UCD9090RGZR [TI]

10-Rail Power Supply Sequencer and Monitor with ACPI Support; 10轨电源排序器和监控ACPI支持
UCD9090RGZR
型号: UCD9090RGZR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

10-Rail Power Supply Sequencer and Monitor with ACPI Support
10轨电源排序器和监控ACPI支持

电源电路 电源管理电路 监控 CD PC
文件: 总48页 (文件大小:1348K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
UCD9090  
www.ti.com  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
10-Rail Power Supply Sequencer and Monitor with ACPI Support  
Check for Samples: UCD9090  
1
FEATURES  
DESCRIPTION  
The UCD9090 is a 10-rail PMBus/I2C addressable  
power-supply sequencer and monitor. The device  
integrates a 12-bit ADC for monitoring up to 10  
power-supply voltage inputs. Twenty-three GPIO pins  
can be used for power supply enables, power-on  
reset signals, external interrupts, cascading, or other  
system functions. Ten of these pins offer PWM  
functionality. Using these pins, the UCD9090 offers  
support for margining, and general-purpose PWM  
functions.  
2
Monitor and Sequence 10 Voltage Rails  
All Rails Sampled Every 400 μs  
12-bit ADC With 2.5-V, 0.5% Internal VREF  
Sequence Based on Time, Rail and Pin  
Dependencies  
Four Programmable Undervoltage and  
Overvoltage Thresholds per Monitor  
Nonvolatile Error and Peak-Value Logging per  
Monitor (up to 30 Fault Detail Entries)  
Specific power states can be achieved using the  
Pin-Selected Rail States feature. This feature allows  
with the use of up to 3 GPIs to enable and disable  
any rail. This is useful for implementing system  
low-power modes and the Advanced Configuration  
and Power Interface (ACPI) specification that is used  
for hardware devices.  
Closed-Loop Margining for 10 Rails  
Margin Output Adjusts Rail Voltage to  
Match User-Defined Margin Thresholds  
Programmable Watchdog Timer and System  
Reset  
Flexible Digital I/O Configuration  
Pin-Selected Rail States  
The TI Fusion Digital Powerdesigner software is  
provided for device configuration. This PC-based  
graphical user interface (GUI) offers an intuitive  
interface for configuring, storing, and monitoring all  
system operating parameters.  
Multiphase PWM Clock Generator  
Clock Frequencies From 15.259 kHz to  
125 MHz  
12V  
12V OUT  
Capability to Configure Independent Clock  
Outputs for Synchronizing Switch-Mode  
Power Supplies  
TEMP12V  
TEMP IC  
3.3V  
Supply  
I12V  
INA196  
12V OUT  
JTAG and I2C/SMBus/ PMBusInterfaces  
GPIO  
GPIO  
VIN  
3.3V OUT  
VMON  
VOUT  
/EN  
DC-DC 1  
3.3V OUT  
VFB  
VMON  
VMON  
VMON  
VMON  
VMON  
VMON  
VMON  
APPLICATIONS  
1.8V OUT  
0.8V OUT  
I0.8V  
Industrial / ATE  
VIN  
1.8V OUT  
/EN VOUT  
GPIO  
TEMP0.8V  
I12V  
Telecommunications and Networking  
Equipment  
LDO1  
TEMP12V  
TEMP0.8V  
TEMP IC  
Servers and Storage Systems  
VIN  
0.8V OUT  
VOUT  
UCD9090  
/EN  
GPIO  
PWM  
Any System Requiring Sequencing and  
Monitoring of Multiple Power Rails  
WDI from main  
processor  
DC-DC  
2
GPIO  
GPIO  
GPIO  
GPIO  
GPIO  
GPIO  
VFB  
WDO  
I0.8V  
INA196  
POWER_GOOD  
Vmarg  
2MHz  
WARN_OC_0.8V_  
OR_12V  
Closed Loop  
Margining  
SYSTEM RESET  
OTHER  
SEQUENCER DONE  
(CASCADE INPUT)  
I2C/  
PMBUS  
JTAG  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PMBus, Fusion Digital Power are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2011, Texas Instruments Incorporated  
UCD9090  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
FUNCTIONAL BLOCK DIAGRAM  
JTAG  
Or  
GPIO  
General Purpose I/O  
(GPIO)  
I2C/PMBus  
Comparators  
Rail Enables (10 max)  
6
Digital Outputs (10 max)  
Digital Inputs (8 max)  
Monitor  
Inputs  
23  
SEQUENCING ENGINE  
11  
12-bit  
200ksps,  
Multi-phase PWM (8 max)  
Margining Outputs (10 max)  
ADC  
(0.5% Int. Ref)  
FLASH Memory  
BOOLEAN  
Logic Builder  
User Data, Fault  
and Peak Logging  
48-pin QFN  
ORDERING INFORMATION  
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see  
the TI Web site at www.ti.com.  
ABSOLUTE MAXIMUM RATINGS(1)  
VALUE  
0.3 to 3.8  
0.3 to 3.8  
0.3 to (V33A + 0.3)  
40 to 150  
2.5  
UNIT  
V
Voltage applied at V33D to DVSS  
Voltage applied at V33A to AVSS  
V
(2)  
Voltage applied to any other pin  
V
Storage temperature (Tstg  
)
°C  
kV  
V
Human-body model (HBM)  
ESD rating  
Charged-device model (CDM)  
750  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating  
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages referenced to VSS  
2
Copyright © 2011, Texas Instruments Incorporated  
UCD9090  
www.ti.com  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
THERMAL INFORMATION  
UCD9090  
THERMAL METRIC(1)  
RGZ  
48 PINS  
25  
UNITS  
θJA  
Junction-to-ambient thermal resistance(2)  
Junction-to-case (top) thermal resistance(3)  
Junction-to-board thermal resistance(4)  
Junction-to-top characterization parameter(5)  
Junction-to-board characterization parameter(6)  
Junction-to-case (bottom) thermal resistance(7)  
θJCtop  
θJB  
8.9  
5.5  
°C/W  
ψJT  
0.3  
ψJB  
1.5  
θJCbot  
1.7  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as  
specified in JESD51-7, in an environment described in JESD51-2a.  
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific  
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB  
temperature, as described in JESD51-8.  
(5) The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).  
(6) The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted  
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).  
(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific  
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.  
RECOMMENDED OPERATING CONDITIONS  
MIN  
3
NOM  
MAX  
3.6  
UNIT  
V
Supply voltage during operation (V33D, V33DIO, V33A  
Operating free-air temperature range, TA  
Junction temperature, TJ  
)
3.3  
40  
110  
125  
°C  
°C  
ELECTRICAL CHARACTERISTICS  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN NOM  
MAX  
UNIT  
SUPPLY CURRENT  
IV33A  
VV33A = 3.3 V  
VV33DIO = 3.3 V  
VV33D = 3.3 V  
8
2
mA  
mA  
mA  
IV33DIO  
Supply current(1)  
IV33D  
IV33D  
ANALOG INPUTS (MON1MON13)  
40  
VV33D = 3.3 V, storing configuration parameters in  
flash memory  
50  
mA  
VMON  
Input voltage range  
MON1MON10  
0
0.2  
4  
-2  
2.5  
2.5  
4
V
V
MON11  
INL  
ADC integral nonlinearity  
ADC differential nonlinearity  
Input leakage current  
Input offset current  
LSB  
LSB  
nA  
DNL  
Ilkg  
2
3 V applied to pin  
100  
5
IOFFSET  
1-ksource impedance  
MON1MON10, ground reference  
MON11, ground reference  
5  
8
μA  
MΩ  
MΩ  
pF  
RIN  
Input impedance  
0.5  
1.5  
3
CIN  
Input capacitance  
10  
tCONVERT  
ADC sample period  
12 voltages sampled, 3.89 μsec/sample  
0°C to 125°C  
400  
μsec  
%
ADC 2.5 V, internal reference accuracy  
0.5  
1  
0.5  
1
VREF  
40°C to 125°C  
%
ANALOG INPUT (PMBUS_ADDRx)  
IBIAS Bias current for PMBus Addr pins  
9
11  
μA  
(1) Typical supply current values are based on device programmed but not configured, and no peripherals connected to any pins.  
Copyright © 2011, Texas Instruments Incorporated  
3
UCD9090  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
www.ti.com  
ELECTRICAL CHARACTERISTICS (continued)  
over operating free-air temperature range (unless otherwise noted)  
PARAMETER  
Voltage open pin  
Voltage shorted pin  
TEST CONDITIONS  
MIN NOM  
MAX  
UNIT  
V
VADDR_OPEN  
VADDR_SHORT  
PMBUS_ADDR0, PMBUS_ADDR1 open  
2.26  
PMBUS_ADDR0, PMBUS_ADDR1 short to ground  
0.124  
V
DIGITAL INPUTS AND OUTPUTS  
VOL  
Low-level output voltage  
IOL = 6 mA(2), V33DIO = 3 V  
Dgnd +  
0.25  
V
V
VOH  
High-level output voltage  
IOH = 6 mA(3), V33DIO = 3 V  
V33DIO  
0.6  
VIH  
VIL  
High-level input voltage  
Low-level input voltage  
V33DIO = 3 V  
2.1  
3.6  
1.4  
V
V
V33DIO = 3.5 V  
MARGINING OUTPUTS  
TPWM_FREQ MARGINING-PWM frequency  
FPWM1-8  
PWM1-2  
15.260  
0.001  
0
125000  
7800  
100  
kHz  
%
DUTYPWM  
MARGINING-PWM duty cycle range  
SYSTEM PERFORMANCE  
VDDSlew  
VRESET  
Minimum VDD slew rate  
VDD slew rate between 2.3 V and 2.9 V  
For power-on reset (POR)  
0.25  
V/ms  
V
Supply voltage at which device comes  
out of reset  
2.4  
tRESET  
Low-pulse duration needed at RESET pin To reset device during normal operation  
2
240  
100  
20  
μS  
MHz  
f(PCLK)  
tretention  
Internal oscillator frequency  
TA = 125°C, TA = 25°C  
TJ = 25°C  
250  
260  
Retention of configuration parameters  
Years  
K cycles  
Write_Cycles  
Number of nonvolatile erase/write cycles TJ = 25°C  
(2) The maximum total current, IOLmax, for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop specified.  
(3) The maximum total current, IOHmax, for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified.  
4
Copyright © 2011, Texas Instruments Incorporated  
UCD9090  
www.ti.com  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
PMBus/SMBus/I2C  
The timing characteristics and timing diagram for the communications interface that supports I2C, SMBus and  
PMBus is shown below.  
