UCC39422NG4 [TI]

MULTIMODE HIGH-FREQUENCY PWM CONTROLLER; 多模高频PWM控制器
UCC39422NG4
型号: UCC39422NG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

MULTIMODE HIGH-FREQUENCY PWM CONTROLLER
多模高频PWM控制器

稳压器 开关式稳压器或控制器 电源电路 开关式控制器 光电二极管 信息通信管理
文件: 总40页 (文件大小:981K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀꢁꢁ ꢂ ꢃꢄ ꢂ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢂ ꢂ ꢆ ꢀꢁꢁ ꢇ ꢃꢄ ꢂ ꢅ ꢆ ꢀꢁ ꢁꢇ ꢃꢄ ꢂꢂ  
ꢈ ꢀꢉꢊ ꢋꢈ ꢌ ꢍꢎ ꢏꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔꢀ ꢎꢕꢁꢖ ꢗꢘ ꢈ ꢁꢌ ꢕ ꢊꢓ ꢌꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
D
Operation Down to an Input  
Voltage of 1.8 V  
simplified schematic block diagram and  
application circuit  
D
D
High Efficiency Boost, SEPIC or  
Flyback (Buck-Boost) Topologies  
1.8 V(MIN)  
+
+
Drives External FETs for  
High-Current Applications  
VPUMP  
VIN  
2 CELL  
ALKALINE/  
NiCd OR  
1 LI−ION  
7
9
1.24 V  
VREF  
D
Up to 2-MHz Oscillator  
CP  
8
3
D
Synchronizable Fixed Frequency  
Operation  
SYNC/SD  
RT  
CHARGE  
PUMP  
13  
14  
VOUT  
PWM  
OSC  
D
D
High-Efficiency Low-Power Mode  
RSEN  
RECT  
2
VOUT  
VPUMP  
High-Efficiency at Very Low-Power  
with Programmable Variable  
Frequency Mode  
4
RSEL  
ANTI−  
CROSS  
COND.  
19  
6
D
D
D
D
D
D
Pulse-by-Pulse Current Limit  
VGD  
CHRG  
5-µA Supply Current in Shutdown  
150-µA Supply Current in Sleep  
Mode  
PWM CIRCUITRY  
CURRENT LIMIT  
ISENSE  
PGND  
12  
5
+
X10  
Selectable NMOS or PMOS  
Rectification  
50 mV TYP  
LOW POWER  
MODE  
1.24 V  
ERROR  
AMP  
Built-In Power-On Reset  
(UCC39422 Only)  
SLOPE  
+
COMPENSATION  
FB  
17  
18  
16  
PFM MODE  
CONTROL  
Built-In Low-Voltage Detect  
(UCC39422 Only)  
COMP  
PFM  
GND  
15  
+
description  
1.22V  
The UCC39421 family of synchronous  
RESET  
UCC39422  
ONLY  
1
PWM controllers is optimized to operate  
from dual alkaline/NiCd cells or a single  
Lithium-Ion (Li-Ion) cell, and convert to  
adjustable output voltages from 2.5 V to  
8 V. For applications where the input  
voltage does not exceed the output, a  
standard boost configuration is used.  
200 mS  
RESET/  
POR  
+
1.18 V  
RSADJ  
VDET  
LOWBAT  
20  
11  
10  
+
1.24 V  
UDG−98122  
For other applications where the input voltage can swing above and below the output, a 1:1 coupled inductor  
(Flyback or SEPIC) is used in place of the single inductor. Fixed frequency operation can be programmed, or  
synchronized to an external clock source. In applications where (at light loads) variable frequency mode is  
acceptable, the IC can be programmed to automatically enter PFM (pulse frequency modulation) mode for an  
additional efficiency benefit.  
Synchronous rectification provides excellent efficiency at high power levels, where N- or P- type MOSFETs can  
be used. At lower power levels (between 10% and 20% of full load) where fixed frequency operation is required,  
low power mode is entered. This mode optimizes efficiency by cutting back on the gate drive of the charging  
FET. At very low power levels, the IC enters a variable frequency mode (PFM). PFM can be disabled by the user.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢊꢦ  
Copyright 2000, Texas Instruments Incorporated  
ꢢ ꢦ ꢣ ꢢꢛ ꢜꢰ ꢞꢝ ꢡ ꢩꢩ ꢧꢡ ꢟ ꢡ ꢠ ꢦ ꢢ ꢦ ꢟ ꢣ ꢫ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢂ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢂ ꢂꢆ ꢀꢁ ꢁꢇ ꢃ ꢄ ꢂ ꢅꢆ ꢀꢁ ꢁꢇ ꢃ ꢄ ꢂ ꢂ  
ꢈ ꢀ ꢉꢊ ꢋ ꢈꢌꢍ ꢎ ꢏ ꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔ ꢀꢎꢕ ꢁꢖ ꢗ ꢘꢈ ꢁꢌ ꢕꢊ ꢓꢌ ꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
description (continued)  
Other features include pulse-by-pulse current limiting, and a low 5-µA quiescent current during shutdown. The  
UCC39422 incorporates programmable power-on reset circuitry and an uncommitted comparator for low  
voltage detection. The available packages are 20-pin TSSOP or 20-pin N for the UCC39422, and 16-pin TSSOP  
or 16-pin N for the UCC39421.  
Ĕ}  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply Voltage (VIN, VOUT,VPUMP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V  
CP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V  
RSEN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 12 V  
SYNC/SD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 5 V  
ISENSE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to 1 V  
Storage Temperature, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
stg  
J
Junction Temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to 150°C  
Lead Temperature (Soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
All voltages are with respect to ground. Currents are positive into and negative out of the specified terminals. Consult the Packaging Section of  
the Databook for thermal limitations and considerations of the package.  
TSSOP−16, DIL−16  
N, PW PACKAGE  
TSSOP−20, DIL−20  
N, PW PACKAGES  
(TOP VIEW)  
(TOP VIEW)  
RSEN  
VOUT  
RECT  
PGND  
CHRG  
VPUMP  
CP  
RSEL  
COMP  
FB  
RESETB  
1
2
3
4
5
6
7
8
9
10  
20 RSADJ  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
19  
18  
17  
16  
15  
14  
13  
12  
11  
RSEN  
VOUT  
RECT  
PGND  
CHRG  
VPUMP  
CP  
RSEL  
COMP  
FB  
PFM  
GND  
RT  
PFM  
GND  
10 SYNC/SD  
ISENSE  
RT  
VIN  
9
SYNC/SD  
ISENSE  
VDET  
VIN  
LOWBAT  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢈ ꢀꢉꢊ ꢋꢈ ꢌ ꢍꢎ ꢏꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔꢀ ꢎꢕꢁꢖ ꢗꢘ ꢈ ꢁꢌ ꢕ ꢊꢓ ꢌꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
electrical characteristics over recommended operating free-air temperature range, T = −40°C to  
A
VIN  
85°C for the UCC2942x, 0°C to 70°C for the UCC3942x, R = 100 k, V  
= 6 V, V  
= 3 V.  
T
VPUMP  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
VIN Section  
Minimum start−up voltage  
Operating current  
1.5  
35  
1.8  
60  
60  
4
V
µA  
µA  
µA  
kHz  
µs  
Not in PFM mode,  
No load  
No load  
Sleep mode current  
Shutdown supply current  
Startup frequency  
PFM mode,  
35  
SYNC/SD = high  
1.5  
120  
2
V
IN  
V
IN  
V
IN  
= 1.8 V  
= 1.8 V  
= 1.8 V  
60  
190  
5
Startup off time  
Startup CS threshold  
36  
56  
mV  
Minimum PUMP or VOUT voltage to exit  
startup  
2.2  
5.0  
2.5  
2.8  
V
VPUMP Section  
Regulation voltage  
Operating current  
Sleep mode current  
V
=3.3 V,  
See Note 1  
6.6  
275  
15  
V
VOUT  
Outputs OFF  
100  
5
µA  
µA  
SYNC/SD = High,  
VOUT = 3 V,  
Shutdown supply current  
2
5
µA  
V
= 3 V  
VPUMP  
CP voltage to turn-on pump switch  
Pump switch Rds(on)  
VOUT Section  
V
= 5 V  
5.3  
4
5.5  
V
VPUMP  
Operating current  
300  
50  
500  
100  
1
650  
150  
2.2  
µA  
µA  
µA  
Sleep mode current  
Shutdown supply current  
SYNC/SD = High  
= 3.3 V  
VPUMP to VOUT threshold to enable  
N-channel rectifier  
V
OUT  
1.4  
1.205  
6.5  
1.7  
2.0  
V
Error Amplifier Section  
Regulation voltage  
FB input current  
2 V < VIN < 5 V  
1.235  
100  
1.265  
350  
V
V
FB  
= 1.25 V  
nA  
V
V
= 1 V,  
COMP  
FB  
Max sinking current, I  
OL  
13  
20  
µA  
µA  
= regulation roltage +50 mV  
V
V
= 0 V,  
COMP  
FB  
Max sourcing current, I  
–20  
150  
–13  
–6.5  
370  
OH  
= regulation voltage –50 mV  
Transconductance  
Unity gain bandwidth  
Max output voltage  
Oscillator Section  
V
FB  
= regulation voltage 4 mV  
270  
100  
1.9  
µs  
kHz  
V
C
= 330 pF,  
See Note 1  
C
V
FB  
= 0 V  
1.6  
2.3  
R
R
R
= 350 kΩ  
= 100 kΩ  
= 35 kΩ  
100  
375  
150  
475  
190  
575  
1.4  
kHz  
kHz  
MHz  
V
T
T
T
Frequency stability  
0.9  
1.2  
R
T
voltage  
0.600  
0.9  
0.625  
1.2  
0.650  
1.6  
SYNC/shutdown threshold  
SYNC input current  
V
SYNC/SD = 2.5 V  
See Note 1  
200  
50  
nA  
ns  
Minimum SYNC pulse width  
Maximum SYNC high time  
SYNC range  
To avoid shutdown  
11  
20  
29  
µs  
fo = measured frequency at R = 100 kΩ  
1.1 fo  
1.7 fo  
kHz  
T
NOTE 1: Ensured by design. Not production tested.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢂ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢂ ꢂꢆ ꢀꢁ ꢁꢇ ꢃ ꢄ ꢂ ꢅꢆ ꢀꢁ ꢁꢇ ꢃ ꢄ ꢂ ꢂ  
ꢈ ꢀ ꢉꢊ ꢋ ꢈꢌꢍ ꢎ ꢏ ꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔ ꢀꢎꢕ ꢁꢖ ꢗ ꢘꢈ ꢁꢌ ꢕꢊ ꢓꢌ ꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
electrical characteristics over recommended operating free-air temperature range, T = −40°C to  
A
VIN  
85°C for the UCC2942x, 0°C to 70°C for the UCC3942x, R = 100 k, V  
= 6 V, V  
= 3 V.  
