UCC28704 [TI]

具有初级侧调节 (PSR) 功能的高效离线 CV 和 CC 反激控制器;
UCC28704
型号: UCC28704
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有初级侧调节 (PSR) 功能的高效离线 CV 和 CC 反激控制器

反激控制 控制器
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中文:  中文翻译
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UCC28704  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
UCC28704 具有一次侧稳压 (PSR) 功能的高效离线 CV CC 反激控制器  
1 特性  
3 说明  
1
效率超过 DoE VI 级和 EU CoC V5 Tier-2 外部电  
源标准  
UCC28704 离线反激控制器是一款高度集成的 6 引脚  
一次侧稳压脉宽调制 (PWM) 控制器,旨在设计符合全  
球效率标准的高效 AC DC 电源。此控制器启动时  
的电流消耗超低,可使设计获得低于 30mW 的无负载  
输入功率,并且节省待机模式能耗。凭借智能一次侧感  
应和控制功能,无需使用光电耦合器或二次侧反馈电路  
即可将输出电压和电流控制在 5% 的变化范围内。  
一次侧稳压功能免除了对光电耦合器和二次侧反馈  
组件的需求  
与同步整流器兼容  
无负载输入功率 <30mW  
±5% 输出电压 (CV) 和电流 (CC) 调节  
增强型动态负载响应  
UCC28704 应用了增强型负载瞬态响应技术,有助于  
最大限度减小输出电容,从而减小系统整体尺寸并降低  
成本。此外,该控制器还免除了对环路补偿组件的需  
求,为电源设计人员简化了设计及调试过程。转换器的  
输出电压和电流会得到稳定性处理,以防出现可能损坏  
负载或连接器的过载状况。同样,恒流输出欠压保护  
(CCUV) 关断特性会监控输出欠压故障以防止由于软短  
路问题而造成连接器过热或烧毁,从而大幅度提升系统  
整体可靠性。NTC 接口引脚有助于为电路板或组件施  
加过热保护。  
具有自动重启响应的恒流输出欠压保护 (CCUV)  
电缆补偿(5V 满载时为 300mV)  
85kHz 最大开关频率  
断续导通模式 (DCM) 谷值开关运行  
针对金属氧化物半导体场效应晶体管 (MOSFET) 的  
已钳位栅极驱动输出  
负温度系数 (NTC) 电阻接口  
电阻或外部高压 (HV) 耗尽型场效应晶体管 (FET)  
启动  
故障保护:输入欠压、输出过压、过流和短路保护  
小外形尺寸晶体管 (SOT) 23-6 封装  
UCC28704 2A 或更高输出电流下可轻松与 TI 的二  
次侧同步整流器 (SR) 控制器搭配使用,从而提高转换  
效率或实现更为紧凑的设计。  
2 应用  
手机和平板电脑的适配器和充电器  
器件信息 (1)  
消费类电子产品的 USB Type-C 交流适配器  
低功率 AC DC 开关模式电源 (SMPS)  
工业用和医疗用开关模式电源 (SMPS)  
部件号  
封装  
SOT23-6  
封装尺寸(标称值)  
UCC28704  
2.90mm x 1.60mm  
(1) 如需了解所有可用封装,请见数据表末尾的可订购产品附录。  
LP38690 的  
5V/2A 适配器效率  
VBLK  
D1  
VREG  
COUT  
T1  
CB1  
NP  
NS  
VOUT  
wt[  
+
88  
85  
RSTR  
VAC  
82  
UCC28704  
VDD  
CoC V5 Tier-2 Average  
D2  
VAUX  
2
6
79  
CDD  
NA  
Q1  
w{1  
DRV  
3
4
76  
DOE Level VI Average  
VS  
CS  
w[/  
115 VAC (with SR)  
w{2  
73  
1
NTC/SU  
GND  
5
230 VAC (with SR)  
CoC 10% Load  
w/{  
wbÇ/  
115 VAC (without SR)  
70  
67  
230 VAC (without SR)  
-t°  
0
25  
50  
75 100  
Load (%)  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
English Data Sheet: SLUSCA8  
 
 
 
UCC28704  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
目录  
1
2
3
4
5
6
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
6.1 Absolute Maximum Ratings ...................................... 4  
6.2 ESD Ratings ............................................................ 4  
6.3 Recommended Operating Conditions....................... 4  
6.4 Thermal Information.................................................. 5  
6.5 Electrical Characteristics........................................... 5  
6.6 Typical Characteristics.............................................. 7  
Detailed Description .............................................. 9  
7.1 Overview ................................................................... 9  
7.2 Functional Block Diagram ......................................... 9  
7.3 Feature Description................................................. 10  
7.4 Device Functional Modes........................................ 24  
8
9
Applications and Implementation ...................... 25  
8.1 Application Information............................................ 25  
8.2 Typical Application .................................................. 25  
8.3 Do's and Don'ts....................................................... 33  
Power Supply Recommendations...................... 34  
10 Layout................................................................... 34  
10.1 Layout Guidelines ................................................. 34  
10.2 Layout Example .................................................... 35  
11 器件和文档支持 ..................................................... 36  
11.1 器件支持................................................................ 36  
11.2 文档支持................................................................ 39  
11.3 社区资源................................................................ 39  
11.4 ....................................................................... 39  
11.5 静电放电警告......................................................... 39  
11.6 Glossary................................................................ 39  
12 机械、封装和可订购信息....................................... 39  
7
4 修订历史记录  
日期  
修订版本  
注释  
2016 2 月  
A
首次发布。  
2
Copyright © 2016, Texas Instruments Incorporated  
 
UCC28704  
www.ti.com.cn  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
5 Pin Configuration and Functions  
SOT23-6 Package  
6-Pin DBV  
Top View  
NTC  
/SU  
VS  
1
2
3
6
5
4
VDD  
GND  
CS  
DRV  
Pin Functions  
PIN  
I/O(1)  
DESCRIPTION  
NAME  
NO.  
NTC/SU is a multi-function pin. First, it provides an interface to an external NTC  
(negative temperature coefficient) resistor for remote temperature sensing. Pulling  
this pin low shuts down PWM action. Additionally, when used with an external  
depletion-mode FET and a low-voltage NPN transistor this pin provides high-voltage  
start up control. A maximum 100-pF noise filter capacitance may be added to this  
pin. The pin should be left floating if not used.  
NTC/SU  
1
I/O  
VDD  
DRV  
2
3
P
VDD is the bias supply input pin to the device.  
DRV is an output pin used to drive the gate of an external high voltage MOSFET  
switching transistor.  
O
CS input connects to a ground referenced current sense resistor in series with the  
power switch. The resulting voltage is used to monitor and control the peak-primary  
current. A series resistor is added to this pin to compensate the peak-primary current  
levels as the AC mains input varies. A small capacitance, up to 30 pF, can be added  
to this pin to filter the current sense signal.  
CS  
GND  
VS  
4
5
6
I
G
I
GND pin is both the reference pin for the controller and the low-side return for the  
drive output. Special care should be taken to return all AC decoupling capacitors as  
close as possible to this pin and avoid any common-mode signal trace length with  
analog signal return paths.  
VS is an input used to provide voltage and timing feedback to the controller. This pin  
is connected to a voltage divider between an auxiliary winding and GND. The value  
of the upper resistor of this divider is used to program the AC-mains run-and-stop  
thresholds and line compensation at the CS pin. Avoid placing a filter capacitor on  
this input which would interfere with accurate sensing of this waveform.  
(1)  
P = Power, G = Ground, I = Input, O = Output, I/O = Input/Output  
Copyright © 2016, Texas Instruments Incorporated  
3
UCC28704  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
6 Specifications  
6.1 Absolute Maximum Ratings  
Over operating free-air temperature range (unless otherwise noted)  
(1)  
MIN  
MAX  
UNIT  
V
VVDD  
VS  
Bias supply voltage  
38  
Voltage range  
–0.75  
–0.5  
–0.5  
7
V
CS, NTC  
VDRV  
IDRV  
IDRV  
IDRV  
IVS  
Voltage range  
5
Self-limiting  
50  
V
Gate-drive voltage at DRV  
V
DRV continuous sink current  
mA  
mA  
mA  
mA  
°C  
°C  
°C  
DRV peak sourcing current, VDRV = 10 V to 0 V  
DRV peak sink current, VDRV = 0 V to 10 V  
VS, peak, 1% duty-cycle, when detecting line voltage  
Operating junction temperature range  
Storage temperature  
Self-limiting  
Self-limiting  
1.2  
TJ  
–55  
–65  
150  
TSTG  
TLEAD  
150  
Lead temperature 0.6 mm from case for 10 seconds  
260  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
6.2 ESD Ratings  
VALUE  
±2000  
±500  
UNIT  
V
V(ESD)  
V(ESD)  
Electrostatic discharge  
Electrostatic discharge  
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
Charged-device model (CDM) ESD stress voltage(2)  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
6.3 Recommended Operating Conditions  
Over operating free-air temperature range (unless otherwise noted)  
MIN  
MAX  
35  
UNIT  
VDD  
CDD  
IVS  
Bias supply operating voltage  
8.5  
V
VDD bypass capacitor  
0.047  
no limit  
1.0  
µF  
mA  
°C  
VS pin sourcing current when detecting line voltage  
Operating junction temperature  
TJ  
–40  
125  
4
Copyright © 2016, Texas Instruments Incorporated  
UCC28704  
www.ti.com.cn  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
6.4 Thermal Information  
UCC28704  
THERMAL METRIC  
DBV  
6 PINS  
150  
55  
UNIT  
(1)  
θJA  
Junction-to-ambient thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
(2)  
θJCtop  
θJB  
Junction-to-case (top) thermal resistance  
(3)  
Junction-to-board thermal resistance  
60  
(4)  
ψJT  
ψJB  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
3
(5)  
55  
(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as  
specified in JESD51-7, in an environment described in JESD51-2a.  
(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-  
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB  
temperature, as described in JESD51-8.  
(4) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).  
(5) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).  
