UCD3138128_15 [TI]

UCD3138x Highly-Integrated Digital Controller For Isolated Power;
UCD3138128_15
型号: UCD3138128_15
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
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UCD3138x Highly-Integrated Digital Controller For Isolated Power

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UCD3138128, UCD3138A64  
SLUSBZ8A JUNE 2014REVISED SEPTEMBER 2014  
UCD3138x Highly-Integrated Digital Controller For Isolated Power  
1 Features  
– Low IC Standby Power  
Primary Side Voltage Sensing  
1
64 kB and 128 kB Program Flash Derivative of  
UCD3138 Family  
Current Share (Average & Master/Slave)  
Feature Rich Fault Protection Options  
2-32 kB or 4-32 kB Program Flash Memory  
Banks  
7 Analog / 4 Digital Comparators,  
Cycle-by-Cycle Current Limiting  
Supports Execution From 1 Bank, While  
Programming Another  
Programmable Blanking Time and Fault  
Counting  
Capability to Update Firmware Without  
Shutting Down the Power Supply  
External Fault Inputs  
Additional Communication Ports Compared to  
the UCD3138 (+1 SPI, +1 I2C)  
Synchronization of DPWM Waveforms Between  
Multiple UCD3138x Devices  
Boot Flash Based Dual Memory Image  
Support for ‘On the Fly’ Firmware Updates  
15 channel, 12 bit, 267 ksps General Purpose  
ADC  
Digital Control of up to 3 Independent Feedback  
Loops  
Internal Temperature Sensor  
Fully Programmable High-Performance 31.25  
MHz, 32-bit ARM7TDMI-S Processor  
Dedicated PID Based Hardware  
2-pole/2-zero Configurable, Non-Linear Control  
64 kB Program Flash (2-32 kB Banks)  
2 kB Data Flash with ECC  
Up to 16 MSPS Error A/D Converter (EADC)  
Configurable Resolution (min: 1mV/LSB)  
8 kB Data RAM  
Up to 8x Oversampling and Adaptive Sample  
Positioning  
4 kB Boot ROM Enables Firmware Boot-Load  
Communication Peripherals,  
Hardware Based Averaging (up to 8x)  
14 bit Effective Reference DAC  
2 - I2C/PMBus interfaces  
2 - UARTs, 1 - SPI  
Up to 8 High Resolution Digital Pulse Width  
Modulated (DPWM) Outputs  
Timer Capture with Selectable Input Pins  
80-pin QFP Package  
250 ps Pulse Width Resolution  
Operating Temperature: –40°C to 125°C  
4 ns Frequency and Phase Resolution  
Adjustable Phase Shift and Dead-bands  
Cycle-by-Cycle Duty Cycle Matching  
Up to 2 MHz Switching Frequency  
2 Applications  
Power Supplies and Telecom Rectifiers  
Power Factor Correction  
Configurable Trailing/Leading/Triangular  
Modulation  
Isolated DC-DC Modules  
Phase Shifted Full Bridge with Peak Current Mode  
Control, LLC, HSFB, Forward, etc.  
RTC support  
Configurable Feedback Control  
Typical Applications and Tools  
Voltage, Average Current and Peak Current  
Mode Control  
Best in Class Firmware  
Development Tools  
Constant Current, Constant Power  
UCD3138A64  
UCD3138128  
Configurable FM, Phase Shift Modulation and  
PWM  
Advanced Configuration &  
Advanced Topology Control  
Fast, Automatic and Smooth Mode Switching  
Debug Tools  
VIN  
Q1  
Q3  
Transformer  
LK  
LR  
Frequency Modulation and PWM  
Phase Shift Modulation and PWM  
Q2  
VIN  
LM  
CO  
esr  
Q1  
Q2  
Q4  
SR2  
n2  
n2  
CR  
L0  
L
n
M
1
High Efficiency and Light Load Management  
C0  
+ Forward, Flyback,  
Half-bridge, etc...  
Q3  
Q4  
SR1  
Burst Mode & Ideal Diode Emulation  
Synchronous Rectifier Soft On/Off  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
 
 
 
 
 
 
 
UCD3138128, UCD3138A64  
SLUSBZ8A JUNE 2014REVISED SEPTEMBER 2014  
www.ti.com  
Table of Contents  
9.1 Overview ................................................................. 17  
9.2 Functional Block Diagram ....................................... 18  
9.3 Feature Description................................................. 19  
9.4 Device Functional Modes........................................ 44  
9.5 Register Maps......................................................... 53  
1
2
3
4
5
6
7
8
Features.................................................................. 1  
Applications ........................................................... 1  
Revision History..................................................... 2  
Description ............................................................. 3  
Product Family Comparison................................. 4  
Product Feature Overview .................................... 5  
Pin Configuration and Functions......................... 6  
Specifications......................................................... 8  
8.1 Absolute Maximum Ratings ..................................... 8  
8.2 Handling Ratings....................................................... 8  
8.3 Recommended Operating Conditions....................... 9  
8.4 Thermal Information.................................................. 9  
8.5 Electrical Characteristics........................................... 9  
8.6 Timing Characteristics............................................. 11  
8.7 PMBUS/SMBUS/IC Timing2.................................... 12  
8.8 Timing Requirements.............................................. 12  
9.6 Synchronous Rectifier MOSFET Ramp And IDE  
Calculation ............................................................... 56  
10 Applications and Implementation...................... 57  
10.1 Application Information.......................................... 57  
10.2 Typical Application ............................................... 58  
11 Power Supply Recommendations ..................... 69  
12 Layout................................................................... 69  
12.1 IC Grounding and Layout Guidelines.................... 69  
12.2 Layout Examples................................................... 70  
13 Device and Documentation Support ................. 72  
13.1 Device Support...................................................... 72  
13.2 Documentation Support ........................................ 72  
13.3 Trademarks........................................................... 74  
13.4 Electrostatic Discharge Caution............................ 74  
13.5 Glossary................................................................ 74  
8.9 Power On Reset (POR) / Brown Out Detect  
(BOD)....................................................................... 14  
8.10 Typical Clock Gating Power Savings.................... 15  
8.11 Typical Characteristics.......................................... 16  
Detailed Description ............................................ 17  
14 Mechanical, Packaging, and Orderable  
9
Information ........................................................... 74  
3 Revision History  
Changes from Original (June 2014) to Revision A  
Page  
Added device UCD313128 .................................................................................................................................................... 1  
Changed Feature From: "64 kB Program Flash Derivative.." To: "64 kB and 128 kB Program Flash Derivative..." ............. 1  
Changed Feature From: 2-32 kB Program Flash Memory Banks To: 2-32 kB or 4-32 kB Program Flash Memory Banks .. 1  
Added Feature: "Boot Flash Based Dual Memory..." ............................................................................................................. 1  
Changed Feature From: 4 kB Data RAM To: 8 kB Data RAM .............................................................................................. 1  
Changed Feature From: "8 kB Boot ROM Enables..." To: "4 kB Boot ROM Enables..." ....................................................... 1  
Changed From: UCD3138A64 to UCD3138x throughout the document................................................................................ 3  
Changed the Product Family Comparison table..................................................................................................................... 4  
Deleted table: Summary Of Key Differences Between UCD3138x & UCD3138.................................................................... 5  
Changed title From: POWER ON RESET AND BROWN OUT (V33D pin, See Figure 3) To: POWER ON RESET  
AND BROWN OUT (V33A pin, See Figure 3)...................................................................................................................... 10  
Changed title From: POWER ON RESET AND BROWN OUT (V33A pin, See Figure 3) To: POWER ON RESET  
AND BROWN OUT (V33A pin, See Figure 3)...................................................................................................................... 12  
Changed From: V33D To: V33A in the definitions list following Figure 3 ........................................................................... 14  
Changed paragraph 2 of the Memory section From: 2048x32-bit Boot ROM To: 1024x32-bit Boot ROM ........................ 17  
Changed text in the Memory section description From: The availability of 64 kB of program Flash memory in 2-32  
kB banks, enables the designers to implement dual images To: The availability of 64 kB or 128 kB of program Flash  
memory in 2-32 kB or 4-32 kB banks, enables the designers to implement multiple images.............................................. 17  
Added a 2 new paragraphs to the end of the Memory section description.......................................................................... 17  
Changed the Memory Map (After Reset Operation) to include Program Flash 2 and Program Flash 3 ............................ 53  
Changed the Memory Map (Normal Operation) to include Program Flash 2 and Program Flash 3 ................................... 53  
Added Figure 36 .................................................................................................................................................................. 55  
2
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Product Folder Links: UCD3138128 UCD3138A64  
 
UCD3138128, UCD3138A64  
www.ti.com  
SLUSBZ8A JUNE 2014REVISED SEPTEMBER 2014  
4 Description  
The UCD3138 family is a digital power supply controller from Texas Instruments offering superior levels of  
integration and performance in a single chip solution. The UCD3138x, in comparison to Texas Instruments  
UCD3138x digital power controller offers 64 kB of program Flash memory in UCD3138A64 (128 KB in  
UCD3138128) and additional options for communication such as SPI and a second I2C port. o The availability of  
of program Flash memory in multiple 32 kB banks enables designers to implement dual images of firmware (e.g.  
one main image + one back-up image) in the device and provides the option to execute from either of the banks  
using appropriate algorithms. It also creates the unique opportunity for the processor to load a new program and  
subsequently execute that program without interrupting power delivery. This feature allows the end user to add  
new features to the power supply in the field while eliminating any down-time required to load the new program.  
The flexible nature of the UCD3138 family makes it suitable for a wide variety of power conversion applications.  
In addition, multiple peripherals inside the device have been specifically optimized to enhance the performance  
of AC/DC and isolated DC/DC applications and reduce the solution component count in the IT and network  
infrastructure space. The UCD3138 family is a fully programmable solution offering customers complete control  
of their application, along with ample ability to differentiate their solution. At the same time, TI is committed to  
simplifying our customer’s development effort through offering best in class development tools, including  
application firmware, Code Composer StudioTM software development environment, and TI’s Fusion Power  
Development GUI which enables customers to configure and monitor key system parameters.  
At the core of the controller are the Digital Power Peripherals (DPP). Each DPP implements a high speed digital  
control loop consisting of a dedicated Error Analog to Digital Converter (EADC), a PID based 2 pole - 2 zero  
digital compensator and DPWM outputs with 250ps pulse width resolution. The device also contains a 12-bit, 267  
ksps general purpose ADC with up to 15 channels, timers, interrupt control, PMBus, I2C, SPI and UART  
communications ports. The device is based on a 32-bit ARM7TDMI-S RISC microcontroller that performs real-  
time monitoring, configures peripherals and manages communications. The ARM microcontroller executes its  
program out of programmable flash memory as well as on chip RAM and ROM.  
In addition to the DPP, specific power management peripherals have been added to enable high efficiency  
across the entire operating range, high integration for increased power density, reliability, and lowest overall  
system cost and high flexibility with support for the widest number of control schemes and topologies. Such  
peripherals include: light load burst mode, synchronous rectification, LLC and phase shifted full bridge mode  
switching, input voltage feed forward, copper trace current sense, ideal diode emulation, constant current  
constant power control, synchronous rectification soft on and off, peak current mode control, flux balancing,  
secondary side input voltage sensing, high resolution current sharing, hardware configurable soft start with pre  
bias, as well as several other features. Topology support has been optimized for voltage mode and peak current  
mode controlled phase shifted full bridge, single and dual phase PFC, bridgeless PFC, hard switched full bridge  
and half bridge, active clamp forward converter, two switch forward converter and LLC half bridge and full bridge.  
Device Information(1)  
PART NUMBER  
PACKAGE  
BODY SIZE (NOM)  
12.00 mm × 12.00 mm  
UCD3138128  
UCD3138A64  
TQFP (80)  
(1) For detailed ordering information please check the Mechanical, Packaging, and Orderable Information section at the end of this  
datasheet.  
Copyright © 2014, Texas Instruments Incorporated  
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UCD3138128, UCD3138A64  
SLUSBZ8A JUNE 2014REVISED SEPTEMBER 2014  
www.ti.com  
5 Product Family Comparison  
UCD3138  
RHA/RMH  
UCD3138064  
RMH  
UCD3138  
RGC  
UCD3138064  
RGC  
UCD3138064  
RGZ  
UCD3138128  
PFC  
UCD3138A64  
Feature  
PFC  
80 Pin QFP  
(14mm x 14mm)  
(Includes leads)  
80 Pin QFP  
(14mm x 14mm)  
(Includes leads)  
40 Pin QFN  
(6mm x 6mm)  
40 Pin QFN  
(6mm x 6mm)  
64 Pin QFN  
( 9mm x 9mm)  
64 Pin QFN  
(9mm x 9mm)  
48 Pin QFN  
(7mm x 7mm)  
Package Offering  
ARM7TDMI-S Core Processor  
31.25 MHz  
8
31.25 MHz  
8
31.25 MHz  
8
31.25 MHz  
8
31.25 MHz  
8
31.25 MHz  
31.25 MHz  
High Resolution DPWM Outputs (250ps  
Resolution)  
8
8
Number of High Speed Independent  
Feedback Loops (# Regulated Output  
Voltages  
3
7
3
7
3
3
3
9
3
3
12-bit, 256kps, General Purpose ADC  
Channels  
14  
14  
15  
15  
Digital Comparators at ADC Outputs  
Flash Memory (Program)  
4
4
4
4
4
4
4
32 kB  
64 kB  
32 kB  
64 kB  
64 kB  
128 kB  
64 kB  
Number of Memory 32kB Flash Memory  
Banks  
Only 1 bank of 64  
kB Flash available  
1
2
1
2
2
4
Flash Memory (Data)  
RAM  
2 kB  
4 kB  
1 + 2(1)  
2 kB  
4 kB  
1 + 2(1)  
2 kB  
4 kB  
4
2 kB  
4 kB  
2 + 2(1)  
2 kB  
4 kB  
1 + 2(1)  
2 kB  
8 kB  
4
2 kB  
8 kB  
4
Programmable Fault Inputs  
High Speed Analog Comparators with  
Cycle-by-Cycle Current Limiting  
6
6
7
7
6
7
7
UART (SCI)  
PMBus/I2C  
Additional I2C  
SPI  
1(1)  
1
1(1)  
1
2
1
0
0
2
2
2
1
1
1
2
1
1
1
1
1
0
0
1(1)  
1(1)  
1(1)  
1(1)  
0
0
4 (16 bit) and  
1 (24 bit)  
4 (16 bit) and  
1 (24 bit)  
4 (16 bit) and  
1 (24 bit)  
4 (16 bit) and  
1 (24 bit)  
4 (16 bit) and  
1 (24 bit)  
4 (16 bit) and  
2 (24 bit)  
4 (16 bit) and  
2 (24 bit)  
Timers  
Timer PWM Outputs  
1(1)  
2(1)  
1(1)  
2(1)  
2
2
1 + 3(1)  
30  
1(1)  
2(1)  
24  
0
4
2 + 2(1)  
43  
4
2 + 2(1)  
43  
Timer Capture Inputs  
Total Digital GPIOs  
1 + 3(1)  
18  
18  
30  
External Interrupts  
0
no  
0
no  
1
no  
1
1
1
External Crystal Clock Support  
Peak Current Mode Control  
no  
no  
Yes (pins #61, 62) Yes (pins #61, 62)  
EADC2 Only  
All EADC channels  
EADC Only  
All EADC channels All EADC Channels All EADC Channels All EADC Channels  
(1) Represents an alternate pin out that is programmable via firmware.  
4
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UCD3138128, UCD3138A64  
www.ti.com  
SLUSBZ8A JUNE 2014REVISED SEPTEMBER 2014  
6 Product Feature Overview  
FEATURE  
UCD3138x 80 PIN  
ARM7TDMI-S Core Processor  
31.25 MHz  
High Resolution DPWM Outputs (250ps Resolution)  
8
Number of High Speed Independent Feedback Loops (# Regulated Output Voltages)  
3
12-bit, 267ksps, General Purpose ADC Channels  
15  
Digital Comparators at ADC Outputs  
4
Flash Memory (Program) (UCD3138A64)  
64 kB  
Flash Memory (Program) (UCD3138128)  
128 kB  
Flash Memory (Data)  
2 kB  
Flash Security  
RAM  
8 kB  
DPWM Switching Frequency  
up to 2 MHz  
Programmable Fault Inputs  
4
High Speed Analog Comparators with Cycle-by-Cycle Current Limiting  
7
UART (SCI)  
2
PMBus  
1
I2C  
1
SPI  
1
Timers  
4 (16 bit) and 2 (24 bit)  
Timer PWM Outputs  
Timer Capture Inputs  
Watchdog  
4
2
On Chip Oscillator  
Power-On Reset and Brown-Out Detector  
Sync IN and Sync OUT Functions  
Total GPIO (includes all pins with multiplexed functions such as, DPWM, Fault Inputs, SCI, etc.)  
External Interrupts  
43  
1
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SLUSBZ8A JUNE 2014REVISED SEPTEMBER 2014  
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7 Pin Configuration and Functions  
12mm × 12mm TQFP  
80 Pins  
Bottom View  
1
2
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
AD13  
AD12  
DGND  
V33D  
3
AD10  
BP18  
4
AD07  
V33DIO  
DGND  
5
AD06  
6
AD04  
FAULT3  
FAULT2  
SPI_MISO  
SPI_MOSI  
SPI_CLK  
SPI_CS  
7
AD03  
8
V33DIO  
9
DGND  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
/RESET  
PWM2  
PWM3  
TCAP0/TCAP1  
TMS  
TCAP1/TCAP0  
ADC_EXT_TRIG  
PMBUS_CLK  
PMBUS_DATA  
PMBUS_ALERT  
PMBUS_CTRL  
I2C_CLK  
I2C_DATA  
TDI/TCAP0/TCAP1  
TDO/TCAP0/TCAP1  
TCK/RTC_IN/RTC_OUT  
FAULT1  
FAULT0  
EXT_INT  
DGND  
Additional pin functionality is specified in the following table.  
Pin Functions  
ALTERNATE ASSIGNMENT  
CONFIGURABLE  
AS A GPIO?  
PIN  
NAME  
PRIMARY ASSIGNMENT  
NO. 1  
NO. 2  
1
2
3
AD13  
AD12  
AD10  
12-bit ADC, Ch 13, comparator E, I-share  
12-bit ADC, Ch 12  
DAC output  
12-bit ADC, Ch 10  
12-bit ADC, Ch 7, Connected to comparator F and reference to  
comparator G  
4
AD07  
DAC output  
5
6
7
8
AD06  
12-bit ADC, Ch 6, Connected to comparator F  
12-bit ADC, Ch 4, Connected to comparator D  
12-bit ADC, Ch 3, Connected to comparator B and C  
Digital I/O 3.3V core supply  
DAC output  
DAC output  
AD04  
AD03  
V33DIO  
6
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SLUSBZ8A JUNE 2014REVISED SEPTEMBER 2014  
Pin Functions (continued)  
ALTERNATE ASSIGNMENT  
CONFIGURABLE  
AS A GPIO?  
