V62/13622-01XE [TI]

支持 4 位、6 位或 8 位 VID 的数字 PWM 系统控制器,UCD9222-EP | RGZ | 48 | -55 to 115;
V62/13622-01XE
型号: V62/13622-01XE
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

支持 4 位、6 位或 8 位 VID 的数字 PWM 系统控制器,UCD9222-EP | RGZ | 48 | -55 to 115

控制器 CD 开关
文件: 总35页 (文件大小:2457K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
具有 4 位,6 位 或 8 位电压识别 (VID) 支持的数字脉宽调制 (PWM) 系统控  
制器  
查询样片: UCD9222-EP  
1
特性  
2
完全可配置双输出非隔离直流/直流 PWM 控制器,  
此控制器支持 TMS320C6670™ 和  
TMS320C6678™ 数字信号处理器 (DSP) VID 接口  
支持纠错码 (ECC) 的增强型非易失性存储器  
由具有一个内部稳压器控制器的单电源供电运行的  
器件可实现宽电源电压范围内的运行  
支持高达 2MHz 的开关频率,此时占空比分辨率为  
250ps  
Fusion Digital Power™ 设计工具,一个基于  
全功能 PC 的设计工具提供支持,以模拟、配置和  
监控电源性能  
高达 1mV 的闭环分辨率  
用于改进瞬态性能的具有非线性增益的硬件加  
速,3 / 3 零补偿器  
应用范围  
网络设备  
支持多个包含预偏置启动的软启动和软停止配置  
支持电压裕度和定序  
电信设备  
现场可编程门阵列 (FPGA)DSP 和存储器电源  
同步输入/输出引脚使多个 UCD92xx 器件之间的  
DPWM 时钟保持一致  
支持国防、航空航天、和医疗应用  
电源参数的 12 位数字监控包括:  
受控基线  
输入电流和电压  
同一组装和测试场所  
同一制造场所  
输出电流和电压  
每个功率级上的温度  
辅助模数转换器 (ADC) 输入  
在扩展(-55°C 115°C)温度范围内可用  
延长的产品生命周期  
延长的产品变更通知  
产品可追溯性  
多电平过流故障保护:  
外部电流故障输入  
模拟比较器监控电流感测电压  
被持续数字监控的电流  
过压和欠压故障保护  
过热故障保护  
说明  
UCD9222 是一款设计用于非隔离式直流/直流电源应用的双轨同步降压数字 PWM 控制器。 这个器件集成了用于直  
/直流环路管理的专用电路,支持多达两个 VID 接口。 此外,UCS9222 具有闪存存储器和一个串口以支持可配  
置性、监控和管理。  
支持几个电压识别 (VID) 模式,其中包括一个 4 位并口,一个 6 位接口和一个 8 位串口。  
UCD9222 被设计用于提供针对非隔离式直流/直流转换器应用的多种所需特性,与此同时,通过减少外部电路来最  
大限度地减少总体系统组件数量。 此解决方案集成具有定序、裕度和跟踪的多环路管理,以针对总体系统效率进行  
优化。 此外,在无需添加额外组件的情况下,支持环路补偿和校准。  
为了简化器件配置,提供德州仪器 (TI) Fusion Digital Power™ 设计工具。 这个基于 PC 的图形用户界面为该器件  
提供了一个直观的界面。 这个工具使得设计人员能够为应用配置系统运行参数、将配置存储至片上非易失性存储器  
并且观察每个功率级输出的频域和时域仿真。  
TI 还开发了多个互补功率级解决方案 - UCD7k 系列中的离散驱动器到 PTD 系列中经完全测试的电源传动模  
块。 这些解决方案已被开发用于为 UCD92xx 系列系统电源控制器提供补充。  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
TMS320C6670, TMS320C6678, Fusion Digital Power, Auto-ID are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2013, Texas Instruments Incorporated  
English Data Sheet: SLVSBY1  
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ORDERING INFORMATION  
OPERATING TEMPERATURE  
RANGE, TJ  
ORDERABLE PART  
NUMBER  
PIN  
COUNT  
TOP SIDE  
MARKING  
SUPPLY  
PACKAGE  
VID NUMBER  
–55°C to 115°C  
UCD9222WRGZREP  
48-pin  
Reel of 2500  
QFN  
UCD9222EP  
V62/13622-01XE  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
–0.3 to 3.8  
UNIT  
V
Voltage applied at V33D to DGND  
Voltage applied at V33A to AGND  
Voltage applied to any pin(2)  
–0.3 to 3.8  
–0.3 to 3.8  
–55 to 150  
V
V
Storage temperature (TSTG  
)
°C  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages referenced to GND.  
RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
MIN NOM  
MAX UNIT  
V
Supply voltage during operation, V33D, V33DIO, V33A  
Operating junction temperature range  
Maximum junction temperature  
3
3.3  
3.6  
115  
125  
V
TJ  
–55  
°C  
°C  
THERMAL INFORMATION  
UCD9222-EP  
RGZ  
THERMAL METRIC(1)  
UNITS  
48 PINS  
27.1  
θJA  
Junction-to-ambient thermal resistance(2)  
Junction-to-case (top) thermal resistance(3)  
Junction-to-board thermal resistance(4)  
θJCtop  
θJB  
12.9  
4.3  
°C/W  
ψJT  
Junction-to-top characterization parameter(5)  
Junction-to-board characterization parameter(6)  
Junction-to-case (bottom) thermal resistance(7)  
0.2  
ψJB  
4.3  
θJCbot  
0.6  
(1) 有关传统和全新热度量的更多信息,请参阅 IC 封装热度量 应用报告 (文献号:ZHCA543。  
(2) JESD51-2a 描述的环境中,按照 JESD51-7 的规定,在一个 JEDEC 标准高 K 电路板上进行仿真,从而获得自然对流条件下的结至环  
境热阻抗。  
(3) 通过在封装顶部模拟一个冷板测试来获得结至芯片外壳(顶部)的热阻。 不存在特定的 JEDEC 标准测试,但可在 ANSI SEMI 标准 G30-  
88 中找到内容接近的说明。  
(4) 按照 JESD51-8 中的说明,通过在配有用于控制 PCB 温度的环形冷板夹具的环境中进行仿真,以获得结至电路板的热阻。  
