UCC5638_06 [TI]
Multimode SCSI 15 Line Terminator;型号: | UCC5638_06 |
厂家: | TEXAS INSTRUMENTS |
描述: | Multimode SCSI 15 Line Terminator |
文件: | 总8页 (文件大小:127K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
UCC5638
Multimode SCSI 15 Line Terminator
DESCRIPTION
FEATURES
The UCC5638 Multimode SCSI Terminator provides a smooth transition
into the LVD SCSI Parallel Interface (SPI-2, SPI-3, SPI-4). It automatically
senses the bus, via DIFFB, and switches the termination to either single
ended (SE) or low voltage differential (LVD) SCSI, dependent on which
type of devices are connected to the bus. The UCC5638 can not be used
on a HVD, EIA485, differential SCSI bus. If the UCC5638 detects a HVD
SCSI device, it switches to a high impedance state.
• Auto Selection Single Ended (SE) or
Low Voltage Differential (LVD)
Termination
• Meets SCSI-1, SCSI-2, Ultra2 (SPI-2
LVD SCSI), Ultra3, Ultra160 (SPI-3)
and Ultra320 (SPI-4) Standards
• 2.7V to 5.25V Operation
• Differential Failsafe Bias
The Multimode terminator contains all functions required to terminate and
auto detect and switch modes for SPI-2, SPI-3 and SPI-4 bus architectures.
Single Ended and Differential impedances and currents are trimmed for
maximum effectiveness. Fail Safe biasing is provided to insure signal integ-
rity. Device/Bus type detection circuitry is integrated into the terminator to
provide automatic switching of termination between single ended and LVD
SCSI and a high impedance for HVD SCSI. The multimode function pro-
vides all the performance analog functions necessary to implement SPI-2
termination in a single monolithic device.
• Thermal packaging for low junction
temperature and better MTBF.
The UCC5638 is offered in a 48 pin LQFP package for a temperature range
of 0°C to 70°C.
BLOCK DIAGRAM
(NOISE LOAD)
HIGH POWER
2.15V
DIFFB 34
0.6V
DIFFERENTIAL
REF
1.3V
1.3V
35 DIFFSEN
LOW VOLTAGE
DIFFERENTIAL
–15mA ≤ I
50µA ≤ I
≤ –5mA
SOURCE
≤ 200µA
SINGLE ENDED
SINK
110
124
REF
2.7V
SOURCE/SINK REGULATOR
56mV
52.5
52.5
–
+
REF
1.25V
12 L1–
11 L1+
56mV
+
–
MODE
SE
ALL SWITCHES
UP
LVD
DISCNCT
DOWN
OPEN
SE GND SWITCH
10µA
110
124
DISCNCT
TRMPWR
36
3
56mV
52.5
52.5
–
+
2
1
L15–
L15+
56mV
+
–
SE GND SWITCH
HS/GND
4-9
HS/GND
28-33
27
10
REG
GND
4.7µF .
UDG-98063
SLUS271B - FEBRUARY 2000 - REVISED APRIL 2001
UCC5638
ABSOLUTE MAXIMUM RATINGS
CONNECTION DIAGRAMS
TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6V
Signal Line Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 5V
Package Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2W
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature. . . . . . . . . . . . . . . . . . . –55°C to +150°C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . . +300°C
Recommended Operating Conditions . . . . . . . . . 2.7V to 5.25V
(TOP VIEW)
FQP Package
HS/GND
HS/GND
HS/GND
HS/GND
HS/GND
HS/GND
REG
L1+
L1–
TRMPWR
L15–
L15+
Currents are positive into negative out of the specified terminal.
Note: Consult Packaging Section of Databook for thermal limi-
tations and considerations of package.
12
10
2
11
9
8
7
6
4
3
1
5
L2+
L2–
L3+
L3–
L4+
L4–
L5+
L5–
L6+
L6–
L7+
L7–
L14–
L14+
L13–
L13+
L12–
L12+
L11–
L11+
L10–
L10+
L9–
13
14
15
48
47
46
45
44
43
42
41
40
39
38
37
RECOMMENDED OPERATING CONDITIONS
TRMPWR Voltage . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.25V
Temperature Ranges . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
16
17
18
19
20
21
22
23
24
L9+
25
27
35
26
28 29 30 31
33 34
36
32
DISCNCT
DIFFSENS
DIFFB
L8+
L8–
GND
HS/GND
HS/GND
HS/GND
HS/GND
HS/GND
HS/GND
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = TJ = 0°C to 70°C,
TRMPWR = 3.3V.
