UCC2912 [TI]

PROGRAMMABLE HOT SWAP POWER MANAGER; 可编程热插拔电源管理器


型号：	UCC2912
厂家：	TEXAS INSTRUMENTS
描述：	PROGRAMMABLE HOT SWAP POWER MANAGER 可编程热插拔电源管理器
文件：	总16页 (文件大小：659K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ꢀ ꢁꢁ ꢂꢃ ꢄꢂ

ꢀ ꢁꢁ ꢅꢃ ꢄꢂ

ꢆꢇꢈ ꢉ ꢇꢊꢋ ꢋ ꢊꢌꢍ ꢎ ꢏꢈ ꢐ ꢑꢒꢊꢆ ꢆꢈ ꢒ ꢎꢇ ꢋ ꢊꢓ ꢊ ꢉꢎ ꢇ

ꢔ

SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003

Integrated 0.15-Ω Power MOSFET

3-V to 8-V Operation

Unidirectional Switch

Thermal Shutdown

Fault-Output Indicator

Digital Programmable Current Limit

from 0 A to 3 A

Maximum-Output Current Can Be Set to 1 A

Above the Programmed Fault Level or to a

Full 4 A

Electronic Circuit Breaker Function

1µA I

When Disabled

Power SOIC, Low-Thermal Resistance

Packaging

Programmable On-Time

Programmable Start Delay

Fixed 3% Duty Cycle

description

The UCC3912 family of hot swap power managers provides complete power management, hot swap capability,

and circuit breaker functions. The only component required to operate the device, other than supply bypassing,

is the fault timing capacitor, C . All control and housekeeping functions are integrated, and externally

programmable. These include the fault current level, maximum output-sourcing current, maximum fault time,

and startup delay. In the event of a constant fault, the internal fixed 3% duty cycle ratio limits average output

power.

The internal 4-bit DAC allows programming of the fault level current from 0 A to 3 A with 0.25-A resolution. The

IMAX control pin sets the maximum sourcing current to 1 A above the fault level when driven low, and to a full

4 A when driven high for applications which require fast output capacitor charging.

When the output current is below the fault level, the output MOSFET is switched on with a nominal on resistance

of 0.15 Ω. When the output current exceeds the fault level, but is less than the maximum sourcing level, the

output remains switched on, but the fault timer starts charging C . Once C charges to a preset threshold, the

switch is turned off, and remains off for 30 times the programmed fault time. When the output current reaches

the maximum sourcing level, the MOSFET transitions from a switch to a constant current source. (continued)

