UCC1926 [TI]

【 20A Integrated Current Sensor; 【 20A集成电流传感器
UCC1926
型号: UCC1926
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

【 20A Integrated Current Sensor
【 20A集成电流传感器

传感器
文件: 总9页 (文件大小:262K)
中文:  中文翻译
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application  
INFO  
UCC1926  
UCC2926  
UCC3926  
available  
±20A Integrated Current Sensor  
FEATURES  
DESCRIPTION  
Integral Non-inductive Current Sense  
Element with Internal Kelvin  
Connections  
The UCC3926 Current Sensor IC contains a wideband, transimpedance  
amplifier for converting the current through an internal, non-inductive  
1.3mshunt resistor into a proportional voltage. The sense element oper-  
ates in both high-side (VDD referenced) and low-side (GND referenced) ap-  
plications.  
20A Current Rating  
Bi-directional, High Side or Low Side  
The UCC3926 can measure currents up to ±20A. This transimpedance am-  
plifier gain is precisely trimmed to 33.3mto convert a 15A input into a  
500mV output signal. It has a very low input offset voltage from chop-  
per-stabilization. A cross-switching block rectifies the input signal by forcing  
the differential output, AOP positive with respect to the other differential  
output, AON. SIGN indicates the polarity of the current.  
Sensing  
Internal Temperature Nulling Circuitry  
for Current Sense Element and  
Amplifier  
Logic Compatible Current Direction  
Status Output  
The UCC3926 programmable amplifier provides three functions. It converts  
the differential transimpedance output signal into a single-ended signal. It  
has a user-controlled gain stage that sets the maximum current level to the  
desired voltage and it level shifts the zero current point to the desired level  
as well. A comparator then compares the output of the instrumentation am-  
plifier to a user-set reference voltage on OCREF, which provides an  
overcurrent status bit OC.  
Low Offset, Chopper Stabilized  
Current Sense Amplifier  
Uncommitted Amplifier with User  
Programmable Gain  
Overcurrent Indication with User  
Programmable Threshold  
The UCC3926 is available in the 16 pin SOIC package.  
BLOCK DIAGRAM  
UDG-97139-1  
SLUS266A - OCTOBER 1999  
UCC1926  
UCC2926  
UCC3926  
CONNECTION DIAGRAM  
ABSOLUTE MAXIMUM RATINGS  
Input Sense Current (IIN) . . . . . . . . . . . . . . . . . . . . . . . . . ± 20A  
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14.5V  
Inrush Current, 50µs . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100A  
Input Voltage Range (CSP, CSN) . . . . . . . . . . . –0.2V to 14.5V  
CSP, CSN, Common Mode Range  
SOIC-16 (Top View)  
DS Package  
(referenced to GND) . . . . . . . . . . . . . . . . . . . . . . . . . ± 200mV  
CSP, CSN, Common Mode Range  
(referenced to VDD) . . . . . . . . . . . . . . . . . . . . . . . . . . ± 200mV  
Shunt Resistance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.25mΩ  
Storage Temperature . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
Junction Temperature. . . . . . . . . . . . . . . . . . . . 55°C to 150°C  
Lead Temperature (Soldering, 10sec.) . . . . . . . . . . . . . . 300°C  
Currents are positive into, negative out of the specified termi-  
nal. Consult Packaging Section of Databook for thermal limita-  
tions and considerations of packages.  
ORDERING INFORMATION  
TEMPERATURE RANGE  
– 55°C to +125°C  
– 40°C to +85°C  
PACKAGES  
UCC1926  
UCC2926  
UCC3926  
DS  
DS  
DS  
0°C to +70°C  
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VDD = 4.8V; all temperature  
ranges and TA = TJ.  