T
VPUMP  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
Current Sense Section  
Gain  
8
10  
150  
25  
11  
V/V  
mV  
MHz  
V
Overcurrent limit threshold  
Unity gain bandwidth  
120  
190  
See Note 1  
= 70 mV  
COMP voltage to I  
accuracy  
threshold  
I
0.83  
80  
1.00  
1.23  
SENSE  
SENSE  
PWM Section  
Maximum duty cycle  
Minimum duty cycle  
V
V
= 0 V,  
V
= 0 V  
88  
%
%
ISENSE  
= 1.5 V  
FB  
0
0.67  
4.0  
30  
FB  
Low power mode V  
COMP  
At COMP pin  
= 350 kΩ,  
0.53  
1.4  
–2  
0.60  
2.8  
15  
V
Slope compensation accuracy  
R
T
R
= 20 kΩ  
SLOPE  
A/s  
mV  
mV  
V
RSEL = GND  
RSEL = VIN  
Rectifier zero current threshold  
–28  
0.5  
–15  
0.9  
2
RSEL threshold  
1.3  
PFM Section  
PFM disable threshold  
Comp hold during sleep  
Startup delay after sleep  
FB voltage to sleep off  
VGSW Drive Section  
Rise time  
0.17  
0.40  
0.22  
0.47  
4
0.27  
0.65  
9
V
V
V
V
= 0.4 V  
PFM  
< 1.23 V  
µs  
V
FB  
1.185  
1.220  
1.245  
C
C
= 1 nF  
= 1 nF  
18  
14  
0.4  
4
35  
30  
ns  
ns  
V
O
Fall time  
O
I
I
I
I
= –100 mA, Respect to VPUMP  
0.65  
10  
OUT  
OUT  
OUT  
OUT  
Output high  
Output low  
= –1 mA,  
= 100 mA  
= 1 mA  
Respect to VPUMP  
mV  
V
0.2  
2
0.35  
6
mV  
ns  
Charge off to rectifier on delay  
RECT Drive Section  
Rise time  
10  
40  
65  
C
C
= 1 nF  
20  
14  
0.2  
5
40  
30  
ns  
ns  
V
O
Fall time  
= 1 nF  
O
I
I
I
I
= –100 mA, Respect to VPUMP  
0.5  
10  
OUT  
OUT  
OUT  
OUT  
Output high  
= –1 mA,  
= 100 mA  
= 1 mA  
Respect to VPUMP  
mV  
V
0.2  
2
0.35  
6
Output low rectifier  
mV  
ns  
Rectifier off to charge on delay  
RESET Section (UCC39422 Only)  
Reset timeout  
10  
40  
65  
C
= 0.33 µF  
100  
–7  
250  
–5.5  
0.1  
400  
–4  
ms  
%
RSADJ  
Percentage below regulation voltage  
Reset threshold  
Output low voltage  
Reset condition,  
RESET = 8 V  
I = 5 mA  
0.25  
0.2  
V
Output leakage  
0.05  
µA  
NOTE 1: Ensured by design. Not production tested.  
4
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ꢀꢁꢁ ꢂ ꢃꢄ ꢂ ꢅ ꢆ ꢀꢁꢁ ꢂ ꢃꢄ ꢂ ꢂ ꢆ ꢀꢁꢁ ꢇ ꢃꢄ ꢂ ꢅ ꢆ ꢀꢁ ꢁꢇ ꢃꢄ ꢂꢂ  
ꢈ ꢀꢉꢊ ꢋꢈ ꢌ ꢍꢎ ꢏꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔꢀ ꢎꢕꢁꢖ ꢗꢘ ꢈ ꢁꢌ ꢕ ꢊꢓ ꢌꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
electrical characteristics over recommended operating free-air temperature range, T = −40°C to  
A
VIN  
85°C for the UCC2942x, 0°C to 70°C for the UCC3942x, R = 100 k, V  
= 6 V, V  
= 3 V.  
T
VPUMP  
PARAMETER  
Voltage Detection Section (UCC39422 Only)  
Threshold voltage  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
1.18  
1.26  
0.15  
0.05  
1.34  
0.3  
V
V
Output low voltage  
I = 5 mA  
Output leakage  
LOWBAT = 8 V  
0.25  
µA  
PIN DESCRIPTIONS  
COMP: This is the output of the transconductance error amplifier. Connect the compensation components from  
this pin to ground.  
CHRG: This is the gate drive output for the N-channel charge MOSFET. Connect it to the gate directly, or through  
a low-value gate resistor.  
CP: This is the input for the charge pump. For applications requiring a charge pump, connect this pin to the  
charge pump diode and flying capacitor, as shown in the applications diagram of Figure 4. For applications  
where no charge pump is required, this pin should be grounded.  
FB: The feedback input is the inverting input to the transconductance error amplifier. Connect this pin to a  
resistive divider between V  
and ground. The output voltage is regulated to:  
OUT  
(
)
R1 ) R2  
V
+ 1.235   
OUT  
R1  
where R1 goes to GND and R2 goes to VOUT.  
GND: This is the signal ground pin for the device. It should be tied to the local ground plane.  
ISENSE: This is the input to the X10 wide bandwidth current-sense amplifier. Connect this pin to the high side  
of the current-sense resistor. An internal current is sourced out this pin for slope compensation. For applications  
requiring slope compensation (or filtering of the current-sense signal), use a resistor in series with this pin.  
LOWBAT: This is the open drain output of the uncommitted comparator. (UCC39422 only). This output is low  
when the VDET pin is above 1.25 V.  
PFM: This is the programming pin for the PFM (pulse frequency modulation) mode threshold. Connect this pin  
to a resistive divider off of the FB pin (or VOUT) to set the PFM threshold. To disable PFM Mode, connect this  
pin to ground (below 0.2 V).  
PGND: This is the power ground pin for the device. Connect it directly to the ground return of the current-sense  
resistor.  
RECT: This is the gate drive output for the synchronous rectifier. Connect it to the gate of the P- or N-channel  
MOSFET directly, or through a low value gate resistor.  
RSEN: This pin is used to sense the voltage across the synchronous rectifier for commutation. In boost  
configurations, connect this pin through a 1-kresistor to the junction of the two MOSFETs and the inductor.  
In flyback and SEPIC configurations, connect this pin through a 1-kresistor to the junction of the drain of the  
synchronous rectifier and the secondary side winding of the coupled inductor.  
RSADJ: A capacitor from this pin to ground sets the reset delay. (UCC39422 only)  
RSEL: This pin programs the device for N- or P-channel synchronous rectifiers by inverting the phase of the  
RECT gate drive output. Connect this pin to ground for N-channel MOSFETs, connect it to V for P-channel  
IN  
MOSFETs.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢁꢂ ꢃ ꢄ ꢂ ꢅꢆ ꢀ ꢁ ꢁꢂ ꢃ ꢄ ꢂ ꢂꢆ ꢀꢁ ꢁꢇ ꢃ ꢄ ꢂ ꢅꢆ ꢀꢁ ꢁꢇ ꢃ ꢄ ꢂ ꢂ  
ꢈ ꢀ ꢉꢊ ꢋ ꢈꢌꢍ ꢎ ꢏ ꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔ ꢀꢎꢕ ꢁꢖ ꢗ ꢘꢈ ꢁꢌ ꢕꢊ ꢓꢌ ꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
RESET: This is the open drain output of the reset comparator. (UCC39422 only) and is active low.  