block diagram

H = 4 A

VIN

IMAX 10

30 mV

REVERSE VOLTAGE

COMPARATOR

CHARGE

PUMP

−

OUT

CURRENT SENSE

4 A

POWER

FET

−

MAX CURRENT

LEVEL

LINEAR CURRENT AMPLIFIER

H = OPEN

1 A

ABOVE

FAULT

ON TIME

CONTROL

14 VOUT

15 VOUT

CURRENT FAULT

LEVEL 0A TO 3 A

−

3% DUTY

CYCLE

THERMAL

SHUTDOWN

OVERCURRENT

COMPARATOR

1.5 V

0 A−3 A

0.25

RES

−

INTERNAL

BIAS

SHTDWN

13 12

UDG-99146

B3 B2 B1 B0

4 BIT DAC

GND

FAULT

HEATSINK

GND PINS

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

ꢆ

ꢇ

ꢈ

ꢦ

ꢕ

ꢡ

ꢀ

ꢁ

ꢟ

ꢐ

ꢠ

ꢖ

ꢚ

ꢈ

ꢘ

ꢓ

ꢙ

ꢕ

ꢊ

ꢐ

ꢊ

ꢗ

ꢘ

ꢢ

ꢙ

ꢚ

ꢠ

ꢛ

ꢜ

ꢝ

ꢞ

ꢗ

ꢚ

ꢘ

ꢗ

ꢟ

ꢣ

ꢠ

ꢡ

ꢛ

ꢢ

ꢘ

ꢞ

ꢝ

ꢜ

ꢟ

ꢚ

ꢙ

ꢣ

ꢐꢢ

ꢡ

ꢤ

ꢟ

ꢥ

ꢗ

ꢠ

ꢝ

ꢟ

ꢞ

ꢗ

ꢞ

ꢚ

ꢛ

ꢘ

ꢡ

ꢦ

ꢝ

ꢘ

ꢞ

ꢢ

ꢟ

ꢧ

ꢛ

ꢚ

ꢠ

ꢞ

ꢚ

ꢛ

ꢜ

ꢞ

ꢚ

ꢟ

ꢣ

ꢗ

ꢙ

ꢗ

ꢠ

ꢢ

ꢛ

ꢞ

ꢨ

ꢞ

ꢢ

ꢛ

ꢚ

ꢙ

ꢩ

ꢝ

ꢖ

ꢘ

ꢜ

ꢢ

ꢟ

ꢞ

ꢝ

ꢘ

ꢦ

ꢝ

ꢛ

ꢦ

ꢪ

ꢝ

ꢞ ꢢ ꢟ ꢞꢗ ꢘꢬ ꢚꢙ ꢝ ꢥꢥ ꢣꢝ ꢛ ꢝ ꢜ ꢢ ꢞ ꢢ ꢛ ꢟ ꢧ

ꢛ

ꢝ

ꢘ

ꢞ

ꢫ

ꢧ

ꢆ

ꢛ

ꢚ

ꢦ

ꢡ

ꢠ

ꢞ

ꢗ

ꢚ

ꢘ

ꢣ

ꢛ

ꢚ

ꢠ

ꢢ

ꢟ

ꢗ

ꢘ

ꢬ

ꢦ

ꢚ

ꢢ

ꢟ

ꢘ

ꢚ

ꢞ

ꢘ

ꢢ

ꢠ

ꢢ

ꢟ

ꢝ

ꢛ

ꢗ

ꢥ

ꢫ

ꢗ

ꢘ

ꢠ

ꢥ

ꢡ

ꢦ

ꢢ

www.ti.com

ꢀ

ꢁ

ꢈ

ꢂ

ꢅ

ꢉ

ꢃ

ꢇ

ꢄ

ꢊ

ꢂ

ꢋ

ꢔ

ꢆ

ꢇ

ꢋ

ꢊ

ꢌ

ꢍ

ꢎ

ꢏ

ꢈ

ꢐ

ꢑ

ꢒ

ꢊ

ꢆ

ꢈ

ꢒ

ꢎ

ꢇ

ꢋ

ꢊ

ꢓ

ꢊ

ꢉ

ꢎ

ꢇ

SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003

description (continued)

The UCC3912 family is designed for unidirectional current flow, emulating an ideal diode in series with the power

switch. This feature is particularly attractive in applications where many devices are powering a common bus,

such as with SCSI Termpwr.

The UCC3912 family can be put into sleep mode drawing only 1-µA of supply current. The SHTDWN pin has

a preset threshold hysteresis which allows the user the ability to set a time delay upon startup to achieve

sequencing of power. Other features include an open drain FAULT output indicator, thermal shutdown, under

voltage lockout, and a low thermal resistance small outline package.

†}

absolute maximum ratings over operating free-air temperature (unless otherwise noted)

VIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V

FAULT sink current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA

FAULT voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to V

Output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting

Input voltage

(B0, B1, B2, B3, IMAX, SHTDWN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to V

Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to 150°C

stg

Operating junction temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to 150°C

Lead temperature (soldering, 10 sec.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C

†

‡

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the Interface Products Data book (TI Literature

Number SLUD002) for thermal limitations and considerations of packages.

package information

TSSOP-24,

PWP Package

(TOP VIEW)

DIL-16, SOIC-16

N, DP Package

(TOP VIEW)

SHTDWN1

N/C 2

24 FAULT

23 N/C

VIN 3

22 VOUT

21 VOUT

20 GND*

19 GND*

18 GND*

17 GND*

16 GND*

15 CT

VIN

GND* 5

GND* 6

GND* 7

GND* 8

EGND* 9

B3 10

B2 11

14 IMAX

13 B0

B1 12

*Pin 5 serves as lowest impedance to the electrical

ground; Pins 4, 12, and 13 serve as heat sink/ground.

