UCC2581DG4 [TI]
Micropower Voltage Mode PWM; 微功耗电压模式PWM
| 型号： | UCC2581DG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Micropower Voltage Mode PWM |
| 文件： | 总16页 (文件大小：934K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
application
INFO
UCC1581
UCC2581
UCC3581
available
Micropower Voltage Mode PWM
BLOCK DIAGRAM
FEATURES
• Low 85µA Startup Current
• Low 300µA Operating Current
• Automatically Disabled
Startup Preregulator
• Programmable Minimum Duty
Cycle with Cycle Skipping
• Programmable Maximum
Duty Cycle
• Output Current 1A Peak
Source and Sink
• Programmable Soft Start
• Programmable Oscillator
Frequency
• External Oscillator
Synchronization Capability
UDG-95011-1
Note: Pin Connection shown for 14-pin Package
DESCRIPTION
The UCC3581 voltage mode pulse width modulator is de- A linear preregulator driver in conjunction with an exter-
signed to control low power isolated DC - DC converters nal depletion mode N-MOSFET provides initial controller
in applications such as Subscriber Line Power (ISDN power. Once the bootstrap supply is functional, the
I.430). Primarily used for single switch forward and preregulator is shut down to conserve power. During light
flyback converters, the UCC3581 features BiCMOS cir- load, power is saved by providing a programmable mini-
cuitry for low startup and operating current, while main- mum duty cycle clamp. When a duty cycle below the
taining the ability to drive power MOSFETs at minimum is called for, the modulator skips cycles to pro-
frequencies up to 100kHz. The UCC3581 oscillator al- vide the correct average duty cycle required for output
lows the flexibility to program both the frequency and the regulation. This effectively reduces the switching fre-
maximum duty cycle with two resistors and a capacitor. A quency, saving significant gate drive and power stage
TTL level input is also provided to allow synchronization losses.
to an external frequency source.
The UCC3581 is available in 14-pin plastic and ceramic
The UCC3581 includes programmable soft start circuitry, dual-in-line packages and in a 14-pin narrow body small
overcurrent detection, a 7.5V linear preregulator to con- outline IC package (SOIC). The UCC1581 is specified for
trol chip VDD during startup, and an on-board 4.0V logic
supply.
operation from −55°C to +125°C, the UCC2581 is speci-
fied for operation from −40°C to +85°C, and the
UCC3581 is specified for operation from 0°C to +70°C.
The UCC3581 provides functions to maximize light load
efficiency that are not normally found in PWM controllers.
MARCH 1999 - REVISED MARCH 2003 - SLUS295B
UCC1581
UCC2581
UCC3581
CONNECTION DIAGRAMS
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (IDD ≤ 10mA). . . . . . . . . . . . . . . . . . . . . . . . 15V
Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30mA
DIL-14, SOIC-14 (Top View)
N or J, D Packages
V
REF Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –10mA
OUT Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 1A
Analog Inputs
EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3V to (VDD + 0.3V)
VC, ISEN, SYNC, DCMIN. . . . . . . . . . –0.3V to (VREF + 0.3V)
Power Dissipation at TD = 25°C
(N, J, Q, L Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W
(D Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.65W
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . –55C to +150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300°C
Unless otherwise specified, all voltages are with respect to
Ground. Currents positive into, negative out of the specified ter-
minal. Consult Packaging Section of Databook for thermal limi-
tations and considerations of packages.
ORDERING INFORMATION
TEMPERATURE RANGE
–55°C to +125°C
PACKAGE
CDIP
UCC1581J
UCC2581D
UCC2581N
UCC3581D
UCC3581N
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
SOIC
PDIP
SOIC
PDIP
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VDD = 10V, 0.1µF capacitor
from VDD to GND, 1.0µF capacitor from REF to GND, RT1 = 680kΩ, RT2 = 12kΩ, CT = 750pF and TA = TJ.