I2C/SMBus/PMBus TIMING REQUIREMENTS  
TA = 40°C to 85°C, 3 V < VDD < 3.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
Slave mode, SMBC 50% duty cycle  
Slave mode, SCL 50% duty cycle  
MIN  
10  
TYP  
MAX UNIT  
FSMB  
FI2C  
SMBus/PMBus operating frequency  
I2C operating frequency  
Bus free time between start and stop  
Hold time after (repeated) start  
Repeated-start setup time  
Stop setup time  
400  
400  
kHz  
kHz  
μs  
10  
t(BUF)  
4.7  
0.26  
0.26  
0.26  
0
t(HD:STA)  
t(SU:STA)  
t(SU:STO)  
t(HD:DAT)  
t(SU:DAT)  
t(TIMEOUT)  
t(LOW)  
μs  
μs  
μs  
Data hold time  
Receive mode  
See(1)  
ns  
Data setup time  
50  
ns  
Error signal/detect  
35  
ms  
μs  
Clock low period  
0.5  
(2)  
t(HIGH)  
t(LOW:SEXT)  
tf  
Clock high period  
See  
0.26  
50  
25  
μs  
(3)  
Cumulative clock low slave extend time  
Clock/data fall time  
See  
ms  
ns  
(4)  
See  
120  
120  
(5)  
tr  
Clock/data rise time  
See  
ns  
(1) The device times out when any clock low exceeds t(TIMEOUT)  
.
(2) t(HIGH), Max, is the minimum bus idle time. SMBC = SMBD = 1 for t > 50 ms causes reset of any transaction that is in progress. This  
specification is valid when the NC_SMB control bit remains in the default cleared state (CLK[0] = 0).  
(3) t(LOW:SEXT) is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.  
(4) Fall time tf = 0.9 VDD to (VILMAX 0.15)  
(5) Rise time tr = (VILMAX 0.15) to (VIHMIN + 0.15)  
Figure 1. I2C/SMBus Timing Diagram  
Start  
Stop  
T
LOW:SEXT  
T
T
T
LOW:MEXT  
LOW:MEXT  
LOW:MEXT  
PMB_Clk  
Clk  
ACK  
Clk  
ACK  
PMB_Data  
Figure 2. Bus Timing in Extended Mode  
Copyright © 2011, Texas Instruments Incorporated  
5
UCD9090  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
www.ti.com  
DEVICE INFORMATION  
Figure 3. UCD9090 PIN ASSIGNMENT  
33 34 35  
27  
28  
29  
30  
31  
MON1  
MON2  
MON3  
MON4  
MON5  
MON6  
MON7  
MON8  
MON9  
MON10  
MON11  
TCK/GPIO18  
TDO/GPIO19  
TDI/GPIO20  
TMS/GPIO21  
TRST  
1
2
38  
39  
40  
41  
42  
45  
46  
48  
37  
36  
AVSS1  
1
MON1  
GPIO1  
GPIO2  
4
35  
34  
BPCAP  
V33A  
2
3
MON2  
5
6
RESET  
GPIO3  
33  
32  
31  
30  
29  
V33D  
DVSS  
4
5
GPIO1  
GPIO4  
7
UCD9090  
GPIO2  
GPIO3  
GPIO13  
GPIO14  
GPIO15  
GPIO16  
GPIO17  
18  
21  
24  
25  
26  
6
TRST  
UCD9090  
7
TMS/GPIO21  
TDI/GPIO20  
GPIO4  
8
PMBUS_CLK  
PMBUS_DATA  
FPWM1/GPIO5  
FPWM2/GPIO6  
PMBUS_CLK  
8
9
28 TDO/GPIO19  
27 TCK/GPIO18  
9
PMBUS_DATA  
PMBUS_ALERT  
PMBUS_CNTRL  
PMBUS_ADDR0  
PMBUS_ADDR1  
10  
11  
12  
19  
20  
44  
43  
26  
GPIO17  
FPWM1/GPIO5  
FPWM2/GPIO6  
FPWM3/GPIO7  
FPWM4/GPIO8  
FPWM5/GPIO9  
FPWM6/GPIO10  
FPWM7/GPIO11  
FPWM8/GPIO12  
10  
11  
12  
13  
14  
15  
16  
17  
25  
GPIO16  
FPWM3/GPIO7  
PWM1/GPI1  
PWM2/GPI2  
22  
23  
RESET  
3
32 36 47  
Table 1. PIN FUNCTIONS  
PIN NAME  
PIN NO.  
I/O TYPE DESCRIPTION  
ANALOG MONITOR INPUTS  
MON1  
MON2  
MON3  
MON4  
MON5  
MON6  
MON7  
MON8  
MON9  
MON10  
MON11  
GPIO  
1
I
I
I
I
I
I
I
I
I
I
I
Analog input (0 V2.5 V)  
2
Analog input (0 V2.5 V)  
Analog input (0 V2.5 V)  
Analog input (0 V2.5 V)  
Analog input (0 V2.5 V)  
Analog input (0 V2.5 V)  
Analog input (0 V2.5 V)  
Analog input (0 V2.5 V)  
Analog input (0 V2.5 V)  
Analog input (0 V2.5 V)  
Analog input (0.2 V2.5 V)  
38  
39  
40  
41  
42  
45  
46  
48  
37  
GPIO1  
4
I/O  
General-purpose discrete I/O  
6
Copyright © 2011, Texas Instruments Incorporated  
 
UCD9090  
www.ti.com  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
Table 1. PIN FUNCTIONS (continued)  
PIN NAME  
GPIO2  
PIN NO.  
I/O TYPE DESCRIPTION  
5
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
General-purpose discrete I/O  
General-purpose discrete I/O  
General-purpose discrete I/O  
General-purpose discrete I/O  
General-purpose discrete I/O  
General-purpose discrete I/O  
General-purpose discrete I/O  
General-purpose discrete I/O  
GPIO3  
6
GPIO4  
7
GPIO13  
18  
21  
24  
25  
26  
GPIO14  
GPIO15  
GPIO16  
GPIO17  
PWM OUTPUTS  
FPWM1/GPIO5  
FPWM2/GPIO6  
FPWM3/GPIO7  
FPWM4/GPIO8  
FPWM5/GPIO9  
FPWM6/GPIO10  
FPWM7/GPIO11  
FPWM8/GPIO12  
PWM1/GPI1  
PWM2/GPI2  
10  
11  
12  
13  
14  
15  
16  
17  
22  
23  
I/O/PWM  
I/O/PWM  
I/O/PWM  
I/O/PWM  
I/O/PWM  
I/O/PWM  
I/O/PWM  
I/O/PWM  
I/PWM  
PWM (15.259 kHz to 125 MHz) or GPIO  
PWM (15.259 kHz to 125 MHz) or GPIO  
PWM (15.259 kHz to 125 MHz) or GPIO  
PWM (15.259 kHz to 125 MHz) or GPIO  
PWM (15.259 kHz to 125 MHz) or GPIO  
PWM (15.259 kHz to 125 MHz) or GPIO  
PWM (15.259 kHz to 125 MHz) or GPIO  
PWM (15.259 kHz to 125 MHz) or GPIO  
PWM (0.93 Hz to 7.8125 MHz) or GPI  
PWM (0.93 Hz to 7.8125 MHz) or GPI  
I/PWM  
PMBus COMM INTERFACE  
PMBUS_CLK  
PMBUS_DATA  
PMBUS_ALERT  
PMBUS_CNTRL  
PMBUS_ADDR0  
PMBUS_ADDR1  
JTAG  
8
I/O  
PMBus clock (must have pullup to 3.3 V)  
PMBus data (must have pullup to 3.3 V)  
9
I/O  
19  
20  
44  
43  
O
I
PMBus alert, active-low, open-drain output (must have pullup to 3.3 V)  
PMBus control  
I
PMBus analog address input. Least-significant address bit  
PMBus analog address input. Most-significant address bit  
I
TCK/GPIO18  
TDO/GPIO19  
TDI/GPIO20  
TMS/GPIO21  
TRST  
27  
28  
29  
30  
31  
I/O  
I/O  
I/O  
I/O  
I
Test clock or GPIO  
Test data out or GPIO  
Test data in (tie to Vdd with 10-kΩ resistor) or GPIO  
Test mode select (tie to Vdd with 10-kΩ resistor) or GPIO  
Test reset tie to ground with 10-kΩ resistor  
INPUT POWER AND GROUNDS  
RESET  
V33A  
3
Active-low device reset input. Hold low for at least 2 μs to reset the device.  
Analog 3.3-V supply. Refer to the Layout Guidelines section.  
Digital core 3.3-V supply. Refer to the Layout Guidelines section.  
1.8-V bypass capacitor. Refer to the Layout Guidelines section.  
Analog ground  
34  
33  
35  
36  
47  
32  
NA  
V33D  
BPCap  
AVSS1  
AVSS2  
DVSS  
Analog ground  
Digital ground  
QFP ground pad  
Thermal pad tie to ground plane.  
FUNCTIONAL DESCRIPTION  
TI FUSION GUI  
The Texas Instruments Fusion Digital Power Designer is provided for device configuration. This PC-based  
Copyright © 2011, Texas Instruments Incorporated  
7
UCD9090  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
www.ti.com  
graphical user interface (GUI) offers an intuitive I2C/PMBus interface to the device. It allows the design engineer  
to configure the system operating parameters for the application without directly using PMBus commands, store  
the configuration to on-chip nonvolatile memory, and observe system status (voltage, etc). Fusion Digital Power  
Designer is referenced throughout the data sheet as Fusion GUI and many sections include screenshots. The  
Fusion GUI can be downloaded from www.ti.com.  
PMBUS INTERFACE  
The PMBus is a serial interface specifically designed to support power management. It is based on the SMBus  
interface that is built on the I2C physical specification. The UCD9090 supports revision 1.1 of the PMBus  
standard. Wherever possible, standard PMBus commands are used to support the function of the device. For  
unique features of the UCD9090, MFR_SPECIFIC commands are defined to configure or activate those features.  
These commands are defined in the UCD90xxx Sequencer and System Health Controller PMBUS Command  
Reference (SLVU352). The most current UCD90xxx PMBusCommand Reference can be found within the TI  
Fusion Digital Power Designer software via the Help Menu (Help, Documentation & Help Center, Sequencers  
tab, Documentation section).  
This document makes frequent mention of the PMBus specification. Specifically, this document is PMBus Power  
System Management Protocol Specification Part II Command Language, Revision 1.1, dated 5 February 2007.  
The specification is published by the Power Management Bus Implementers Forum and is available from  
www.pmbus.org.  
The UCD9090 is PMBus compliant, in accordance with the Compliance section of the PMBus specification. The  
firmware is also compliant with the SMBus 1.1 specification, including support for the SMBus ALERT function.  
The hardware can support either 100-kHz or 400-kHz PMBus operation.  
THEORY OF OPERATION  
Modern electronic systems often use numerous microcontrollers, DSPs, FPGAs, and ASICs. Each device can  
have multiple supply voltages to power the core processor, analog-to-digital converter or I/O. These devices are  
typically sensitive to the order and timing of how the voltages are sequenced on and off. The UCD9090 can  
sequence supply voltages to prevent malfunctions, intermittent operation, or device damage caused by improper  
power up or power down. Appropriate handling of under- and overvoltage faults can extend system life and  
improve long term reliability. The UCD9090 stores power supply faults to on-chip nonvolatile flash memory for aid  
in system failure analysis.  