These pins should be connected to large etch areas to

help dissipate heat. For N package, pins 4, 12, and 13

are N/C.

*Pin 9 serves as lowest impedance to the electrical ground;

other GND pins serve as heat sink/ground. These pins should

be connected to large etch areas to help dissipate heat.

www.ti.com

ꢀ ꢁꢁ ꢂꢃ ꢄꢂ

ꢀ ꢁꢁ ꢅꢃ ꢄꢂ

ꢆꢇꢈ ꢉ ꢇꢊꢋ ꢋ ꢊꢌꢍ ꢎ ꢏꢈ ꢐ ꢑꢒꢊꢆ ꢆꢈ ꢒ ꢎꢇ ꢋ ꢊꢓ ꢊ ꢉ ꢎꢇ

ꢔ

SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003

electrical characteristics, these specifications apply for T = −40°C to 85°C for the UCC2912;

= 0°C to 70°C for the UCC3912, VIN = 5 V, IMAX = 0.4 V, SHTDWN = 2.4 V

(unless otherwise stated)

supply section

PARAMETER

Voltage input range

Supply current

TEST CONDITIONS

MIN

3.0

TYP

MAX

8.0

UNITS

1.0

0.5

2.0

5.0

µA

Sleep mode current

SHTDWN = 0.2 V

NOTE 1: All voltages are with respect to ground. Current is positive into and negative out of the specified terminal.

output section

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNITS

= 1 A

= 2 A

= 3 A

= 1A,

= 2 A,

= 3 A,

0.15

0.3

0.22

0.45

0.68

0.27

0.56

0.8

OUT

0.45

0.17

0.35

0.5

Voltage drop

VIN = 3 V

Reverse leakage current

Initial startup time

< V

OUT

SHTDWN = 0.2 V, V

= 5 V

OUT

µA

µs

°C

See Note 2

100

170

Short circuit response

Thermal shutdown

Thermal hysteresis

NOTE 1: All voltages are with respect to ground. Current is positive into and negative out of the specified terminal.

NOTE 2: Ensured by design. Not production tested.

DAC section

PARAMETER

TEST CONDITIONS

Code = 0000−0011

MIN

TYP

MAX

UNITS

µA

Output leakage

0.25

0.50

0.75

1.00

1.25

1.50

1.75

2.00

2.25

2.50

2.75

3.0

0.45

0.75

1.0

Code = 0100

Code = 0101

0.1

0.25

0.5

Code = 0110

Code = 0111

0.75

1.0

1.25

1.5

Code = 1000

Code = 1001

1.25

1.5

1.75

2.0

Trip current

Code = 1010

Code = 1011

1.7

2.3

Code = 1100

1.9

2.58

2.9

Code = 1101

2.1

Code = 1110

2.3

3.2

Code = 1111

2.5

3.5

Maximum output current

Code = 0000 to 0011

UCC2912 Code = 0100 to 1111,

UCC3912 Code = 0100 to 1111,

0.02

2.0

= 0 V

0.5

3.0

1.0

4.0

MAX

Maximum output current over trip

(current source mode)

= 0 V

1.8

Maximum output current (current source mode)

Code = 0100 to 1111,

= 2.4 V

5.2

NOTE 1: All voltages are with respect to ground. Current is positive into and negative out of the specified terminal.

www.ti.com

ꢀ

ꢁ

ꢈ

ꢂ

ꢅ

ꢉ

ꢃ

ꢇ

ꢄ

ꢊ

ꢂ

ꢋ

ꢔ

ꢆ

ꢇ

ꢋ

ꢊ

ꢌ

ꢍ

ꢎ

ꢏ

ꢈ

ꢐ

ꢑ

ꢒꢊ

ꢆ

ꢈ

ꢒ

ꢎ

ꢇ

ꢋ

ꢊ

ꢓ

ꢊ

ꢉ

ꢎ

ꢇ

SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003

electrical characteristics, these specifications apply for T = −40°C to 85°C for the UCC2912;