PIN  
NAME  
PRIMARY ASSIGNMENT  
NO. 1  
NO. 2  
9
DGND  
RESET  
PWM2  
PWM3  
TCAP1  
Digital ground  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
Device Reset Input, active low  
General purpose PWM 2  
General purpose PWM 3  
Timer Capture Input  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
TCAP0  
ADC_EXT_TRIG  
PMBUS_CLK  
PMBUS_DATA  
PMBUS_ALERT  
PMBUS_CTRL  
I2C_CLK  
I2C_DATA  
DGND  
ADC conversion external trigger input  
PMBUS Clock (Open Drain)  
PMBus data (Open Drain)  
PMBus Alert (Open Drain)  
PMBus Control (Open Drain)  
I2C Clock  
I2C Data  
Digital ground  
DPWM0A  
DPWM0B  
DPWM1A  
DPWM1B  
DPWM2A  
DPWM2B  
DPWM3A  
DPWM3B  
GPIOA  
DPWM 0A output  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
DPWM 0B output  
DPWM 1A output  
DPWM 1B output  
DPWM 2A output  
DPWM 2B output  
DPWM 3A output  
DPWM 3B output  
General Purpose I/O Pin  
General Purpose I/O Pin  
General Purpose I/O Pin  
General Purpose I/O Pin  
DPWM Synchronize pin  
SCI TX 0  
GPIOB  
GPIOC  
GPIOD  
SYNC  
SCI_TX0  
SCI_RX0  
SCI_TX1  
SCI_RX1  
PWM0  
SCI RX 0  
SCI TX 1  
SCI RX 1  
General purpose PWM 0  
General purpose PWM 1  
Digital ground  
PWM1  
DGND  
EXT_INT  
FAULT0  
FAULT1  
TCK(1)  
External Interrupt  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
Yes  
External fault input 0  
External fault input 1  
JTAG TCK (for manufacturer test only)  
JTAG TDO (for manufacturer test only)  
JTAG TDI (for manufacturer test only)  
JTAG TMS (for manufacturer test only)  
Timer Capture Input  
RTC_IN  
TCAP0  
TCAP0  
RTC_OUT  
TCAP1  
TDO(1)  
TDI(1)  
TCAP1  
TMS(1)  
TCAP0  
TCAP1  
SPI_CS  
SPI Chip Select  
SPI_CLK  
SPI_MOSI  
SPI_MISO  
FAULT2  
FAULT3  
DGND  
SPI Clock  
SPI Master Output Slave Input  
SPI Master Input Slave Output  
External fault input 2  
External fault input 3  
Digital ground  
V33DIO  
Digital I/O 3.3V core supply  
1.8V Bypass (For internal use only, do not load)  
Digital 3.3V core supply  
Digital ground  
BP18  
V33D  
DGND  
RSVD  
Internal use only. Tie to BP18.  
RTC external clock input  
RTC_IN_1_8  
(1) Fusion Digital Power based debug tools are recommended instead of JTAG.  
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Pin Functions (continued)  
ALTERNATE ASSIGNMENT  
NO. 1 NO. 2  
CONFIGURABLE  
AS A GPIO?  
PIN  
NAME  
PRIMARY ASSIGNMENT  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
AGND  
EAP0  
EAN0  
EAP1  
EAN1  
EAP2  
EAN2  
AGND  
V33A  
AD00  
AD01  
AD02  
AD05  
AD14  
AD08  
AD09  
AD11  
AGND  
Analog ground  
Channel #0, differential analog voltage, positive input  
Channel #0, differential analog voltage, negative input  
Channel #1, differential analog voltage, positive input  
Channel #1, differential analog voltage, negative input  
Channel #2, differential analog voltage, positive input  
Channel #2, differential analog voltage, negative input  
Analog ground  
Analog 3.3V supply  
12-bit ADC, Ch 0, Connected to current source  
12-bit ADC, Ch 1, Connected to current source  
12-bit ADC, Ch 2, Connected to comparator A, I-share  
12-bit ADC, Ch 5  
12-bit ADC, Ch 14  
12-bit ADC, Ch 8  
12-bit ADC, Ch 9  
12-bit ADC, Ch 11  
Analog ground  
8 Specifications  
(1)  
8.1 Absolute Maximum Ratings  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
UNIT  
MIN  
–0.3  
–0.3  
–0.3  
-0.3  
MAX  
3.8  
3.8  
3.8  
2.5  
0.3  
3.0  
V33D  
V33D to DGND  
V33DIO to DGND  
V33A to AGND  
BP18 to DGND  
Ground difference  
V
V
V
V
V
V
V33DIO  
V33A  
BP18  
|DGND – AGND|  
RTC_IN_1_8/RSVD  
-0.3  
–0.3  
–40  
All Pins, excluding  
AGND(2)  
Voltage applied to any pin  
Junction Temperature  
3.8  
V
TOPT  
125  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) Referenced to DGND  
8.2 Handling Ratings  
MIN  
MAX  
UNIT  
Tstg  
Storage temperature range  
–55  
150  
°C  
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all  
pins(1)  
–2000  
–500  
2000  
500  
V(ESD)  
Electrostatic discharge  
V
Charged device model (CDM), per JEDEC specification  
JESD22-C101, all pins(2)  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
8
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8.3 Recommended Operating Conditions  
Over operating free-air temperature range (unless otherwise noted)  
MIN  
3.0  
3.0  
3.0  
1.6  
-40  
TYP  
3.3  
3.3  
3.3  
1.8  
-
MAX UNIT  
V33D  
V33DIO  
V33A  
BP18  
TJ  
Digital power  
3.6  
3.6  
3.6  
2.0  
125  
V
V
Digital I/O power  
Analog power  
V
1.8 V digital power  
Junction temperature  
V
°C  
8.4 Thermal Information  
THERMAL METRIC(1)  
80-PIN QFN  
47.8  
UNIT  
RθJA  
Junction-to-ambient thermal resistance  
RθJCtop  
RθJB  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
7.8  
24.4  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
0.2  
ψJB  
24.0  
RθJCbot  
N/A  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
8.5 Electrical Characteristics  
V33A = V33D = V33DIO = 3.3V; 1μF from BP18 to DGND, TJ = –40°C to 125°C (unless otherwise noted)  
PARAMETER  
SUPPLY CURRENT  
TEST CONDITION  
MIN  
TYP  
MAX  
UNIT  
Measured on V33A. The device is  
powered up but all ADC12 and EADC  
sampling is disabled  
I33A(1)  
6.3  
mA  
All GPIO and communication pins are  
open  
I33DIO(1)  
I33D(1)  
0.35  
69  
mA  
mA  
ROM program execution  
The device is in ROM mode with all  
DPWMs enabled and switching at 2  
MHz. The DPWMs are all unloaded.  
I33  
93  
100  
mA  
ERROR ADC INPUTS EAP, EAN  
EAP – AGND  
–0.15  
–0.256  
–256  
0.8  
1.998  
1.848  
248  
V
EAP – EAN  
V
Typical error range  
AFE = 0  
mV  
mV  
mV  
mV  
mV  
MΩ  
μA  
AFE = 3  
1
2
4
8
1.20  
2.30  
4.45  
9.10  
AFE = 2  
1.7  
EAP – EAN Error voltage digital resolution  
AFE = 1  
3.55  
6.90  
0.5  
AFE = 0  
REA  
Input impedance (See Figure 9)  
AGND reference  
IOFFSET Input offset current (See Figure 9)  
–5  
5
16  
10  
-6  
4
Input voltage = 0 V at AFE = 0  
Input voltage = 0 V at AFE = 1  
Input voltage = 0 V at AFE = 2  
Input voltage = 0 V at AFE = 3  
–16  
–10  
–6  
mV  
mV  
mV  
mV  
EADC Offset  
–4  
15.62  
5
Sample Rate  
MHz  
MHz  
Analog Front End Amplifier Bandwidth  
100  
(1) Characterized by design and not production tested.  
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Electrical Characteristics (continued)  
V33A = V33D = V33DIO = 3.3V; 1μF from BP18 to DGND, TJ = –40°C to 125°C (unless otherwise noted)  
PARAMETER  
TEST CONDITION  
See Figure 10  
MIN  
TYP  
MAX  
21  
UNIT  
V/V  
Gain  
Minimum output voltage  
EADC DAC  
DAC range  
1
A0  
mV  
0
1.6  
V
VREF DAC reference resolution  
10 bit, No dithering enabled  
With 4 bit dithering enabled  
1.56  
97.6  
mV  
μV  
VREF DAC reference resolution  
INL  
–1.5  
–1.0  
1.58  
1.5  
2.1  
LSB  
LSB  
V
DNL  
DAC reference voltage  
1.61  
ADC12  
IBIAS  
Bias current for PMBus address pins  
Measurement range for voltage monitoring  
Internal ADC reference voltage  
9.5  
0
10.5  
2.5  
μA  
V
–40°C to 125°C  
–40°C to 25°C  
25°C to 125°C  
2.475  
2.500  
–0.7  
2.53  
V
Change in Internal ADC reference from  
25°C reference voltage(1)  
mV  
-6  
ADC12 INL integral nonlinearity(2)  
ADC12 DNL differential nonlinearity(2)  
ADC Zero Scale Error  
-7.5/+2.9  
–0.7/+3.2  
±5  
LSB  
LSB  
mV  
mV  
nA  
ADC_SAMPLING_SEL = 6 for all  
ADC12 data, 25 °C to 125 °C  
–7  
7
35  
ADC Full Scale Error  
–35  
±20  
Input bias  
2.5 V applied to pin  
200  
Input leakage resistance(2)  
Input Capacitance(2)  
ADC_SAMPLING_SEL= 6 or 0  
1
MΩ  
pF  
10  
DIGITAL INPUTS/OUTPUTS(3)(4)  
DGND  
+ 0.25  
VOL  
VOH  
Low-level output voltage(5)  
IOH = 4 mA, V33DIO = 3 V  
IOH = –4 mA, V33DIO = 3 V  
V
V
V33DIO  
– 0.6  
(5)  
High-level output voltage  
VIH  
VIL  
IOH  
IOL  
High-level input voltage  
Low-level input voltage  
Output sinking current  
Output sourcing current  
V33DIO = 3 V  
V33DIO = 3 V  
2.1  
V
V
1.1  
4
mA  
mA  
–4  
SYSTEM PERFORMANCE  
Processor master clock (MCLK)  
Digital filter delay(6)  
31.25  
250  
MHz  
MCLKs  
MHz  
tDelay  
(1 clock = 32ns)  
6
f(PCLK)  
Internal oscillator frequency  
240  
238  
9.7  
260  
Current share current source (See  
Figure 28)  
ISHARE  
259  
μA  
kΩ  
RSHARE Current share resistor (See Figure 28)  
POWER ON RESET AND BROWN OUT (V33A pin, See Figure 3)  
10.3  
VGH  
VGL  
Vres  
Voltage good High  
Voltage good Low  
2.7  
2.5  
0.8  
V
V
V
Voltage at which IReset signal is valid(2)  
(2) Characterized by design and not production tested.  
(3) DPWM outputs are low after reset. Other GPIO pins are configured as inputs after reset.  
(4) On the 40 pin package V33DIO is connected to V33D internally.  
(5) The maximum total current, IOHmax and IOLmax for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop  
specified. Maximum sink current per pin = –6 mA at VOL; maximum source current per pin = 6 mA at VOH  
.
(6) Time from close of error ADC sample window to time when digitally calculated control effort (duty cycle) is available. This delay, which  
has no variation associated with it, must be accounted for when calculating the system dynamic response.  
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Electrical Characteristics (continued)  
V33A = V33D = V33DIO = 3.3V; 1μF from BP18 to DGND, TJ = –40°C to 125°C (unless otherwise noted)  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX  
UNIT  
Internal signal warning of brownout  
conditions  
Brownout  
2.9  
V
TEMPERATURE SENSOR(2)  
VTEMP  
Voltage range of sensor  
Volts/°C  
1.46  
2.44  
V
mV/ºC  
ºC/LSB  
ºC  
Voltage resolution  
Temperature resolution  
Accuracy(2)(7)  
6.3  
0.0969  
±5  
Degree C per bit  
-40°C to 125°C  
–10  
–40  
10  
Temperature range  
ITEMP  
-40°C to 125°C  
125  
ºC  
Current draw of sensor when active  
Trimmed 25°C reading  
30  
μA  
VAMB  
ANALOG COMPARATOR  
DAC Reference DAC Range  
Ambient temperature  
1.87  
V
0
2.5  
V
Reference Voltage  
2.478  
2.5 2.513  
V
Bits  
INL(2)  
DNL(2)  
7
bits  
LSB  
LSB  
mV  
mA  
mV  
mV  
–0.42  
0.06  
–5.5  
0.5  
0.21  
0.12  
19.5  
1
Offset  
Reference DAC buffered output load(8)  
Buffer offset (-0.5 mA)  
Buffer offset (1.0 mA)  
8.3  
17  
RTC INTERFACE  
fRTC RTC external input frequency  
10  
MHz  
(7) Ambient temperature offset value from the TEMPSENCTRL register should be used to meet accuracy.  
(8) Available from reference DACs for comparators D, E, F and G.  
8.6 Timing Characteristics  
V33A = V33D = V33DIO = 3.3V; 1μF from BP18 to DGND, TJ = –40°C to 125°C (unless otherwise noted)  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
250  
3.9  
MAX  
UNIT  
ns  
EADC DAC  
t
Settling Time  
From 10% to 90%  
ADC12  
ADC single sample conversion time(1)  
ADC_SAMPLING_SEL= 6 or 0  
μs  
SYSTEM PERFORMANCE  
Total time is: TWD x  
(WDCTRL.PERIOD+1)  
TWD Watchdog time out resolution  
10.5  
100  
13.3  
17  
6
ms  
ns  
Time to disable DPWM output based on  
active FAULT pin signal  
High level on FAULT pin  
66  
1
Flash Read  
MCLKs  
MCLKs  
tDelay  
Digital filter delay(2)  
(1 clock = 32ns)  
TJ = 25°C  
Retention period of flash content (data  
retention and program)  
years  
ms  
Program time to erase one page or block in  
data flash or program flash  
20  
50  
Program time to write one word in program  
flash  
µs  
(1) Characterized by design and not production tested.  
(2) Time from close of error ADC sample window to time when digitally calculated control effort (duty cycle) is available. This delay, which  
has no variation associated with it, must be accounted for when calculating the system dynamic response.  
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Timing Characteristics (continued)  
V33A = V33D = V33DIO = 3.3V; 1μF from BP18 to DGND, TJ = –40°C to 125°C (unless otherwise noted)  
PARAMETER  
TEST CONDITION  
MIN  
TYP  
MAX  
UNIT  
µs  
Program time to write one word in data  
flash  
40  
Sync-in/sync-out pulse width  
Sync pin  
256  
ns  
POWER ON RESET AND BROWN OUT (V33A pin, See Figure 3)  
Time delay after Power is good or  
RESET* relinquished  
tPOR  
1
ms  
ms  
IRESET goes from a low state to a high  
state. This is approximately equivalent  
to toggling the external reset pin from  
low to high state.  
The time it takes from the device to exit a  
reset state and begin executing the boot  
flash.(1)  
tEXC1  
0.5  
IRESET goes from a low state to a high  
state. This is approximately equivalent  
to toggling the external reset pin from  
low to high state.  
The time it takes from the device to exit a  
reset state and begin executing program  
flash bank 0 (32 kB).(1)  
tEXC2  
3
6
ms  
ms  
μs  
IRESET goes from a low state to a high  
state. This is approximately equivalent  
to toggling the external reset pin from  
low to high state.  
The time it takes from the device to exit a  
reset state and begin executing the total  
program flash (64 kB).(1)  
tEXCT  
TEMPERATURE SENSOR(1)  
tON  
Turn on time / settling time of sensor  
100  
7
ANALOG COMPARATOR  
Bits  
bits  
LSB  
LSB  
INL(3)  
DNL(3)  
–0.42  
0.06  
0.21  
0.12  
Time to disable DPWM output based on 0  
V to 2.5 V step input on the analog  
90  
150  
ns  
comparator.(3)  
(3) Characterized by design and not production tested.  
8.7 PMBUS/SMBUS/IC Timing2  
The timing characteristics and timing diagram for the communications interface that supports I2C, SMBus, and  
PMBus in Slave or Master mode are shown in the Timing Requirements, Figure 1, and Figure 2. The numbers in  
the Timing Requirements are for 400 kHz operating frequency. However, the device supports two speeds,  
standard (100 kHz) and fast (400 kHz).  
8.8 Timing Requirements  
PARAMETER  
TEST CONDITIONS  
MIN TYP MAX UNIT  
Typical values at TA = 25°C and VCC = 3.3 V (unless otherwise noted)  
fSMB  
fI2C  
SMBus/PMBus operating frequency  
I2C operating frequency  
Slave mode, SMBC 50% duty cycle  
Slave mode, SCL 50% duty cycle  
100 400  
100 400  
kHz  
kHz  
Bus free time between start and  
stop(1)  
t(BUF)  
1.3  
µs  
t(HD:STA)  
t(SU:STA)  
t(SU:STO)  
t(HD:DAT)  
t(SU:DAT)  
Hold time after (repeated) start(1)  
Repeated start setup time(1)  
Stop setup time(1)  
0.6  
0.6  
0.6  
0
µs  
µs  
µs  
ns  
ns  
ms  
µs  
Data hold time  
Receive mode  
Data setup time  
100  
35  
t(TIMEOUT) Error signal/detect(2)  
t(LOW) Clock low period  
1.3  
(1) Fast mode, 400 kHz  
(2) The device times out when any clock low exceeds t(TIMEOUT)  
.
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Timing Requirements (continued)  
PARAMETER  
TEST CONDITIONS  
MIN TYP MAX UNIT  
t(HIGH)  
Clock high period(3)  
35  
ms  
Cumulative clock low slave extend  
time(4)  
t(LOW:SEXT)  
25  
ms  
20 + 0.1  
Cb(5)  
tf  
Clock/data fall time  
Rise time tr = (VILmax – 0.15) to (VIHmin + 0.15)  
Fall time tf = 0.9 VDD to (VILmax – 0.15)  
300  
ns  
20 + 0.1  
Cb(5)  
tr  
Clock/data rise time  
300  
400  
ns  
Cb  
Total capacitance of one bus line  
pF  
(3) t(HIGH), Max, is the minimum bus idle time. SMBC = SMBD = 1 for t > 50 ms causes reset of any transaction that is in progress. This  
specification is valid when the NC_SMB control bit remains in the default cleared state (CLK[0] = 0).  
