UCC28180DR [TI]

Programmable Frequency, Continuous Conduction Mode (CCM), Boost Power Factor Correction (PFC) Controller; 可编程频率,连续导通模式( CCM )升压功率因数校正(PFC )控制器
UCC28180DR
型号: UCC28180DR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Programmable Frequency, Continuous Conduction Mode (CCM), Boost Power Factor Correction (PFC) Controller
可编程频率,连续导通模式( CCM )升压功率因数校正(PFC )控制器

稳压器 开关式稳压器或控制器 电源电路 开关式控制器 功率因数校正 光电二极管
文件: 总48页 (文件大小:1765K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
Programmable Frequency, Continuous Conduction Mode (CCM), Boost Power Factor  
Correction (PFC) Controller  
Check for Samples: UCC28180  
1
FEATURES  
DESCRIPTION  
The UCC28180 is a flexible and easy-to-use, 8-pin,  
active Power Factor Correction (PFC) controller that  
operates under Continuous Conduction Mode (CCM)  
to achieve high Power Factor, low current distortion  
and excellent voltage regulation of boost pre-  
regulators in AC - DC front-ends. The controller is  
suitable for universal AC input systems operating in  
100-W to few-kW range with the switching frequency  
programmable between 18 kHz to 250 kHz, to  
conveniently support both power MOSFET and IGBT  
switches. An integrated 1.5-A and 2-A (SRC-SNK)  
peak gate drive output, clamped internally at 15.2 V  
(typical), enables fast turn-on, turn-off and easy  
management of the external power switch without the  
need for buffer circuits.  
8-pin Solution (no AC line sensing needed)  
Wide Range Programmable Switching  
Frequency (18 kHz to 250 kHz for MOSFET and  
IGBT based PFC converters)  
Trimmed Current Loop Circuits for Low iTHD  
Reduced Current Sense Threshold (minimizes  
power dissipation in shunt)  
Average Current-Mode Control  
Soft Over Current and Cycle-by-Cycle Peak  
Current Limit Protection  
Output Over-Voltage Protection with  
Hysteresis Recovery  
Audible Noise Minimization Circuitry  
Open Loop Detection  
Low-distortion wave shaping of the input current  
using average current mode control is achieved  
without input line sensing, reducing the external  
component count. In addition, the controller features  
reduced current sense thresholds to facilitate the use  
of small value shunt resistors for reduced power  
dissipation, especially important in high power  
systems. To enable low current distortion, the  
controller also features trimmed internal current loop  
regulation circuits for eliminating associated  
inaccuracies.  
Enhance Dynamic Response During Output  
Over and Under-Voltage Conditions  
Maximum Duty Cycle of 96% (typical)  
Burst Mode for No Load Regulation  
VCC UVLO, Low ICC Start-Up (<75 µA)  
APPLICATIONS  
Universal AC Input, CCM Boost PFC  
converters in 100-W to Few-kW range  
Server and Desktop Power Supplies  
White Good Appliances (Air Conditioners,  
Refrigerators)  
Industrial Power Supplies (DIN Rail)  
Flat Panel TV (PDP, LCD and LED) TVs  
Typical Application  
VOUT  
EMI Filter  
LINE  
INPUT  
Bridge  
Rectifier  
+
GND  
GATE  
VCC  
1
2
3
4
8
7
6
5
Auxilary  
Supply  
ICOMP  
ISENSE VSENSE  
FREQ VCOMP  
Rload  
UCC28180  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  
 