PARAMETER
Reference Section
TEST CONDITIONS
MIN
TYP
MAX UNITS
Output Voltage
I = –0.2mA
3.94
4.0
20
4.06
45
V
Load Regulation
–5.0mA < I < –0.2mA
mV
Undervoltage Lockout Section
Start Threshold
6.7
6.2
0.2
7.3
6.8
0.5
7.9
7.4
0.8
V
V
V
Minimum Operating Voltage After Start
Hysteresis
Linear Preregulator Section
Regulated VDD Voltage
Regulated VDD to UVLO Delta
VDD Override Threshold
Oscillator Section
Frequency
7.0
7.5
8.0
600
8.2
V
mV
V
100
230
25°C
18
19.5
3.0
2.5
1.0
2.1
1.8
21
kHz
%
V
Temperature Stability
CT Peak Voltage
(Note 1)
(Note 1)
(Note 1)
CT Valley Voltage
V
SYNC VIH
1.9
81
2.3
V
SYNC VIL
(Note 1)
V
PWM SECTION
Maximum Duty Cycle
Minimum Duty Cycle
84
87
0
%
%
(VC < 1.0V) DCMIN = 0V
(VC > 1.0V at start of cycle) DCMIN = 1.18V
(DCMIN), (Note 1)
7
10
20
20
13
%
Input Bias Current
–150
–150
150
150
nA
nA
(VC), (Note 1)
2
UCC1581
UCC2581
UCC3581
ELECTRICAL CHARACTERISTICS: Unless otherwise stated, these specifications apply for VDD = 10V, 0.1µF capacitor
from VDD to GND, 1.0µF capacitor from REF to GND, RT1 = 680kΩ, RT2 = 12kΩ, CT = 750pF and TA = TJ.
PARAMETER
Current Sense Section
TEST CONDITIONS
MIN
TYP
MAX UNITS
Input Bias Current
Overcurrent Threshold
Output Section
OUT Low Level
–150
0.4
20
150
0.6
nA
V
0.5
I = 100mA
0.6
0.6
20
1.2
1.2
100
V
V
OUT High Level
Rise/Fall Time
I = –100mA, VDD – OUT
(Note 1)
ns
Soft start Section
Soft start Current
Chip Enable Section
VIH
SS = 2V
–9
–11.5
–14
µA
1.9
1.7
180
5
2.0
1.8
230
10
2.1
1.9
280
15
V
V
VIL
Hysteresis
mV
µA
Source Current
Overall Section
Start-Up Current
Operating Supply Current
VDD Zener Shunt Voltage
IDD Stand-by Shunt Voltage
VDD < Start Threshold
VC = 0V
85
300
15
130
600
16.5
150
µA
µA
V
IDD = 10mA
13.5
EN = 0V
100
µA
Note 1: Guaranteed by design. Not 100% tested in production
PIN DESCRIPTIONS
2.0V
RT1
CT: Oscillator timing capacitor pin. Minimum value is
100pF.
The oscillator charging current is 9.2•
.
DCMIN: Input for programming minimum duty cycle
where pulse skipping begins. This pin can be grounded
to disable minimum duty cycle feature and pulse
skipping.
See Application Diagram Fig. 1.
2.0V
The current into this pin is
.
RT1
The value of RT1 should be between 220k and 1MΩ.
EN: Enable input. This pin has an internal 10µA pull-up.
A logic low input inhibits the PWM output and causes the
soft start capacitor to be discharged.
RT2: Resistor pin to program oscillator discharge time.
The minimum value of RT2 is 10kΩ. See Application
Diagram Fig. 1.
GND: Circuit ground.
SS: Soft start capacitor pin. The charging current out of
SS is 3.75X the current in RT1.
GT: Pin for controlling the gate of an external depletion
mode N-MOSFET for the startup supply. The external
N-MOSFET regulates VDD to 7.5V until the bootstrap
supply comes up, then GT goes low.
SYNC: Oscillator synchronization pin. Rising edge
triggered CMOS/TTL compatible input with a 2.1V
threshold. SYNC should be grounded if not used. The
minimum pulse width of the SYNC signal is 100ns.
ISEN: Input for overcurrent comparator. This function can
be used for pulse-by-pulse current limiting. The threshold
is 0.5V nominal.
VC: Control voltage input to PWM comparator. The
nominal control range of VC is 1.0V to 2.5V.
OUT: Gate drive output to external N-MOSFET.
VDD: Chip input power with an 15V internal clamp. VDD
is regulated by startup FET to 7.5V until the bootstrap
voltage comes up. VDD should be bypassed at the chip
with a 0.1µF minimum capacitor.
REF: 4.0V reference output. A minimum value bypass
capacitor of 1.0µF is required for stability.
RT1: Resistor pin to program oscillator charging current.
3
UCC1581
UCC2581
UCC3581
APPLICATION INFORMATION
The UCC3581’s oscillator allows the user the flexibility to
program the frequency and the duty cycle by adjusting
two resistors and a capacitor. Application Diagram Fig. 1
shows these components as RT1, RT2, and CT. RT1 pro-
grams the timing capacitor charging current which results
in a linear ramp charging CT. Discharge of CT is accom-
plished though RT2 which results in a standard RC dis-
charge waveform. The oscillator on-time (CT charging) is
calculated by the formula
RT2
UCC3581
1
CT
RT2 14
SYNC 13
RT1 12
V
IN
C
T
BSS129 OR
EQUIV.
D2
2
3
GT
VDD
1µF
RT1
tON =0.082• RT1• CT .