System reliability can be improved through four-corner testing during system verification. During four-corner  
testing, the system is operated at the minimum and maximum expected ambient temperature and with each  
power supply set to the minimum and maximum output voltage, commonly referred to as margining. The  
UCD9090 can be used to implement accurate closed-loop margining of up to 10 power supplies.  
The UCD9090 10-rail sequencer can be used in a PMBus- or pin-based control environment. The TI Fusion GUI  
provides a powerful but simple interface for configuring sequencing solutions for systems with between one and  
10 power supplies using 10 analog voltage-monitor inputs, two GPIs and 21 highly configurable GPIOs. A rail  
includes voltage, a power-supply enable and a margining output. At least one must be included in a rail  
definition. Once the user has defined how the power-supply rails should operate in a particular system, analog  
input pins and GPIOs can be selected to monitor and enable each supply (Figure 4).  
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Figure 4. Fusion GUI Pin-Assignment Tab  
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After the pins have been configured, other key monitoring and sequencing criteria are selected for each rail from  
the Vout Config tab (Figure 5):  
Nominal operating voltage (Vout)  
Undervoltage (UV) and overvoltage (OV) warning and fault limits  
Margin-low and margin-high values  
Power-good on and power-good off limits  
PMBus or pin-based sequencing control (On/Off Config)  
Rails and GPIs for Sequence On dependencies  
Rails and GPIs for Sequence Off dependencies  
Turn-on and turn-off delay timing  
Maximum time allowed for a rail to reach POWER_GOOD_ON or POWER_GOOD_OFF after being enabled  
or disabled  
Other rails to turn off in case of a fault on a rail (fault-shutdown slaves)  
Figure 5. Fusion GUI VOUT-Config Tab  
The Synchronize margins/limits/PG to Vout checkbox is an easy way to change the nominal operating voltage  
of a rail and also update all of the other limits associated with that rail according to the percentages shown to the  
right of each entry.  
The plot in the upper left section of Figure 5 shows a simulation of the overall sequence-on and sequence-off  
configuration, including the nominal voltage, the turnon and turnoff delay times, the power-good on and  
power-good off voltages and any timing dependencies between the rails.  
After a rail voltage has reached its POWER_GOOD_ON voltage and is considered to be in regulation, it is  
compared against two UV and two OV thresholds in order to determine if a warning or fault limit has been  
exceeded. If a fault is detected, the UCD9090 responds based on a variety of flexible, user-configured options.  
Faults can cause rails to restart, shut down immediately, sequence off using turnoff delay times or shut down a  
group of rails and sequence them back on. Different types of faults can result in different responses.  
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Fault responses, along with a number of other parameters including user-specific manufacturing information and  
external scaling and offset values, are selected in the different tabs within the Configure function of the Fusion  
GUI. Once the configuration satisfies the user requirements, it can be written to device SRAM if Fusion GUI is  
connected to a UCD9090 using an I2C/PMBus. SRAM contents can then be stored to data flash memory so that  
the configuration remains in the device after a reset or power cycle.  
The Fusion GUI Monitor page has a number of options, including a device dashboard and a system dashboard,  
for viewing and controlling device and system status.  
Figure 6. Fusion GUI Monitor Page  
The UCD9090 also has status registers for each rail and the capability to log faults to flash memory for use in  
system troubleshooting. This is helpful in the event of a power-supply or system failure. The status registers  
(Figure 7) and the fault log (Figure 8) are available in the Fusion GUI. See the UCD90xxx Sequencer and  
System Health Controller PMBus Command Reference (SLVU352) and the PMBus Specification for detailed  
descriptions of each status register and supported PMBus commands.  
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Figure 7. Fusion GUI Rail-Status Register  
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Figure 8. Fusion GUI Flash-Error Log (Logged Faults)  
POWER-SUPPLY SEQUENCING  
The UCD9090 can control the turn-on and turn-off sequencing of up to 10 voltage rails by using a GPIO to set a  
power-supply enable pin high or low. In PMBus-based designs, the system PMBus master can initiate a  
sequence-on event by asserting the PMBUS_CNTRL pin or by sending the OPERATION command over the I2C  
serial bus. In pin-based designs, the PMBUS_CNTRL pin can also be used to sequence-on and sequence-off.  
The auto-enable setting ignores the OPERATION command and the PMBUS_CNTRL pin. Sequence-on is  
started at power up after any dependencies and time delays are met for each rail. A rail is considered to be on or  
within regulation when the measured voltage for that rail crosses the power-good on (POWER_GOOD_ON(1))  
(1) In this document, configuration parameters such as Power Good On are referred to using Fusion GUI names. The UCD90xxx  
Sequencer and System Health Controller PMBus Command Reference name is shown in parentheses (POWER_GOOD_ON) the first  
time the parameter appears.  
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limit. The rail is still in regulation until the voltage drops below power-good off (POWER_GOOD_OFF). In the  
case that there isn't voltage monitoring set for a given rail, that rail is considered ON if it is commanded on (either  
by  
OPERATION  
command,  
PMBUS  
CNTRL  
pin,  
or  
auto-enable)  
and  
(TON_DELAY  
+
TON_MAX_FAULT_LIMIT) time passes. Also, a rail is considered OFF if that rail is commanded OFF and  
(TOFF_DELAY + TOFF_MAX_WARN_LIMIT) time passes  
14  
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Turn-on Sequencing  
The following sequence-on options are supported for each rail:  
Monitor only do not sequence-on  
Fixed delay time (TON_DELAY) after an OPERATION command to turn on  
Fixed delay time after assertion of the PMBUS_CNTRL pin  
Fixed time after one or a group of parent rails achieves regulation (POWER_GOOD_ON)  
Fixed time after a designated GPI has reached a user-specified state  
Any combination of the previous options  
The maximum TON_DELAY time is 3276 ms.  
Turn-off Sequencing  
The following sequence-off options are supported for each rail:  
Monitor only do not sequence-off  
Fixed delay time (TOFF_DELAY) after an OPERATION command to turn off  
Fixed delay time after deassertion of the PMBUS_CNTRL pin  
Fixed time after one or a group of parent rails drop below regulation (POWER_GOOD_OFF)  
Fixed delay time in response to an undervoltage, overvoltage, or max turn-on fault on the rail  
Fixed delay time in response to a fault on a different rail when set as a fault shutdown slave to the faulted rail  
Fixed delay time in response to a GPI reaching a user-specified state  
Any combination of the previous options  
The maximum TOFF_DELAY time is 3276 ms.  
Ÿ Rail 1 and Rail 2 are both sequenced “ON”  
and “OFF” by the PMBUS_CNTRL pin  
only  
PMBUS_CNTRL PIN  
TON_DELAY[1]  
TOFF_DELAY[1]  
Ÿ Rail 2 has Rail 1 as an “ON” dependency  
Ÿ Rail 1 has Rail 2 as an “OFF” dependency  
RAIL 1 EN  
POWER_GOOD_ON[1]  
POWER_GOOD_OFF[1]  
RAIL 1 VOLTAGE  
TON_DELAY[2]  
TOFF_DELAY[2]  
RAIL 2 EN  
RAIL 2 VOLTAGE  
TON_MAX_FAULT_LIMIT[2]  
TOFF_MAX_WARN_LIMIT[2]  
Figure 9. Sequence-on and Sequence-off Timing  
Sequencing Configuration Options  
In addition to the turn-on and turn-off sequencing options, the time between when a rail is enabled and when the  
monitored rail voltage must reach its power-good-on setting can be configured using max turn-on  
(TON_MAX_FAULT_LIMIT). Max turn-on can be set in 1-ms increments. A value of 0 ms means that there is no  
limit and the device can try to turn on the output voltage indefinitely.  
Rails can be configured to turn off immediately or to sequence-off according to rail and GPI dependencies, and  
user-defined delay times. A sequenced shutdown is configured by selecting the appropriate rail and GPI  
dependencies, and turn-off delay (TOFF_DELAY) times for each rail. The turn-off delay times begin when the  
PMBUS_CNTRL pin is deasserted, when the PMBus OPERATION command is used to give a soft-stop  
command, or when a fault occurs on a rail that has other rails set as fault-shutdown slaves.  
Shutdowns on one rail can initiate shutdowns of other rails or controllers. In systems with multiple UCD9090s, it  
is possible for each controller to be both a master and a slave to another controller.  
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PIN SELECTED RAIL STATES  
This feature allows with the use of up to 3 GPIs to enable and disable any rail. This is useful for implementing  
system low-power modes and the Advanced Configuration and Power Interface (ACPI) specification that is used  
for operating system directed power management in servers and PCs. In up to 8 system states, the power  
system designer can define which rails are on and which rails are off. If a new state is presented on the input  
pins, and a rail is required to change state, it will do so with regard to its sequence-on or sequence-off  
dependencies.  
The OPERATION command is modified when this function causes a rail to change its state. This means that the  
ON_OFF_CONFIG for a given rail must be set to use the OPERATION command for this function to have any  
effect on the rail state. The first 3 pins configured with the GPI_CONFIG command are used to select 1 of 8  
system states. Whenever the device is reset, these pins are sampled and the system state, if enabled, will be  
used to update each rail state. When selecting a new system state, changes to the status of the GPIs must not  
take longer than 1 microsecond. See the UCD90xxx Sequencer and System Health Controller PMBus Command  
Reference for complete configuration settings of PIN_SELECTED_RAIL_STATES.  
Table 2. GPI Selection of System States  
System  
State  
GPI 2 State  
GPI 1 State  
GPI 0 State  
NOT Asserted  
NOT Asserted  
NOT Asserted  
NOT Asserted  
Asserted  
NOT Asserted  
NOT Asserted  
Asserted  
NOT Asserted  
Asserted  
0
1
2
3
4
5
6
7
NOT Asserted  
Asserted  
Asserted  
NOT Asserted  
NOT Asserted  
Asserted  
NOT Asserted  
Asserted  
Asserted  
Asserted  
NOT Asserted  
Asserted  
Asserted  
Asserted  
MONITORING  
The UCD9090 has 11 monitor input pins (MONx) that are multiplexed into a 2.5V referenced 12-bit ADC. The  
monitor pins can be configured so that they can measure voltage signals to report voltage, current and  
temperature type measurements. A single rail can include all three measurement types, each monitored on  
separate MON pins. If a rail has both voltage and current assigned to it, then the user can calculate power for the  
rail. Digital filtering applied to each MON input depends on the type of signal. Voltage inputs have no filtering.  
Current and temperature inputs have a low-pass filter.  
Although the monitor results can be reported with a resolution of about 15 μV, the real conversion resolution of  
610 μV is fixed by the 2.5-V reference and the 12-bit ADC.  
Table 3. Voltage Range and Resolution  
VOLTAGE RANGE  
(Volts)  
RESOLUTION  
(millivolts)  
0 to 127.99609  
0 to 63.99805  
0 to 31.99902  
0 to 15.99951  
0 to 7.99976  
0 to 3.99988  
0 to 1.99994  
0 to 0.99997  
3.90625  
1.95313  
0.97656  
0.48824  
0.24414  
0.12207  
0.06104  
0.03052  
VOLTAGE MONITORING  
Up to 12 voltages can be monitored using the analog input pins. The input voltage range is 0 V2.5 V for all  
MONx inputs except MON11 (pin 37) which has a range of 0.2V2.5V. Any voltage between 0 V and 0.2 V on  
these pins is read as 0.2 V. External resistors can be used to attenuate voltages higher than 2.5 V.  