PARAMETER
TRMPWR Supply Current Section
TRMPWR Supply Current
TEST CONDITIONS
MIN
TYP
MAX UNITS
LVD SCSI Mode
20
1.6
250
25
10
mA
mA
A
SE SCSI Mode
Disabled Terminator
400
Regulator Section
1.25V Regulator
LVD SCSI Mode
VREG = 0V
1.15
1.25
1.35
V
1.25V Regulator Source Current
1.25V Regulator Sink Current
1.3V Regulator
–375 –700 –1000 mA
VREG = 3.3V
Diff Sense
170
1.2
–15
50
300
1.3
700
1.4
–5
mA
V
1.3V Regulator Source Current
1.3V Regulator Sink Current
2.7V Regulator
VREG = 0V
mA
A
VREG = 3.3V
SE SCSI Mode
VREG = 0V
200
3.0
2.5
2.7
V
2.7V Regulator Source Current
2.7V Regulator Sink Curren
Differential Termination Section
Differential Impedance
Common Mode Impedence
Differential Bias Voltage
Common Mode Bias
–375 –700 –1000 mA
VREG = 3.3V
170
300
700
mA
100
110
100
1.15
105
150
110
165
125
1.35
3
(Note 2)
mV
V
1.25
Output Capacitance
Single Ended Measurement to Ground (Note 1)
2
pF
UCC5638
ELECTRICAL CHARACTERISTICS Unless otherwise stated, these specifications apply for TA = TJ = 0°C to 70°C,
TRMPWR = 3.3V.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNITS
Single Ended Termination Section
Impedance
102.3
110
117.7
(VLX −0.2V )
Z =
, (Note 3)
ILX
Termination Current
Signal Level 0.2V, All Lines Low
Signal Level 0.5V
–21
–18
–24
–25.4
–22.4
400
3
mA
mA
nA
Output Leakage
Output Capacitance
Single Ended Measurement to Ground (Note 1)
I = 10mA
pF
Single Ended GND SE Impedance
Disconnect and Diff Buffer Input Section
DISCNCT Threshold
20
10
60
0.8
2.0
30
V
A
V
V
A
DISCNCT Input Current
Diff Buffer Single Ended to LVD Threshold
Diff Buffer LVD to HPD Threshold
DIFFB Input Current
0.5
1.9
–10
0.7
2.4
10
Note 1: Ensured by design. Not 100% tested in production.
1.2V
(VCM max) – I(VCM min)
Note 2: Line+ (positive) tied to Line– (negative);
I
[
]
Note 3: VLX= Output voltage for each terminator minus output pin (L1– through L15–) with each pin unloaded.
ILX = Output current for each terminator minus output pin (L1– through L15–) with the minus output pin forced to 0.2V.
PIN DESCRIPTIONS
DIFFB: Diff sense filter pin should be connected at a LINEn–: Signal line active line for single ended or nega-
4.7 F capacitor.
tive line in differential applications for the SCSI bus.
DIFFSENS: The SCSI bus Diff Sense line to detect what
LINEn+: Ground line for single ended or positive line for
types of devices are connected to the SCSI bus.
differential applications for the SCSI bus.
DISCNCT: Disconnect pin shuts down the terminator REG: Regulator bypass pin, must be connected to a
when it is not at the end of the bus. The disconnect pin
low enables the terminator.
4.7 F capacitor.
TRMPWR: VIN 2.7V to 5.25V supply, bypass near the
terminator with a 4.7 F capacitor to ground.
Note: In Disconnect Mode, the comparitor set powers down for
low idle current.
3
UCC5638
APPLICATION INFORMATION
The UCC5638 is a Multi-mode active terminator with se- with 4 mil etch and 4 mil spacing between the runs within
lectable single ended (SE) and low voltage differential a pair, and a minimum of 8 mil spacing to the next pair.
(LVD) SCSI termination integrated into a monolithic com- This spacing between the pairs reduces potential
ponent. Mode selection is accomplished with the “diff crosstalk. Beware of feed-throughs and each through
sense" signal.
hole connection adds a lot of capacitance. Standard
power and ground plane spacing yields about 1pF to
each plane. Each feed-through will add about 2.5pF to
3.5pF. Enlarging the clearance holes on both power and
ground planes can reduce the capacitance and opening
up the power and ground planes under the connector
can reduce the capacitance for through hole connector
applications. Microstrip technology is normally too low of
impedance and should not be used. It is designed for
50 rather than 120 differential systems.
The diff sense signal is a three level signal, which is
driven at each end of the bus by one active terminator.
An LVD SCSI or multi-mode terminator drives the diff
sense line to 1.3 V. If diff sense is at 1.3 V, then bus is in
LVD SCSI mode. If a single ended SCSI device is
plugged into the bus, the diff sense line is shorted to
ground. With diff sense shorted to ground, the terminator
changes to single ended mode to accommodate the SE
device. If an HVD SCSI device is plugged in to the bus,
the diff sense line is pulled high and the terminator shuts
down.