PARAMETER  
Supply Section  
TEST CONDITIONS  
MIN  
TYP MAX UNITS  
VDD  
IVDD  
4.8  
14  
6
V
mA  
3.8  
Transimpedance Amplifier Section  
AOP – AON  
IIN = 15A, VDD = 10V, 25°C  
IIN = 15A, VDD = 10V, 0°C to +70°C  
IIN = 15A, VDD = 10V, –40°C to +85°C  
490  
480  
460  
410  
500  
500  
500  
500  
1.0  
0
510  
520  
540  
590  
mV  
mV  
mV  
mV  
V
I
I
IN = 15A, VDD = 10V, –55°C to +125°C  
IN = 0  
Quiescent Output Voltage (AOP, AON)  
Quiescent Differential Voltage (AOP –  
IIN = 0, Measure AC Peak to Peak  
30  
mV  
AON)  
Bandwidth  
(Note 1)  
20  
40  
350  
1.3  
MHz  
mΩ  
dB  
Output Impedance  
Shunt Resistance  
PSRR  
500  
CSP to CSN  
VDD = 4.8V to 10V  
VDD = 10V to 14V  
(Note 1)  
45  
25  
–200  
dB  
Temperature Coefficient  
Sign Comparator Section  
VOH, VDD – SIGN  
200 ppm/°C  
CSP = 1A, ISIGN = –100µA, CSN = 0V  
CSP = –1A, ISIGN = 100µA, CSN = 0V  
Ramp CSP, CSN = 0V  
0.2  
0.2  
400  
0.4  
0.4  
700  
V
V
mA  
mA  
V
OL, SIGN  
I
IH Threshold  
IIL Threshold  
Ramp CSP, CSN = 0V  
–400 –700  
Programmable Amplifier Section  
AVOL  
GBW  
VIO  
60  
6
–9  
70  
13  
9
dB  
MHz  
mV  
At 200kHz  
VIN = 0.5V, 1.5V, 2.5V  
2
UCC1926  
UCC2926  
UCC3926  
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VDD = 4.8V; all temperature  
ranges and TA = TJ.  
PARAMETER  
Programmable Amplifier Section (cont.)  
PSRR  
TEST CONDITIONS  
MIN  
TYP MAX UNITS  
VDD = 4.8V to 10V  
DD = 10V to 14V  
60  
60  
dB  
dB  
V
Common Mode Input Range  
IIB, Input Bias Current (NI, INV)  
IIO, Input Offset Current  
VOL  
0.5  
2.5  
V
nA  
nA  
mV  
mV  
V
V
mA  
µA  
–100 –350  
20  
100  
150  
1.2  
7
350  
200  
300  
2
INV – NI = 20mV, IO = 0µA  
INV – NI = 20mV, IO = 200µA  
NI – INV = 20mV, IO = –200µA, (VDD – OUT)  
NI – INV = 20mV, VDD = 14V  
OUT = 1.5V  
VOH  
V
OH, Clamp  
6
1
8
IOL  
IOH  
3.5  
OUT = 1.5V  
– 250 – 325  
Overcurrent Comparator Section  
OC Comp Threshold  
Common Mode Range  
OCREF = 2V  
(Note 1)  
2.00  
0.1  
2.05  
VDD–  
2
V
V
Hysteresis  
VOL  
VOH, VDD – OC  
Propagation Delay  
20  
40  
0.2  
0.2  
90  
60  
mV  
V
V
(OCREF – OUT) = 100mV, IOC = 100µA  
(OUT – OCREF) = 100mV, IOC = –100µA  
(OUT – OCREF) = ±100mV  
0.4  
0.4  
175  
ns  
Note 1: Guaranteed by design. Not 100% tested in prodcution.  
PIN DESCRIPTIONS  
sensing or to VDD for high side sensing. CSP – CSN  
may vary from ±75mV from either GND or VDD. Current  
into CSN is defined as negative.  
AOP: Positive output of the converted current signal.  
Voltage from AOP to AON is the absolute value of the  
transimpedance amplifier output. AOP may show some  
“chopping” noise. The differential to single-ended  
conversion removes the common-mode noise between  
AOP and AON.Some high frequency filtering of AOP to  
GND can reduce the fast transient spikes. The output  
stage of AOP is shown in Figure 1.  
CSP: Input connection to the other end of the internal  
current sense shunt resistor. Nominal resistance from  
CSP to CSN is 1.3mW. The current shunt has a nominal  
temperature coefficient of 3530 ppm/°C. The temperature  
adjusted autozero gain should cancel this temp co. effect.  
CSP may be referenced to GND for low side sensing or  
to VDD for high side sensing. CSP – CSN may vary from  
±75mV from either GND or VDD. Current into CSP is  
defined as positive.  
AON: Negative output of the converted current signal.  
Voltage from AOP to AON is the absolute value of the  
transimpedance amplifier output. AON may show some  
“chopping” noise. The differential to single-ended  
conversion removes the common-mode noise between  
AOP and AON. Some high frequency filtering of AON to  
GND can reduce the fast transient spikes. Note that AON  
is above GND voltage. The output stage of AON is shown  
in Figure 1.  
VDD  
CROSS SWITCH  
IMPEDANCE  
CSN: Input connection to one end of the internal current  
sense shunt resistor. Nominal resistance from CSP to  
CSN is 1.3m. The current shunt has a nominal  
temperature coefficient of 3530 ppm/°C. The temperature  
adjusted autozero gain is designed to cancel this temp  
co. effect. CSN may be referenced to GND for low side  
AOP, AON  
100  
15K  
250µA  
ESD DIODE  
Figure 1. AOP and AON output stage.  