6.5 Electrical Characteristics  
Over operating free-air temperature range, VVDD = 25 V, RNTC = open, –40°C TA 125°C, TJ = TA (unless otherwise noted)  
PARAMETER  
BIAS SUPPLY INPUT  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
IRUN  
Supply current, run  
Supply current, wait  
Supply current, start  
Supply current, fault  
IDRV = 0, run state  
1.65  
40  
2.3  
70  
2.65  
100  
2.5  
mA  
µA  
IWAIT  
ISTART  
IFAULT  
IDRV = 0, VVDD = 20 V, wait state  
IDRV = 0, VVDD = 17 V, start state  
IDRV = 0, fault state  
1.5  
2.2  
µA  
1.7  
2.8  
mA  
UNDER-VOLTAGE LOCKOUT  
VVDD(on)  
VVDD(off)  
VS INPUT  
VVSR  
VDD turn-on threshold  
VDD turn-off threshold  
VVDD low to high  
VVDD high to low  
17.5  
7.3  
21  
23  
V
V
7.7  
8.15  
(1)  
Regulating level  
Measured at no-load condition, TJ =  
25°C  
4.02  
4.06  
4.1  
V
VVSNC  
IVSB  
Negative clamp level  
Input bias current  
IVS = –300 µA  
VVS = 4 V  
190  
250  
0
325  
mV  
µA  
–0.25  
0.25  
CS INPUT  
VCST(max)  
VCST(min)  
KAM  
(2)  
Max CS threshold voltage  
Min CS threshold voltage  
AM control ratio  
VVS = 3.70 V  
720  
170  
3.55  
345  
750  
187.5  
4
784  
210  
4.4  
mV  
mV  
V/V  
mV  
(2)  
VVS = 4.35 V  
VCST(max) / VCST(min)  
VCCR  
Constant-current regulating level  
Line compensating current  
356  
369  
KLC  
ratio, IVSLS  
(current out of CS pin)  
/
IVSLS = –300 µA  
23  
25  
29  
A/A  
ns  
TCSLEB  
Leading-edge blanking time  
DRV output duration, VCS = 1 V  
170  
255  
340  
(1) The regulation level and OV threshold at VS decrease with increasing temperature by 1 mV/. This compensation over temperature is  
included to reduce the variances in power supply output regulation over-voltage detection with respect to the external output rectifier.  
(2) These threshold voltages represent average levels. This device automatically varies the current sense threshold to improve EMI  
performance.  
Copyright © 2016, Texas Instruments Incorporated  
5
 
UCC28704  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
Electrical Characteristics (continued)  
Over operating free-air temperature range, VVDD = 25 V, RNTC = open, –40°C TA 125°C, TJ = TA (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
DRV  
IDRS  
DRV source current  
VDRV = 5 V, VVDD = 9 V  
25  
32  
6.5  
38  
12  
mA  
Ω
RDRVLS  
VDRCL  
RDRVSS  
TIMING  
fSW(max)  
fSW(min)  
tZTO  
DRV low-side drive resistance  
DRV clamp voltage  
IDRV = 10 mA  
VVDD = 35 V  
9.5  
10.6  
205  
13  
V
DRV pull-down in start state  
165  
250  
kΩ  
(3)  
Maximum switching frequency  
Minimum switching frequency  
Zero-crossing timeout delay  
VVS = 3.7 V  
VVS = 4.6 V  
78  
0.88  
1.7  
85  
1.03  
2.39  
94  
1.18  
3
kHz  
kHz  
µs  
tCCUV_BLAN Blanking delay time before CCUV  
VVS step from 3.5 V to 2.4 V to DRV  
stop switching  
90  
120  
150  
ms  
shutdown  
K
PROTECTION  
KOVP  
Over-voltage threshold ratio to VVSR VOVP/VVSR  
1.13  
2.41  
1.35  
190  
70  
1.15  
2.48  
1.51  
220  
80  
1.18  
2.55  
1.6  
V/V  
V
VCCUV  
VOCP  
CCUV VO = 3.0 V  
TJ = 25, auto restart after fault  
At CS input  
Over-current threshold  
VS line-sense run current  
VS line-sense stop current  
V
IVSL(run)  
IVSL(stop)  
KVSL  
Current out of VS pin – increasing  
Current out of VS pin – decreasing  
265  
100  
µA  
µA  
VS line-sense ratio IVSL(run)  
IVSL(stop)  
/
2.55  
2.8  
2.95  
260  
A/A  
°C  
(4)  
TJ(stop)  
Thermal shut-down temperature  
Internal junction temperature  
150  
CABLE COMPENSATION  
VCVS(max)  
Maximum compensation at VS  
Change in VS regulating level at full-  
load  
180  
220  
mV  
NTC INPUT  
VNTCTH  
NTC shut-down threshold  
VDD UVLO cycle when below this  
threshold  
0.9  
90  
0.95  
100  
1
V
INTC  
NTC pull-up current, out of pin  
VNTC = 1.1 V  
120  
µA  
(3) These frequency limits represent average levels. This device automatically varies the switching frequency to improve EMI performance.  
(4) Not tested in production.  
6
版权 © 2016, Texas Instruments Incorporated  
UCC28704  
www.ti.com.cn  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
6.6 Typical Characteristics  
VDD = 25 V, unless otherwise noted.  
5x101  
1x101  
1x105  
1x104  
1x103  
1x102  
1x101  
1x100  
1x10-1  
Run State  
IRUN, VDD = 25V  
IWAIT, VDD = 20V  
1x100  
Wait State  
1x10-1  
1x10-2  
éVDD Turn-Off  
åVDD Turn-On  
1x10-3  
1x10-4  
ISTART, VDD = 17V  
Start State  
1x10-5  
1x10-6  
0
5
10  
15  
20  
25  
30  
35  
40  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
VDD - Bias Supply Voltage (V)  
TJ - Temperature (èC)  
D001  
D002  
1. Bias Supply Current vs. Bias Supply Voltage  
2. Bias Supply Current vs. Temperature  
300  
275  
250  
225  
200  
175  
150  
125  
100  
75  
4.12  
4.10  
4.08  
4.05  
4.03  
4.00  
3.98  
3.95  
IVSL, Run  
IVSL, Stop  
50  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
TJ - Temperature (èC)  
TJ - Temperature (èC)  
D003  
D004  
3. VS Regulation Voltage vs. Temperature  
4. Line-Sense Current vs. Temperature  
365  
360  
355  
350  
345  
192.9  
192.7  
192.5  
192.3  
192.1  
191.9  
191.7  
191.5  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
TJ - Temperature (èC)  
TJ - Temperature (èC)  
D006  
D005  
6. Constant-Current Regulation Level vs. Temperature  
5. Minimum CS Threshold Voltage vs. Temperature  
版权 © 2016, Texas Instruments Incorporated  
7
UCC28704  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
Typical Characteristics (接下页)  
VDD = 25 V, unless otherwise noted.  
1.05  
33.5  
33.0  
32.5  
32.0  
31.5  
31.0  
30.5  
30.0  
1.04  
1.03  
1.02  
1.01  
1.00  
0.99  
0.98  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
TJ - Temperature (èC)  
TJ - Temperature (èC)  
D007  
D008  
7. Minimum Switching Frequency vs. Temperature  
8. DRV Source Current vs. Temperature  
108  
107  
106  
105  
104  
103  
0.952  
0.951  
0.95  
0.949  
0.948  
0.947  
0.946  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
TJ - Temperature (èC)  
TJ - Temperature (èC)  
D010  
D009  
10. NTC Pullup Current vs. Temperature  
9. NTC Shutdown Threshold Voltage vs. Temperature  
2.6  
2.55  
2.5  
2.45  
2.4  
2.35  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
TJ - Temperature (èC)  
D011  
11. Constant-Current Under-Voltage Threshold vs. Temperature  
8
版权 © 2016, Texas Instruments Incorporated  
UCC28704  
www.ti.com.cn  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
7 Detailed Description  
7.1 Overview  
The UCC28704 flyback power supply controller provides accurate constant voltage and constant current  
regulation with primary-side feedback control. It also eliminates the need for opto-coupler feedback circuits. The  
controller optimizes the modulation scheme and the device's power management to boost power conversion  
efficiency, lower power dissipation at no-load and light load. Frequency dithering reduces the EMI peak energy at  
the fundamental switching frequency and harmonics. Features include fixed cable compensation and constant  
current output under-voltage shutdown, or CCUV, to protect USB terminals from getting over-heated or burn-out  
condition during soft-short circuit fault.  
The controller operates in discontinuous conduction mode with valley switching to minimize switching losses. A  
combination of frequency modulation and primary peak current modulation to provide high power conversion  
efficiency across the load range. Accurate voltage and constant current regulation, fast dynamic response, and  
fault protection are achieved with primary-side control. A complete charger solution can be realized with a  
straightforward design process, low cost and low component count.  
In UCC28704, as compared to UCC28700/1/2/3, features such as constant current under voltage protection and  
enhanced load transient schemes have been added. Also, in UCC28704, the demagnetizing ratio has been  
extended to 0.475 along with an increased AM ratio of 4:1. The maximum frequency of the controller is set at 85  
kHz and the AM region switching frequency is optimally set at 25 kHz to have better trade-offs between no-load  
standby power consumption and load transient response. UCC28704 also incorporates schemes to have better  
noise rejection at the output voltage sense (VS pin) allowing for improved output voltage ripple reduction.  
7.2 Functional Block Diagram  
VDD  
INTC  
UVLO  
21 V/7.7 V  
VDD  
GND  
OC FAULT  
Line FAULT  
2
5
Power and Fault  
Managment  
CCUV FAULT  
OV FAULT  
VNTCTH  
VSS /1.15  
4.06 V  
OTP FAULT  
NTC/SU  
1
Minimum fSW  
Bias  
VSS /1.10  
4.06 V  
1 kHz  
4 kHz  
S
Q
VDD  
R
Q
4.06 V + VCVS  
VSS  
30 mA  
+
VCL  
E/A  
Control Law  
6
Sampler  
VS  
CCUV FAULT  
3
200 kW  
DRV  
120 ms  
Delay  
10 V  
VCST  
1/fSW  
2.48 V  
Zero Crossing  
S
R
Q
Q
Detect  
VCVS  
CS  
4
Secondary  
Timing Detect  
Current Regulation and  
Cable compensation  
VCST  
LEB  
IVSLS  
IVSLS  
Line Sense  
IVSLS / KLC  
Line  
Fault  
OC  
Fault  
10 kW  
1.5 V  
2.2 V / 0.8 V  
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7.3 Feature Description  
7.3.1 Detailed Pin Description  
7.3.1.1 VDD (Device Bias Voltage Supply)  
The VDD pin is typically powered from a rectified auxiliary transformer winding, the same winding that is used to  
capture the output voltage level. A bypass capacitor, with minimum value 0.047 μF, on the VDD pin is used for  
initially biasing the device to start-up along with a resistive or active source of start-up charging current. UVLO  
start / stop levels of 21 V / 7.7 V accommodate lower values of VDD capacitance that in turns keeps the start-up  
current low, which for resistive start-up has an impact on both stand-by power and power-on delay. A high, 35-V,  
maximum operating level on VDD alleviates concerns with leakage energy charging of VDD and gives added  
flexibility to when varying power supply output voltage must be supported.  
7.3.1.2 GND (Ground)  
This is an external return pin, and provides the reference point for both external signal and the gate drive of the  
device. The VDD bypass capacitor should be placed close to this pin. Critical component GND connections from  
the VS, CS and NTC pins should have dedicated and short paths to this pin.  
7.3.1.3 VS (Voltage-Sense)  
The VS pin is connected to a resistor divider from the auxiliary winding to ground. The output-voltage feedback  
information is sampled at the end of the transformer secondary current demagnetization time to provide an  
accurate representation of the output voltage. Timing information to achieve valley-switching and to control the  
duty cycle of the secondary transformer current is determined by the waveform on the VS pin. The VS input is a  
critical signal and will generally be with relatively high impedance. To avoid unpredictable behavior avoid placing  
a filter capacitor on this pin and keep the total PCB area tied to VS at a minimum.  
