UC3548Q [TI]

2.2A SWITCHING CONTROLLER, 1000kHz SWITCHING FREQ-MAX, PQCC20, PLASTIC, LCC-20;
UC3548Q
型号: UC3548Q
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2.2A SWITCHING CONTROLLER, 1000kHz SWITCHING FREQ-MAX, PQCC20, PLASTIC, LCC-20

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UC1548  
UC2548  
UC3548  
Primary Side PWM Controller  
FEATURES  
BLOCK DIAGRAM  
Primary Side Voltage Feed-  
forward Control of Isolated Power  
Supplies  
Accurate DC Control of  
Secondary Side Short Circuit  
Current using Primary Side  
Average Current Mode Control  
Accurate Programmable  
Maximum Duty Cycle Clamp  
Maximum Volt-Second Product  
Clamp to Prevent Core Saturation  
Practical Operation Up to 1MHz  
High Current (2A Pk) Totem Pole  
Output Driver  
Wide Bandwidth (8MHz) Current  
Error Amplifier  
Undervoltage Lockout Monitors  
VCC, VIN and VREF  
Output Active Low During UVLO  
Low Startup Current (500µA)  
UDG-95037  
Pin numbers refer to 16-pin DIL and SOIC packages only.  
DESCRIPTION  
The UC3548 family of PWM control ICs uses voltage feed- driver. The current error amplifier easily interfaces with an  
forward control to regulate the output voltage of isolated optoisolator from a secondary side voltage sensing circuit.  
power supplies. The UC3548 resides on the primary side  
A full featured undervoltage lockout (UVLO) circuit is con-  
and has the necessary features to accurately control sec-  
tained in the UC3548. UVLO monitors the supply voltage  
ondary side short circuit current with average current  
to the controller (VCC), the reference voltage (VREF), and  
mode control techniques. The UC3548 can be used to  
the input line voltage (VIN). All three must be good before  
control a wide variety of converter topologies.  
soft start commences. If either VCC or VIN is low, the sup-  
In addition to the basic functions required for pulse width  
modulation, the UC3548 implements a patented technique  
of sensing secondary current from the primary side in an  
isolated buck derived converter. A current waveform syn-  
thesizer monitors switch current and simulates the inductor  
current downslope so that the complete current waveform  
can be constructed on the primary side without actual sec-  
ondary side measurement. This information on the primary  
side is used by an average current mode control circuit to  
accurately limit maximum output current.  
ply current required by the chip is only 500µA and the  
output is actively held low.  
Two on board protection features set controlled limits to  
prevent transformer core saturation. Input voltage is moni-  
tored and pulse width is constrained to limit the maximum  
volt-second product applied to the transformer. A unique  
patented technique limits maximum duty cycle within 3%  
of a user programmed value.  
These two features allow for more optimal use of trans-  
formers and switches, resulting in reduced system size  
and cost.  
The UC3548 circuitry includes a precision reference, a  
wide bandwidth error amplifier for average current control,  
an oscillator to generate the system clock, latching PWM  
comparator and logic circuits, and a high current output  
Both patents embodied in the UC3548 belong to Lambda  
Electronics Incorporated and are licensed for use in appli-  
cations employing these devices.  
4/97  
UC1548  
UC2548  
UC3548  
ABSOLUTE MAXIMUM RATINGS  
Supply Voltage (Pin 15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22V  
Output Current, Source or Sink (Pin 14)  
Analog Output Currents, Source or Sink (Pins 5 & 10) . . . 5mA  
Power Dissipation at TA = 60°C . . . . . . . . . . . . . . . . . . . . . . . . 1W  
Storage Temperature Range. . . . . . . . . . . . . . . 65°C to +150°C  
Lead Temperature (Soldering 10 seconds) . . . . . . . . . . +300°C  
Notes: All voltages are with respect to ground (DIL and SOIC  
pin 1). Currents are positive into the specified terminal.  
Pin numbers refer to the 16 pin DIL and SOIC packages.  