EN 11
SS 10
The off-time (CT discharging) is calculated by the formula
tOFF =0.95 • RT1• CT .
Q1
4
OUT
C
SS
REF
Resistor RT1 programs the charging current. The current
is:
5
6
GND
REF
DCMIN
9
8
2.0V
.
RT1
REF
1µF
REF
CT charging current is 9.2 times the current in RT1. RT1
can range from 220kΩ to 1MΩ. Minimum capacitor size
is 100pF, and minimum RT2 size is 10k.
7
ISEN
VC
V
IN
U1
D1
A Block Diagram of the Oscillator is shown in Fig. 2. The
oscillator also has an external synchronization pin.
When a low to high level is detected, and if the oscilla-
tor’s output is in the high state (CT charging), the oscilla-
tor output immediately goes low and CT starts
discharging. The sync input is rising edge sensitive and
is ignored when the oscillator output is low.
REF &
E/A
U1
R
L
T1
UDG-99043
Figure 1. Application diagram.
UDG-96105
Figure 2. Oscillator.
4
UCC1581
UCC2581
UCC3581
APPLICATION INFORMATION (cont.)
The externally bypassed 4.0V reference is controlled by
undervoltage lockout and chip enable circuitry. The en-
able input is internally tied to a 10µA current source
which allows the pin to be driven by an open collector
driver. The part is also enabled if EN floats. The
UCC3581 has a soft start function which requires a user
supplied external timing capacitor. When in soft start
mode, the soft start capacitor, CSS, is charged with a
constant current source. The soft start current is 3.75X
the current in RT1.
A Typical Micropower Application
The circuit shown in Fig. 3 illustrates the use of the
UCC3581 in a micropower application. The isolated 5V
flyback power supply uses a minimum of parts and oper-
ates over an 8:1 input voltage range (15VDC to 120VDC)
while delivering a regulated 5V output with a load swing
from 0W to 1W. It operates in the discontinuous mode at
light load or high line, and continuous mode at heavier
loads and lower line voltages. Higher input line voltages
are possible by simply increasing the voltage ratings of
C1, Q1, D1 and D2.
There is an on-chip control amplifier, which when driving
the gate of an external depletion mode N-MOSFET, acts
as a 7.5V linear preregulator supplying VDD directly from
the primary input power line. The preregulator may sub-
sequently be fully disabled by a tertiary bootstrap winding
providing a minimum of 8.2V to the VDD pin.
The most notable feature of the design is its efficiency.
With a load of 1 watt, the typical efficiency is 82%, drop-
ping to 70% around 50mW. With a load of only 12.5mW,
the efficiency remains as high as 50%. At this load, with
an input of 50V, the total input current is only 500µA.
Note that the power supply can be disabled by pulling the
UCC3581 enable pin low, in which case the input current
drops to less than 150µA.
Computation of DCMIN
DCMIN for a given duty cycle is calculated as follows:
(
)
tON +tOFF
The UCC3581 achieves very low losses by means of low
quiescent current and pulse skipping at light loads which
reduces switching losses. The degree of pulse skipping is
controlled by programming the minimum duty cycle. In
this example, the frequency is 35kHz at maximum load
and drops to <2kHz at 12.5mW load (minimum pulse
width of around 6µsec, or 21% duty cycle at 35kHz).
Another way losses are reduced is operating with a VDD
of around 10V rather than the more common 12V to 16V.
At such light primary currents, the MOSFET remains in
full saturation with a gate drive voltage well below 10V.
∆V =iOSC • DC •
CT
where:
• i = oscillator charge current = 9.2 . (2.0V/RT1)
• DC = Duty Cycle, as a fraction of 1
• tON = 0.082 • RT1 • CT
• tOFF = 0.95 • RT2 • CT
• CT = Oscillator Capacitor
The CT pin ramp slews from 1V to 2.5V. Therefore, add
∆V to 1V to get DCMIN voltage.
Gate drive losses are minimized by choosing a MOSFET
with low total gate charge, in this case only 8nC maxi-
mum. By choosing a large gate drive resistor, EMI is min-
imized by reducing peak currents. Due to pulse skipping,
switching times are less critical for efficiency at light load.
Example: For 10% duty cycle with RT1 = 680kΩ, RT2 =
12kΩ, and CT = 705pF,
The shunt regulator (LM3411) and optocoupler
(MOC8100) are also key to the efficiency at such light
loads, and were chosen for their low operating current.
The LM3411 has a quiescent current of only 150µA max-
imum (compared to 1mA for the more common TL431).
In addition, because it is not a three terminal device, the
LM3411’s quiescent current does not flow in the
optocoupler LED. Since this bias current is not in the
feedback control path, a higher value pull-up resistor can
be used on the optocoupler output transistor, further re-
ducing losses.