The VS pin also senses the bulk capacitor input voltage to provide for ac-input run and stop thresholds, and to  
compensate the current-sense threshold across the AC-input range. This information is sensed by monitoring the  
current pulled out of the VS pin during the MOSFET on-time. During this time the voltage on the VS pin is  
clamped to about 250mV below GND. As a result, the current out of the pin is determined by the upper VS  
divider resistor, the auxiliary to primary turns-ratio and the bulk input voltage level. For the AC-input run/stop  
function, the run threshold on VS is IVSL(run) (typical 220 µA) and the stop threshold is IVSL(stop) (typical 80 µA).  
The values for the auxiliary voltage divider upper-resistor RS1 and lower-resistor RS2 can be determined by the  
equations below.  
2 ì V  
VBULK(run)  
IN(run)  
RS1  
=
ö
NPA ìIVSL(run) NPA ìIVSL(run)  
where  
NPA is the transformer primary-to-auxiliary turns ratio,  
VIN(run) is the AC rms voltage to enable turn-on of the flyback converter (run),  
VBULK(run) is the DC bulk voltage to enable turn-on of the flyback converter (run),  
IVSL(run) is the run-threshold for the current pulled out of the VS pin during the primary MOSFET on-time. (see  
the Electrical Characteristics table).  
(1)  
RS1 ì VVSR  
NAS ì(VOCV + VF) - VVSR  
RS2  
=
where  
VOCV is the converter regulated output voltage,  
VF is the output rectifier forward voltage drop at near-zero current,  
NAS is the transformer auxiliary to secondary turns ratio,  
RS1 is the VS divider high-side resistance,  
VVSR is the CV regulating level at the VS input (see the Electrical Characteristics table).  
(2)  
This pin is also used to sense the output constant current under voltage (CCUV) level, used to shut down the  
converter in the case of a soft-short circuit at its output. Refer to Constant Current Under-Voltage Protection for  
further information.  
10  
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Feature Description (接下页)  
7.3.1.4 DRV (Gate Drive)  
The DRV pin is connected to the MOSFET gate pin, usually through a series resistor. The DRV provides a gate  
drive signal which is clamped to 10.5-V internally. During turn-on the driver applies a typical 30-mA current  
source out of the DRV pin. When the DRV voltage rises to above 9 V the output current is reduced to about 100  
µA. This current brings the DRV voltage to the 10.5-V clamp level, or to VDD, whichever is less. The 30-mA  
current provides adequate turn-on speed while automatically limiting noise generated at turn-on by the MOSFET  
drain dv/dt and by the leading edge turn-on current spike. The gate drive turn-off current is internally limited to  
about 400 mA when DRV is above about 4 V. At lower DRV voltages the current will reduce, eventually being  
limited by the low-side on resistance, RDS(on). The drain turn-on and turn-off dv/dt can be further impacted by  
adding external resistor in series with DRV pin. The drain current resonances can be damped with a small series  
gate resistor, generally less than a 1 Ω.  
7.3.1.5 CS (Current Sense)  
The current sense pin is connected through a series resistor (RLC) to the current-sense resistor (RCS). The  
controller varies the internal current sense threshold between 0.188 V and 0.75 V, setting a corresponding  
control range for the peak-primary winding current to a 4-to-1 range. The series resistor RLC provides an input  
voltage feed-forward function. The voltage drop across this resistor reduces primary-side peak current as the line  
voltage increases, compensating for the increased di/dt and delays in the MOSFET turn-off. There is an internal  
leading-edge blanking time of 255 ns to eliminate sensitivity to the MOSFET turn-on leading edge current spike.  
If additional blanking time is needed, a small bypass capacitor, up to 30 pF, can be placed on between CS pin  
and GND pin. The value of RCS is determined by the target output current in constant current (CC) regulation.  
The values of RCS and RLC can be determined by the equations below. The term ηXFMR is intended to account for  
the energy stored in the transformer but not delivered to the secondary. This includes transformer core and  
copper losses, bias power, and primary leakage inductance losses.  
Example: With a transformer core and copper losses of 3%, leakage inductance caused power losses 2%, and  
bias power to output power ratio of 0.5%. The transformer power transfer efficiency is estimated as ηXFMR  
=
100% - 3% - 2% - 0.5% = 94.5%  
VCCR ìNPS  
2 ìIOCC  
RCS  
=
ì hXFMR  
where  
VCCR is a current regulation constant (see the Electrical Characteristics table),  
NPS is the transformer primary-to-secondary turns ratio (a typical turns-ratio of 12 to 15 is recommended for 5-  
V output),  
IOCC is the target output current in constant-current regulation,  
ηXFMR is the transformer efficiency.  
(3)  
KLC ì RS1 ìRCS ì(tD + tGATE_ OFF)ìNPA  
RLC  
=
LP  
where  
RS1 is the VS pin high-side resistor value,  
RCS is the current-sense resistor value,  
tD is the current-sense delay (typical 50 ns) plus MOSFET turn-off delay,  
tGATE_OFF is the primary-side main MOSFET turn-off time,  
NPA is the transformer primary-to-auxiliary turns-ratio,  
LP is the transformer primary inductance,  
KLC is a current-scaling constant (see the Electrical Characteristics table).  
(4)  
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Feature Description (接下页)  
7.3.1.6 NTC/SU (NTC Thermistor Shutdown and External Start Up Control)  
The UCC28704 uses an external NTC resistor tied to the NTC/SU pin to program a thermal shutdown  
temperature for the power supply. The NTC/SU shutdown threshold is 0.95 V with an internal 105-µA current  
source which results in a 9.05-kΩ thermistor shutdown threshold. A small capacitor with value not greater than  
100 pF can be used on this pin for any noise reduction purposes. The capacitor with its value greater than 100  
pF can cause a false over-temperature protection response. The NTC/SU pin should be left floating if not used.  
The NTC/SU pin can be used to control an external depletion-mode FET to enable active high-voltage start up,  
Refer to Initial Power-On with A Depletion-Mode FET for more detail.  
7.3.2 Primary-Side Regulation (PSR)  
12 illustrates a simplified flyback convertor with the main voltage regulation blocks of the device shown. The  
power train operation is the same as any DCM flyback circuit but accurate output voltage and current sensing is  
the key to primary-side control.  
+ VF -  
IS  
Timing  
VCL  
Bulk Voltage -VBLK  
Primary Winding  
(VOUT + VF + ISRS) x NA / NS  
COUT  
RLOAD  
Secondary  
Winding  
VOUT  
RS1  
Aux  
Winding  
Control  
Law  
Q1  
Discriminator and  
Sampler  
VS  
RS2  
D5  
DRV  
-
Minimum  
Period  
And Peak  
Primary  
Current  
CS  
Zero Crossings  
RCS  
12. Simplified Flyback Convertor  
(with the Main Voltage Regulation Blocks)  
In primary-side control, the output voltage is sensed on the auxiliary winding during the transfer of transformer  
energy to the secondary. As shown in 13 during this time, the auxiliary winding voltage has a down slope  
representing a decreasing total rectifier forward voltage drop VF and resistance voltage drop (ISRS) as the  
secondary current decreases to zero. To achieve an accurate representation of the secondary output voltage on  
the auxiliary winding, the discriminator reliably blocks the leakage inductance reset and ringing, continuously  
samples the auxiliary voltage during the down slope after the ringing is diminished, and captures the error signal  
at the time the secondary winding reaches zero current. The internal reference on VS is 4.06 V; the resistor  
divider is selected as outlined in the VS pin description.  
VS Sample  
(VOUT + VF + ISRS) NA / NS  
0 V  
- (VBLK) NA / NP  
13. Auxiliary Winding Voltage  
12  
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The UCC28704 VS signal sampler includes signal discrimination methods to ensure an accurate sample of the  
output voltage from the auxiliary winding. There are however critical details of the auxiliary winding signal to  
ensure reliable operation, specifically the reset time of the leakage inductance and the duration of any  
subsequent leakage inductance ring. Refer to 14 for a detailed illustration of waveform criteria to ensure a  
reliable sample on the VS pin. The first detail to examine is the duration of the leakage inductance reset  
pedestal, TLK_RESET in 14. Since this can mimic the waveform of the secondary current decay, followed by a  
sharp downslope, it is important to keep the leakage reset time less than 750 ns for IPRI minimum, and less than  
3.0 µs for IPRI maximum. The second detail is the amplitude of ringing on the VAUX waveform following tLK_RESET  
.
The peak-to-peak voltage at the VS pin should be less than approximately 250 mVp-p at least 250 ns before the  
end of the demagnetization time, tDMAG. If there is a concern with excessive ringing, it usually occurs during light  
or no load conditions, when tDMAG is at the minimum, tDMAG(min). The tolerable ripple on VS is scaled up to the  
auxiliary winding voltage by RS1 and RS2, and is equal to 250 mV × (RS1+RS2) / RS2. The snubber designs can be  
designed to allow the ripple voltage to meeting these requirements.  
As mentioned in Device Functional Modes, when IPP < IPP(max), the device operation enters a “Wait” state during  
each switching cycle of its non-switching portion as shown in 14. In the Wait state, the device bias current  
changes to IWAIT (typical 70 µA) from IRUN (typical 2.3 mA), reducing its bias power to help boost efficiency at light  
load and to reduce standby load power.  
tLK_RESET  
Entering Wait State  
IPP < IPP(max)  
VS ring p-p  
(scaled)  
RS2/(RS1+RS2  
0 V  
)
tDM_BLANK  
tDMAG  
tSW  
14. Auxiliary Waveform Details  
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Feature Description (接下页)  
7.3.3 Primary-Side Constant Voltage (CV) Regulation  
During voltage regulation (CV mode), the controller operates in frequency modulation mode and peak current  
amplitude modulation mode as illustrated in 15 below. The UCC28704 incorporates internal voltage-loop  
compensation circuits so that external compensation is not necessary, provided that the value of COUT is high  
enough. The following equation determines a minimum value of COUT necessary to maintain a phase margin of  
about 40 degrees over the full-load range,  
IOCC  
COUT í 100 ì  
VOCV ì fMAX  
(5)  
The internal operating frequency limits of the device are fSW(max) and fSW(min), typically 85 kHz and 1 kHz,  
respectively. The choice of transformer primary inductance and primary-peak current sets the maximum  
operating frequency of the converter, which must be equal to or lower than fSW(max). Conversely, the choice of  
maximum target operating frequency and primary-peak current determines the transformer primary-inductance  
value. The actual minimum switching frequency for any particular converter depends on several factors, including  
minimum loading level, leakage inductance losses, switch-node capacitance losses, other switching and  
conduction losses, and bias-supply requirements. In any case, the minimum steady-state frequency of the  
converter must always exceed fSW(min) or the output voltage may rise to the over-voltage protection level (OVP)  
and the controller responds as described in Fault Protection.  