Consult Packaging Section of Databook for thermal  
DC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5A  
Pulse (0.5µs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2A  
±
Power Ground to Ground (Pin 1 to Pin 13) . . . . . . . . . . . 0.2V  
Analog Input Voltages  
(Pins 3, 4, 7, 8, 12, 16) . . . . . . . . . . . . . . . . . . . . . -0.3 to 7V  
Analog Input Currents, Source or Sink  
(Pins 3, 4, 7, 8, 11, 12, 16) . . . . . . . . . . . . . . . . . . . . . . 1mA  
limitations and considerations of packages.  
CONNECTION DIAGRAMS  
DIL-16, SOIC-16 (Top View)  
J, N, or DW Packages  
PLCC-20 & LCC-20 (Top View)  
Q & L Packages  
ELECTRICAL CHARACTERISTICS Unless otherwise stated, all specifications are over the junction temperature range of  
55°C to +125°C for the UC1548, 40°C to +85°C for the UC2548, and 0°C to +70°C for the UC3548. Test conditions are: VCC =  
12V, CT = 400pF, CI = 100pF, IOFF = 100µA, CDC = 100nF, Cvs = 100pF, and Ivs = 400µA, TA = TJ.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
Real Time Current Waveform Synthesizer  
Ion Amplifier  
Offset Voltage  
Slew Rate (Note 1)  
lib  
0.95  
20  
1
1.05  
-20  
V
25  
-2  
V/µs  
µA  
IOFF Current Mirror  
Input Voltage  
Current Gain  
Current Error Amplifier  
AVOL  
0.95  
0.9  
1
1
1.05  
1.1  
V
A/A  
60  
100  
dB  
mV  
µA  
Vio  
12V VCC 20V, 0V VCM 5V  
10  
-3  
lib  
-0.5  
3.3  
0.3  
1.6  
8
Voh  
IO = 200µA  
IO = 200µA  
VO = 1V  
3.1  
3.5  
0.6  
2.0  
V
Vol  
V
Source Current  
GBW Product  
Slew Rate (Note 1)  
Oscillator  
1.4  
5
mA  
MHz  
V/µs  
f = 200kHz  
8
10  
Frequency  
TA = 25°C  
240  
235  
250  
260  
265  
kHz  
kHz  
2
UC1548  
UC2548  
UC3548  
ELECTRICAL CHARACTERISTICS (cont.): Unless otherwise stated, all specifications are over the junction  
temperature range of 55°C to +125°C for the UC1548, 40°C to +85°C for the UC2548, and 0°C to +70°C for the UC3548. Test  
conditions are: VCC = 12V, CT = 400pF, CI = 100pF, IOFF = 100µA, CDC = 100nF, Cvs = 100pF, and Ivs = 400µA, TA = TJ.  
PARAMETER  
Duty Cycle Clamp  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
Max Duty Cycle  
VCC Comparator  
Turn-on Threshold  
Turn-off Threshold  
Hysteresis  
V(DMAX) = 0.75 VREF  
73.5  
76.5  
79.5  
14  
%
13  
10  
3
V
V
V
9
2.5  
3.5  
UV Comparator  
Turn-on Threshold  
RHYSTERESIS  
4.1  
77  
4.35  
90  
4.6  
V
Vuv = 4.2V  
103  
kΩ  
Reference  
VREF  
TA = 25°C  
4.95  
4.93  
5
5.05  
5.07  
15  
V
0 < IO < 10mA, 12 < VCC < 20  
12V < VCC < 20V  
0 < IO < 10mA  
V
Line Regulation  
Load Regulation  
4
3
mV  
mV  
mA  
15  
Short Circuit Current  
Output Stage  
VREF = 0V  
30  
50  
70  
Rise & Fall Time (Note 1)  
Output Low Saturation  
Cl = 1nF  
20  
0.25  
1.2  
45  
0.4  
2.2  
3.0  
1.2  
ns  
V
IO = 20mA  
IO = 200mA  
IO = -200mA  
IO = 20mA  
V
Output High Saturation  
2.0  
V
UVLO Output Low Saturation  
0.8  
V
ICC  
ISTART  
VCC = 12V  
0.2  
0.5  
22  
0.4  
1
mA  
mA  
mA  
ICC (pre-start)  
ICC (run)  
VCC = 15V, V(UV) = 0  
26  
Note 1: Guaranteed by design. Not 100% tested in production.  