(4) t(LOW:SEXT) is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.  
(5) Cb (pF)  
Figure 1. IC/SMBUS/PMBUS Timing Diagram2  
Figure 2. Bus Timing In Extended Mode  
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8.9 Power On Reset (POR) / Brown Out Detect (BOD)  
V33D  
3.3 V  
Brown Out  
VGH  
VGL  
Vres  
t
tPOR  
tPOR  
IReset  
t
undefined  
Figure 3. Power On Reset (POR) / Brown Out Reset (BOR)  
VGH –  
VGL –  
This is the V33A threshold where the internal power is declared good. The UCD3138x comes out  
of reset when above this threshold.  
This is the V33A threshold where the internal power is declared bad. The device goes into reset  
when below this threshold.  
Vres  
IReset  
tPOR  
This is the V33A threshold where the internal reset signal is no longer valid. Below this threshold  
the device is in an indeterminate state.  
This is the internal reset signal. When low, the device is held in reset. This is equivalent to holding  
the reset pin on the IC low.  
The time delay from when VGH is exceeded to when the device comes out of reset.  
Brown  
Out –  
This is the V33A voltage threshold at which the device sets the brown out status bit. In addition an  
interrupt can be triggered if enabled.  
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8.10 Typical Clock Gating Power Savings  
6.00  
5.00  
4.00  
3.00  
2.00  
1.00  
0.00  
DPWM  
ADC12  
Front-end Control Peak Current  
Mode  
Timer  
Filter  
Constant  
Power/Constant  
Current  
SCI  
GIO  
C001  
Module  
The CLKGATECTRL register provides control bits that can enable or disable the clock to several peripherals  
such as, PCM, CPCC, digital filters, front ends, DPWMs, UARTs, ADC-12 and more.  
By default, all these controls are enabled. If a specific peripheral is not used the clock gate can be disabled in  
order to block the propagation of the clock signal to that peripheral and therefore reduce the overall current  
consumption of the device. The power savings chart displays the power savings per module. For example there  
are 4 DPWM modules, therefore, if all 4 are disabled a total of ~20 mA can be saved.  
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8.11 Typical Characteristics  
ADC12 Measurement Temperature Sensor Voltage  
2.1  
2.6  
2.4  
2.2  
2.0  
1.8  
1.6  
1.4  
2
1.9  
1.8  
1.7  
1.6  
−60 −40 −20  
0
20 40 60 80 100 120 140 160  
Temperature (°C)  
−40  
−20  
0
20  
40  
60  
Temperature (°C)  
80  
100  
120  
G006b  
G005a  
Figure 5. ADC12 Measurement Temperature Sensor Voltage  
vs. Temperature  
Figure 4. EADC LSB Size With 4x Gain (Mv) vs. Temperature  
ADC12 2.5-V Reference  
ADC12 Temperature Sensor Measurement Error  
8
2.515  
2.510  
2.505  
2.500  
6
4
2
2.495  
2.490  
2.485  
0
−2  
−4  
2.480  
2.475  
−40  
−20  
0
20  
40  
60  
Temperature (°C)  
80  
100  
120  
−40  
−20  
0
20  
40  
60  
80  
100  
120  
G002b  
Temperature (°C)  
G003b  
Figure 7. ADC12 Temperature Sensor Measurement Error  
vs. Temperature  
Figure 6. ADC12 2.5-V Reference vs. Temperature  
2.08  
2.06  
3 σ  
1 σ  
AVG  
-1 σ  
-3 σ  
2.04  
2.02  
2
1.98  
1.96  
1.94  
1.92  
-100  
-50  
0
50  
100  
150  
200  
Temperature (°C)  
Figure 8. Oscillator Frequency (2MHz Reference, Divided Down From 250MHz) vs. Temperature  
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9 Detailed Description  
9.1 Overview  
9.1.1 ARM Processor  
The ARM7TDMI-S processor is a synthesizable member of the ARM family of general purpose 32-bit  
microprocessors. The ARM architecture is based on RISC (Reduced Instruction Set Computer) principles where  
two instruction sets are available. The 32-bit ARM instruction set and the 16-bit Thumb instruction set. The  
Thumb instructions allow for higher code density equivalent to a 16-bit microprocessor, with the performance of  
the 32-bit microprocessor.  
The three-staged pipelined ARM processor has fetch, decode and execute stage architecture. Major blocks in  
the ARM processor include a 32-bit ALU, 32 x 8 multiplier, and a barrel shifter.  
9.1.2 Memory  
The UCD3138x (ARM7TDMI-S) is a Von-Neumann architecture, where a single bus provides access to all of the  
memory modules. All of the memory module addresses are sequentially aligned along the same address range.  
This applies to program flash, data flash, ROM and all other peripherals.  
Within the UCD3138 family architecture, there is a 1024x32-bit Boot ROM that contains the initial firmware  
startup routines for PMBUS communication and non-volatile (FLASH) memory download. This boot ROM is  
executed after power-up-reset checks if there is a valid FLASH program written. If a valid program is present, the  
ROM code branches to the main FLASH-program execution. If there is no valid program, the device waits for a  
program download through the PMBus.  
The UCD3138 family also supports customization of the boot program by allowing an alternative boot routine to  
be executed from program FLASH. This feature enables assignment of a unique address to each device;  
therefore, enabling firmware reprogramming even when several devices are connected on the same  
communication bus.  
There are three separate flash memory areas present inside the device. There are 2-32 kB program flash blocks  
and 1-2 kB data flash area. The 32 kB program areas are organized as 8 k x 32 bit memory blocks and are  
intended to be for the firmware programs. The blocks are configured with page erase capability for erasing blocks  
as small as 1 kB per page, or with a mass erase for erasing the entire 32 kB array. The flash endurance is  
specified at 1000 erase/write cycles and the data retention is good for 100 years. The 2 kB data flash array is  
organized as a 512 x 32 bit memory (32 byte page size). The data flash is intended for firmware data value  
storage and data logging. Thus, the Data flash is specified as a high endurance memory of 20 k cycles with  
embedded error correction code (ECC).  
For run time data storage and scratchpad memory, a 8 kB RAM is available. The RAM is organized as a 2 k x 32  
bit array.  
The availability of 64 kB or 128 kB of program Flash memory in 2-32 kB or 4-32 kB banks, respectively enables  
the designers to implement multiple images of firmware (e.g. one main image + one back-up image) in the device  
and the flexibility to execute from either of the banks using appropriate algorithms. It also creates the unique  
opportunity for the processor to load a new program and subsequently execute that program without interrupting  
power delivery. This feature allows the end user to add new features to the power supply while eliminating any  
down-time required to load the new program.  
The UCD3138128 adds two additional 32 kB program flash blocks. On the UCD3138128, the boot ROM supports  
a dual image configuration where each image contains 64 kB. If the first 64kB has an invalid program, the boot  
ROM will check for a valid program in the second 64kB and jump there. The boot ROM also supports a  
configuration with a single program occupying the entire 128 kB.  
For the UCD3138128, on the fly updates are supported through boot ROM while UCD3138A64 on the fly  
updates are supported through boot flash. Detailed procedures can be found in SLUUB54  
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9.2 Functional Block Diagram  
Loop MUX  
DPWM0A  
EAP0  
PID Based  
Filter 0  
Front End 0  
EAN0  
DPWM0  
DPWM1  
DPWM2  
DPWM3  
DPWM0B  
DPWM1A  
EAP1  
PID Based  
Filter 1  
Front End 1  
EAN1  
DPWM1B  
DPWM2A  
DPWM2B  
DPWM3A  
PID Based  
Filter 2  
Front End 2  
AFE  
Constant Power Constant  
Current  
23-AFE  
DPWM3B  
SYNC  
EAP2  
Front End Averaging  
Digital Comparators  
EADC  
2AFE  
X
Avg()  
EAN2  
SAR/Prebias  
Ramp  
DAC0  
Input Voltage Feed Forward  
A0  
Filter x  
CPCC  
G
Value  
Dither  
Abs()  
Peak Current Mode  
Control Comparator  
PMBUS_ALERT  
PMBUS_CTRL  
PMBUS_DATA  
PMBUS_CLK  
PWM0  
Advanced Power Control  
Mode Switching, Burst Mode, IDE,  
Synchronous Rectification soft on & off  
PMBus/I2C  
ADC_EXT  
AD[14:0]  
ADC12 Control  
Sequencing, Averaging,  
Digital Compare, Dual  
Sample and hold  
PWM1  
ADC12  
Timers  
PWM2  
AD00  
AD01  
4 ± 16 bit (PWM)  
2 ± 24 bit (TCAP)  
PWM3  
Internal Temperature  
Sensor  
TCAP0  
TCAP1  
AD02  
AD13  
Current Share  
Analog, Average, Master/Slave  
AGND  
Oscillator  
SCI_TX1  
SCI_RX0  
SCI_TX1  
SCI_RX1  
EXT_INT  
FAULT0  
FAULT1  
FAULT2  
FAULT3  
GPIO[A..D]  
/RESET  
UART0  
UART1  
ARM7TDMI-S  
32 bit, 31.25 MHz  
Analog  
Comparators  
AD02  
AD03  
Memory  
DFLASH 2 kB  
RAM 8 kB  
A
B
ROM 4 kB  
PFLASH  
64 kB (UCD3138A64)  
or  
GPIO  
Control  
C
128 kB (UCD3138128)  
AD04  
AD13  
AD06  
AD07  
Fault MUX &  
Control  
Bank 0  
32 kB  
Bank 1  
32 kB  
D
V33D  
V33DIO  
BP18  
Cycle by Cycle  
Current Limit  
E
Bank 3  
32 kB  
Bank 4  
32 kB  
Power and  
1.8 V Voltage  
Regulator  
Digital  
Comparators  
TCK  
F
DGND  
V33A  
Power On Reset  
JTAG  
TDI  
G
TMS  
Brown Out Detection  
AGND  
TDO  
SPI_MISO  
SPI_MOSI  
SPI_CLK  
SPI_CS  
RTC_IN_1_8  
RTC_IN  
SPI  
Real Time  
Clock  
RTC_OUT  
I2C_DATA  
I2C_CLK  
PMBus/I2C  
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9.3 Feature Description  
9.3.1 System Module  
The System Module contains the interface logic and configuration registers to control and configure all the  
memory, peripherals and interrupt mechanisms. The blocks inside the system module are the address decoder,  
memory management controller, system management unit, central interrupt unit, and clock control unit.  
9.3.1.1 Address Decoder (DEC)  
The Address Decoder generates the memory selects for the FLASH, ROM and RAM arrays. The memory map  
addresses are selectable through configurable register settings. These memory selects can be configured from 1  
kB to 16 MB. Power on reset uses the default addresses in the memory map for ROM execution, which is then  
configured by the ROM code to the application setup. During access to the DEC registers, a wait state is  
asserted to the CPU. DEC registers are only writable in the ARM privilege mode for user mode protection.  
9.3.1.2 Memory Management Controller (MMC)  
The MMC manages the interface to the peripherals by controlling the interface bus for extending the read and  
write accesses to each peripheral. The unit generates eight peripheral select lines with 1 kB of address space  
decoding.  
9.3.1.3 System Management (SYS)  
The SYS unit contains the software access protection by configuring user privilege levels to memory or  
peripherals modules. It contains the ability to generate fault or reset conditions on decoding of illegal address or  
access conditions. A clock control setup for the processor clock (MCLK) speed, is also available.  
9.3.1.4 Central Interrupt Module (CIM)  
The CIM accepts 32 interrupt requests for meeting firmware timing requirements. The ARM processor supports  
two interrupt levels: FIQ and IRQ. FIQ is the highest priority interrupt. The CIM provides hardware expansion of  
interrupts by use of FIQ/IRQ vector registers for providing the offset index in a vector table. This numerical index  
value indicates the highest precedence channel with a pending interrupt and is used to locate the interrupt vector  
address from the interrupt vector table. Interrupt channel 0 has the lowest precedence and interrupt channel 31  
has the highest precedence. To remove the interrupt request, the firmware should clear the request as the first  
action in the interrupt service routine. The request channels are maskable, allowing individual channels to be  
selectively disabled or enabled.  
Table 1. Interrupt Priority Table  
MODULE COMPONENT OR  
REGISTER  
NAME  
DESCRIPTION  
PRIORITY  
BRN_OUT_INT  
EXT_INT  
Brownout  
Brownout interrupt  
0 (Lowest)  
External Interrupts  
Watchdog Control  
Interrupt on external input pin  
Interrupt from watchdog exceeded (reset)  
1
2
WDRST_INT  
Wake-up interrupt when watchdog equals half of set watch  
time  
WDWAKE_INT  
Watchdog Control  
3
SCI_ERR_INT  
SCI_RX_0_INT  
SCI_TX_0_INT  
SCI_RX_1_INT  
SCI_TX_1_INT  
PMBUS_INT  
UART or SCI Control  
UART or SCI Control  
UART or SCI Control  
UART or SCI Control  
UART or SCI Control  
UART or SCI error Interrupt. Frame, parity or overrun  
UART0 RX buffer has a byte  
4
5
UART0 TX buffer empty  
6
UART1 RX buffer has a byte  
7
UART1 TX buffer empty  
8
PMBus related interrupt  
9
DIG_COMP_SPI_I2C_INT 12-bit ADC Control, SPI, I2C  
Digital comparator, SPI and I2C interrupt  
10  
“Prebias complete”, “Ramp Delay Complete”, “Ramp  
Complete”, “Load Step Detected”,  
FE0_INT Front End 0  
11  
“Over-Voltage Detected”, “EADC saturated”  
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Feature Description (continued)  
Table 1. Interrupt Priority Table (continued)  
MODULE COMPONENT OR  
REGISTER  
NAME  
DESCRIPTION  
PRIORITY  
“Prebias complete”, “Ramp Delay Complete”, “Ramp  
Complete”, “Load Step Detected”,  
FE1_INT  
Front End 1  
12  
“Over-Voltage Detected”, “EADC saturated”  
“Prebias complete”, “Ramp Delay Complete”, “Ramp  
Complete”, “Load Step Detected”,  
FE2_INT  
Front End 2  
13  
“Over-Voltage Detected”, “EADC saturated”  
PWM3_INT  
16-bit Timer PWM 3  
16-bit Timer PWM 2  
16-bit Timer PWM 1  
16-bit timer PWM 0  
24-bit Timer Control  
24-bit Timer Control  
16-bit Timer PWM3 counter overflow or compare interrupt  
16-bit Timer PWM2 counter Overflow or compare interrupt  
16-bit Timer PWM1 counter overflow or compare interrupt  
16-bit Timer PWM0 counter overflow or compare interrupt  
24-bit Timer counter overflow interrupt  
14  
15  
16  
17  
18  
19  
20  
21  
22  
PWM2_INT  
PWM1_INT  
PWM0_INT  
OVF24_INT  
CAPTURE_1_INT  
Reserved for future use  
CAPTURE_0_INT  
COMP_0_INT  
24-bit Timer capture 1 interrupt  
24-bit Timer Control  
24-bit Timer Control  
24-bit Timer capture 0 interrupt  
24-bit Timer compare 0 interrupt  
Constant Power Constant Current Mode switched in CPCC module Flag needs to be read for  
CPCC_RTC_INT  
ADC_CONV_INT  
23  
24  
or Real Time Clock Output  
details. RTC timer output generates an interrupt.  
12-bit ADC Control  
ADC end of conversion interrupt  
Analog comparator interrupts, Over-Voltage detection,  
Under-Voltage detection,  
FAULT_INT  
Fault Mux Interrupt  
25  
LLM load step detection  
DPWM3  
DPWM2  
DPWM3  
DPWM2  
Same as DPWM1  
Same as DPWM1  
26  
27  
1) Every (1-256) switching cycles  
2) Fault Detection  
DPWM1  
DPWM1  
28  
3) Mode switching  
DPWM0  
DPWM0  
Same as DPWM1  
29  
30  
EXT_FAULT_INT  
SYS_SSI_INT  
External Faults  
System Software  
Fault pin interrupt  
System software interrupt  
31 (highest)  
9.3.2 Peripherals  
9.3.2.1 Digital Power Peripherals  
At the core of the UCD3138x controller are 3 Digital Power Peripherals (DPP). Each DPP can be configured to  
drive from one to eight DPWM outputs. Each DPP consists of:  
Differential input error ADC (EADC) with sophisticated controls  
Hardware accelerated digital 2-pole/2-zero PID based filter  
Digital PWM module with support for a variety of topologies  
These can be connected in many different combinations, with multiple filters and DPWMs. They are capable of  
supporting functions like input voltage feed forward, current mode control, and constant current/constant power,  
etc.. The simplest configuration is shown in the following figure:  
EAP  
DPWMA  
Digital  
PWM  
Error ADC  
(Front End)  
Filter  
DPWMB  
EAN  
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9.3.2.1.1 Front End  
Figure 9 shows the block diagram of the front end module. It consists of a differential amplifier, an adjustable  
gain error amplifier, a high speed flash analog to digital converter (EADC), digital averaging filters and a precision  
high resolution set point DAC reference. The programmable gain amplifier in concert with the EADC and the  
adjustable digital gain on the EADC output work together to provide 9 bits of range with 6 bits of resolution on the  
EADC output. The output of the Front End module is a 9 bit sign extended result with a gain of 1 LSB / mV.  
Depending on the value of AFE selected, the resolution of this output could be either 1, 2, 4 or 8 LSBs. In  
addition Front End 0 has the ability to automatically select the AFE value such that the minimum resolution is  
maintained that still allows the voltage to fit within the range of the measurement. The EADC control logic  
receives the sample request from the DPWM module for initiating an EADC conversion. EADC control circuitry  
captures the EADC-9-bit-code and strobes the filter for processing of the representative error. The set point DAC  
has 10 bits with an additional 4 bits of dithering resulting in an effective resolution of 14 bits. This DAC can be  
driven from a variety of sources to facilitate things like soft start, nested loops, etc. Some additional features  
include the ability to change the polarity of the error measurement and an absolute value mode which  
automatically adds the DAC value to the error.  
