V62/07635-02XE [TI]
增强型产品毫微功耗高速单路比较器 | D | 8 | -55 to 125;
| 型号： | V62/07635-02XE |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 增强型产品毫微功耗高速单路比较器 | D | 8 | -55 to 125 比较器 |
| 文件： | 总14页 (文件大小：526K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLV3491A-EP, TLV3492A-EP, TLV3494A-EP
www.ti.com
SGDS035–DECEMBER 2007
1.8 V, NANOPOWER,
PUSH/PULL OUTPUT COMPARATORS
1
FEATURES
APPLICATIONS
•
•
•
•
•
Portable Medical Equipment
Wireless Security Systems
Remote Control Systems
Handheld Instruments
•
Very Low Supply Current: 0.8 µA (Typical)
•
Input Common Mode Range 200 mV Beyond
Supply Rails
•
•
•
•
Supply Voltage: 1.8 V to 5.5 V
High Speed: 6 µs
Ultra-Low Power Systems
Push/Pull CMOS Output Stage
Controlled Baseline
DESCRIPTION/ORDERING INFORMATION
The TLV349x family of push/pull output comparators
features a fast 6µs response time and <1.2 µA (max)
nanopower capability, allowing operation from 1.8 V
to 5.5 V. Input common-mode range beyond supply
rails make the TLV349x an ideal choice for
low-voltage applications.
–
One Assembly/Test Site, One Fabrication
Site
•
•
Extended Temperature Performance of –55°C
to 125°C
Enhanced Diminishing Manufacturing Sources
(DMS) Support
The TLV349x is excellent for power-sensitive,
low-voltage (2-cell) applications.
•
•
Enhanced Product Change Notification
Qualification Pedigree
TLV349x RELATED PRODUCTS
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification testing
should not be viewed as justifying use of this component beyond
specified performance and environmental limits.
PRODUCT
FEATURES
550 nA, 2.5 V to 16 V, Push-Pull CMOS
Output Stage Comparator
TLV370x
550 nA, 2.5 V to 16 V, Open-Drain Output
Stage Comparator
TLV340x
ORDERING INFORMATION(1)
SPECIFIED
PACKAGE
TEMPERATURE
MARKING
PACKAGE-
LEAD
PACKAGE
ORDERABLE
PART NUMBER
TRANSPORT MEDIA,
QUANTITY
PRODUCT
DESIGNATOR(2)
RANGE
TLV3491
TLV3492
TLV3494
SO-8
SO-8
D
D
D
–55°C to 125°C
–55°C to 125°C
–55°C to 125°C
3491EP
3492EP
3494EP
TLV3491AMDREP(3) Tape and Reel, 2500
TLV3492AMDREP Tape and Reel, 2500
TLV3494AMDREP(3) Tape and Reel, 2500
SO-14
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) Prouct Preview. Contact your Texas Instruments Sales Representative for availability.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2007, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TLV3491A-EP, TLV3492A-EP, TLV3494A-EP
www.ti.com
SGDS035–DECEMBER 2007
ABSOLUTE MAXIMUM RATINGS(1)
VALUE
UNIT
V
Supply Voltage
5.5
(V–) – 0.5 to (V+) + 0.5
±10
Voltage(2)
Current(2)
V
Signal Input Terminals
mA
Output Short-Circuit(3)
Continuous
–55 to 125
–65 to 150
150
Operating Temperature
°C
°C
°C
°C
V
Storage Temperature
Junction Temperature
Lead Temperature (soldering, 10s)
ESD Rating (Human Body Model)
300
3000
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short-circuit to ground, one amplifier per package.
PIN CONFIGURATIONS
-In A
-In D
-In A
-In
V-
TLV3492
-In B
V-
V-
-In C
-In B
2
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TLV3491A-EP TLV3492A-EP TLV3494A-EP
TLV3491A-EP, TLV3492A-EP, TLV3494A-EP
www.ti.com
SGDS035–DECEMBER 2007
ELECTRICAL CHARACTERISTICS
At TA = 25°C, and VS = 1.8 V to 5.5 V, unless otherwise noted.