PIN DESCRIPTIONS  
CAO: Output of the current error amplifier. Also the  
ION: Input pin to inductor current waveform synthesizer.  
resistor load for the collector of an optocoupler.  
Apply a voltage proportional to switch current to this pin.  
CDC: Connect a charge balance integration capacitor  
from CDC to GND to achieve an accurate duty cycle  
clamp. This capacitor also sets the soft start time.  
NI: Noninverting input of the current error amplifier.  
OUT: Output driver for the gate of a power FET.  
PGND: Power ground pin for the output driver. This  
ground circuit should be connected to GND at a single  
point.  
CI: Output of the inductor current waveform synthesizer.  
Requires a capacitor to ground.  
CT: A capacitor from CT to GND sets the oscillator  
frequency.  
UV: Line voltage sense pin to insure the chip only  
operates with sufficient line voltage. Program with a  
resistive divider from the converter input voltage to UV  
to GND.  
DMAX: Programs maximum duty cycle with a resistive  
divider from VREF to DMAX to GND.  
GND: Signal ground.  
VCC: Chip supply voltage. Bypass with a 1µF ceramic  
capacitor to PGND.  
INV: Inverting input of the current error amplifier.  
VREF: Precision voltage reference. Bypass with a 1µF  
ceramic capacitor to GND.  
IOFF: Programs the discharge slope of the capacitor on  
CI to emulate the down slope of the inductor current  
waveform.  
VS: Volt second clamp programming pin and feedforward  
ramp waveform for the pulse width modulator. Connect a  
resistor to the input line voltage and a capacitor to GND.  
3
UC1548  
UC2548  
UC3548  
UNDERVOLTAGE LOCKOUT  
The undervoltage lockout block diagram is shown in Fig-  
ure 1. The VCC comparator monitors chip supply voltage.  
Hysteretic thresholds are set at 13V and 10V to facilitate  
off-line applications. If the VCC comparator is low, ICC is  
low (<500µA) and the output is low.  
When the UV comparator is low, ICC is low (<500µA) and  
the output is low.  
When both the UV and VCC comparators are high, the in-  
ternal bias circuitry for the remainder of the chip is  
activated. The CDC pin (see discussion on Maximum Duty  
Cycle Control and Soft Start) and the Output are held low  
until VREF exceeds the 4.5V threshold of the VREF com-  
parator. When VREF is good, control of the output driver is  
transferred to the PWM circuitry and CDC is allowed to  
charge.  
The UV comparator monitors input line voltage (VIN). A  
pair of resistors divides the input line to UV. Hysteretic in-  
put line thresholds are programmed by Rv1 and Rv2. The  
thresholds are  
VIN(on) = 4.35V (1 + Rv1/Rv2) and  
VIN(off) = 4.35V (1 + Rv1/Rv2) where  
Rv2= Rv2||90k.  
If any of the three UVLO comparators go low, the UVLO  
latch is set, the output is held low, and CDC is discharged.  
This state will be maintained until all three comparators are  
high and the CDC pin is fully discharged.  
The resulting hysteresis is  
VIN(hys) = 4.35V Rv1 / 90k.  
UDG-95038  
Figure 1: Undervoltage Lockout  
Frequency Decrease as a Function of RT  
Oscillator Frequency as a Function of CT  
2000  
RT = Open  
1000  
500  
100  
20  
500  
1000  
5000  
50 100  
C (pF)  
UDG-95039  
Figure 2: Oscillator Frequency  
4
UC1548  
UC2548  
UC3548  
OSCILLATOR  
A capacitor from the CT pin to GND programs oscillator for the output driver. If the maximum duty cycle control is  
frequency, as shown in Figure 2. Frequency is determined defeated by connecting DMAX to VREF, the maximum  
by:  
duty cycle is limited by the oscillator to 90%. If an adjust-  
ment is required, an additional trim resistor RT from CT to  
F = 1 / (10k CT).  