= 0°C to 70°C for the UCC3912, VIN = 5 V, IMAX = 0.4 V, SHTDWN = 2.4 V

(unless otherwise stated)

timer section

PARAMETER

TEST CONDITIONS

MIN

−45.0

0.72

2.0

TYP

-36.0

MAX

−22.0

1.57

1.50

6.0

UNITS

µA

CT charge current

= 1.0 V

UCC2912

UCC3912

1.20

3.0

CT discharge current

Output duty cycle

CT fault threshold

CT reset threshold

= 0 V

OUT

1.3

1.5

1.7

0.4

0.5

0.6

NOTE 1: All voltages are with respect to ground. Current is positive into and negative out of the specified terminal.

shutdown section

PARAMETER

Shutdown threshold

TEST CONDITIONS

MIN

1.1

TYP

MAX

UNITS

1.5

100

1.9

Shutdown hysteresis

Input current

SHTDWN = 1 V

500

fault output section

PARAMETER

Output leakage current

Low level output voltage

TEST CONDITIONS

MIN

TYP

MAX

500

0.8

UNITS

= 10 mA

0.4

OUT

TTL input dc characteristics section

PARAMETER

TYP

MAX

UNITS

TTL input voltage high

TTL input voltage low

TTL input high current

TTL input low current

(can be connected to V

)

2.0

0.8

= 2.4 V

= 0.4 V

µA

NOTE 1: All voltages are with respect to ground. Current is positive into and negative out of the specified terminal.

pin description

B0−B3: These pins provide digital input to the DAC which sets the fault current threshold. They can be used

to provide a digital soft-start, adaptive current limiting.

CT: A capacitor connected to ground sets the maximum fault time. The maximum fault time must be more than

the time to charge the external capacitance in one cycle. The maximum fault time is defined as

FAULT = 27.8 × 10 × CT. Once the fault time is reached the output will shutdown for a time given by:

= 833 × 10 × CT, this equates to a 3% duty cycle.

FAULT: Open drain output which pulls low upon any condition which causes the output to open: fault, thermal

shutdown, or shutdown.

IMAX: When this pin is set to logic low the maximum sourcing current will always be 1 A above the programmed

fault level. When set to logic high, the maximum sourcing current will be a constant 4 A for applications which

require fast charging of load capacitance.

www.ti.com

ꢀ ꢁꢁ ꢂꢃ ꢄꢂ

ꢀ ꢁꢁ ꢅꢃ ꢄꢂ

ꢆꢇꢈ ꢉ ꢇꢊꢋ ꢋ ꢊꢌꢍ ꢎ ꢏꢈ ꢐ ꢑꢒꢊꢆ ꢆꢈ ꢒ ꢎꢇ ꢋ ꢊꢓ ꢊ ꢉ ꢎꢇ

ꢔ

SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003

pin description (continued)

SHTDWN: When this pin is brought to a logic low, the IC is put into a sleep mode drawing typically less than

1 µA of I . The input threshold is hysteretic, allowing the user to program a startup delay with an external RC

circuit.

VIN: Input voltage to the UCC3912. The recommended voltage range is 3 V to 8 V. Both VIN pins should be

connected together and to the power source.

VOUT: Output voltage from the UCC3912. When switched the output voltage will be approximately

− (0.15 Ω × I

). Both VOUT pins should be connected together and to the load.

OUT

APPLICATION INFORMATION

12 13

GND

HEAT SINK

GND PINS

OUT

VIN

VOUT

OUT

UCC2912

UCC3912

LED

16 FAULT

11 CT

SHTDWN

B0 IMAX

DIP

SWITCH

NOTE: For demonstration board schematic see Design Note DN-58 (TI Literature Number SLUA187).

