UCC3923PWPR [TI]

1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8, TSSOP-8;
UCC3923PWPR
型号: UCC3923PWPR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO8, TSSOP-8

文件: 总10页 (文件大小:148K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
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SLUS471 – NOVEMBER 2000  
PW PACKAGE  
(TOP VIEW)  
D
Wide Supply Range ±20 V to ±100 V  
D
Smooth Output Ramping Using Linear  
Current Amplifier  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
PG1  
PG2  
PG3  
PG4  
PG5  
–VIN  
UVLO  
SEQTIME  
REF  
DRAINSENS  
OLVO  
D
Undervoltage and Overvoltage Shutdown  
D
Sequenced Open-Drain Outputs for Five  
DC-To-DC Converters  
D
D
D
Open-Drain Fault Output  
FAULT  
ON Input Referenced to Positive Supply  
(UCC3923)  
FLTTIME-  
GATE  
GND  
ON  
ISENS  
IRAMP  
INSB  
ON Input referenced to Negative Supply  
(possible alternative version)  
INSA  
D
Dual Insertion Detection Inputs  
D
Electrostatic-Discharge Protection  
– Human-Body-Model 2 kV  
– Machine Model 200 V  
PACKAGE  
(TOP VIEW)  
D OR P PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
FAULT  
FLTTIME  
GATE  
GND  
INSA  
INSB  
IRAMP  
–VIN  
UVLO  
PG  
REF  
DRAINSENS  
ON  
FAULT  
FLTTIME  
GATE  
–VIN  
1
2
3
4
8
7
6
5
ON  
ISENS  
IRAMP  
GND  
8
ISENS  
description  
The UCC3923 family of devices are Hot-Swap Power Managers for use with negative power supplies. These  
devices are optimized for use in systems with nominal –48-V supplies, but are fully functional over a supply  
range of –20 V to –200 V. These devices can be used both on plug-in cards and on back-planes to limit inrush  
current, control load turnon and turnoff, report faults, isolate faulty loads, and sequence downstream dc-to-dc  
converters.  
The UCC3923 offers the basic features of controlled turnon, load current ramping, and logic output of fault status  
in a tiny 8-pin package. The UCC3924 adds undervoltage protection, two insertion detection pins, power-good  
sensing, one output for downstream converter enabling, and a reference for cascoding, in a 14-pin package.  
The UCC3925 has all of the previously noted features plus overvoltage protection and supply sequencing for  
up to five downstream converters in a 20-pin package.  
AVAILABLE OPTIONS  
PACKAGED DEVICES  
TSSOP–14  
T
ENABLE  
A
TSSOP–8  
UCC3923  
UCC3926  
TSSOP–20  
UCC39235  
UCC3928  
Active high  
Active low  
UCC3924  
–40_C to 85__C  
UCC3927  
All packages are available left end taped and reeled. Add an R suffix to the device type (e.g.,  
UCC3923PWPR) to order quantities of 2000 devices per reel.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2000, Texas Instruments Incorporated  
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SLUS471 – NOVEMBER 2000  
functional block diagram  
LOAD  
DRAINSENS  
19  
PG5  
PG4  
PG3  
+
+
+
18  
17  
16  
ON  
20  
4 V  
3 V  
+
1.4 V  
GND  
1
2 V  
INSA  
2
+
+
+
PG2  
+
+
15  
1 V  
0 V  
INSB  
1.5 V  
4V  
PG1  
3
UVLO  
4
14  
13  
99 R  
GATE  
+
+
+
ISENS  
FAULT  
OVLO  
6
12  
11  
R
REF  
5
S
R
Q
TIMER  
Q
5 V  
1.25 V  
7
8
9
10  
SEQTIME  
–VIN  
IRAMP  
FLTTIME  
UDG–00151  
20-pin package shown. Pin numbers are for counting purposes only, Actual pin locations are dependent upon customer requirements and  
precedence of other products.  