RT: A resistor from this pin to ground programs the frequency of the pulse width modulator.  
50  
Frequency (MHz) ^  
(
)
kW  
R
T
SYNC/SD: This pin has two functions. It may be used to synchronize the UCC39421’s switching frequency to  
an external clock, or to shutdown the IC entirely. In shutdown, the quiescent current is reduced to just a few  
microamps (both external FETs are turned off). To shutdown the converter, this pin must be held high (above  
2.0 V) for a minimum of 29 µs. If not used, this pin should be grounded.  
To synchronize the internal oscillator to an external source, the SYNC/SD pin must be driven with a clock pulse,  
with a minimum amplitude of 2.0 V. The internal circuitry syncs to the rising edge of the external clock. The clock  
pulse width is not critical (must be 50 ns minimum).  
Note: When coming out of shutdown (or during power-up), the SYNC/SD pin must be held low for a minimum  
of 200 µs before applying an external clock to ensure startup.  
VPUMP: This is the output of the charge pump. For applications requiring a charge pump, connect a 1-µF  
capacitor from this pin to ground. Otherwise, connect this pin to the higher of V or V  
, and decouple with  
IN  
OUT  
a 0.1-µF capacitor.  
VOUT: Connect this pin to the output voltage. This input is used for sensing the voltage across the synchronous  
rectifier and for supplying power to internal circuitry and should be decoupled with a 0.1-µF capacitor.  
VIN: This is the input power pin of the device. Connect this pin to the input voltage source. A 0.1-µF decoupling  
capacitor should be connected between this pin and ground.  
VDET: This is the non-inverting input to an uncommitted comparator. This input may be used for detecting a  
low-battery condition. (UCC39422 only)  
6
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ꢈ ꢀꢉꢊ ꢋꢈ ꢌ ꢍꢎ ꢏꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔꢀ ꢎꢕꢁꢖ ꢗꢘ ꢈ ꢁꢌ ꢕ ꢊꢓ ꢌꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
The UCC39421 is a high frequency, synchronous PWM controller optimized for portable, battery-powered  
applications where size and efficiency are of critical importance. It includes high-speed, high-current FET  
drivers for those converter applications requiring low Rds(on) external MOSFETs. A detailed block diagram is  
shown in Figure 2.  
optimizing efficiency  
The UCC39421 optimizes efficiency and extends battery life with its low quiescent current and its synchronous  
rectifier topology. The additional features of low-power (LP) mode and PFM mode maintain high efficiency over  
a wide range of load current. These features are discussed in detail.  
power saving modes  
Since this is a peak current mode controller, the error amplifier output voltage sets the peak inductor current  
required to sustain the load. The UCC39421 incorporates two special modes of operation designed to optimize  
efficiency over a wide range of load current. This is done by comparing the error amplifier output voltage (on  
the COMP pin) to two fixed thresholds (one of which is user programmable). If the error amplifier output voltage  
drops below the first threshold, low power mode is entered. If the error-amplifier output voltage drops even  
further, below a second user programmable threshold, PFM mode is entered. These modes of operation are  
designed to maintain high efficiency at light loads, and are described in detail in the following text. Refer to the  
simplified block diagram of Figure 1 for the control logic.  
LPM COMP  
0.6 V  
+
1 = LP_MODE  
70 mV  
VOUT  
SENSE  
+
PFM  
1.24 V  
HOLD AMP  
ERROR AMP  
+
FB  
1=SLEEP  
PFM COMP  
COMP  
PFM  
+
+
S
R
Q
+
1.22  
PFM DISABLE COMP  
0.2 V  
UDG−98108  
Figure 1. Simplified Block Diagram of Low Power and Pulse Mode Control Logic  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
power saving modes (continued)  
VPUMP  
7
VIN  
9
VPUMP  
VOUT  
VIN  
VDD  
CONTROL  
VGD  
+
8
3
2
CP  
VDD  
VDD BIAS  
PGND  
CONTROL  
AND UVLO  
PUMP  
SWITCH  
CONTROL  
1.2 V  
1=SD  
VOUT  
µ
20 s  
ADAPTIVE  
DELAY  
ZERO  
+
VIN  
CURRENT  
SENSING  
+
VOUT+2 V  
RSEN  
RECT  
VIN  
IZERO  
13  
14  
SYNC/SD  
RT  
85%  
DMAX  
PWM  
OSC  
VPUMP  
CLK  
MUX  
A
4
B
ANTI−  
CROSS  
COND.  
A/B  
R
S
19 RSEL  
Q
VGD  
6
CHRG  
36 mV  
SLOPECOMP  
Q
Q
R
S
START−UP  
+
VPUMP >2.5 V  
µ
S
2.5  
ISENSE  
PGND  
LEB  
12  
5
V
30 MHz AMP  
IN  
VOUT>2.5 V  
ILIM COMP  
+
0.15 V  
+
+
X10  
1.24 V  
VREF  
1 = LP_MODE  
+
PWM  
COMP  
+
0.6 V  
0.3 V  
10%−20% OF FULL  
LOAD = LP_MODE  
1.24 V  
ERROR AMP  
+
GND  
15  
FB  
+
17  
18  
70 mV  
PFM COMP  
COMP  
PFM  
1=SLEEP  
S
R
+
16 PFM  
Q
+
PFM DISABLE  
COMP  
+
1.22  
+
0.2 V  
RESET  
UCC29422  
ONLY  
1
RESET/POR  
1.18 V  
20  
11  
RSADJ  
VDET  
LOWBAT 10  
+
1.24 V  
UDG−98107  
Figure 2. Detailed Block Diagram  
8
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
low power mode  
During normal operation, at medium to high load currents, the switching frequency remains fixed, programmed  
by the resistor on the RT pin. At these higher loads, the gate drive output on the CHRG pin (for the N-channel  
charge FET) is the higher of V or V  
. When the load current drops (sensed by a drop in the error amp  
IN  
PUMP  
voltage), the UCC39421 automatically enters LP mode, and the gate drive voltage on the CHRG pin is reduced  
to lower gate drive losses. This helps to maintain high efficiency at light loads where the gate drive losses begin  
to dominate and the lowest possible Rds(on) is not required. If the load increases, normal or “high power” mode  
resumes. The expression for gate drive power loss is given by equation (1). It can be seen that the power varies  
as a function of the applied gate voltage squared.  
2
ǒ Ǔ  
  V  
G
Q
  f  
G
(1)  
P
+
GATELOSS  
V
S
Where Q is the total gate charge and V is the gate voltage specified in the MOSFET manufacturer’s data  
G
S
sheet, V is the applied gate drive voltage, and f is the switching frequency.  
G
The nominal COMP voltage where LP mode is entered is 0.6 V. Given the internal offset and gain of the  
current-sense amplifier, this corresponds to a peak switch current of:  
(
)
0.6 * 0.3  
0.03  
(2)  
I
+
+
PEAK  
K   R  
R
SENSE  
SENSE  
Where 0.6 V is the threshold for LP mode, 0.3 V is the internal offset, K is the nominal current-sense amplifier  
gain of 10, and R is the value of the current-sense resistor. If the peak inductor current is below this value,  
SENSE  
the UCC39421 enters LP mode and the gate drive voltage on the CHRG pin is equal to V . At peak currents  
IN  
higher than this, the gate drive voltage is the higher of VIN or VPUMP.  
PFM mode  
At very light loads, the UCC39421 enters PFM mode. In this mode, when the error amplifier output voltage drops  
below the PFM threshold, the controller goes into sleep mode until V has dropped slightly (30 mV measured  
OUT  
at the feedback pin). At this time, the controller turns back on and operates at fixed frequency for a short duration  
(typically a few hundred microseconds) until the output voltage has increased and the error amplifier output  
voltage has dropped below the PFM threshold once again. Then the converter turns off and the cycle repeats.  
This results in a very low duty cycle of operation, reducing all losses and greatly improving light load efficiency.  
During sleep mode, most of the circuitry internal to the UCC39421 is powered down, reducing quiescent current  
and maximizing efficiency.  
The peak inductor current at which this mode is entered is user programmable by setting the voltage on the PFM  
pin. This can be done with a single resistor in series with the feedback divider, as shown in the application  
diagrams. The nominal peak current threshold for PFM mode is defined by the equation:  
ǒ1.25 R1Ǔ* 0.3  
ǒ
Ǔ
R1)R2  
(3)  
I
^
PEAK  
K   R  
SENSE  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
PFM mode (continued)  
Where 0.3 V is the internal offset and K is the nominal current-sense amplifier gain of 10 and R  
is the value  
SENSE  
of the current-sense resistor. Note that in this case, the PFM pin voltage is set by the R1/R2 resistive divider  
off of the FB pin, which is regulated to 1.25 V.  
