UCC27212DPRT [TI]
具有 5V UVLO 和负电压处理能力的 4A、120V 半桥栅极驱动器 | DPR | 10 | -40 to 140;
| 型号： | UCC27212DPRT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 5V UVLO 和负电压处理能力的 4A、120V 半桥栅极驱动器 | DPR | 10 | -40 to 140 栅极驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总29页 (文件大小：958K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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UCC27212
SLUSCO1A –JUNE 2017–REVISED APRIL 2018
UCC27212 120-V Boot, 4-A Peak, High-Frequency Half-Bridge Driver
1 Features
3 Description
The UCC27212 device has a peak output current of
4-A source and 4-A sink, which allows for the ability
to drive large power MOSFETs. The device features
an on-chip 120-V rated bootstrap diode eliminating
the need for external discrete diodes. The input
structure can directly handle –10 V, which increases
robustness and is also independent of supply voltage.
The UCC27212 offers 5 V UVLO which helps lower
power losses and increased input hysteresis that
allows for interface to analog or digital PWM
controllers with enhanced noise immunity. The
switching node of the UCC27212 (HS pin) can handle
–18-V maximum, which allows the high-side channel
to be protected from inherent negative voltages.
1
•
4-A Sink, 4-A Source Output Currents
Maximum Boot Voltage 120-V DC
•
•
•
•
•
•
•
•
•
7-V to 17-V VDD Operating Range
20-V ABS Maximum VDD Operating Range
5-V Turn-off Under Voltage Lockout (UVLO)
Input Pins Can Tolerate –10 V to +20 V
7.2-ns Rise and 5.5-ns Fall Time (1000-pF Load)
20-ns Typical Propagation Delay
4-ns Typical Delay Matching
Specified from –40°C to +140°C
2 Applications
Device Information(1)
•
•
•
•
DC-DC Power Supplies
PART NUMBER
PACKAGE
BODY SIZE (NOM)
Merchant Telecom Rectifiers
UCC27212
WSON (10)
4.0 mm x 4.0 mm
Half-Bridge and Full-Bridge Converters
Push-Pull and Active-Clamp Forward Converters
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Diagram
Propagation Delays vs Supply Voltage T = 25°C
12 V
100 V
32
TDLRR
VDD
TDLFF
TDHRR
TDHFF
28
24
20
16
12
8
HB
SECONDARY
SIDE
CIRCUIT
HO
HS
LO
HI
LI
DRIVE
HI
PWM
CONTROLLER
DRIVE
LO
UCC27212
4
ISOLATION
AND
FEEDBACK
0
8
12
16
20
Supply Voltage (V)
D001
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
UCC27212
SLUSCO1A –JUNE 2017–REVISED APRIL 2018
www.ti.com
Table of Contents
7.4 Device Functional Modes........................................ 15
Application and Implementation ........................ 16
8.1 Application Information............................................ 16
8.2 Typical Application ................................................. 16
Power Supply Recommendations...................... 20
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 3
Pin Configuration and Functions......................... 4
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings ............................................................ 5
6.3 Recommended Operating Conditions....................... 6
6.4 Thermal Information.................................................. 6
6.5 Electrical Characteristics........................................... 6
6.6 Switching Characteristics.......................................... 7
6.7 Typical Characteristics............................................ 10
Detailed Description ............................................ 13
7.1 Overview ................................................................. 13
7.2 Functional Block Diagram ....................................... 14
7.3 Feature Description................................................. 14
8
9
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 22
11 Device and Documentation Support ................. 23
11.1 Documentation Support ....................................... 23
11.2 Receiving Notification of Documentation Updates 23
11.3 Community Resources.......................................... 23
11.4 Trademarks........................................................... 23
11.5 Electrostatic Discharge Caution............................ 23
11.6 Glossary................................................................ 23
7
12 Mechanical, Packaging, and Orderable
Information ........................................................... 23
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4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (June 2017) to Revision A
Page
•
•
Changed " 5-V to 17-V VDD Operating Range, (20-V ABS Maximum)" to "7-V to 17-V VDD Operating Range, (20-V
ABS Maximum)" ..................................................................................................................................................................... 1
Changed extended output pulse from 325-ns MAX to 325-ns TYP. ..................................................................................... 8
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5 Pin Configuration and Functions
DPR Package
SON-10
Top View
VDD
HB
1
2
3
4
5
10
9
LO
VSS
LI
PowerPAD ™
HO
HS
8
7
HI
N/C
6
N/C
Not to scale
Pin Functions
PIN
I/O
DESCRIPTION
NO.
NAME
High-side bootstrap supply. The bootstrap diode is on-chip but the external bootstrap
capacitor is required. Connect positive side of the bootstrap capacitor to this pin. Typical
range of HB bypass capacitor is 0.022 µF to 0.1 µF.
