UCD3020A [TI]
具有多达 2 个稳压输出和 6 个 DPWM 输出的完全可编程的数字功率控制器;
| 型号： | UCD3020A |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有多达 2 个稳压输出和 6 个 DPWM 输出的完全可编程的数字功率控制器 控制器 功率控制 |
| 文件： | 总12页 (文件大小：2164K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
For data sheet and general inquiries on the UCD30xx part family, please contact
ucd30xxdigitalpowersupport@list.ti.com
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
UCD3020RGZR
UCD3020RGZR
UCD3020RGZT
UCD3020RGZT
UCD3028RHAR
UCD3028RHAT
UCD3040PFCR
UCD3040RGCR
UCD3040RGCT
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
TQFP
VQFN
VQFN
RGZ
RGZ
RGZ
RGZ
RHA
RHA
PFC
RGC
RGC
48
48
48
48
40
40
80
64
64
2500
2500
250
330.0
330.0
180.0
180.0
330.0
180.0
330.0
330.0
180.0
16.4
16.4
16.4
16.4
16.4
16.4
24.4
16.4
16.4
7.3
7.3
7.3
7.3
6.3
6.3
15.0
9.3
9.3
7.3
7.3
7.3
7.3
6.3
6.3
15.0
9.3
9.3
1.5
1.5
1.5
1.5
1.1
1.1
1.5
1.5
1.5
12.0
12.0
12.0
12.0
12.0
12.0
20.0
12.0
12.0
16.0
16.0
16.0
16.0
16.0
16.0
24.0
16.0
16.0
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
250
2500
250
1000
2000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
UCD3020RGZR
UCD3020RGZR
UCD3020RGZT
UCD3020RGZT
UCD3028RHAR
UCD3028RHAT
UCD3040PFCR
UCD3040RGCR
UCD3040RGCT
VQFN
VQFN
VQFN
VQFN
VQFN
VQFN
TQFP
VQFN
VQFN
RGZ
RGZ
RGZ
RGZ
RHA
RHA
PFC
RGC
RGC
48
48
48
48
40
40
80
64
64
2500
2500
250
367.0
367.0
210.0
210.0
367.0
210.0
367.0
367.0
210.0
367.0
367.0
185.0
185.0
367.0
185.0
367.0
367.0
185.0
38.0
38.0
35.0
35.0
38.0
35.0
45.0
38.0
35.0
250
2500
250
1000
2000
250
Pack Materials-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
UCD3020ARGZR
UCD3020ARGZT
ACTIVE
ACTIVE
VQFN
VQFN
RGZ
RGZ
48
48
2500 RoHS & Green
250 RoHS & Green
NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
-40 to 125
-40 to 125
UCD3020A
UCD3020A
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Mar-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
UCD3020ARGZR
UCD3020ARGZT
VQFN
VQFN
RGZ
RGZ
48
48
2500
250
330.0
180.0
16.4
16.4
7.3
7.3
7.3
7.3
1.1
1.1
12.0
12.0
16.0
16.0
Q2
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
25-Mar-2015
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
UCD3020ARGZR
UCD3020ARGZT
VQFN
VQFN
RGZ
RGZ
48
48
2500
250
367.0
210.0
367.0
185.0
38.0
35.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RGZ 48
7 x 7, 0.5 mm pitch
VQFN - 1 mm max height
PLASTIC QUADFLAT PACK- NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224671/A
www.ti.com
PACKAGE OUTLINE
VQFN - 1 mm max height
RGZ0048A
PLASTIC QUADFLAT PACK- NO LEAD
A
7.1
6.9
B
(0.1) TYP
7.1
6.9
SIDE WALL DETAIL
OPTIONAL METAL THICKNESS
PIN 1 INDEX AREA
(0.45) TYP
CHAMFERED LEAD
CORNER LEAD OPTION
1 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
2X 5.5
5.15±0.1
(0.2) TYP
13
24
44X 0.5
12
25
SEE SIDE WALL
DETAIL
SYMM
2X
5.5
1
36
0.30
0.18
PIN1 ID
(OPTIONAL)
48X
48
37
SYMM
0.1
C A B
C
0.5
0.3
48X
0.05
SEE LEAD OPTION
4219044/D 02/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
VQFN - 1 mm max height
RGZ0048A
PLASTIC QUADFLAT PACK- NO LEAD
2X (6.8)
5.15)
SYMM
(
48X (0.6)
37
48
48X (0.24)
44X (0.5)
1
36
SYMM
2X
2X
(5.5)
(6.8)
2X
(1.26)
2X
(1.065)
(R0.05)
TYP
25
12
21X (Ø0.2) VIA
TYP
24
13
2X (1.065)
2X (1.26)
2X (5.5)
LAND PATTERN EXAMPLE
SCALE: 15X
SOLDER MASK
OPENING
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
EXPOSED METAL
EXPOSED METAL
METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4219044/D 02/2022
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
VQFN - 1 mm max height
RGZ0048A
PLASTIC QUADFLAT PACK- NO LEAD
2X (6.8)
SYMM
(
1.06)
37
48X (0.6)
48
48X (0.24)
44X (0.5)
1
36
SYMM
2X
2X
(5.5)
(6.8)
2X
(0.63)
2X
(1.26)
(R0.05)
TYP
25
12
24
13
2X
(1.26)
2X (0.63)
2X (5.5)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
67% PRINTED COVERAGE BY AREA
SCALE: 15X
4219044/D 02/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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