DETAILED OPTION MATRIX  
PIN NAME  
DESCRIPTION  
Undervoltage input  
Overvoltage input  
PG output(s)  
UCC3923 UCC3924 UCC3925 UCC3926 UCC3927 UCC3928  
UVLO  
OVLO  
PGx  
X
X
X
5
X
X
X
5
1
X
X
X
1
X
X
X
REF  
Reference output  
Insert detect  
X
X
X
X
X
X
X
X
INSA, INSB  
DRAINSENS Power good detection input  
SEQTIME  
Programming for downstream load sequencing  
8–Pin TSSOP  
14–Pin TSSOP  
20–Pin TSSOP  
X
X
Packages  
X
X
X
X
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SLUS471 – NOVEMBER 2000  
Terminal Functions  
TERMINAL  
NO.  
DESCRIPTION  
NAME  
I/O  
UCC3923  
UCC3926  
UCC3924  
UCC3927  
UCC3925  
UCC3928  
DRAINSENS  
FAULT  
FLTTIME  
GATE  
GND  
1
2
3
4
5
6
7
8
10  
1
16  
6
I
O
I
Power good detection input  
Logic fault output  
2
7
Programming for fault timeout  
Gate drive output  
3
8
O
I
4
9
Ground  
INSA  
5
10  
11  
12  
13  
14  
15  
1
I
Insertion detection input A  
Insertion detection input B  
Programming for current ramping  
Current sense input  
INSB  
6
I
IRAMP  
ISENS  
ON  
7
I
8
I
9
O
I
Logic command to turn on power to load  
Input overvoltage detection input  
Enable for first downstream load  
Enable for second downstream load  
Enable for third downstream load  
Enable for fourth downstream load  
Enable for fifth downstream load  
Reference output  
OVLO  
PG1  
12  
O
O
O
O
O
O
I
PG2  
2
PG3  
3
PG4  
4
PG5  
5
REF  
11  
17  
18  
19  
20  
SEQTIME  
UVLO  
–VIN  
Programming for downstream load sequencing  
Input undervoltage detection input  
Negative supply input  
13  
14  
I
I
detailed description  
power good detection input (UCC3924 and UCC3925 only)  
DRAINSENS is an input that senses the voltage across the power FET. When the voltage on DRAINSENS is  
less than 1V with respect to –VIN and IRAMP is greater than or equal to 5 V with respect to –VIN, then the power  
FET is considered fully on and the PG outputs are allowed to begin sequencing the loads.  
logic fault output (UCC3923, UCC3924, UCC3925)  
FAULT is an open-drain, active-low driver that asserts when the fault latch is set. The UCC3923 UCC3924 and  
UCC3925 controls the load inrush during starting by closed-loop regulation of load current. When the ON input  
is low, IRAMP, FLTTIME, and SEQTIME are held low. When ON is asserted high, IRAMP is released and allows  
C
to charge. Load current is limited to:  
IRAMP  
V
IRAMP  
I
v 0.01   
LOAD  
R
SENSE  
During this time, C  
charges. If C  
charges to 4 V before the power FET fully enhances, the fault  
FLTTIME  
FLTTIME  
latch sets, the load is immediately turned off, and FAULT pulls low. The fault latch is cleared when ON is pulled  
low.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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SLUS471 – NOVEMBER 2000  
detailed description (continued)  
programming for fault timeout  
During the time when the power FET is regulating current to the load, FLTTIME is pulled high with 10 µA. When  
the load current drops below the commanded maximum load current, FLTTIME is quickly pulled low. If FLTTIME  
charges to 4 V before the power FET fully enhances, the fault latch sets and the load is immediately turned off.  
gate drive output  
When ON is low, GATE is held low. When ON is asserted high, IRAMP is released and allows C  
to charge.  