During sleep mode, the COMP pin is forced to 70 mV above the PFM pin voltage. This minimizes error amplifier  
overshoot when coming out of sleep mode, and prevents erroneously tripping the PFM comparator.  
disabling PFM mode  
The user may disable PFM mode by pulling the PFM pin below 0.2 V. In this case, the UCC39421 remains on,  
in fixed frequency operation at all load currents. The PFM pin can also be driven, through a resistive divider,  
off of an output from the system controller. This allows the system controller to prepare for an expected step  
increase in load, improving the converter’s large signal transient response. An example of this is shown in  
Figure 3.  
UCC39421  
ENABLE OUTPUT  
FROM CONTROLLER  
R2  
PFM  
7
R1  
Figure 3. Driving the PFM Pin From a Controller Output  
choosing a topology and optimal synchronous rectifier  
The UCC39421 is designed to be very flexible, and can be used in boost, flyback and SEPIC topologies. It can  
operate from input voltages between 1.8 V and 8.0 V. Output voltages can be between 2.5 V and 8.0 V. It can  
also drive either N- or P-channel MOSFET synchronous rectifiers. Table 1 can be used to select the appropriate  
topology for a given combination of input and output voltage requirements. Although it is designed to operate  
as a peak current mode controller, it can also be configured for voltage mode control. This is discussed in a later  
section.  
The user can program the gate drive output on the RECT pin for N-channel MOSFETs by grounding the RSEL  
pin, or for P-channel MOSFETs by connecting the RESEL pin to VIN. Table 2 is used to determine whether an  
N- or P-channel synchronous rectifier should be used.  
Note: In all cases, low-voltage-logic MOSFETs should be used to achieve the lowest possible on-resistance  
for the highest efficiency.  
The application diagrams in Figures 4 through 8 illustrate the use of the UCC39421 in all the topologies, using  
N- and P-channel rectifiers. They are be discussed in detail in the next section.  
10  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
choosing a topology and optimal synchronous rectifier (continued)  
Note that the higher the frequency of operation, the more critical the MOSFET gate charge becomes for  
efficiency, particularly at light loads. However, high load currents demand lower Rds(on), which tends to  
increase gate charge. These two parameters should be balanced. At lower frequencies, the gate charge  
becomes less important, at 1 MHz or more, it is critical.  
Table 1. SELECTING TOPOLOGY BASED ON INPUT AND OUTPUT VOLTAGE REQUIREMENTS  
Cell Type  
Nunber of Cells  
V
Range  
V
Topology  
Boost  
IN  
OUT  
2
1.8 V to 3.0 V  
3.0 < V < 8.0  
2.5 < V < 3.9  
4.5 < V < 8.0  
V > 8.0  
Flyback or SEPIC  
Boost  
Alkaline or NiCd, NiMH  
3
1
2.7 V to 4.5 V  
Non−synchronous boost  
Flyback or SEPIC  
Boost  
2.5 < V < 3.6  
4.2 < V < 8.0  
V > 8.0  
Li-Ion  
2.5 V to 4.2 V  
Non−synchronous boost  
boost topology  
The boost topology is simple and efficient, and should be used whenever the desired output voltage is greater  
than the maximum input voltage.  
boost using two n-channel MOSFETs  
A boost converter using two N-channel MOSFETs is shown in Figure 4. This configuration is optimal for output  
voltages below 4 V, where the output voltage may not be high enough to provide optimal gate drive for a  
P-channel MOSFET. Note that in this case, a charge pump is required to provide proper gate drive levels. This  
is easily accomplished by adding an external diode and a capacitor, as shown. The diode connects from the  
output voltage to the CP pin. It should be an ultrafast or a Schottky diode. A 0.1-µF ceramic capacitor is  
connected from the drain of the charge FET to the CP pin. This is the “flying” capacitor that charges to (V  
OUT  
– V  
) every time the charge FET is on. A charge pump reservoir capacitor is connected from the VPUMP  
DIODE  
pin to ground. It should be at least 1µF. A high-speed active rectifier inside the UCC39421 charges the pump  
capacitor from the CP pin. The charge pump voltage is:  
(4)  
V
^ 2   V  
PUMP  
OUT  
For a block diagram of the charge pump logic, refer to Figure 12.  
Note: A charge pump should not be used at output voltages over 4.0 V to avoid pump voltages exceeding 8 V.  
For other applications, where the charge pump is not required, the CP pin should be grounded and the pin  
should be connected to either V  
or V , whichever is greater.  
IN  
OUT  
11  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
boost using two n-channel MOSFETs  
+V  
IN  
+1.8 V 3.2 V  
L1  
+C  
IN  
COILTRONICS  
CTX5−2  
µ
100  
F
10 V  
UCC39421  
1k  
1
2
RSEN  
VOUT  
RSEL 16  
Q2 (N)  
V
C
R3  
100 k  
1%  
OUT  
POLE  
C
+3.3 V  
R
COMP  
COMP  
COMP 15  
FB 14  
C
OUT  
D
µ
0.1 F  
PUMP  
1N4148  
RG2 4.7  
R2  
41 k  
1%  
3
4
VGRECT  
PGND  
µ
0.1 F  
C
FLY  
PFM 13  
R1  
20 k  
1%  
RG1  
4.7  
Q1  
(N)  
5
6
CHRG  
GND 12  
RT 11  
RT  
100 k  
µ
1 F  
C
R
PUMP  
SENSE  
0.025  
VPUMP  
SYNC/SD 10  
7
8
CP  
ISENSE  
9
VIN  
+V  
IN  
C5  
µ
F
0.1  
R
SLOPE  
1.5 k  
UDG−98116  
Figure 4. Application Diagram for the Boost Topology Using the N-channel Synchronous Rectifier  
Table 2. SELECTING SYNCHRONOUS RECTIFIER BASED ON TOPOLOGY AND OUTPUT VOLTAGE  
Topology  
V
Synchronous Rectifier  
P-channel (low voltage logic)  
OUT  
3.0 < V < 8.0  
N-channel (low voltage logic)  
Note: Requires a diode and a capacitor for the charge pump  
V < 4.0  
Boost  
Non-synchronous  
Note: Use Schottky rectifier (See Figure 16)  
V > 8.0  
N-channel (low voltage logic)  
Note: Requires a diode and a capacitor for the charge pump  
2.5 < V < 3.0  
Flyback  
SEPIC  
3.0 < V < 8.0  
3.0 < V < 8.0  
N-channel (low voltage logic)  
P-channel (low voltage logic)  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
boost using N- and P-channel MOSFETs  
For output voltages greater than the input and greater than about 3.0 V, a P-channel may be used for the  
synchronous rectifier. This configuration is shown in Figure 5. In this case, the VPUMP pin should be connected  
to VOUT. This configuration can be used for a 3.3 V output if a low voltage logic MOSFET is used.  
relating peak inductor current to average output current for the boost converter  
For a continuous mode boost converter, the average output current is related to the peak inductor current by  
the following:  
ǒ(IOUT Ǔ  
)
di  
2
(5)  
I
+
PEAK  
)
1 * D  
where D is the duty cycle and the inductor ripple current, di, is defined as:  
t
  V  
D   V  
ON  
IN  
+
IN  
f   L  
(6)  
(7)  
di +  
L
where f is the switching frequency and L is the inductor value. The duty cycle is defined as:  
V
* V  
IN  
D + ǒ O Ǔ  
V
O
Substituting equations (6) and (7) into equation (5) yields:  
I
V
* V  
V
ǒ O Ǔ  
IN  
2   f   L V  
OUT  
V *V  
ǒ Ǔ  
IN  
(8)  
I
+
)
 
PEAK  
O
IN  
1 * ǒ O Ǔ  
V
O
Note that in these equations, the voltage drop across the rectifier has been neglected.  
13  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
relating peak inductor current to average output current for the boost converter  
VIN  
1.8 V  
TO  
C
10  
16V  
L1  
IN1  
µ
µ
F
2.2  
H
4.8 V  
C1  
UCC39421  
R7  
10 pF  
1 k  
R1  
15 k  
1%  
1
2
3
4
5
6
RSEN  
RSEL 16  
C2  
R4  
100 k  
470 pF  
C
10  
C
OUT1  
10  
16V  
OUT2  
C6  
+5 V  
0 A  
TO  
VOUT  
COMP 15  
FB 14  
µ
µ
F
F
Q1B  
Si6803  
(P)  
µ
0.1  
F
16V  
1 A  
R2  
15 k  
1%  
VGRECT  
PGND  
Q1A  
Si6803  
(N)  
PFM 13  
R3  
15 k  
1%  
CHRG  
VPUMP  
GND 12  
RT 11  
R4  
100 k  
R
S
0.025  
C4  
SYNC/SD 10  
µ
0.1  
F
SYNC/  
SHUDOWN  
INPUT  
7
8
CP  
R5  
1 M  
ISENSE  
9
VIN  
+V  
IN  
C5  
µ
F
0.1  
R6  
1.5 k  
UDG−98117  
Figure 5. Application Diagram for the Boost Topology Using a P-channel Synchronous Rectifier  
flyback topology using n-channel MOSFETs  
A flyback converter using the UCC39421 is shown in Figure 6. It uses a standard two-winding coupled inductor  
with a 1:1 turns ratio. The advantage of this topology is that the output voltage can be greater or less than the  
input voltage, as shown in Table 1. For example, this is ideal for generating 3.3 V from a Lithium-Ion cell. Note  
that RC snubbers are placed across the primary and secondary windings to reduce ringing due to leakage  
inductance. These are optional, and may not be required in the application.  