To achieve a regulated output voltage in the CV mode operation, energy balance has to be maintained. As the  
UCC28704 has a minimum switching frequency typical 1 kHz, together with the energy per switching cycle  
determined by converter parameters, such as the transformer primary inductance Lp and the selected RCS  
resistor, the converter has a minimum input power. A proper pre-load needs to be selected to ensure that this  
minimum energy is balanced during the no-load condition. The selection of the line compensation resistor value  
(RLC) connected to the CS pin can impact the energy per switching cycle based on low-line and high-line  
conditions. Typical Application section provides a design example to show how to implement these  
considerations.  
In the CV mode operation, the cable compensation is in effect. The cable compensation is to adjust the output  
voltage at board-end to be higher than the no-load setup point, noted as VOCV, then to compensate the voltage  
drop due to the cable resistance through which the load current IO is flowing. The UCC28704 cable  
compensation is fixed at 6% of VOCV at full load, and the board-end output voltage is described by 公式 6:  
IO  
VOUT = VOCV ì(1+ 0.06 ì  
)
IOCC  
(6)  
14  
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Due to the cable compensation, the output voltage at board-end is seen higher than VOCV with a positive slope  
when load current IO> 0. The output voltage at the cable's end can be flat, upturned, or downturned, depending  
on the cable total resistance in use. Primary-Side Constant Current (CC) Regulation has more descriptions on  
the cable compensation.  
fSW  
Control Law Profile in Constant Voltage (CV) Mode  
IPP  
IPP(max)  
85 kHz  
IPP  
fSW  
Region 2  
FM  
Region 1  
25 kHz  
1kHz  
IPP(max)/4  
AM  
FM  
Region 3  
Region 4  
4.85 V  
1.3 V  
2.2 V  
3.0 V  
Control Voltage, E/A Output - VCL  
15. Frequency and Amplitude Modulation Modes  
(during CV mode)  
In CV mode operation, the control consists of four regions, namely, region 1 through 4. The device internal error  
op-amp output VCL sets a particular region operation. Refer to 12 for VCL. The steady-state control-law  
voltage, VCL, ranges between 1.3 V to 4.85 V. Heavy load operation is usually in region 4 where frequency  
modulation to output regulation is used and primary-peak current is controlled at its maximum. Region 3 is  
usually for medium-load range typically from 10% load and above. In this region switching frequency is fixed at  
nominal 25 kHz along with primary-peak current varying from 25% to 100% of its maximum. A low operating  
frequency range (region 2) is for lighter loads to achieve stable regulation at low frequencies. In region 2, peak-  
primary current is always maintained at IPP(max)/4 in the lower frequency level. Transitions between levels are  
automatically accomplished by the controller depending on the internal control-law voltage, VCL. During a load  
transient condition when VCL > 4.85 V, the device operates in constant current mode. When load is in step-down  
transient demanding frequency lower than 4 kHz, first, the device stays at 4 kHz for up to 500 ms, or the output  
voltage reaches about 10% over the VOCV within 500 ms, then the device adjusts the switching frequency to be  
lower than 4 kHz as needed. More details can be found in Load Transient Response.  
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Feature Description (接下页)  
7.3.4 Primary-Side Constant Current (CC) Regulation  
Timing information at the VS pin and current information at the CS pin allow accurate regulation of the secondary  
average current. The control law dictates that as power is increased in CV regulation and approaching CC  
regulation the primary-peak current is at IPP(max). Referring to 16 below, the primary peak current (IPP), turns-  
ratio (NS/NP), secondary demagnetization time (tDMAG), and switching period (tSW) determine the secondary  
average output current. Ignoring leakage inductance effects, the average output current is given by 公式 7. By  
regulating the secondary rectifier conduction duty cycle, the output average current is constant for given IPP and  
transformer turns-ratio. When the load increases, the secondary-side rectifier conduction duty cycle keep  
increasing. Once it reaches preset value of 0.475, the converter switching frequency is then reduced to maintain  
0.475 secondary-side duty cycle. Therefore, the output current is kept constant. Because the current is kept  
constant, the increasing load results in lower output voltage. Converter can shut down in this condition if the  
output voltage drops below CCUV protection level, or UCC28704 VDD drops below its UVLO turn-off threshold.  
i
IPP  
ISP x NS/NP  
t
tON  
tDMAG  
tSW  
16. Transformer Currents  
IPP NP tDMAG  
IOUT  
=
ì
ì
2
NS  
tSW  
(7)  
As shown in 17 below, CV mode operation is from IO = 0 to IOCC; at IO = IOCC, the operation enters CC mode  
and VO starts to drop as the load resistance becomes further lower while IO is maintained at IOCC until Vo reaches  
the CCUV threshold. Details of the CCUV operation are given in Constant Current Under-Voltage Protection. 图  
17 shows the output at board-end and at cable-end. The cable compensation nominally compensates 300 mV  
for a 5V-output at the IOCC level.  
Vo (Board-End) =  
VOCV x (1+ 0.06 x IO/IOCC  
)
VOCV  
VO_CCUV at  
Board-End  
Vo at Cable-End  
Fixed Cable Compensation  
VO_CCUV at  
Cable-End  
0
IOCC  
Output Current IO  
17. Typical Target Output V-I Characteristic  
16  
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Feature Description (接下页)  
7.3.5 Valley-Switching and Valley-Skipping  
The UCC28704 utilizes valley switching to reduce switching losses in the MOSFET, reduce induced-EMI, and  
minimize the turn-on current spike at the sense resistor. The controller operates in valley-switching in all load  
conditions unless the VDS ringing diminished.  
Referring to 18 below, the UCC28704 operates in a valley-skipping mode in most load conditions to maintain  
an accurate voltage or current regulation point and still switch on the lowest available VDS voltage.  
VDS  
0 V  
VDRV  
t
0 V  
18. Valley-Skipping Mode  
The UCC28704 forces a controlled minimum switching period corresponding to the power supply operating  
frequency. In each switching cycle, after the minimum period is expired, the UCC28704 looks for the next  
resonant valley on the auxiliary winding. The controller initiates a new power cycle at this valley point which  
corresponds to a reduced voltage level on the power MOSFET. If at the point in time when the minimum period  
expires ringing on the transformer winding has decayed such that no further resonant valleys can be detected a  
new power cycle is initiated following a fixed time, tZTO  
.
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Feature Description (接下页)  
7.3.6 Start-Up Operation  
Upon application of input voltage to the converter, the start up resistance connected to VDD from the bulk  
capacitor voltage (VBULK) charges the VDD capacitor. During charging of the VDD capacitor, the device supply  
current is less than 1.5 µA. When VDD reaches the 21-V UVLO turn-on threshold, the controller is enabled and  
the converter starts switching. The peak-primary currents with initial three cycles are limited to IPP(min). This allows  
sensing any initial input or output faults with minimal power delivery. When confirmed that the input voltage is  
above the programmed converter turn-on voltage and with no faults detected, the start-up process proceeds and  
normal power conversion follows. The converter remains in discontinuous conduction mode operation during  
charging of the output capacitor(s), maintaining a constant output current until the output voltage is in regulation.  
Initial power-on to the UCC28704 device is achieved by one of the two approaches that are described in Initial  
Power-On with a Start-Up Resistor and Initial Power-On with A Depletion-Mode FET.  
7.3.6.1 Initial Power-On with a Start-Up Resistor  
A common used initial power-on approach for UCC28704 is to use a start-up resistor, RSTR, to tie VDD to VBLK  
,
as show in 19. With this approach, the VDD pin is connected to a bypass capacitor to ground and a start-up  
resistance to the input bulk capacitor (+) terminal. The VDD turn-on UVLO threshold is 21 V (VVDD(on))and turn-off  
UVLO threshold is 7.7 V (VVDD(off)), with an available operating range up to 35 V. The USB charging practice  
requires the output current to operate in constant-current mode from 5 V to typical about 3 V; this is easily  
achieved with a nominal VDD of approximately 15 V. The additional VDD headroom up to 35 V allows for VDD to  
rise due to the leakage energy delivered to the VDD capacitor in high-load conditions. Also, the wide VDD range  
provides the advantage of selecting a relatively small VDD capacitor and high-value start-up resistance to  
minimize no-load stand-by power loss in the start-up resistor.  
The RSTR value has effect to power-on delay time and no-load standby power losses. Both are usually part of the  
design specifications. Increase RSTR reduces standby power losses while increases power-on delay time. A  
typical range of RSTR is from 10 Mto 15 Mas initial design start point for off-line AC-to-DC adapters where  
power-on delay time usually requires less than two seconds. Due to the limited voltage rating, RSTR is normally  
implemented by two or three resistors in series.  
VBLK  
D1  
VREG  
COUT  
T1  
CB1  
CB2  
NP  
NS  
VOUT  
wt[  
+
RSTR  
VAC  
UCC28704  
D2  
VAUX  
2
VDD  
CDD  
Q1  
NA  
w{1  
DRV  
CS  
3
4
6
1
VS  
w[/  
w{2  
NTC/SU  
GND  
5
w/{  
wbÇ/  
-t°  
19. Power-On with Start-Up Resistor  
18  
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7.3.6.2 Initial Power-On with A Depletion-Mode FET  
The UCC28704 NTC/SU pin can control an external depletion-mode FET to provide more efficient start-up. This  
provides a fast start-up time with eliminating the loss associated with the start-up circuit. Therefore, the standby  
power at no load can be minimized. This gives an alternative method to power on the device initially. As shown  
in 20, the depletion mode FET HV start-up circuit consists of QST1, QST2, CST, RILIM, and RST1 to RST3  
.
Before VDD reaches VVDD(on), NTC/SU stays low, QST1 turns on, which enables the quick charge of CDD thereby  
achieving a shorter power-on delay time. After VDD VVDD(on), NTC/SU starts sourcing 105 µA to turn on QST2  
then turns off QST1. This stops QST1 providing current to UCC28704 and minimizes the loss in the start-up circuit.  
In normal operation when IPP < IPP(max), the device enters wait state in each switching cycle, see 14 for wait  
state time. During wait state, NTC/SU stops sourcing 105 µA; which turns off QST2 and can potentially cause  
QST1 to turn on. Hence CST is added to ensure that QST1 is off even during wait state. For reference, RST1 = RST2  
= 2 M, RST3 = 100 k, CST = 1 nF, RILIM = 365 k, as an example. To select a depletion-mode FET for QST1  
,
BSS126 or similar can be an option.  