(1)
PARAMETER
OFFSET VOLTAGE
TEST CONDITIONS
TA
MIN
TYP
MAX
UNIT
25°C
±3
±15
±25
Input Offset Voltage
vs Temperature
VOS
VCM = 0V, IO = 0mA
mV
Full Range
dVOS/dT TA = –55°C to 125°C
±12
350
µV/°C
µV/V
25°C
1000
1600
vs Power Supply
PSRR
VS = 1.8 V to 5.5 V
Full Range
INPUT BIAS CURRENT
Input Bias Current
25°C
Full Range
25°C
±1
±1
±50
±1600
±50
IB
VCM = VCC/2
VCM = VCC/2
pA
pA
Input Offset Current
IOS
Full Range
±200
INPUT VOLTAGE RANGE
Common-Mode Voltage Range VCM
(V–) – 0.2
(V+) + 0.2
V
25°C
Full Range
25°C
60
55
54
50
74
62
VCM = –0.2 V to (V+) – 1.5 V
VCM = –0.2 V to (V+) + 0.2 V
Common-Mode Rejection Ratio CMRR
dB
Full Range
INPUT CAPACITANCE
Common-Mode
2
4
pF
pF
Differential
SWITCHING CHARACTERISTICS
Input Overdrive = 10 mV
Input Overdrive = 100 mV
12
6
µs
µs
µs
µs
ns
ns
Propagation Delay Time,
t(PLH)
f = 10 kHz,
VSTEP = 1 V
Low-to-High
Input Overdrive = 10 mV
Input Overdrive = 100 mV
13.5
6.5
Propagation Delay Time,
t(PHL)
f = 10 kHz,
VSTEP = 1 V
High-to-Low
Rise Time
tR
tF
CL = 10 pF
CL = 10 pF
100
100
Fall Time
OUTPUT
Voltage Output High from Rail
Voltage Output Low from Rail
Short-Circuit Current
POWER SUPPLY
Specified Voltage Range
VOH
VOL
ISC
VS = 5 V, IOUT = -5 mA
VS = 5 V, IOUT = 5 mA
Full Range
Full Range
90
300
300
mV
mV
160
See Typical Characteristics
VS
IQ
1.8
5.5
1.2
2.1
V
25°C
0.85
Quiescent Current(2)
Vs = 5.5 V, VO = High
µA
Full Range
TEMPERATURE RANGE
Specified Range
Storage Range
Thermal Resistance, θJA
SO-8
TA
–55
–65
125
150
°C
°C
165
133
°C/W
°C/W
SO-14
(1) Full Range is -55°C to 125°C.
(2) IQ per channel.
Copyright © 2007, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TLV3491A-EP TLV3492A-EP TLV3494A-EP
TLV3491A-EP, TLV3492A-EP, TLV3494A-EP
www.ti.com
SGDS035–DECEMBER 2007
TYPICAL CHARACTERISTICS
At TA = 25°C, VS = 1.8 V to 5.5 V, and Input Overdrive = 100 mV, unless otherwise noted.
QUIESCENT CURRENT vs TEMPERATURE
QUIESCENT CURRENT
1.00
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
vs OUTPUT SWITCHING FREQUENCY
12
10
8
VDD = 3 V
VS = 5 V
VDD = 5 V
VDD = 1.8 V
6
4
VS = 3 V
2
VS = 1.8 V
0
–50
–25
0
25
50
75
100
125
1
10
100
1k
10k
100k
Temperature ( °C)
Output Transition Frequency (Hz)
SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE
INPUT BIAS CURRENT vs TEMPERATURE
140
120
100
80
45
40
35
30
25
20
15
10
5
Sink
60
Source
40
20
0
0
–5
1.5
2
2.5
3
3.5
4
4.5
5
5.5
–50
–25
0
25
50
75
100
125
Supply Voltage (V)
Temperature ( °C)
OUTPUT LOW vs OUTPUT CURRENT
OUTPUT HIGH vs OUTPUT CURRENT
VDD = 3 V
0.25
0.2
0.25
0.2
VDD = 1.8 V
VDD = 3 V
VDD = 1.8 V
0.15
0.1
0.15
0.1
VDD = 5 V
VDD = 5 V
0.05
0
0.05
0
0
2
4
6
8
10
12
0
2
4
6
8
10
12
Output Current (mA)
Output Current (mA)
4
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TLV3491A-EP TLV3492A-EP TLV3494A-EP
TLV3491A-EP, TLV3492A-EP, TLV3494A-EP
www.ti.com
SGDS035–DECEMBER 2007
TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, VS = 1.8 V to 5.5 V, and Input Overdrive = 100 mV, unless otherwise noted.
