin is brought below 2.5V. The
outputs may begin switching at 0 degrees phase shift be-
fore the SOFTSTART pin begins to rise -- this condition
will not prematurely deliver power to the load.
=
dT RS LOPE • CRAMP
Current mode control may be achieved with a minimum
amount of external circuitry, in which case this pin pro-
vides slope compensation.
FREQSET (oscillator frequency set pinA):resistor and a
capacitor from FREQSET to GND will set the oscillator
frequency.
Because of the 1.3V offset between the ramp input and
the PWM comparator, the error amplifier output voltage
can not exceed the effective ramp peak voltage and duty
cycle clamping is easily achievable with appropriate val-
DELAYSET A-B, DELAYSET C-D (output delay control):
The user programmed current flowing from these pins to
GND set the turn-on delay for the corresponding output
pair. This delay is introduced between turn-off of one
switch and turn-on of another in the same leg of the
bridge to provide a dead time in which the resonant
switching of the external power switches takes place.
Separate delays are provided for the two half-bridges to
accommodate differences in the resonant capacitor
charging currents.
ues of RSLOPE and CRAMP
.
SLOPE (set ramp slope/slope compensationA):resistor
from this pin to VCC will set the current used to generate
the ramp. Connecting this resistor to the DC input line
voltage will provide voltage feed-forward.
SOFTSTART (soft start):SOFTSTART will remain at
GND as long as VIN is below the UVLO threshold.
SOFTSTART will be pulled up to about 4.8V by an inter-
nal 9µA current source when VIN becomes valid (assum-
ing a non-fault condition). In the event of a current-fault
(CS+ voltage exceeding 2.5V), SOFTSTART will be
pulled to GND and them ramp to 4.8V. If a fault occurs
during the SOFTSTART cycle, the outputs will be imme-
diately disabled and SOFTSTART must charge fully prior
to resetting the fault latch.
EA– (error amplifier inverting inpuTt)h:is is normally con-
nected to the voltage divider resistors which sense the
power supply output voltage level.
EA+ (error amplifier non-inverting inpuTth):is is normally
connected to a reference voltage used for comparison
with the sensed power supply output voltage level at the
EA+ pin.
For paralleled controllers, the SOFTSTART pins may be
paralled to a single capacitor, but the charge currents will
be additive.
GND (signal ground):All voltages are measured with re-
spect to GND. The timing capacitor, on the FREQSET
6
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
PIN DESCRIPTIONS (cont.)
VC (output switch supply voltage):This pin supplies NOTE: When VIN exceeds the UVLO threshold the sup-
power to the output drivers and their associated bias cir-
cuitry. Connect VC to a stable source above 3V for nor-
mal operation, above 12V for best performance. This
supply should be bypassed directly to the PWRGND pin
with low ESR, low ESL capacitors.
ply current (IIN) will jump from about 100µA to a current
in excess of 20µA. If the UC1875 is not connected to a
well bypassed supply, it may immediately enter UVLO
again.
VREF: This pin is an accurate 5V voltage reference. This
output is capable of delivering about 60mA to peripheral
circuitry and is internally short circuit current limited.
VREF is disabled while VIN is low enough to force the
chip into UVLO. The circuit is also in UVLO until VREF
reaches approximately 4.75V. For best results bypass
VREF with a 0.1µF, low ESR, low ESL, capacitor to the
GND pin.
VIN (primary chip supply voltage)T:his pin supplies
power to the logic and analog circuitry on the integrated
circuit that is not directly associated with driving the out-
put stages. Connect VIN to a stable source above 12V
for normal operation. To ensure proper chip functionality,
these devices will be inactive until VIN exceeds the up-
per undervoltage lockout threshold. This pin should by
bypassed directly to the GND pin with low ESR, low ESL
capacitors.
APPLICATION INFORMATION
Undervoltage Lockout Section
VIN
When power is applied to the circuit and VIN is below
the upper UVLO threshold, IIN will be below 600µA, the
reference generator will be off, the fault latch is reset,
the soft-start pin is discharged, and the outputs are ac-
tively held low. When VIN exceeds the upper UVLO
threshold, the reference generator turns on. All else re-
mains in the shut-down mode until the output of the ref-
erence, VREF, exceeds 4.75V.
GATE
INTERNAL
BIAS
10.75V/9.25V
REFERENCE
GENERATOR
VREF
GND
TO SOFT-
START
LOGIC
4.75V
UDG-99136
The high frequency oscillator may be either ternal resistor and capacitor to ground from the
free-running or externally synchronized. For FREQSET pin.
free-running operation, the frequency is set via an ex-
Simplified Oscillator Schematic
UDG-95077
UDG-95079
UDG-95078
7
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
APPLICATION INFORMATION (cont.)