 
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
DESCRIPTION (CONT.)  
Simple external networks allow for flexible compensation of the current and voltage control loops. In addition,  
UCC28180 offers an enhanced dynamic response circuit that is based on the voltage feedback signal to deliver  
improved response under fast load transients, both for output over-voltage and under-voltage conditions. An  
unique VCOMP discharge circuit provided in UCC28180 is activated whenever the voltage feedback signal  
exceeds VOVP_L thus allowing a chance for the control loop to stabilize quickly and avoid encountering the over-  
voltage protection function when PWM shut-off can often cause audible noise. Controlled soft start gradually  
regulates the input current during start-up and reduces stress on the power switches. Numerous system-level  
protection features available in the controller include VCC UVLO, peak current limit, soft over-current, output  
open-loop detection, output over-voltage protection and open-pin detection (VISNS). A trimmed internal reference  
provides accurate protection thresholds and regulation set-point. The user can control low power standby mode  
by pulling the VSENSE pin below 0.82 V.  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION  
PART NUMBER  
PACKAGE  
OPERATING TEMPERATURE RANGE, TA  
UCC28180D  
SOIC 8-Pin (D) Lead (Pb)-Free/Green(1) Lead  
(Pb)-Free/Green  
–40°C to 125°C  
(1) SOIC (D) package is available taped and reeled by adding “R” to the above part number. Reeled quantities are 2,500 devices per reel.  
ABSOLUTE MAXIMUM RATINGS(1)  
Over operating free-air temperature range, all voltages are with respect to GND (unless otherwise noted). Currents are  
positive into and negative out of the specified terminal.  
VALUE  
MIN  
–0.3  
–0.3  
–24  
UNIT  
MAX  
22  
7
Input voltage range  
VCC, GATE  
V
FREQ, VSENSE, VCOMP, ICOMP  
ISENSE  
7
Input current range  
VSENSE, ISENSE  
Operating  
–1  
1
mA  
°C  
°C  
°C  
kV  
V
–55  
150  
150  
300  
2
Junction temperature, TJ  
Lead temperature, TSOL  
Storage  
–65  
Soldering, 10 s  
Human Body Model (HBM)  
Charged Device Model (CDM)  
Electrostatic Discharge (ESD)  
Protection  
500  
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other condition beyond those included under “recommended operating  
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods of time may affect device reliability.  
2
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
MIN  
VCCOFF + 1V  
–40  
MAX UNIT  
VCC input voltage from a low-impedance source  
Operating junction temperature, TJ  
Operating frequency  
21  
V
125  
°C  
18  
250 kHz  
THERMAL INFORMATION  
UCC28180  
SOIC (D)  
8 PINS  
116.1  
62.2  
THERMAL METRIC(1)  
UNITS  
θJA  
Junction-to-ambient thermal resistance(2)  
Junction-to-case (top) thermal resistance(3)  
Junction-to-board thermal resistance(4)  
Junction-to-top characterization parameter(5)  
Junction-to-board characterization parameter(6)  
Junction-to-case (bottom) thermal resistance(7)  
θJCtop  
θJB  
56.4  
°C/W  
ψJT  
14.4  
ψJB  
55.9  
θJCbot  
N/A  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as  
specified in JESD51-7, in an environment described in JESD51-2a.  
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-  
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB  
temperature, as described in JESD51-8.  
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).  
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).  
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific  
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
Spacer  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
Unless otherwise noted, VCC=15Vdc, 0.1µF from VCC to GND, –40°C TJ = TA +125°C. All voltages are with respect to  
GND. Currents are positive into and negative out of the specified terminal.  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX  
UNITS  
VCC Bias Supply  
ICCPRESTART  
ICCSTBY  
ICC Pre-start current  
ICC Standby current  
ICC Operating current  
VCC = VCCOFF – 0.2 V  
75  
2.95  
8.8  
µA  
mA  
mA  
VSENSE = 0.5 V  
1.80  
5.8  
2.40  
7.0  
ICCON_load  
VSENSE = 4.0 V, CGATE = 4.7 nF  
Under Voltage LockOut (UVLO)  
VCCON  
VCC Turn on threshold  
10.8  
9.1  
11.5  
9.5  
12.1  
10.3  
2.0  
V
V
V
VCCOFF  
VCC Turn off threshold  
UVLO Hysteresis  
1.6  
1.7  
Variable Frequency  
Minimum switching frequency  
RFREQ = 130 kΩ  
RFREQ = 32.7 kΩ  
RFREQ = 8.2 kΩ  
TA = 25°C  
16.3  
61.75  
225  
18.0  
65.00  
250  
19.8  
68.25  
275  
kHz  
kHz  
kHz  
V
fSW  
Typical switching frequency  
Maximum switching frequency  
Voltage at FREQ pin  
VFREQ  
PWM  
DMIN  
1.43  
1.50  
1.56  
Minimum duty cycle  
Maximum duty cycle  
Minimum off time  
VSENSE = 5.1 V, ISENSE = –0.25 V  
VSENSE = 4.0 V, RFREQ = 32.7 Ω  
VSENSE = 3 V, ICOMP = 0.72 V  
0%  
DMAX  
94.8% 96.5% 98.0%  
450 570 690  
tOFF(min)  
ns  
System Protection  
VSOC  
VPCL  
ISENSE threshold, soft over current (SOC)  
–0.259 –0.295 –0.312  
V
V
ISENSE threshold, peak current limit (PCL)  
–0.345  
–0.4 –0.438  
ISENSE bias current, ISENSE open-pin protection  
(ISOP)  
IISOP  
ISENSE = 0 V  
–2.30  
–2.95  
µA  
ISENSE threshold, ISENSE open-pin protection  
(ISOP)  
VISOP  
VOLP  
ISENSE = open pin  
0.085  
16.5  
100  
0.14  
17.6  
325  
V
%VREF  
nA  
VSENSE threshold, open loop protection (OLP)  
ICOMP = 1 V, ISENSE = 0 V  
VSENSE = 0.5 V  
15.6  
Open loop protection (OLP) Internal pull-down  
current  
VSENSE threshold, output under-voltage detection  
(UVD) used for enhanced dynamic response(1)  
VUVD  
VOVD  
93.25  
95.00  
97.00  
%VREF  
%VREF  
VSENSE threshold, output over-voltage detection  
(OVD) used for Enhanced dynamic response(1)  
103.00 105.00 106.75  
Output over-voltage protection low threshold,  
VCOMP is discharged by a 4kresistor when  
VSENSE > VOVP_L  
VOVP_L  
105  
107  
100  
107  
109  
109  
111  
%VREF  
%VREF  
Output over-voltage protection high threshold, PWM  
shuts off when VSENSE > VOVP_H  
VOVP_H  
Output over-voltage protection (VOVP_H) reset  
threshold, PWM turns on when VSENSE <  
VOVP_H(RST)  
VOVP_H(RST)  
102  
104  
%VREF  
%VREF  
ICOMP threshold, external overload protection  
0.20  
0.25  
Current Loop  
gmi  
Transconductance gain  
0.75  
2.7  
0.95  
±50  
3.0  
1.10  
3.3  
mS  
µA  
V
(1)  
Output linear range  
ICOMP voltage during OLP  
VSENSE = 0 V  
(1) Not production tested. Characterized by design  
4
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
ELECTRICAL CHARACTERISTICS (continued)  
Unless otherwise noted, VCC=15Vdc, 0.1µF from VCC to GND, –40°C TJ = TA +125°C. All voltages are with respect to  
GND. Currents are positive into and negative out of the specified terminal.  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX  
UNITS  
Voltage Loop  
VREF  
Reference voltage  
TA = 25°C  
4.93  
4.87  
–40  
–230  
23  
5.00  
5.00  
–56  
–280  
40  
5.07  
5.15  
–70  
V
V
–40°C TA +125°C  
gmv  
Transconductance gain without EDR  
Transconductance gain under EDR  
Maximum sink current under normal operation  
Source current under soft start  
Maximum current under EDR operation  
VSENSE input bias current  
µS  
µS  
µA  
µA  
µA  
nA  
V
gmv-EDR  
–340  
57  
VSENSE = 5 V, VCOMP = 4 V  
VSENSE = 4 V, VCOMP = 4 V  
VSENSE = 4 V, VCOMP = 2.5 V  
VSENSE = 5 V  
–29  
–40  
–200  
100  
0.04  
0.37  
1.5  
–52  
–241  
250  
20  
VCOMP voltage during OLP  
VSENSE = 0.5 V, IVCOMP= 0.5 mA  
VCOMP = 2 V, VCC = floating  
IVCOMP = –100 µA, VSENSE = 4 V  
VCOMP = 0 V  
0.00  
0.10  
VCOMP rapid discharge current  
VCOMP precharge voltage  
mA  
V
VPRECHARGE  
IPRECHARGE  
VCOMP precharge current  
–1  
mA  
%VREF  
VSENSE threshold, end-of-soft-start  
Initial Start-up  
98  
Gate Driver  
GATE current, peak, sinking(2)  
GATE current, peak, sourcing(2)  
GATE rise time  
CGATE = 4.7 nF  
2.0  
–1.5  
40  
A
A
CGATE = 4.7 nF  
CGATE = 4.7 nF, GATE = 2 V to 8 V  
CGATE = 4.7 nF, GATE = 8 V to 2 V  
IGATE = 0 A  
8
8
60  
40  
ns  
ns  
V
GATE fall time  
25  
GATE low voltage, no load  
GATE low voltage, sinking  
GATE low voltage, sourcing  
GATE low voltage, sinking, OFF  
GATE low voltage, sinking, OFF  
GATE high voltage  
0.00  
0.04  
–0.04  
0.20  
0.8  
0.01  
0.06  
–0.06  
0.31  
1.4  
IGATE = 20 mA  
V
IGATE = -20 mA  
V
VCC = 5 V, IGATE = 5 mA  
VCC = 5 V, IGATE = 20 mA  
VCC = 20 V, CGATE = 4.7 nF  
VCC = 12.2 V, CGATE = 4.7 nF  
0.10  
0.4  
V
V
14.5  
10.8  
15.2  
11.2  
16.1  
12  
V
GATE high voltage  
V
VCC = VCCOFF + 0.2 V,  
CGATE = 4.7 nF  
GATE high voltage  
8.2  
9.0  
10.1  
V
(2) Not production tested. Characterized by design  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
DEVICE INFORMATION  
SOIC (TOP VIEW)  
GND  
GATE  
VCC  
1
2
3
4
8
7
6
5
ICOMP  
ISENSE VSENSE  
FREQ  
VCOMP  
PIN FUNCTIONS  
NAME  
GATE  
I/O  
PIN #  
FUNCTION  
Gate Drive: Integrated push-pull gate driver for one or more external power MOSFETs. Typical 2.0-A sink  
and 1.5-A source capability. Output voltage is typically clamped at 15.2 V (typical).  
O
8
1
GND  
Ground: device ground reference.  
Current Loop Compensation: Transconductance current amplifier output. A capacitor connected to GND  
provides compensation and averaging of the current sense signal in the current control loop. The controller is  
disabled if the voltage on ICOMP is less than 0.2 V, (ICOMPP protection function).  
ICOMP  
O
I
2
Inductor Current Sense: Input for the voltage across the external current sense resistor, which represents  
the instantaneous current through the PFC boost inductor. This voltage is averaged by the current amplifier to  
eliminate the effects of ripple and noise. Soft Over Current (SOC) limits the average inductor current. Cycle-  
by-cycle peak current limit (PCL) immediately shuts off the GATE drive if the peak-limit voltage is exceeded.  
An internal 2.3-µA current source pulls ISENSE above 0.085 V to shut down PFC operation if this pin  
becomes open-circuited, (ISOP protection function). Use a 220-Ω resistor between this pin and the current  
sense resistor to limit inrush-surge currents into this pin.  
ISENSE  
VCC  
3
Device Supply: External bias supply input. Under-Voltage Lockout (UVLO) disables the controller until VCC  
exceeds a turn-on threshold of 11.5 V. Operation continues until VCC falls below the turn-off (UVLO)  
threshold of 9.5 V. A ceramic by-pass capacitor of 0.1 µF minimum value should be connected from VCC to  
GND as close to the device as possible for high-frequency filtering of the VCC voltage.  
7
Voltage Loop Compensation: Transconductance voltage error amplifier output. A resistor-capacitor network  
connected from this pin to GND provides compensation. VCOMP is held at GND until VCC, and VSENSE  
exceed their threshold voltages. Once these conditions are satisfied, VCOMP is charged until the VSENSE  
voltage reaches its nominal regulation level. When Enhanced Dynamic Response (EDR) is engaged, a higher  
transconductance is applied to VCOMP to reduce the charge or discharge time for faster transient response.  
Soft Start is programmed by the capacitance on this pin. VCOMP is pulled low when VCC UVLO,  
OLP/Standby, ICOMPP and ISOP functions are activated.  
VCOMP  
FREQ  
O
O
5
4
Switching Frequency Setting: This pin allows the setting of the operating switching frequency by connecting  
a resistor to ground. The programmable frequency range is from 18 kHz to 250 kHz.  
Output Voltage Sense: An external resistor-divider network connected from this pin to the PFC output  
voltage provides feedback sensing for regulation to the internal 5-V reference voltage. A small capacitor from  
this pin to GND filters high-frequency noise. Standby disables the controller and discharges VCOMP when  
the voltage at VSENSE drops below the Open-Loop Protection (OLP) threshold of 16.5%VREF (0.82 V). An  
internal 100-nA current source pulls VSENSE to GND during pin disconnection. Enhanced Dynamic  
Response (EDR) rapidly returns the output voltage to its normal regulation level when a system line or load  
step causes VSENSE to rise above 105% or fall below 95% of the reference voltage. Two level Output Over-  
Voltage Protection (OVP): a 4-kresistor connects VCOMP to ground to rapidly discharge VCOMP when  
VSENSE exceeds 107% (VOVP_L) of the reference voltage. If VSENSE exceeds 109% (VOVP_H) of the  
reference voltage, GATE output will be disabled until VSENSE drops below 102% of the reference voltage.  
VSENSE  
I
6
6
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
BLOCK DIAGRAM  
EMI Filter  
LBST  
DBST  
VOUT  
LINE  
INPUT  
Bridge  
Rectifier  
+
RFB1  
QBST  
RGATE  
CIN  
COUT  
RLOAD  
RFB2  
RSENSE  
Auxiliary Supply  
VCC  
UCC28180 Block Diagram  
+
+
7
Under voltage lockout  
VCCON  
11.5V  
ICOMP Protection  
Q
Q
S
R
CVCC  
GND  
0.2V  
+
ICOMPP  
VCCOFF  
9.5V  
1
UVLO  
ICOMP  
2
PWM  
Comparator  
KPC(s)  
Current  
Amplifier  
Gate Driver  
+
gmi  
CICOMP  
S
Q
Q
+
3V  
PWM  
RAMP  
M2  
R
FAULT  
GAIN  
M1, K1  
GATE  
O
V
P
|
O
L
P
I
OVP_H  
Min Off Time  
8
S
O
P
Oscillator  
H
PCL  
S
R
Q
Q
Pre-Drive and  
Clamp Circuit  
Clock  
M2  
M1  
VCOMP  
+
Q
S
OVP_H  
RISENSEfilter  
5.45V  
5.10V  
4k  
Q
R
+
+
+
ISENSE  
Peak Current Limit(PCL)  
3
300ns  
Leading Edge  
Blanking  
Over voltage protection  
5.35V  
1V  
PCL  
OVP_L  
SOC  
CISENSEfilter  
+
+
-2.5X  
EDR  
EDR  
5.25V  
Soft Over Current(SOC)  
0.72V  
Over voltage detector  
4.75V  
+
+
SOC  
ISOP  
Under voltage detector  
0.82V  
+
OLP/STANDBY  
ICOMPP  
FREQ  
100nA  
Oscillator  
Voltage Error  
Amplifier  
ISOP  
UVLO  
OLP  
4
FAULT  
5V  
+
gmv  
RFREQ  
VSENSE  
CVSENSE  
6
5
gmv Enhancement  
End of soft start detector  
4.9V  
+
END OF SS  
VCOMP  
RCV  
Rapid Discharge  
when  
VCC < VCCOFF  
EDR  
UVLO  
SS  
Q
Q
S
R
END OF SS  
FAULT  
CCV2  
FAULT  
CCV1  
VPRECHARGE  
FAULT  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
TYPICAL CHARACTERISTICS  
0.99  
0.97  
0.95  
0.93  
0.91  
0.89  
0.87  
0.85  
VCC = 15 V  
265  
215  
165  
115  
65  
15  
0
20  
40  
60  
80  
100  
120  
140  
15 35 55 75 95 115 135 155 175 195 215 235 255  
RFREQ (KŸ)  
FSW ± Switching Frequency (kHz)  
C001  
C002  
Figure 1. Switching Frequency vs. Resistor  
Figure 2. Maximum Duty Cycle vs. Switching Frequency  
12.0  
11.5  
11.0  
10.5  
10.0  
9.5  
3.5  
TJ = 25ƒC  
VSENSE = 3 V  
No Gate Load  
VCC Turn ON  
3.0  
FSW = 65 kHz  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
ICC Turn ON  
VCC Turn OFF  
ICC Turn OFF  
9.0  
8.5  
8.0  
10  
60  
110  
±40  
0
5
10  
15  
20  
25  
TJ ± Temperature (ƒC)  
VCC ± Bias Supply Voltage (V)  
C003  
C004  
Figure 3. UVLO Threshold vs. Temperature  
Figure 4. Supply Current vs. Bias Supply Voltage  
8
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
 