PROPAGATION DELAY (t PLH) vs CAPACITIVE LOAD
PROPAGATION DELAY (t PHL) vs CAPACITIVE LOAD
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
VDD = 3 V
VDD = 5 V
VDD = 3 V
VDD = 5 V
VDD = 1.8 V
VDD = 1.8 V
0.01
0.1
1
10
Capacitive Load (nF)
PROPAGATION DELAY (t PLH) vs INPUT OVERDRIVE
100
1k
0.01
0.1
1
10
100
1k
Capacitive Load (nF)
PROPAGATION DELAY (t PHL) vs INPUT OVERDRIVE
20
18
16
14
12
10
8
20
18
16
14
12
10
8
VDD = 5 V
VDD = 1.8 V
VDD = 3 V
VDD = 1.8 V
VDD = 3 V
6
6
VDD = 5 V
4
4
0
10
20
30
40
50 60
70
80
90 100
0
10
20
30
40
50 60
70
80
90 100
Input Overdrive (mV)
Input Overdrive (mV)
PROPAGATION DELAY (t PLH) vs TEMPERATURE
PROPAGATION DELAY (t PHL) vs TEMPERATURE
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
VDD = 1.8 V
VDD = 3 V
VDD = 1.8 V
VDD = 3 V
VDD = 5 V
VDD = 5 V
–50
–25
0
25
50
75
100
125
–50
–25
0
25
50
75
100
125
Temperature (° C)
Temperature ( °C)
Copyright © 2007, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TLV3491A-EP TLV3492A-EP TLV3494A-EP
TLV3491A-EP, TLV3492A-EP, TLV3494A-EP
www.ti.com
SGDS035–DECEMBER 2007
TYPICAL CHARACTERISTICS (continued)
At TA = 25°C, VS = 1.8 V to 5.5 V, and Input Overdrive = 100 mV, unless otherwise noted.
PROPAGATION DELAY (t PLH
)
PROPAGATION DELAY (t PHL)
VDD
=
2.5 V
VDD
=
2.5 V
VIN+
VIN–
VIN–
VIN+
VOUT
VOUT
2 µs/div
2 µs/div
PROPAGATION DELAY (t PHL
)
PROPAGATION DELAY (t PLH
)
VIN+
VDD
= 0.9 V
VDD
=
0.9 V
VIN–
VIN–
VIN+
VOUT
VOUT
2 µs/div
2 µs/div
6
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TLV3491A-EP TLV3492A-EP TLV3494A-EP
TLV3491A-EP, TLV3492A-EP, TLV3494A-EP
www.ti.com
SGDS035–DECEMBER 2007
APPLICATION INFORMATION
The TLV349x family of comparators features rail-to-rail input and output on supply voltages as low as 1.8 V. The
push/pull output stage is optimal for reduced power budget applications and features no shoot-through current.
Low supply voltages, common-mode input range beyond supply rails, and a typical supply current of 0.8 µA
make the TLV349x family an excellent candidate for battery-powered applications with single-cell operation.
BOARD LAYOUT
Figure 1 shows the typical connections for the TLV349x. To minimize supply noise, power supplies should be
capacitively decoupled by a 0.01 µF ceramic capacitor in parallel with a 10 µF electrolytic capacitor. Comparators
are very sensitive to input noise. Proper grounding (use of ground plane) will help maintain specified
performance of the TLV349x family.