2
HB
P
7
3
HI
I
High-side input.(1)
HO
O
High-side output. Connect to the gate of the high-side power MOSFET.
High-side source connection. Connect to source of high-side power MOSFET. Connect the
negative side of bootstrap capacitor to this pin.
4
HS
P
8
10
5
LI
I
Low-side input.(1)
LO
O
—
—
Low-side output. Connect to the gate of the low-side power MOSFET.
No internal connection.
N/C
N/C
6
No internal connection.
Used on the DDA, DRM and DPR packages only. Electrically referenced to VSS (GND).
Connect to a large thermal mass trace or GND plane to dramatically improve thermal
performance.
PowerPAD
Pad
G
(2)
™
Positive supply to the lower-gate driver. Decouple this pin to VSS (GND). Typical decoupling
capacitor range is 0.22 µF to 4.7 µF.(3)
1
9
VDD
VSS
P
G
Negative supply terminal for the device which is generally grounded.
(1) For cold temperature applications TI recommends the upper capacitance range. Follow the Layout Guidelines for PCB layout.
(2) The thermal pad is not directly connected to any leads of the package; however, it is electrically and thermally connected to the
substrate which is the ground of the device.
(3) HI or LI input is assumed to connect to a low impedance source signal. The source output impedance is assumed less than 100 Ω. If the
source impedance is greater than 100 Ω, add a bypassing capacitor, each, between HI and VSS and between LI and VSS. The added
capacitor value depends on the noise levels presented on the pins, typically from 1 nF to 10 nF should be effective to eliminate the
possible noise effect. When noise is present on two pins, HI or LI, the effect is to cause HO and LO malfunctions to have wrong logic
outputs.
4
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
–10
MAX
20
UNIT
VDD(2), VHB – VHS
VLI, VHI
Supply voltage range
V
V
V
Input voltages on LI and HI
20
DC
–0.3
VDD + 0.3
VLO
VHO
VHS
Output voltage on LO
Output voltage on HO
Repetitive pulse < 100
ns(3)
–2
VHS – 0.3
VHS – 2
–1
VDD + 0.3
VHB + 0.3
VHB + 0.3
100
V
V
V
V
V
DC
Repetitive pulse < 100
ns(3)
DC
Voltage on HS
Voltage on HB
Repetitive pulse < 100
ns(3)
–(24 V –
VDD)
115
VHB
–0.3
–40
–65
120
150
150
V
TJ
Operating virtual junction temperature range
°C
°C
Storage temperature, Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to VSS unless otherwise noted. Currents are positive into and negative out of the specified terminal.
(3) Verified at bench characterization. VDD is the value used in an application design.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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6.3 Recommended Operating Conditions
over operating free-air temperature range, all voltages are with respect to VSS; currents are positive into and negative out of
the specified terminal. –40°C < TJ = TA < 140°C (unless otherwise noted)
MIN
NOM
MAX
17
UNIT
V
VDD
VHS
VHS
VHB
Supply voltage range, VHB – VHS
Voltage on HS
7
–1
12
100
110
115
50
V
Voltage on HS (repetitive pulse < 100 ns)
Voltage on HB
–(20 V – VDD)
VHS + 8
V
V
Voltage slew rate on HS
Operating junction temperature
V/ns
°C
–40
140
6.4 Thermal Information
UCC27212
THERMAL METRIC(1)
DPR (SON)
10 PINS
36.8
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
36.0
14.0
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.3
ψJB
14.2
RθJC(bot)
3.4