 
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
TYPICAL CHARACTERISTICS (continued)  
9
8
7
6
5
4
3
2
1
0
70  
65  
60  
55  
50  
45  
40  
35  
30  
VCC = 15 V  
VCC = VCCON t 0.2 V  
Operating, GATE Load = 4.7 nF  
Pre-Start  
Standby  
10  
60  
110  
10  
60  
TJ ± Temperature (ƒC)  
110  
±40  
±40  
TJ ± Temperature (ƒC)  
C005  
C006  
Figure 5. Supply Current vs. Temperature  
Figure 6. Pre-Start Supply Current vs. Temperature  
75  
73  
71  
69  
67  
65  
63  
61  
59  
57  
55  
75  
73  
71  
69  
67  
65  
63  
61  
59  
57  
55  
VCC = 15 V  
FSW = 65 kHz  
TJ = 25ƒC  
FSW = 65 kHz  
Switching Frequency  
Switching Frequency  
10  
60  
110  
9
11  
13  
15  
17  
19  
21  
23  
±40  
TJ ± Temperature (ƒC)  
VCC ± Bias Supply Voltage (V)  
C007  
C008  
Figure 7. Oscillator Frequency (65 kHz) vs. Temperature  
Figure 8. Oscillator Frequency (65 kHz) vs. Bias Supply  
Voltage  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
20.0  
19.5  
19.0  
18.5  
18.0  
17.5  
17.0  
16.5  
16.0  
15.5  
15.0  
250.0  
249.5  
249.0  
248.5  
248.0  
247.5  
247.0  
246.5  
246.0  
245.5  
245.0  
VCC = 15 V  
VCC = 15 V  
0
25  
50  
75  
100  
125  
0
25  
50  
75  
100  
125  
±50  
±25  
±50  
±25  
Temperature (ƒC)  
Temperature (ƒC)  
C006  
C002  
Figure 9. Oscillator Frequency (18 kHz) vs. Temperature  
Figure 10. Oscillator Frequency (250 kHz) vs. Temperature  
20.0  
250.0  
TJ = 25ƒC  
TJ = 25ƒC  
19.5  
249.5  
19.0  
18.5  
18.0  
17.5  
17.0  
16.5  
16.0  
15.5  
15.0  
249.0  
248.5  
248.0  
247.5  
247.0  
246.5  
246.0  
245.5  
245.0  
9
11  
13  
15  
17  
19  
21  
9
11  
13  
15  
17  
19  
21  
Bias Supply Voltage (V)  
Bias Supply Voltage (V)  
C003  
C004  
Figure 11. Oscillator Frequency (18 kHz) vs. Bias Voltage  
Figure 12. Oscillator Frequency (250 kHz) vs. Bias Voltage  
2.0  
±45  
VCC = 15 V  
VCC = 15 V  
1.8  
1.6  
1.4  
1.2  
1.0  
±47  
±49  
±51  
±53  
±55  
Gain, No EDR  
0.8  
0.6  
0.4  
0.2  
0.0  
±57  
Gain  
±59  
±61  
±63  
±65  
10  
60  
TJ ± Temperature (ƒC)  
110  
10  
60  
110  
±40  
±40  
T
J t Temperature (ƒC)  
C009  
C010  
Figure 13. Current Loop Gain vs. Temperature  
Figure 14. Voltage Loop Gain vs. Temperature  
10  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
TYPICAL CHARACTERISTICS (continued)  
5.5  
5.4  
5.3  
5.2  
5.1  
5.0  
4.9  
4.8  
4.7  
4.6  
4.5  
0.00  
±0.05  
±0.10  
±0.15  
±0.20  
±0.25  
±0.30  
±0.35  
±0.40  
±0.45  
±0.50  
VCC = 15 V  
VCC = 15 V  
Reference Voltage  
Soft Over-Current Protection (SOC)  
10  
60  
110  
10  
60  
110  
±40  
±40  
TJ ± Temperature (ƒC)  
TJ ± Temperature (ƒC)  
C011  
C012  
Figure 15. Reference Voltage vs. Temperature  
Figure 16. ISENSE Threshold Soft Over Current (SOC) vs.  
Temperature  
2.0  
115  
110  
105  
100  
95  
VCC = 15 V  
VCC = 15 V  
1.8  
1.6  
1.4  
1.2  
VOVP_H  
VOVP_L  
VOVD  
VOVP_H(RST  
)
1.0  
VOLP  
0.8  
0.6  
0.4  
0.2  
0.0  
VUVD  
90  
10  
35  
60  
85  
110  
10  
60  
110  
±40  
±15  
±40  
T
J t Temperature (ƒC)  
TJ ± Temperature (ƒC)  
C013  
C014  
Figure 17. VSENSE Threshold vs. Temperature  
Figure 18. VSENSE Threshold Open Loop vs. Temperature  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
650  
630  
610  
590  
570  
550  
530  
510  
490  
470  
450  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
VSENSE = 3 V  
ICOMP = 0.72 V  
FSW = 65 kHz  
VCC = 15 V  
CGATE = 4.7 nF  
VGATE = 2 V-8 V  
tOFF(min)  
Rise Time  
Fall Time  
0
10  
35  
60  
85  
110  
10  
35  
60  
85  
110  
±40  
±15  
±40  
±15  
TJ ± Temperature (ƒC)  
TJ ± Temperature (ƒC)  
C015  
C016  
Figure 19. Minimum Off Time vs. Temperature  
Figure 20. Gate Drive Rise/Fall Time vs. Temperature  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
2.0  
TJ = 25ƒC  
CGATE = 4.7 nF  
VGATE = 2 V-8 V  
VCC = 15 V  
IGATE = 20 mA  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
Rise Time  
Fall Time  
VGATE  
0
10  
12  
14  
16  
18  
20  
22  
10  
35  
60  
85  
110  
±40  
±15  
VCC ± Bias Supply Voltage (V)  
TJ ± Temperature (ƒC)  
C017  
C018  
Figure 21. Gate Drive Rise/Fall Time vs. Bias Supply  
Voltage  
Figure 22. Gate Low Voltage vs. Temperature  
12  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
APPLICATION INFORMATION  
UCC28180 Operation  
The UCC28180 is a switch-mode controller used in boost converters for power factor correction operating at a  
fixed frequency in continuous conduction mode. The UCC28180 requires few external components to operate as  
an active PFC pre-regulator. The operating switching frequency can be programmed from 18 kHz to 250 kHz  
simply by connecting the FREQ pin to ground through a resistor.  
The internal 5-V reference voltage provides for accurate output voltage regulation over the typical world-wide 85-  
VAC to 265-VAC mains input range from zero to full output load. The usable system load ranges from 100 W to  
few kW.  
Regulation is accomplished in two loops. The inner current loop shapes the average input current to match the  
sinusoidal input voltage under continuous inductor current conditions. Under light-load conditions, depending on  
the boost inductor value, the inductor current may go discontinuous but still meet Class-A/D requirements of IEC  
61000-3-2 despite the higher harmonics. The outer voltage loop regulates the PFC output voltage by generating  
a voltage on VCOMP (dependent upon the line and load conditions) which determines the internal gain  
parameters for maintaining a low-distortion, steady-state, input-current wave shape.  
Bias Supply  
The UCC28180 operates from an external bias supply. It is recommended that the device be powered from a  
regulated auxiliary supply. (This device is not intended to be used from a bootstrap bias supply. A bootstrap bias  
supply is fed from the input high voltage through a resistor with sufficient capacitance on VCC to hold up the  
voltage on VCC until current can be supplied from a bias winding on the boost inductor. For that reason, the  
minimal hysteresis on VCC would require an unreasonable value of hold-up capacitance.)  
During normal operation, when the output is regulated, current drawn by the device includes the nominal run  
current plus the current supplied to the gate of the external boost switch. Decoupling of the bias supply must take  
switching current into account in order to keep ripple voltage on VCC to a minimum. A ceramic capacitor of 0.1-  
µF minimum value from VCC to GND with short, wide traces is recommended.  
VCC  
VCC(ON) 11.5V  
VCC(  
9.5V  
OFF)  
ICC  
ICC(ON)  
ICC(stby) < 2.95 mA  
ICC(prestart) < 75 µA  
Controller  
State  
Soft-  
Start  
UVLO  
OFF  
Run  
Run  
UVLO  
OFF  
Soft-Start  
Fault/standby  
OFF  
PWM  
State  
Ramp  
Regulated  
Ramp Regulated  
Figure 23. Device Supply States  
The device's bias operates in several states. During startup, VCC Under-Voltage LockOut (UVLO) sets the  
minimum operational DC input voltage of the controller. There are two UVLO thresholds. When the UVLO turn-on  
threshold is exceeded, the PFC controller turns ON. If the VCC voltage falls below the UVLO turn-off threshold,  
the PFC controller turns off. During UVLO, current drawn by the device is minimal. After the device turns on, Soft  
Start (SS) is initiated and the boost inductor current is ramped up in a controlled manner to reduce the stress on  
the external components and avoids output voltage overshoot. During soft start and after the output is in  
regulation, the device draws its normal run current. If any of several fault conditions are encountered or if the  
device is put in standby with an external signal, the device draws a reduced standby current.  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
13  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
Soft Start  
Soft-Start controls the rate of rise of VCOMP in order to obtain a linear control of the increasing duty cycle as a  
function of time. VCOMP, the output of the voltage loop transconductance amplifier, is pulled low during UVLO,  
ICOMPP, ISOP and OLP (Open-Loop Protection)/STANDBY. Once the fault condition is released, an initial pre-  
charge source rapidly charges VCOMP to 1.5 V. After that point, a constant 40 µA of current is sourced into the  
compensation components causing the voltage on this pin to ramp linearly until the output voltage reaches 85%  
of its final value. At this point, the sourcing current decreases until the output voltage reaches its final rated  
voltage. The soft-start time is controlled by the voltage error amplifier compensation capacitor values selected,  
and is user programmable based on desired loop crossover frequency. Once the output voltage exceeds 98% of  
rated voltage, soft start is over, the initial pre-charge source is disconnected, and EDR is no longer inhibited.  
Soft-Start  
5V  
+
gmv  
VCOMP  
FAULT  
VSENSE  
VCOMP  
ISS = -40uA  
for VSENSE < 4.25V  
during Soft-Start  
FAULT  
END OF SS  
(LATCHED)  
1.5V source for  
rapid pre-charge  
of VCOMP prior  
to Soft-Start  
+
Figure 24. Soft Start  
System Protection  
System-level protection features help keep the system within safe operating limits.  
14  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
VCC Under-Voltage LockOut (UVLO)  
VCC  
Auxiliary Supply  
CDECOUPLE  
GND  
UVLO  
Figure 25. UVLO  
During startup, Under-Voltage LockOut (UVLO) keeps the device in the off state until VCC rises above the 11.5-  
V enable threshold, VCCON. With a typical 1.7 V of hysteresis on UVLO to increase noise immunity, the device  
turns off when VCC drops to the 9.5-V disable threshold, VCCOFF  
.
If, during a brief AC-line dropout, the VCC voltage falls below the level necessary to bias the internal FAULT  
circuitry, the UVLO condition enables a special rapid discharge circuit which continues to discharge the VCOMP  
capacitors through a low impedance despite a complete lack of VCC. This helps to avoid an excessive current  
surge should the AC-line return while there is still substantial voltage stored on the VCOMP capacitors. Typically,  
these capacitors can be discharged to less than 1 V within 150 ms of loss of VCC.  
Output Over-Voltage Protection (OVP)  
There are two levels of OVP: When VSENSE exceeds 107% (VOVP_L) of the reference voltage, a 4-kresistor  
connects VCOMP to ground to rapidly discharge VCOMP. If VSENSE exceeds 109% (VOVP_H) of the reference  
voltage, GATE output is disabled until VSENSE drops below 102% of the reference voltage.  
Open Loop Protection/Standby (OLP/Standby)  
If the output voltage feedback components were to fail and disconnect (open loop) the signal from the VSENSE  
input, then it is likely that the voltage error amp would increase the GATE output to maximum duty cycle. To  
prevent this, an internal pull-down forces VSENSE low. If the output voltage falls below 16.5% of its rated  
voltage, causing VSENSE to fall below 0.82 V, the device is put in standby, a state where the PWM switching is  
halted and the device is still on but draws standby current below 2.95 mA. This shutdown feature also gives the  
designer the option of pulling VSENSE low with an external switch (standby function).  
ISENSE Open-Pin Protection (ISOP)  
If the current feedback components were to fail and disconnect (open loop) the signal to the ISENSE input, then  
it is likely that the PWM stage would increase the GATE output to maximum duty cycle. To prevent this, an  
internal pull-up source drives ISENSE above 0.085 V so that a detector forces a state where the PWM switching  
is halted and the device is still on but draws standby current below 2.95 mA. This shutdown feature avoids  
continual operation in OVP and severely distorted input current.  
ICOMP Open-Pin Protection (ICOMPP)  
If the ICOMP pin shorts to ground, then the GATE output increases to maximum duty cycle. To prevent this,  
once ICOMP pin voltage falls below 0.2 V, the PWM switching is halted and the device is still on but draws  
standby current below 2.95 mA .  
FAULT Protection  
VCC UVLO, OLP/Standby, ISOP and ICOMPP funtions constitute the fault protection feature in the UCC28180.  
Under fault protection, VCOMP pin is pulled low and the device is in standby.  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
15  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
Output Over-Voltage Detection (OVD), Under-Voltage Detection (UVD) and Enhanced Dynamic  
Response (EDR)  
During normal operation, small perturbations on the PFC output voltage rarely exceed ±5% deviation and the  