VBLK  
CB2  
D1  
VREG  
COUT  
T1  
CB1  
NP  
NS  
VOUT  
wt[  
+
RLIM  
QST1  
VAC  
w{Ç1  
UCC28704  
VDD  
VAUX  
NA  
D2  
2
CDD  
Q1  
w{1  
DRV  
3
4
6
1
VS  
CS  
w[/  
w{Ç2  
w{2  
NTC/SU  
GND  
5
QST2  
w/{  
CST  
w{Ç3  
wbÇ/  
-t°  
20. Power-On with a Depletion-Mode FET  
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Feature Description (接下页)  
7.3.7 Fault Protection  
There is comprehensive fault protection incorporated into the UCC28704. Protection functions include:  
Output Over-Voltage  
Input Under-Voltage  
Primary Over-Current Fault  
CS Pin Open Fault  
CS Pin Short-to-GND Fault  
VS Pin Fault  
External NTC Over-Temperature  
Device Internal Over-Temperature  
Constant Current Under Voltage Output Shutdown (CCUV) for Soft-Short Protection  
Output Over-Voltage: The output over-voltage function is determined by the voltage feedback on the VS pin. If  
the voltage sample on VS exceeds 4.67 V, 115% of the nominal regulating level, for three consecutive switching  
cycles an OV fault is asserted. Once asserted the device stops switching, initiating a UVLO reset and re-start  
fault cycle. During the fault, the VDD bias current remains at the run current level, discharging the VDD pin to the  
UVLO turn-off threshold, VVDD(off). After that, the device returns to the start state, VDD now charging to VVDD(on)  
where switching is initiated. The UVLO sequence repeats as long as the fault condition persists.  
Input Under-Voltage: The line input run and stop thresholds are determined by current information at the VS pin  
during the MOSFET on-time. While the VS pin is clamped close to GND during the MOSFET on-time, the current  
through RS1, out of the VS pin, is monitored to determine a sample of the bulk capacitor voltage. A wide  
separation of run and stop thresholds allows clean start-up and shut-down of the power supply with the line  
voltage. From the start state, the sensed VS current, IVSL, must exceed the run current threshold, IVSL(run) (typical  
220 µA), within the first three cycles after switching starts as VDD reaches VVDD(on). If it does not, then switching  
stops and the UVLO reset and re-start fault cycle is initiated. Once running, IVSL must drop below the stop level,  
IVSL(stop) (typically 80 µA), for three consecutive cycles to initiate the fault response.  
Primary Over-Current: The UCC28704 always operates with cycle-by-cycle primary-peak current control. The  
normal operating range of the CS pin is 0.75 V to 0.188 V. If the voltage on CS exceeds the 1.5-V over-current  
level, any time after the internal leading edge blanking time and before the end of the transformer  
demagnetization, for three consecutive cycles the device shuts down and the UVLO reset and re-start fault cycle  
begins.  
CS Pin Open: The CS pin has a 2-µA minimum pull-up that brings the CS pin above the 1.5-V OC fault level if  
the CS pin is open. This causes the primary over-current fault after three cycles.  
CS Pin Short to GND: On the first, and only the first cycle at start-up, the device checks to verify that the  
VCST(min) threshold is reached at the CS pin within 4 µs of DRV going high. If the CS voltage fails to reach this  
level then the device terminates the current cycle and immediately enters the UVLO reset and re-start fault  
sequence.  
VS Pin: Protection is included in the event of component failures on the VS pin. If the high-side VS divider  
resistor opens the controller stops switching. VDD collapses to its VVDD(off) threshold, a start-up attempt follows  
with a single DRV on-time when VDD reaches VVDD(on). The UVLO cycle will repeat. If the low-side VS divider  
resistor is open then an output over-voltage fault occurs.  
NTC Over-Temperature: UCC28704 uses the NTC/SU pin to program thermal shutdown threshold with an  
external NTC thermistor on this pin. The NTC shutdown threshold is 0.95 V with an internal 105-µA current  
source which results in a 9.05-kΩ thermistor shutdown threshold. If the NTC/SU pin voltage is below 0.95 V at  
the end of the secondary current demagnetization time for three consecutive cycles switching stops and the  
UVLO reset and re-start fault sequence is initiated.  
Device Internal OTP: The internal over-temperature protection threshold is 150°C. If the junction temperature of  
the device reaches this threshold the device initiates the UVLO reset and re-start fault cycle. If the temperature is  
still high at the end of the UVLO cycle, the protection cycle repeats.  
Constant Current Under-Voltage: Output shutdown (CCUV) for soft-short protection. Constant Current Under-  
Voltage Protection provides detailed description for this fault and fault response.  
20  
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Feature Description (接下页)  
7.3.8 Constant Current Under-Voltage Protection  
The constant current output under voltage shutdown (CCUV) feature is to provide protection for USB connectors  
from over-heat or burn-out due to soft-short circuit fault. A partial or soft-short can happen due to the presence of  
foreign objects at the terminals of the USB upstream facing port, UFP, for example, smartphones with USB  
Micro-B or USB Type-C connectors. When this happens along with the converter operates in CC mode with  
enough VDD voltage (VDD > VVDD(off)) available from auxiliary winding, the converter can sustain operation at this  
condition resulting in a potential USB burn-out condition which is named as soft-short fault to distinguish from a  
hard-short circuit fault. Traditional over-current protection and short-circuit protection cannot tell a soft-short fault.  
The UCC28704 provides protection when soft-short circuit fault occurs with the corresponding converter V-I  
characteristics as shown in 21.  
As shown in 22, the CCUV feature of UCC28704 detects the operation of the converter under this condition  
when the controller is operating in CC mode and when the output voltage drops out of regulation, reaching the  
CCUV threshold. If the controller detects that the VS pin voltage is below VCCUV threshold continuously for 120  
ms, then it initiates a CCUV fault and sets the CCUV latch. Once the CCUV latch is set, the controller goes  
through 3 cycles of VDD-UVLO without any PWM operation and clears the latch on the 4th VDD UVLO power-  
up. If the CCUV condition still exists, then the controller enters into CCUV fault after 120 ms and repeats the  
UVLO cycles. This 120-ms time delay allows converter normal start up without triggering the CCUV protection.  
The flyback design should allow output voltage rise above CCUV protection level under normal operating  
conditions within 120ms or the CCUV fault may be triggered.  
+/-5%  
5.25 V  
5.0  
4.75 V  
Board-End  
Cable-End  
4.0  
3.0  
2.0  
1.0  
3.0 V  
2.7 V  
0
IOCC  
Output Current (A)  
21. Typical Target Output V-I Curves  
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Feature Description (接下页)  
VBULK  
CC UV Fault œ Shutdown and Auto - Restart  
VDD(on)  
VDD  
VDD(off)  
2.5 mA  
mA  
2
1.5µA  
1.5µA  
1.5µA  
1.5µA  
1.5µA  
IVDD  
t
CCUV_ FAULT_ TIMER  
120 ms  
DRV  
DRV  
CCUV_ FAULT_ LATCH  
IOCC  
VOUT = VOCV  
_ CCUV  
VOUT  
VOUT  
IOUT  
22. Timing Diagram of CCUV and Output Re-Start  
22  
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Feature Description (接下页)  
7.3.9 Load Transient Response  
The UCC28704 can provide excellent transient performance for most load steps. However the response of PSR  
controller is always limited by the operating frequency of the converter, since the controller only samples or reads  
the output voltage once every switching cycle. At zero external load, or standby, the operating frequency is set  
by any preload together with the bias power needed. This frequency, fSW(standby), sets a maximum incremental  
response delay. The preload can always be adjusted, at the expense of standby power, to increase the standby  
frequency. The actual response delay depends on the relative timing of the load step within the switching cycle.  
Thus for a given load step, IOUT(step), the output deviation can be as large as:  
IOUT(step)  
DVOUT  
=
COUT ì fSW(s tandby)  
(8)  
In the case of repeating load transients the situation is aggravated. Whenever the load steps from a modest  
current level to zero, there is a period of time when there is a slight over-shoot in the output voltage and the  
control loop saturates and force the converter operating at to its minimum switching frequency, fSW(min), or 1 kHz  
regardless what preload setting is. If the next positive load step occurs during this time the output deviation will  
be larger, remembering that fSW(standby) must be > fSW(min)  
.
A special transient response algorithm in this controller dynamically adjusts the minimum controlled switching  
frequency, such that during a mid to high current level condition the loop's minimum switching frequency is raised  
to fSW(lim), typically 4 kHz. This raised minimum switching frequency is maintained following a load step-down  
change until the output voltage rises momentarily to 10% above its normal regulating level or has stayed above  
its normal regulating level for 500 ms. During this time the response to a load step-up change benefits from the  
decreased response delay afforded by the 4-kHz switching frequency. This is illustrated in 23. Application  
Curves provides test results and further description in regarding to this technique.  
In applications where standby power is not critical the minimum operating frequency of the  
loop can be kept higher than 4 kHz. In these cases controller will continuously maintain a  
4-kHz minimum frequency.  
Transient response from standby  
Periodic Transient Response  
VOUT(nom) x 1.1  
VOUT(nom)  
VOUT  
IOUT  
fSW(min) = 4 kHz  
fSW(min) = 4 kHz  
fSW(standby)  
fSW(min) = 1 kHz  
fSW(standby)  
fSW  
fSW(min)  
VOUT Recovers to nom Level,  
fSW(min) < fSW(standby)  
Standby Zero Load  
Steady State  
Load = 0,  
4 kHz > fSW(standby)  
Standby Zero Load  
Steady State  
Periodic Load Steps  
23. Dynamic Load Response  
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7.4 Device Functional Modes  
The UCC28704 operates in different modes according to input voltage, VDD voltage, and output load conditions:  
At start-up, when VDD is less than the turn-on threshold, VVDD(on) , the device is simply waiting for VDD to  
reach this threshold while the VDD capacitor is getting charged.  
When VDD exceeds VVDD(on), the device starts switching to deliver power to the converter output. The initial 3  
switching cycles control the primary-peak current to IPP(min). This allows sensing any initial input or output  
faults with minimal power delivery. When confirmed with input voltage above predetermined level and no fault  
conditions, start up process proceeds and normal power conversion follows. The converter will remain in  
discontinuous current mode operation during charging of the output capacitor(s), maintaining a constant  
output current until the output voltage reaches its regulation point.  
CV mode means that the converter keeps the output voltage constant. When the load current is less than  
the current limit level, the converter operates in CV mode to keep the output voltage at the regulation level  
over the entire load and input line ranges.  
CC mode means that the converter keeps the output current constant. When the output voltage is below  
the regulation level, the converter operates in CC mode to limit the output current.  
In CC mode, when the output voltage starts to drop below regulation and if it reaches below the CCUV  
threshold VCCUV, sensed at the VS pin, the controller declares a CCUV fault and disables PWM. The  
controller initiates a shutdown-restart operation. This protection mode helps avoid USB terminals from  
getting over-heated and thereby preventing a burn-out condition, which is also called soft-short protection.  
Detailed description is in Constant Current Under-Voltage Protection.  
When operating in CV mode where IPP reaches IPP(max), the UCC28704 operates continuously in the run state.  
In this state, the VDD bias current is always at IRUN plus the average gate-drive current.  
When operating in CV mode where IPP is less than IPP(max), the UCC28704 operates in the wait state between  
switching cycles and in the run state during a switching cycle. In the wait state, the VDD bias current is  
reduced to IWAIT after demagnetizing time of each switching cycle to improve efficiency at light loads. This  
helps reduce light-load power losses, particularly for achieving higher efficiency at 10% and 25% load  
conditions.  
When a dynamic load change occurs in CV mode, the UCC28704 provides an enhanced transient response  
to reduce load step caused VOUT dip in periodic load change operation. Detailed description is in Load  
Transient Response.  