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.5 Electrical Characteristics
over operating free-air temperature range, VHS = VSS = 0 V, no load on LO or HO, TA = TJ = –40°C to +140°C, (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY CURRENTS, VDD = VHB = 12 V
IDD
VDD quiescent current
V(LI) = V(HI) = 0 V
0.05
2.1
0.085
2.5
0.17
6.5
0.1
5.1
1
mA
mA
mA
mA
µA
IDDO
IHB
VDD operating current
f = 500 kHz, CLOAD = 0
V(LI) = V(HI) = 0 V
Boot voltage quiescent current
Boot voltage operating current
HB to VSS quiescent current
HB to VSS operating current
0.015
1.5
0.065
2.5
IHBO
IHBS
IHBSO
f = 500 kHz, CLOAD = 0
V(HS) = V(HB) = 115 V
f = 500 kHz, CLOAD = 0
0.0005
0.07
1.2
mA
SUPPLY CURRENTS, VDD = VHB = 6.8 V
IDD
VDD quiescent current
V(LI) = V(HI) = 0 V
0.02
2.1
0.065
2.5
0.14
6.5
0.08
5.1
1
mA
mA
mA
mA
µA
IDDO
IHB
VDD operating current
f = 500 kHz, CLOAD = 0
V(LI) = V(HI) = 0 V
Boot voltage quiescent current
Boot voltage operating current
HB to VSS quiescent current
HB to VSS operating current
0.01
1.5
0.04
2.5
IHBO
IHBS
IHBSO
f = 500 kHz, CLOAD = 0
V(HS) = V(HB) = 115 V
f = 500 kHz, CLOAD = 0
0.0005
0.07
1.2
mA
INPUT, VDD = VHB = 12 V
VHIT
VLIT
VIHYS
RIN
Input voltage threshold
1.7
1.2
2.3
1.6
700
68
2.55
1.9
V
V
Input voltage threshold
Input voltage hysteresis
Input pulldown resistance
mV
kΩ
INPUT, VDD = VHB = 6.8 V
VHIT
VLIT
Input voltage threshold
1.6
1.1
2.0
1.5
2.6
2.1
V
V
Input voltage threshold
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Electrical Characteristics (continued)
over operating free-air temperature range, VHS = VSS = 0 V, no load on LO or HO, TA = TJ = –40°C to +140°C, (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
500
68
MAX
UNIT
mV
VIHYS
RIN
Input voltage hysteresis
Input pulldown resistance
kΩ
UNDER-VOLTAGE LOCKOUT (UVLO), VDD = VHB = 12 V
VDDR
VDD turnon threshold
Hysteresis
4.9
5.7
0.4
5.3
0.3
6.4
6.3
V
V
V
V
VDDHYS
VHBR
VHB turnon threshold
Hysteresis
4.35
VHBHYS
BOOTSTRAP DIODE, VDD = VHB = 12 V
VF
Low-current forward voltage
High-current forward voltage
Dynamic resistance, ΔVF/ΔI
IVDD-HB = 100 µA
0.65
0.85
0.5
0.8
0.95
0.85
V
V
Ω
VFI
RD
IVDD-HB = 100 mA
IVDD-HB = 100 mA and 80 mA
0.3
0.3
BOOTSTRAP DIODE, VDD = VHB = 6.8 V
VF
Low-current forward voltage
High-current forward voltage
Dynamic resistance, ΔVF/ΔI
IVDD-HB = 100 µA
0.65
0.85
0.5
0.8
0.95
0.85
V
V
Ω
VFI
RD
IVDD-HB = 100 mA
IVDD-HB = 100 mA and 80 mA
LO GATE DRIVER, VDD = VHB = 12 V
VLOL
VLOH
Low-level output voltage
High level output voltage
Peak pullup current(1)
0.05
0.1
0.1
0.16
3.7
0.19
0.29
V
V
A
A
(1)
Peak pulldown current
4.5
LO GATE DRIVER, VDD = VHB = 6.8 V
VLOL
VLOH
Low-level output voltage
High level output voltage
Peak pullup current
ILO = 100 mA
0.04
0.12
0.13
0.23
1.3
0.35
0.42
V
V
A
A
ILO = –100 mA, VLOH = VDD – VLO
VLO = 0 V
Peak pulldown current
VLO = 12 V for VDD = 6.8V
1.7
HO GATE DRIVER, VDD = VHB = 12 V
VHOL
VHOH
Low-level output voltage
High-level output voltage
0.05
0.1
0.1
0.16
3.7
0.19
0.29
V
V
A
A
(1)
Peak pullup current
(1)
Peak pulldown current
4.5
HO GATE DRIVER, VDD = VHB = 6.8 V
VLOL
VLOH
Low-level output voltage
High level output voltage
Peak pullup current
IHO = 100 mA
0.04
0.12
0.13
0.23
1.3
0.35
0.42
V
V
A
A
IHO = –100 mA, VHOH = VHB – VHO
VHO = 0 V
Peak pulldown current
VHO = 12 V for VDD = 6.8V
1.7
(1) Ensured by design.