IRAMP  
During this time, GATE rises, turning on the external power FET so that:  
ǒVIRAMP  
Ǔ
* V  
SENSE  
IN  
I
+ 0.01   
LOAD  
R
IRAMP does not ramp higher than 5 V above –VIN, so load current is programmed to a maximum of  
0.05/R . If the load is unable to accept the current, GATE rises up to 12 V above –VIN, fully enhancing  
SENSE  
the power FET. If load current ever spikes above that maximum value, the current limiting amplifier reduces  
GATE voltage to a level that maintains I at 0.05/R  
.
SENSE  
LOAD  
ground  
GND is the ground input to the IC in negative supply systems. The ON input signal is measured with respect  
to GND. All other signals are with respect to –VIN.  
insertion detection  
INSA and INSB are active-low inputs that must be asserted for the IC to drive the load. These inputs have  
internal pullup current sources of 10 µA so they can be driven by open-drain logic. These inputs can also be  
used as board insertion detection inputs. In this case, these inputs would be connected to corner pins of a  
connector. The mating pins of the connector would be connected to –VIN. This would prevent operation before  
both corners of the connector are mated.  
current ramping  
When ON is low, IRAMP is held low. When ON is asserted high, IRAMP is released and allows C  
During this time, GATE rises, turning on the external power FET so that:  
to charge.  
IRAMP  
ǒVIRAMP  
Ǔ
* V  
SENSE  
IN  
I
+ 0.01   
LOAD  
R
IRAMP does not ramp higher than 5 V above –VIN, so load current is programmed to a maximum of  
0.05/R  
.
SENSE  
current sensing  
Load current is sensed by the voltage between ISENS and –VIN. A current sense resistor, RSENSE is  
connected between ISENS and –VIN. Maximum load current is limited to:  
ǒVIRAMP  
Ǔ
* V  
SENSE  
IN  
0.05  
I
+ 0.01   
during current ramp and I  
v
LOAD  
LOAD  
R
R
SENSE  
when IRAMP reaches final value.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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detailed description (continued)  
logic command to turn on power-to-load  
Three logic inputs enable the load: INSA, INSB, and ON. To turn on the load, INSA and INSB must be lower  
than a TTL threshold above –VIN and ON must be more than a TTL threshold above GND.  
overvoltage/undervoltage lockout  
In addition to the logic inputs INSA, INSB, and ON, two other inputs enable load current: OVLO and UVLO.  
Specifically, OVLO must be less than 1.25 V with respect to –VIN and UVLO must be more than 1.25 V with  
respect to –VIN to enable load current. These pins can be used as logic inputs or as precision overvoltage  
shutdown and undervoltage lockout inputs by connecting these inputs to a voltage divider from GND to –VIN.  
enable downstream power converter  
The IC has five outputs to enable downstream power converters or loads. These outputs are open-drain  
active-low drivers. During power–up, all five outputs are high–impedance. When load current is ramped up to  
maximum command and the output power FET has V < 1 V, C  
starts to charge and PG1 immediately  
DS  
SEQTIME  
asserts low. When C  
charges up to 1 V, PG2 asserts low. When C  
charges up to 2 V, PG3  
charges up to 4 V, PG4  
SEQTIME  
SEQTIME  
SEQTIME  
SEQTIME  
asserts low. When C  
asserts low.  
charges up to 3 V, PG4 asserts low and when C  
reference output  
REF is a voltage reference output 5 V higher than –VIN. This output is enabled whenever –VIN to GND is  
greater than 20 V. This reference can be used as a bias for cascode devices to buffer low-voltage logic outputs.  
This reference should not be loaded with more than 50 µA.  
programming for downstream load sequencing  
These outputs turn on sequentially, with PG1 turning on first, PG2 second, etc. The delay from PG1 to PG2  
is the time required to charge the capacitor from SEQTIME to –VIN by 1 V. SEQTIME is pulled high through  
a 10-µA current source, so the delay between output enables is C/10 µA.  
negative supply input  
–VIN is the negative supply input to the IC. All signals are measured with respect to –VIN except ON. In positive  
supply systems, –VIN is the ground input to the IC.  