normal voltage control loop gain drives the output back into regulation. For large changes in line or load, if the  
output voltage perturbation exceeds ±5%, an output over-voltage (OVD) or under-voltage (UVD) is detected and  
Enhanced Dynamic Response (EDR) acts to speed up the slow response of the low-bandwidth voltage loop.  
During EDR, the transconductance of the voltage error amplifier is increased approximately five times to speed  
charging or discharging the voltage-loop compensation capacitors to the level required for regulation. EDR is  
disabled when 5.25 V > VSENSE > 4.75 V. The EDR feature is not activated until soft start is completed. The  
UVD is disabled during soft over protection (SOC) condition (since UVD and SOC conflict with each other).  
Over Voltage Protection  
Enhanced Dynamic Response  
Open Loop Protection/ Standby  
Soft-Start Complete  
+
OVP_L  
5.35V  
+
OVP_H  
5.45V  
S
R
Q
Q
OVERVOLTAGE  
PROTECTION  
+
5.10V  
Output Voltage  
Standby  
EDR  
EDR  
+
+
RFB1  
VSENSE  
OVERVOLTAGE  
DETECTION  
5.25V  
UNDERVOLTAGE  
DETECTION  
4.75V  
4.9V  
RFB2  
Optional  
END OF SS  
SOFT-START COMPLETE  
+
+
OPEN LOOP  
PROTECTION/STANDBY  
OLP/STANDBY  
0.82V  
Figure 26. OVP_H, OVP_L, EDR, OLP, Soft Start Complete  
16  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
Over-Current Protection  
Inductor current is sensed by RISENSE, a low value resistor in the return path of input rectifier. The other side of  
the resistor is tied to the system ground. The voltage is sensed on the rectifier side of the sense resistor and is  
always negative. The voltage at ISENSE is buffered by a fixed gain of -2.5 to provide a positive internal signal to  
the current functions. There are two over-current protection features; Soft Over-Current (SOC) protects against  
an overload on the output and Peak Current Limit (PCL) protects against inductor saturation.  
Soft Over Current (SOC)  
0.72V  
SOC  
ISENSE Open-Pin  
Protection (ISOP)  
+
LINE  
INPUT  
+
IISOP  
2µA  
VOUT  
VISOP  
0.082V  
ISOP  
RISENSE  
+
ISENSE  
CISENSEfilter  
RISENSEfilter  
300ns  
Leading Edge  
Blanking  
(Optional)  
PCL  
1V  
+
+
-2.5x  
Peak Current Limit (PCL)  
Figure 27. Soft Over-Current/Peak-Current Limit  
Soft Over-Current (SOC)  
Soft Over-Current (SOC) limits the input current. SOC is activated when the current sense voltage on ISENSE  
reaches -0.285 V. This is a soft control as it does not directly switch off the gate driver. Instead a 4-kresistor  
connects VCOMP to ground to discharges VCOMP and the control loop is adjusted to reduce the PWM duty  
cycle. The under-voltage detection (UVD) is disabled during SOC.  
Peak Current Limit (PCL)  
Peak Current Limit (PCL) operates on a cycle-by-cycle basis. When the current sense voltage on ISENSE  
reaches –0.4 V, PCL is activated, immediately terminating the active switch cycle. PCL is leading-edge blanked  
to improve noise immunity against false triggering.  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
17  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
Current Sense Resistor, RISENSE  
The current sense resistor, RISENSE, is sized using the minimum threshold value of Soft Over Current (SOC),  
VSOC(min) . To avoid triggering this threshold during normal operation, resulting in a decreased duty-cycle, the  
resistor is sized for an overload current of 10% more than the peak inductor current,  
VSOC(min)  
RISENSE  
£
1.1 IL _ PEAK(max)  
(1)  
Since RISENSE “sees” the average input current, worst-case power dissipation occurs at input low-line when input  
current is at its maximum. Power dissipated by the sense resistor is given by:  
PRISENSE = I  
(
2 R  
)
IN_RMS(max)  
ISENSE  
(2)  
Peak current limit (PCL) protection turns off the output driver when the voltage across the sense resistor reaches  
the PCL threshold, VPCL. The absolute maximum peak current, IPCL, is given by:  
VPCL / 2.5  
=
IPCL  
RISENSE  
(3)  
Gate Driver  
The GATE output is designed with a current-optimized structure to directly drive large values of total  
MOSFET/IGBT gate capacitance at high turn-on and turn-off speeds. An internal clamp limits voltage on the  
MOSFET gate to 15.2 V (typical). When VCC voltage is below the UVLO level, the GATE output is held in the off  
state. An external gate drive resistor, RGATE, can be used to limit the rise and fall times and dampen ringing  
caused by parasitic inductances and capacitances of the gate drive circuit and to reduce EMI. The final value of  
the resistor depends upon the parasitic elements associated with the layout and other considerations. A 10-kΩ  
resistor close to the gate of the MOSFET/IGBT, between the gate and ground, discharges stray gate capacitance  
and helps protect against inadvertent dv/dt-triggered turn-on.  
Gate Driver  
VCC  
7
PWM  
FAULT  
GATE  
GND  
OVP_H  
8
1
PCL  
S
R
Q
Q
Pre-Drive and  
Clamp Circuit  
Clock  
Figure 28. Gate Driver  
18  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
Current Loop  
The overall system current loop consists of the current averaging amplifier stage, the pulse width modulator  
(PWM) stage, the external boost inductor stage and the external current sensing resistor.  
ISENSE and ICOMP Functions  
The negative polarity signal from the current sense resistor is buffered and inverted at the ISENSE input. The  
internal positive signal is then averaged by the current amplifier (gmi), whose output is the ICOMP pin. The  
voltage on ICOMP is proportional to the average inductor current. An external capacitor to GND is applied to the  
ICOMP pin for current loop compensation and current ripple filtering. The gain of the averaging amplifier is  
determined by the internal VCOMP voltage. This gain is non-linear to accommodate the world-wide AC-line  
voltage range.  
ICOMP is connected to 3-V internally whenever OVP_H, ISOP, or OLP is triggered.  
Pulse Width Modulator  
The PWM stage compares the ICOMP signal with a periodic ramp to generate a leading-edge-modulated output  
signal which is high whenever the ramp voltage exceeds the ICOMP voltage. The slope of the ramp is defined by  
a non-linear function of the internal VCOMP voltage.  
The PWM output signal always starts low at the beginning of the cycle, triggered by the internal clock. The output  
stays low for a minimum off-time, tOFF_min, after which the ramp rises linearly to intersect the ICOMP voltage. The  
ramp-ICOMP intersection determines tOFF, and hence DOFF. Since DOFF = VIN/VOUT by the boost-topology  
equation, and since VIN is sinusoidal in wave-shape, and since ICOMP is proportional to the inductor current, it  
follows that the control loop forces the inductor current to follow the input voltage wave-shape to maintain boost  
regulation. Therefore, the average input current is also sinusoidal in wave-shape.  
PWM cycle  
VICOMP  
VRAMP = F(VCOMP  
)
tON  
tOFF  
Figure 29. PWM Generation  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
19  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
Control Logic  
The output of the PWM comparator stage is conveyed to the GATE drive stage, subject to control by various  
protection functions incorporated into the device. The GATE output duty-cycle may be as high as 98%, but  
always has a minimum off-time tOFF_min. Normal duty-cycle operation can be interrupted directly by OVP_H and  
PCL. UVLO, ISOP, ICOMMP and OLP/Standby also terminate the GATE output pulse, and further inhibit output  
until the SS operation can begin.  
Voltage Loop  
The outer control loop of the PFC controller is the voltage loop. This loop consists of the PFC output sensing  
stage, the voltage error amplifier stage, and the non-linear gain generation.  
Output Sensing  
A resistor-divider network from the PFC output voltage to GND forms the sensing block for the voltage control  
loop. The resistor ratio is determined by the desired output voltage and the internal 5-V regulation reference  
voltage.  
The very low bias current at the VSENSE input allows the choice of the highest practicable resistor values for  
lowest power dissipation and standby current. A small capacitor from VSENSE to GND serves to filter the signal  
in a high-noise environment. This filter time constant should generally be less than 100 µs.  
Voltage Error Amplifier  
The transconductance error amplifier (gmv) generates an output current proportional to the difference between the  
voltage feedback signal at VSENSE and the internal 5-V reference. This output current charges or discharges  
the compensation network capacitors on the VCOMP pin to establish the proper VCOMP voltage for the system  
operating conditions. Proper selection of the compensation network components leads to a stable PFC pre-  
regulator over the entire AC-line range and 0% to 100% load range. The total capacitance also determines the  
rate-of-rise of the VCOMP voltage at Soft Start, as discussed earlier.  
The amplifier output VCOMP is pulled to GND during any fault or standby condition to discharge the  
compensation capacitors to an initial zero state. Usually, the large capacitor has a series resistor which delays  
complete discharge for their respective time constant (which may be several hundred milliseconds). If VCC bias  
voltage is quickly removed after UVLO, the normal discharge transistor on VCOMP loses drive and the large  
capacitor could be left with substantial voltage on it, negating the benefit of a subsequent Soft Start. The  
UCC28180 incorporates a parallel discharge path which operates without VCC bias, to further discharge the  
compensation network after VCC is removed.  
If the output voltage perturbations exceed ±5%, and output over-voltage (OVD) or under-voltage (UVD) is  
detected, the OVD or UVD function invokes EDR which immediately increases the voltage error amplifier  
transconductance to about 280 µS. This higher gain facilitates faster charging or discharging the compensation  
capacitors to the new operating level. When output voltage perturbations greater than 107%VREF appear at the  
VSENSE input, a 4-kresistor connects VCOMP to ground to quickly reduce VCOMP voltage. When output  
voltage perturbations are greater than 109%VREF, the GATE output is shut off until VSENSE drops below 102%  
of regulation.  
Non-Linear Gain Generation  
The voltage at VCOMP is used to set the current amplifier gain and the PWM ramp slope. This voltage is subject  
to modification by the SOC function, as discussed earlier.  
Together the current gain and the PWM slope adjust to the different system operating conditions (set by the AC-  
line voltage and output load level) as VCOMP changes, to provide a low-distortion, high-power-factor, input-  
current wave shape following that of the input voltage.  
20  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
Design Example  
Design Goals  
This example illustrates the design process and component selection for a continuous mode power factor  
correction boost converter utilizing the UCC28180. The pertinent design equations are shown for a universal  
input, 360-W PFC converter with an output voltage of 390 V.  
Table 1. Design Goal Parameters  
PARAMETER  
Input Characteristics  
TEST CONDITION  
MIN  
TYP  
MAX  
UNIT  
VIN  
Input voltage  
85  
47  
265  
VAC  
Hz  
fLINE  
Input frequency  
63  
VIN = VIN(min)  
IOUT = IOUT(max)  
,
IIN(peak)  
Peak input current  
7
A
Output Characteristics  
V
IN(min) VIN VIN(max)  
fLINE(min) fLINEfLINE(max)  
OUT IOUT(max)  
,
VOUT  
Output voltage  
Line Regulation  
,
379  
390  
402  
5%  
5%  
VDC  
I
V
IN(min) VINVIN(max),  
IOUT = IOUT(max)  
VIN = 115 VAC,  
fLINE = 60 Hz,  
I
OUT(min) IOUT IOUT(max)  
Load Regulation  
VIN = 230 VAC,  
fLINE = 60 Hz,  
5%  
I
OUT(min)IOUT IOUT(max)  
IN(min) VIN VIN(max)  
fLINE(min) fLINE fLINE(max)  
IN(min) VIN VIN(max)  
LINE(min) fLINE fLINE(max)  
V
IOUT  
Output Load Current  
Output Power  
0
0
0.923  
360  
A
V
f
POUT  
W
VIN = 115 VAC,  
fLINE = 60 Hz  
IOUT = IOUT(max)  
2.5  
2.5  
3.9  
3.9  
VRIPPLE(SW High frequency  
VP-P  
Output voltage ripple  
)
VIN = 230 VAC,  
fLINE = 50 Hz  
IOUT = IOUT(max)  
VIN = 115 VAC,  
fLINE = 60 Hz,  
IOUT = IOUT(max)  
11.6  
13.3  
19.5  
19.5  
VRIPPLE(f_LI Line frequency  
VP-P  
Output voltage ripple  
NE)  
VIN = 230 VAC,  
fLINE = 50 Hz,  
IOUT = IOUT(max)  
Output over voltage  
protection  
VOUT(OVP)  
VOUT(UVP)  
425  
370  
V
Output under voltage  
protection  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
21  
Product Folder Links :UCC28180  
 
