UC5603Z [TI]

9-LINE 110ohm SCSI BUS TERMINATOR, PZIP16, ZIP-16;


型号：	UC5603Z
厂家：	TEXAS INSTRUMENTS
描述：	9-LINE 110ohm SCSI BUS TERMINATOR, PZIP16, ZIP-16 接口集成电路
文件：	总11页 (文件大小：344K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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ꢆ ꢇꢈ ꢉꢊꢋ ꢌꢁꢌ ꢉ ꢍꢁꢎ ꢉ ꢏꢋ ꢎ ꢋꢐ ꢑꢉ ꢊ ꢍꢎꢒ ꢐ

ꢓ

SLUS195B − MARCH 1997 − REVISED NOVEMBER 2003

Complies with SCSI, SCSI−2 and SPI−2

Standards

Logic Command Disconnects all

Termination Lines

6-pF Channel Capacitance during

Disconnect

Trimmed Termination Current to 3%

Trimmed Impedance to 3%

100-µA Supply Current in Disconnect Mode

Meets SCSI Hot Plugging

Negative Clamping on all Signal Lines

Current Limit and Thermal Shutdown

Protection

−400-mA Sourcing Current for Termination

+400-mA Sinking Current for Active

Negation Drivers

description

The UC5603 provides 9 lines of active termination for a SCSI (Small Computers Systems Interface) parallel bus.

The SCSI standard recommends active termination at both ends of the cable segment.

The UC5603 provides a disconnect feature which, when opened or driven high, will disconnect all terminating

resistors, and disables the regulator; greatly reducing standby power. The output channels remain high

impedance even without Termpwr applied. A low channel capacitance of 6 pF allows units at interim points of

the bus to have little to no effect on the signal integrity.

Functionally the UC5603 is similar to its predecessor, the UC5601 − 18 line Active Terminator. Several electrical

enhancements were incorporated in the UC5603, such as a sink/source regulator output stage to accommodate

all signal lines at 5 V, while the regulator remains at its nominal value, reduced channel capacitance to 6 pF

typical, and as with the UC5601, custom power packages are utilized to allow normal operation at full power

conditions (1.2 watts).

functional block diagram

UDG-94049

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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ꢀ ꢁꢂꢃ ꢄꢅ

ꢆꢇ ꢈ ꢉ ꢊꢋ ꢌꢁ ꢌꢉ ꢍ ꢁꢎ ꢉ ꢏꢋ ꢎꢋ ꢐ ꢑꢉ ꢊꢍꢎꢒ ꢐ

ꢓ

SLUS195B − MARCH 1997 − REVISED NOVEMBER 2003

description (continued)

Internal circuit trimming is utilized, first to trim the impedance to a 3% tolerance, and then most importantly, to

trim the output current to a 3% tolerance, as close to the max SCSI spec as possible, which maximizes noise

margin in fast SCSI operation.

Other features include negative clamping on all signal lines to protect external circuitry from latch-up, thermal

shutdown and current limit.

This device is offered in low thermal resistance versions of the industry standard 16 pin narrow body SOIC.

connection diagrams

DP PACKAGE

(TOP VIEW)

N PACKAGE

(TOP VIEW)

LINE6

LINE5

REG

LINE7

LINE8

LINE7

LINE8

LINE6

LINE5

REG

N/C

LINE9

GND*

N/C

GND*

SGND*

DISCNCT

LINE1

SGND

DISCNCT

LINE1

N/C

TRMPWR

LINE4

LINE3

11 TRMPWR

10 LINE4

LINE2

LINE3

* DP package pin 5 serves as signal ground; pins 4,

12, 13 serve as heatsink/ground.

ORDERING INFORMATION

Packaged Devices

= T

DIL -16(N)

UC5603N

SOIC-16 (DP){

0°C to 70°C

UCUC5603DP

†

DP (SOIC−16) packages are available taped and reeled. Add TR suffix to device type (e.g.

UC5603DPTR) to order quantities of 2000 devices per reel.

www.ti.com

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ꢆ ꢇꢈ ꢉꢊꢋ ꢌꢁ ꢌꢉ ꢍꢁꢎ ꢉ ꢏꢋ ꢎ ꢋꢐꢑ ꢉ ꢊꢍꢎꢒ ꢐ

ꢓ

SLUS195B − MARCH 1997 − REVISED NOVEMBER 2003

†}

absolute maximum ratings over operating free-air temperature (unless otherwise noted)

Termpwr voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V

Signal line voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 7 V

Regulator output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5 A

Storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C

Operating temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C

Lead temperature (soldering, 10 sec.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

†

‡

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Unless otherwise specified all voltages are with respect to Ground. Currents are positive into, negative out of the specified terminal. Consult

Packaging Section of Unitrode Integrated Circuits databook for thermal limitations and considerations of packages.

recommended operating conditions

Termpwr voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 V to 5.25 V

Signal line voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to 5 V

Disconnect input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to Termpwr

electrical characteristics, these specifications apply for T = 0°C to 70°C. TRMPWR = 4.75 V

DISCNCT = 0 V, T = T , (unless otherwise stated)

supply current section

PARAMETER

TEST CONDITIONS

All termination lines = Open

MIN

TYP

MAX

UNITS

Termpwr supply current

Power down mode

All termination lines = 0.5 V

DISCNCT = Open

200

100

220

150

µA

output section (terminator lines)