It is possible to operate the controller in a peak current mode control configuration. In this mode topologies like  
the phase shifted full bridge converter can be controlled to maintain transformer flux balance. The internal DAC  
can be ramped at a synchronously controlled slew rate to achieve a programmable slope compensation. This  
eliminates the sub-harmonic oscillation as well as improves input voltage feed-forward performance. A0 is a unity  
gain buffer used to isolate the peak current mode comparator. The offset of this buffer is specified in the  
Electrical Characteristics table.  
EAP  
Front End Differential  
Amplifier  
REA  
IOFFSET  
AGND  
EAN  
REA  
IOFFSET  
AGND  
Figure 9. Input Stage Of EADC Module  
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AFE_GAIN  
23-AFE_GAIN  
EAP0  
6 bit ADC  
8mV/LSB  
2AFE_GAIN  
EAN0  
Signed 9 bit result  
(error) 1 mV /LSB  
EADC  
X
Averaging  
SAR/Prebias  
Ramp  
Filter x  
CPCC  
DAC0  
A0  
10 bit DAC  
1.5625mV/LSB  
Value  
Dither  
4 bit dithering gives 14 bits of effective resolution  
97.65625V/LSB effective resolution  
Absolute Value  
Calculation  
10 bit result  
1.5625mV/LSB  
Peak Current  
Detected  
Peak Current Mode  
Comparator  
Figure 10. Front End Module  
9.3.2.1.2 DPWM Module  
The DPWM module represents one complete DPWM channel with 2 independent outputs, A and B. Multiple  
DPWM modules within the UCD3138x system can be configured to support all key power topologies. DPWM  
modules can be used as independent DPWM outputs, each controlling one power supply output voltage rail. It  
can also be used as a synchronized DPWM—with user selectable phase shift between the DPWM channels to  
control power supply outputs with multiphase or interleaved DPWM configurations.  
The output of the filter feeds the high resolution DPWM module. The DPWM module produces the pulse width  
modulated outputs for the power stage switches. The filter calculates the necessary duty ratio as a 24-bit number  
in Q23 fixed point format (23 bit integer with 1 sign bit). This represents a value within the range 0.0 to 1.0. This  
duty ratio value is used to generate the corresponding DPWM output ON time. The resolution of the DPWM ON  
time is 250 psec.  
Each DPWM module can be synchronized to another module or to an external synchronization signal. An input  
SYNC signal causes a DPWM ramp timer to reset. The SYNC signal outputs—from each of the four DPWM  
modules—occur when the ramp timer crosses a programmed threshold. This allows the phase of the DPWM  
outputs for multiple power stages to be tightly controlled.  
The DPWM logic takes the output of the filter and converts it into the correct DPWM output for several power  
supply topologies. It provides for programmable dead times and cycle adjustments for current balancing between  
phases. It controls the triggering of the EADC. It can synchronize to other DPWMs or to external sources. It can  
provide synchronization information to other DPWMs or to external recipients. In addition, it interfaces to several  
fault handling circuits. Some of the control for these fault handling circuits is in the DPWM registers. Fault  
handling is covered in the Fault Mux section.  
Each DPWM module supports the following features:  
Dedicated 14 bit time-base with period and frequency control  
Shadow period register for end of period updates.  
Quad-event control registers (A and B, rising and falling) (Events 1-4)  
Used for on/off DPWM duty ratio updates.  
Phase control relative to other DPWM modules  
Sample trigger placement for output voltage sensing at any point during the DPWM cycle.  
Support for 2 independent edge placement DPWM outputs (same frequency or period setting)  
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Dead-time between DPWM A and B outputs  
High Resolution PWM capability – 250 ps  
Pulse cycle adjustment of up to ±8.192 µs ( 32768 × 250 ps)  
Active high/ active low output polarity selection  
Provides events to trigger both CPU interrupts and start of ADC12 conversions.  
9.3.2.1.3 DPWM Events  
Each DPWM can control the following timing events:  
1. Sample Trigger Count–This register defines where the error voltage is sampled by the EADC in relationship  
to the DPWM period. The programmed value set in the register should be one fourth of the value calculated  
based on the DPWM clock. As the DCLK (DCLK = 62.5 MHz max) controlling the circuitry runs at one fourth  
of the DPWM clock (PCLK = 250MHz max). When this sample trigger count is equal to the DPWM Counter,  
it initiates a front end calculation by triggering the EADC, resulting in a CLA calculation, and a DPWM  
update. Over-sampling can be set for 2, 4 or 8 times the sampling rate.  
2. Phase Trigger Count–count offset for slaving another DPWM (Multi-Phase/Interleaved operation).  
3. Period–low resolution switching period count. (count of PCLK cycles)  
4. Event 1–count offset for rising DPWM A event. (PCLK cycles)  
5. Event 2–DPWM count for falling DPWM A event that sets the duty ratio. Last 4 bits of the register are for  
high resolution control. Upper 14 bits are the number of PCLK cycle counts.  
6. Event 3–DPWM count for rising DPWM B event. Last 4 bits of the register are for high resolution control.  
Upper 14 bits are the number of PCLK cycle counts.  
7. Event 4–DPWM count for falling DPWM B event. Last 4 bits of the register are for high resolution control.  
Upper 14 bits are the number of PCLK cycle counts.  
8. Cycle Adjust–Constant offset for Event 2 and Event 4 adjustments.  
Basic comparisons between the programmed registers and the DPWM counter can create the desired edge  
placements in the DPWM. High resolution edge capability is available on Events 2, 3 and 4.  
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Multi Mode Open Loop  
Start of Period  
Start of Period  
Period  
Period Counter  
DPWM Output A  
Event 1  
Event 2 (High Resolution)  
Cycle Adjust A (High Resolution)  
Sample Trigger 1  
To Other  
Modules  
Blanking A Begin  
Blanking A End  
DPWM Output B  
Event 3 (High Resolution)  
Event 4 (High Resolution)  
Cycle Adjust B (High Resolution)  
Sample Trigger 2  
Blanking B Begin  
To Other  
Modules  
Blanking B End  
Phase Trigger  
Events which change with DPWM mode:  
DPWM A Rising Edge = Event 1  
DPWM A Falling Edge = Event 2 + Cycle Adjust A  
DPWM B Rising Edge = Event 3  
DPWM B Falling Edge = Event 4 + Cycle Adjust B  
Phase Trigger = Phase Trigger Register value  
Events always set by their registers, regardless of mode:  
Sample Trigger 1, Sample Trigger 2, Blanking A Begin, Blanking A End, Blanking B Begin,  
Blanking B End  
The drawing above is for multi-mode, open loop. Open loop means that the DPWM is controlled entirely by its  
own registers, not by the filter output. In other words, the power supply control loop is not closed.  
The Sample Trigger signals are used to trigger the Front End to sample input signals. The Blanking signals are  
used to blank fault measurements during noisy events, such as FET turn on and turn off. Additional DPWM  
modes are described below.  
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9.3.2.1.4 High Resolution DPWM  
Unlike conventional PWM controllers where the frequency of the clock dictates the maximum resolution of PWM  
edges, the UCD3138x DPWM can generate waveforms with resolutions as small as 250 ps. This is 16 times the  
resolution of the clock driving the DPWM module.  
This is achieved by providing the DPWM mechanism with 16 phase shifted clock signals of 250 MHz each.  
9.3.2.1.5 Over Sampling  
The DPWM module has the capability to trigger an over sampling event by initiating the EADC to sample the  
error voltage. The default “00” configuration has the DPWM trigger the EADC once based on the sample trigger  
register value. The over sampling register has the ability to trigger the sampling 2, 4 or 8 times per PWM period.  
Thus the time the over sample happens is at the divide by 2, 4, or 8 time set in the sampling register. The “01”  
setting triggers 2X over sampling, the “10” setting triggers 4X over sampling, and the “11” triggers over sampling  
at 8X.  
9.3.2.1.6 DPWM Interrupt Generation  
The DPWM has the capability to generate a CPU interrupt based on the PWM frequency programmed in the  
period register. The interrupt can be scaled by a divider ratio of up to 255 for developing a slower interrupt  
service execution loop. This interrupt can be fed to the ADC circuitry for providing an ADC12 trigger for sequence  
synchronization. Table 2 outlines the divide ratios that can be programmed.  
9.3.2.1.7 DPWM Interrupt Scaling/Range  
Table 2. DPWM Interrupt Divide Ratio  
NUMBER OF 32  
INTERRUPT  
DIVIDE  
SETTING  
INTERRUPT  
DIVIDE  
COUNT  
INTERRUPT  
DIVIDE  
COUNT (HEX)  
SWITCHING PERIOD  
FRAMES (assume  
1MHz loop)  
MHZ  
PROCESSOR  
CYCLES  
1
2
0
1
00  
01  
03  
07  
0F  
1F  
2F  
3F  
4F  
5F  
7F  
9F  
BF  
DF  
FF  
1
2
32  
64  
3
3
4
128  
4
7
8
256  
5
15  
31  
47  
63  
79  
95  
127  
159  
191  
223  
255  
16  
32  
48  
64  
80  
96  
128  
160  
192  
224  
256  
512  
6
1024  
1536  
2048  
2560  
3072  
4096  
5120  
6144  
7168  
8192  
7
8
9
10  
11  
12  
13  
14  
15  
9.3.3 Automatic Mode Switching  
Automatic Mode switching enables the DPWM module to switch between modes automatically, with no firmware  
intervention. This is useful to increase efficiency and power range. The following paragraphs describe phase-  
shifted full bridge and LLC examples.  
9.3.3.1 Phase Shifted Full Bridge Example  
In phase shifted full bridge topologies, efficiency can be increased by using pulse width modulation, rather than  
phase shift, at light load. This is shown below:  
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DPWM3A  
(QB1)  
DPWM3B  
(QT1)  
DPWM2A  
(QT2)  
DPWM2B  
(QB2)  
VTrans  
DPWM1B  
(QSYN1,3)  
DPWM0B  
(QSYN2,4)  
IPRI  
Figure 11. Phase-Shifted Full Bridge Waveforms  
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L1  
T1  
Q7  
+12V  
Q6  
Q5  
C1  
RL  
VBUS  
I_pri  
PRIM  
CURRENT  
ORING  
CTL  
T2  
VOUT  
C2  
R2  
D1  
T1  
QT2  
QB2  
QT1  
VA  
Lr  
Current  
Sensing  
QB1  
D2  
DPWM0B  
DPWM1B  
Vref  
DPWM0  
Duty for mode  
switching  
Vout  
Iout  
CPCC  
<
EADC0  
EADC1  
CLA0  
DPWM1  
DPWM2  
CLA1  
DPWM2A  
DPWM2B  
Load Current  
DPWM3A  
DPWM3B  
I_pri  
EADC2  
DPWM3  
PCM  
AD00  
ISOLATED  
GATE Transformer  
ACFAIL_IN  
FAULT 0  
FAULT 1  
FAULT 2  
SYNCHRONOUS  
GATE DRIVE  
AD01  
AD02/CMP0  
AD03/CMP1/CMP2  
AD04/CMP3  
AD05/CMP4  
AD06/CMP5  
AD07/CMP6  
AD08  
ACFAIL_OUT  
FAILURE  
I_SHARE  
Vout  
FAULT  
GPIO1  
GPIO2  
GPIO3  
ORING_CRTL  
ON/OFF  
Iout  
I_pri  
CBC  
temp  
P_GOOD  
Vin  
VA  
WD  
ARM7  
AD09  
PMBus  
UART0  
RST  
OSC  
Primary  
UART1  
Memory  
Figure 12. Secondary-Referenced Phase-Shifted Full Bridge Control With Synchronous Rectification  
9.3.3.2 LLC Example  
In LLC, three modes are used. At the highest frequency, a pulse width modulated mode (Multi Mode) is used. As  
the frequency decreases, resonant mode is used. As the frequency gets still lower, the synchronous MOSFET  
drive changes so that the on-time is fixed and does not increase. In addition, the LLC control supports cycle-by-  
cycle current limiting. This protection function operates by a comparator monitoring the maximum current during  
the DPWMA conduction time. Any time this current exceeds the programmable comparator reference the pulse is  
immediately terminated. Due to classic instability issues associated with half-bridge topologies it is also possible  
to force DPWMB to match the truncated pulse width of DPWMA. Here are the waveforms for the LLC:  
PWM  
Mode  
LLC Mode  
fr  
fs= fr_max  
fs< fr  
fs> fr  
Q1T  
Q1B  
QSR1  
QSR2  
Tr= 1/fr  
Tr= 1/fr  
ISEC(t)  
Figure 13. LLC Waveforms  
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VBUS  
Q1T  
ILR(t)  
Transformer  
QSR2  
LRES  
LK  
NS  
NS  
Driver  
DPWM1B  
ISEC(t)  
Oring Circuitry  
RLRES  
Q1B  
ILM(t)  
LM  
VOUT  
NP  
RF1  
RF2  
AD03  
COUT1  
COUT2  
EAP0  
VOUT(t)  
VBUS  
ESR1  
ESR2  
CF  
QSR1  
EAN0  
AD04  
CRES  
RS  
Driver  
DPWM1A  
CS  
CRES  
VCR(t)  
RS1  
RS2  
ADC13  
EAP1  
Driver  
Driver  
DPWM0B  
DPWM0A  
Figure 14. Secondary-Referenced Half-Bridge Resonant LLC Control With Synchronous Rectification  
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9.3.3.3 Mechanism For Automatic Mode Switching  
The UCD3138x allows the customer to enable up to two distinct levels of automatic mode switching. These  
different modes are used to enhance light load operation, short circuit operation and soft start. Many of the  
configuration parameters for the DPWM are in DPWM Control Register 1. For automatic mode switching, some  
of these parameters are duplicated in the Auto Config Mid and Auto Config High registers.  
If automatic mode switching is enabled, the filter duty signal is used to select which of these three registers is  
used. There are 4 registers which are used to select the points at which the mode switching takes place. They  
are used as shown below.  
Automatic Mode Switching  
With Hysteresis  
Filter Duty  
Full Range  
Auto Config High  
High – Upper Threshold  
High – Lower Threshold  
Auto Config Mid  
Low – Upper Threshold  
Low – Lower Threshold  
Control  
Register 1  
0
Figure 15. Automatic Mode Switching  
As shown, the registers are used in pairs for hysteresis. The transition from Control Register 1 to Auto Config  
Mid only takes place when the Filter Duty goes above the Low Upper threshold. It does not go back to Auto  
Config Mid until the Low Lower Threshold is passed. This prevents oscillation between modes if the filter duty is  
close to a mode switching point.  
9.3.4 DPWMC, Edge Generation, Intramux  
The UCD3138x has hardware for generating complex waveforms beyond the simple DPWMA and DPWMB  
waveforms already discussed – DPWMC, the Edge Generation Module, and the IntraMux.  
DPWMC is a signal inside the DPWM logic. It goes high at the Blanking A begin time, and low at the Blanking A  
end time.  
The Edge Gen module takes DPWMA and DPWMB from its own DPWM module, and the next one, and uses  
them to generate edges for two outputs. For DPWM3, the DPWM0 is considered to be the next DPWM. Each  
edge (rising and falling for DPWMA and DPWMB) has 8 options which can cause it.  
The options are:  
0 = DPWM(n) A Rising edge  
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1 = DPWM(n) A Falling edge  
2 = DPWM(n) B Rising edge  
3 = DPWM(n) B Falling edge  
4 = DPWM(n+1) A Rising edge  
5 = DPWM(n+1) A Falling edge  
6 = DPWM(n+1) B Rising edge  
7 = DPWM(n+1) B Falling edge  
Where “n" is the numerical index of the DPWM module of interest. For example n=1 refers to DPWM1.  
The Edge Gen is controlled by the DPWMEDGEGEN register. It also has an enable/disable bit.  
The IntraMux is controlled by the Auto Config registers. Intra Mux is short for intra multiplexer. The IntraMux  
takes signals from multiple DPWMs and from the Edge Gen and combines them logically to generate DPWMA  
and DPWMB signals This is useful for topologies like phase-shifted full bridge, especially when they are  
controlled with automatic mode switching. Of course, it can all be disabled, and DPWMA and DPWMB will be  
driven as described in the sections above. If the Intra Mux is enabled, high resolution must be disabled, and  
DPWM edge resolution goes down to 4 ns.  
Here is a drawing of the Edge Gen/Intra Mux:  
A/B/C (N)  
A/B/C (N+1)  
INTRAMUX  
C (N+2)  
C (N+3)  
PWM A  
PWM B  
EDGE GEN  
A(N)  
B(N)  
EGEN A  
EGEN B  
A(N+1)  
B(N+1)  
B SELECT  
A SELECT  
A ON SELECT  
A OFF SELECT  
B ON SELECT  
B OFF SELECT  
Figure 16. Edge Generation / IntraMux  
Here is a list of the IntraMux modes for DPWMA:  
0 = DPWMA(n) pass through (default)  
1 = Edge-gen output, DPWMA(n)  
2 = DPWNC(n)  
3 = DPWMB(n) (Crossover)  
4 = DPWMA(n+1)  
5 = DPWMB(n+1)  
6 = DPWMC(n+1)  
7 = DPWMC(n+2)  
8 = DPWMC(n+3)  
and for DPWMB:  
0 = DPWMB(n) pass through (default)  
1 = Edge-gen output, DPWMB(n)  
2 = DPWNC(n)  
3 = DPWMA(n) (Crossover)  
4 = DPWMA(n+1)  
5 = DPWMB(n+1)  
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6 = DPWMC(n+1)  
7 = DPWMC(n+2)  
8 = DPWMC(n+3)  
The DPWM number wraps around just like the Edge Gen unit. For DPWM3 the following definitions apply:  
DPWM(n)  
DPWM3  
DPWM0  
DPWM1  
DPWM2  
DPWM(n+1)  
DPWM(n+2)  
DPWM(n+3)  
9.3.5 Filter  
The UCD3138x filter is a PID filter with many enhancements for power supply control. Some of its features  
include:  
Traditional PID Architecture  
Programmable non-linear limits for automated modification of filter coefficients based on received EADC error  
Multiple coefficient sets fully configurable by firmware  
Full 24-bit precision throughout filter calculations  
Programmable clamps on integrator branch and filter output  
Ability to load values into internal filter registers while system is running  
Ability to stall calculations on any of the individual filter branches  
Ability to turn off calculations on any of the individual filter branches  
Duty cycle, resonant period, or phase shift generation based on filter output.  
Flux balancing  
Voltage feed forward  
Here is the first section of the Filter :  
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Limit Comparator  
Limit 6  
Limit 5  
…..  