 
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
UNIT  
Table 1. Design Goal Parameters (continued)  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX  
Control Loop Characteristics  
fSW  
Switching frequency  
TJ = 25°C  
114  
120  
126  
kHz  
Hz  
VIN = 162 VDC,  
IOUT = 0.466 A  
f(CO)  
Voltage Loop Bandwidth  
8
68  
VIN = 162 VDC,  
IOUT = 0.466 A  
Voltage Loop Phase Margin  
Power Factor  
°
VIN = 115 VAC,  
IOUT = IOUT(max)  
PF  
0.99  
VIN = 115 VAC,  
fLINE = 60 Hz,  
IOUT = IOUT(max)  
4.3%  
4%  
10%  
10%  
THD  
Total harmonic distortion  
VIN = 230 VAC,  
fLINE = 50 Hz  
IOUT = IOUT(max)  
VIN = 115 VAC,  
fLINE = 60 Hz,  
IOUT = IOUT(max)  
η
Full load efficiency  
94%  
25  
Ambient temperature  
°C  
22  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
The following procedure refers to the schematic shown in Figure 30.  
+
-
Figure 30. Design Example Schematic  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
23  
Product Folder Links :UCC28180  
 
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
Current Calculations  
The input fuse, bridge rectifier, and input capacitor are selected based upon the input current calculations. First,  
determine the maximum average output current, IOUT(max)  
POUT(max)  
IOUT(max) =  
:
VOUT  
(4)  
(5)  
360W  
390 V  
IOUT(max)  
=
@ 0.923 A  
The maximum input RMS line current, IIN_RMS(max), is calculated using the parameters from Table 1 and the  
efficiency and power factor initial assumptions:  
POUT(max)  
I IN_ RMS(max)  
=
hVIN(min)PF  
(6)  
(7)  
360W  
I IN_ RMS(max)  
=
= 4.551A  
0.94 ´85 V ´0.99  
Based upon the calculated RMS value, the maximum input current, IIN (max), and the maximum average input  
current, IIN_AVG(max), assuming the waveform is sinusoidal, can be determined.  
I
=
2I  
IN_ RMS(max)  
IN(max)  
(8)  
(9)  
I
=
2 ´ 4.551A = 6.436 A  
IN(max)  
2I  
IN(max)  
I
=
IN_ AVG(max)  
p
(10)  
(11)  
2´ 6.436 A  
I
=
= 4.097 A  
IN_ AVG(max)  
p
24  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
The Switching Frequency  
The UCC28180 switching frequency is user programmable with a single resistor on the FREQ pin to ground. For  
this design, the switching frequency, fSW, was chosen to be 120 kHz. Figure 31 (same as Figure 1) could be  
used to select the suitable resistor to program the switching frequency or the value can be calculated using  
constant scaling values of fTYP and RTYP. In all cases, fTYP is a constant that is equal to 65 kHz, RINT is a constant  
that is equal to 1 MΩ, and RTYP is a constant that is equal to 32.7 k. Simply applying the calculation below  
yields the appropriate resistor that should be placed between FREQ and GND:  
f
TYP ´RTYP ´RINT  
RFREQ  
=
(fSW ´RINT ) + (RTYP ´ fSW ) - (RTYP ´ fTYP  
65kHz ´32.7kW ´1MW  
)
(12)  
(13)  
RFREQ  
=
= 17.451kW  
(120kHz ´1MW) + (32.7kW ´120kHz) - (32.7kW ´ 65kHz)  
A typical value of 17.8 kfor the FREQ resistor results in a switching frequency of 118 kHz.  
265  
215  
165  
115  
65  
15  
0
20  
40  
60  
80  
100  
120  
140  
RFREQ (KŸ)  
C001  
Figure 31. Frequency vs. RFREQ  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
25  
Product Folder Links :UCC28180  
 