(
)
tON +tOFF
∆V =iOSC • DC •
CT
2.0V
• (0.1)• 4.182• 10
9.2•
−5 sec+8.55 • 10−6 sec
680k
=
750 • 10−12
∆V =0.18V
Therefore,
DCMIN =1V +0.18V =1.18V
5
UCC1581
UCC2581
UCC3581
TYPICAL APPLICATION
UDG-96104
Figure 3. Micropower power supply with 50% efficiency at 12.5mW load.
90
80
70
60
50
40
30
20
10
0
25V Line
100V Line
10
100
1000
Output Load [mW]
Figure 4. UCC3581 efficiency vs. line and load.
6
UCC1581
UCC2581
UCC3581
APPLICATION INFORMATION (cont.)
A rather large soft start capacitor was chosen to give a If the sync input is used, it should not be left in a high im-
startup time of several hundred milliseconds, reducing pedance state where noise could cause false triggering.
the input surge current while the output is coming up.
If unused, it should be grounded.
Note that for stability, the UCC3581 VREF bypass capaci- The transformer was designed with a standard Magnetics
RM8 ferrite core using P material, gapped for an AL of
1600mH/1000Turn2. The primary consists of 44 turns,
while the 5V secondary has 10 turns and the bootstrap
winding 18 turns. For simplicity, all the windings can be
#28 AWG. A two section bobbin was used to provide high
primary to secondary isolation. A much smaller design,
with reduced isolation, could have been done for this low
power level.
tor needs to be at least 1µF. The VDD supply also needs
some capacitance to hold it up between pulses at light
load and high line, where the frequency may drop to less
than 1kHz due to pulse skipping. Otherwise it may drop
low enough for the startup MOSFET to be biased on,
lowering efficiency.
TYPICAL CHARACTERISTIC CURVES
140
4.10
4.08
4.06
4.04
4.02
4.00
3.98
3.96
3.94
3.92
3.90
470k/47k
120
100
680k/12k
80
60
40
20
0
1M/10k
220k/10k
-75 -50 -25
0
25
50
75 100 125
100
1000
CT [pF]
10000
TEMPERATURE [°C]
Figure 5. Reference voltage vs. temperature.
Figure 6. Frequency vs. CT vs. RT1 and RT2.
1600
100
1nF LOAD
1M/10K
1400
90
80
70
60
50
40
30
1200
1000
800
600
400
200
0
680K/12K
220K/10K
NO
LOAD
470K/47K
0
20
40
60
80
100
0
20
40
60
80
100
FREQUENCY [kHz]
FREQUENCY [kHz]
Figure 7. Duty cycle vs. frequency vs. RT1 / RT2.
Figure 8. IDD vs. frequency RT1 = 680k, RT2 = 12k.
7
UCC1581
UCC2581
UCC3581
TYPICAL CHARACTERISTIC CURVES (cont.)
40
35
30
25
20
15
10
5
0
200
400
600
800
1000
1200
RT1 [kW]
Figure 9. Soft start current vs. RT1.
UNITRODE CORPORATION
7 CONTINENTAL BLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 FAX (603) 424-3460
8
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
UCC2581D
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOIC
SOIC
SOIC
SOIC
D
14
14
14
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
UCC2581D
UCC2581DG4
UCC2581DTR
UCC2581DTRG4
ACTIVE
ACTIVE
ACTIVE
D
D
D
50
Green (RoHS
& no Sb/Br)
-40 to 85
UCC2581D
UCC2581D
UCC2581D
2500
2500
Green (RoHS
& no Sb/Br)
-40 to 85
Green (RoHS
& no Sb/Br)
-40 to 85
UCC2581J
UCC2581Q
UCC3581D
OBSOLETE
OBSOLETE
ACTIVE
UTR
UTR
D
TBD
TBD
Call TI
Call TI
Call TI
Call TI
-40 to 85
-40 to 85
0 to 70
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
14
14
14
14
14
14
50
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
UCC3581D
UCC3581D
UCC3581D
UCC3581D
UCC3581N
UCC3581N
UCC3581DG4
UCC3581DTR
UCC3581DTRG4
UCC3581N
ACTIVE
ACTIVE
D
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
N / A for Pkg Type
N / A for Pkg Type
Call TI
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
2500
2500
25
Green (RoHS
& no Sb/Br)
ACTIVE
D
Green (RoHS
& no Sb/Br)
ACTIVE
N
Green (RoHS
& no Sb/Br)
UCC3581NG4
UCC3581Q
ACTIVE
N
25
Green (RoHS
& no Sb/Br)
OBSOLETE
UTR
TBD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
UCC3581DTR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC 14
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 38.0
UCC3581DTR
D
2500
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明