Capacitance balance is critical for Ultra2 and
Ultra3/Ultra160. The balance capacitance standard is
0.5pF per line with the balance between pairs of 2pF.
The components are designed with very tight balance,
typically 0.1pF between pins in a pair and 0.3pF between
pairs. Layout balance is critical, feed-throughs and etch
length must be balanced, preferably no feed-throughs
would be used. Capacitance for devices should be meas-
ured in the typical application, material and components
above and below the circuit board effect the capacitance.
The diff sense line is driven and monitored by the termi-
nator through a 100ms to 300ms noise filter at the DIFFB
input pin. A set of comparators, that allow for ground
shifts, determine the bus status as follows. Any diff sense
signal below 0.5V indicates single ended, between 0.7V
and 1.9V is LVD SCSI and above 2.2V is HVD SCSI.
In the single ended mode, a multi-mode terminator has a
110 terminating resistor connected to a 2.7V termina-
tion voltage regulator. The 2.7V regulator is used on all
Unitrode terminators designed for 3.3V systems. This re-
quires the terminator to operate in specification down to
2.7V TRMPWR voltage to allow for the 3.3V supply toler-
ance, an unidirectional fusing device and cable drop. At
each L+ pin, a ground driver drives the pin to ground,
while in single ended mode. The ground driver is spe-
cially designed so it will not effect the capacitive balance
Multi-mode terminators need to consider power dissipa-
tion; the UCC5638 is offered in a power package with
heat sink ground pins. These heat sink/ground pins are
directly connected to the die mount paddle under the die
and conduct heat from the die to reduce the junction
temperature. These pins need to be connected to etch
area or a feed-through per pin connecting to the ground
plane layer on a multi-layer board.
of the bus when the device is in LVD SCSI or disconnect In 3.3V TRMPWR systems, the UCC3912 should be
mode. The device requirements call for 0.5pF balance on used to replace the fuse and diode. This reduces the
the lines of a differential pair. The terminator capacitance voltage drop, allowing for cable drop to the far end termi-
has to be a small part of the capacitance imbalance.
nator. 3.3V battery systems normally have a 10% toler-
ance. The UCC3912 is 150mV drop under LVD SCSI
loads, allowing 150mV drop in the cable system. All Uni-
trode LVD SCSI and multi-mode terminators are de-
signed for 3.3V systems, operating down to 2.7V.
Layout is very critical for Ultra2, Ultra3, Ultra160 and
Ultra320 systems. Multi-layer boards need to adhere to
the 120 impedance standard, including connector and
feed-through. This is normally done on the outer layers
4
UCC5638
TYPICAL APPLICATION
L1+
L1–
L1+
L1–
TERMPWR
TRMPWR
3
TRMPWR
TRMPWR
3
CONTROL LINES (9)
L9+
L9–
L9+
L9–
L10+
L10–
L10+
L10–
4 BITS OF THE HIGH BYTE
L15+
L15–
L15+
L15–
36
36
DISCNCT
DISCNCT
DIFFSENSE 35
35 DIFFSENSE
REG
10
DIFF B
34
DIFF B
34
REG
10
50k
50k
4.7µF
.
4.7µF
4.7µF
4.7µF
270k
4.7µF
.
4.7µF
L1+
L1+
L1–
L1–
HIGH BYTE 4 BITS
PLUS PARITY
DATA LINES (15)
DATA LINES (15)
L5+
L5–
L5+
L5–
3
TRMPWR
TRMPWR
3
L6+
L6–
L6+
L6–
LOW BYTE 8+ PARITY
L14+
L14–
L14+
L14–
36
36
DISCNCT
DISCNCT
REG
10
DIFF B
34
DIFF B
34
REG
10
4.7µF
.
4.7µF
SCSI CONTROLLER
DIFFSENS
UDG-98064
Note: A 220k resistor is added to ground to insure the transceivers will come up in single-ended mode when no terminator is en-
abled. The controller DIFFSENS ties to the DIFFB pin on the terminators, only one RC network should be on a device.
5
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
UCC5638FQP
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
LQFP
PT
48
48
48
48
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
UCC5638FQPG4
UCC5638FQPTR
UCC5638FQPTRG4
LQFP
LQFP
LQFP
PT
PT
PT
250 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MTQF003A – OCTOBER 1994 – REVISED DECEMBER 1996
PT (S-PQFP-G48)
PLASTIC QUAD FLATPACK
0,27
0,17
M
0,08
0,50
36
25
37
24
48
13
0,13 NOM
1
12
5,50 TYP
7,20
SQ
6,80
Gage Plane
9,20
SQ
8,80
0,25
0,05 MIN
0°–7°
1,45
1,35
0,75
0,45
Seating Plane
0,10
1,60 MAX
4040052/C 11/96
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-026
D. This may also be a thermally enhanced plastic package with leads conected to the die pads.
1
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