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The ADC operates continuously, requiring 3.89 μs to convert a single analog input and 46.7 μs to convert all 12  
of the analog inputs. Each rail is sampled by the sequencing and monitoring algorithm every 400 μs. The  
maximum source impedance of any sampled voltage should be less than 4 k. The source impedance limit is  
particularly important when a resistor-divider network is used to lower the voltage applied to the analog input  
pins.  
MON1 - MON6 can be configured using digital hardware comparators, which can be used to achieve faster fault  
responses. Each hardware comparator has four thresholds (two UV (Fault and Warning) and two OV (Fault and  
Warning)). The hardware comparators respond to UV or OV conditions in about 80 μs (faster than 400 µs for the  
ADC inputs) and can be used to disable rails or assert GPOs. The only fault response available for the hardware  
comparators is to shut down immediately.  
An internal 2.5-V reference is used by the ADC. The ADC reference has a tolerance of ±0.5% between 0°C and  
125°C and a tolerance of ±1% between 40°C and 125°C. An external voltage divider is required for monitoring  
voltages higher than 2.5 V. The nominal rail voltage and the external scale factor can be entered into the Fusion  
GUI and are used to report the actual voltage being monitored instead of the ADC input voltage. The nominal  
voltage is used to set the range and precision of the reported voltage according to Table 3.  
MON1 – MON6  
Fast Digital  
Comparators  
MON1  
12-bit  
SAR ADC  
200ksps  
M
U
X
MON2  
.
.
.
.
MON13  
Analog  
Inputs  
(12)  
Glitch  
Filter  
MON1 – MON13  
Internal  
2.5Vref  
0.5%  
Figure 10. Voltage Monitoring Block Diagram  
Although the monitor results can be reported with a resolution of about 15 μV, the real conversion resolution of  
610 μV is fixed by the 2.5-V reference and the 12-bit ADC.  
CURRENT MONITORING  
Current can be monitored using the analog inputs. External circuitry, see Figure 11, must be used in order to  
convert the current to a voltage within the range of the UCD9090 MONx input being used.  
If a monitor input is configured as a current, the measurements are smoothed by a sliding-average digital filter.  
The current for 1 rail is measured every 200μs. If the device is programmed to support 10 rails (independent of  
current not being monitored at all rails), then each rail's current will get measured every 2ms. The current  
calculation is done with a sliding average using the last 4 measurements. The filter reduces the probability of  
false fault detections, and introduces a small delay to the current reading. If a rail is defined with a voltage  
monitor and a current monitor, then monitoring for undercurrent warnings begins once the rail voltage reaches  
POWER_GOOD_ON. If the rail does not have a voltage monitor, then current monitoring begins after  
TON_DELAY.  
The device supports multiple PMBus commands related to current, including READ_IOUT, which reads external  
currents from the MON pins; IOUT_OC_FAULT_LIMIT, which sets the overcurrent fault limit;  
IOUT_OC_WARN_LIMIT, which sets the overcurrent warning limit; and IOUT_UC_FAULT_LIMIT, which sets the  
undercurrent fault limit. The UCD90xxx Sequencer and System Health Controller PMBus Command Reference  
contains a detailed description of how current fault responses are implemented using PMBus commands.  
IOUT_CAL_GAIN is a PMBus command that allows the scale factor of an external current sensor and any  
amplifiers or attenuators between the current sensor and the MON pin to be entered by the user in milliohms.  
IOUT_CAL_OFFSET is the current that results in 0 V at the MON pin. The combination of these PMBus  
commands allows current to be reported in amperes. The example below using the INA196 would require  
programming IOUT_CAL_GAIN to Rsense(mΩ)×20.  
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UCD9090  
MONx  
INA196  
VOUT  
Vin+  
Vin-  
Rsense  
AVSS1  
GND  
V+  
3.3V  
Gain = 20V/V  
Figure 11. Current Monitoring Circuit Example using the INA196  
REMOTE TEMPERATURE MONITORING AND INTERNAL TEMPERATURE SENSOR  
The UCD9090 has support for internal and remote temperature sensing. The internal temperature sensor  
requires no calibration and can report the device temperature via the PMBus interface. The remote temperature  
sensor can report the remote temperature by using a configurable gain and offset for the type of sensor that is  
used in the application such as a linear temperature sensor (LTS) connected to the analog inputs.  
External circuitry must be used in order to convert the temperature to a voltage within the range of the UCD9090  
MONx input being used.  
If an input is configured as a temperature, the measurements are smoothed by a sliding average digital filter. The  
temperature for 1 rail is measured every 100ms. If the device is programmed to support 10 rails (independent of  
temperature not being monitored at all rails), then each rail's temperature will get measured every 1s. The  
temperature calculation is done with a sliding average using the last 16 measurements. The filter reduces the  
probability of false fault detections, and introduces a small delay to the temperature reading. The internal device  
temperature is measured using a silicon diode sensor with an accuracy of ±5°C and is also monitored using the  
ADC. Temperature monitoring begins immediately after reset and initialization.  
The device supports multiple PMBus commands related to temperature, including READ_TEMPERATURE_1,  
which reads the internal temperature; READ_TEMPERATURE_2, which reads external temperatures; and  
OT_FAULT_LIMIT and OT_WARN_LIMIT, which set the overtemperature fault and warning limit. The UCD90xxx  
Sequencer and System Health Controller PMBus Command Reference contains a detailed description of how  
temperature-fault responses are implemented using PMBus commands.  
TEMPERATURE_CAL_GAIN is a PMBus command that allows the scale factor of an external temperature  
sensor and any amplifiers or attenuators between the temperature sensor and the MON pin to be entered by the  
user in °C/V. TEMPERATURE_CAL_OFFSET is the temperature that results in 0 V at the MON pin. The  
combination of these PMBus commands allows temperature to be reported in degrees Celsius.  
18  
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UCD9090  
TMP20  
MONx  
VOUT  
AVSS1  
GND  
V+  
3.3V  
Vout = -11.67mV/°C x T + 1.8583  
at -40°C < T < 85°C  
Figure 12. Remote Temperature Monitoring Circuit Example using the TMP20  
TEPERATURE BY HOST INPUT  
If the host system has the option of not using the temperature-sensing capability of the UCD9090, it can still  
provide the desired temperature to the UCD9090 through PMBus. The host may have temperature  
measurements available through I2C or SPI interfaced temperature sensors. The UCD9090 would use the  
temperature given by the host in place of an external temperature measurement for a given rail. The temperature  
provided by the host would still be used for detecting overtemperature warnings or faults, logging peak  
temperatures, input to Boolean logic-builder functions, and feedback for the fan-control algorithms. To write a  
temperature associated with a rail, the PMBus command used is the READ_TEMPERATURE_2 command. If the  
host writes that command, the value written will be used as the temperature until another value is written. This is  
true whether a monitor pin was assigned to the temperature or not. When there is a monitor pin associated with  
the temperature, once READ_TEMPERATURE_2 is written, the monitor pin is not used again until the part is  
reset. When there is not a monitor pin associated with the temperature, the internal temperature sensor is used  
for the temperature until the READ_TEMPERATURE_2 command is written.  
UCD9090  
Faults and  
Warnings  
I2C  
I2C or SPI  
REMOTE  
TEMP  
SENSOR  
Logged Peak  
Temperatures  
READ_TEMPERATURE_2  
HOST  
Boolean Logic  
Figure 13. Temperature Provided by Host  
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FAULT RESPONSES AND ALERT PROCESSING  
Device monitors that the rail stays within a window of normal operation. There are two programmable warning  
levels (under and over) and two programmable fault levels (under and over). When any monitored voltage goes  
outside of the warning or fault window, the PMBALERT# pin is asserted immediately, and the appropriate bits are  
set in the PMBus status registers (see Figure 7). Detailed descriptions of the status registers are provided in the  
UCD90xxx Sequencer and System Health Controller PMBus Command Reference and the PMBus Specification.  
A programmable glitch filter can be enabled or disabled for each MON input. A glitch filter for an input defined as  
a voltage can be set between 0 and 102 ms with 400-μs resolution.  
Fault-response decisions are based on results from the 12-bit ADC. The device cycles through the ADC results  
and compares them against the programmed limits. The time to respond to an individual event is determined by  
when the event occurs within the ADC conversion cycle and the selected fault response.  
PMBUS_CNTRL PIN  
TIME BETWEEN  
RESTARTS  
TIME BETWEEN  
RESTARTS  
TIME BETWEEN  
RESTARTS  
TON_DELAY[1]  
TOFF_DELAY[1]  
MAX_GLITCH_TIME  
RAIL 1 EN  
VOUT_OV_FAULT_LIMIT  
MAX_GLITCH_TIME +  
TOFF_DELAY[1]  
MAX_GLITCH_TIME +  
TOFF_DELAY[1]  
VOUT_UV_FAULT_LIMIT  
POWER_GOOD_ON[1]  
MAX_GLITCH_TIME  
MAX_GLITCH_TIME  
TOFF_DELAY[1]  
RAIL 1 VOLTAGE  
TON_DELAY[2]  
TOFF_DELAY[2]  
RAIL 2 EN  
RAIL 2 VOLTAGE  
Rail 1 and Rail 2 are both sequenced “ON” and  
“OFF” by the PMBUS_CNTRL pin only  
Rail 1 is set to use the glitch filter for UV or OV events  
Rail 1 is set to RESTART 3 times after a UV or OV event  
Rail 1 is set to shutdown with delay for a OV event  
Rail 2 has Rail 1 as an “ON” dependency  
Rail 1 has Rail 2 as a Fault Shutdown Slave  
Figure 14. Sequencing and Fault-Response Timing  
PMBUS_CNTRL PIN  
TON_DELAY[1]  
Rail 1 and Rail 2 are both sequenced  
“ON” and “OFF” by the PMBUS_CNTRL  
pin only  
RAIL 1 EN  
Time Between Restarts  
Rail 2 has Rail 1 as an “ON” dependency  
Rail 1 is set to shutdown immediately  
and RESTART 1 time in case of a Time  
On Max fault  
POWER_GOOD_ON[1]  
POWER_GOOD_ON[1]  
RAIL 1 VOLTAGE  
TON_MAX_FAULT_LIMIT[1]  
TON_DELAY[2]  
TON_MAX_FAULT_LIMIT[1]  
RAIL 2 EN  
RAIL 2 VOLTAGE  
Figure 15. Maximum Turn-on Fault  
The configurable fault limits are:  
TON_MAX_FAULT Flagged if a rail that is enabled does not reach the POWER_GOOD_ON limit within the  
configured time  
VOUT_UV_WARN Flagged if a voltage rail drops below the specified UV warning limit after reaching the  
POWER_GOOD_ON setting  
VOUT_UV_FAULT Flagged if a rail drops below the specified UV fault limit after reaching the  
POWER_GOOD_ON setting  
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VOUT_OV_WARN Flagged if a rail exceeds the specified OV warning limit at any time during startup or  
operation  
VOUT_OV_FAULT Flagged if a rail exceeds the specified OV fault limit at any time during startup or operation  
MAX_TOFF_WARN Flagged if a rail that is commanded to shut down does not reach 12.5% of the nominal rail  
voltage within the configured time  
Faults are more serious than warnings. The PMBALERT# pin is always asserted immediately if a warning or fault  
occurs. If a warning occurs, the following takes place:  
Warning Actions  
Immediately assert the PMBALERT# pin  
Status bit is flagged  
Assert a GPIO pin (optional)  
Warnings are not logged to flash  
A number of fault response options can be chosen from:  
Fault Responses  
Continue Without Interruption: Flag the fault and take no action  
Shut Down Immediately: Shut down the faulted rail immediately and restart according to the rail  
configuration  
Shut Down using TOFF_DELAY: If a fault occurs on a rail, exhaust whatever retries are  
configured. If the rail does not come back, schedule the shutdown of this rail and all  
fault-shutdown slaves. All selected rails, including the faulty rail, are sequenced off according to  
their sequence-off dependencies and T_OFF_DELAY times. If Do Not Restart is selected, then  
sequence off all selected rails when the fault is detected.  