Note that for converters where V and V  
adequate gate drive. This is illustrated in the example if Figure 7.  
may both be below 3 V, a charge pump is needed to provide  
IN  
OUT  
14  
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ꢈ ꢀꢉꢊ ꢋꢈ ꢌ ꢍꢎ ꢏꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔꢀ ꢎꢕꢁꢖ ꢗꢘ ꢈ ꢁꢌ ꢕ ꢊꢓ ꢌꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
flyback topology using n-channel MOSFETs (continued)  
V
IN  
2.5 V TO 8.0 V  
+
C
IN  
100µF  
10 V  
10  
L1A  
COILTRONICS  
CTX5−2  
470 pF  
UCC39421  
RSEL 16  
1 k  
RSEN  
1
2
C
R3  
100 k  
1%  
POLE  
C
R
COMP  
COMP  
V
L1B  
OUT  
VOUT  
COMP 15  
FB 14  
3.3 V  
0.1µF  
470 pF  
10  
RG2 4.7  
Q1A  
Si9802  
(N)  
R2  
41 k  
1%  
3
4
VGRECT  
PGND  
C
+
OUT  
PFM 13  
Q1B  
Si9802  
(N)  
R1  
20 k  
1%  
RG1  
4.7  
5
6
CHRG  
GND 12  
RT 11  
RT  
100 k  
R
0.05Ω  
SENSE  
VPUMP  
SYNC/SD 10  
7
8
CP  
ISENSE  
9
VIN  
+V  
IN  
0.1µF  
C5  
0.1µF  
R
1.5 k  
SLOPE  
UDG−98113  
Figure 6. Application Diagram for the Flyback Topology Using the N-channel Synchronous Rectifier  
15  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
flyback topology using n-channel MOSFETs (continued)  
V
IN  
+1.8 V TO 4.2 V  
+
C
IN  
100µF  
10V  
L1A  
COILTRONICS  
CTX5−2  
UCC39421  
1 k  
RSEL 16  
1
2
RSEN  
CPOLE  
CCOMP  
R3  
100 k  
1%  
RCOMP  
L1B  
VOUT  
VOUT  
COMP 15  
FB 14  
2.5 V  
0.1µF  
470 pF  
10  
RG2 4.7  
Q1A  
Si9802  
(N)  
R2  
41 k  
1%  
3
4
VGRECT  
PGND  
COUT  
+
PFM 13  
Q1B  
Si9802  
(N)  
R1  
20 k  
1%  
RG1  
4.7  
D1  
1N4148  
5
6
7
CHRG  
VPUMP  
CP  
GND 12  
RT 11  
RT  
100 k  
SYNC/SD 10  
RSENSE  
0.05  
0.1µF  
ISENSE  
9
8
VIN  
+V  
IN  
0.1 F  
µ
RSLOPE 1.5 k  
RBIAS 180 k  
UDG−98211  
Figure 7. Flyback Converter Using Charge Pump Input for Low Voltage Operation  
relating peak inductor current to average output current for the flyback converter  
For a continuous mode flyback converter, the average output current is related to the peak inductor current by  
the following:  
ǒ(IOUT Ǔ  
)
di  
2
(9)  
I
+
PEAK  
)
1 * D  
where D is the duty cycle and the inductor ripple current, dI, is defined as:  
t
  V  
D   V  
ON  
IN  
+
IN  
f   L  
(10)  
di +  
L
where f is the switching frequency and L is the inductor value. The duty cycle is defined as:  
16  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
relating peak inductor current to average output current for the flyback converter (continued)  
V
D + ǒV Ǔ  
O
) V  
(11)  
IN  
O
Substituting equations (10) and (11) into equation (9) yields:  
I
V
V
OUT  
V
O
IN  
ǒV Ǔ  
2   f   L  
) V  
(12)  
I
+
)
 
PEAK  
IN  
O
O
1 * ǒ Ǔ  
ǒ Ǔ  
V
)V  
IN  
O
Figure 7 shows an example of a converter where both V and V  
may be quite low in voltage. In this case,  
IN  
OUT  
a diode has been added to peak detect the voltage on the drain of the charge FET and use it for the pump input  
voltage. This is used to drive the gates of the FETs. To assure that the pump voltage is used (rather than V ,  
IN  
which may be low), resistor R  
is discussed further in the section Changing the Low Power Threshold.  
has also been added to the ISENSE input to inhibit LP mode. This technique  
BIAS  
V
IN  
1.8 TO 6.0V  
+
C
IN  
L1A  
100µF  
10V  
10µF 16V  
UCC39421  
RSEL 16  
1k  
RSEN  
1
2
C
R3  
100k  
1%  
V
3.3V  
POLE  
OUT  
Q2  
(P)  
C
R
L1B  
COMP  
COMP  
VOUT  
COMP 15  
FB 14  
10µF  
10V  
+
0.1µF  
R2  
41k  
1%  
3
4
VGRECT  
PGND  
PFM 13  
Q1  
R1  
20k  
1%  
Si9802  
(N)  
5
6
CHRG  
GND 12  
RT 11  
RT  
47k  
VPUMP  
1M  
0.1µF  
SYNC  
INPUT  
R
0.05Ω  
SENSE  
SYNC/SD 10  
7
8
CP  
ISENSE  
9
VIN  
+V  
IN  
0.1µF  
1.5k  
R
SLOPE  
UDG−98214  
Figure 8. Application Diagram for the SEPIC Technology Using a P-channel Synchronous Rectifier  
17  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
SEPIC topology using N- and P-channel MOSFETs  
The UCC39421 may also be used in the SEPIC (single-ended primary inductance converter) topology. This  
topology, which is similar to the flyback, uses a capacitor to aid in energy transfer from input to output. This  
configuration is shown in Figure 8. The N-channel synchronous rectifier has been changed to a P-channel and  
moved to the other end of the inductor’s secondary winding, and a new capacitor has been placed across the  
dotted ends of the two windings. The SEPIC topology offers the same advantage of the flyback in that it can  
generate an output voltage that is greater or less than the input voltage.  
However, it also offers improved efficiency. Although it requires an additional capacitor in the power stage, it  
greatly reduces ripple current in the input capacitor and improves efficiency by transferring the energy in the  
leakage inductance of the coupled inductor to the output. This also provides snubbing for the primary and  
secondary windings, eliminating the need for RC snubbers. Note that the capacitor must have low ESR, with  
sufficient ripple current rating for the application. Another advantage of the SEPIC is that the inductors do not  
have to be on the same core.  
PWM duty cycle and slope compensation  
All boost and flyback converters using peak current mode control are susceptible to a phenomenon known as  
subharmonic oscillation when operated in the continuous conduction mode beyond 50% duty cycle. Continuous  
conduction mode (CCM) means that the inductor current never goes to zero during the switching cycle. For a  
CCM boost converter, the required duty cycle for a given input and output voltage (neglecting voltage drops  
across the MOSFET switches) is given by equation (7). This is shown graphically for a number of common  
output voltages in Figure 9. For example, it can be seen that for a 3.3-V output (using the boost topology) slope  
compensation is not required because the duty cycle never exceeds 50%.  
For the flyback topology, using a coupled inductor with a 1:1 turns ratio, the duty cycle is defined by  
equation (11). This is shown graphically for a number of common output voltages in Figure 10.  
To prevent subharmonic oscillation beyond 50% duty cycle, a technique called slope compensation is used,  
which modifies the slope of the current ramp. This is accomplished by adding a part of the timing ramp to the  
current-sense input. In the UCC39421, this can be done by simply adding a resistor in series with the ISENSE  
input. A current is sourced within the IC which is proportional to the internal timing ramp voltage. The value of  
the resistor determines the amount of slope compensation added.  
The slope compensation output current at the ISENSE pin is equal to:  
1
(13)  
I
+
Ańm sec  
SLOPE  
R
T
where RT is the timing resister in ohms ().  
The required slope compensation resistor for a boost configuration is given by the equation:  
ǒVOUT  
Ǔ
* 2   V  
  R  
  R  
ǒ
Ǔ
T
SENSE  
IN min  
(14)  
R
+
SLOPE  
L
where R  
is the current-sense resistor value in ohms () and L is the inductor value in microhenries (µH).  