V+
0.01 µF
10 µF
VIN
TLV3492
VOUT
VREF
Figure 1. Basic Connections of the TLV3492
SETTING REFERENCE VOLTAGE
It is important to use a stable reference when setting the transition point for the TLV349x. The REF1004 provides
a 1.25-V reference voltage with low drift and only 8 µA of quiescent current.
EXTERNAL HYSTERESIS
Comparator inputs have no noise immunity within the range of specified offset voltage (±15 mV). For noisy input
signals, the comparator output may display multiple switching as input signals move through the switching
threshold. The typical comparator threshold of the TLV349x is ±15 mV. To prevent multiple switching within the
comparator threshold of the TLV349x, external hysteresis may be added by connecting a small amount of
feedback to the positive input. Figure 2 shows a typical topology used to introduce hysteresis, described by the
equation:
+
V
´R1
V
=
HYST
R + R
1
2
VHYST will set the value of the transition voltage required to switch the comparator output by increasing the
threshold region, thereby reducing sensitivity to noise.
V+
VHYST = 0.38 V
5 V
VIN
TLV3492
VOUT
R2
560 kΩ
R1
39 kΩ
VREF
Figure 2. Adding Hysteresis to the TLV3492
Copyright © 2007, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): TLV3491A-EP TLV3492A-EP TLV3494A-EP
TLV3491A-EP, TLV3492A-EP, TLV3494A-EP
www.ti.com
SGDS035–DECEMBER 2007
RELAXATION OSCILLATOR
The TLV3492 can be configured as a relaxation oscillator to provide a simple and inexpensive clock output (see
Figure 3). The capacitor is charged at a rate of 0.69 RC. It also discharges at a rate of 0.69 RC. Therefore, the
period is 1.38 RC. R1 may be a different value than R2.
VC
2/3 (V+)
1/3 (V+)
t
T1 T2
V+
V+
C
R1
1000 pF
1 MΩ
VOUT
t
R2
R2
F = 724 Hz
1 MΩ
1 MΩ
V+
R2
1 MΩ
Figure 3. TLV3492 Configured as a Relaxation Oscillator
POWER-ON RESET
The reset circuit shown in Figure 4 provides a time delayed release of reset to the MSP430 microcontroller.
Operation of the circuit is based on a stabilization time constant of the supply voltage, rather than on a
predetermined voltage value. The negative input is a reference voltage created by a simple resistor divider.
These resistor values should be relatively high to reduce the current consumption of the circuit. The positive input
is an RC circuit that provides a power-up delay. When power is applied, the output of the comparator is low,
holding the processor in the reset condition. Only after allowing time for the supply voltage to stabilize does the
positive input of the comparator become higher than the negative input, resulting in a high output state and
releasing the processor for operation. The stabilization time required for the supply voltage is adjustable by the
selection of the RC component values. Use of a lower-valued resistor in this portion of the circuit will not increase
current consumption because no current flows through the RC circuit after the supply has stabilized. The reset
delay time needed depends on the power-up characteristics of the system power supply. R1 and C1 are selected
to allow enough time for the power supply to stabilize. D1 provides rapid reset if power is lost. In this example,
the R1 • C1 time constant is 10 ms.
V+
R1
1 MΩ
MSP430
C1
RESET
TLV3492
10 nF
R2
2 MΩ
R3
2 MΩ
Figure 4. The TLV349x Configured as a Reset Circuit for the MSP430.
8
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TLV3491A-EP TLV3492A-EP TLV3494A-EP
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jan-2008
PACKAGING INFORMATION
Orderable Device
TLV3492AMDREP
V62/07635-01XE
Status (1)
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
8
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TLV3492AMDREP
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Aug-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOIC
SPQ
Length (mm) Width (mm) Height (mm)
340.5 338.1 20.6
TLV3492AMDREP
D
8
2500
Pack Materials-Page 2
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