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
Bridge Rectifier  
The input bridge rectifier must have an average current capability that exceeds the input average current.  
Assuming a forward voltage drop, VF_BRIDGE, of 1 V across the rectifier diodes, BR1, the power loss in the input  
bridge, PBRIDGE, can be calculated:  
P
= 2VF _ BRIDGEIIN_ AVG(max)  
BRIDGE  
(14)  
(15)  
P
= 2´1V ´ 4.097 A = 8.195W  
BRIDGE  
Heat sinking will be required to maintain operation within the bridge rectifier’s safe operating area.  
Inductor Ripple Current  
The UCC28180 is a Continuous Conduction Mode (CCM) controller but if the chosen inductor allows relatively  
high-ripple current, the converter will be forced to operate in Discontinuous Mode (DCM) at light loads and at the  
higher input voltage range. High-inductor ripple current has an impact on the CCM/DCM boundary and results in  
higher light-load THD, and also affects the choices for the input capacitor, RSENSE and CICOMP values. Allowing an  
inductor ripple current, ΔIRIPPLE, of 20% or less will result in CCM operation over the majority of the operating  
range but requires a boost inductor that has a higher inductance value and the inductor itself will be physically  
large. As with all converter designs, decisions must be made at the onset in order to optimize performance with  
size and cost. In this design example, the inductor is sized in such a way as to allow a greater amount of ripple  
current in order to minimize space with the understanding that the converter operates in DCM at the higher input  
voltages and at light loads but optimized for a nominal input voltage of 115 VAC at full load. Although specifically  
defined as a CCM controller, the UCC28180 is shown in this application to meet the overall performance goals  
while transitioning into DCM at high-line voltage, at a higher load level.  
Input Capacitor  
The input capacitor must be selected based upon the input ripple current and an acceptable high frequency input  
voltage ripple. Allowing an inductor ripple current, ΔIRIPPLE, of 40% and a high frequency voltage ripple factor,  
ΔVRIPPLE_IN, of 7%, the maximum input capacitor value, CIN, is calculated by first determining the input ripple  
current, IRIPPLE, and the input voltage ripple, VIN_RIPPLE  
:
I
RIPPLE= DIRIPPLEIIN(max)  
(16)  
(17)  
(18)  
(19)  
(20)  
DIRIPPLE = 0.4  
RIPPLE= 0.4 ´ 6.436 A = 2.575 A  
= DVRIPPLE _IN  
I
V
V
IN_ RECTIFIED(min)  
IN_ RIPPLE  
DVRIPPLE _IN = 0.07  
V
=
2V  
IN  
IN_ RECTIFIED  
(21)  
V
=
2 ´85 V = 120 V  
IN_ RECTIFIED  
(22)  
(23)  
V
= 0.07 ´120 V = 8.415 V  
IN_ RIPPLE  
The recommended value for the input x-capacitor can now be calculated:  
I
RIPPLE  
CIN  
=
8fSW  
V
IN_ RIPPLE  
(24)  
(25)  
2.575 A  
8
´
118kHz
´
8.415 V  
CIN  
=
= 0.324mF  
A standard value 0.33-µF Y2/X2 film capacitor is used.  
26  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
Boost Inductor  
Based upon the allowable inductor ripple current discussed above, the boost inductor, LBST, is selected after  
determining the maximum inductor peak current, IL_PEAK  
:
IRIPPLE  
+
IL _ PEAK(max) = I  
IN(max)  
2
(26)  
(27)  
2.575 A  
2
IL _ PEAK(max) = 6.436 A +  
= 7.724 A  
The minimum value of the boost inductor is calculated based upon the acceptable ripple current, IRIPPLE, at a  
worst case duty cycle of 0.5:  
VOUTD(1- D)  
LBST(min)  
³
fSWIRIPPLE  
(28)  
(29)  
390 V ´0.5(1- 0.5)  
118kHz
´
2.575 A  
LBST(min)  
³
³ 321mH  
The recommended minimum value for the boost inductor assuming a 40% ripple current is 321 µH; the actual  
value of the boost inductor that will be used is 327 µH. With this actual value used, the actual resultant inductor  
current ripple will be:  
LBST = 327mH  
(30)  
VOUTD(1- D)  
IRIPPLE(actual)  
=
fSWLBST  
(31)  
390 V ´0.5(1- 0.5)  
118kHz ´327mH  
IRIPPLE(actual)  
=
= 2.527 A  
(32)  
(33)  
2.527 A  
IL _ PEAK(max) = 6.436 A +  
= 7.7 A  
2
The duty cycle is a function of the rectified input voltage and will be continuously changing over the half line  
cycle. The duty cycle, DUTY(max), can be calculated at the peak of the minimum input voltage:  
VOUT - V  
=
IN_ RECTIFIED(min)  
DUTY  
(max)  
VOUT  
(34)  
(35)  
V
=
2 ´85 V = 120 V  
IN_ RECTIFIED(min)  
390 V -120 V  
DUTY  
=
= 0.692  
(max)  
390 V  
(36)  
Boost Diode  
The diode losses are estimated based upon the forward voltage drop, VF, at 125°C and the reverse recovery  
charge, QRR, of the diode. Using a silicon carbide Schottky diode, although more expensive, will essentially  
eliminate the reverse recovery losses and result in less power dissipation:  
PDIODE = VF _125CIOUT(max) + 0.5fSW VOUTQRR  
(37)  
(38)  
(39)  
VF _125°C = 1V  
QRR = 0nC  
PDIODE = 1V ´0.923 A + 0.5 ´119kHz ´390 V ´0nC = 0.923W  
)
(
) (  
(40)  
This output diode should have a blocking voltage that exceeds the output over voltage of the converter and be  
attached to an appropriately sized heat sink.  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
27  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
Switching Element  
The MOSFET/IGBT switch will be driven by a GATE output that is clamped at 15.2 V for VCC bias voltages  
greater than 15.2 V. An external gate drive resistor is recommended to limit the rise time and to dampen any  
ringing caused by the parasitic inductances and capacitances of the gate drive circuit; this will also help in  
meeting any EMI requirements of the converter. The design example uses a 3.3-Ω resistor; the final value of any  
design is dependent upon the parasitic elements associated with the layout of the design. To facilitate a fast turn  
off, a standard 40-V, 1-A Schottky diode is placed anti-parallel with the gate drive resistor. A 10-kΩ resistor is  
placed between the gate of the MOSFET/IGBT and ground to discharge the gate capacitance and protect from  
inadvertent dv/dt triggered turn-on.  
The conduction losses of the switch MOSFET, in this design are estimated using the RDS(on) at 125°C, found in  
the device data sheet, and the calculated drain to source RMS current, IDS_RMS  
:
PCOND = ID2S _ RMSRDS(on)125°C  
(41)  
(42)  
RDS(on)125°C = 0.35W  
POUT(max)  
16V  
IN_ RECTIFIED(min)  
IDS _ RMS  
=
2 -  
V
3pVOUT  
IN_ RECTIFIED(min)  
(43)  
360W  
120 V  
16 ´120 V  
3p ´390 V  
IDS _ RMS  
=
2 -  
= 3.639 A  
(44)  
(45)  
PCOND = 3.639 A2 ´0.35W = 4.636W  
The switching losses are estimated using the rise time, tr, and fall time, tf, of the MOSFET gate, and the output  
capacitance losses.  
tr = 5ns  
tf = 4.5ns  
COSS = 780pF  
(46)  
(tr + tf ) + 0.5COSSV2  
OUT û  
é
ù
PSW = fSW 0.5VOUT IN(max)  
I
ë
(47)  
(48)  
é
ë
2 ù  
û
PSW = 118kHz 0.5 ´390 V ´ 6.436A(5ns + 4.5ns) + 0.5´ 780pF´390 V = 8.407W  
Total FET losses  
PCOND + PSW = 4.636W + 8.407W = 13.042W  
(49)  
The MOSFET requires an appropriately sized heat sink.  
28  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
Sense Resistor  
To accommodate the gain of the non-linear power limit, the sense resistor, RSENSE, is sized such that it triggers  
the soft over current at 10% higher than the maximum peak inductor current using the minimum soft over current  
threshold of the ISENSE pin, VSOC, of ISENSE equal to 0.265 V.  
VSOC(min)  
RSENSE  
=
I
L _ PEAK(max) ´1.1  
(50)  
(51)  
0.259 V  
RSENSE  
=
= 0.032W  
7.7 A ´1.1  
The power dissipated across the sense resistor, PRSENSE, must be calculated:  
PRSENSE = II2N_ RMS(max)RSENSE  
(52)  
(53)  
PRSENSE = 4.551A2 ´0.032W = 0.663W  
The peak current limit, PCL, protection feature is triggered when current through the sense resistor results in the  
voltage across RSENSE to be equal to the VPCL threshold. For a worst case analysis, the maximum VPCL threshold  
is used:  
VPCL(max)  
IPCL  
=
RSENSE  
(54)  
(55)  
0.438 V  
IPCL  
=
= 13.688 A  
0.032W  
To protect the device from inrush current, a standard 220-Ω resistor, RISENSE, is placed in series with the ISENSE  
pin. A 1000-pF capacitor is placed close to the device to improve noise immunity on the ISENSE pin.  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
29  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
Output Capacitor  
The output capacitor, COUT, is sized to meet holdup requirements of the converter. Assuming the downstream  
converters require the output of the PFC stage to never fall below 300 V, VOUT_HOLDUP(min), during one line cycle,  
tHOLDUP = 1/fLINE(min), the minimum calculated value for the capacitor is:  
2POUT(max)tHOLDUP  
VO2UT - VO2UT _ HOLDUP(min)  
COUT(min)  
³
(56)  
(57)  
2´360W ´ 21.28ms  
390 V2
-
300 V2  
COUT(min)  
³
³ 247mF  
It is advisable to de-rate this capacitor value by 10%; the actual capacitor used is 270 µF.  
Verifying that the maximum peak-to-peak output ripple voltage will be less than 5% of the output voltage ensures  
that the ripple voltage will not trigger the output over-voltage or output under-voltage protection features of the  
controller. If the output ripple voltage is greater than 5% of the regulated output voltage, a larger output capacitor  
is required. The maximum peak-to-peak ripple voltage, occurring at twice the line frequency, and the ripple  
current of the output capacitor is calculated:  
VOUT _ RIPPLE(pp) < 0.05 VOUT  
(58)  
VOUT _ RIPPLE(pp) < 0.05 ´390 V = 19.5 VPP  
(59)  
IOUT  
VOUT _ RIPPLE(pp)  
=
2p(2fLINE(min))COUT  
(60)  
(61)  
0.923A  
VOUT _ RIPPLE(pp)  
=
= 5.789 V  
2p(2´ 47Hz)´ 270mF  
The required ripple current rating at twice the line frequency is equal to:  
IOUT(max)  
ICOUT _ 2fline  
=
2
0.923 A  
2
(62)  
(63)  
ICOUT _ 2fline  
=
= 0.653 A  
There is a high frequency ripple current through the output capacitor:  
16 VOUT  
ICOUT _ HF = IOUT(max)  
-1.5  
3pV  
IN_ RECTIFIED(min)  
(64)  
(65)  
16 ´390 V  
3p ´120 V  
ICOUT _ HF = 0.923 A  
-1.5 = 1.848 A  
The total ripple current in the output capacitor is the combination of both and the output capacitor must be  
selected accordingly:  
I
COUT _ RMS(total)= IC2OUT _ 2fline + IC2OUT _ HF  
(66)  
(67)  
I COUT _ RMS(total)  
=
0.653 A2 +1.848 A2 = 1.96 A  
30  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
Output Voltage Set Point  
For low power dissipation and minimal contribution to the voltage set point, it is recommended to use 1 MΩ for  
the top voltage feedback divider resistor, RFB1. Multiple resistors in series are used due to the maximum  
allowable voltage across each. Using the internal 5-V reference, VREF, the bottom divider resistor, RFB2, is  
selected to meet the output voltage design goals.  
VREFRFB1  
RFB2  
=
VOUT - VREF  
(68)  
(69)  
5 V ´1MW  
RFB2  
=
= 13.04kW  
390 V - 5 V  
A standard value 13-kΩ resistor for RFB2 results in a nominal output voltage set point of 391 V.  
An output over voltage is detected when the output voltage exceeds its nominal set-point level by 5%, as  
measured when the voltage at VSENSE is 105% of the reference voltage, VREF. At this threshold, the enhanced  
dynamic response (EDR) is triggered and the non-linear gain to the voltage error amplifier will increase the  
transconductance to VCOMP and quickly return the output to its normal regulated value. This EDR threshold  
occurs when the output voltage reaches the VOUT(ovd) level:  
VOVD = 1.05 VREF = 1.05 ´5 V = 5.25 V  
(70)  
æ
OVD ç  
è
ö
÷
ø
RFB1 + RFB2  
VOUT(ovd) = V  
RFB2  
(71)  
(72)  
æ
ç
è
ö
÷
ø
1MW +13kW  
13kW  
VOUT(ovd) = 5.25 V ´  
= 410.7 V  
In the event of an extreme output over voltage event, the GATE output will be disabled if the output voltage  
exceeds its nominal set-point value by 9%. The output voltage, VOUT(ovp), at which this protection feature is  
triggered is calculated as follows:  
æ
REF ç  
è
ö
÷
ø
RFB1 + RFB2  
VOUT(ovp) = 1.09 ´ V  
= 426.4 V  
RFB2  
(73)  
An output under voltage is detected when the output voltage falls below 5% below its nominal set-point as  
measured when the voltage at VSENSE is 95% of the reference voltage, VREF  
:
VUVD = 0.95 VREF = 0.95 ´5 V = 4.75 V  
(74)  
æ
UVD ç  
è
ö
÷
ø
RFB1 + RFB2  
VOUT(uvp) = V  
RFB2  
(75)  
(76)  
æ
ç
è
ö
÷
ø
1MW +13kW  
13kW  
VOUT(uvp) = 4.75 V ´  
= 371.6 V  
A small capacitor on VSENSE must be added to filter out noise. Limit the value of the filter capacitor such that  
the RC time constant is limited to approximately 10 µs so as not to significantly reduce the control response time  
to output voltage deviations.  
10ms  
CVSENSE  
=
= 769pF  
RFB2  
(77)  
The closest standard value of 820 pF was used on VSENSE for a time constant of 10.66 µs.  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
31  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
Loop Compensation  
The current loop is compensated first by determining the product of the internal loop variables, M1M2, using the  
internal controller constants K1 and KFQ. Compensation is optimized maximum load and nominal input voltage,  
115 VAC is used for the nominal line voltage for this design:  
IOUT(max)VO2UT 2.5RSENSEK1  
M1M2 =  
hVI2N_ RMSKFQ  
(78)  
1
KFQ  
=
=
fSW  
1
KFQ  
= 8.475ms  
118kHz  
K1 = 7  
(79)  
(80)  
0.923 A ´390 V2 ´ 2.5 ´0.032W ´ 7  
0.92´115 V2 ´8.475ms  
V
M1M2 =  
= 0.751  
ms  
The VCOMP operating point is found on the following chart, M1M2 vs. VCOMP. Once the M1M2 result is  
calculated above, find the resultant VCOMP voltage at that operating point to calculate the individual M1 and M2  
components.  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0  
VCOMP (V)  
C007  
Figure 32. M1M2 vs. VCOMP  
For the given M1M2 of 0.751 V/µs, the VCOMP approximately equal to 3 V, as shown in Figure 32.  
32  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
 