Restart  
Do Not Restart: Do not attempt to restart a faulted rail after it has been shut down.  
Restart Up To N Times: Attempt to restart a faulted rail up to 14 times after it has been shut down.  
The time between restarts is measured between when the rail enable pin is deasserted (after any  
glitch filtering and turn-off delay times, if configured to observe them) and then reasserted. It can  
be set between 0 and 1275 ms in 5-ms increments.  
Restart Continuously: Same as Restart Up To N Times except that the device continues to restart  
until the fault goes away, it is commanded off by the specified combination of PMBus  
OPERATION command and PMBUS_CNTRL pin status, the device is reset, or power is removed  
from the device.  
Shut Down Rails and Sequence On (Re-sequence): Shut down selected rails immediately or after  
continue-operation time is reached and then sequence-on those rails using sequence-on  
dependencies and T_ON_DELAY times.  
SHUT DOWN ALL RAILS AND SEQUENCE ON (RESEQUENCE)  
In response to a fault, or a RESEQUENCE command, the UCD9090 can be configured to turn off a set of rails  
and then sequence them back on. To sequence all rails in the system, then all rails must be selected as  
fault-shutdown slaves of the faulted rail. The rails designated as fault-shutdown slaves will do soft shutdowns  
regardless of whether the faulted rail is set to stop immediately or stop with delay. Shut-down-all-rails and  
sequence-on are not performed until retries are exhausted for a given fault.  
While waiting for the rails to turn off, an error is reported if any of the rails reaches its TOFF_MAX_WARN_LIMIT.  
There is a configurable option to continue with the resequencing operation if this occurs. After the faulted rail and  
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fault-shutdown slaves sequence-off, the UCD9090 waits for a programmable delay time between 0 and 1275 ms  
in increments of 5 ms and then sequences-on the faulted rail and fault-shutdown slaves according to the start-up  
sequence configuration. This is repeated until the faulted rail and fault-shutdown slaves successfully achieve  
regulation or for a user-selected 1, 2, 3, 4 or unlimited times. If the resequence operation is successful, the  
resequence counter is reset if all of the rails that were resequenced maintain normal operation for one second.  
Once shut-down-all-rails and sequence-on begin, any faults on the fault-shutdown slave rails are ignored. If there  
are two or more simultaneous faults with different fault-shutdown slaves, the more conservative action is taken.  
For example, if a set of rails is already on its second resequence and the device is configured to resequence  
three times, and another set of rails enters the resequence state, that second set of rails is only resequenced  
once. Another example if one set of rails is waiting for all of its rails to shut down so that it can resequence,  
and another set of rails enters the resequence state, the device now waits for all rails from both sets to shut  
down before resequencing.  
GPIOs  
The UCD9090 has 21 GPIO pins that can function as either inputs or outputs. Each GPIO has configurable  
output mode options including open-drain or push-pull outputs that can be actively driven to 3.3 V or ground.  
There are an additional two pins that can be used as either inputs or PWM outputs but not as GPOs. Table 4  
lists possible uses for the GPIO pins and the maximum number of each type for each use. GPIO pins can be  
dependents in sequencing and alarm processing. They can also be used for system-level functions such as  
external interrupts, power-goods, resets, or for the cascading of multiple devices. GPOs can be sequenced up or  
down by configuring a rail without a MON pin but with a GPIO set as an enable.  
22  
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Table 4. GPIO Pin Configuration Options  
PIN  
RAIL EN  
(10 MAX)  
GPI  
(8 MAX)  
GPO  
(10 MAX)  
PWM OUT  
(10 MAX)  
MARGIN PWM  
(10 MAX)  
FPWM1/GPIO5  
FPWM2/GPIO6  
FPWM3/GPIO7  
FPWM4/GPIO8  
FPWM5/GPIO9  
FPWM6/GPIO10  
FPWM7/GPIO11  
FPWM8/GPIO12  
GPI1/PWM1  
GPI2/PWM2  
GPIO1  
11  
12  
13  
14  
15  
16  
17  
18  
24  
25  
5
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
GPIO2  
6
GPIO3  
7
GPIO4  
8
GPIO13  
19  
22  
23  
26  
27  
28  
29  
30  
31  
GPIO14  
GPIO15  
GPIO16  
GPIO17  
TCK/GPIO18  
TDO/GPIO19  
TDI/GPIO20  
TMS/GPIO21  
GPO Control  
The GPIOs when configured as outputs can be controlled by PMBus commands or through logic defined in  
internal Boolean function blocks. Controlling GPOs by PMBus commands (GPIO_SELECT and GPIO_CONFIG)  
can be used to have control over LEDs, enable switches, etc. with the use of an I2C interface. See the  
UCD90xxx Sequencer and System Health Controller PMBus Command Reference for details on controlling a  
GPO using PMBus commands.  
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GPO Dependencies  
GPIOs can be configured as outputs that are based on Boolean combinations of up to two ANDs all ORed  
together (Figure 16). Inputs to the logic blocks can include the first 8 defined GPOs, GPIs and rail-status flags.  
One rail status type is selectable as an input for each AND gate in a Boolean block. For a selected rail status, the  
status flags of all active rails can be included as inputs to the AND gate. _LATCH rail-status types stay asserted  
until cleared by a MFR PMBus command or by a specially configured GPI pin. The different rail-status types are  
shown in Table 5. See the UCD90xxx Sequencer and System Health Controller PMBus Command Reference for  
complete definitions of rail-status types. The GPO response can be configured to have a delayed assertion or  
deassertion.  
Sub block repeated for each of GPI(1:7)  
GPI_INVERSE(0)  
GPI_POLARITY(0)  
GPI_ENABLE(0)  
AND_INVERSE(0)  
1
_GPI(0)  
GPI(0)  
_GPI(1:7)  
_STATUS(0:8)  
_GPO(1:7)  
_STATUS(9)  
There is one STATUS_TYPE_SELECT for each of the two AND  
boolean block  
gates in  
a
STATUS_TYPE_SELECT  
STATUS(0)  
STATUS(1)  
OR_INVERSE(x)  
Status Type 1  
Sub block repeated for each of STATUS(0:8)  
GPOx  
STATUS_INVERSE(9)  
STATUS_ENABLE(9)  
Status Type 31  
ASSERT_DELAY(x)  
DE-ASSERT_DELAY(x)  
1
STATUS(9)  
AND_INVERSE(1)  
_GPI(0:7)  
_STATUS(0:9)  
_GPO(0:7)  
Sub block repeated for each of GPO(1:7)  
GPO_INVERSE(0)  
GPO_ENABLE(0)  
1
_GPO(0)  
GPO(0)  
Figure 16. Boolean Logic Combinations  
Figure 17. Fusion Boolean Logic Builder  
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Table 5. Rail-Status Types for Boolean Logic  
Rail-Status Types  
POWER_GOOD  
IOUT_UC_FAULT  
TEMP_OT_FAULT  
TEMP_OT_WARN  
SEQ_ON_TIMEOUT  
SEQ_OFF_TIMEOUT  
TOFF_MAX_WARN_LATCH  
SEQ_ON_TIMEOUT_LATCH  
SEQ_OFF_TIMEOUT_LATCH  
SYSTEM_WATCHDOG_TIMEOUT_LATCH  
IOUT_OC_FAULT_LATCH  
MARGIN_EN  
MRG_LOW_nHIGH  
VOUT_OV_FAULT  
VOUT_OV_WARN  
VOUT_UV_WARN  
VOUT_UV_FAULT  
TON_MAX_FAULT  
TOFF_MAX_WARN  
IOUT_OC_FAULT  
IOUT_OC_WARN  
SYSTEM_WATCHDOG_TIMEOUT  
VOUT_OV_FAULT_LATCH  
VOUT_OV_WARN_LATCH  
VOUT_UV_WARN_LATCH  
VOUT_UV_FAULT_LATCH  
TON_MAX_FAULT_LATCH  
IOUT_OC_WARN_LATCH  
IOUT_UC_FAULT_LATCH  
TEMP_OT_FAULT_LATCH  
TEMP_OT_WARN_LATCH  
GPO Delays  
The GPOs can be configured so that they manifest a change in logic with a delay on assertion, deassertion, both  
or none. GPO behavior using delays will have different effects depending if the logic change occurs at a faster  
rate than the delay. On a normal delay configuration, if the logic for a GPO changes to a state and reverts back  
to previous state within the time of a delay then the GPO will not manifest the change of state on the pin. In  
Figure 18 the GPO is set so that it follows the GPI with a 3ms delay at assertion and also at de-assertion. When  
the GPI first changes to high logic state, the state is maintained for a time longer than the delay allowing the  
GPO to follow with appropriate logic state. The same goes for when the GPI returns to its previous low logic  
state. The second time that the GPI changes to a high logic state it returns to low logic state before the delay  
time expires. In this case the GPO does not change state. A delay configured in this manner serves as a glitch  
filter for the GPO.  
3ms  
3ms  
GPI  
GPO  
1ms  
Figure 18. GPO Behavior When Not Ignoring Inputs During Delay  
The Ignore Input During Delay bit allows to output a change in GPO even if it occurs for a time shorter than the  
delay. This configuration setting has the GPO ignore any activity from the triggering event until the delay expires.  
Figure 19 represents the two cases for when ignoring the inputs during a delay. In the case in which the logic  
changes occur with more time than the delay, the GPO signal looks the same as if the input was not ignored.  
Then on a GPI pulse shorter than the delay the GPO still changes state. Any pulse that occurs on the GPO when  
having the Ignore Input During Delay bit set will have a width of at least the time delay.  
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3ms  
3ms  
3ms  
3ms  
GPI  
GPO  
1ms  
Figure 19. GPO Behavior When Ignoring Inputs During Delay  
State Machine Mode Enable  
When this bit within the GPO_CONFIG command is set, only one of the AND path will be used at a given time.  