Synchronizing The Oscillator
The CLOCKSYNC pin of the oscillator may be used to synchronize multiple UC1875 devices simply by connecting
the CLOCKSYNC of each UC1875 to the others:
1875/6/7/8s only
UDG-95080
All ICs will sync to chip with the fastest local oscillator.
R1 & RN may be needed to keep sync pulse narrow due to capacitance on line.
R1 & RN may also be needed to properly terminate RSYNC line.
Syncing to external TTL/CMOS
UDG-95081
ICs will sync to fastest chip or TTL clock if it is higher frequency.
R & RN may be needed for same reasons as above
Although each UC1875/6/7/8 has a local oscillator fre- Capacitive loading on the CLOCKSYNC pin will in-
quency, the group of devices will synchronize to the crease the clock pulse width, and may adversely effect
fastest oscillator driving the CLOCKSYNC pin. This ar- system performance. Therefore, a resistor to ground
rangement allows the synchronizing connection be- from the CLOCKSYNC pin is optional, but may be re-
tween ICs to be broken without any local loss of quired to offset capacitive loading on this pin. These re-
functionality.
sistors are shown in the oscillator schematics as R1,
RN.
Synchronizing the device to an external clock signal
may be accomplished with a minimum of external cir-
cuitry, as shown in the previous figure.
8
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
APPLICATION INFORMATION (cont.)
Delay Blocks And Output Stages
In each of the output stages, transistors Q3 through Q6 self-biased driver to hold Q6 on prior to the supply
form a high-speed totem-pole driver which will source reaching its turn-on threshold. This circuit is operable
or sink more than one amp peak with a total delay of when the chip supply is zero. Q6 is also turned on and
approximately 30 nanoseconds. To ensure a low output held low with a signal from the fault logic portion of the
level prior to turn-on, transistors Q7 through Q9 form a chip.
UDG-95082
The delay providing the dead-time is accomplished with 2.5V and the range of dead time control is
C1 which must discharge to VTH before the output can from 50 to 200 nanoseconds. NOTE: There is no way
go high. The time is defined by the current sources, I1, to disable the delay circuitry, and the delay time must
which is programmed by an external resistor, RTD. The be programmed.
voltage on the Delay Set pins is internally regulated to
Output Switch Orientation
The four outputs of the UC1875/6/7/8 interface to the full bridge converter switches as shown below:
UDG-95083
3 Winding Bifilar, AWG 30 Kynar Insulation
9
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
APPLICATION INFORMATION (cont.)
Fault/Soft-Start
The fault control circuitry provides two forms of power ceed while the phase-shift is advanced from zero to its
shutdown:
nominal value with the time constant of the
SOFT-START capacitor.
• Complete turn-off of all four output power stages.
• Clamping the phase shift command to zero.
The fault logic insures that a continuous fault will insti-
tute a low frequency “hiccup” retry cycle by forcing the
SOFT-START capacitor to charge through its full cycle
between each restart attempt.
Complete turn-off is ordered for an over-current fault or
a low supply voltage. When the SOFTSTART pin
reaches its low threshold, switching is allowed to pro-
UDG-95084
UDG-95085
10
UC1875/6/7/8
UC2875/6/7/8
UC3875/6/7/8
APPLICATIONS INFORMATION (cont.)
Slope/Ramp Pins
The ramp generator may be configured for the following The figure below shows a voltage-mode configuration.
control methods:
With RSLOPE tied to a stable voltage source, the wave-
form on CRAMP will be a constant-slope ramp, providing
conventional voltage-mode control. If RSLOPE is con-
nected to the power supply input voltage, a vari-
able-slope ramp will provide voltage feedforward.
• Voltage Mode
• Voltage Feedforward
• Current Mode
• Current Mode with Slope Compensation
Voltage Mode Operation
1. Simple voltage mode operation
achieved by placing RSLOPE between VIN
and SLOPE.
2. Voltage Feedforward achieved by plac-
ing RSLOPE between supply voltage and
SLOPE pin of UC1875.
RAMP
VRslope
dV
≈
dT RS LOPE • CRAMP
UDG-95086
For current-mode control the ramp generator may be disabled by grounding the slope pin and using the ramp pin
as a direct current sense input to the PWM comparator.
CONTACT INFORMATION
If you should have questions or need additional information, please contact Jody Bustamante at (903) 868-6132 or
j-busta@ti.com.