6.6 Switching Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PROPAGATION DELAYS, VDD = VHB = 12 V
TDLFF
TDHFF
TDLRR
TDHRR
VLI falling to VLO falling
VHI falling to VHO falling
VLI rising to VLO rising
VHI rising to VHO rising
CLOAD = 0
CLOAD = 0
CLOAD = 0
CLOAD = 0
10
10
10
10
16
16
20
20
30
30
42
42
ns
ns
ns
ns
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Switching Characteristics (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
PROPAGATION DELAYS, VDD = VHB = 6.8 V
TDLFF
TDHFF
TDLRR
TDHRR
VLI falling to VLO falling
VHI falling to VHO falling
VLI rising to VLO rising
VHI rising to VHO rising
CLOAD = 0
CLOAD = 0
CLOAD = 0
CLOAD = 0
10
10
13
13
24
24
28
28
50
50
57
57
ns
ns
ns
ns
DELAY MATCHING, VDD = VHB = 12 V
TJ = 25°C
4
4
4
4
9.5
17
ns
ns
ns
ns
TMON
From HO OFF to LO ON
From LO OFF to HO ON
TJ = –40°C to +140°C
TJ = 25°C
9.5
17
TMOFF
TJ = –40°C to +140°C
DELAY MATCHING, VDD = VHB = 6.8 V
TJ = 25°C
8
8
6
6
ns
ns
ns
ns
TMON
From HO OFF to LO ON
From LO OFF to HO ON
TJ = –40°C to +140°C
TJ = 25°C
18
18
TMOFF
TJ = –40°C to +140°C
OUTPUT RISE AND FALL TIME, VDD = VHB = 12 V
tR
tR
tF
tF
tR
tF
LO rise time
HO rise time
LO fall time
HO fall time
LO, HO
CLOAD = 1000 pF, from 10% to 90%
CLOAD = 1000 pF, from 10% to 90%
CLOAD = 1000 pF, from 90% to 10%
CLOAD = 1000 pF, from 90% to 10%
CLOAD = 0.1 µF, (3 V to 9 V)
7.8
7.8
ns
ns
ns
ns
µs
µs
6.0
6.0
0.36
0.20
0.6
0.4
LO, HO
CLOAD = 0.1 µF, (9 V to 3 V)
OUTPUT RISE AND FALL TIME, VDD = VHB = 6.8 V
tR
tR
tF
tF
tR
tF
LO rise time
HO rise time
LO fall time
HO fall time
LO, HO
CLOAD = 1000 pF, from 10% to 90%
CLOAD = 1000 pF, from 10% to 90%
CLOAD = 1000 pF, from 90% to 10%
CLOAD = 1000 pF, from 90% to 10%
CLOAD = 0.1 µF, (30% to 70%)
9.5
13.0
9.5
ns
ns
ns
ns
µs
µs
13.0
0.45
0.2
0.7
0.5
LO, HO
CLOAD = 0.1 µF, (70% to 30%)
MISCELLANEOUS
Minimum input pulse width that changes the
output
100
ns
ns
(1)(2)
(3)
Bootstrap diode turnoff time
IF = 20 mA, IREV = 0.5 A
20
when VDD = VHB = 6.8 V, VHS =
100 V, and input pulse width is 100
ns
Extended output pulse
325
ns
(1) Ensured by design.
(2) IF: Forward current applied to bootstrap diode, IREV: Reverse current applied to bootstrap diode.
(3) Typical values for TA = 25°C.
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LI
Input
(HI, LI)
HI
TDLRR, TDHRR
LO
Output
(HO, LO)
TDLFF, TDHFF
HO
Figure 1. Timing Diagram
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6.7 Typical Characteristics
100
80
60
40
20
0
100
10
1
CL = 0 pF, T = −40°C
CL = 0 pF, T = 25°C
0.1
0.01
CL = 0 pF, T = 140°C
CL = 1000 pF, T = 25°C
CL = 1000 pF, T = 140°C
CL = 4700 pF, T = 140°C
IDD
IHB
0
2
4
6
8
10
12
14
16
18
20
10
100
Frequency (kHz)
1000
Supply Voltage (V)
G002
T = 25°C
VDD = 12 V
Figure 2. Quiescent Current vs Supply Voltage
Figure 3. IDD Operating Current vs Frequency
100
10
100
10
1
1
CL = 0 pF, T = −40°C
CL = 0 pF, T = 25°C
CL = 0 pF, T = −40°C
CL = 0 pF, T = 25°C
0.1
0.01
CL = 0 pF, T = 140°C
CL = 1000 pF, T = 25°C
CL = 1000 pF, T = 140°C
CL = 4700 pF, T = 140°C
0.1
0.01
CL = 0 pF, T = 140°C
CL = 1000 pF, T = 25°C
CL = 1000 pF, T = 140°C
CL = 4700 pF, T = 140°C
10
100
Frequency (kHz)
1000
10
100
Frequency (kHz)
1000
VDD = 12 V
VHB – VHS = 12 V
Figure 4. IDD Operating Current vs Frequency
Figure 5. Boot Voltage Operating Current vs
Frequency (HB To HS)
6
5
6
5
4
4
3
3
2
2
1
1
0
0
Rising
Falling
Rising
Falling
−1
−1
−40 −20
0
20
40
60
Temperature (°C)
80
100 120 140
8
12
16
20
Supply Voltage (V)
VDD = 12 V
T = 25°C
Figure 7. Input Thresholds vs Temperature
Figure 6. Input Threshold vs Supply Voltage
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Typical Characteristics (continued)
0.32
0.28
0.24
0.2
0.2
0.16
0.12
0.08
0.04
0
0.16
0.12
VDD = VHB = 8 V
VDD = VHB = 8 V
VDD = VHB = 12 V
VDD = VHB = 16 V
VDD = VHB = 20 V
0.08
0.04
0
VDD = VHB = 12 V
VDD = VHB = 16 V
VDD = VHB = 20 V
−40 −20
0
20
40
Temperature (°C)
60
80
100 120 140
−40 −20
0
20
40
Temperature (°C)
60
80
100 120 140
IHO = ILO = 100 mA
IHO = ILO = 100 mA
Figure 8. LO and HO High-Level Output Voltage
vs Temperature
Figure 9. LO and HO Low-Level Output Voltage
vs Temperature
8
7.6
7.2
6.8
6.4
6
1.5
1.2
0.9
0.6
0.3
0
5.6
5.2
VDD Rising Threshold