When the GPO logic result is currently TRUE, AND path 0 will be used until the result becomes FALSE. When  
the GPO logic result is currently FALSE, AND path 1 will be used until the result becomes TRUE. This provides a  
very simple state machine and allows for more complex logical combinations.  
GPI Special Functions  
There are five special input functions for which GPIs can be used. There can be no more than one pin assigned  
to each of these functions.  
Sequencing Timeout Source - If SEQ_TIMEOUT is non-zero on any rail, a fault will occur if this GPI pin  
does not go active within SEQ_TIMEOUT time after the rail reaches its power good state.  
Latched Statuses Clear Source - When a GPO uses a latched status type (_LATCH), you can configure a  
GPI that will clear the latched status.  
Input Source for Margin Enable - When this pin is asserted, all rails with margining enabled will be put in a  
margined state (low or high).  
Input Source for Margin Low/Not-High - When this pin is asserted all margined rails will be set to Margin  
Low as long as the Margin Enable is asserted. When this pin is de-asserted the rails will be set to Margin  
High.  
The polarity of GPI pins can be configured to be either Active Low or Active High. The first 3 GPIs that are  
defined regardless of their main purpose will be used for the PIN_SELECTED_RAIL_STATES command.  
Power-Supply Enables  
Each GPIO can be configured as a rail-enable pin with either active-low or active-high polarity. Output mode  
options include open-drain or push-pull outputs that can be actively driven to 3.3 V or ground. During reset, the  
GPIO pins are high-impedance except for FPWM/GPIO pins 1724, which are driven low. External pulldown or  
pullup resistors can be tied to the enable pins to hold the power supplies off during reset. The UCD9090 can  
support a maximum of 12 enable pins.  
NOTE  
GPIO pins that have FPWM capability (pins 10-17) should only be used as power-supply  
enable signals if the signal is active high.  
Cascading Multiple Devices  
A GPIO pin can be used to coordinate multiple controllers by using it as a power good-output from one device  
and connecting it to the PMBUS_CNTRL input pin of another. This imposes a master/slave relationship among  
multiple devices. During startup, the slave controllers initiate their start sequences after the master has  
completed its start sequence and all rails have reached regulation voltages. During shutdown, as soon as the  
master starts to sequence-off, it sends the shut-down signal to its slaves.  
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A shutdown on one or more of the master rails can initiate shutdowns of the slave devices. The master  
shutdowns can be initiated intentionally or by a fault condition. This method works to coordinate multiple  
controllers, but it does not enforce interdependency between rails within a single controller.  
The PMBus specification implies that the power-good signal is active when ALL the rails in a controller are  
regulating at their programmed voltage. The UCD9090 allows GPIOs to be configured to respond to a desired  
subset of power-good signals.  
PWM Outputs  
FPWM1-8  
Pins 10-17 can be configured as fast pulse-width modulators (FPWMs). The frequency range is 15.260 kHz to  
125 MHz. FPWMs can be configured as closed-loop margining outputs, fan controllers or general-purpose  
PWMs.  
Any FPWM pin not used as a PWM output can be configured as a GPIO. One FPWM in a pair can be used as a  
PWM output and the other pin can be used as a GPO. The FPWM pins are actively driven low from reset when  
used as GPOs.  
The frequency settings for the FPWMs apply to pairs of pins:  
FPWM1 and FPWM2 same frequency  
FPWM3 and FPWM4 same frequency  
FPWM5 and FPWM6 same frequency  
FPWM7 and FPWM8 same frequency  
If an FPWM pin from a pair is not used while its companion is set up to function as a PWM, it is recommended to  
configure the unused FPWM pin as an active-low open-drain GPO so that it does not disturb the rest of the  
system. By setting an FPWM, it automatically enables the other FPWM within the pair if it was not configured for  
any other functionality.  
The frequency for the FPWM is derived by dividing down a 250MHz clock. To determine the actual frequency to  
which an FPWM can be set, must divide 250MHz by any integer between 2 and (214-1).  
The FPWM duty cycle resolution is dependent on the frequency set for a given FPWM. Once the frequency is  
known the duty cycle resolution can be calculated as Equation 1.  
Change per Step (%)FPWM = frequency ÷ (250 × 106 × 16) × 100  
(1)  
Take for an example determining the actual frequency and the duty cycle resolution for a 75MHz target  
frequency.  
1. Divide 250MHz by 75MHz to obtain 3.33.  
2. Round off 3.33 to obtain an integer of 3.  
3. Divide 250MHz by 3 to obtain actual closest frequency of 83.333MHz.  
4. Use Equation 1 to determine duty cycle resolution to obtain 2.0833% duty cycle resolution.  
PWM1-2  
Pins 22 and 23 can be used as GPIs or PWM outputs. These PWM outputs have an output frequency of 0.93 Hz  
to 7.8125 MHz.  
The frequency for PWM1 and PWM2 is derived by dividing down a 15.625MHz clock. To determine the actual  
frequency to which these PWMs can be set, must divide 15.625MHz by any integer between 2 and (224-1). The  
duty cycle resolution will be dependent on the set frequency for PWM1 and PWM2.  
The PWM1 or PWM2 duty cycle resolution is dependent on the frequency set for the given PWM. Once the  
frequency is known the duty cycle resolution can be calculated as Equation 2  
Change per Step (%)PWM1/2 = frequency ÷ 15.625 × 106 × 100  
(2)  
To determine the closest frequency to 1MHz that PWM1 can be set to calculate as the following:  
1. Divide 15.625MHz by 1MHz to obtain 15.625.  
2. Round off 15.625 to obtain an integer of 16.  
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3. Divide 15.625MHz by 16 to obtain actual closest frequency of 976.563kHz.  
4. Use Equation 2 to determine duty cycle resolution to obtain 6.25% duty cycle resolution.  
All frequencies below 238Hz will have a duty cycle resolution of 0.0015%.  
Programmable Multiphase PWMs  
The FPWMs can be aligned with reference to their phase. The phase for each FPWM is configurable from 0° to  
360°. This provides flexibility in PWM-based applications such as power-supply controller, digital clock  
generation, and others. See an example of four FPWMs programmed to have phases at 0°, 90°, 180° and 270°  
(Figure 20).  
Figure 20. Multiphase PWMs  
MARGINING  
Margining is used in product validation testing to verify that the complete system works properly over all  
conditions, including minimum and maximum power-supply voltages, load range, ambient temperature range,  
and other relevant parameter variations. Margining can be controlled over PMBus using the OPERATION  
command or by configuring two GPIO pins as margin-EN and margin-UP/DOWN inputs. The MARGIN_CONFIG  
command in the UCD90xxx Sequencer and System Health Controller PMBus Command Reference describes  
different available margining options, including ignoring faults while margining and using closed-loop margining to  
trim the power-supply output voltage one time at power up.  
Open-Loop Margining  
Open-loop margining is done by connecting a power-supply feedback node to ground through one resistor and to  
the margined power supply output (VOUT) through another resistor. The power-supply regulation loop responds to  
the change in feedback node voltage by increasing or decreasing the power-supply output voltage to return the  
feedback voltage to the original value. The voltage change is determined by the fixed resistor values and the  
voltage at VOUT and ground. Two GPIO pins must be configured as open-drain outputs for connecting resistors  
from the feedback node of each power supply to VOUT or ground.  
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MON(1:10)  
3.3V  
UCD9090  
POWER  
SUPPLY  
10kW  
out  
V
GPIO(1:10)  
/EN  
VOUT  
VFB  
3.3V  
Rmrg_HI  
VFB  
“0” or 1”  
“0” or 1”  
GPIO  
GPIO  
VOUT  
Rmrg_LO  
3.3V  
POWER  
SUPPLY  
Vout  
W
10k  
/EN  
VOUT  
VFB  
VFB  
Rmrg_HI  
VOUT  
.
3.3V  
Rmrg_LO  
Open Loop Margining  
Figure 21. Open-Loop Margining  
Closed-Loop Margining  
Closed-loop margining uses a PWM or FPWM output for each power supply that is being margined. An external  
RC network converts the FPWM pulse train into a DC margining voltage. The margining voltage is connected to  
the appropriate power-supply feedback node through a resistor. The power-supply output voltage is monitored,  
and the margining voltage is controlled by adjusting the PWM duty cycle until the power-supply output voltage  
reaches the margin-low and margin-high voltages set by the user. The voltage setting resolutions will be the  
same that applies to the voltage measurement resolution (Table 3). The closed loop margining can operate in  
several modes (Table 6). Given that this closed-loop system has feed back through the ADC, the closed-loop  
margining accuracy will be dominated by the ADC measurement. The relationship between duty cycle and  
margined voltage is configurable so that voltage increases when duty cycle increases or decreases. For more  
details on configuring the UCD9090 for margining, see the Voltage Margining Using the UCD9012x application  
note (SLVA375).  
Table 6. Closed Loop Margining Modes  
Mode  
Description  
DISABLE  
Margining is disabled.  
ENABLE_TRI_STATE  
When not margining, the PWM pin is set to high impedance state.  
When not margining, the PWM duty-cycle is continuously adjusted to keep the voltage at  
VOUT_COMMAND.  
ENABLE_ACTIVE_TRIM  
ENABLE_FIXED_DUTY_CYCLE  
When not margining, the PWM duty-cycle is set to a fixed duty-cycle.  
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MON(1:10)  
3.3V  
UCD9090  
POWER  
SUPPLY  
Vout  
10kW  
GPIO  
/EN  
VOUT  
VFB  
R1  
R2  
250 kHz – 1MHz  
Vmarg  
V
FB  
FPWM1  
R3  
R4  
C1  
Closed Loop  
Margining  
Figure 22. Closed-Loop Margining  
SYSTEM RESET SIGNAL  
The UCD9090 can generate a programmable system-reset pulse as part of sequence-on. The pulse is created  
by programming a GPIO to remain deasserted until the voltage of a particular rail or combination of rails reach  
their respective POWER_GOOD_ON levels plus a programmable delay time. The system-reset delay duration  
can be programmed as shown in Table 7. See an example of two SYSTEM RESET signals Figure 23. The first  
SYSTEM RESET signal is configured so that it de-asserts on Power Good On and it asserts on Power Good Off  
after a given common delay time. The second SYSTEM RESET signal is configured so that it sends a pulse after  
a delay time once Power Good On is achieved. The pulse width can be configured between 0.001s to 32.256s.  
See the UCD90xxx Sequencer and System Health Controller PMBus Command Reference for pulse width  
configuration details.  
Power Good On  
Power Good On  
Power Good Off  
POWER GOOD  
Delay  
Delay  
Delay  
SYSTEM RESET  
configured without pulse  
Pulse  
Pulse  
SYSTEM RESET  
configured with pulse  
Figure 23. System Reset with and without Pulse Setting  
The system reset can react to watchdog timing. In Figure 24 The first delay on SYSTEM RESET is for the initial  
reset release that would get a CPU running once all necessary voltage rails are in regulation. The watchdog is  
configured with a Start Time and a Reset Time. If these times expire without the WDI clearing them then it is  
expected that the CPU providing the watchdog signal is not operating. The SYSTEM RESET is toggled either  
using a Delay or GPI Tracking Release Delay to see if the CPU recovers.  