SENSE  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
PWM duty cycle and slope compensation (continued)  
For a flyback topology, using a 1:1 turns ratio, the equation becomes:  
ǒVOUT  
Ǔ
* V  
  R  
  R  
ǒ
Ǔ
T
SENSE  
IN min  
15)  
R
+
SLOPE  
L
If the converter is operated in the discontinuous conduction mode (inductor current drops to zero), no slope  
compensation is required. The point at which this mode boundary occurs is a function of switching frequency,  
input voltage, output voltage, load current, and inductor value. However, in general the converter is more  
efficient when operated in the continuous conduction mode due to the lower peak currents.  
CCM BOOST CONVERTER DUTY CYCLE  
CCM FLYBACK CONVERTER DUTY CYCLE  
vs  
vs  
INPUT VOLTAGE  
INPUT VOLTAGE  
80%  
70%  
60%  
50%  
40%  
70%  
60%  
VOUT = 5.0 V  
VOUT = 5 V  
VOUT = 3.3 V  
30%  
20%  
50%  
40%  
VOUT = 3.0 V  
10%  
0%  
VOUT = 2.5 V  
VOUT = 3.3 V  
30%  
2
2.5  
3
3.5  
4
4.5  
2
3
4
V
IN  
− Input Voltage − V  
V
IN  
− Input Voltage − V  
Figure 10  
Figure 9  
voltage mode control  
The UCC39421 can be operated as a voltage mode controller by connecting a 5.6-kresistor from the ISENSE  
pin to ground. The internal current source generates an artificial ramp voltage on this input. In this case, no slope  
compensation is required, and no current-sense resistor is required in series with the source of the N-channel  
MOSFET. A typical application diagram is shown in Figure 11. However, in this configuration there is no  
overcurrent protection. In addition, the pulse and low power modes, designed to increase efficiency at light  
loads, operates at different load currents. This is because the internal error amplifier’s output voltage is no longer  
a direct function of load current, but rather of duty cycle. When operating in CCM, the duty cycle is largely a  
function of input and output voltage, not load current. At light enough loads however, the converter goes into  
discontinuous mode and the error amplifier voltage drops low enough to activate the low power and pulse  
modes.  
19  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
voltage mode control (continued)  
V
IN  
1.8 V TO 4.5 V  
+
100  
C
µ
10V  
IN  
L1  
F
UCC39421  
V
OUT  
1 k  
5.0 V  
RSEN  
VOUT  
RSEL 16  
1
2
C
R3  
100 k  
1%  
POLE  
Q2  
(P)  
+
µ
0.1  
10V  
F
C
C
R
COMP  
OUT  
COMP  
µ
0.1  
F
COMP 15  
FB 14  
RG2  
4.7  
R2  
41 k  
1%  
3
4
VGRECT  
PGND  
PFM 13  
R1  
20 k  
1%  
RG1  
4.7  
Q1  
(N)  
5
6
CHRG  
GND 12  
RT 11  
RT  
100 k  
VPUMP  
µ
F
0.1  
SYNC/SD 10  
7
8
CP  
ISENSE  
9
R
SLOPE  
5.6 k  
VIN  
+V  
IN  
µ
F
0.1  
UDG−98215  
Figure 11. Typical Boost Configuration Using Voltage Mode Control  
start up  
The UCC39421 incorporates a unique feature to help it start-up at low input voltages. If the input voltage is below  
2.5 V at start-up, a separate control circuit takes over until V or V gets above 2.5 V. In this mode, the  
OUT  
PUMP  
charge MOSFET is turned on for 5 µs, or until the voltage on the ISENSE pin reaches 36 mV, whichever occurs  
first. The charge MOSFET then remains off for a fixed time of 2.5 µs, and the body diode of the synchronous  
rectifier MOSFET is used to supply current to the output. This cycle repeats until either V  
or V  
exceeds  
OUT  
PUMP  
2.5 V. This results in constant off time control, with a minimum switching frequency of approximately 120 kHz.  
During this low voltage start-up mode, all other internal circuitry is off, including the synchronous rectifier drive  
and the slope compensation current source. The peak inductor current during this mode is limited to:  
0.036  
(16)  
I
+
PEAK  
R
SENSE  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
start up (continued)  
If input voltages below 2.5 V are expected, it is important to use a low voltage logic N-channel MOSFET (with  
a threshold voltage around 1 V or less) to ensure start-up at full load.  
A block diagram of the low voltage start-up logic is shown in Figure 12.  
V
IN  
L
V
UCC39421  
PUMP  
+
C
PUMP  
C
FLY  
D
V
V
PUMP  
IN  
2.5 V < V  
2.5 V < V  
2.5 V < V  
LPM < V  
PUMP  
PUMP  
BODY  
V
OUT  
OUT  
COMP  
A
B
C
NORMAL PWM  
A/B  
OUT  
MUX  
DRIVER  
µ
5− sec  
DELAY  
Q
S
R
SENSE  
+
Q
R
µ
2.5− sec  
DELAY  
36 mV  
UDG−98121  
Figure 12. Symplified Diagram of Low Voltage Start−Up and Charge Pump Control Logic  
anticross-conduction and adaptive synchronous rectifier commutation logic  
When operating in the continuous conduction mode (CCM), the charge MOSFET and the synchronous rectifier  
MOSFET are simply driven out of phase, so that when one is on the other is off. There is a built-in time delay  
of about 30 ns to prevent any cross-conduction.  
In the event that the converter is operating in the discontinuous conduction mode (DCM), the synchronous  
rectifier needs to be turned off sooner, when the rectifier current drops to zero. Otherwise, the output begins  
to discharge as the current reverses and goes back through the rectifier to the input. (This obviously cannot  
happen when using a conventional diode rectifier). To prevent this, the UCC39421 incorporates a high-speed  
comparator that senses the voltage on the synchronous rectifier (using the RSEN input) for purposes of  
commutation. In the boost and SEPIC topologies, the synchronous rectifier is turned off when the voltage on  
the RSEN pin goes negative with respect to V  
decoupled.  
. For this reason, it is important to have the VOUT pin well  
OUT  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
anticross-conduction and adaptive synchronous rectifier commutation logic (continued)  
In the flyback topology however (using a ground referenced N-channel MOSFET rectifier), the rectifier voltage  
is sensed on the MOSFET drain, with respect to ground rather than V . The voltage polarity in this case is  
OUT  
opposite that of the boost and SEPIC topologies. This problem is solved with the adaptive logic within the  
UCC39421. During each charge cycle, while the N-channel charge FET is on, a latch is set if the voltage on the  
RSEN pin exceeds V /2. This indicates a flyback topology, since this node is be equal to or greater than V  
IN  
IN  
at this time. In the case of the boost and the SEPIC, the voltage at the RSEN input is near or below ground, and  
the latch is not be set. This allows the UCC39421 to sense which topology is in use and adapt the synchronous  
rectifier commutation logic accordingly. Note that the RSEN input must have a series resistor to limit the current  
when going below ground. Values less than or equal to 1 kare recommended to prevent time delay due to  
stray capacitance.  
current-sense amplifier and leading edge blanking  
The UCC39421 includes a high-speed current-sense amplifier with a nominal gain of 10 to minimize losses  
associated with the current-sense resistor. The amplifier was designed to provide good response and minimal  
propagation delay, allowing switching frequencies at 2 MHz. The current-sense resistor should be chosen to  
provide a maximum peak voltage of 100 mV at full load, with the minimum input voltage.  
A leading-edge blanking time of 40 ns is provided to filter out leading-edge spikes in the current-sense  
waveform. In most applications, this eliminates the need for a filter capacitor on the ISENSE pin.  
overcurrent protection  
The UCC39421 includes a peak current limit function. If the voltage on the ISENSE pin exceeds 0.15 V after  
the initial blanking period, the pulse is terminated and the charge MOSFET is turned off.  
sync/shutdown input  
The SYNC/SD pin has two functions; it may be used to synchronize the UCC39421’s switching frequency to  
an external clock, or to shutdown the IC entirely. In shutdown, the quiescent current is reduced to just a few  
microamps.  
To synchronize the internal clock to an external source, the SYNC/SD pin must be driven high, above 2.0 V  
minimum. The circuitry syncs to the rising edge of the input, the pulse width is not critical.  
To shutdown the converter, the SYNC/SD pin must be held high (above 2.0 V) for a minimum of 29 µs.  
This pin should be grounded if not used.  
changing the low power mode threshold  
For some applications the user may want to lower the low power (LP) mode threshold, or even eliminate this  
feature altogether. For example, if a boost topology is being used, and the input voltage is below 2.5 V, the gate  
drive to the charge FET may want to be derived from the pump (or output) voltage under all load conditions,  
rather than from V . This means the converter would never be allowed to operate in LP mode.  
