UCC5622FQP [TI]

27 - Line SCSI Terminator With Split Disconnect;
UCC5622FQP
型号: UCC5622FQP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

27 - Line SCSI Terminator With Split Disconnect

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UCC5622  
27 - Line SCSI Terminator With Split Disconnect  
FEATURES  
DESCRIPTION  
Complies with SCSI, SCSI-2, SCSI-3, The UCC5622 provides 27 lines of active termination for a SCSI (Small  
SPI and FAST-20 (Ultra) Standards  
Computer Systems Interface) parallel bus. The SCSI standard recom-  
mends active termination at both ends of the cable.  
2.5pF Channel Capacitance During  
Disconnect  
The UCC5622 is ideal for high performance 5V SCSI systems. During dis-  
connect the supply current is typically only 100µA, which makes the IC at-  
tractive for lower powered systems.  
100µA Supply Current in Disconnect  
Mode  
The UCC5622 features a split disconnect allowing the user to control termi-  
nation lines 10 to 27 with disconnect one, DISCNCT1, and control terminia-  
tion lines 1 to 9 with disconnect two, DISCNCT2.  
4V To 7V Operation  
110Termination  
The UCC5622 is designed with a low channel capacitance of 2.5pF, which  
eliminates effects on signal integrity from disconnected terminators at in-  
terim points on the bus.  
Completely Meets SCSI Hot Plugging  
–900mA Sourcing Current for  
Termination  
The power amplifier output stage allows the UCC5622 to source full termi-  
nation current and sink active negation current when all termination lines  
are actively negated.  
+500mA Sinking Current for Active  
Negation  
Logic Command Disconnects all  
Termination Lines  
The UCC5622, as with all Unitrode terminators, is completely hot plugga-  
ble and appears as high impedance at the teminating channels with  
V
= 0V or open.  
TRMPWR  
Split Disconnect Controls Lines 1 to 9  
and 10 to 27 Separately  
Internal circuit trimming is utilized, first to trim the 110impedance, and  
then most importantly, to trim the output current as close to the maximum  
SCSI-3 specification as possible, which maximizes noise margin in FAST-  
20 SCSI operation.  
Trimmed Impedance to 5%  
Current Limit and Thermal Shutdown  
Protection  
(continued)  
BLOCK DIAGRAM  
UDG-96113  
Circuit Design Patented  
10/98  
UCC5622  
CONNECTION DIAGRAM  
ABSOLUTE MAXIMUM RATINGS  
TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V  
Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to +7V  
Regulator Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5A  
Storage Temperature . . . . . . . . . . . . . . . . . . . 65°C to +150°C  
Junction Temperature. . . . . . . . . . . . . . . . . . . 55°C to +150°C  
Lead Temperature (Soldering, 10 Sec.). . . . . . . . . . . . . +300°C  
SSOP-44 (Top View)  
MWP Package  
Currents are positive into, negative out of the specified termi-  
nal. Consult Packaging Section of Databook for thermal limita-  
tions and considerations of packages.  
LQFP-48 (Top View)  
MWP Package  
DESCRIPTION (cont.)  
Other features include thermal shutdown and current limit.  
This device is offered in low thermal resistance versions  
of the industry standard 44 pin wide body QSOP (MWP)  
and 48 pin LQFP (FQP). Consult QSOP-44 and LQFP-48  
Packaging Diagram for exact dimensions.  
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = 0°C to 70°C,  
TRMPWR = 4.75V, DISCNCT1 = DSCNCT2 = 0V, TA = TJ.  
PARAMETER  
Supply Current Section  
TRMPWR Supply Current  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
All Termination Lines = Open  
1
2
mA  
mA  
µA  
All Termination Lines = 0.2V  
630  
100  
650  
200  
Power Down Mode  
DISCNCT1 = DSCNCT2 = TRMPWR  
2
UCC5622  
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = 0°C to 70°C,  
TRMPWR = 4.75V, DISCNCT1 = DSCNCT2 = 0V, TA = TJ.  
PARAMETER  
Output Section (Termination Lines)  
Termination Impedance  
Output High Voltage  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
(Note 3)  
(Note 1)  
104.5  
2.6  
110  
2.8  
23.3  
23.3  
23  
115.5  
3.0  
24  
V
Max Output Current  
VLINE = 0.2V, TJ = 25 C  
22.1  
20.7  
21  
mA  
mA  
mA  
mA  
mA  
nA  
VLINE = 0.2V  
24  
VLINE = 0.2V, TRMPWR = 4V, TJ = 25°C (Note 1)  
VLINE = 0.2V, TRMPWR = 4V (Note 1)  
VLINE = 0.5V  
24  
20  
23  
24  
22.4  
400  
Output Leakage  
DISCNCT1 = DISCNCT2 = 2.4V, TRMPWR = 0V to  
5.25V  
10  
Output Capacitance  
Regulator Section  
DISCNCT1 = DISCNCT2 = 2.4V (Note 2)  
2.5  
4
pF  
Regulator Output Voltage  
Drop Out Voltage  
2.6  
2.8  
0.4  
3.0  
0.8  
V
V
All Termination Lines = 0.2V  
VREG = 0V  
Short Circuit Current  
650  
300  
900 –1300  
mA  
mA  
°C  
°C  
Sinking Current Capability  
Thermal Shutdown  
VREG = 3.5V  
500  
170  
10  
900  
Thermal Shutdown Hysteresis  
Disconnect Section  
Disconnect Threshold DISCNCT1  
Input Current DISCNCT1  
Controls Lines 10 to 27  
DISCNCT1 = 0V  
0.8  
0.8  
1.5  
–10  
1.5  
2.0  
–30  
2
V
µA  
V
Disconnect Threshold DISCNCT2 Controls Lines 1 to 9  
Input Current DISCNCT2 DISCNCT2 = 0V  
–10  
–30  
µA  
Note 1:Measuring each termination line while other 26 are low (0.2V).  
Note 2:Guaranteed by design. Not 100% tested in production.  
Note 3: Tested by measuring IOUT with VOUT = 0.2V and VOUT with no load, then calculate:  
=
PIN DESCRIPTIONS  
DISCNCT1: Disconnect one controls termination lines GND: Ground reference for the IC.  
10 – 27. Taking this pin high or leaving it open causes  
L1 – L27: 110termination channels.  
termination lines 10 - 27 to become high impedence, tak-  
ing this pin low allows the channels to provide normal ter-  
mination.  
REG: Output of the internal 2.7V regulator.  
TRMPWR: Power for the IC.  
DISCNCT2: Disconnect two controls termination lines  
1 – 9. Taking this pin high or leaving it open causes  
termination lines 1 - 9 to become high impedence. Taking  
this pin low allows the channels to provide normal  
terminiation. Taking both disconnect pins high or leaving  
them open will put the chip in to sleep mode where it will  
be in low-power mode.  
3
UCC5622  
UDG-98172  
Figure 1. Typical Wide SCSI Bus Configuration Using the UCC5622  
UNITRODE CORPORATION  
7 CONTINENTAL BLVD MERRIMACK, NH 03054  
TEL (603) 424-2410 FAX (603) 424-3460  
4
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1999, Texas Instruments Incorporated  

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