5
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SLUS471 – NOVEMBER 2000  
absolute maximum ratings over operating free–air temperature range (unless otherwise noted)  
}
Input voltage range, all pins except GND, ON, DRAINSENS . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 15 V  
}
Input voltage range, GND, ON, DRAINSENS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 80 V  
}
Output voltage range, PG1, PG2, PG3, PG4, PG5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 15 V  
Output voltage range, FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 65 V  
Continuous output current, PG1, PG2, PG3, PG4, PG5, FAULT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA  
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table  
}
Operating virtual junction temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40_C to 125_C  
J
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65_C to 150_C  
stg  
Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . 260_C  
ESD Protection: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HBM 2 kV  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CDM 1 kV  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.  
All voltages are with respect to –VIN unless otherwise stated.  
DISSIPATION RATING TABLE  
PACKAGE  
T
A
25_C  
DERATING FACTOR  
T
= 85_C  
A
POWER RATING  
ABOVE T = 25_C  
POWER RATING  
A
TSSOP–8  
TSSOP–14  
TSSOP–20  
800 mW  
10 mW/_C  
10 mW/_C  
10 mW/_C  
200 mW  
800 mW  
200 mW  
800 mW  
200 mW  
recommended operating conditions  
MIN  
–20  
0
MAX  
–80  
7
UNIT  
V
Input voltage (–VIN to GND)  
Input voltage (FLTTIME, INSA, INSB, IRAM, OVLO, SEQTIME, UVLO to –VIN)  
Input voltage (ISENS to –VIN)  
V
0
0.2  
80  
V
Input voltage (DRAINSENS to –VIN)  
0
V
Input voltage (ON to GND)  
0
80  
V
Output current (PG1, PG2, PG3, PG4, PG5, FAULT, REF)  
2
mA  
_C  
Operating virtual junction temperature, T  
J
–40  
125  
electrostatic discharge protection  
MIN  
MAX  
2
UNIT  
kV  
Human body model  
Charged device model  
Machine model  
1
kV  
0.2  
kV  
6
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electrical characteristics over recommended operating junction temperature range,  
–VIN to GND = –48 V, ON to GND = 2.8 V, INSA = INSB = –VIN, ISENS = –VIN, UVLO = 2.5 V, OVLO  
= VIN, all outputs unloaded (unless otherwise noted)  
power fet drive  
PARAMETER  
GATE output voltage  
TEST CONDITIONS (See Note 1)  
MIN  
10  
TYP  
12  
250  
MAX  
14  
UNIT  
V
V
V
= 0 V  
ISENS  
GATE pulldown current in fault  
ISENS input current  
= 0.1 V  
100  
–1  
mA  
µA  
ISENS  
ON = high,  
0 V < V  
ISENS  
< 0.1 V  
1
timers  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
µA  
IRAMP pullup current during start  
IRAMP low voltage  
ON = high,  
ON = low  
0 V < V  
< 5 V  
10  
IRAMP  
2
2
mV  
V/V  
mV  
mV  
IRAMP to ISENS gain  
ON = high,  
ON = high,  
ON = high  
0 V < V  
< 5 V  
0.01  
IRAMP  
IRAMP offset voltage referred to ISENS  
IRAMP clamp voltage referred to ISENS  
V
= 0 V  
–2  
45  
IRAMP  
50  
10  
55  
FLTTIME pullup current during current  
limit  
ON = high,  
Fault latch not set  
µA  
FLTTIME low voltage  
ON = low  
ON = high,  
ON = low  
ON = high,  