The sawtooth wave shape is generated by a charging cur- ground can be used to adjust the oscillator frequency. RT  
should not be less than 40kohms. This will allow up to a  
22% decrease in frequency.  
rent of 200µA and a discharge current of 1800µA. The  
discharge time of the sawtooth is guaranteed dead time  
UDG-95040  
Figure 3: Error Amplifier Gain and Phase Response over Frequency  
INDUCTOR CURRENT WAVEFORM SYNTHESIZER  
Average current mode control is a very useful technique the input to the follower. The discharge current is pro-  
to control the value of any current within a switching con- grammed at IOFF.  
verter. Input current, output inductor current, switch  
The follower has a one volt offset, so that zero current  
current, diode current or almost any other current can be  
corresponds to one volt at CI. The best utilization of the  
controlled. In order to implement average current mode  
UC3548 is to translate maximum average inductor current  
control, the value of the current must be explicitly known  
to a 4 volt signal level. Given N and Ns (the turns ratio of  
at all times. To control output inductor current (IL) in a  
the power and current sense transformers respectively),  
buck derived isolated converter, switch current provides  
proper scaling of IL to V(CI) requires a sense resistor Rs  
inductor current information, but only during the on time of  
as calculated from:  
the switch. During the off time, switch current drops  
Rs = 4V Ns N / IL(max).  
Restated, the maximum average inductor current will be  
limited to:  
abruptly to zero, but the inductor current actually dimin-  
ishes with a slope dIL/dt = Vo/L. This down slope must  
be synthesized in some manner on the primary side to  
IL(max) = 4V Ns N/Rs.  
provide the entire inductor current waveform for the con-  
IOFF and CI need to be chosen so that the ratio of  
trol circuit.  
dV(CI)/dt to dIL/dt is the same during switch off time as  
The patented current waveform synthesizer (Figure 4) on time. Recommended nominal off current is 100µA.  
consists of a unidirectional voltage follower which forces This requires  
the voltage on capacitor CI to follow the on time switch  
current waveform. A programmable discharge current  
synthesizes the off time portion of the waveform. ION is  
CI = (100µA N Ns L) / (Rs Vo(nom))  
where L is the output inductor value and Vo(nom) is the  
converter regulated output voltage.  
5
UC1548  
UC2548  
UC3548  
INDUCTOR CURRENT WAVEFORM SYNTHESIZER (cont.)  
There are several methods to program IOFF. If accurate even during short circuit conditions. Actual inductor  
maximum current control is required, IOFF must track out- downslope is closer to zero during a short circuit. The  
put voltage. The method shown in Figure 4 derives a penalty is that the average current is understated by an  
voltage proportional to VIN D (where D = duty cycle). In amount approximately equal to the nominal inductor rip-  
a buck converter, output voltage is proportional to VIN ple current. Output short circuit is therefore higher than  
D. A resistively loaded diode connection to the bootstrap the designed maximum output current.  
winding yields a square wave whose amplitude is propor-  
A third method of generating IOFF is to add a second  
tional to VIN and is duty cycle modulated by the control  
winding to the output inductor core (Figure 6). When the  
circuit. Averaging this waveform with a filter generates a  
power switch is off and inductor current flows in the free  
primary side replica of secondary regulated Vo. A single  
wheeling diode, the voltage across the inductor is equal  
pole filter is shown, but in practice a two or three pole filter  
to the output voltage plus the diode drop. This voltage is  
provides better transient response. Filtered voltage is con-  
then transformed by the second winding to the primary  
verted by ROFF to a current to the IOFF pin to control CI  
side of the converter. The advantages to this approach  
are its inherent accuracy and bandwidth. Winding the sec-  
downslope.  