PID Filter Branch Stages  
Limit 0  
Coefficient  
select  
EADC_DATA  
Xn  
16  
24  
9
24  
X
P
9
9
24  
16  
24  
24  
9
9
24  
24  
9
+
+
X
I
24  
24  
Ki Low  
9
24  
24  
X
32  
9
Round  
24  
16  
24  
XnXn+1  
9
9
24  
24  
-
X
Clamp  
+
D
Figure 17. First Section of the Filter  
The filter input, Xn, generally comes from a front end. Then there are three branches, P, I. and D. Note that the D  
branch also has a pole, Kd Alpha. Clamps are provided both on the I branch and on the D alpha pole.  
The filter also supports a nonlinear mode, where up to 7 different sets of coefficients can be selected depending  
on the magnitude of the error input Xn. This can be used to increase the filter gain for higher errors to improve  
transient response.  
Here is the output section of the filter (S0.23 means that there is 1 sign bit, 0 integer bits and 23 fractional bits).:  
Filter Yn  
Clamp High  
Yn Scale  
Shifter  
24  
24  
24  
P
I
24  
24  
24  
S0.23  
26  
Filter Yn  
Saturate  
Yn  
Clamp  
+
D
S2.23  
S0.23  
S0.23  
Filter Yn  
Clamp Low  
All are S0.23  
Figure 18. Output Section of the Filter  
This section combines the P, I, and D sections, and provides for saturation, scaling, and clamping.  
There is a final section for the filter, which permits its output to be matched to the DPWM:  
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Filter Output  
Clamp High  
Round to  
18 bits,  
Truncate  
low 4 bits  
Filter Period  
Bits [17:4]  
Filter YN  
24 S0.23  
38  
18  
14  
X
Clamp to  
Positive  
Round to  
S14.23  
14.4  
14.0  
Filter YN (Duty %)  
18  
Filter Duty  
14.4  
38  
18 bits,  
Clamp to  
Positive  
18  
Clamp  
X
24  
S0.23  
S14.23  
14.4  
KCompx 14.0  
14  
14.0  
14.0  
KCompx  
DPWMx Period  
Loop_VFF  
14  
DPWMx Period 14.0  
Filter Output  
Clamp Low  
14.0  
14.0  
14.0  
14.0  
PERIOD_MULT_SEL  
Resonant Duty  
OUTPUT_MULT_SEL  
Figure 19. Final Section for the Filter  
This permits the filter output to be multiplied by a variety of correction factors to match the DPWM Period, to  
provide for Voltage Feed Forward, or for other purposes. After this, there is another clamp. For resonant mode,  
the filter can be used to generate both period and duty cycle.  
9.3.5.1 Loop Multiplexer  
The Loop Mux controls interconnections between the filters, front ends, and DPWMs. Any filter, front end, and  
DPWM can be combined in a variety of configurations.  
It also controls the following connections:  
DPWM to Front End  
Front End DAC control from Filters or Constant Current/Constant Power Module  
Filter Special Coefficients and Feed Forward  
DPWM synchronization  
Filter to DPWM  
The following control modules are configured in the Loop Mux:  
Constant Power/Constant Current  
Cycle Adjustment (Current and flux balancing)  
Global Period  
Light Load (Burst Mode)  
Analog Peak Current Mode  
9.3.5.2 Fault Multiplexer  
In order to allow a flexible way of mapping several fault triggering sources to all the DPWMs channels, the  
UCD3138x provides an extensive array of multiplexers that are united under the name Fault Mux module.  
The Fault Mux Module supports the following types of mapping between all the sources of fault and all the  
different fault response mechanisms inside each DPWM module.  
Many fault sources may be mapped to a single fault response mechanism. For instance an analog  
comparator in charge of over voltage protection, a digital comparator in charge of over current protection and  
an external digital fault pin can be all mapped to a Fault-A signal connected to a single FAULT MODULE and  
shut down DPWM1-A.  
A single fault source can be mapped to many fault response mechanisms inside many DPWM modules. For  
instance an analog comparator in charge of over current protection can be mapped to DPWM-0 through  
DPWM-3 by way of several fault modules.  
Many fault sources can be mapped to many fault modules inside many DPWM modules.  
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CBC_PWM_AB_EN  
FAULT MUX  
DPWM  
Bit20 in DPWMCTRL0  
CYCLE BY CYCLE  
ANALOG PCM  
FAULT- CBC  
AB FLAG  
FAULT MODULE  
DISABLE PWM A AND B  
CBC_FAULT_EN  
Bit30 in DPWMFLTCTRL  
FAULT- AB  
FAULT-A  
FAULT-B  
AB FLAG  
FAULT MODULE  
DISABLE PWM A AND B  
DCOMP– 4X  
EXT GPIO4X  
ACOMP – 7X  
A FLAG  
FAULT MODULE  
DISABLE PWM A ONLY  
B FLAG  
FAULT MODULE  
DISABLE PWM B ONLY  
ALL_FAULT_EN  
DPWM_EN  
Bit0 in DPWMCTRL0  
Bit 31 in DPWMFLTCTRL  
Figure 20. Fault Mux Module  
The Fault Mux Module provides a multitude of fault protection functions within the UCD3138x high-speed loop  
(Front End Control, Filter, DPWM and Loop Mux modules). The Fault Mux Module allows highly configurable  
fault generation based on digital comparators, high-speed analog comparators and external fault pins. Each of  
the fault inputs to the DPWM modules can be configured to one or any combination of the fault events provided  
in the Fault Mux Module.  
Each one of the DPWM engines has four fault modules. The modules are called CBC fault module, AB fault  
module, A fault module and B fault module.  
The internal circuitry in all the four fault modules is identical, and the difference between the modules is limited to  
the way the modules are attached to the DPWMs.  
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FAULT FLAG  
FAULT IN  
FAULT MODULE  
Figure 21. Fault Module  
All fault modules provide immediate fault detection but only once per DPWM switching cycle. Each one of the  
fault modules own a separate max_count and the fault flag will be set only if sequential cycle-by-cycle fault count  
exceeds max_count.  
Once the fault flag is set, DPWMs need to be disabled by DPWM_EN going low in order to clear the fault flags.  
Please note, all four Fault Modules share the same DPWM_EN control, all fault flags (output of Fault Modules)  
will be cleared simultaneously.  
All four Fault Modules share the same global FAULT_EN as well. Therefore a specific Fault Module cannot be  
enabled/ disabled separately.  
FAULT - CBC  
CLIM  
CYCLE BY CYCLE  
Figure 22. Cycle-By-Cycle Block  
Unlike Fault Modules, only one Cycle by Cycle block is available in each DPWM module.  
The Cycle by Cycle block works in conjunction with CBC Fault Module and enables DPWM reaction to signals  
arriving from the Analog Peak current mode (PCM) module.  
The Fault Mux Module supports the following basic functions:  
4 digital comparators with programmable thresholds and fault generation  
Configuration for 7 high speed analog comparators with programmable thresholds and fault generation  
External GPIO detection control with programmable fault generation  
Configurable DPWM fault generation for DPWM Current Limit Fault, DPWM Over-Voltage Detection Fault,  
DPWM A External Fault, DPWM B External Fault and DPWM IDE Flag  
Clock Failure Detection for High and Low Frequency Oscillator blocks  
Discontinuous Conduction Mode Detection  
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HFO/LFO  
Fail Detect  
DCM Detection  
Analog Comparator 0  
Control  
Analog  
Comparator 0  
Digital Comparator 0  
Control  
Front End  
Control 0  
Analog Comparator 1  
Control  
Analog  
Comparator 1  
Digital Comparator 1  
Control  
Front End  
Control 1  
Analog Comparator 2  
Control  
Analog  
Comparator 2  
Digital Comparator 2  
Control  
Analog Comparator 3  
Control  
Analog  
Comparator 3  
Front End  
Control 2  
Digital Comparator 3  
Control  
Analog Comparator 4  
Control  
Analog  
Comparator 4  
fault[2:0]  
External GPIO  
Detection  
Analog Comparator 5  
Control  
Analog  
Comparator 5  
DPWM 0  
Fault Control  
DPWM 1  
Fault Control  
DPWM 2  
Fault Control  
DPWM 3  
Fault Control  
Analog Comparator 6  
Control  
Analog  
Comparator 6  
DPWM 0  
DPWM 1  
DPWM 2  
DPWM 3  
Analog Comparator  
Automated Ramp  
Figure 23. Fault Mux Block Diagram  
9.3.6 Communication Ports  
9.3.6.1 SCI (UART) Serial Communication Interface  
maximum of two independent Serial Communication Interface (SCI) or Universal Asynchronous  
A
Receiver/Transmitter (UART) interfaces are included within the device for asynchronous start-stop serial data  
communication (see the pin out sections for details). Each interface has a 24 bit pre-scaler for supporting  
programmable baud rates, a programmable data word and stop bit options. Half or full duplex operation is  
configurable through register bits. A loop back feature can also be setup for firmware verification. Both SCI-TX  
and SCI-RX pin sets can be used as GPIO pins when the peripheral is not being used.  
9.3.6.2 PMBUS/I2C  
The UCD3138x has two independent interfaces which both support PMBus and I2C in master and slave modes.  
Only one of the interfaces has control of the address pin current sources as well as support for the optional  
Control and Alert lines described in the PMBus specification. Other than these differences, the interfaces are  
identical.  
The PMBus/I2C interface is designed to minimize the processor overhead required for interface. It can  
automatically detect and acknowledge addresses. It handles start and stop conditions automatically, and can  
clock stretch until the processor has time to poll the PMBus status. It will automatically receive and send up to 4  
bytes at a time. It can automatically verify and generate a PEC. This means that a write byte command can be  
received by the processor with only one function call. There is no need for any interrupts at all with this  
PMBus/I2C interface. If it is polled every few milliseconds, it will work perfectly.  
The interface also supports automatic ACK of two independent addresses. If both PMBus/I2C interfaces are used  
at the same time a total of 4 independent addresses can be automatically detected.  
Example: PMBus Address Decode via ADC12 Reading  
The user can allocate 2 pins of the 12-bit ADC input channels, AD_00 and AD_01, for PMBus address decoding.  
At power-up the device applies IBIAS to each address detect pin and the voltage on that pin is captured by the  
internal 12-bit ADC.  
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Vdd  
AD00,  
AD01  
pin  
On/Off Control  
I
BIAS  
Resistor to  
set PMBus  
Address  
To ADC Mux  
Figure 24. PMBUS Address Detection Method  
PMBus/I2C address 0x7E is a reserved address and should not be used in a system using the UCD3138x. This  
address is used for manufacturing test.  
9.3.6.3 SPI  
The SPI is a high-speed synchronous serial input/output port that allows a serial bit stream of programmed length  
(1 to 16 bits) to be shifted into and out of the device at a programmed bit-transfer rate. The SPI is normally used  
for communication between the UCD3138x and external peripherals. Typical applications include an interface to  
external I/O or peripheral expansion via devices such as shift registers, display drivers, SPI EPROMs and  
analog-to-digital converters. The SPI allows serial communication with other SPI devices through a 3-pin or 4-pin  
mode interface. The SPI typically is configured as a master for communicating to external EEPROM.  
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SCS  
tCSS  
tWH  
tWL  
tCSH  
SCK  
tSU  
tH  
MISO  
MOSI  
VALID IN  
tV  
tHO  
VALID OUT  
PSCK  
tWH  
tWL  
tSU  
tH  
tV  
tHO  
tCSS  
Period SCK  
2 ICLK  
1/2 PSCK  
1/2 PSCK  
2 ns (typical)  
4 ns (typical)  
4 ns (typical)  
2 ns (typical)  
1 PSCK  
SCK High Time  
SCK Low Time  
Data in setup  
Data in hold  
Ouput Valid  
Ouput Data Hold  
Chip Select Setup  
tCSH  
Chip Select Hold  
1 PSCK  
Figure 25. SPI Timing Diagram  
9.3.7 Real Time Clock  
The UCD3138x has an internal real time clock (RTC) function that can track time in seconds, minutes, hours and  
days. This function requires an external precision 10 MHz clock.  
Firmware writable time/day register which tracks the total number of days.  
The day counter will be able to count 4 years worth of days.  
Years and months and leap year calculation must be calculated in firmware.  
Firmware programmable frequency correction of ±200 ppm in 0.8 ppm steps  
The RTC function can provide interrupts to the IRQ or FIQ at 1, 10, 30, and 60 second intervals.  
The clock from the RTC driver can be driven to an external pin through an internal multiplexor  
The clock for the RTC function can come from an external clock through a dedicated GPIO pin.  
9.3.8 Timers  
External to the Digital Power Peripherals there are 3 different types of timers in UCD3138x. They are the 24-bit  
timer, 16-bit timer and the watchdog timer  
9.3.8.1 24-Bit Timer  
There is one 24 bit timer which runs off the Interface Clock. It can be used to measure the time between two  
events, and to generate interrupts after a specific interval. Its clock can be divided down by an 8-bit pre-scalar to  
provide longer intervals. The timer has two compare registers (Data Registers). Both can be used to generate an  
interrupt after a time interval. . Additionally, the timer has a shadow register (Data Buffer register) which can be  
used to store CPU updates of the compare events while still using the timer. The selected shadow register  
update mode happens after the compare event matches.  
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The two capture pins TCAP0 and TCAP1 are inputs for recording a capture event. A capture event can be set  
either to rising, falling, or both edges of the capture pin signal. Upon this event, the counter value is stored in the  
corresponding capture data register. Five Interrupts from the 24 bit timer can be set, which are the counter  
rollover event (overflow), capture events 0 and 1, and the two comparison match events. Each interrupt can be  
disabled or enabled.  
9.3.8.2 16-Bit PWM Timers  
There are four 16 bit counter PWM timers which run off the Interface Clock and can further be divided down by a  
8-bit pre-scaler to generate slower PWM time periods. Each timer has two compare registers (Data Registers) for  
generating the PWM set/unset events. Additionally, each timer has a shadow register (Data Buffer register)  
which can be used to store CPU updates of compare events while still using the timer. The selected shadow  
register update mode happens after the compare event matches.  
The counter reset can be configured to happen on a counter roll over, a compare equal event, or by a software  
controlled register. Interrupts from the PWM timer can be set due to the counter rollover event (overflow) or by  
the two comparison match events. Each comparison match and the overflow interrupts can be disabled or  
enabled.  
Upon an event comparison, the PWM pin can be configured to set, clear, toggle or have no action at the output.  
The value of PWM pin output can be read for status or simply configured as General Purpose I/O for reading the  
value of the input at the pin.  
9.3.8.3 Watchdog Timer  
A watchdog timer is provided on the device for ensuring proper firmware loop execution. The timer is clocked off  
of a separate low speed oscillator source. If the timer is allowed to expire, a reset condition is issued to the ARM  
processor. The watchdog is reset by a simple CPU write bit to the watchdog key register by the firmware routine.  
On device power-up the watchdog is disabled. Yet after it is enabled, the watchdog cannot be disabled by  
firmware. Only a device reset can put this bit back to the default disabled state. A half timer flag is also provided  
for status monitoring of the watchdog.  
9.3.9 General Purpose ADC12  
The ADC12 is a 12 bit, high speed analog to digital converter, equipped with the following options:  
Typical conversion speed of 267 ksps  
Conversions can consist from 1 to 16 ADC channel conversions in any desired sequence  
Post conversion averaging capability, ranging from 4X, 8X, 16X or 32X samples  
Configurable triggering for ADC conversions from the following sources: firmware, DPWM rising edge,  
ADC_EXT_TRIG pin or Analog Comparator results  
Interrupt capability to embedded processor at completion of ADC conversion  
Six digital comparators on the first 6 channels of the conversion sequence using either raw ADC data or  
averaged ADC data  
Two 10 µA current sources for excitation of PMBus addressing resistors  
Dual sample and hold for accurate power measurement  
Internal temperature sensor for temperature protection and monitoring  
The control module (ADC12 Contol Block Diagram) contains the control and conversion logic for auto-  
sequencing a series of conversions. The sequencing is fully configurable for any combination of 16 possible ADC  
channels through an analog multiplexer embedded in the ADC12 block. Once converted, the selected channel  
value is stored in the result register associated with the sequence number. Input channels can be sampled in any  
desired order or programmed to repeat conversions on the same channel multiple times during a conversion  
sequence. Selected channel conversions are also stored in the result registers in order of conversion, where the  
result 0 register is the first conversion of a 16-channel sequence and result 15 register is the last conversion of a  
16-channel sequence. The number of channels converted in a sequence can vary from 1 to 16.  
Unlike EADC0 through EADC2, which are primarily designed for closing high speed compensation loops, the  
ADC12 is not usually used for loop compensation purposes. The EADC converters have a substantially faster  
conversion rate, thus making them more attractive for closed loop control. The ADC12 features make it best  
suited for monitoring and detection of currents, voltages, temperatures and faults. Please see the Typical  
Characteristics plots for the temperature variation associated with this function.  
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ADC12 Block  
ADC12 Registers  
ADC  
Averaging  
12-bit SAR  
ADC  
S/H  
ADC  
Channels  
ADC12  
Control  
Digital  
Comparators  
ADC Channel  
ADC External Trigger (from pin)  
Analog  
Comparators  
DPWM  
Modules  
Figure 26. ADC12 Control Block Diagram  
9.3.10 Miscellaneous Analog  
The Miscellaneous Analog Control (MAC) Registers are a catch-all of registers that control and monitor a wide  
variety of functions. These functions include device supervisory features such as Brown-Out and power saving  
configuration, general purpose input/output configuration and interfacing, internal temperature sensor control and  
current sharing control.  
The MAC module also provides trim signals to the oscillator and AFE blocks. These controls are usually used at  
the time of trimming at manufacturing; therefore this document will not cover these trim controls.  
9.3.11 Brownout  
Brownout function is used to determine if the device supply voltage is lower than a threshold voltage, a condition  
that may be considered unsafe for proper operation of the device.  
The brownout threshold is higher than the reset threshold voltage; therefore, when the supply voltage is lower  
than brownout threshold, it still does not necessarily trigger a device reset.  
The brownout interrupt flag can be polled or alternatively can trigger an interrupt to service such case by an  
interrupt service routine. Please see the Power On Reset (POR) / Brown Out Reset (BOR) section.  
9.3.12 Global I/O  
Up to 32 pins in UCD3138x can be configured in the Global I/O register to serve as a general purpose input or  
output pins (GPIO). This includes all digital input or output pins except for the RESET pin.  
The pins that cannot be configured as GPIO pins are the supply pins, ground pins, ADC-12 analog input pins,  
EADC analog input pins and the RESET pin. Additional digital pins not listed in this register can be configured  
through their local configuration registers.  
