UCC5638_06 [TI]

Multimode SCSI 15 Line Terminator;
UCC5638_06
型号: UCC5638_06
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Multimode SCSI 15 Line Terminator

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UCC5638  
Multimode SCSI 15 Line Terminator  
DESCRIPTION  
FEATURES  
The UCC5638 Multimode SCSI Terminator provides a smooth transition  
into the LVD SCSI Parallel Interface (SPI-2, SPI-3, SPI-4). It automatically  
senses the bus, via DIFFB, and switches the termination to either single  
ended (SE) or low voltage differential (LVD) SCSI, dependent on which  
type of devices are connected to the bus. The UCC5638 can not be used  
on a HVD, EIA485, differential SCSI bus. If the UCC5638 detects a HVD  
SCSI device, it switches to a high impedance state.  
Auto Selection Single Ended (SE) or  
Low Voltage Differential (LVD)  
Termination  
Meets SCSI-1, SCSI-2, Ultra2 (SPI-2  
LVD SCSI), Ultra3, Ultra160 (SPI-3)  
and Ultra320 (SPI-4) Standards  
2.7V to 5.25V Operation  
Differential Failsafe Bias  
The Multimode terminator contains all functions required to terminate and  
auto detect and switch modes for SPI-2, SPI-3 and SPI-4 bus architectures.  
Single Ended and Differential impedances and currents are trimmed for  
maximum effectiveness. Fail Safe biasing is provided to insure signal integ-  
rity. Device/Bus type detection circuitry is integrated into the terminator to  
provide automatic switching of termination between single ended and LVD  
SCSI and a high impedance for HVD SCSI. The multimode function pro-  
vides all the performance analog functions necessary to implement SPI-2  
termination in a single monolithic device.  
Thermal packaging for low junction  
temperature and better MTBF.  
The UCC5638 is offered in a 48 pin LQFP package for a temperature range  
of 0°C to 70°C.  
BLOCK DIAGRAM  
(NOISE LOAD)  
HIGH POWER  
2.15V  
DIFFB 34  
0.6V  
DIFFERENTIAL  
REF  
1.3V  
1.3V  
35 DIFFSEN  
LOW VOLTAGE  
DIFFERENTIAL  
–15mA I  
50µA I  
–5mA  
SOURCE  
200µA  
SINGLE ENDED  
SINK  
110  
124  
REF  
2.7V  
SOURCE/SINK REGULATOR  
56mV  
52.5  
52.5  
+
REF  
1.25V  
12 L1–  
11 L1+  
56mV  
+
MODE  
SE  
ALL SWITCHES  
UP  
LVD  
DISCNCT  
DOWN  
OPEN  
SE GND SWITCH  
10µA  
110  
124  
DISCNCT  
TRMPWR  
36  
3
56mV  
52.5  
52.5  
+
2
1
L15–  
L15+  
56mV  
+
SE GND SWITCH  
HS/GND  
4-9  
HS/GND  
28-33  
27  
10  
REG  
GND  
4.7µF .  
UDG-98063  
SLUS271B - FEBRUARY 2000 - REVISED APRIL 2001  
UCC5638  
ABSOLUTE MAXIMUM RATINGS  
CONNECTION DIAGRAMS  
TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6V  
Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 5V  
Package Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2W  
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C  
Junction Temperature. . . . . . . . . . . . . . . . . . . 55°C to +150°C  
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300°C  
Recommended Operating Conditions . . . . . . . . . 2.7V to 5.25V  
(TOP VIEW)  
FQP Package  
HS/GND  
HS/GND  
HS/GND  
HS/GND  
HS/GND  
HS/GND  
REG  
L1+  
L1–  
TRMPWR  
L15–  
L15+  
Currents are positive into negative out of the specified terminal.  
Note: Consult Packaging Section of Databook for thermal limi-  
tations and considerations of package.  
12  
10  
2
11  
9
8
7
6
4
3
1
5
L2+  
L2–  
L3+  
L3–  
L4+  
L4–  
L5+  
L5–  
L6+  
L6–  
L7+  
L7–  
L14–  
L14+  
L13–  
L13+  
L12–  
L12+  
L11–  
L11+  
L10–  
L10+  
L9–  
13  
14  
15  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
RECOMMENDED OPERATING CONDITIONS  
TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.25V  
Temperature Ranges . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C  
16  
17  
18  
19  
20  
21  
22  
23  
24  
L9+  
25  
27  
35  
26  
28 29 30 31  
33 34  
36  
32  
DISCNCT  
DIFFSENS  
DIFFB  
L8+  
L8–  
GND  
HS/GND  
HS/GND  
HS/GND  
HS/GND  
HS/GND  
HS/GND  
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = TJ = 0°C to 70°C,  
TRMPWR = 3.3V.  