HB Rising Threshold
VDD UVLO Hysteresis
HB UVLO Hysteresis
−40 −20
0
20
40
60
80
100 120 140
−40 −20
0
20
40
60
80
100 120 140
Temperature (°C)
Temperature (°C)
G009
G010
Figure 10. Undervoltage Lockout Threshold
vs Temperature
Figure 11. Undervoltage Lockout Threshold Hysteresis
vs Temperature
40
36
32
28
24
20
16
12
8
32
24
16
TDLRR
TDLFF
TDHRR
TDHFF
TDLRR
TDLFF
8
TDHRR
TDHFF
4
0
0
−40 −20
0
20
40
Temperature (°C)
60
80
100 120 140
−40 −20
0
20
40
Temperature (°C)
60
80
100 120 140
VDD = VHB = 12 V
Figure 12. Propagation Delays vs Temperature
VDD = VHB = 12 V
Figure 13. Propagation Delays vs Temperature
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Typical Characteristics (continued)
32
28
24
20
16
12
8
32
28
24
20
16
12
8
TDLRR
TDLFF
TDHRR
TDHFF
TDLRR
TDLFF
TDHRR
TDHFF
4
4
0
0
8
12
16
Supply Voltage (V)
20
8
12
16
20
Supply Voltage (V)
T = 25°C
T = 25°C
Figure 14. Propagation Delays vs Supply Voltage
(VDD = VHB
Figure 15. Propagation Delays vs Supply Voltage
(VDD = VHB
)
)
10
8
5
4
3
2
1
0
Pulldown Current
Pullup Current
6
4
2
0
TMON
TMOFF
−2
−40 −20
0
20
40
60
Temperature (°C)
80
100 120 140
0
2
4
6
8
10
12
Output Voltage (V)
G016
VDD = VHB = 12 V
VDD = VHB = 12 V
Figure 16. Delay Matching vs Temperature
Figure 17. Output Current vs Output Voltage
100
10
1
0.1
0.01
0.001
500
550
600
650
700
750
800
850
Diode Voltage (mV)
G017
Figure 18. Diode Current vs Diode Voltage
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7 Detailed Description
7.1 Overview
The UCC27212 device represents Texas Instruments’ latest generation of high-voltage gate drivers, which are
designed to drive both the high-side and low-side of N-Channel MOSFETs in a half- and full-bridge or
synchronous-buck configuration. The floating high-side driver can operate with supply voltages of up to 120 V,
which allows for N-Channel MOSFET control in half-bridge, full-bridge, push-pull, two-switch forward, and active
clamp forward converters.
The UCC27212 device feature 4-A source and sink capability, industry best-in-class switching characteristics and
a host of other features listed in Table 1. These features combine to ensure efficient, robust and reliable
operation in high-frequency switching power circuits.
Table 1. UCC27212 Highlights
FEATURE
BENEFIT
High peak current ideal for driving large power MOSFETs with
minimal power loss (fast-drive capability at Miller plateau)
4-A source and sink current with 0.9-Ω output resistance
Increased robustness and ability to handle undershoot and
overshoot can interface directly to gate-drive transformers without
having to use rectification diodes.
Input pins (HI and LI) can directly handle –10 VDC up to 20 VDC
120-V internal boot diode
Provides voltage margin to meet telecom 100-V surge requirements
Allows the high-side channel to have extra protection from inherent
negative voltages caused by parasitic inductance and stray
capacitance
Switch node (HS pin) able to handle –18 V maximum for 100 ns
Robust ESD circuitry to handle voltage spikes
Excellent immunity to large dV/dT conditions
Best-in-class switching characteristics and extremely low-pulse
transmission distortion
18-ns propagation delay with 7.2-ns rise time and 5.5-ns fall time
2-ns (typical) delay matching between channels
Symmetrical UVLO circuit
Avoids transformer volt-second offset in bridge
Ensures high-side and low-side shut down at the same time
Complementary to analog or digital PWM controllers; increased
hysteresis offers added noise immunity
TTL optimized thresholds with increased hysteresis
In the UCC27212 device, the high side and low side each have independent inputs that allow maximum flexibility
of input control signals in the application. The boot diode for the high-side driver bias supply is internal to the
UCC27212. The UCC27212 is the TTL or logic compatible version. The high-side driver is referenced to the
switch node (HS), which is typically the source pin of the high-side MOSFET and drain pin of the low-side
MOSFET. The low-side driver is referenced to VSS, which is typically ground. The UCC27212 functions are
divided into the input stages, UVLO protection, level shift, boot diode, and output driver stages.