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Power Good On  
POWER GOOD  
Watchdog  
Reset Time  
Watchdog  
Start Time  
Watchdog  
Start Time  
WDI  
Delay  
Watchdog  
Reset Time  
SYSTEM RESET  
Delay or  
GPI Tracking Release Delay  
Figure 24. System Reset with Watchdog  
Table 7. System-Reset Delay  
Delay  
0 ms  
1 ms  
2 ms  
4 ms  
8 ms  
16 ms  
32 ms  
64 ms  
128 ms  
256 ms  
512 ms  
1.02 s  
2.05 s  
4.10 s  
8.19 s  
16.38 s  
32.8 s  
WATCH DOG TIMER  
A GPI and GPO can be configured as a watchdog timer (WDT). The WDT can be independent of power-supply  
sequencing or tied to a GPIO functioning as a watchdog output (WDO) that is configured to provide a  
system-reset signal. The WDT can be reset by toggling a watchdog input (WDI) pin or by writing to  
SYSTEM_WATCHDOG_RESET over I2C. The WDI and WDO pins are optional when using the watchdog timer.  
The WDI can be replaced by SYSTEM_WATCHDOG_RESET command and the WDO can be manifested  
through the Boolean Logic defined GPOs or through the System Reset function.  
The WDT can be active immediately at power up or set to wait while the system initializes. Table 8 lists the  
programmable wait times before the initial timeout sequence begins.  
Table 8. WDT Initial Wait Time  
WDT INITIAL WAIT TIME  
0 ms  
100 ms  
200 ms  
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Table 8. WDT Initial Wait  
Time (continued)  
WDT INITIAL WAIT TIME  
400 ms  
800 ms  
1.6 s  
3.2 s  
6.4 s  
12.8 s  
25.6 s  
51.2 s  
102 s  
205 s  
410 s  
819 s  
1638 s  
The watchdog timeout is programmable from 0.001s to 32.256s. See the UCD90xxx Sequencer and System  
Health Controller PMBus Command Reference for details on configuring the watchdog timeout. If the WDT times  
out, the UCD9090 can assert a GPIO pin configured as WDO that is separate from a GPIO defined as  
system-reset pin, or it can generate a system-reset pulse. After a timeout, the WDT is restarted by toggling the  
WDI pin or by writing to SYSTEM_WATCHDOG_RESET over I2C.  
<tWDI  
<tWDI  
<tWDI  
tWDI  
<tWDI  
WDI  
WDO  
Figure 25. Timing of GPIOs Configured for Watchdog Timer Operation  
DATA AND ERROR LOGGING TO FLASH MEMORY  
The UCD9090 can log faults and the number of device resets to flash memory. Peak voltage measurements are  
also stored for each rail. To reduce stress on the flash memory, a 30-second timer is started if a measured value  
exceeds the previously logged value. Only the highest value from the 30-second interval is written from RAM to  
flash.  
Multiple faults can be stored in flash memory and can be accessed over PMBus to help debug power-supply  
bugs or failures. Each logged fault includes:  
Rail number  
Fault type  
Fault time since previous device reset  
Last measured rail voltage  
The total number of device resets is also stored to flash memory. The value can be reset using PMBus.  
With the brownout function enabled, the run-time clock value, peak monitor values, and faults are only logged to  
flash when a power-down is detected. The device run-time clock value is stored across resets or power cycles  
unless the brownout function is disabled, in which case the run-time clock is returned to zero after each reset.  
It is also possible to update and calibrate the UCD9090 internal run-time clock via a PMBus host. For example, a  
host processor with a real-time clock could periodically update the UCD9090 run-time clock to a value that  
corresponds to the actual date and time. The host must translate the UCD9090 timer value back into the  
appropriate units, based on the usage scenario chosen. See the REAL_TIME_CLOCK command in the  
UCD90xxx Sequencer and System Health Controller PMBus Command Reference for more details.  
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BROWNOUT FUNCTION  
The UCD9090 can be enabled to turn off all nonvolatile logging until a brownout event is detected. A brownout  
event occurs if VCC drops below 2.9 V. In order to enable this feature, the user must provide enough local  
capacitance to deliver up to 80 mA (consider additional load based on GPOs sourcing external circuits such as  
LEDs) on for 5 ms while maintaining a minimum of 2.6 V at the device. If using the brownout circuit (Figure 26),  
then a schottky diode should be placed so that it blocks the other circuits that are also powered from the 3.3V  
supply.  
With this feature enabled, the UCD9090 saves faults, peaks, and other log data to SRAM during normal  
operation of the device. Once a brownout event is detected, all data is copied from SRAM to Flash. Use of this  
feature allows the UCD9090 to keep track of a single run-time clock that spans device resets or system power  
down (rather than resetting the run time clock after device reset). It can also improve the UCD9090 internal  
response time to events, because Flash writes are disabled during normal system operation. This is an optional  
feature and can be enabled using the MISC_CONFIG command. For more details, see the UCD90xxx  
Sequencer and System Health Controller PMBus Command Reference.  
UCD9090  
B340A  
V33A  
V33D  
AVSS1  
AVSS2  
3.3V  
C
DVSS  
Figure 26. Brownout Circuit  
PMBUS ADDRESS SELECTION  
Two pins are allocated to decode the PMBus address. At power up, the device applies a bias current to each  
address-detect pin, and the voltage on that pin is captured by the internal 12-bit ADC. The PMBus address is  
calculated as follows.  
PMBus Address = 12 × bin(VAD01) + bin(VAD00  
)
Where bin(VAD0x) is the address bin for one of eight addresses as shown in Table 9. The address bins are  
defined by the MIN and MAX VOLTAGE RANGE (V). Each bin is a constant ratio of 1.25 from the previous bin.  
This method maintains the width of each bin relative to the tolerance of standard 1% resistors.  
Table 9. PMBus Address Bins  
RPMBus  
ADDRESS BIN  
PMBus RESISTANCE (kΩ)  
open  
11  
10  
9
200  
154  
118  
90.9  
69.8  
53.6  
41.2  
31.6  
8
7
6
5
4
short  
Copyright © 2011, Texas Instruments Incorporated  
33  
 
 
UCD9090  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
www.ti.com  
A low impedance (short) on either address pin that produces a voltage below the minimum voltage causes the  
PMBus address to default to address 126 (0x7E). A high impedance (open) on either address pin that produces  
a voltage above the maximum voltage also causes the PMBus address to default to address 126 (0x7E).  
Address 0 is not used because it is the PMBus general-call address. Addresses 11 and 127 can not be used by  
this device or any other device that shares the PMBus with it, because those are reserved for manufacturing  
programming and test. It is recommended that address 126 not be used for any devices on the PMBus, because  
this is the address that the UCD9090 defaults to if the address lines are shorted to ground or left open. Table 10  
summarizes which PMBus addresses can be used. Other SMBus/PMBus addresses have been assigned for  
specific devices. For a system with other types of devices connected to the same PMBus, see the SMBus device  
address assignments table in Appendix C of the latest version of the System Management Bus (SMBus)  
specification. The SMBus specification can be downloaded at http://smbus.org/specs/smbus20.pdf.  
34  
Copyright © 2011, Texas Instruments Incorporated  
UCD9090  
www.ti.com  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
Table 10. PMBus Address Assignment Rules  
Address  
STATUS  
Prohibited  
Avoid  
Reason  
0
SMBus generaladdress call  
11  
Causes conflicts with other devices during program flash updates.  
PMBus alert response protocol  
12  
Prohibited  
For JTAG Use  
Prohibited  
126  
127  
Default value; may cause conflicts with other devices.  
Used by TI manufacturing for device tests.  
VDD  
UCD9090  
10uA  
On/Off Control  
Ibias  
To 12-bit ADC  
PMBUS_ADDR0  
PMBUS_ADDR1  
Resistors to set  
PMBus address  
Figure 27. PMBus Address-Detection Method  
CAUTION  
Address 126 (0x7E) is not recommended to be selected as a permanent PMBus  
address for any given application design. Leaving the address in default state as 126  
(0x7E) will enable the JTAG and not allow using the JTAG compatible pins (27-30) as  
GPIOs. The UCD9090 runs at 10% slower frequency while the JTAG is enabled to  
ensure best JTAG operation.  
DEVICE RESET  
The UCD9090 has an integrated power-on reset (POR) circuit which monitors the supply voltage. At power up,  
the POR detects the V33D rise. When V33D is greater than VRESET, the device comes out of reset.  
The device can be forced into the reset state by an external circuit connected to the RESET pin. A logic-low  
voltage on this pin for longer than tRESET holds the device in reset. It comes out of reset within 1 ms after  
RESETis released and can return to a logic-high level. To avoid an erroneous trigger caused by noise, connect  
RESET to a 10kohm pullup resistor (from RESET to 3.3 V) and a 1000pF capacitor (from RESET to AVSS).  
Any time the device comes out of reset, it begins an initialization routine that lasts about 20 ms. During the  
initialization routine, the FPWM pins are held low, and all other GPIO and GPI pins are open-circuit. At the end of  
initialization, the device begins normal operation as defined by the device configuration.  
DEVICE CONFIGURATION AND PROGRAMMING  
From the factory, the device contains the sequencing and monitoring firmware. It is also configured so that all  
GPOs are high-impedance (except for FPWM/GPIO pins 10-17, which are driven low), with no sequencing or  
fault-response operation. See Configuration Programming of UCD Devices, available from the Documentation &  
Help Center that can be selected from the Fusion GUI Help menu, for full UCD9090 configuration details.  
After the user has designed a configuration file using Fusion GUI, there are three general device-configuration  
programming options:  
1. Devices can be programmed in-circuit by a host microcontroller using PMBus commands over I2C (see the  
UCD90xxx  
Sequencer  
and  
System  
Health  
Controller  
PMBus  
Command  
Reference).  
Each parameter write replaces the data in the associated memory (RAM) location. After all the required  
configuration data has been sent to the device, it is transferred to the associated nonvolatile memory (data  
flash) by issuing a special command, STORE_DEFAULT_ALL. This method is how the Fusion GUI normally  
Copyright © 2011, Texas Instruments Incorporated  
35  
 
UCD9090  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
www.ti.com  
reads and writes a device configuration.  
2. The Fusion GUI (Figure 28) can create a PMBus or I2C command script file that can be used by the I2C  
master to configure the device.  
Figure 28. Fusion GUI PMBus Configuration Script Export Tool  
3. Another in-circuit programming option is for the Fusion GUI to create a data flash image from the  
configuration file (Figure 29). The configuration files can be exported in Intel Hex, Serial Vector Format (SVF)  
and S-record. The image file can be downloaded into the device using I2C or JTAG. The Fusion GUI tools  
can be used on-board if the Fusion GUI can gain ownership of the target board I2C bus.  
36  
Copyright © 2011, Texas Instruments Incorporated  
 
UCD9090  
www.ti.com  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
Figure 29. Fusion GUI Device Configuration Export Tool  
Devices can be programmed off-board using the Fusion GUI tools or a dedicated device programmer. For small  
runs, a ZIF socketed board with an I2C header can be used with the standard Fusion GUI or manufacturing GUI.  