PARAMETER  
TRMPWR Supply Current Section  
TRMPWR Supply Current  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
LVD SCSI Mode  
20  
1.6  
250  
25  
10  
mA  
mA  
A
SE SCSI Mode  
Disabled Terminator  
400  
Regulator Section  
1.25V Regulator  
LVD SCSI Mode  
VREG = 0V  
1.15  
1.25  
1.35  
V
1.25V Regulator Source Current  
1.25V Regulator Sink Current  
1.3V Regulator  
–375 –700 –1000 mA  
VREG = 3.3V  
Diff Sense  
170  
1.2  
–15  
50  
300  
1.3  
700  
1.4  
–5  
mA  
V
1.3V Regulator Source Current  
1.3V Regulator Sink Current  
2.7V Regulator  
VREG = 0V  
mA  
A
VREG = 3.3V  
SE SCSI Mode  
VREG = 0V  
200  
3.0  
2.5  
2.7  
V
2.7V Regulator Source Current  
2.7V Regulator Sink Curren  
Differential Termination Section  
Differential Impedance  
Common Mode Impedence  
Differential Bias Voltage  
Common Mode Bias  
–375 –700 –1000 mA  
VREG = 3.3V  
170  
300  
700  
mA  
100  
110  
100  
1.15  
105  
150  
110  
165  
125  
1.35  
3
(Note 2)  
mV  
V
1.25  
Output Capacitance  
Single Ended Measurement to Ground (Note 1)  
2
pF  
UCC5638  
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = TJ = 0°C to 70°C,  
TRMPWR = 3.3V.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNITS  
Single Ended Termination Section  
Impedance  
102.3  
110  
117.7  
(VLX 0.2V )  
Z =  
, (Note 3)  
ILX  
Termination Current  
Signal Level 0.2V, All Lines Low  
Signal Level 0.5V  
–21  
–18  
–24  
–25.4  
–22.4  
400  
3
mA  
mA  
nA  
Output Leakage  
Output Capacitance  
Single Ended Measurement to Ground (Note 1)  
I = 10mA  
pF  
Single Ended GND SE Impedance  
Disconnect and Diff Buffer Input Section  
DISCNCT Threshold  
20  
10  
60  
0.8  
2.0  
30  
V
A
V
V
A
DISCNCT Input Current  
Diff Buffer Single Ended to LVD Threshold  
Diff Buffer LVD to HPD Threshold  
DIFFB Input Current  
0.5  
1.9  
–10  
0.7  
2.4  
10  
Note 1: Ensured by design. Not 100% tested in production.  
1.2V  
(VCM max) I(VCM min)  
Note 2: Line+ (positive) tied to Line– (negative);  
I
[
]
Note 3: VLX= Output voltage for each terminator minus output pin (L1– through L15–) with each pin unloaded.  
ILX = Output current for each terminator minus output pin (L1– through L15–) with the minus output pin forced to 0.2V.  
PIN DESCRIPTIONS  
DIFFB: Diff sense filter pin should be connected at a LINEn–: Signal line active line for single ended or nega-  
4.7 F capacitor.  
tive line in differential applications for the SCSI bus.  
DIFFSENS: The SCSI bus Diff Sense line to detect what  
LINEn+: Ground line for single ended or positive line for  
types of devices are connected to the SCSI bus.  
differential applications for the SCSI bus.  
DISCNCT: Disconnect pin shuts down the terminator REG: Regulator bypass pin, must be connected to a  
when it is not at the end of the bus. The disconnect pin  
low enables the terminator.  
4.7 F capacitor.  
TRMPWR: VIN 2.7V to 5.25V supply, bypass near the  
terminator with a 4.7 F capacitor to ground.  
Note: In Disconnect Mode, the comparitor set powers down for  
low idle current.  
3
UCC5638  
APPLICATION INFORMATION  
The UCC5638 is a Multi-mode active terminator with se- with 4 mil etch and 4 mil spacing between the runs within  
lectable single ended (SE) and low voltage differential a pair, and a minimum of 8 mil spacing to the next pair.  
(LVD) SCSI termination integrated into a monolithic com- This spacing between the pairs reduces potential  
ponent. Mode selection is accomplished with the “diff crosstalk. Beware of feed-throughs and each through  
sense" signal.  
hole connection adds a lot of capacitance. Standard  
power and ground plane spacing yields about 1pF to  
each plane. Each feed-through will add about 2.5pF to  
3.5pF. Enlarging the clearance holes on both power and  
ground planes can reduce the capacitance and opening  
up the power and ground planes under the connector  
can reduce the capacitance for through hole connector  
applications. Microstrip technology is normally too low of  
impedance and should not be used. It is designed for  
50 rather than 120 differential systems.  
The diff sense signal is a three level signal, which is  
driven at each end of the bus by one active terminator.  
An LVD SCSI or multi-mode terminator drives the diff  
sense line to 1.3 V. If diff sense is at 1.3 V, then bus is in  
LVD SCSI mode. If a single ended SCSI device is  
plugged into the bus, the diff sense line is shorted to  
ground. With diff sense shorted to ground, the terminator  
changes to single ended mode to accommodate the SE  
device. If an HVD SCSI device is plugged in to the bus,  
the diff sense line is pulled high and the terminator shuts  
down.  
Capacitance balance is critical for Ultra2 and  
Ultra3/Ultra160. The balance capacitance standard is  
0.5pF per line with the balance between pairs of 2pF.  