IN  
22  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
changing the low power mode threshold (continued)  
Although the LP mode threshold is internally fixed at 0.6 V (referenced to the pin), the point at which the LP  
mode is entered can be easily modified by adding a single resistor, as shown in Figure 13. Resistor R  
forms  
BIAS  
a divider with R  
(used for slope compensation) and adds a dc offset to the current-sense input, raising  
SLOPE  
the output voltage of the sense amplifier and fooling the LP mode comparator into thinking the load is higher  
than it is. The required bias resistor to transition out of LP mode for a given peak current can be calculated using  
the following equation:  
R
  V  
SLOPE  
0.03 * I  
OUT  
  R  
(17)  
R
+
BIAS  
PEAK  
SENSE  
UCC39421  
600 mV  
LP MODE  
V
IN  
+
FB 17  
CONTROL  
LOGIC  
1.24 V  
+
COMP 18  
V
OUT  
CHRG  
DRIVE  
C
OUT  
6
+
R
SLOPE  
PWM  
X10  
12  
ISENSE  
300 mV  
R
SENSE  
R
BIAS  
UDG−98213  
Figure 13. Modifying Low Power (LP) Mode Threshold  
Due to the current-sense amplifier gain of 10 and the internal offset of 300 mV, an offset of just 30 mV or more  
at the ISENSE pin inhibits the LP mode altogether. Note that inhibiting LP mode does not prevent PFM from  
working, as long as the PFM pin is set to a voltage higher than:  
18)  
ǒ
ISENSEǓ) 0.3V  
10   V  
programming the PWM frequency  
Some applications may want to remain in a fixed frequency mode of operation, even at light load, rather than  
going into PFM mode. This lowers efficiency at light load. One way to improve the efficiency while maintaining  
fixed frequency operation is to lower the PWM frequency under light load conditions. This can be easily done,  
as shown in Figure 14. By adding a second timing resistor and a small MOSFET switch, the host can switch  
between two discrete frequencies at any time.  
23  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
non-synchronous boost for higher output voltage applications  
The UCC39421 can also be used in non-synchronous applications to provide output voltages greater than 8  
volts from low voltage inputs. An example of a 12-V boost application is shown in Figure 16. Since none of the  
IC pins are exposed to the boosted voltage, the output voltage is limited only by the ratings of the external  
MOSFET, rectifier, and filter capacitor. At these higher output voltages, good efficiency is maintained since the  
rectifier drop is small compared to the output voltage. Note that PFM mode can still be used to maintain high  
efficiency at light load. Typical efficiency causes are shown in Figure 15.  
Since all the power supply pins (VIN, VOUT, VPUMP) operate off the input voltage, it must be >2.5 V and high  
enough to assure proper gate drive to the charge FET.  
VOUT  
UCC39421  
1
2
3
RSEN  
RSEL 16  
COMP 15  
FB 14  
R1  
R2  
VOUT  
VGRECT  
4
5
PGND  
CHRG  
VPUMP  
PFM 13  
GND 12  
6
7
8
RT 11  
RT2  
CP  
SYNC/SD 10  
ISENSE  
RT1  
VIN  
9
FREQUENCY  
CONTROL  
2N7002  
UDG−98216  
Figure 14. Changing the PWM Frequency  
24  
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ꢈ ꢀꢉꢊ ꢋꢈ ꢌ ꢍꢎ ꢏꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔꢀ ꢎꢕꢁꢖ ꢗꢘ ꢈ ꢁꢌ ꢕ ꢊꢓ ꢌꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
non−synchronous boost for higher output voltage applications (continued)  
NON-SYNCHRONOUS BOOST EFFICIENCY  
95%  
VIN = 5 V  
90%  
85%  
VIN = 3.3 V  
80%  
75%  
70%  
f
= 550 kHz  
L = 6.8 mH  
DT3316P−682 (IRF7601) MBR0530  
VPFM = 0.5 V  
65%  
60%  
0.001  
0.01  
0.1  
1
I
− Output Current − A  
OUT  
Figure 15  
25  
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ꢈ ꢀ ꢉꢊ ꢋ ꢈꢌꢍ ꢎ ꢏ ꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔ ꢀꢎꢕ ꢁꢖ ꢗ ꢘꢈ ꢁꢌ ꢕꢊ ꢓꢌ ꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
non−synchronous boost for higher output voltage applications (continued)  
3.0 V TO 8.0V  
C
100  
+
IN  
µ
F
16V  
L1  
µ
H
6.8  
R3  
249 K  
1%  
UCC39421  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
RSEN  
VOUT  
RSEL  
COMP  
FB  
C
12V  
POLE  
1.25 V  
C
100  
16V  
D1  
MBR0530T  
OUT  
+
R2  
17.8 K  
1%  
µ
R
COMP  
F
C
COMP  
N/C  
VGRECT  
PGND  
R1  
11 K  
1%  
PFM  
GND  
Q1  
(N)  
RG1  
4.7  
VGCHRG  
RT  
100 K  
R
0.05  
SENSE  
VPUMP  
CP  
RT  
SYNC/SD  
ISENSE  
+V  
IN  
VIN  
µ
F
0.1  
R
1.5 K  
SLOPE  
UDG−98212  
Figure 16. Non-Synchronous Boost Converter for Higher Output Voltages  
UCC39422 features  
The UCC39422 is a 20-pin device that adds a reset function and an uncommitted comparator to the UCC39421.  
A simplified diagram of the reset circuit is shown in Figure 17.  
g
=1/26 k  
m
1
RESET  
FB  
17  
+
V
S
R
Q
Q
IN  
+
8 pF  
µ
1
A
1.175 V  
RSADJ  
1.175 V  
20  
C
RESET  
+
1.175 V  
UDG−98206  
Figure 17. Reset Circuitry  
26  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
The reset circuit monitors the voltage at the feedback (FB) pin and issues a reset if the feedback voltage drops  
below 1.175 V. This represents a 6% drop in output voltage. Monitoring the voltage internally at the FB pin  
eliminates the need for another external voltage divider. The RESET output is an open-drain output that is active  
low during reset. It stays low until the feedback voltage is above 1.175 V for a period of time called the reset  
pulse width, which is user programmable. An external capacitor on the RSADJ pin and an internal 1-µA current  
source determine the reset pulse width, according to the following equation:  
(19)  
t
+ C  
  1.18  
RESET  
where t  
RESET  
is the reset pulse width in seconds, and C  
is the capacitor value in microFarads (µF).  
RESET  
RESET  
An adaptive glitch filter is included to prevent nuisance trips. This is implemented using a gm amplifier to charge  
an 8-pF capacitor to 1.175 V before declaring a reset. This provides a delay which is inversely proportional to  
the magnitude of the feedback voltage error. The delay time is approximated by the following equation:  
0.25  
1.175 * V  
(20)  
t
^
ms  
DELAY  
FB  
where t  
is the filter delay time in microseconds. Note that the maximum current from the gm amplifier is  
DELAY  
limited to 2 µA, limiting the minimum time delay to 4.8 µs.  
A typical application schematic using the UCC39422 is shown in Figure 18. In this example, R1 and R2 have  
been selected to trip the LOWBAT output when V drops below 2.0 V. Note that the RESET and LOWBAT  
IN  
outputs are open drain and require a pullup.  
27  
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ꢈ ꢀ ꢉꢊ ꢋ ꢈꢌꢍ ꢎ ꢏ ꢋ ꢐꢏ ꢑꢒꢓ ꢎꢔ ꢀꢎꢕ ꢁꢖ ꢗ ꢘꢈ ꢁꢌ ꢕꢊ ꢓꢌ ꢉ ꢉꢎ ꢓ  
SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
UCC39422 features (continued)  
VIN  
RESET* (ACTIVE LOW)  
UCC39422  
+CIN  
L1  
C
RESET  
1
2
3
4
5
6
RSETB  
RSEN  
RSADJ 20  
RSEL 19  
1 k  
Q1 (P)  
C
POLE  
+V  
OUT  
VOUT  
+ C  
C
COMP  
R
OUT  
COMP  
COMP 18  
FB 17  
RG  
VGRECT  
PGND  
CHRG  
µ
0.1 F  
RG  
PFM 16  
Q1 (N)  
GND 15  
RT  
R
µ
0.1 F  
SENSE  
100 k  
7
8
VPUMP  
CP  
RT 14  
SYNC/SD 13  
ISENSE 12  
VDET 11  
R2  
150 k  
9
VIN  
+V  
IN  
+V  
µ
0.1 F  
IN  
R1  
250 k  
10 LOWBAT  
47 pF  
LOWBAT (ACTIVE HIGH)  
R
THRESHOLD = 2.0 V  
SLOPE  
UDG−99034  
Figure 18. Typical UCC39422 Application  
28  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
selecting the inductor  
The inductor must be chosen based on the desired operating frequency and the maximum load current. Higher  
frequencies allow the use of lower inductor values, reducing component size. Higher load currents require larger  
inductors with higher current ratings and less winding resistance to minimize losses. The inductor must be rated  
for operation at the highest anticipated peak current. Refer to equation (8) and equation (12) to calculate the  
peak inductor current for a boost or flyback design, based on V , V  
, maximum load, frequency, and inductor  
IN OUT  
value. Some manufacturers rate their parts for maximum energy storage in microjoules (µJ). This is expressed  
by:  
2
(21)  
E + 0.5   L   I  
PEAK  
where E is the required energy rating in microjoules. L is the inductor value in microhenries (µH) (with current  
applied), and I  
is the peak current in amps that the inductor sees in the application. Another way in which  
PEAK  
inductor ratings are sometimes specified is the maximum volt-seconds applied. This is given simply by:  
V
  D  
IN  
(22)  
, and f is the switching  
OUT  
E   T +  
f
where ET is the required rating in V-µs, D is the duty cycle for a given V and V  
IN  
frequency in MHz. Refer to equations (7) and (11) to calculate the duty cycle for a CCM boost or flyback  
converter.  