The device operation can be stopped by the events listed below:  
If VDD drops below the VVDD(off) threshold, the device stops switching, its bias current consumption is  
lowered to ISTART until VDD rises above the VVDD(on) threshold. The device then resumes switching.  
If a fault condition is detected, the device stops switching and its bias current consumption becomes  
IFAULT. This current level discharges VDD to VVDD(off) where the bias current changes from IFAULT to ISTART  
until VDD rises above the VVDD(on) threshold.  
By pulling down NTC/SU pin to below VNTCTH, the device responds similar to that of an NTC fault wherein  
PWM is disabled and converter is shutdown. On releasing the pull-down on NTC, normal operation into  
CV mode will be restored.  
If a fault condition persists, the operation sequence described above in repeats until the fault condition or the  
input voltage is removed. Refer to Fault Protection for fault conditions and post-fault operation.  
24  
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8 Applications and Implementation  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
8.1 Application Information  
The UCC28704 device is a PSR controller optimized for isolated-flyback AC-to-DC single-output supply  
applications, typically in the range from 5 W to 25 W, providing constant-voltage (CV) mode control and constant  
current (CC) mode control for precise output regulation; and to help meet USB-compliant adaptors and charger  
requirements as well as help meeting DOE Level VI or CoC V5 Tier 2 efficiency performance. The device uses  
the information obtained from auxiliary winding sensing (VS) to control the output voltage without requiring  
optocoupler/TL431 feedback circuitry. Not requiring optocoupler feedback reduces the component count and  
makes the design more cost effective.  
8.2 Typical Application  
24 illustrates a typical circuit diagram for AC-to-DC adapter applications. It is a flyback converter with primary-  
side regulation (PSR) controlled by UCC28704. Such applications widely exist in ac-dc adapters for  
smartphones, tablet-computers, and e-readers and so forth. The following sub-sections provide critical design  
formulas.  
VBLK  
D1  
VREG  
COUT  
T1  
CB1  
NP  
NS  
VOUT  
wt[  
+
RSTR  
VAC  
UCC28704  
VDD  
D2  
VAUX  
2
6
CDD  
NA  
Q1  
w{1  
DRV  
3
4
VS  
CS  
w[/  
w{2  
1
NTC/SU  
GND  
5
w/{  
wbÇ/  
-t°  
24. Typical Application Circuit  
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Typical Application (接下页)  
8.2.1 Design Requirements  
The following table illustrates a typical subset of high-level design requirements for a particular converter of  
which many of the parameter values are used in the various design equations in this section. Many other  
necessary design parameters, such as fSW(MAX) and VBULK(min) for example, may not be listed in such a table.  
These values may be selected based on design experience or other considerations, and may be iterated to  
obtain optimal results.  
1. UCC28704 Design Parameters  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
INPUT CHARACTERISTICS  
VIN  
AC-line input voltage  
Line frequency  
85  
47  
115/230  
50/60  
43  
265  
63  
VRMS  
Hz  
fLINE  
PSTBY  
No-load input power  
VIN = typ, IO = 0A  
50  
mW  
OUTPUT CHARACTERISTICS (MEASUREMENT AT 150-mCABLE-END)  
VO  
DC output voltage  
Output voltage ripple  
Output rated current  
VIN = typ, IO = 0 to IOR  
VIN = typ, IO = IOR  
VIN = min to max  
VIN = typ, IO > IOR  
2.7V < VO < 5V  
4.75  
2.1  
5
5.25  
80  
V
mV  
A
VRIPPLE  
IOR  
2.0  
2.2  
2.7  
IOCC  
Output constant current  
2.3  
A
V
VCCUV  
ηAVG  
η10  
CC UV shutdown interception  
Average efficiency  
VIN= typ, IO = IOCC  
VIN= typ, average of 25%, 50%,  
75%, and 100% Load  
80%  
75%  
Light-load efficiency  
VIN= typ, 10% load  
SYSTEMS CHARACTERISTICS  
fsw  
Switching frequency  
1
65  
kHz  
s
VIN = min  
TON-Delay  
Power-on delay time  
1.8  
IO= IOR (constant resistor load)  
26  
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8.2.2 Detailed Design Procedure  
This procedure outlines the steps to design a constant-voltage, constant-current flyback converter using the  
UCC28704 controller. Please refer to the 24 for circuit details and section 器件命名规则 for variable definitions  
used in the applications equations below.  
8.2.2.1 VDD Capacitance, CDD  
The capacitance on VDD needs to supply the device operating current until the output of the converter reaches  
the target minimum operating voltage. At this time the auxiliary winding can sustain the voltage to the  
UCC28704. The total output current available to the load and to charge the output capacitors is the constant-  
current regulation target. The equation below assumes the output current of the flyback is available to charge the  
output capacitance until the minimum output voltage VOCC is achieved. The gate-drive current depends on  
particular MOSFET to be used. If with an estimated 1.0 mA of gate-drive current, CDD is determined by 公式 9.  
COUT ì VOCC  
I
+1.0mA ì  
(
)
RUN  
IOCC  
DD(on),min - VDD(off),max  
CDD  
=
V
(
)
(9)  
8.2.2.2 VDD Start-Up Resistance, RSTR  
Once the VDD capacitance is known, the start-up resistance from VBULK to achieve the power-on delay time  
(tSTR) target can be determined.  
2 ì V  
IN(min)  
RSTR  
=
VDD(on) ìCDD  
ISTART  
+
tSTR  
(10)  
8.2.2.3 Input Bulk Capacitance and Minimum Bulk Voltage  
Determine the minimum voltage on the input capacitance, CB1 and CB2 total, in order to determine the maximum  
Np to Ns turns ratio of the transformer. The input power of the converter based on target full-load efficiency,  
minimum input rms voltage, and minimum AC input frequency are used to determine the input capacitance  
requirement.  
Maximum input power is determined based on VOCV, IOCC, and the full-load efficiency target. An initial estimate of  
84% can be assumed for the full-load efficiency for a 5-V/2-A design.  
VOCV ìIOCC  
P =  
IN  
h
(11)  
公式 12 provides an accurate solution for input capacitance based on a target minimum bulk capacitor voltage.  
To target a given input capacitance value, iterate the minimum capacitor voltage to achieve the target  
capacitance.  
÷
VBULK(min)  
1
«
÷
÷
P ì 0.5 + ìarcsin  
IN  
p
÷
2 ì V  
IN(min)  
«
CBULK  
=
2VI2N(min) - VB2ULK(min) ì f  
(
)
LINE  
(12)  
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8.2.2.4 Transformer Turns Ratio, Inductance, Primary-Peak Current  
The maximum primary-to-secondary turns ratio can be determined by the target maximum switching frequency at  
full load, the minimum input capacitor bulk voltage, and the estimated DCM resonant time.  
Initially determine the maximum available total duty cycle of the on time and secondary conduction time based on  
target switching frequency and DCM resonant time. For DCM resonant time, assume 500 kHz if you do not have  
an estimate from previous designs. For the transition mode operation limit, the period required from the end of  
secondary current conduction to the first valley of the VDS voltage is ½ of the DCM resonant period, or 1 µs  
assuming 500-kHz resonant frequency. DMAX can be determined using 公式 13.  
t
R
DMAX = 1-  
ì fMAX ÷ -DMAGCC  
«
2
(13)  
Once DMAX is known, the maximum turns ratio of the primary to secondary can be determined with the equation  
below. DMAGCC is defined as the secondary diode conduction duty cycle during constant-current, CC, operation. It  
is set internally by the UCC28704 at 0.475. The total voltage on the secondary winding needs to be determined;  
which is the sum of VOCV, the secondary rectifier VF, and the cable compensation voltage (VOCBC). For the 5-V  
USB charger applications, a turns ratio range of 12 to 15 is typically used for a 10-W design.  
DMAX ì VBULK(min)  
NPS(max)  
=
DMAGCC ì V  
+ VF + VOCBC  
(
)
OCV  
(14)  
NPS is determined also with other design factors such as primary MOSFET, secondary rectifier diode, as well as  
secondary MOSFET if synchronous rectifier is used. Once an optimum turns-ratio is determined from a detailed  
transformer design, use this ratio for the following parameters.  
The UCC28704 controller constant-current regulation is achieved by maintaining DMAGCC = 0.475 at the  
maximum primary current setting. The transformer turns ratio and constant-current regulating voltage determine  
the current sense resistor for a target constant current limit.  
Since not all of the energy stored in the transformer is transferred to the secondary, a transformer efficiency term  
is included. This efficiency number includes the core and winding losses, leakage inductance ratio, and bias  
power ratio to rated output power. For a 5-V, 2-A charger example, bias power of 0.5% is a good estimate. An  
overall transformer efficiency of 94.5% is a good estimation of assuming 2% leakage inductance, 3% core and  
winding loss, and 0.5% bias power.  
RCS is used to program the primary-peak current with 公式 15:  
VCCR ìNPS  
RCS  
=
ì hXFMR  
2 ìIOCC  
(15)  
The primary transformer inductance can be calculated using the standard energy storage equation for flyback  
transformers. Primary current, maximum switching frequency, output and transformer efficiency are included in  
公式 16. Initially determine transformer primary current.  
Initially the transformer primary current should be determined. Primary current is simply the maximum current  
sense threshold divided by the current sense resistance.  
VCST(max)  
IPP(max)  
=
RCS  
(16)  
2ì V  
+ VF + VOCBC ìI  
(
)
OCV  
OCC  
LP =  
hXFMR ìIP2P(max) ì fMAX  
(17)  
The secondary winding to auxiliary winding transformer turns ratio (NAS) is determined by the lowest target  
operating output voltage in constant-current regulation and the VDD UVLO of the UCC28704. There is additional  
energy supplied to VDD from the transformer leakage inductance energy which allows a lower turns ratio to be  
used in many designs. The VOCC lower than CCUV level is not achievable because the CCUV protection is going  
to be triggered first.  
VDD(off) + VFA  
NAS  
=
VOCC + VF  
(18)  
28  
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8.2.2.5 Transformer Parameter Verification  
The transformer turns-ratio selected affects the MOSFET VDS and secondary rectifier reverse voltage so these  
should be reviewed. The UCC28704 controller requires a minimum on time of the MOSFET (tON) and minimum  
DMAG time (tDMAG(min)) of the secondary rectifier in the high line, minimum-load condition. The selection of fMAX, LP  
and RCS affects the minimum tON and tDMAG  
The secondary rectifier and MOSFET voltage stress can be determined by the equations below.  
IN(max) ì 2  
.
V
VREV  
=
+ VOCV + VOCBC  
NPS  
(19)  
For the MOSFET VDS voltage stress, an estimated leakage inductance voltage spike (VLK) needs to be included.  