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
The individual loop factors, M1 which is the current loop gain factor, and M2 which is the voltage loop PWM ramp  
slope, are calculated using the following conditions:  
The M1 non-linear current loop gain factor follows the following identities:  
M1 = 0.068  
if VCOMP < 1 V  
(81)  
(82)  
(83)  
(84)  
M1 = 0.156 ´ VCOMP - 0.088  
if 1 V < VCOMP < 2 V  
if 2 V < VCOMP < 4.5 V  
M1 = 0.313 ´ VCOMP - 0.401  
M1 = 1.007  
if 4.5 V < VCOMP < 5 V  
In this example, according to the chart in Figure 32, VCOMP is approximately equal to 3 V, so M1 is calculated  
to be approximately equal to 0.538:  
M1 = 0.313 ´ 2.45 - 0.401= 0.366  
(85)  
The M2 non-linear PWM ramp slope will obey the following relationships:  
V
M2 = 0  
ms  
if VCOMP 0.5 V  
(86)  
(87)  
(88)  
fSW  
V
M2 =  
M2 =  
´0.1223 ´(VCOMP - 0.5)2  
65kHz  
fSW  
ms  
if 0.5 V VCOMP 4.6 V  
V
´ 2.056  
65kHz  
ms  
if 4.6 V VCOMP 5 V  
In this example, with VCOMP approximately equal to 3 V, M2 equals 1.388 V/µs:  
118kHz  
V
V
M2 =  
´0.1223 ´(3 - 0.5)2  
= 1.388  
65kHz  
ms  
ms  
(89)  
Verify that the product of the individual gain factors, M1 and M2, is approximately equal to the M1M2 factor  
determined above, if not, iterate the VCOMP value and recalculate M1M2  
V
V
M1 ´M2 = 0.538 ´1.388  
= 0.747  
ms  
ms  
(90)  
The product of M1 and M2 is within 1% of the M1M2 factor previously calculated:  
M1 ´M2 @ M1M2  
(91)  
(92)  
V
V
0.747  
@ 0.751  
ms  
ms  
If more accuracy was desired, iteration results in a VCOMP value of 3.004 V where M1M2 and M1 x M2 are both  
equal to 0.751 V/µs.  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
33  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
The non-linear gain variable, M3, can now be calculated:  
M3 = 0  
if VCOMP < 5 V  
(93)  
(94)  
(95)  
(96)  
fSW  
65kHz ms  
fSW  
65kHz ms  
fSW  
65kHz ms  
fSW  
65kHz ms  
M3 = 0  
V
M3 =  
M3 =  
M3 =  
M3 =  
´
´(0.0166´ VCOMP - 0.0083)  
if 0.5 V < VCOMP < 1 V  
V
´
´(0.0572´ VCOMP2 - 0.0597´ VCOMP + 0.0155)  
´(0.1148´ VCOMP2 - 0.1746´ VCOMP + 0.0586)  
´(0.1148´ VCOMP2 - 0.1746´ VCOMP + 0.0586)  
if 1 V < VCOMP < 2 V  
if 2 V < VCOMP < 4.5 V  
if 4.5 V < VCOMP < 4.6 V  
V
´
V
´
(97)  
(98)  
if 4.6 V < VCOMP < 5 V  
In this example, using 3.004 V for VCOMP for a more precise calculation, M3 calculates to 1.035 V/µs:  
118kHz  
V
V
M3 =  
´
65kHz ms  
´(0.1148´3.0042 - 0.1746´ 3.004 + 0.0586) = 1.035  
ms  
(99)  
For designs that allow a high inductor ripple current, the current averaging pole, which functions to flatten out the  
ripple current on the input of the PWM comparator, should be at least decade before the converter switching  
frequency. Analysis on the completed converter may be needed to determine the ideal compensation pole for the  
current averaging circuit as too large of a capacitor on ICOMP will add phase lag and increase iTHD where as too  
small of an ICOMP capacitor will result in not enough averaging and an unstable current averaging loop. The  
frequency of the current averaging pole, fIAVG, is chosen to be at approximately 5 kHz for this design as the  
current ripple factor, IRIPPLE, was chosen at the onset of the design process to be 40%, which is large enough to  
force DCM operation and result in relatively high inductor ripple current. The required capacitor on ICOMP,  
CICOMP, for this is determined using the transconductance gain, gmi, of the internal current amplifier:  
g
mi ´M1  
CICOMP  
=
K12pf  
IAVG  
(100)  
(101)  
0.95mS´0.538  
7 ´ 2´ p ´3kHz  
CICOMP  
=
= 2330pF  
34  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
A standard value 2700-pF capacitor for CICOMP results in a current averaging pole frequency of 4.314 kHz.  
mi ´M1  
K1 ´ 2´ p ´ 2700pF  
g
f
=
= 4.314kHz  
IAVG  
(102)  
The transfer function of the current loop can be plotted:  
K12.5RSENSEVOUT  
1
GCL(f) =  
´
s(f)2K1CICOMP  
KFQM1M2LBST  
s(f) +  
gmi ´M1  
(103)  
(104)  
GCLdB(f) = 20log G (f)  
(
CL  
)
100  
80  
±80  
Gain  
±90  
Phase  
60  
±100  
±110  
±120  
±130  
±140  
±150  
±160  
±170  
±180  
40  
20  
0
±20  
±40  
±60  
±80  
±100  
10  
100  
1k  
10k  
100k  
1M  
Frequency (Hz)  
C005  
Figure 33. Bode Plot of the Current Averaging Circuit  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
35  
Product Folder Links :UCC28180  
 
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
The voltage transfer function, GVL(f) contains the product of the voltage feedback gain, GFB, and the gain from the  
pulse width modulator to the power stage, GPWM_PS, which includes the pulse width modulator to power stage  
pole, fPWM_PS. The plotted result is shown in Figure 33.  
RFB2  
GFB  
=
R
FB1 + RFB2  
13kW  
GFB  
=
= 0.013  
1MW +13kW  
(105)  
1
fPWM _ PS  
=
=
K12.5RSENSEVO3UTCOUT  
2p  
KFQM1M2V2  
IN(nom)  
1
fPWM _ PS  
= 1.479Hz  
7 ´ 2.5 ´0.032W ´390V3 ´ 270mF  
2p  
V
8.475ms ´0.539´1.392 ´115 V2  
ms  
(106)  
M3VOUT  
M1M2 ´1V  
GPWM _ PS(f) =  
s(f)  
1+  
2pfPWM_ PS  
(107)  
(108)  
GVL(f) = GFBGPWM _ PS(f)  
GVLdB(f) = 20log G (f)  
(
VL  
)
100  
80  
0
PWM to Power Stage Gain  
Total Open Loop Gain  
Total Open Loop Phase  
±10  
±20  
±30  
±40  
±50  
±60  
±70  
±80  
±90  
±100  
60  
40  
20  
0
±20  
±40  
±60  
±80  
±100  
0.01  
0.1  
1
10  
100  
1000  
Frequency (Hz)  
C008  
Figure 34. Bode Plot of the Open Voltage Loop without Error Amplifier  
36  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
 