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7.2 Functional Block Diagram
2
HB
UVLO
3
4
HO
HS
LEVEL
SHIFT
5
HI
1
6
VDD
UVLO
LO
8
7
VSS
LI
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7.3 Feature Description
7.3.1 Input Stages
The input stages provide the interface to the PWM output signals. The input stages of the UCC27212 device
have impedance of 70-kΩ nominal and input capacitance is approximately 2 pF. Pulldown resistance to VSS
(ground) is 70 kΩ. The logic level compatible input provides a rising threshold of 2.3 V and a falling threshold of
1.6 V. There is enough input hysteresis to avoid noise related jitter issues on the input.
7.3.2 Undervoltage Lockout (UVLO)
The bias supplies for the high-side and low-side drivers have UVLO protection. VDD as well as VHB to VHS
differential voltages are monitored. The VDD UVLO disables both drivers when VDD is below the specified
threshold. The rising VDD threshold is 5.7 V with 0.4-V hysteresis. The VHB UVLO disables only the high-side
driver when the VHB to VHS differential voltage is below the specified threshold. The VHB UVLO rising threshold is
5.3 V with 0.4 V hysteresis.
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Feature Description (continued)
7.3.3 Level Shift
The level shift circuit is the interface from the high-side input to the high-side driver stage which is referenced to
the switch node (HS). The level shift allows control of the HO output referenced to the HS pin and provides
excellent delay matching with the low-side driver.
7.3.4 Boot Diode
The boot diode necessary to generate the high-side bias is included in the UCC27212 family of drivers. The
diode anode is connected to VDD and cathode connected to VHB. With the VHB capacitor connected to HB and the
HS pins, the VHB capacitor charge is refreshed every switching cycle when HS transitions to ground. The boot
diode provides fast recovery times, low diode resistance, and voltage rating margin to allow for efficient and
reliable operation.
7.3.5 Output Stages
The output stages are the interface to the power MOSFETs in the power train. High slew rate, low resistance and
high peak current capability of both output drivers allow for efficient switching of the power MOSFETs. The low-
side output stage is referenced from VDD to VSS and the high side is referenced from VHB to VHS
.
7.4 Device Functional Modes
The device operates in normal mode and UVLO mode. See the Undervoltage Lockout (UVLO) section for
information on UVLO operation mode. In the normal mode the output state is dependent on states of the HI and
LI pins. Table 2 lists the output states for different input pin combinations.
Table 2. Device Logic Table
HI PIN
LI PIN
HO(1)
LO(2)
L
L
L
H
L
L
L
L
H
L
H
H
H
H
H
H
(1) HO is measured with respect to HS.
(2) LO is measured with respect to VSS.
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
To affect fast switching of power devices and reduce associated switching power losses, a powerful gate driver is
employed between the PWM output of controllers and the gates of the power semiconductor devices. Also, gate
drivers are indispensable when it is impossible for the PWM controller to directly drive the gates of the switching
devices. With the advent of digital power, this situation will be often encountered because the PWM signal from
the digital controller is often a 3.3-V logic signal which cannot effectively turn on a power switch. Level shifting
circuitry is needed to boost the 3.3-V signal to the gate-drive voltage (such as 12 V) in order to fully turn on the
power device and minimize conduction losses. Traditional buffer drive circuits based on NPN/PNP bipolar
transistors in totem-pole arrangement, being emitter follower configurations, prove inadequate with digital power
because they lack level-shifting capability. Gate drivers effectively combine both the level-shifting and buffer-drive
functions. Gate drivers also find other needs such as minimizing the effect of high-frequency switching noise by
locating the high-current driver physically close to the power switch, driving gate-drive transformers, and
controlling floating power-device gates, reducing power dissipation and thermal stress in controllers by moving
gate charge power losses from the controller into the driver.
Finally, emerging wide band-gap power device technologies such as GaN based switches, which are capable of
supporting very high switching frequency operation, are driving very special requirements in terms of gate drive
capability. These requirements include operation at low VDD voltages (5 V or lower), low propagation delays and
availability in compact, low-inductance packages with good thermal capability. Gate-driver devices are extremely
important components in switching power, and they combine the benefits of high-performance, low-cost
component count and board-space reduction as well as simplified system design.
8.2 Typical Application
12 V
100 V
VDD
HB
SECONDARY
SIDE
CIRCUIT
HO
HI
LI
DRIVE
HI
HS
LO
PWM
CONTROLLER
DRIVE
LO
UCC27212-Q1
ISOLATION
AND
FEEDBACK
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Figure 19. UCC27212 Typical Application
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Typical Application (continued)
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 3.