3
UCC1926  
UCC2926  
UCC3926  
PIN DESCRIPTIONS (cont.)  
Use this opamp to establish overall gain and nominal  
zero current reference voltage. This amplifier may be  
configured with a gain of one or more. Any non-common  
mode “chopping” noise between AOP and AON will show  
up at OUT. Some filtering of OUT may improve the appli-  
cation’s performance.  
GND: This pin is the return point for all device currents.  
INV: Negative input to the programmable amplifier to  
provide differential to single-ended signal conversion.  
NI: Positive input to the programmable amplifier to  
provide differential to single-ended signal conversion.  
OC: Overcurrent comparator output. When OUT is  
greater than OCREF, OC switches high. The OC  
comparator has a typical hysteresis of 25mV.  
SIGN: Sign comparator output. SIGN also controls the  
analog switches in the cross-switching block to keep  
AOP greater than AON. At currents near zero amps, the  
sign comparator may switch from “chopping” noise from  
the transimpedance amplifier.  
OCREF: The reference pin of overcurrent comparator for  
setting overcurrent threshold voltage.  
VDD: VDD is the power input connection for this device.  
Its input range is from 4.8V to 14V. Bypass to GND using  
good quality ceramic capacitors.  
OUT: Output of the programmable amplifier intended to  
provide differential to single-ended signal conversion of  
the transimpedance amplifier's outputs.  
TYPICAL CHARACTERISTICS CURVES  
700  
600  
500  
400  
300  
200  
1.4  
1.3  
1.2  
1.1  
1
0.9  
0.8  
0.7  
0.6  
LIMIT OF RESOLUTION  
(SIGN LIMIT  
THRESHOLD BAND)  
100  
0
-20  
-15  
-10  
-5  
0
5
10  
15  
20  
-75  
-50  
-25  
0
25  
50  
75  
100  
125  
INPUT CURRENT [A]  
TEMPERATURE [°C]  
Figure 2. Differential output voltage (AOP-AON) vs.  
input current (IIN).  
Figure 3. Quiescent AOP, AON output voltage vs.  
temperature.  
1.800  
1.700  
1.600  
1.500  
1.400  
1.300  
1.200  
1.100  
1.000  
0.900  
0.800  
620  
IIN = 15A  
600  
VDD = 14V  
580  
560  
540  
VDD = 12V  
520  
VDD = 10V  
500  
VDD = 4.8V  
480  
-75  
-50  
-25  
0
25  
50  
75  
100  
125  
-75  
-50  
-25  
0
25  
50  
75  
100  
125  
TEMPERATURE [°C]  
TEMPERATURE [°C]  
Figure 4. Differential output voltage (AOP - AON) vs.  
VDD and temperature.  
Figure 5. Typical shunt resistance vs. temperature.  
4
UCC1926  
UCC2926  
UCC3926  
LAB EVALUATION CIRCUIT  
The circuit shown uses a pulse generator to switch cur- with different gain settings for the programmable ampli-  
rents while observing the analog voltage of the sensed fier. The OCREF voltage and the NI DC bias voltage can  
current. A four position switch can be used to experiment  
be adjusted with 1kpotentiometers to offset the ampli-  
fier output and set the overcurrent comparator threshold.  
10k  
+10V  
13  
10µF  
0.027µF  
4
VS  
1k  
SIGN COMPARATOR  
1
2
3
TRANSIMPENDANCE  
AMPLIFIER rm=3.33mΩ  
+
6
5
10Ω  
PULSE  
GENERATOR  
SEL  
1.3mΩ  
I
MAX=20A  
100pF  
14  
SW1  
SW2  
12  
CROSS  
SWITCH  
10kΩ  
10kΩ  
VDD GND  
+5V  
15  
16  
7
1k  
1k  
10kΩ  
PROGRAMMABLE AMPLIFIER  
OVERCURRENT  
9
OUT  
0.027µF  
+5V  
8
COMPARATOR  
+
1k  
1k  
11  
10  
10kΩ  
0.027µF  
10kΩ  
SW3  
SW4  
10kΩ  
10kΩ  
100pF  
UDG-97158  
UNITRODE CORPORATION  
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054  
TEL. (603) 424-2410 • FAX (603) 424-3460  
5
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Mar-2005  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SOIC  
SOIC  
SOIC  
SOIC  
Drawing  
UCC2926DS  
UCC2926DSTR  
UCC3926DS  
OBSOLETE  
OBSOLETE  
OBSOLETE  
OBSOLETE  
DW  
D
16  
16  
16  
16  
TBD  
TBD  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
Call TI  
DW  
D
UCC3926DSTR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan  
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS  
&
no Sb/Br)  
-
please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
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