There are two ways to configure and use the digital pins as GPIO pins:  
1. Through the centralized Global I/O control registers.  
2. Through the distributed control registers in the specific peripheral that shares it pins with the standard GPIO  
functionality.  
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The Global I/O registers offer full control of:  
1. Configuring each pin as a GPIO.  
2. Setting each pin as input or output.  
3. Reading the pin’s logic state, if it is configured as an input pin.  
4. Setting the logic state of the pin, if it is configured as an output pin.  
5. Connecting pin/pins to high rail through internal push/pull drivers or external pull up resistors.  
The Global I/O registers include Global I/O EN register, Global I/O OE Register, Global I/O Open Drain Control  
Register, Global I/O Value Register and Global I/O Read Register.  
The following is showing the format of Global I/O EN Register (GLBIOEN) as an example:  
BIT NUMBER  
Bit Name  
Access  
31:0  
GLOBAL_IO_EN  
R/W  
Default  
0000_0000_0000_0000_0000_0000_0000_0000  
Bits 29-0: GLOBAL_IO_EN – This register enables the global control of digital I/O pins  
0 = Control of IO is done by the functional block assigned to the IO (Default)  
1 = Control of IO is done by Global IO registers.  
PIN NUMBER  
BIT  
PIN_NAME  
UCD3138x  
11  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
PWM2  
PWM3  
12  
FAULT3  
ADC_EXT_TRIG  
TCK  
55  
14  
45  
TDO  
46  
TMS  
48  
TDI  
47  
SCI_TX1  
SCI_TX0  
SCI_RX1  
SCI_RX0  
TCAP0  
37  
35  
38  
36  
49  
PWM1  
40  
PWM0  
39  
TCAP1  
13  
I2C_DATA  
PMBUS_CTRL  
PMBUS_ALERT  
EXT_INT  
FAULT2  
FAULT1  
FAULT0  
SYNC  
20  
18  
17  
42  
54  
44  
43  
8
34  
7
DPWM3B  
DPWM3A  
DPWM2B  
DPWM2A  
DPWM1B  
DPWM1A  
DPWM0B  
DPWM0A  
29  
6
28  
5
27  
4
26  
3
25  
2
24  
1
23  
0
22  
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9.3.13 Temperature Sensor Control  
Temperature sensor control register provides internal temperature sensor enabling and trimming capabilities. The  
internal temperature sensor is disabled by default.  
Temperature  
Calibration  
ADC 12  
Temperature  
Sensor  
CH15  
Figure 27. Internal Temp Sensor  
Temperature sensor is calibrated at room temperature (25 °C) via a calibration register value.  
The temperature sensor is measured using ADC12 (via Ch15). The temperature is then calculated using a  
mathematical formula involving the calibration register (this effectively adds a delta to the ADC measurement).  
The temperature sensor can be enabled or disabled.  
9.3.14 I/O Mux Control  
I/O Mux Control register may be used in order to choose a single specific functionality that is desired to be  
assigned to a physical device pin for your application. See the UCD3138x programmer's manual for details on  
the available configurations.  
9.3.15 Current Sharing Control  
UCD3138x provides three separate modes of current sharing operation.  
Analog bus current sharing  
PWM bus current sharing  
Master/Slave current sharing  
AD02 has a special ESD protection mechanism that prevents the pin from pulling down the current-share bus  
if power is missing from the UCD3138x  
The simplified current sharing circuitry is shown in the drawing below. The digital pulse connected to SW3  
transforms SW3 into a pulse-width-modulated current source. Details on the frequency and resolution of this  
feature are in the digital power fusion peripherals manual.  
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3.3 V  
ISHARE  
SW3  
Digital  
3.3 V  
3.3V  
ESD  
AD13  
ESD  
3.2 kΩ  
400 Ω  
250 Ω  
AD02  
SW2  
SW1  
ESD  
250 Ω  
EXT CAP  
RSHARE  
ADC12 and  
CMP  
ADC12 and  
CMP  
Figure 28. Simplified Current Sharing Circuitry  
FOR TEST ONLY,  
ALWAYS KEEP 00  
CURRENT SHARING MODE  
CS_MODE  
EN_SW1  
EN_SW2  
DPWM  
Off or Slave Mode (3-state)  
PWM Bus  
00  
00  
00  
00  
00 (default)  
0
1
0
0
0
0
0
1
0
01  
10  
11  
ACTIVE  
Off or Slave Mode (3-state)  
Analog Bus or Master  
0
0
The period and the duty of 8-bit PWM current source and the state of the SW1 and SW2 switches can be  
controlled through the current sharing control register (CSCTRL).  
9.3.16 Temperature Reference  
The temperature reference register (TEMPREF) provides the ADC12 count when ADC12 measures the internal  
temperature sensor (channel 15) during the factory trim and calibration.  
This information can be used by different periodic temperature compensation routines implemented in the  
firmware. But it should not be overwritten by firmware, otherwise this factory written value will be lost until the  
device is reset.  
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9.4 Device Functional Modes  
9.4.1 DPWM Modes Of Operation  
The DPWM is a complex logic system which is highly configurable to support several different power supply  
topologies. The discussion below will focus primarily on waveforms, timing and register settings, rather than on  
logic design.  
The DPWM is centered on a period counter, which counts up from 0 to PRD, and then is reset and starts over  
again.  
The DPWM logic causes transitions in many digital signals when the period counter hits the target value for that  
signal.  
9.4.1.1 Normal Mode  
In Normal mode, the Filter output determines the pulse width on DPWM A. DPWM B fits into the rest of the  
switching period, with a dead time separating it from the DPWM A on-time. It is useful for buck topologies,  
among others. Here is a drawing of the Normal Mode waveforms:  
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Device Functional Modes (continued)  
Normal Mode Closed Loop  
Start of Period  
Start of Period  
Period  
Period Counter  
Filter controlled edge  
DPWM Output A  
Event 1  
Filter Duty (High Resolution)  
Cycle Adjust A (High Resolution)  
Adaptive Sample Trigger A  
Adaptive Sample Trigger B  
Sample Trigger 1  
Blanking A Begin  
To Other  
Modules  
Blanking A End  
DPWM Output B  
Event 3 – Event 2 (High Res)  
Event 4 (High Res)  
Sample Trigger 2  
Blanking B Begin  
Blanking B End  
Phase Trigger  
To Other  
Modules  
Events which change with DPWM mode:  
DPWM A Rising Edge = Event 1  
DPWM A Falling Edge = Event 1 + Filter Duty + Cycle Adjust A  
Adaptive Sample Trigger A = Event 1 + Filter Duty + Adaptive Sample Register or  
Adaptive Sample Trigger B = Event 1 + Filter Duty/2 + Adaptive Sample Register  
DPWM B Rising Edge = Event 1 + Filter Duty + Cycle Adjust A + (Event 3 – Event 2)  
DPWM B Falling Edge = Event 4  
Phase Trigger = Phase Trigger Register value or Filter Duty  
Events always set by their registers, regardless of mode:  
Sample Trigger 1, Sample Trigger 2, Blanking A Begin, Blanking A End, Blanking B  
Begin, Blanking B End  
Figure 29. Normal Mode - Closed Loop  
Cycle adjust A can be used to adjust pulse widths on individual phases of a multi-phase system. This can be  
used for functions like current balancing. The Adaptive Sample Triggers can be used to sample in the middle of  
the on-time (for an average output), or at the end of the on-time (to minimize phase delay) The Adaptive Sample  
Register provides an offset from the center of the on-time. This can compensate for external delays, such as  
MOSFET and gate driver turn on times.  
Blanking A-Begin and Blanking A-End can be used to blank out noise from the MOSFET turn on at the beginning  
of the period (DPWMA rising edge). Blanking B could be used at the turn off time of DPWMB. The other edges  
are dynamic, so blanking is more difficult.  
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Device Functional Modes (continued)  
Cycle Adjust B has no effect in Normal Mode.  
9.4.1.2 Phase Shifting  
In most modes, it is possible to synchronize multiple DPWM modules using the phase shift signal. The phase  
shift signal has two possible sources. It can come from the Phase Trigger Register. This provides a fixed value,  
which is useful for an application like interleaved PFC.  
The phase shift value can also come from the filter output. In this case, the changes in the filter output causes  
changes in the phase relationship of two DPWM modules. This is useful for phase shifted full bridge topologies.  
The following figure shows the mechanism of phase shift:  
Phase Shift  
DPWM0 Start of Period  
DPWM0 Start of Period  
Period Counter  
DPWM1 Start of Period  
DPWM1 Start of Period  
Period Counter  
Phase Trigger = Phase Trigger Register value or Filter Duty  
Figure 30. Phase Shifting  
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Device Functional Modes (continued)  
9.4.1.3 DPWM Multiple Output Mode  
Multi mode is used for systems where each phase has only one driver signal. It enables each DPWM peripheral  
to drive two phases with the same pulse width, but with a time offset between the phases, and with different  
cycle adjusts for each phase.  
The Multi-Mode diagram is shown in Figure 31.  
Multi Mode Closed Loop  
Start of Period  
Start of Period  
Period  
Period Counter  
Filter controlled edge  
DPWM Output A  
Event 1  
Filter Duty (High Resolution)  
Cycle Adjust A (High Resolution)  
Adaptive Sample Trigger A  
Adaptive Sample Trigger B  
Sample Trigger 1  
Blanking A Begin  
To Other  
Modules  
Blanking A End  
DPWM Output B  
Event 3 (High Resolution)  
Filter Duty (High Resolution)  
Cycle Adjust B (High Resolution)  
Sample Trigger 2  
Blanking B Begin  
Blanking B End  
To Other  
Modules  
Phase Trigger  
Events which change with DPWM mode:  
DPWM A Rising Edge = Event 1  
DPWM A Falling Edge = Event 1 + Filter Duty + Cycle Adjust A  
Adaptive Sample Trigger A = Event 1 + Filter Duty + Adaptive Sample Register or  
Adaptive Sample Trigger B = Event 1 + Filter Duty/2 + Adaptive Sample Register  
DPWM B Rising Edge = Event 3  
DPWM B Falling Edge = Event 3 + Filter Duty + Cycle Adjust B  
Phase Trigger = Phase Trigger Register value or Filter Duty  
Events always set by their registers, regardless of mode:  
Sample Trigger 1, Sample Trigger 2, Blanking A Begin, Blanking A End, Blanking B  
Begin, Blanking B End  
Figure 31. DPWM Multi-Mode Close Loop  
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Device Functional Modes (continued)  
Event 2 and Event 4 are not relevant in Multi mode.  
DPWMB can cross over the period boundary safely, and still have the proper pulse width, so full 100% pulse  
width operation is possible. DPWMA cannot cross over the period boundary.  
Since the rising edge on DPWM B is also fixed, Blanking B-Begin and Blanking B-End can be used for blanking  
this rising edge.  
And, of course, Cycle Adjust B is usable on DPWM B.  
9.4.1.4 DPWM Resonant Mode  
This mode provides a symmetrical waveform where DPWMA and DPWMB have the same pulse width. As the  
switching frequency changes, the dead times between the pulses remain the same.  
The equations for this mode are designed for a smooth transition from PWM mode to resonant mode, as  
described in the LLC Example section. Here is a diagram of this mode:  
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Device Functional Modes (continued)  
Resonant Symmetrical Closed Loop  
Start of Period Start of Period  
Filter Period  
Period Counter  
Filter controlled edge  
DPWM Output A  
Event 1  
Filter Duty – Average Dead Time  
Adaptive Sample Trigger A  
Adaptive Sample Trigger B  
Sample Trigger 1  
Blanking A Begin  
To Other  
Modules  
Blanking A End  
DPWM Output B  
Event 3 - Event 2  
Period Register – Event 4  
Sample Trigger 2  
Blanking B Begin  
Blanking B End  
Phase Trigger  
To Other  
Modules  
Events which change with DPWM mode:  
Dead Time 1 = Event 3 – Event 2  
Dead Time 2 = Event 1 + Period Register – Event 4)  
Average Dead Time = (Dead Time 1 + Dead Time 2)/2  
DPWM A Rising Edge = Event 1  
DPWM A Falling Edge = Event 1 + Filter Duty – Average Dead Time  
Adaptive Sample Trigger A = Event 1 + Filter Duty + Adaptive Sample Register  
Adaptive Sample Trigger B = Event 1 + Filter Duty/2 + Adaptive Sample Register  
DPWM B Rising Edge = Event 1 + Filter Duty – Average Dead Time + (Event 3 – Event 2)  
DPWM B Falling Edge = Filter Period – (Period Register – Event 4)  
Phase Trigger = Phase Trigger Register value or Filter Duty  
Events always set by their registers, regardless of mode:  
Sample Trigger 1, Sample Trigger 2, Blanking A Begin, Blanking A End, Blanking B Begin,  
Blanking B End  
Figure 32. DPWM Resonant Symmetrical Mode  
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Device Functional Modes (continued)  
The Filter has two outputs, Filter Duty and Filter Period. In this case, the Filter is configured so that the Filter  
Period is twice the Filter Duty. So if there were no dead times, each DPWM pin would be on for half of the  
period. For dead time handling, the average of the two dead times is subtracted from the Filter Duty for both  
DPWM pins. Therefore, both pins will have the same on-time, and the dead times will be fixed regardless of the  
period. The only edge which is fixed relative to the start of the period is the rising edge of DPWM A. This is the  
only edge for which the blanking signals can be used easily.  
9.4.2 Triangular Mode  
Triangular mode provides a stable phase shift in interleaved PFC and similar topologies. In this case, the PWM  
pulse is centered in the middle of the period, rather than starting at one end or the other. In Triangular Mode,  
only DPWM-B is available. Here is a diagram for Triangular Mode:  
Triangular Mode Closed Loop  
Start of Period  
Period  
Start of Period  
Period Counter  
DPWM Output A  
Sample Trigger 1  
Blanking A Begin  
Blanking A End  
To Other  
Modules  
Filter controlled edge  
DPWM Output B  
Cycle Adjust A (High Resolution)  
Cycle Adjust B (High Resolution)  
Filter Duty/2 (High Resolution)  
Period/2  
Sample Trigger 2  
Blanking B Begin  
Blanking B End  
To Other  
Phase Trigger  
Modules  
Events which change with DPWM mode:  
DPWM A Rising Edge = None  
DPWM A Falling Edge = None  
Adaptive Sample Trigger = None  
DPWM B Rising Edge = Period/2 - Filter Duty/2 + Cycle Adjust A  
DPWM B Falling Edge = Period/2 + Filter Duty/2 + Cycle Adjust B  
Phase Trigger = Phase Trigger Register value or Filter Duty  
Events always set by their registers, regardless of mode:  
Sample Trigger 1, Sample Trigger 2, Blanking A Begin, Blanking A End, Blanking B  
Begin, Blanking B End  
Figure 33. Triangular Mode  
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Device Functional Modes (continued)  
All edges are dynamic in triangular mode, so fixed blanking is not that useful. The adaptive sample trigger is not  
needed. It is very easy to put a fixed sample trigger exactly in the center of the FET on-time, because the center  
of the on-time does not move in this mode.  
9.4.3 Leading Edge Mode  
Leading edge mode is similar to Normal mode, reversed in time. The DPWM A falling edge is fixed, and the  
rising edge moves to the left, or backwards in time, as the filter output increases. The DPWM B falling edge  
stays ahead of the DPWMA rising edge by a fixed dead time. Here is a diagram of the Leading Edge Mode:  
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Device Functional Modes (continued)  
Leading Edge Closed Loop  
Start of Period  
Start of Period  
Period  
Period Counter  
DPWM Output A  
Event 1  
Filter Duty (High Resolution)  
Cycle Adjust A (High Resolution)  
Adaptive Sample Trigger A  
Adaptive Sample Trigger B  
Sample Trigger 1  
Blanking A Begin  
To Other  
Modules  
Blanking A End  
DPWM Output B  
Event 2 - Event 3 (High Resolution)  
Event 4 (High Resolution)  
Sample Trigger 2  
Blanking B Begin  
Blanking B End  
Phase Trigger  
To Other  
Modules  
Events which change with DPWM mode:  
DPWM A Falling Edge = Event 1  
DPWM A Rising Edge = Event 1 - Filter Duty + Cycle Adjust A  
Adaptive Sample Trigger A = Event 1 - Filter Duty + Adaptive Sample Register or  
Adaptive Sample Trigger B = Event 1 - Filter Duty/2 + Adaptive Sample Register  
DPWM B Rising Edge = Event 4  
DPWM B Falling Edge = Event 1 - Filter Duty + Cycle Adjust A -(Event 2 – Event 3)  
Phase Trigger = Phase Trigger Register value or Filter Duty  
Events always set by their registers, regardless of mode:  
Sample Trigger 1, Sample Trigger 2, Blanking A Begin, Blanking A End, Blanking B  
Begin, Blanking B End  
Figure 34. Leading Edge Mode  
As in the Normal mode, the two edges in the middle of the period are dynamic, so the fixed blanking intervals are  
mainly useful for the edges at the beginning and end of the period.  