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
The voltage error amplifier is compensated with a zero, fZERO, at the fPWM_PS pole and a pole, fPOLE, placed at 20  
Hz to reject high frequency noise and roll off the gain amplitude. The overall voltage loop crossover, fV, is desired  
to be at 10 Hz. The compensation components of the voltage error amplifier are selected accordingly.  
1
fZERO  
=
2pRVCOMPCVCOMP  
(109)  
(110)  
1
fPOLE  
=
RVCOMPCVCOMPCVCOMP _ P  
2p  
C
VCOMP + CVCOMP _ P  
é
ù
ú
ú
ú
ú
ú
ê
ê
ê
ê
ê
1+ s(f)RVCOMPCVCOMP  
GEA(f) = gmv  
é
ù
ú
ú
û
æ
ç
ç
è
ö
÷
÷
ø
RVCOMPCVCOMPCVCOMP _ P  
C
(
VCOMP + CVCOMP _ P s(f)ê1+ s(f)  
)
CVCOMP + CVCOMP _ P  
ê
ë
ê
ë
ú
û
(111)  
From Figure 34, the gain of the voltage transfer function at 10 Hz is approximately 0.081 dB. Estimating that the  
parallel capacitor, CVCOMP_P, is much smaller than the series capacitor, CVCOMP, the unity gain will be at fV, and  
the zero will be at fPWM_PS, the series compensation capacitor is determined:  
fV = 10Hz  
(112)  
fV  
gmv  
fPWM_ PS  
(f)  
CVCOMP  
=
0-G  
VLdB  
20  
10  
´ 2pfV  
(113)  
(114)  
10Hz  
56ms ´  
1.479Hz  
CVCOMP  
=
= 6.08mF  
0-0.081dB  
20  
10  
´
2
´ p ´
10Hz  
The capacitor for VCOMP must have a voltage rating that is greater than the absolute maximum voltage rating of  
the VCOMP pin, which is 7 V. The readily available standard value capacitor that is rated for at least 10 V in the  
package size that would fit the application was 4.7 µF and this is the value used for CVCOMP in this design  
example.  
RVCOMP is calculated using the actual CVCOMP capacitor value.  
CVCOMP = 4.7mF  
(115)  
1
RVCOMP  
=
2pfZEROCVCOMP  
(116)  
(117)  
1
RVCOMP  
=
= 22.89kW  
2´ p ´1.479Hz ´ 4.7mF  
A 22.6-kΩ resistor is used for RVCOMP  
.
CVCOMP  
CVCOMP _ P  
=
2pfPOLERVCOMPCVCOMP -1  
(118)  
(119)  
4.7mF  
CVCOMP _ P  
=
= 0.381mF  
2´ p ´ 20Hz ´ 22.6kkW ´ 4.7mF -1  
A 0.47-µF capacitor is used for CVCOMP_P  
.
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
37  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
The total closed loop transfer function, GVL_total, contains the combined stages and is plotted in Figure 35.  
GVL _ total(f) = GFB(f)GPWM _ PS(f)GEA(f)  
(120)  
(121)  
GVL _ totaldB(f) = 20log G  
(
(f)  
)
VL _ total  
100  
100  
80  
60  
40  
20  
0
50  
0
±50  
±100  
±150  
EA Gain  
Total Closed Loop Gain  
Total Closed Loop Phase Margin  
0.01  
0.1  
1
10  
100  
1000  
Frequency (Hz)  
C001  
Figure 35. Closed Loop Voltage Bode Plot  
38  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
 
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
Layout Guidelines  
Layout Guidelines  
As with all PWM controllers, the effectiveness of the filter capacitors on the signal pins depends upon the  
integrity of the ground return. Separating the high di/dt induced noise on the power ground from the low current  
quiet signal ground is required for adequate noise immunity. Even with a signal layer PCB design, the pin out of  
the UCC28180 is ideally suited to minimize noise on the small signal traces. As shown in Figure 36, the  
capacitors on VSENSE, VCOMP, ISENSE, ICOMP, and FREQ (if used) must be all be returned directly to the  
portion of the ground plane that is the quiet signal GND and not in high-current return path of the converter,  
shown as power GND. The trace from the FREQ pin to the frequency programming resistor should be as short  
as possible. It is recommended that the compensation components on ICOMP and VCOMP are located as close  
as possible to the UCC28180. Placement of these components should take precedence, paying close attention  
to keeping their traces away from high noise areas. The bypass capacitors on VCC must be located physically  
close the VCC and GND pins of the UCC28180 but should not be in the immediate path of the signal return.  
Other layout considerations should include keeping the switch node as short as possible, with a wide trace to  
reduce induced ringing caused by parasitic inductance. Every effort should be made to avoid noise from the  
switch node from corrupting the small signal traces with adequate clearance and ground shielding. As some  
compromises must be made due to limitation of PCB layers or space constraints, traces that must be made long,  
such as the signal from the current sense resistor shown in Figure 36, should be as wide as possible, avoid long  
narrow traces.  
Table 2. Layout Component Description for Figure 36  
LAYOUT COMPONENTS  
REFERENCE DESIGNATOR  
FUNCTION  
Controller, UCC28180  
U1  
Q1  
Main switch  
D2  
Boost diode  
R5  
RGATE  
R7  
Pull-down resistor on GATE  
Turn-off diode on GATE  
D1  
C11, C12  
C7  
VCC bypass capacitors  
ICOMP compensation, CICOMP  
Placeholders for additional ICOMP compensation, if needed  
ISENSE filter, CISENSE  
R1, C6  
C8  
R2  
ISENSE inrush current limiting resistor, RISENSE  
Frequency programming resistor, RFREQ  
Placeholder for FREQ filter, if needed  
VCOMP compensation components, RVCOMP, CVCOMP_P, CVCOMP  
VSENSE filter, CVSENSE  
R3  
C9  
R6, C13, C14  
C15  
R11, R12  
R13  
RFB1 on VSENSE  
RFB2 on VSENSE  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
39  
Product Folder Links :UCC28180  
UCC28180  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
www.ti.com  
Figure 36. Recommended Layout for UCC28180  
Additional References  
References  
These references, additional design tools, and links to additional references, including design software and  
models may be found on the web at http://www.power.ti.com under Technical Documents.  
User Guide, Using the UCC28180EVM-573, 360-W Power Factor Correction, Texas Instruments Literature No.  
SLUUAT3  
Design Spreadsheet, UCC28180 Design Calculator, Texas Instruments Literature No. SLUC506  
40  
Submit Documentation Feedback  
Copyright © 2013, Texas Instruments Incorporated  
Product Folder Links :UCC28180  
UCC28180  
www.ti.com  
SLUSBQ5A NOVEMBER 2013REVISED NOVEMBER 2013  
REVISION HISTORY  
Changes from Original (November 2013) to Revision A  
Page  
Added Features bullet, "Reduced Current Sense Threshold" . ............................................................................................ 1  
Changed marketing status from Product Preview to Production Data. ................................................................................ 1  
Added Figure 8 through Figure 13. ....................................................................................................................................... 8  
Changed Figure 31 through Figure 35. .............................................................................................................................. 21  
Copyright © 2013, Texas Instruments Incorporated  
Submit Documentation Feedback  
41  
Product Folder Links :UCC28180  
PACKAGE OPTION ADDENDUM  
www.ti.com  
13-Nov-2013  
PACKAGING INFORMATION  
Orderable Device  
UCC28180D  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
SOIC  
SOIC  
D
8
8
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
U28180  
U28180  
UCC28180DR  
ACTIVE  
D
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
13-Nov-2013  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Nov-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
UCC28180DR  
SOIC  
D
8
2500  
330.0  
12.4  
6.4  
5.2  
2.1  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Nov-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOIC  
SPQ  
Length (mm) Width (mm) Height (mm)  
340.5 338.1 20.6  
UCC28180DR  
D
8
2500  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered  
documentation. Information of third parties may be subject to additional restrictions.  
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements  
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support  
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which  
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause  
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use  
of any TI components in safety-critical applications.  
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to  
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and  
requirements. Nonetheless, such components are subject to these terms.  
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties  
have executed a special agreement specifically governing such use.  
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in  
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components  
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and  
regulatory requirements in connection with such use.  
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of  
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.  
Products  
Applications  
Audio  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
Medical  
Logic  
Security  
www.ti.com/security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense  
Video and Imaging  
www.ti.com/space-avionics-defense  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/omap  
OMAP Applications Processors  
Wireless Connectivity  
TI E2E Community  
e2e.ti.com  
www.ti.com/wirelessconnectivity  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2013, Texas Instruments Incorporated  

相关型号:

UCC2818A

BiCMOS POWER FACTOR PREREGULATOR
TI

UCC2818A-Q1

BiCMOS POWER-FACTOR PREREGULATOR
TI

UCC2818AD

BiCMOS POWER FACTOR PREREGULATOR
TI

UCC2818ADG4

BiCMOS POWER FACTOR PREREGULATOR
TI

UCC2818ADR

BiCMOS POWER FACTOR PREREGULATOR
TI

UCC2818ADR/

BiCMOS POWER FACTOR PREREGULATOR
TI

UCC2818ADR/1

1.2A POWER FACTOR CONTROLLER, 120kHz SWITCHING FREQ-MAX, PDSO16, GREEN, PLASTIC, MS-012AC, SOIC-16
TI

UCC2818ADRG4

BiCMOS POWER FACTOR PREREGULATOR
TI

UCC2818AN

BiCMOS POWER FACTOR PREREGULATOR
TI

UCC2818ANG4

BiCMOS POWER FACTOR PREREGULATOR
TI

UCC2818APW

BiCMOS POWER FACTOR PREREGULATOR
TI

UCC2818APWG4

BiCMOS POWER FACTOR PREREGULATOR
TI