ON = low  
ON = high,  
ON = high,  
ON = high,  
ON = high,  
ON = low  
10  
mV  
V
FLTTIME fault threshold voltage  
FLTTIME discharge current  
V
V
= 0.1 V  
3.75  
10  
4.00  
10  
4.25  
ISENS  
mA  
µA  
mV  
V
SEQTIME pullup current  
= 5 V, V  
= 0 V  
IRAMP  
ISENS  
SEQTIME low-level input voltage  
SEQTIME to PG2 threshold voltage  
SEQTIME to PG3 threshold voltage  
SEQTIME to PG4 threshold voltage  
SEQTIME to PG5 threshold voltage  
SEQTIME discharge current  
10  
1.1  
2.1  
3.1  
4.1  
V
V
V
V
= 5 V, V  
= 5 V, V  
= 5 V, V  
= 5 V, V  
= 0 V  
= 0 V  
= 0 V  
= 0 V  
0.9  
1.9  
2.9  
3.9  
10  
1.0  
2.0  
3.0  
4.0  
IRAMP  
IRAMP  
IRAMP  
IRAMP  
ISENS  
ISENS  
ISENS  
ISENS  
V
V
V
mA  
power good  
PARAMETER  
TEST CONDITIONS  
= 5 V,  
MIN  
TYP  
MAX  
UNIT  
PG1, PG2, PG3, PG4, PG5 on  
resistance  
ON = high,  
V
V
SEQTIME  
100  
= 0 V  
ISENS  
To PG1 rising  
DRAINSENS = –VIN  
DRAINSENS threshold voltage  
DRAINSENS pullup current  
0.85  
1.00  
10  
1.15  
V
µA  
fault output  
PARAMETER  
TEST CONDITIONS  
= 0.1 V,  
MIN  
TYP  
MAX  
100  
UNIT  
ON = high,  
V
ISENS  
= 5 V  
FAULT on resistance  
V
FLTTIME  
7
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electrical characteristics over recommended operating junction temperature range,  
–VIN to GND = –48 V, ON to GND = 2.8 V, INSA = INSB = –VIN, ISENS = –VIN, UVLO = 2.5 V, OVLO  
= VIN, all outputs unloaded (unless otherwise noted) (continued)  
voltage reference output  
PARAMETER  
REF voltage  
TEST CONDITIONS  
< 0 µA  
MIN  
4.9  
TYP  
5.0  
MAX  
5.1  
UNIT  
–50 µA < I  
V
REF  
undervoltage/overvoltage lockout  
PARAMETER  
UVLO falling threshold  
UVLO hysteresis  
TEST CONDITIONS  
to GATE falling  
MIN  
1.20  
TYP  
1.25  
MAX  
1.30  
UNIT  
V
ON = high,  
ON = high,  
to GATE rising  
25  
mV  
µA  
V
UVLO input current  
OVLO rising threshold  
OVLO hysteresis  
V
= 2.5 V  
–1  
1
UVLO  
ON = high,  
ON = high,  
to GATE falling  
to GATE rising  
1.20  
1.25  
25  
1.30  
mV  
µA  
OVLO input current  
V
= 2.5 V  
–1  
1
OVLO  
supply and control inputs  
PARAMETER  
–VIN input current  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
µA  
250  
1.4  
10  
INSA, INSB threshold voltage  
INSA, INSB pullup current  
ON = high,  
= V  
to GATE rising  
1.0  
1.0  
1.8  
1.8  
V
V
= –VIN  
INSB  
µA  
INSA  
ON threshold voltage with respect to  
GND  
To GATE rising  
1.4  
10  
V
ON input current  
V
ON  
– V  
GND  
= 5 V  
µA  
8
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TYPICAL CHARACTERISTICS  
TYPICAL TURNON CYCLE  
TURNON INTO EXCESSIVELY HEAVY LOAD  
–VIN  
ON  
–VIN  
ON  
IRAMP  
GATE  
IRAMP  
GATE  
ISENS  
ISENS  
FLTTIME  
SEQTIME  
ENA1  
FLTTIME  
FAULT  
ENA2  
ENA3  
ENA4  
ENA5  
Figure 1  
Figure 2  
APPLICATION INFORMATION  
ESD Protection  
All UCC3923, UCC3924, and UCC3925 terminals incorporated ESD-protection circuitry designed to withstand  
a 2-kV human-body-model discharge as defined in MIL–STD–883C.  
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
Customers are responsible for their applications using TI components.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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