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9.5 Register Maps  
9.5.1 CPU Memory Map And Interrupts  
When the device comes out of power-on-reset, the data memories are mapped to the processor as follows:  
9.5.1.1 Memory Map (After Reset Operation)  
ADDRESS  
SIZE (BYTES)  
MODULE  
0x0000_0000 – 0x0003_FFFF  
In 32 repeated blocks of 8 k each  
32 X 8 k  
Boot ROM  
0x0004_0000 – 0x0004_7FFF  
0x0004_8000 – 0x0004_FFFF  
0x0005_0000_0x0005_7FFF  
0x0005_0000_0x0005_7FFF  
0x0006_9800 – 0x0006_9FFF  
0x0006_A000 – 0x0006_BFFF  
32 k  
32 k  
32 k  
32 k  
2 k  
Program Flash 0  
Program Flash 1  
Program Flash 2  
Program Flash 3  
Data Flash  
8 k  
Data RAM  
9.5.1.2 Memory Map (Normal Operation)  
Just before the boot ROM program gives control to flash program, the ROM configures the memory as follows:  
ADDRESS  
SIZE (BYTES)  
MODULE  
Boot ROM  
0x0002_0000 – 0x0002_1FFF  
0x0000_0000 – 0x00000_07FFF  
0x0000_8000 – 0x08000_0FFFF  
0x0000_8000 - 0x10000_17FFF  
0x0000_8000 - 0x18000_1FFFF  
0x0006_9800 – 0x0006_9FFF  
0x0006_A000 – 0x0006_BFFF  
8 k  
32 k  
32 k  
32 k  
32 k  
2 k  
Program Flash 0 (or 1)  
Program Flash 1 (or 0)  
Program Flash 2 (or 0 for UCD3138128 only)  
Program Flash 3 (or 1 for UCD3138128 only)  
Data Flash  
8 k  
Data RAM  
9.5.1.3 Memory Map (System And Peripherals Blocks)  
ADDRESS  
SIZE  
256  
256  
256  
256  
256  
256  
256  
256  
256  
256  
256  
256  
256  
256  
256  
256  
256  
256  
256  
MODULE  
Loop Mux  
0x0012_0000 - 0x0012_00FF  
0x0013_0000 - 0x0013_00FF  
0x0014_0000 - 0x0014_00FF  
0x0015_0000 - 0x0015_00FF  
0x0016_0000 - 0x0016_00FF  
0x0017_0000 - 0x0017_00FF  
0x0018_0000 - 0x0018_00FF  
0x0019_0000 - 0x0019_00FF  
0x001A_0000 - 0x001A_00FF  
0x001B_0000 – 0x001B_00FF  
0x001C_0000 - 0x001C_00FF  
0x001D_0000 - 0x001D_00FF  
0x001E_0000 - 0x001E_00FF  
0xFFF7_E400 - 0xFFF7_34FF  
0xFFF7_EC00 - 0xFFF7_ECFF  
0xFFF7_ED00 - 0xFFF7_EDFF  
0xFFF7_F000 - 0xFFF7_F0FF  
0xFFF7_F600 - 0xFFF7_F6FF  
0xFFF7_F700 - 0xFFF7_F7FF  
Fault Mux  
ADC  
DPWM 3  
Filter 2  
DPWM 2  
Front End/Ramp Interface 2  
Filter 1  
DPWM 1  
Front End/Ramp Interface 1  
Filter 0  
DPWM 0  
Front End/Ramp Interface 0  
RTC  
UART 0  
UART 1  
Miscellaneous Analog Control  
PMBus/I2C Interface (1)  
PMBus/I2C Interface (2)  
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ADDRESS  
SIZE  
256  
256  
256  
256  
23  
MODULE  
GIO  
0xFFF7_FA00 - 0xFFF7_FAFF  
0xFFF7_FD00 - 0xFFF7_FDFF  
0xFFFF_FD00 - 0xFFFF_FDFF  
0xFFFF_FE00 - 0xFFFF_FEFF  
0xFFFF_FF20 - 0xFFFF_FF37  
0xFFFF_FFD0 - 0xFFFF_FFEC  
Timer  
MMC  
DEC  
CIM  
28  
SYS  
The registers and bit definitions inside the System and Peripheral blocks are detailed in the programmer’s  
manuals.  
9.5.2 Boot ROM  
The device incorporates a 8 kB boot ROM. This boot ROM includes support for:  
Program download through the PMBus  
Device initialization  
Examining and modifying registers and memory  
Verifying and executing program flash automatically  
Jumping to a customer defined boot program  
Checksum evaluation to support using the program flash as a single 64 kB block or as 2-32 kB blocks.  
The Boot ROM is entered automatically on device reset. It initializes the device and then performs checksums on  
the program flash. If the first 2 kB of program FLASH 0 has a valid checksum, the program branches to location  
0 in Program FLASH 0. This permits the use of a custom boot program. If the first checksum fails, it performs  
some additional checksum calculations to determine where the valid program is located. This permits full  
automated program memory checking, when there is no need for a custom boot program. The complete decision  
tree is located in Figure 35. Additionally, the part can support two separate programs in block 0 and block 1  
through a custom boot-flash routine.  
Device Reset  
Does PFLASH 0 have a  
BRANCH instruction at the  
beginning?  
Yes  
No  
Is there a valid checksum on  
the first 2 kB of PFLASH 0,  
all 32 kB of PFLASH 0,  
all 64 kB of PFLASH 0 & 1?  
Yes  
No  
Stay in ROM  
BRANCH to  
Program Flash 0  
Figure 35. Check Sum Evaluation Flowchart, 64 kB  
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Device Reset  
Does PFLASH 0 have a  
BRANCH instruction at the  
beginning?  
Yes  
No  
Is there a valid checksum on  
the first 2 kB of PFLASH 0,  
all 32 kB of PFLASH 0,  
all 64 kB of PFLASH 0 & 1  
or 128 kB of PFLASH 0, 1, 2 and 3?  
Does PFLASH 2 have a  
BRANCH instruction at the  
beginning?  
Yes  
No  
No  
Yes  
Is there a valid checksum on  
all 64 kB of PFLASH 2 &3?  
Yes  
No  
BRANCH to  
Stay in ROM  
Program Flash 0  
BRANCH to  
Program Flash 2  
Figure 36. Check Sum Evaluation Flowchart, 128 kB  
If none of the checksums are valid, the Boot ROM stays in control, and accepts commands via the PMBus  
interface. These functions can be used to read and write to all memory locations in the device. Typically they are  
at address 11 and are used to download a program to Program Flash, and to command its execution.  
9.5.3 Customer Boot Program  
As described above, it is possible to generate a user boot program using 2 kB or more of the Program Flash.  
This can support things which the Boot ROM does not support, including:  
Program download via UART – useful especially for applications where the UCD3138A64 or UCD3138128 is  
isolated from the host (e.g., PFC)  
Encrypted download – useful for code security in field updates.  
PMBus download at different addresses  
Different command formats  
9.5.4 Flash Management  
The device offers a variety of features providing for easy prototyping and easy flash programming. At the same  
time, high levels of security are possible for production code, even with field updates. Standard firmware will be  
provided for storing multiple copies of system parameters in data flash. This minimizes the risk of losing  
information if data-flash programming is interrupted.  
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9.6 Synchronous Rectifier MOSFET Ramp And IDE Calculation  
The device has built in logic for optimizing the performance of the synchronous rectifier MOSFETs. This comes in  
two forms:  
Synchronous Rectifier MOSFET ramp for softly turning on and off the MOSFETs  
Ideal Diode Emulation (IDE) calculation  
When starting up a power supply, It is not uncommon for there to already be a voltage present on the output –  
this is called pre-bias. It can be very difficult to calculate the ideal synchronous rectifier MOSFET on-time for this  
case. If it is not calculated correctly, it may pull down the pre-bias voltage, causing the power supply to sink  
current. To avoid this, the synchronous rectifier MOSFETs are not turned on until after the power supply has  
ramped up to the nominal output voltage. The synchronous rectifier MOSFETs are then turned on slowly in order  
to avoid an output voltage glitch. The synchronous rectifier MOSFET ramp logic can be used to turn them on at a  
rate well below the bandwidth of the filter.  
In discontinuous mode, the ideal on-time for the synchronous rectifier MOSFETs is a function of Vin, Vout, and the  
primary side duty cycle (D). The IDE logic in the UCD3138x takes Vin and Vout data from the firmware and  
combines it with D data from the filter hardware. It uses this information to calculate the ideal on-time for the  
synchronous rectifier MOSFETs.  
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10 Applications and Implementation  
10.1 Application Information  
The UCD3138x has an extensive set of fully-programmable, high-performance peripherals that make it suitable  
for a wide range of power supply applications. In order to make the part easier to use, TI has prepared an  
extensive set of materials to demonstrate the features of the device for several key applications. In each case the  
following items are available:  
1. Full featured EVM hardware that demonstrates classic power supply functionality.  
2. An EVM user guide that contains schematics, bill-of-materials, layout guidance and test data showcasing the  
performance and features of the device and the hardware.  
3. A firmware programmers manual that provides a step-by-step walk through of the code.  
Table 3. Application Information  
APPLICATION  
EVM DESCRIPTION  
This EVM demonstrates a PSFB DC-DC power converter with digital control using the UCD3138x device. Control is  
implemented by using PCMC with slope compensation. This simplifies the hardware design by eliminating the need  
for a series blocking capacitors and providing the inherent input voltage feed-forward that comes from PCMC. The  
controller is located on a daughter card and requires firmware in order to operate. This firmware, along with the entire  
source code, is made available through TI. A free, custom function GUI is available to help the user experiment with  
the different hardware and software enabled features. The EVM accepts a DC input from 350 VDC to 400 VDC, and  
outputs a nominal 12 VDC with full load output power of 360 W, or full output current of 30 A.  
Phase shifted full  
bridge  
This EVM demonstrates an LLC resonant half-bridge DC-DC power converter with digital control using the  
UCD3138x device. The controller is located on a daughter card and requires firmware in order to operate. This  
firmware, along with the entire source code, is made available through TI. A free, custom function GUI is available to  
help the user experiment with the different hardware and software enabled features. The EVM accepts a DC input  
from 350 VDC to 400 VDC, and outputs a nominal 12 VDC with full load output power of 340 W, or full output current  
of 29 A.  
LLC resonant  
converter  
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10.2 Typical Application  
This section summarizes the PSFB EVM DC-DC power converter.  
L1  
T1  
Q7  
+12V  
Q6  
Q5  
C1  
RL  
VBUS  
I_pri  
PRIM  
ORING  
CTL  
CURRENT  
T2  
VOUT  
C2  
R2  
D1  
T1  
QT2  
QB2  
QT1  
VA  
Lr  
Current  
Sensing  
QB1  
D2  
Vref  
DPWM0  
DPWM0B  
DPWM1B  
Duty for mode  
switching  
Vout  
CPCC  
<
EADC0  
EADC1  
CLA0  
DPWM1  
DPWM2  
Iout  
CLA1  
DPWM2A  
DPWM2B  
Load Current  
DPWM3A  
DPWM3B  
I_pri  
EADC2  
PCM  
DPWM3  
AD00  
AD01  
ISOLATED  
GATE Transformer  
ACFAIL_IN  
FAULT0  
FAULT1  
FAULT2  
SYNCHRONOUS  
GATE DRIVE  
ACFAIL_OUT  
FAILURE  
AD02/CMP0  
AD03/CMP1/CMP2  
AD04/CMP3  
AD05/CMP4  
AD06/CMP5  
AD07/CMP6  
AD08  
I_SHARE  
Vout  
FAULT  
UCD3138  
GPIO1  
GPIO2  
GPIO3  
ORING_CRTL  
ON/OFF  
Iout  
I_pri  
CBC  
temp  
P_GOOD  
Vin  
VA  
WD  
ARM7  
AD09  
PMBus  
UART0  
RST  
OSC  
Primary  
UART1  
Memory  
Figure 37. Phase-Shifted Full-Bridge  
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Typical Application (continued)  
10.2.1 Design Requirements  
Table 4. Input Characteristics  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX UNIT  
ALL SPECIFICATIONS at Vin=400V and 25°C AMBIENT UNLESS OTHERWISE NOTED.  
Vin  
Input voltage range  
Max input voltage  
Input current  
Normal Operating  
Continuous  
350  
385  
420  
420  
V
V
Vinmax  
Iin  
Vin=350V, Full Load  
1.15  
30  
A
Istby  
Von  
Vhys  
Input no load current Output current is 0A  
mA  
V
Vin Decreasing (input voltage is detected on secondary side)  
340  
360  
Under voltage lockout  
Vin Increasing  
V
Table 5. Output Characteristics  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX UNIT  
ALL SPECIFICATIONS at Vin=400V and 25°C AMBIENT UNLESS OTHERWISE NOTED.  
VO  
Output voltage setpoint  
Line regulation  
No load on outputs  
12  
V
Regline  
All outputs; 360 Vin 420; IO = IOmax  
All outputs; 0 IO IOmax; Vin = 400 V  
5Hz to 20 MHz  
0.5  
1
%
%
Regload  
Load regulation  
Ripple and noise(1)  
Vn  
IO  
η
100  
mVpp  
A
Output current  
0
30  
Efficiency at phase-shift mode  
Efficiency at PWM ZVS mode  
Efficiency at hard switching mode  
Output adjust range  
Vo = 12 V, Io = 15 A  
Vo = 12 V, Io = 15 A  
Vo = 12 V, Io = 15 A  
93%  
93%  
90%  
η
η
Vadj  
11.4  
12.6  
V
V
Transient response  
overshoot/undershoot  
Vtr  
50% Load Step at 1AµS, min load at 2A  
±0.36  
tsettling  
tstart  
Transient response settling time  
Output rise time  
100  
50  
µS  
mS  
%
10% to 90% of Vout  
At Startup  
Overshoot  
2
fs  
Switching frequency  
Current sharing accuracy  
Loop phase margin  
Loop gain margin  
Over Vin and IO ranges  
50% - full load  
150  
±5  
kHz  
%
Ishare  
φ
10% - Full load  
10% - Full load  
45  
degree  
dB  
G
10  
(1) Ripple and noise are measured with 10µF Tantalum capacitor and 0.1µF ceramic capacitor across output.  
10.2.2 Detailed Design Procedure  
10.2.2.1 PCMC (Peak Current Mode Control) PSFB (Phase Shifted Full Bridge) Hardware Configuration  
Overview  
The hardware configuration of the UCD3138x PCMC PSFB converter contains two critical elements that are  
highlighted in the subsequent sections.  
DPWM initialization - This section will highlight the key register settings and considerations necessary for the  
UCD3138x to generate the correct MOSFET waveforms for this topology. This maintains the proper phase  
relationship between the MOSFETs and synchronous rectifiers as well as the proper set up required to  
function correctly with PCMC.  
PCMC initialization - This section will discuss the register settings and hardware considerations necessary to  
modulate the DPWM pins with PCMC and internal slope compensation.  
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10.2.2.2 DPWM Initialization for PSFB  
The UCD3138x DPWM peripheral provides flexibility for a wide range of topologies. The PSFB configuration  
utilizes the Intra-Mux and Edge Generation Modules of the DPWM. For a diagram showing these modules, see  
the UCD3138x Digital Power Peripherals Manual.  
Here is a schematic of the power stage of the PSFB:  
L1  
T1  
VOUT  
Q6  
VBUS  
I_pri  
PRIM  
CURRENT  
Q5  
T2  
R2  
D1  
D2  
QT2  
QB2  
QT1  
QB1  
Lr  
T1  
ISOLATED  
GATE Transformer  
SYNCHRONOUS  
GATE DRIVE  
Figure 38. Schematic – PSFB Power Stage  
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Here is an overview of the key PSFB signals:  
3 A – QB1  
( DPWM1C)  
3 B – QT1  
( DPWM2C)  
2 A – QT2  
( EDGEGEN)  
X1  
Y3  
2 B – QB2  
( EDGEGEN)  
X3  
Y2  
Transformer  
Voltage  
X2  
1 B –  
QSYN 1,3  
Y1  
0 B –  
QSYN 2,4  
DPWM3AF  
DPWM3BF  
DPWM 2AF  
DPWM 2BF  
Current  
Peak Level  
X1, X2 ,X3 and Y1 , Y2 , Y3 are sets of moving edges  
All other edges are fixed .  
Figure 39. Key PSFB Signals  
10.2.2.3 DPWM Synchronization  
DPWM1 is synchronized to DPWM0, DPWM2 is synchronized to DPWM1, and DPWM3 is synchronized to  
DPWM2, ½ period out of phase using these commands:  
Dpwm1Regs.DPWMCTRL0.bit.MSYNC_SLAVE_EN = 1; //configured to slave  
Dpwm2Regs.DPWMCTRL0.bit.MSYNC_SLAVE_EN = 1; // configured to slave  
Dpwm3Regs.DPWMCTRL0.bit.MSYNC_SLAVE_EN = 1; // configured to slave  
Dpwm0Regs.DPWMPHASETRIG.all = PWM_SLAVESYNC;  
Dpwm1Regs.DPWMPHASETRIG.all = PWM_SLAVESYNC;  
Dpwm2Regs.DPWMPHASETRIG.all = PWM_SLAVESYNC;  
LoopMuxRegs.DPWMMUX.bit.DPWM1_SYNC_SEL = 0; // Slave to dpwm-0  
LoopMuxRegs.DPWMMUX.bit.DPWM2_SYNC_SEL = 1; // Slave to dpwm-1  
LoopMuxRegs.DPWMMUX.bit.DPWM3_SYNC_SEL = 2; // Slave to dpwm-2  
If the event registers on the DPWMs are the same, the two pairs of signals will be symmetrical. All code  
examples are taken from the PSFB EVM code, unless otherwise stated.  
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10.2.2.4 Fixed Signals to Bridge  
The two top signals in the above drawing have fixed timing. The DPWM1CF and DPWM2CF signals are used for  
these pins. DPWMCxF refers to the signal coming out of the fault module of DPWMx, as shown inFigure 40.  
Figure 40. Fixed Signals to Bridge  
These signals are actually routed to pins DPWM3A and 3B using the Intra Mux with these statements:  
Dpwm3Regs.DPWMCTRL0.bit.PWM_A_INTRA_MUX = 7; // Send DPWM1C  
Dpwm3Regs.DPWMCTRL0.bit.PWM_B_INTRA_MUX = 8; // Send DPWM2C  
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Since these signals are really being used as events in the timer, the #defines are called EV5 and EV6. Here are  
the statements which initialize them:  
// Setup waveform for DPWM-C (re-using blanking B regs)  
Dpwm2Regs.DPWMBLKBBEG.all = PWM2_EV5 + (4 *16);  
Dpwm2Regs.DPWMBLKBEND.all = PWM2_EV6;  
Period End  
Controlled by DPWM1 Blanking register  
Period Start  
Blank B Begin  
Blank B End  
3 A – QB1  
Even 6  
Even 5  
( DPWM1C)  
3 B – QT1  
Even 6  
Even 6  
Even 5  
( DPWM 2C)  
Blank B Begin  
Blank B End  
Controlled by DPWM2 Blanking register  
Figure 41. Blank B Timing Information  
The statements for DPWM1 are the same. Remember that DPWMC reuses the Blank B registers for timing  
information.  
10.2.2.5 Dynamic Signals to Bridge  
DPWM0 and 1 are set at normal mode. PCMC triggering signal (fault) chops DPWM0A and 1A cycle by cycle.  
The corresponding DPWM0B and 1B are used for synchronous rectifier MOSFET control. The same PCMC  
triggering signal is applied to DPWM2 and DPWM3. Both of these are set to normal mode as well. DPWM2 and  
3 are chopped and their edges are used to generate the next two dynamic signals to the bridge. They are  
generated using the Edge Generator Module in DPWM2. The Edge Generator sources are DPWM2 and  
DPWM3. The edges used are:  
DPWM2A turned on by a rising edge on DPWM2BF  
DPWM2A turned off by a falling edge on DPWM3AF  
DPWM2B turned on by a rising edge on DPWM3BF  
DPWM2B turned off by a falling edge on DPWM2AF  
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Period Start  
Period End  
3 A – QB1  
( DPWM 1C)  
3 B – QT1  
( DPWM 2C)  
2 A – QT2  
( EDGEGEN )  
2 B – QB2  
( EDGEGEN )  
Y3  
X3  
1A  
1 B –  
QSYN 1,3  
Y2  
Y1  
X2  
0A  
0 B –  
QSYN 2,4  
X1  
DPWM 3AF  
DPWM 3BF  
DPWM 2AF  
DPWM 2BF  
Current  
Peak Level  
Chopping point  
Chopping point  
X1 , X2 , X3 and Y1 , Y2 , Y3 are sets of moving edges  
All other edges are fixed .  