The components are designed with very tight balance,  
typically 0.1pF between pins in a pair and 0.3pF between  
pairs. Layout balance is critical, feed-throughs and etch  
length must be balanced, preferably no feed-throughs  
would be used. Capacitance for devices should be meas-  
ured in the typical application, material and components  
above and below the circuit board effect the capacitance.  
The diff sense line is driven and monitored by the termi-  
nator through a 100ms to 300ms noise filter at the DIFFB  
input pin. A set of comparators, that allow for ground  
shifts, determine the bus status as follows. Any diff sense  
signal below 0.5V indicates single ended, between 0.7V  
and 1.9V is LVD SCSI and above 2.2V is HVD SCSI.  
In the single ended mode, a multi-mode terminator has a  
110 terminating resistor connected to a 2.7V termina-  
tion voltage regulator. The 2.7V regulator is used on all  
Unitrode terminators designed for 3.3V systems. This re-  
quires the terminator to operate in specification down to  
2.7V TRMPWR voltage to allow for the 3.3V supply toler-  
ance, an unidirectional fusing device and cable drop. At  
each L+ pin, a ground driver drives the pin to ground,  
while in single ended mode. The ground driver is spe-  
cially designed so it will not effect the capacitive balance  
Multi-mode terminators need to consider power dissipa-  
tion; the UCC5638 is offered in a power package with  
heat sink ground pins. These heat sink/ground pins are  
directly connected to the die mount paddle under the die  
and conduct heat from the die to reduce the junction  
temperature. These pins need to be connected to etch  
area or a feed-through per pin connecting to the ground  
plane layer on a multi-layer board.  
of the bus when the device is in LVD SCSI or disconnect In 3.3V TRMPWR systems, the UCC3912 should be  
mode. The device requirements call for 0.5pF balance on used to replace the fuse and diode. This reduces the  
the lines of a differential pair. The terminator capacitance voltage drop, allowing for cable drop to the far end termi-  
has to be a small part of the capacitance imbalance.  
nator. 3.3V battery systems normally have a 10% toler-  
ance. The UCC3912 is 150mV drop under LVD SCSI  
loads, allowing 150mV drop in the cable system. All Uni-  
trode LVD SCSI and multi-mode terminators are de-  
signed for 3.3V systems, operating down to 2.7V.  
Layout is very critical for Ultra2, Ultra3, Ultra160 and  
Ultra320 systems. Multi-layer boards need to adhere to  
the 120 impedance standard, including connector and  
feed-through. This is normally done on the outer layers  
4
UCC5638  
TYPICAL APPLICATION  
L1+  
L1–  
L1+  
L1–  
TERMPWR  
TRMPWR  
3
TRMPWR  
TRMPWR  
3
CONTROL LINES (9)  
L9+  
L9–  
L9+  
L9–  
L10+  
L10–  
L10+  
L10–  
4 BITS OF THE HIGH BYTE  
L15+  
L15–  
L15+  
L15–  
36  
36  
DISCNCT  
DISCNCT  
DIFFSENSE 35  
35 DIFFSENSE  
REG  
10  
DIFF B  
34  
DIFF B  
34  
REG  
10  
50k  
50k  
4.7µF  
.
4.7µF  
4.7µF  
4.7µF  
270k  
4.7µF  
.
4.7µF  
L1+  
L1+  
L1–  
L1–  
HIGH BYTE 4 BITS  
PLUS PARITY  
DATA LINES (15)  
DATA LINES (15)  
L5+  
L5–  
L5+  
L5–  
3
TRMPWR  
TRMPWR  
3
L6+  
L6–  
L6+  
L6–  
LOW BYTE 8+ PARITY  
L14+  
L14–  
L14+  
L14–  
36  
36  
DISCNCT  
DISCNCT  
REG  
10  
DIFF B  
34  
DIFF B  
34  
REG  
10  
4.7µF  
.
4.7µF  
SCSI CONTROLLER  
DIFFSENS  
UDG-98064  
Note: A 220k resistor is added to ground to insure the transceivers will come up in single-ended mode when no terminator is en-  
abled. The controller DIFFSENS ties to the DIFFB pin on the terminators, only one RC network should be on a device.  
5
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Jul-2006  
PACKAGING INFORMATION  
Orderable Device  
UCC5638FQP  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
LQFP  
PT  
48  
48  
48  
48  
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
UCC5638FQPG4  
UCC5638FQPTR  
UCC5638FQPTRG4  
LQFP  
LQFP  
LQFP  
PT  
PT  
PT  
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MTQF003A – OCTOBER 1994 – REVISED DECEMBER 1996  
PT (S-PQFP-G48)  
PLASTIC QUAD FLATPACK  
0,27  
0,17  
M
0,08  
0,50  
36  
25  
37  
24  
48  
13  
0,13 NOM  
1
12  
5,50 TYP  
7,20  
SQ  
6,80  
Gage Plane  
9,20  
SQ  
8,80  
0,25  
0,05 MIN  
0°7°  
1,45  
1,35  
0,75  
0,45  
Seating Plane  
0,10  
1,60 MAX  
4040052/C 11/96  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-026  
D. This may also be a thermally enhanced plastic package with leads conected to the die pads.  
1
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