VDSPK = V  
ì 2 + V  
+ VF + VOCBC ìNPS + VLK  
(
)
)
(
IN(max)  
OCV  
(20)  
The following equations are used to determine for the minimum tON target of 0.3 µs and minimum de-mag  
time, tDMAG(min), target of 1.7 µs. The minimum tDMAG(min) target needs to be typically 2.45 µs when a  
synchronous rectifier is used on the secondary-side instead of a Schottky diode rectifier. Additional details  
are provided in Design Considerations in Using with Synchronous Rectifiers.  
IPP(max)  
LP  
IN(max) ì 2  
tON(min)  
=
ì
KAM  
V
(21)  
(22)  
tON(min) ì VIN(max) ì 2  
tDMAG(min)  
=
NPS ì V  
+ VF  
(
)
OCV  
8.2.2.6 VS Resistor Divider, Line Compensation, and NTC  
The VS divider resistors determine the output voltage regulation point of the flyback converter, also the high-side  
divider resistor (RS1) determines the line voltage at which the controller enables continuous DRV operation. RS1  
is initially determined based on the transformer auxiliary to primary turns-ratio and the desired input voltage  
operating threshold.  
V
IN(run) ì 2  
RS1  
=
NPA ìIVSL(run)  
(23)  
The low-side VS pin resistor is selected based on desired VO regulation voltage. IVSL(run) is VS pin run current  
with a typical value 220 µA for a design.  
RS1 ì VVSR  
RS2  
=
NAS ì V  
+ VF - V  
(
)
OCV  
VSR  
(24)  
The UCC28704 can maintain tight constant-current regulation over input line by utilizing the line compensation  
feature. The line compensation resistor (RLC) value is determined by current flowing in RS1 and expected gate  
drive and MOSFET turn-off delay. Assume a 50-ns internal delay in the UCC28704.  
KLC ì RS1 ìRCS ì(tD + tGATE_ OFF)ìNPA  
RLC  
=
LP  
(25)  
The NTC function on NTC/SU-pin is to program with a NTC resistor for the desired over-temperature shutdown  
threshold. The shut-down threshold is 0.95 V with an internal 105-μA current source which results in a 9.05-kΩ  
thermistor shut-down threshold. The SU function on NTC/SU-pin is described in Initial Power-On with A  
Depletion-Mode FET. Pulling down this pin to GND stops switching and can be used for remote enable and  
disable control. This pin should be left floating if not used.  
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29  
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www.ti.com.cn  
8.2.2.7 Standby Power Estimate  
Assuming no-load standby power is a critical design parameter, determine the estimated no-load power based  
on target converter maximum switching frequency and output power rating. The following equation estimates the  
stand-by power of the converter.  
POUT ì fMIN  
K2AM ì fMAX  
PSB _ CONV  
@
(26)  
For a typical USB charger application, the bias power during no-load is approximately 2.1 mW. This is based on  
21-V VDD and 100-µA bias current. The output preload resistor can be estimated by VOCV and the difference in  
the converter stand-by power and the bias power. The equation for output preload resistance accounts for bias  
power estimated at 2.1 mW. Preload resistor value is estimated in 公式 27 :  
VO2CV  
RPL  
=
PSB _ CONV - 2.1mW  
(27)  
Typical start-up resistance values for RSTR range from 10 Mto 15 Mto achieve less than 2-s start-up time.  
The capacitor bulk voltage for the loss estimation is the highest voltage for the stand-by power measurement,  
typically 325 VDC  
.
2
(VBULK - VDD  
)
PRSTR  
=
RSTR  
(28)  
For the total stand-by power estimation add an estimated 2.5 mW for snubber loss to the start-up resistance and  
converter stand-by power loss.  
PSB = PSB _ CONV + PRSTR + PSNBR  
(29)  
8.2.2.8 Output Capacitance  
The output capacitance value is typically determined by the transient response requirement from no-load. For  
example, in some USB charger applications there is a requirement to maintain a minimum VO of 4.1 V with a  
load-step transient of 0 mA to 500 mA . 公式 30 assumes that the switching frequency can be at the UCC28704  
minimum of fSW(min)  
.
1
ITRAN  
+ 50ms  
«
÷
÷
fSW(min)  
COUT  
=
DVO  
(30)  
公式 5 should be observed together with 公式 30 for stability consideration when determine COUT  
.
Another consideration of the output capacitor(s) is the ripple voltage requirement. The output capacitors and their  
total ESR are the main factors to determine the output voltage ripple. 公式 31 provides a formula to determine  
required ESR value RESR, and 公式 31 provides a formula to determine required capacitance. The total output  
ripple is the sum of these two parts with scale factors and 10mV to consider other noise as shown in 公式 33,  
1
RESR  
=
ì VRIPPLE_R  
IPP(max) ìNPS  
(31)  
LP ìIP2P(max)  
1
COUT  
=
ì
4 ì(VOCV + VCBC  
)
VRIPPLE _ C  
(32)  
(33)  
VRIPPLE = 0.81ì VRIPPLE_R +1.15ì VRIPPLE_C +10mV  
Example: if require VRIPPLE = 70 mV, assume 0.81 × VRIPPLE_R = 1.15 × VRIPPLE_C = 30 mV, then RESR = 4.05  
m, and COUT = 643 µF, with assumption of LP = 700 µH, IPP(max) = 0.713 A, NPS = 13, VOCV = 5 V, VCBC = 0.3 V.  
30  
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8.2.2.9 Design Considerations in Using with Synchronous Rectifiers  
Special design considerations need to be observed when using synchronous rectifiers (SR) with the UCC28704.  
14 depicts the de-mag time partition. When using UCC28704 with SR, a portion of the de-mag time needs to  
be reserved for tbw, as shown in 25, which is the body diode conduction time when SR MOSFET turns off  
before the de-mag time ends.  
tLK_RESET  
tBW  
VS ring p-p  
(scaled)  
0 V  
RS2 / (RS1 + RS2  
)
tDM_BLANK  
tDMAG  
tSW  
25. Auxiliary Waveform Details  
The critical parameter dictating the maximum switching frequency when UCC28704 is used with an SR is  
determined based on tDMAG(min). The tDMAG(min) needs to be typically 2.45 µs including the SR bump width (tBW) is  
750 ns. The 750-ns (tBW) is required for the internal circuit to filter out the SR bump change caused by MOSFET  
body diode conduction that is sensed on the VS pin waveform. The corresponding switching frequency measured  
at starting point of constant current operation should not be greater than 55 kHz.  
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31  
 
UCC28704  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
8.2.3 Application Curves  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
85.0%  
80.0%  
75.0%  
70.0%  
65.0%  
60.0%  
Board-End (115Vac)  
Board-End (230Vac)  
0.15W Cable-End (115Vac)  
0.15W Cable-End (230Vac)  
Board-End  
Cable-End (150mW)  
10% 20% 30% 40% 50% 60% 70% 80% 90% 100%  
Output Power  
D026  
0.0  
0.2  
0.5  
0.8  
1.0  
1.2  
1.5  
1.8  
2.0  
2.2  
Iout (A)  
D027  
26. Efficiency  
27. Output V-I Curves  
120 ms  
VOUT  
VDD(on)  
(1)  
(2)  
(3)  
(4)  
VDD  
VDD(off)  
IOUT  
10 ms  
VOUT  
2 A  
fsw  
fsw > 4 kHz  
IOUT  
4 kHz  
< 4 kHz  
DRV  
28. Soft-Short Protection  
29. Response to Load Step-Down  
1.1 x VOCV  
VOUT  
5.45 V  
VOCV (V)  
4.44 V  
10 ms  
IOUT  
2 A  
0 A  
200 ms  
31. Typical Output Load Transient Response  
30. Typical VOUT Start Up at No Load  
32  
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UCC28704  
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ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
26 shows efficiency test result based on a 5-V/2-A, 10-W adapter using UCC28704. The efficiency  
performance exceeds CoC V5 Tier 2 (79% for average and 69.7% for a 10%-load) and DOE Level VI (78.7% for  
average) measured at 150-mcable-end. As comparison, the measured result at board-end shown in 26.  
27 shows typical VI curves from the same 10-W board. The board-end output voltage has cable compensation  
to achieve cable-end output voltage with very well-regulated result in constant voltage mode operation range. In  
constant current mode operation, the result depicts a good constant current operation from the vertical line of  
current along with the output voltage drop until reaches CCUV. Notice that the CCUV difference at board-end  
and at cable-end is about 300 mV that is the same as cable compensation voltage at full load.  
28 illustrates the timing diagram when the operation is in CCUV. The response of the controller to a soft-short  
circuit is shown wherein VOUT reaches to less than the VCCUV threshold. The converter is in CC mode and any  
additional load tending higher than IOCC causes VOUT to drop below regulation due to the soft-short. As VOUT is  
able to sustain VDD above its UVLO and the soft-short circuit condition persists continuously for 120 ms, the  
CCUV fault is initiated. The waveform shows the 3 VDD UVLO cycles that the controller goes through after the  
fault and it attempts to restart on the 4th VDD UVLO cycle with the response repeating due to the sustained soft  
short-circuit fault. The 120 ms is to blank any possible noise interference which may cause unnecessary CCUV  
protection to interrupt a normal operation.  
29 provides the test result to explain the enhanced load transient scheme that is described in Load Transient  
Response. When the load steps down and demands a lower switching frequency, the controller clamps the  
switching frequency at 4 kHz until either the output has gone above its regulation level for more than 500 ms or  
has reached more than 10% of its VOCV. This enables the converter to have a better response to an ensuing load  
step up from the reduced response time. If either of the condition is met, then the controller starts to adjust the  
fSW below 4 kHz if the converter operation demands such a frequency.  
Associated to this enhancement, the output voltage may experience a 10% overshoot as shown in 29 during a  
load step-down or as shown in 30 during a no-load start up.  
31 shows the output load transient with load step change between 0-A and 2-A full load.  
8.3 Do's and Don'ts  
During no-load operation, do allow sufficient margin for variations in VDD level to avoid the UVLO shutdown  
threshold. Also, at no-load, keep the average switching frequency greater than 1.5 × fSW(min) typical to avoid a  
rise in output voltage. RLC needs to be adjusted based on no-load operation accounting for both low-line and  
high-line operation..  
Do clean flux residue and contaminants from the PCB after assembly. Uncontrolled leakage current from VS  
to GND causes the output voltage to increase, while leakage current from VDD to VS can cause output  
voltage to increase.  
If ceramic capacitors are used for VDD, do use quality parts with X7R or X5R dielectric rated 50 V or higher  
to minimize reduction of capacitance due to DC-bias voltage and temperature variation.  
Do not use leaky components if low stand-by input power consumption is a design requirement.  
Do not probe the VS node with an ordinary oscilloscope probe; the probe capacitance can alter the signal and  
disrupt regulation.  
Do observe VS indirectly by probing the auxiliary winding voltage at RS1 and scaling the waveform by the VS  
divider ratio.  
Do follow 公式 5, 公式 30, 公式 31 to 公式 33 for COUT  
.
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33  
UCC28704  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
9 Power Supply Recommendations  
The UCC28704 is intended for AC-to-DC adapters and chargers with universal input voltage range of 85 VRMS to  
265 VRMS, 47 Hz to 63 Hz, using flyback topology. It can also be used in other applications and converter  
topologies with different input voltages. Be sure that all voltages and currents are within the recommended  
operating conditions and absolute maximum ratings of the device.  