UDG-99171

Figure 1. Evaluation Circuit

protecting the UCC3912 from voltage transients

The parasitic inductance associated with the power distribution can cause a voltage spike at V if the load

current is suddenly interrupted by the UCC3912. It is important to limit the peak of this spike to less than 8 V

to prevent damage to the UCC3912. This voltage spike can be minimized by:

Reducing the power distribution inductance (e.g., twist the positive and negative leads of the power supply

feeding V , locate the power supply close to the UCC3912, use a PCB ground plane,...etc.).

Decoupling V with a capacitor, C (refer to Figure 1), located close to pins 2 and 3. This capacitor is

typically less than 1 µF to limit the inrush current.

Clamping the voltage at V below 8 V with a zener diode, D1 (refer to Figure 1), located close to pins 2

and 3.

www.ti.com

ꢀ

ꢁ

ꢈ

ꢂ

ꢅ

ꢉ

ꢃ

ꢇ

ꢄ

ꢊ

ꢂ

ꢋ

ꢔ

ꢆ

ꢇ

ꢋ

ꢊ

ꢌ

ꢍ

ꢎ

ꢏ

ꢈ

ꢐ

ꢑ

ꢒꢊ

ꢆ

ꢈꢒ

ꢎ

ꢇ

ꢋ

ꢊ

ꢓ

ꢊ

ꢉ

ꢎ

ꢇ

SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003

APPLICATION INFORMATION

UDG-93019-4

Figure 2. Load Current, Timing-Capacitor Voltage, and Output Voltage of the UCC3912 Under Fault

Conditions.

estimating maximum load capacitance

For hot-swap applications, the rate at which the total output capacitance can be charged depends on the

maximum output current available and the nature of the load. For a constant-current current-limited controller,

the output will come up if the load asks for less than the maximum available short-circuit current.

To ensure recovery of a duty-cycle from a short-circuited load condition, there is a maximum total output

capacitance which can be charged for a given unit ON time (fault time). The design value of ON or fault time

can be adjusted by changing the timing capacitor C .

For worst-case constant-current load of value just less than the trip limit; C

can be estimated from:

OUT(max)

28 10 CT

_[ǒ_IMAX

* I

ǒ Ǔ

OUT(max)

LOAD

OUT

where V

is the output voltage.

OUT

www.ti.com

ꢀ ꢁꢁ ꢂꢃ ꢄꢂ

ꢀ ꢁꢁ ꢅꢃ ꢄꢂ

ꢆꢇꢈ ꢉ ꢇꢊꢋ ꢋ ꢊꢌꢍ ꢎ ꢏꢈ ꢐ ꢑꢒꢊꢆ ꢆꢈ ꢒ ꢎꢇ ꢋ ꢊꢓ ꢊ ꢉ ꢎꢇ

ꢔ

SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003

APPLICATION INFORMATION

For a resistive load of value RL, the value of C

can be estimated from:

OUT(max)

28 10 CT

[

OUT(max)

ȧ_{RL ȏn}

OUT

Ȣ^1*

ǒ Ǔ

MAX

The overcurrent comparator senses both the DAC output and a representation of the output current. When the

output current exceeds the programmed level the timing capacitor C charges with 36 µA of current. If the fault

occurs for the time it takes for C to charge up to 1.5 V, the fault latch is set and the output switch is opened.

The output remains opened until C discharges to 0.5 V with a 1.2-µA current source. Once the 0.5 V is reached

the output is enabled and will either appear as a switch, if the fault is removed, or a current source if the fault

remains. If the over current condition is still present, then C will begin charging, starting the cycle over, resulting

in approximately a 3% on time.