Figure 42. Dynamic Signals to Bridge  
The Edge Generator is configured with these statements:  
Dpwm2Regs.DPWMEDGEGEN.bit.A_ON_EDGE = 2;  
Dpwm2Regs.DPWMEDGEGEN.bit.A_OFF_EDGE = 5;  
Dpwm2Regs.DPWMEDGEGEN.bit.B_ON_EDGE = 6;  
Dpwm2Regs.DPWMEDGEGEN.bit.B_OFF_EDGE = 1;  
Dpwm2Regs.DPWMCTRL0.bit.PWM_A_INTRA_MUX = 1; // EDGEGEN-A out the A output  
Dpwm2Regs.DPWMCTRL0.bit.PWM_B_INTRA_MUX = 1; // EDGEGEN-B out the B output  
Dpwm2Regs.DPWMEDGEGEN.bit.EDGE_EN = 1;  
The EDGE_EN bits are set for all 4 DPWMs. This is done to ensure that all signals have the same timing delay  
through the DPWM.  
The finial 6 gate signals are shown in Figure 43.  
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Period Start  
Period End  
3 A – QB1  
( DPWM 1C)  
3 B – QT1  
( DPWM 2C)  
2 A – QT2  
( EDGEGEN )  
2 B – QB2  
( EDGEGEN )  
Y3  
X3  
1 B –  
QSYN 1,3  
Y2  
Y1  
X2  
X1  
0 B –  
QSYN 2,4  
Peak Level  
Current  
Chopping point  
Chopping point  
Figure 43. Final 6 Gate Signals  
Note how the falling edge of DPWM2AF aligns with the X1 edge, and how the rising edge of DPWM2BF aligns  
with the X3 edge. The falling edges on DPWM2AF and DPWM3AF are caused by the peak detection logic. This  
is fed through the Cycle By Cycle logic. The Cycle By Cycle logic also has a special feature to control the rising  
edges of DPWM2BF (X1 and X3) and DPWM3BF (Y1 and Y3). It uses the value of Event3 – Event2 to control  
the time between the edges. The same feature is used with DPWM0 and DPWM1 to control the X2 and Y2  
signals. Using the other 2 DPWMs permits these signals to have a different dead time.  
The same setup can be used for voltage mode control. In this case, the Filter output sets the timing of the falling  
edge on DPWMxAF.  
All DPWMs are configured in Normal mode, with CBC enabled. If external slope compensation is used,  
DPWM1A and DPWM1B are used to reset the external compensator at the beginning of each half cycle. If no  
PCMC event occurs, the values of Events 2 and 3 determine the locations of the edges, just as in open loop  
mode.  
10.2.3 System Initialization for PCM  
PCM (Peak Current Mode) is a specialized configuration for the UCD3138x which involves several peripherals.  
This section describes how it works across the peripherals.  
10.2.3.1 Use of Front Ends and Filters in PSFB  
All three front ends are used in PSFB. The same signals are used in the same places for both PCMC and  
voltage mode. The same hardware can be used for both control modes, with the mode determined by which  
firmware is loaded into the device. FE0 and FE1 are used with their associated filters, but Filter 2 is not used at  
all.  
FE0 – Vout – voltage loop  
FE1 – Iout – current loop  
FE2 – Ipri – PCM  
In PCMC mode, FE2 is used for PCMC, and the voltage loop is normally used to provide the start point for the  
compensation ramp. If the CPCC firmware detects a need for constant current mode, it switches to the current  
loop for the start point.  
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10.2.3.2 Peak Current Detection  
Peak current detection involves all the major modules of the DPPs, the Front End, Filter, Loop Mux, Fault Mux  
and the DPWMs. A drawing of the major elements is shown in Figure 44.  
Ipri  
PCM  
Comparator  
Loop  
Mux  
Fault  
Mux  
DPWM  
Voltage Loop  
Filter  
Loop  
Mux  
Ramp  
Module  
Loop  
Mux  
Vout  
Front  
End  
Figure 44. Peak Current Detection Function  
All signals without arrows flow from left to right. The voltage loop is used to select a peak current level. This level  
is fed to the Ramp module to generate a compensation ramp. The compensation ramp is compared to the  
primary current by the PCMC comparator in the Front End. When the ramp value is greater than the primary  
current, the APCMC signal is sent to the DPWM, causing the events described in the previous sections.  
The DPWM frame start and output pin signals can be used to trigger the Ramp Module. In this case, unlike in the  
case of other ramp module functions, each DPWM frame triggers the start of the ramp. The ramp steps every 32  
ns.  
The Filter is configured normally, there is no real difference for PCMC. The PCM_FILTER_SEL bits in the  
LoopMux.PCMCTRL register are used to select which filter is connected to the ramp module:  
LoopMuxRegs.PCMCTRL.bit.PCM_FILTER_SEL =0; //select filter0  
With Firmware Constant Power/Constant current, Filter 1 and Front End 1 are used as a current control loop,  
with the EADCDAC set to high current. If the voltage loop value becomes higher than the current loop value,  
then Filter 1 is used to control the PCM ramp start value:  
LoopMuxRegs.PCMCTRL.bit.PCM_FILTER_SEL =1;  
S P A C E //select filter1 for slope compensation source  
In the ramp module, there are 2 bitfields in the RAMPCTRL register which must be configured. The  
PCM_START_SEL must be set to a 1 to enable the Filter to be used as a ramp start source. The RAMP_EN bit  
must be set, of course.  
The DAC_STEP register sets the slope of the compensation ramp. The DAC value is in volts, of course, so it is  
necessary to calculate the slope after the current to voltage conversion. Here is the formula for converting from  
millivolts per microsecond to DACSTEP.  
m = compensation slope in millivolts per microsecond  
ACSTEP = 335.5 × M  
In C, this can be written:  
#define COMPENSATION_SLOPE 150 //compensation slope in millivolts per microsecond  
#define DACSTEP_COMP_VALUE ((int) (COMPENSATION_SLOPE*335.5) )  
S P A C E //value in DACSTEP for desired compensation slope  
S P A C E FeCtrl0Regs.DACSTEP.all = DACSTEP_COMP_VALUE;  
It may also be necessary to set a ramp ending value in the RAMPDACEND register.  
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In addition, it is necessary to set the D2S_COMP_EN bit in the EADCCTRL register. This is for enabling the  
differential to single ended comparator function. The front end diagram leaves it out for simplicity, but the  
connection between the DAC and the EADC amplifier is actually differential. The PCMC comparator, however, is  
single ended. So a conversion is necessary as shown in Figure 45.  
AFE_GAIN  
23-AFE_GAIN  
6 bit ADC  
8mV/LSB  
EAP0  
2AFE_GAIN  
EAN0  
Signed 9 bit result  
(error) 1 mV /LSB  
EADC  
X
Averaging  
SAR/Prebias  
Ramp  
Filter x  
CPCC  
DAC0  
10 bit DAC  
1.5625mV/LSB  
Σ
Value  
Differential to  
Single Ended  
Dither  
4 bit dithering gives 14 bits of effective resolution  
97.65625μV/LSB effective resolution  
Absolute Value  
Calculation  
10 bit result  
1.5625mV/LSB  
Peak Current  
Detected  
Peak Current Mode  
Comparator  
Figure 45. Differential to Single-Ended Comparator Function  
The EADC_MODE bit in EADCCTRL should be set to a 5 for peak current mode.  
The peak current detection signal next goes to the Loop Mux. The Fault Mux has only 1 APCM input, but there  
are 3 front ends. So the PCM_FE_SEL bits in APCMCTRL must be used to select which front end is used:  
LoopMuxRegs.APCMCTRL.bit.PCM_FE_SEL = 2; // use FE2 for PCM */  
The PCM_EN bit must also be set.  
LoopMuxRegs.APCMCTRL.bit.PCM_EN = 1; // Enable PCM  
Next the Fault Mux is used to enable the APCM bit to the CLIM/CBC signal to the DPWM. There are 4  
DPWMxCLIM registers, one for each DPWM. The ANALOG_PCM_EN bit must be set in each one to connect the  
PCM detection signal to the CLIM/CBC signal on each DPWM. For the latest configuration information on all of  
these bits, consult the appropriate EVM firmware. To avoid errors, it is best to configure your hardware design  
using the same DPWMs, filters, and front ends for the same functions as the EVM.  
DPWM timing is used to trigger the start of the ramp. This is selected by the FECTRLxMUX registers in the Loop  
Mux. DPWMx_FRAME_SYNC_EN bits, when set, cause the ramp to be triggered at the start of the DPWM  
period.  
10.2.3.3 Peak Current Mode (PCM)  
There is one peak current mode control module in the device however any front end can be configured to use  
this module.  
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10.2.4 Application Curves  
30A Load  
syncFETs off  
1A-16A-1A  
Vin =385V  
Figure 47. VOUT Soft Start  
Figure 46. Load Transient  
Kp =14000  
Ki =300  
Kd =2000  
Alpha = –2  
Figure 48. Bode Plot  
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11 Power Supply Recommendations  
Both 3.3 VD and 3.3 VA should have a local 4.7 µF capacitor placed as close as possible to the device pins  
BP18 should have a 1 µF capacitor.  
12 Layout  
12.1 IC Grounding and Layout Guidelines  
Two grounds are recommended: AGND (analog) and DGND (digital)  
AGND plane should be just large enough to connect to all required components.  
Power ground (PGND) can be independent or combined with DGND  
The power pad of the driver IC should be tied to DGND  
RSVD must be tied to BP18.  
All analog signal filter capacitors should be tied to AGND  
If the gate driver device, such as UCD27524 or UCD27511/7 driver is used, the filter capacitor for the  
current sensing pin can be tied to DGND for easy layout  
All digital signals, such as GPIO, PMBus and PWM are referenced to DGND.  
The RESET pin capacitor (0.1 µF) should be connected to DGND. If the RESET pin is unused it is  
recommended to tie the pin to 3.3 V through 220 Ω.  
All filter and decoupling capacitors should be placed close to UCD3138x as possible  
Resistor placement is less critical and can be moved a little further away  
The DGND and AGND net-short resistor MUST be placed right between one UCD3138x’s DGND pin and one  
AGND pin. Ground connections to the net short element should be made by a large via (or multiple paralleled  
vias) for each terminal of the net-short element.  
If a gate driver device such as UCC27524 or UCC27511/7 is on the control card and there is a PGND  
connection, a net-short resistor should be tied to the DGND plane and PGND plane by multiple vias. In  
addition the net-short element should be close to the driver IC.  
Configure all unused GPIO as inputs and connect them to ground. Alternatively unused GPIOs can be  
configured to outputs and set to a logic level of 0.  
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12.2 Layout Examples  
Figure 49. Layout Example  
70  
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Layout Examples (continued)  
UCD3138A64/UCD3138128  
Figure 50. Layout Example  
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13 Device and Documentation Support  
13.1 Device Support  
13.1.1 Development Support  
The application firmware for the UCD3138x is developed on Texas Instruments Code Composer Studio (CCS)  
integrated development environment.  
Device programming, real time debug and monitoring/configuration of key device parameters for certain power  
topologies are all available through Texas Instruments’ FUSION_DIGITAL_POWER_DESIGNER Graphical User  
Interface (http://www.ti.com/tool/fusion_digital_power_designer). The FUSION_DIGITAL_POWER_DESIGNER  
software application uses the PMBus protocol to communicate with the device over a serial bus using an  
interface adaptor known as the USB-TO-GPIO, available as an EVM from Texas Instruments  
(http://www.ti.com/tool/usb-to-gpio). PMBUS-based real-time debug capability is available through the ‘Memory  
Debugger’ tool within the Device GUI module of the FUSION_DIGITAL_POWER_DESIGNER GUI, which  
represents a powerful alternative over traditional JTAG-based approaches’.  
The software application can also be used to program the devices, with a version of the tool known as  
FUSION_MFR_GUI optimized for manufacturing environments (http://www.ti.com/tool/fusion_mfr_gui). The  
FUSION_MFR_GUI tool supports multiple devices on a board, and includes built-in logging and reporting  
capabilities.  
13.2 Documentation Support  
13.2.1 Related Links  
The table below lists quick access links. Categories include technical documents, support and community  
resources, tools and software, and quick access to sample or buy.  
Table 6. Related Links  
TECHNICAL  
DOCUMENTS  
TOOLS &  
SOFTWARE  
SUPPORT &  
COMMUNITY  
PARTS  
PRODUCT FOLDER  
SAMPLE & BUY  
UCD3138A64  
UCD3138128  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
Click here  
13.2.2 Related Documentation  
In terms of reference documentation, the following programmer’s manuals are available offering detailed  
information regarding the application and usage of UCD3138x digital controller:  
1. UCD3138064 or UCD3138128 Programmer's Manual  
2. UCD3138 Digital Power Peripheral Programmer's Manual Key topics covered in this manual include:  
Digital Pulse Width Modulator (DPWM)  
Modes of Operation (Normal/Multi/Phase-shift/Resonant etc)  
Automatic Mode Switching  
DPWMC, Edge Generation & Intra-Mux  
Front End  
Analog Front End  
Error ADC or EADC  
Front End DAC  
Ramp Module  
Successive Approximation Register Module  
Filter  
Filter Math  
Loop Mux  
Analog Peak Current Mode  
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Constant Power/Constant Current (CPCC)  
Automatic Cycle Adjustment  
Fault Mux  
Analog Comparators  
Digital Comparators  
Fault Pin functions  
DPWM Fault Action  
Ideal Diode Emulation (IDE), DCM Detection  
Oscillator Failure Detection  
Register Map for all of the above peripherals in UCD3138A64 or UCD3138128  
3. UCD3138 Monitoring and Communications Programmer’s Manual  
Key topics covered in this manual include:  
ADC12  
Control, Conversion, Sequencing & Averaging  
Digital Comparators  
Temperature Sensor  
PMBUS Addressing  
Dual Sample & Hold  
Miscellaneous Analog Controls (Current Sharing, Brown-Out, Clock-Gating)  
PMBUS Interface  
General Purpose Input Output (GPIO)  
Timer Modules  
PMBus  
Register Map for all of the above peripherals in UCD3138A64  
4. UCD3138 ARM and Digital System Programmer’s Manual  
Key topics covered in this manual include:  
Boot ROM & Boot Flash  
BootROM Function  
Memory Read/Write Functions  
Checksum Functions  
Flash Functions  
Avoiding Program Flash Lock-Up  
ARM7 Architecture  
Modes of Operation  
Hardware/Software Interrupts  
Instruction Set  
Dual State Inter-working (Thumb 16-bit Mode/ARM 32-bit Mode)  
Memory & System Module  
Address Decoder, DEC (Memory Mapping)  
Memory Controller (MMC)  
Central Interrupt Module  
Register Map for all of the above peripherals in UCD3138A64 or UCD3138128  
5. FUSION_DIGITAL_POWER_DESIGNER for UCD31XX Isolated Power Applications – User Guide  
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13.2.2.1 References  
1. UCD3138064 Programmer’s Manual (Literature Number: SLUUAD8 )  
2. UCD3138 Digital Power Peripherals Programmer’s Manual (Literature Number:SLUU995)  
3. UCD3138 Monitoring & Communications Programmer’s Manual (Literature Number:SLUU996)  
4. UCD3138 ARM and Digital System Programmer’s Manual (Literature Number:SLUU994)  
5. FUSION_DIGITAL_POWER_DESIGNER for Isolated Power Applications (Literature Number: SLUA676)  
6. Code Composer Studio Development Tools v3.3 – Getting Started Guide, (Literature Number: SPRU509H)  
7. ARM7TDMI-S Technical Reference Manual  
8. System Management Bus (SMBus) Specification  
9. PMBus™ Power System Management Protocol Specification  
10. UCD3138128 Programmers Manual (Literature Number: SLUUB54)  
In addition to the tools and documentation described above, for the most up to date information regarding  
evaluation modules, reference application firmware and application notes/design tips, please visit  
http://www.ti.com/product/UCD3138A64.  
13.3 Trademarks  
PMBus is a trademark of SMIF, Inc.  
All other trademarks are the property of their respective owners.  
13.4 Electrostatic Discharge Caution  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
13.5 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
14 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical packaging and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
7-Sep-2014  
PACKAGING INFORMATION  
Orderable Device  
UCD3138128PFC  
UCD3138128PFCR  
UCD3138A64PFC  
UCD3138A64PFCR  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
TQFP  
TQFP  
TQFP  
TQFP  
PFC  
80  
80  
80  
80  
96  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
UCD3138128  
ACTIVE  
ACTIVE  
ACTIVE  
PFC  
PFC  
PFC  
1000  
96  
Green (RoHS  
& no Sb/Br)  
UCD3138128  
UCD3138A64  
UCD3138A64  
Green (RoHS  
& no Sb/Br)  
1000  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
7-Sep-2014  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
6-Sep-2014  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
UCD3138128PFCR  
UCD3138A64PFCR  
TQFP  
TQFP  
PFC  
PFC  
80  
80  
1000  
1000  
330.0  
330.0  
24.4  
24.4  
15.0  
15.0  
15.0  
15.0  
1.5  
1.5  
20.0  
20.0  
24.0  
24.0  
Q2  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
6-Sep-2014  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
UCD3138128PFCR  
UCD3138A64PFCR  
TQFP  
TQFP  
PFC  
PFC  
80  
80  
1000  
1000  
367.0  
367.0  
367.0  
367.0  
45.0  
45.0  
Pack Materials-Page 2  
MECHANICAL DATA  
MTQF009A – OCTOBER 1994 – REVISED DECEMBER 1996  
PFC (S-PQFP-G80)  
PLASTIC QUAD FLATPACK  
0,27  
0,17  
M
0,50  
60  
0,08  
41  
40  
61  
80  
21  
0,13 NOM  
1
20  
Gage Plane  
9,50 TYP  
12,20  
SQ  
11,80  
0,25  
14,20  
SQ  
0,05 MIN  
0°7°  
13,80  
0,75  
0,45  
1,05  
0,95  
Seating Plane  
0,08  
1,20 MAX  
4073177/B 11/96  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-026  
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