UC3524ADWTR [TI]
Advanced Regulating Pulse Width Modulators; 高级稳压脉宽调制器
| 型号： | UC3524ADWTR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Advanced Regulating Pulse Width Modulators |
| 文件： | 总16页 (文件大小：3480K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
LCCC
LCCC
SOIC
Drawing
5962-8764502EA
UC1524AJ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
16
16
16
20
20
16
1
1
1
1
1
TBD
TBD
TBD
TBD
TBD
A42 SNPB
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
UC1524AJ883B
UC1524AL
J
FK
FK
DW
POST-PLATE N / A for Pkg Type
POST-PLATE N / A for Pkg Type
UC1524AL883B
UC2524ADW
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC2524ADWG4
UC2524ADWTR
UC2524ADWTRG4
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
DW
DW
DW
16
16
16
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC2524AJ
UC2524AN
ACTIVE
ACTIVE
CDIP
PDIP
J
16
16
1
TBD
A42 SNPB
N / A for Pkg Type
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UC2524ANG4
UC3524ADW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
SOIC
SOIC
N
16
16
16
16
16
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
DW
DW
DW
DW
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC3524ADWG4
UC3524ADWTR
UC3524ADWTRG4
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
UC3524AJ
UC3524AN
ACTIVE
ACTIVE
CDIP
PDIP
J
16
16
1
TBD
A42 SNPB
N / A for Pkg Type
N
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
UC3524ANG4
ACTIVE
PDIP
N
16
25 Green (RoHS & CU NIPDAU N / A for Pkg Type
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
4-Feb-2008
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
UC2524ADWTR
UC3524ADWTR
SOIC
SOIC
DW
DW
16
16
2000
2000
330.0
330.0
16.4
16.4
10.85
10.85
10.8
10.8
2.7
2.7
12.0
12.0
16.0
16.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
UC2524ADWTR
UC3524ADWTR
SOIC
SOIC
DW
DW
16
16
2000
2000
346.0
346.0
346.0
346.0
33.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
A
B
NO. OF
TERMINALS
**
18 17 16 15 14 13 12
MIN
MAX
MIN
MAX
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
19
20
11
10
9
20
28
44
52
68
84
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
B SQ
22
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
8
A SQ
23
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
7
24
25
6
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
5
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
26 27 28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140/D 10/96
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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