UDG-94019-1

Figure 3. UCC3912 On-Time Circuitry

www.ti.com

ꢀ

ꢁ

ꢈ

ꢂ

ꢅ

ꢉ

ꢃ

ꢇ

ꢄ

ꢊ

ꢂ

ꢋ

ꢔ

ꢆ

ꢇ

ꢋ

ꢊ

ꢌ

ꢍ

ꢎ

ꢏ

ꢈ

ꢐ

ꢑ

ꢒꢊ

ꢆ

ꢈꢒ

ꢎ

ꢇ

ꢋ

ꢊ

ꢓ

ꢊ

ꢉ

ꢎ

ꢇ

SLUS241D − MARCH 1994 - REVISED NOVEMBER 2003

APPLICATION INFORMATION

UDG-94019-1

Figure 4. R

vs. Temperature at 2-A Load Current.

DS(on)

safety recommendations

Although the UCC3912 family is designed to provide system protection for all fault conditions, all integrated

circuits can ultimately fail short. For this reason, if the UCC3912 is intended for use in safety critical applications

where UL or some other safety rating is required, a redundant safety device such as a fuse should be placed

in series with the device. The UCC3912 will prevent the fuse from blowing virtually for all fault conditions,

increasing system reliability and reducing maintenance cost, in addition to providing the hot swap benefits of

the device.

www.ti.com

PACKAGE OPTION ADDENDUM

www.ti.com

28-Aug-2010

PACKAGING INFORMATION

Status ⁽¹⁾

Eco Plan ⁽²⁾

MSL Peak Temp ⁽³⁾

Samples

Orderable Device

Package Type Package

Drawing

Pins

Package Qty

Lead/

Ball Finish

(Requires Login)

UCC2912DP

UCC2912DPG4

UCC2912DPR

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

Request Free Samples

Green (RoHS

& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR

Request Free Samples

Purchase Samples

SOIC

2500

Green (RoHS

& no Sb/Br)

UCC2912DPRG4

UCC2912PWP

SOIC

Green (RoHS

& no Sb/Br)

Purchase Samples

TSSOP

SOIC

Green (RoHS

& no Sb/Br)

Request Free Samples

Purchase Samples

UCC2912PWPG4

UCC3912DP

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

UCC3912DPG4

UCC3912DPTR

UCC3912DPTRG4

UCC3912PWP

SOIC

Green (RoHS

& no Sb/Br)

SOIC

2500

Green (RoHS

& no Sb/Br)

SOIC

Green (RoHS

& no Sb/Br)

Purchase Samples

TSSOP

Green (RoHS

& no Sb/Br)

Request Free Samples

Purchase Samples

UCC3912PWPG4

UCC3912PWPTR

UCC3912PWPTRG4

Green (RoHS

& no Sb/Br)

2000

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Purchase Samples

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

28-Aug-2010

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

UCC2912DPR

UCC3912DPTR

UCC3912PWPTR

SOIC

2500

2000

330.0

16.4

6.5

10.3

8.3

2.1

1.6

8.0

16.0

TSSOP

6.95

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

14-Jul-2012

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

UCC2912DPR

UCC3912DPTR

UCC3912PWPTR

SOIC

2500

2000

367.0

38.0

TSSOP

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should

obtain the latest relevant information before placing orders and should verify that such information is current and complete. All

semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time

of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which

have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such

components to meet such requirements.

Products

Audio

Applications

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

www.ti.com/computers

www.ti.com/consumer-apps

www.ti.com/energy

dsp.ti.com

Clocks and Timers

Interface

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/industrial

www.ti.com/medical

www.ti.com/security

Medical

Logic

Security

Power Mgmt

Microcontrollers

RFID

power.ti.com

Space, Avionics and Defense www.ti.com/space-avionics-defense

microcontroller.ti.com

www.ti-rfid.com

Video and Imaging

www.ti.com/video

OMAP Mobile Processors www.ti.com/omap

Wireless Connectivity www.ti.com/wirelessconnectivity

TI E2E Community

e2e.ti.com

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

UCC2912 [TI]

相关型号：

UCC2912DP

UCC2912DP

UCC2912DPG4

UCC2912DPR

UCC2912DPRG4

UCC2912DPTR

UCC2912N

UCC2912NG4

UCC2912PWP

UCC2912PWP

UCC2912PWPG4

UCC2912PWPR