Table 3. Design Specifications
DESIGN PARAMETER
Supply voltage, VDD
Voltage on HS, VHS
Voltage on HB, VHB
Output current rating, IO
Operating frequency
EXAMPLE VALUE
12 V
0 V to 100 V
12 V to 112 V
–4 A to 4 A
500 kHz
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8.2.2 Detailed Design Procedure
8.2.2.1 Power Dissipation
Power dissipation of the gate driver has two portions as shown in Equation 1.
PDISS = PDC + PSW
(1)
(2)
Use Equation 2 to calculate the DC portion of the power dissipation (PDC).
PDC = IQ × VDD
where
•
IQ is the quiescent current for the driver.
The quiescent current is the current consumed by the device to bias all internal circuits such as input stage,
reference voltage, logic circuits, protections, and also any current associated with switching of internal devices
when the driver output changes state (such as charging and discharging of parasitic capacitances, parasitic
shoot-through, and so forth). The UCC27212 features very low quiescent currents (less than 0.17 mA, refer to
the table and contain internal logic to eliminate any shoot-through in the output driver stage. Thus the effect of
the PDC on the total power dissipation within the gate driver can be safely assumed to be negligible. The power
dissipated in the gate-driver package during switching (PSW) depends on the following factors:
•
Gate charge required of the power device (usually a function of the drive voltage VG, which is very close to
input bias supply voltage VDD)
•
•
Switching frequency
Use of external gate resistors. When a driver device is tested with a discrete, capacitive load calculating the
power that is required from the bias supply is fairly simple. The energy that must be transferred from the bias
supply to charge the capacitor is given by Equation 3.
2
EG = ½CLOAD × VDD
where
•
•
CLOAD is load capacitor
VDD is bias voltage feeding the driver
(3)
There is an equal amount of energy dissipated when the capacitor is charged and when it is discharged. This
leads to a total power loss given by Equation 4.
PG = CLOAD × VDD2 × fSW
where
•
fSW is the switching frequency
(4)
The switching load presented by a power MOSFET/IGBT is converted to an equivalent capacitance by examining
the gate charge required to switch the device. This gate charge includes the effects of the input capacitance plus
the added charge needed to swing the drain voltage of the power device as it switches between the ON and OFF
states. Most manufacturers provide specifications of typical and maximum gate charge, in nC, to switch the
device under specified conditions. Using the gate charge Qg, determine the power that must be dissipated when
switching a capacitor which is calculated using the equation QG = CLOAD × VDD to provide Equation 5 for power.
PG = CLOAD × VDD2 × fSW = QG × VDD × fSW
(5)
This power PG is dissipated in the resistive elements of the circuit when the MOSFET/IGBT is being turned on
and off. Half of the total power is dissipated when the load capacitor is charged during turnon, and the other half
is dissipated when the load capacitor is discharged during turnoff. When no external gate resistor is employed
between the driver and MOSFET/IGBT, this power is completely dissipated inside the driver package. With the
use of external gate-drive resistors, the power dissipation is shared between the internal resistance of driver and
external gate resistor.
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8.2.3 Application Curves
Figure 20. Negative 10-V Input
Figure 21. Step Input
Figure 22. Symmetrical UVLO
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9 Power Supply Recommendations
The bias supply voltage range for which the UCC27212 device is recommended to operate is from 7 V to 17 V.
The lower end of this range is governed by the internal undervoltage-lockout (UVLO) protection feature on the
VDD pin supply circuit blocks. Whenever the driver is in UVLO condition when the VDD pin voltage is below the
V(ON) supply start threshold, this feature holds the output low, regardless of the status of the inputs. The upper
end of this range is driven by the 20-V absolute maximum voltage rating of the VDD pin of the device (which is a
stress rating). Keeping a 3-V margin to allow for transient voltage spikes, the maximum recommended voltage for
the VDD pin is 17 V. The UVLO protection feature also involves a hysteresis function, which means that when the
VDD pin bias voltage has exceeded the threshold voltage and device begins to operate, and if the voltage drops,
then the device continues to deliver normal functionality unless the voltage drop exceeds the hysteresis
specification VDD(hys). Therefore, ensuring that, while operating at or near the 7 V range, the voltage ripple on the
auxiliary power supply output is smaller than the hysteresis specification of the device is important to avoid
triggering device shutdown. During system shutdown, the device operation continues until the VDD pin voltage
has dropped below the V(OFF) threshold, which must be accounted for while evaluating system shutdown timing
design requirements. Likewise, at system start-up the device does not begin operation until the VDD pin voltage
has exceeded the V(ON) threshold.
The quiescent current consumed by the internal circuit blocks of the device is supplied through the VDD pin.