If accurate system maximum current is not a critical re- ond coil on the output inductor core while maintaining the  
quirement, Figure 5 shows the simplest method of required isolation makes this a more costly solution. In the  
downslope generation: a single resistor (ROFF = 40k)  
example, ROFF = Vo / 100µA. The 4 ROFF resistor is  
from IOFF to VREF. The discharge current is then 100µA. added to compensate the one volt input level of the IOFF  
The disadvantage to this approach is that the synthesizer pin. Without this compensation, a minor current foldback  
continues to generate a down slope when the switch is off behavior will be observed.  
UDG-95041  
Figure 4: Inductor Current Waveform Synthesizer  
UDG-95042  
UDG-95043  
Figure 6: Second Inductor Winding Generation of IOFF  
Figure 5: Fixed IOFF  
6
UC1548  
UC2548  
UC3548  
The soft start time constant is approximately:  
FEED FORWARD PULSE WIDTH MODULATION  
T(ss) = 20k CDC.  
Pulse width modulation is achieved by comparing the out-  
put of the current error amplifier to the feed forward ramp  
generated at VS (Figure 7). The charge slope of the ramp  
is determined by a resistor (RVS) from VS to VIN and a  
capacitor (CVS) from VS to GND. In the event that CAO is  
at its maximum voltage, typically 3.3V, the UC3548 will  
limit the power stage to a volt-second product of:  
GROUND PLANES  
The output driver on the UC3548 is capable of 2A peak  
currents. Careful layout is essential for correct operation  
of the chip. A ground plane must be employed (Figure 8).  
A unique section of the ground plane must be designated  
for high di/dt currents associated with the output stage.  
This point is the power ground to which to PGND pin is  
connected. Power ground can be separated from the rest  
of the ground plane and connected at a single point, al-  
though this is not strictly necessary if the high di/dt paths  
are well understood and accounted for. VCC should be  
bypassed directly to power ground with a good high fre-  
quency capacitor. The source of the power MOSFET  
should connect to power ground as should the return con-  
nection for input power to the system and the bulk input  
capacitor. The output should be clamped with a high cur-  
rent Schottky diode to both VCC and PGND. Nothing else  
should be connected to power ground.  
VIN TON(max) = 3.3V Rvs Cvs.  
An isolated voltage control loop can be implemented with  
a secondary side reference, error amplifier and an opto-  
isolator. The optoisolator can be used to override the  
current amplifier output which is current limited by a 2.5k  
resistor. In overcurrent situations, the voltage loop turns  
the optoisolator off and the current error amplifier then as-  
sumes duty cycle control resulting in accurately limited  
maximum output current.  
MAXIMUM DUTY CYCLE AND SOFT START  
A patented technique is used to accurately program maxi-  
mum duty cycle. Programming is accomplished by a  
divider from VREF to DMAX (Figure 7). The value pro-  
grammed is:  
VREF should be bypassed directly to the signal portion of  
the ground plane with a good high frequency capacitor.  
Low ESR/ESL ceramic 1µF capacitors are recommended  
for both VCC and VREF. The capacitors from CT, CDC, CI  
and VS should likewise be connected to the signal ground  
plane.  
D(max) = Rd1 / (Rd1 + Rd2).  
For proper operation, the integrating capacitor, CDC,  
should be larger than T(osc) / 80k, where T(osc) is the os-  
cillator period. CDC also sets the soft start time constant,  
so values of CDC larger than minimum may be desired.  
UDG-95044  
UDG-95045-1  
Figure 7: Duty Cycle Control  
7
UC1548  
UC2548  
UC3548  
UDG-95046  
Figure 8: Ground Plane Considerations  
UDG-95047-1  
Figure 9: Typical Application - Voltage Feedforward Control Isolated Forward Converter with Average Current Limiting  
UNITRODE CORPORATION  
7 CONTINENTAL BLVD. MERRIMACK, NH 03054  
TEL. (603) 424-2410 FAX (603) 424-3460  
8
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
UC3548N  
OBSOLETE  
PDIP  
N
16  
TBD  
Call TI  
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
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Addendum-Page 1  
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