10 Layout  
10.1 Layout Guidelines  
In order to increase the reliability and feasibility of the project it is recommended to adhere to the following  
guidelines for PCB layout. In 32, a typical 5-V/2-A USB adapter design schematic is shown in 32.  
Minimize stray capacitance on the VS node. Place the voltage sense resistors (RS1 and RS2 in 24) close to  
the VS pin.  
Arrange the components to minimize the loop areas of the switching currents as much as possible. These  
areas include such loops as the transformer primary winding current loop (a), the MOSFET gate-drive loop  
(b), the primary snubber loop (c), the auxiliary winding loop (d) and the secondary output current loop (e). In  
practice, trade-offs may have to be made. Loops with higher current should be minimized with higher priority.  
As a rule of thumb, the priority goes from high to low as (a) – (e) – (c) – (d) – (b).  
The RLC resistor location is critical. To avoid any dv/dt induced noise (for example MOSFET drain dv/dt)  
coupled onto this resistor, it is better to place RLC closer to the controller and avoid nearby the MOSFET.  
To improve thermal performance increase the copper area connected to GND pins.  
T1  
VBLK  
D1  
+
-
COUT  
CB1  
CB2  
NP  
NS  
VOUT  
wt[  
+
(e)  
(a)  
CSN1  
DSN1  
L
(C)  
w{b1  
RSTR  
w{b2  
Optional, short  
across if not used  
VAC  
DIN  
N
UCC28704  
VDD  
D2  
VAUX  
Q1  
2
wD1  
CDD  
NA  
w{1  
DRV  
3
(B)  
6
1
VS  
CS  
w[/  
Isolation  
Boundary  
4
(d)  
w{2  
NTC/SU  
GND  
5
w/{  
CY  
wbÇ/  
-t°  
32. 10-W, 5-V/2-A USB Adapter Schematics  
34  
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UCC28704  
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ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
10.2 Layout Example  
33 demonstrates a 10-W, 5-V/2-A, layout with trade-offs to minimize the loops while effectively placing  
components and tracks for low noise operation on a single-layer printed circuit board. In addition to the  
consideration of minimal loops, one another layout guideline is always to use the device GND as reference point.  
This applies to both power and signal to return to the device GND pin (pin 5).  
CO1  
Loop (e)  
Loop (c)  
D1  
Transformer Isolation Boundary  
Loop (a)  
+ VOUT  
-
Y-Cap  
Loop (b)  
CB2  
Loop (d)  
UCC28704  
Input Rectifier DIN  
33. Layout Example  
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11 器件和文档支持  
11.1 器件支持  
11.1.1 器件命名规则  
11.1.1.1 电容术语(以法拉为单位)  
CBULK  
CDD  
CB1 CB2 的总输入电容。  
VDD 引脚所需的最小电容。  
COUT  
所需的最小输出电容。  
11.1.1.2 占空比术语  
DMAGCC CC 中二次侧二极管导通占空比,0.475。  
DMAX 最大 MOSFET 导通时间占空比。  
11.1.1.3 频率术语(以赫兹为单位)  
fLINE  
最低线路频率。  
fMAX  
转换器的最高目标满载开关频率。  
fMIN  
转换器的最低开关频率,在器件 fSW(min)限值基础上增加 15% 的裕度。  
负载减小后的瞬态开关频率  
fSW(lim)  
FSW(min)  
fSW(max)  
最低开关频率(见Electrical Characteristics表)  
最大开关频率(见Electrical Characteristics表)  
fSW(standby) 轻负载条件下负载变化之前的开关频率  
11.1.1.4 电流术语(以安培为单位)  
IOCC  
转换器输出恒流目标。  
IOR  
转换器额定输出电流。  
IPP(max)  
ISTART  
ITRAN  
IVSL(run)  
IWAIT  
变压器一次侧最大电流。  
启动偏置电源电流(见Electrical Characteristics表)。  
所需的正负载阶跃电流。  
VS 引脚运行电流(见Electrical Characteristics表)。  
等待状态期间的 VDD 偏置电流。(见Electrical Characteristics表)。  
11.1.1.5 电流和电压调节术语  
KAM  
KCo  
KLC  
一次侧峰峰值电流比(见Electrical Characteristics表)。  
稳定性因子为 100,用于计算 COUT  
电流调节常量(见Electrical Characteristics表)。  
36  
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UCC28704  
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ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
器件支持 (接下页)  
11.1.1.6 变压器术语  
LP  
变压器一次侧电感。  
LS  
变压器二次侧电感。  
NAS  
NPA  
NPS  
NA  
变压器辅助绕组与二次侧绕组匝数比。  
变压器一次侧绕组与辅助绕组匝数比。  
变压器一次侧绕组与二次侧绕组匝数比。  
变压器辅助绕组的匝数。  
NP  
变压器一次侧绕组的匝数。  
NS  
变压器二次侧绕组的匝数。  
11.1.1.7 功率术语(以瓦特为单位)  
PIN  
转换器最大输入功率。  
转换器的满载输出功率。  
VDD 启动电阻功耗。  
总待机功耗。  
POUT  
PRSTR  
PSB  
PSB_CONV  
PSB 与启动电阻和缓冲器功耗的差值。  
11.1.1.8 电阻术语(以 Ω 为单位)  
RCS  
RESR  
RPL  
一次侧电流编程电阻  
输出电容的总 ESR。  
转换器输出端的预载电阻。  
高侧 VS 引脚电阻。  
RS1  
RS2  
低侧 VS 引脚电阻。  
RSTR  
高电压与 VDD 之间连接的启动电阻  
11.1.1.9 时序术语(以秒为单位)  
tD  
电流感测延迟。  
tDMAG(min)  
tGATE_OFF  
tON(min)  
tR  
二次侧整流器最短导通时间。  
一次侧主 MOSFET 关断时间。  
MOSFET 最短导通时间。  
tDMAG 之后的谐振环周期。  
tSTR  
由于 VDD 电容 CDD 需要充电时间所造成的上电延时。  
tZTO  
tZTO:未检测到过零点时 VS 引脚上的过零点超时延迟(见Electrical Characteristics表)  
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37  
UCC28704  
ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
www.ti.com.cn  
器件支持 (接下页)  
11.1.1.10 电压术语(以伏特为单位)  
VBLK VBULK 大容量电容电压。  
VBULK(max)  
VBULK(min)  
VBULK(run)  
VCBC  
用于待机功耗测量的大容量电容最高电压。  
满功率条件下 CB1CB2 的最低电压。  
转换器启动(运行)高电压。  
满载时电路板端输出的电缆补偿电压。  
VCCR  
恒流调节电压(见Electrical Characteristics表)。  
恒流输出电压关断的 VS 阈值(见Electrical Characteristics表)  
CS 引脚的最大电流感测阈值(见Electrical Characteristics表)。  
CS 引脚的最小电流感测阈值(见Electrical Characteristics表)。  
UVLO 关断电压(见Electrical Characteristics表)。  
UVLO 导通电压(见Electrical Characteristics表)。  
电流接近零时的二次侧整流器正向压降。  
辅助整流器正向压降。  
VCCUV  
VCST(max)  
VCST(min)  
VVDD(off)  
VVDD(on)  
VF  
VFA  
VLK  
估计的漏感能量复位电压。  
VOCV  
经稳压的转换器输出电压。  
VOCC  
恒流稳压条件下的最低目标转换器输出电压。  
满载条件下的输出峰峰值纹波电压。  
VRIPPLE  
VVSR  
VS 输入端的 CV 调节电平(见Electrical Characteristics表)。  
11.1.1.11 交流电压术语(以 VRMS 为单位)  
VIN(max)  
VIN(min)  
VIN(run)  
转换器的最大输入电压。  
转换器的最小输入电压。  
转换器输入启动(运行)电压。  
11.1.1.12 效率术语  
η
转换器总体效率。  
η10  
10% 负载时的效率。  
ηAVG  
ηXFMR  
25%50%75% 100% 负载时的算术平均效率。  
变压器一次侧与二次侧之间的功率传输效率。  
38  
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UCC28704  
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ZHCSEQ1A FEBRUARY 2016REVISED FEBRUARY 2016  
11.2 文档支持  
11.2.1 相关文档ꢀ  
相关文档如下:  
《使用 UCC28704-1EVM-724,评估模块》SLUUBF1  
11.3 社区资源  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
11.4 商标  
E2E is a trademark of Texas Instruments.  
11.5 静电放电警告  
这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损  
伤。  
11.6 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
12 机械、封装和可订购信息  
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对  
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。  
版权 © 2016, Texas Instruments Incorporated  
39  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
UCC28704DBVR-1  
UCC28704DBVT-1  
ACTIVE  
ACTIVE  
SOT-23  
SOT-23  
DBV  
DBV  
6
6
3000 RoHS & Green  
250 RoHS & Green  
NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 125  
-40 to 125  
7041  
7041  
NIPDAU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
Addendum-Page 2  
PACKAGE OUTLINE  
DBV0006A  
SOT-23 - 1.45 mm max height  
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR  
C
3.0  
2.6  
0.1 C  
1.75  
1.45  
B
1.45 MAX  
A
PIN 1  
INDEX AREA  
1
2
6
5
2X 0.95  
1.9  
3.05  
2.75  
4
3
0.50  
6X  
0.25  
C A B  
0.15  
0.00  
0.2  
(1.1)  
TYP  
0.25  
GAGE PLANE  
0.22  
0.08  
TYP  
8
TYP  
0
0.6  
0.3  
TYP  
SEATING PLANE  
4214840/C 06/2021  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.  
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.  
5. Refernce JEDEC MO-178.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
DBV0006A  
SOT-23 - 1.45 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
6X (1.1)  
1
6X (0.6)  
6
SYMM  
5
2
3
2X (0.95)  
4
(R0.05) TYP  
(2.6)  
LAND PATTERN EXAMPLE  
EXPOSED METAL SHOWN  
SCALE:15X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
EXPOSED METAL  
EXPOSED METAL  
0.07 MIN  
ARROUND  
0.07 MAX  
ARROUND  
NON SOLDER MASK  
DEFINED  
SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK DETAILS  
4214840/C 06/2021  
NOTES: (continued)  
6. Publication IPC-7351 may have alternate designs.  
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
DBV0006A  
SOT-23 - 1.45 mm max height  
SMALL OUTLINE TRANSISTOR  
PKG  
6X (1.1)  
1
6X (0.6)  
6
SYMM  
5
2
3
2X(0.95)  
4
(R0.05) TYP  
(2.6)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
SCALE:15X  
4214840/C 06/2021  
NOTES: (continued)  
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
9. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
重要声明和免责声明  
TI 提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,不保证没  
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将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他 TI 知识产权或任何第三方知  
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的约束。TI 提供这些资源并不会扩展或以其他方式更改 TI 针对 TI 产品发布的适用的担保或担保免责声明。IMPORTANT NOTICE  
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