PARAMETER

TEST CONDITIONS

= −5 mA to −15 mA

MIN

107

2.7

TYP

110

2.9

MAX

UNITS

Ω

Terminator impedance

Output high voltage

∆I

113

LINE

= 4 V,

See Note 1

TRMPWR

T = 25°C

−21.1 −21.9 −22.4

−20.5 −21.9 −22.4

−20.3 −21.9 −22.4

−19.8 −21.9 −22.4

−22.0 −24.0 −25.4

Max output current

= 0.5 V

LINE

0°C < T < 70°C

T = 25°C

= 0.5 V,

TRMPWR = 4 V,

LINE

See Note 1

0°C < T < 70°C

Max output current

Output clamp level

= 0.2 V,

LINE

= −30 mA

TRMPWR = 4.0 V to 5.25 V

0°C < T < 70°C

−0.2 −0.05

0.1

400

100

LINE

= 0 to 4 V

= 5.25 V

LINE

TRMPWR = 0 V to 5.25,

VREG = 0 V

µA

LINE

Output leakage

DISCNCT = 4 V

TRMPWR = 0 V to 5.25 V,

REG = Open

400

LINE

= 0 V to 5.25 V

Output capacitance

DISCNCT = Open

See Note 2

DP Package

NOTES: 1. Measuring each termination line while other 8 are low (0.5 V).

2. Ensured by design. Not production tested.

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ꢆꢇ ꢈ ꢉ ꢊꢋ ꢌꢁ ꢌꢉ ꢍ ꢁꢎ ꢉ ꢏꢋ ꢎꢋ ꢐ ꢑꢉ ꢊꢍꢎꢒ ꢐ

ꢓ

SLUS195B − MARCH 1997 − REVISED NOVEMBER 2003

regulator section

PARAMETER

TEST CONDITIONS

MIN

2.8

TYP

2.9

MAX

UNITS

Regulator output voltage

Line regulation

All termination lines = 5 V

TRMPWR = 4 V to 6 V

= 100 mA to −100 mA

2.9

Load regulation

REG

All termination lines = 0.5 V

Drop out voltage

0.7

Short circuit current

Sinking current capability

Thermal shutdown

= 0 V

−200 −400 −600

°C

REG

= 3.5 V

200

400

170

600

REG

Thermal shutdown hysteresis

disconnect section

PARAMETER

Disconnect threshold

Threshold hysteresis

Input current

TEST CONDITIONS

MIN

1.3

TYP

1.5

160

MAX

1.7

UNITS

100

250

DISCNCT = 0 V

APPLICATION INFORMATION

UDG-94050

Figure 1. Typical Wide SCSI Bus Configurations Utilizing 1 UC5601 and 1 UC5603 Device

www.ti.com

ꢀ ꢁꢂ ꢃꢄ ꢅ

ꢆ ꢇꢈ ꢉꢊꢋ ꢌꢁ ꢌꢉ ꢍꢁꢎ ꢉ ꢏꢋ ꢎ ꢋꢐꢑ ꢉ ꢊꢍꢎꢒ ꢐ

ꢓ

SLUS195B − MARCH 1997 − REVISED NOVEMBER 2003

APPLICATION INFORMATION

UDG-94051

Figure 2. Typical Wide SCSI Bus Configurations Utilizing 3 UC5603 Devices

www.ti.com

PACKAGE OPTION ADDENDUM

www.ti.com

7-Oct-2013

PACKAGING INFORMATION

Orderable Device

UC5603DP

Status Package Type Package Pins Package

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

0 to 70

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

LIFEBUY

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

UC5603DP

UC5603DPG4

LIFEBUY

Green (RoHS

& no Sb/Br)

Level-2-260C-1 YEAR

0 to 70

UC5603DP

UC5603DPR

UC5603DPRTR

UC5603DPTR

UC5603DPTRG4

UC5603J

NRND

SOIC

CDIP

PLCC

TBD

Call TI

0 to 70

OBSOLETE

NRND

UC5603DP

UC5603QP

UC5603QPTR

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

7-Oct-2013

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

MECHANICAL DATA

MPLC004A – OCTOBER 1994

FN (S-PQCC-J**)

PLASTIC J-LEADED CHIP CARRIER

20 PIN SHOWN

Seating Plane

0.004 (0,10)

0.180 (4,57) MAX

0.120 (3,05)

0.090 (2,29)

0.020 (0,51) MIN

0.032 (0,81)

0.026 (0,66)

D2/E2

0.021 (0,53)

0.013 (0,33)

0.050 (1,27)

0.007 (0,18)

0.008 (0,20) NOM

D/E

D1/E1

D2/E2

NO. OF

PINS

MIN

0.385 (9,78)

MAX

MIN

MAX

MIN

MAX

0.395 (10,03)

0.350 (8,89)

0.356 (9,04)

0.141 (3,58)

0.191 (4,85)

0.291 (7,39)

0.341 (8,66)

0.169 (4,29)

0.219 (5,56)

0.319 (8,10)

0.369 (9,37)

0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58)

0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66)

0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20)

0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91)

1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45)

4040005/B 03/95

NOTES: A. All linear dimensions are in inches (millimeters).

B. This drawing is subject to change without notice.

C. Falls within JEDEC MS-018

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UC5603Z [TI]

相关型号：

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