In any case, the inductor must use a low loss core designed for high-frequency operation. High-frequency ferrite  
cores are recommended. Some manufacturers of off-the-shelf surface-mount designs are listed in Table 3. For  
flyback and SEPIC topologies, use a two-winding coupled inductor. SEPIC designs can also use two discrete  
inductors.  
Table 3. MT COMMERCIAL INDUCTOR MANUFACTURERS  
Coilcraft Inc. (800) 322−2645.1102 Silver Lake RD, Cary, IL 60013  
Coiltronics Inc. (407) 241−7876 6000 Park of Commerce Blvd, Boca Raton, FL 33487  
Dale Electronics, Inc. (605) 665−9301East Highway 50, Yankton, SD 57078  
Pulse Engineering Ltd. (204) 633−4321300 Keewatin Street, Winnipeg, MB R2X 2R9  
Sumida Voice (65) 296−3388 Fax (65) 293−3390 Block 996, Bendemeer Rd., #04−05/06 Singapore 33944  
BH Electronics (612) 894−9590 12219 Wood Lake Drive, Burnsville, MN 55337  
Tokin America Inc. (408) 432−8020155 Nicholson Lane, San Jose CA 95134  
29  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
selecting the filter capacitor  
The input and output filter capacitors must have low ESR and low ESL. Surface-mount tantalum, OSCONs or  
multilayer ceramics (MLCs) are recommended. The capacitor selected must have the proper ripple current  
rating for the application. Some recommended capacitor types are listed in Table 4.  
Table 4. RECOMMENDED SMT FILTER CAPACITORS  
Manufacturer  
AVX  
Part Number  
TPS series  
Features  
Low ESR tantalum  
Low ESR tantalum  
Low ESR ceramic  
Low ESR organic  
Low ESR, low profile tantalum  
Low ESR tantalum  
Low ESR ceramic  
Low ESR ceramic  
Kemet  
T410 series  
GRM series  
OSCON series  
591D series  
594D series  
Y5U, Y5V Type  
X5R Type  
Murata  
Sanyo  
Sprague  
Tokin  
Taiyo Yuden  
circuit layout and grounding  
As with any high frequency switching power supply, circuit layout, hookup, and grounding are critical for proper  
operation. Although this may be a relatively low-power, low-voltage design, these issues are still very important.  
The MOSFET turn-on and turn-off times necessary to maintain high efficiency at high switching frequencies of  
1 MHz or more result in high dv/dt and di/dts. This makes stray circuit inductance especially critical. In addition,  
the high impedances associated with low-power designs, such as in the feedback divider, make them especially  
susceptible to noise pickup.  
layout  
The component layout should be as tight as possible to minimize stray inductance. This is especially true of the  
high-current paths, such as in series with the MOSFETs and the input and output filter capacitors.  
The components associated with the feedback, compensation and timing should be kept away from the power  
components (MOSFETs, inductor). Keep all components as close to the IC pins as possible. Nodes that are  
especially noise sensitive are the FB and RT pins. Other sensitive pins are COMP and PFM.  
grounding  
A ground plane is highly recommended. The PGND pin of the UCC39421 should be close to the grounded end  
of the current-sense resistor, the input filter cap, and the output filter cap. The GND pin should be close to the  
grounded end of the RT resistor, the feedback divider resistor, the ISENSE capacitor (if used), and the  
compensation network.  
MOSFET gate resistors  
The UCC39421 includes low-impedance CMOS output drivers for the two external MOSFET switches. The  
CHRG output has a nominal resistance of 4 , and the RECT has a nominal resistance of 2 . For  
high-frequency operation using low gate charge MOSFETs, no gate resistors are required. To reduce  
high-frequency ringing at the MOSFET gates, low-value series gate resistors may be added. These should be  
non-inductive resistors, with a value of 2 to 10 , depending on the frequency of operation. Lower values  
results in better switching times, improving efficiency.  
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SLUS246C − OCTOBER 1999 − REVISED FEBRUARY 2005  
APPLICATION INFORMATION  
minimizing output ripple and noise spikes  
The amount of output ripple is determined primarily by the type of output filter capacitor and how it is connected  
in the circuit. In most cases, the ripple is be dominated by the ESR (equivalent series resistance) and ESL  
(equivalent series inductance) of the capacitor, rather than the actual capacitance value. Low ESR and ESL  
capacitors are mandatory in achieving low output ripple. Surface-mount packages greatly reduce the ESL of  
the capacitor, minimizing noise spikes. To further minimize high frequency spikes, a surface mount ceramic  
capacitor should be placed in parallel with the main filter capacitor. For best results, a capacitor should be  
chosen whose self-resonant frequency is near the frequency of the noise spike. For high switching frequencies,  
ceramic capacitors alone may be used, reducing size and cost.  
For applications where the output ripple must be extremely low, a small LC filter may be added to the output.  
The resonant frequency should be below the selected switching frequency, but above that of any dynamic loads.  
The filter’s resonant frequency is given by:  
1
(23)  
f
+
RES  
Ǹ
2 p L   C  
Where f is the frequency in Hz, L is the filter inductor value in Henries, and C is the filter capacitor value in Farads.  
It is important to select an inductor rated for the maximum load current and with minimal resistance to reduce  
losses. The capacitor should be a low-impedance type, such as a tantalum.  
If an LC ripple filter is used, the feedback point can be taken before or after the filter, as long as the filter’s  
resonant frequency is well above the loop crossover frequency. Otherwise, the additional phase lag makes the  
loop unstable. The only advantage to connecting the feedback after the filter is that any small voltage drop  
across the filter inductor is corrected for in the loop, providing the best possible voltage regulation. However,  
the resistance of the inductor is usually low enough that the voltage drop is negligible.  
31  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
PACKAGING INFORMATION  
Orderable Device  
UCC29421N  
Status Package Type Package Pins Package Qty  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
(1)  
(2)  
(3)  
(4)  
NRND  
PDIP  
PDIP  
N
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
N / A for Pkg Type  
UCC29421N  
UCC29421N  
29421  
UCC29421NG4  
UCC29421PW  
NRND  
NRND  
NRND  
NRND  
NRND  
NRND  
NRND  
NRND  
NRND  
NRND  
NRND  
N
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
PW  
PW  
PW  
PW  
N
90  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
N / A for Pkg Type  
UCC29421PWG4  
UCC29421PWTR  
UCC29421PWTRG4  
UCC39421N  
90  
Green (RoHS  
& no Sb/Br)  
29421  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
29421  
Green (RoHS  
& no Sb/Br)  
29421  
Green (RoHS  
& no Sb/Br)  
UCC39421N  
UCC39421N  
39421  
UCC39421NG4  
UCC39421PW  
PDIP  
N
25  
Green (RoHS  
& no Sb/Br)  
N / A for Pkg Type  
0 to 70  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
90  
Green (RoHS  
& no Sb/Br)  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
0 to 70  
UCC39421PWG4  
UCC39421PWTR  
UCC39421PWTRG4  
90  
Green (RoHS  
& no Sb/Br)  
0 to 70  
39421  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
0 to 70  
39421  
Green (RoHS  
& no Sb/Br)  
0 to 70  
39421  
UCC39422N  
UCC39422NG4  
UCC39422PW  
OBSOLETE  
OBSOLETE  
NRND  
PDIP  
PDIP  
N
N
20  
20  
20  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
0 to 70  
0 to 70  
0 to 70  
UCC39422N  
TSSOP  
PW  
70  
70  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-2-260C-1 YEAR  
UCC39422  
UCC39422  
UCC39422PWG4  
NRND  
TSSOP  
PW  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-2-260C-1 YEAR  
0 to 70  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
21-Mar-2013  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) Only one of markings shown within the brackets will appear on the physical device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
UCC29421PWTR  
UCC39421PWTR  
TSSOP  
TSSOP  
PW  
PW  
16  
16  
2000  
2000  
330.0  
330.0  
12.4  
12.4  
6.9  
6.9  
5.6  
5.6  
1.6  
1.6  
8.0  
8.0  
12.0  
12.0  
Q1  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
UCC29421PWTR  
UCC39421PWTR  
TSSOP  
TSSOP  
PW  
PW  
16  
16  
2000  
2000  
367.0  
367.0  
367.0  
367.0  
35.0  
35.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
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complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
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