Although this fact is well known, it is important to recognize that the charge for source current pulses delivered by
the HO pin is also supplied through the same VDD pin. As a result, every time a current is sourced out of the HO
pin, a corresponding current pulse is delivered into the device through the VDD pin. Thus, ensure that a local
bypass capacitor is provided between the VDD and GND pins and located as close to the device as possible for
the purpose of decoupling is important. A low-ESR, ceramic surface-mount capacitor is required. TI recommends
using a capacitor in the range 0.22 µF to 4.7 µF between VDD and GND. In a similar manner, the current pulses
delivered by the HO pin are sourced from the HB pin. Therefore a 0.022-µF to 0.1-µF local decoupling capacitor
is recommended between the HB and HS pins.
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10 Layout
10.1 Layout Guidelines
To improve the switching characteristics and efficiency of a design, the following layout rules must be followed.
•
•
•
Locate the driver as close as possible to the MOSFETs.
Locate the VDD – VSS and VHB-VHS (bootstrap) capacitors as close as possible to the device (see ).
Pay close attention to the GND trace. Use the thermal pad of the package as GND by connecting it to the
VSS pin (GND). The GND trace from the driver goes directly to the source of the MOSFET, but must not be
in the high current path of the MOSFET drain or source current.
•
•
Use similar rules for the HS node as for GND for the high-side driver.
For systems using multiple UCC27212 devices, TI recommends that dedicated decoupling capacitors be
located at VDD–VSS for each device.
•
•
Care must be taken to avoid placing VDD traces close to LO, HS, and HO signals.
Use wide traces for LO and HO closely following the associated GND or HS traces. A width of 60 to 100 mils
is preferable where possible.
•
•
Use as least two or more vias if the driver outputs or SW node must be routed from one layer to another. For
GND, the number of vias must be a consideration of the thermal pad requirements as well as parasitic
inductance.
Avoid LI and HI (driver input) going close to the HS node or any other high dV/dT traces that can induce
significant noise into the relatively high impedance leads.
A poor layout can cause a significant drop in efficiency or system malfunction, and it can even lead to decreased
reliability of the whole system.
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10.2 Layout Example
HB Bypassing Cap
(Bottom Layer)
Ground plane
(Bottom Layer)
VDD Bypassing Cap
Ext. Gate
Resistance
(LO)
Ext. Gate
Resistance
(HO)
To LO
Load
To HO
Load
Figure 23. UCC27212 Layout Example
10.2.1 Thermal Considerations
The useful range of a driver is greatly affected by the drive-power requirements of the load and the thermal
characteristics of the package. For a gate driver to be useful over a particular temperature range, the package
must allow for efficient removal of the heat produced while keeping the junction temperature within rated limits.
The thermal metrics for the driver package are listed in . For detailed information regarding the table, refer to the
Application Note from Texas Instruments entitled Semiconductor and IC Package Thermal Metrics (SPRA953).
The UCC27212 device is offered in SOIC (8) and VSON (8). The section lists the thermal performance metrics
related to the SOT-23 package.
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
•
•
PowerPAD™ Thermally Enhanced Package, Application Report
PowerPAD™ Made Easy, Application Report
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.4 Trademarks
E2E is a trademark of Texas Instruments.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
UCC27212DPRR
UCC27212DPRT
ACTIVE
WSON
WSON
DPR
10
10
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 140
-40 to 140
UCC
27212
ACTIVE
DPR
NIPDAU
UCC
27212
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
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10-Dec-2020
Addendum-Page 2
PACKAGE OUTLINE
DPR0010A
WSON - 0.8 mm max height
SCALE 3.000
PLASTIC SMALL OUTLINE - NO LEAD
4.1
3.9
A
B
(0.2)
4.1
3.9
PIN 1 INDEX AREA
FULL R
BOTTOM VIEW
SIDE VIEW
20.000
ALTERNATIVE LEAD
DETAIL
0.8
0.7
C
SEATING PLANE
0.08 C
0.05
0.00
EXPOSED
THERMAL PAD
2.6 0.1
(0.1) TYP
SEE ALTERNATIVE
LEAD DETAIL
5
6
2X
3.2
11
3
0.1
8X 0.8
1
10
0.35
0.25
0.1
10X
0.5
0.3
PIN 1 ID
10X
C A B
C
0.05
4218856/B 01/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
DPR0010A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(2.6)
10X (0.6)
SYMM
10
1
10X (0.3)
(1.25)
SYMM
11
(3)
8X (0.8)
6
5
(
0.2) VIA
TYP
(1.05)
(R0.05) TYP
(3.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
EXPOSED
METAL
EXPOSED
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EDGE
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4218856/B 01/2021
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
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EXAMPLE STENCIL DESIGN
DPR0010A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
10X (0.6)
METAL
TYP
(0.68)
10
1
10X (0.3)
(0.76)
11
SYMM
8X (0.8)
4X
(1.31)
5
6
(R0.05) TYP
4X (1.15)
(3.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 11:
77% PRINTED SOLDER COVERAGE BY AREA
SCALE:20X
4218856/B 01/2021
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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