The Fusion GUI can also create a data flash file that can then be loaded into the UCD9090 using a dedicated  
device programmer.  
To configure the device over I2C or PMBus, the UCD9090 must be powered. The PMBus clock and data pins  
must be accessible and must be pulled high to the same VDD supply that powers the device, with pullup resistors  
between 1 kand 2 k. Care should be taken to not introduce additional bus capacitance (<100 pF). The user  
configuration can be written to data flash using a gang programmer via JTAG or I2C before the device is installed  
in circuit. To use I2C, the clock and data lines must be multiplexed or the device addresses must be assigned by  
socket. The Fusion GUI tools can be used for socket addressing. Pre-programming can also be done using a  
single device test fixture.  
Copyright © 2011, Texas Instruments Incorporated  
37  
UCD9090  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
www.ti.com  
Table 11. Configuration Options  
Data Flash via JTAG  
Data Flash via I2C  
PMBus Commands via I2C  
Data Flash Export (.srec or hex  
type file)  
Data Flash Export (.svf type file)  
Dedicated programmer  
Project file I2C/PMBus script  
Off-Board Configuration  
On-Board Configuration  
Fusion tools (with exclusive bus  
access via USB to I2C adapter)  
Fusion tools (with exclusive bus  
access via USB to I2C adapter)  
Data flash export  
IC  
Fusion tools (with exclusive bus  
access via USB to I2C adapter)  
Fusion tools (with exclusive bus  
access via USB to I2C adapter)  
The advantages of off-board configuration include:  
Does not require access to device I2C bus on board.  
Once soldered on board, full board power is available without further configuration.  
Can be partially reconfigured once the device is mounted.  
Full Configuration Update while in Normal Mode  
Although performing a full configuration of the UCD9090 in a controlled test setup is recommended, there may be  
times in which it is required to update the configuration while the device is in an operating system. Updating the  
full configuration based on methods listed in DEVICE CONFIGURATION AND PROGRAMMING section while  
the device is in an operating system can be challenging because these methods do not permit the UCD9090 to  
operate as required by application during the programming. During described methods the GPIOs may not be in  
the desired states which can disable rails that provide power to the UCD9090. To overcome this, the UCD9090  
has the capability to allow full configuration update while still operating in normal mode.  
Updating the full configuration while in normal mode will consist of disabling data flash write protection, erasing  
the data flash, writing the data flash image and reset the device. It is not required to reset the device immediately  
but make note that the UCD9090 will continue to operate based on previous configuration with fault logging  
disabled until reset. See Configuration Programming of UCD Devices, available from the Documentation & Help  
Center that can be selected from the Fusion GUI Help menu, for details.  
JTAG INTERFACE  
The JTAG port can be used for production programming. Four of the six JTAG pins can also be used as GPIOs  
during normal operation. See the Pin Functions table at the beginning of the document and Table 4 for a list of  
the JTAG signals and which can be used as GPIOs. The JTAG port is compatible with the IEEE Standard  
1149.1-1990, IEEE Standard Test-Access Port and Boundary Scan Architecture specification. Boundary scan is  
not supported on this device. The UCD9090 runs at 10% slower frequency while the JTAG is enabled to ensure  
best JTAG operation.  
The JTAG interface can provide an alternate interface for programming the device. It is disabled by default in  
order to enable the GPIO pins with which it is multiplexed. There are two conditions under which the JTAG  
interface is enabled:  
1. On power-up if the data flash is blank, allowing JTAG to be used for writing the configuration parameters to a  
programmed device with no PMBus interaction  
2. When address 126 (0x7E) is detected at power up. A short to ground or an open condition on either address  
pin will cause an address 126 (0x7E) to be generated which enables JTAG mode.  
The Fusion GUI can create SVF files (See DEVICE CONFIGURATION AND PROGRAMMING section) based on  
a given data flash configuration which can be used to program the desired configuration by JTAG. For Boundary  
Scan Description Language (BSDL) file that supports the UCD9090 see the product folder in www.ti.com.  
INTERNAL FAULT MANAGEMENT AND MEMORY ERROR CORRECTION (ECC)  
The UCD9090 verifies the firmware checksum at each power up. If it does not match, then the device waits for  
I2C commands but does not execute the firmware. A device configuration checksum verification is also  
performed at power up. If it does not match, the factory default configuration is loaded. The PMBALERT# pin is  
asserted and a flag is set in the status register. The error-log checksum validates the contents of the error log to  
make sure that section of flash is not corrupted.  
38  
Copyright © 2011, Texas Instruments Incorporated  
UCD9090  
www.ti.com  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
There is an internal firmware watchdog timer. If it times out, the device resets so that if the firmware program is  
corrupted, the device goes back to a known state. This is a normal device reset, so all of the GPIO pins are  
open-drain and the FPWM pins are driven low while the device is in reset. Checks are also done on each  
parameter that is passed, to make sure it falls within the acceptable range.  
Error-correcting code (ECC) is used to improve data integrity and provide high-reliability storage of Data Flash  
contents. ECC uses dedicated hardware to generate extra check bits for the user data as it is written into the  
Flash memory. This adds an additional six bits to each 32-bit memory word stored into the Flash array. These  
extra check bits, along with the hardware ECC algorithm, allow for any single-bit error to be detected and  
corrected when the Data Flash is read.  
Copyright © 2011, Texas Instruments Incorporated  
39  
UCD9090  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
www.ti.com  
APPLICATION INFORMATION  
12V  
12V OUT  
TEMP12V  
TEMP IC  
3.3V  
Supply  
I12V  
INA196  
12V OUT  
VIN  
5V OUT  
VOUT  
GPIO1  
/EN  
VMON1  
VMON2  
VMON3  
VMON4  
VMON5  
VMON6  
VMON7  
VMON8  
VMON9  
VMON10  
DC-DC 1  
VFB  
5V OUT  
3.3V OUT  
2.5V OUT  
VIN  
3.3V OUT  
VOUT  
GPIO2  
GPIO3  
GPIO4  
/EN  
DC-DC 2  
VFB  
1.8V OUT  
0.8V OUT  
I0.8V  
VIN  
TEMP0.8V  
I12V  
2.5V OUT  
VOUT  
/EN  
DC-DC 3  
GPIO5  
TEMP12V  
VIN  
VFB  
1.8V OUT  
/EN VOUT  
LDO1  
TEMP0.8V  
UCD9090  
TEMP IC  
WDI from main  
processor  
GPI1  
0.8V OUT  
VIN  
VOUT  
GPIO6  
/EN  
DC-DC 4  
GPIO18  
GPIO12  
GPIO13  
GPIO14  
GPIO17  
WDO  
VFB  
POWER_GOOD  
I0.8V  
INA196  
Vmarg  
2MHz  
WARN_OC_0.8V_  
OR_12V  
FPWM5  
Closed Loop  
Margining  
SYSTEM RESET  
OTHER  
SEQUENCER DONE  
(CASCADE INPUT)  
I2C/  
PMBUS  
JTAG  
Figure 30. Typical Application Schematic  
NOTE  
Figure 30 is a simplified application schematic. Voltage dividers such as the ones placed  
on VMON1 input have been omitted for simplifying the schematic. All VMONx pins which  
are configured to measure a voltage that exceeds the 2.5V ADC reference are required to  
have a voltage divider.  
40  
Copyright © 2011, Texas Instruments Incorporated  
 
UCD9090  
www.ti.com  
SLVSA30A APRIL 2011REVISED AUGUST 2011  
Layout Guidelines  
The thermal pad provides a thermal and mechanical interface between the device and the printed circuit board  
(PCB). Connect the exposed thermal pad of the PCB to the device VSS pins and provide at least a 4 × 4 pattern  
of PCB vias to connect the thermal pad and VSS pins to the circuit ground on other PCB layers.  
For supply-voltage decoupling, provide power-supply pin bypass to the device as follows:  
0.1-μF, X7R ceramic in parallel with 0.01-μF, X7R ceramic at pin 35 (BPCAP)  
0.1-μF, X7R ceramic in parallel with 4.7-μF, X5R ceramic at pin 33 (V33D  
0.1-μF, X7R ceramic in parallel with 4.7-μF, X5R ceramic at pin 34 (V33A  
)
)
Depending on use and application of the various GPIO signals used as digital outputs, some impedance control  
may be desired to quiet fast signal edges. For example, when using the FPWM pins for fan control or voltage  
margining, the pin is configured as a digital clock signal. Route these signals away from sensitive analog signals.  
It is also good design practice to provide a series impedance of 20 Ω to 33 Ω at the signal source to slow fast  
digital edges.  
Estimating ADC Reporting Accuracy  
The UCD9090 uses a 12-bit ADC and an internal 2.5-V reference (VREF) to convert MON pin inputs into digitally  
reported voltages. The least significant bit (LSB) value is VLSB = VREF/2N where N = 12, resulting in a VLSB = 610  
μV. The error in the reported voltage is a function of the ADC linearity errors and any variations in VREF. The  
total unadjusted error (ETUE) for the UCD9090 ADC is ±5 LSB, and the variation of VREF is ±0.5% between 0°C  
and 125°C and ±1% between 40°C and 125°C. VTUE is calculated as VLSB × ETUE. The total reported voltage  
error is the sum of the reference-voltage error and VTUE. At lower monitored voltages, VTUE dominates reported  
error, whereas at higher monitored voltages, the tolerance of VREF dominates the reported error. Reported error  
can be calculated using Equation 3, where REFTOL is the tolerance of VREF, VACT is the actual voltage being  
monitored at the MON pin, and VREF is the nominal voltage of the ADC reference.  
æ
ç
è
ö
÷
ø
V
REF ´ETUE  
1+REFTOL  
æ
ö
RPTERR  
=
´
+ VACT -1  
ç
÷
VACT  
4096  
è
ø
(3)  
From Equation 3, for temperatures between 0°C and 125°C, if VACT = 0.5 V, then RPTERR = 1.11%. If VACT = 2.2  
V, then RPTERR = 0.64%. For the full operating temperature range of 40°C to 125°C, if VACT = 0.5 V, then  
RPTERR = 1.62%. If VACT = 2.2 V, then RPTERR = 1.14%.  
SPACER  
Copyright © 2011, Texas Instruments Incorporated  
41  
 
PACKAGE OPTION ADDENDUM  
www.ti.com  
20-Aug-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
UCD9090RGZR  
UCD9090RGZT  
ACTIVE  
ACTIVE  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-3-260C-168 HR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
18-Aug-2011  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
UCD9090RGZR  
UCD9090RGZT  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
330.0  
180.0  
16.4  
16.4  
7.3  
7.3  
7.3  
7.3  
1.5  
1.5  
12.0  
12.0  
16.0  
16.0  
Q2  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
18-Aug-2011  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
UCD9090RGZR  
UCD9090RGZT  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500  
250  
346.0  
190.5  
346.0  
212.7  
33.0  
31.8  
Pack Materials-Page 2  
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