11
PACKAGE OPTION ADDENDUM
www.ti.com
19-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
LCCC
CDIP
TO-92
LCCC
CDIP
CDIP
CDIP
CDIP
LCCC
LCCC
SOIC
Drawing
5962-9455501M3A
5962-9455501MRA
5962-9455501MXA
5962-9455501V3A
5962-9455501VRA
UC1875J
ACTIVE
ACTIVE
OBSOLETE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
FK
J
28
20
28
28
20
20
20
20
28
28
28
1
1
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
POST-PLATE Level-NC-NC-NC
A42 SNPB
Call TI
Level-NC-NC-NC
Call TI
LP
FK
J
1
1
1
1
Call TI
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Level-NC-NC-NC
Call TI
Call TI
J
A42 SNPB
A42 SNPB
Call TI
UC1875J883B
UC1875JQMLV
UC1875L
J
J
FK
FK
DW
1
1
POST-PLATE Level-NC-NC-NC
POST-PLATE Level-NC-NC-NC
UC1875L883B
UC2875DWP
20 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC2875DWPG4
UC2875DWPTR
UC2875DWPTRG4
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
DW
DW
DW
28
28
28
20 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC2875J
UC2875N
ACTIVE
ACTIVE
CDIP
PDIP
J
20
20
1
TBD
A42 SNPB
Level-NC-NC-NC
N
20 Green (RoHS & CU NIPDAU Level-NC-NC-NC
no Sb/Br)
UC2875NG4
ACTIVE
PDIP
N
20
20 Green (RoHS & CU NIPDAU Level-NA-NA-NA
no Sb/Br)
UC2875QP
UC2876N
ACTIVE
ACTIVE
PLCC
PDIP
FN
N
28
20
37
TBD
Call TI
Level-2-220C-1 YEAR
20 Green (RoHS & CU NIPDAU Level-NC-NC-NC
no Sb/Br)
UC3875DWP
UC3875DWPG4
UC3875DWPTR
UC3875DWPTRG4
UC3875N
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
DW
DW
DW
DW
N
28
28
28
28
20
20
20 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-NC-NC-NC
no Sb/Br)
UC3875NG4
N
20 Green (RoHS & CU NIPDAU Level-NC-NC-NC
no Sb/Br)
UC3875QP
UC3875QPTR
UC3876N
ACTIVE
ACTIVE
ACTIVE
PLCC
PLCC
PDIP
FN
FN
N
28
28
20
37
TBD
TBD
Call TI
Call TI
Level-2-220C-1 YEAR
Level-2-220C-1 YEAR
750
20 Green (RoHS & CU NIPDAU Level-NC-NC-NC
no Sb/Br)
UC3877DWPTR
ACTIVE
SOIC
DW
28
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
19-Oct-2005
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MPLC004A – OCTOBER 1994
FN (S-PQCC-J**)
PLASTIC J-LEADED CHIP CARRIER
20 PIN SHOWN
Seating Plane
0.004 (0,10)
0.180 (4,57) MAX
0.120 (3,05)
D
0.090 (2,29)
D1
0.020 (0,51) MIN
3
1
19
0.032 (0,81)
0.026 (0,66)
4
18
D2/E2
D2/E2
E
E1
8
14
0.021 (0,53)
0.013 (0,33)
0.050 (1,27)
9
13
0.007 (0,18)
M
0.008 (0,20) NOM
D/E
D1/E1
D2/E2
NO. OF
PINS
**
MIN
0.385 (9,78)
MAX
MIN
MAX
MIN
MAX
0.395 (10,03)
0.350 (8,89)
0.356 (9,04)
0.141 (3,58)
0.191 (4,85)
0.291 (7,39)
0.341 (8,66)
0.169 (4,29)
0.219 (5,56)
0.319 (8,10)
0.369 (9,37)
20
28
44
52
68
84
0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58)
0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66)
0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20)
0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91)
1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45)
4040005/B 03/95
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
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Following are URLs where you can obtain information on other Texas Instruments products and application
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Products
Applications
Audio
Amplifiers
amplifier.ti.com
www.ti.com/audio
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dataconverter.ti.com
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www.ti.com/automotive
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dsp.ti.com
Broadband
Digital Control
Military
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
Logic
interface.ti.com
logic.ti.com
Power Mgmt
Microcontrollers
power.ti.com
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Security
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
microcontroller.ti.com
Telephony
Video & Imaging
Wireless
www.ti.com/wireless
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Post Office Box 655303 Dallas, Texas 75265
Copyright 2005, Texas Instruments Incorporated
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