(5) 结至顶部的特征参数,( ψJT),估算真实系统中器件的结温,并使用 JESD51-2a(第 6 章和第 7 章)中描述的程序从仿真数据中提取出该  
参数以便获得 θJA  
(6) 结至电路板的特征参数,(ψJB),估算真实系统中器件的结温,并使用 JESD51-2a(第 6 章和第7 章)中描述的程序从仿真数据中提取出该  
参数以便获得 θJA  
(7) 通过在外露(电源)焊盘上进行冷板测试仿真来获得结至芯片外壳(底部)热阻。 不存在特定的 JEDEC 标准测试,但可在 ANSI SEMI  
标准 G30-88 中找到了内容接近的说明。  
间距  
2
Copyright © 2013, Texas Instruments Incorporated  
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
ELECTRICAL CHARACTERISTICS  
over operating junction temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
NOM  
MAX UNIT  
SUPPLY CURRENT  
IV33  
Total V33 supply current,  
V33A = V33DIO = 3.3 V  
54  
80  
mA  
IV33DIO  
IV33A  
V33DIO = 3.3 V  
V33A = 3.3 V  
42  
8
55  
15  
65  
mA  
mA  
mA  
Supply current  
IV33DIO  
V33DIO = 3.3 V storing configuration  
parameters in flash memory  
52  
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS  
V33  
3.3-V linear regulator  
Emitter of NPN transistor  
3.25  
3.3  
4
3.6  
4.6  
8
V
V
V33FB  
IV33FB  
Beta  
3.3-V linear regulator feedback  
Series pass base drive  
Series NPN pass device  
VIN = 12 V  
0.2  
40  
0.4  
100  
mA  
EXTERNALLY SUPPLIED 3.3 V POWER  
V33D, V33DIO1  
V33DIO2  
,
Digital 3.3-V power  
TJ = 25°C  
TJ = 25°C  
3.0  
3.0  
3.6  
3.6  
V
V
V33A  
Analog 3.3-V power  
ERROR AMPLIFIER INPUTS EAPn, EANn  
VCM  
Common mode voltage each pin  
0
1.8  
V
VERROR  
EAP-EAN  
REA  
Internal error voltage range  
Error voltage digital resolution  
Input impedance  
AFE_GAIN field of CLA_GAINS = 1X(1)  
AFE_GAIN field of CLA_Gains = 8X  
Ground reference, TJ = 25°C  
–256  
248  
mV  
mV  
MΩ  
µA  
1
1.5  
IOFFSET  
Vref 10-bit DAC  
Vref  
Input offset current  
1 ksource impedance, TJ = 25°C  
–5  
0
5
Reference voltage setpoint  
Reference voltage resolution  
1.7  
V
Vrefres  
1.56  
mV  
ANALOG INPUTS CS1A, CS2A, VinMon, IinMon, Vtrack, Temp1, Temp2, Addr0, Addr1  
VADC_RANGE  
Measurement range for voltage  
monitoring  
Inputs: VinMon, IinMon, Vtrack, Temp1,  
Temp2, CS1A, CS2A  
0
2.6  
V
Voffset  
input offset voltage  
–27  
27  
2
mV  
V
VOC_THRS  
Over-current comparator threshold Inputs: CS1A, CS2A  
voltage range(2)  
0.032  
VOC_RES  
Over-current comparator threshold Inputs: CS1A, CS2A  
voltage range  
31.25  
mV  
°C  
Tempinternal  
Internal temperature sense  
accuracy  
Over range from 0°C to 100°C  
–15  
15  
INL  
Ilkg  
ADC integral nonlinearity  
Input leakage current  
TJ = -40°C to 115°C  
3 V applied to pin  
Ground reference  
–2.5  
2.5  
mV  
nA  
100  
RIN  
CIN  
Input impedance  
8
MΩ  
pF  
Current sense input capacitance  
10  
(1) See the UCD92xx PMBus Command Reference for the description of the AFE_GAIN field of CLA_GAINS command.  
(2) Can be disabled by setting to '0'  
Copyright © 2013, Texas Instruments Incorporated  
3
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
ELECTRICAL CHARACTERISTICS (Continued)  
over operating junction temperature range (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
NOM  
MAX  
UNIT  
DIGITAL INPUTS/OUTPUTS  
Dgnd  
+0.3  
VOL  
VOH  
Low-level output voltage  
High-level output voltage  
IOL = 6 mA(1), V33DIO = 3 V  
IOH = -6 mA(2), V33DIO = 3 V  
V
V
V33DIO  
–0.6V  
VIH  
VIL  
High-level input voltage  
Low-level input voltage  
V33DIO = 3V  
2.1  
3.6  
1.4  
V
V
V33DIO = 3.5 V  
SYSTEM PERFORMANCE  
VRESET Voltage where device comes out of reset  
tRESET  
V33D Pin  
2.3  
2
2.4  
10  
V
Pulse width needed for reset  
Setpoint reference accuracy  
nRESET pin  
µs  
Vref commanded to be 1V, at 25°C AFEgain = 4,  
1V input to EAP/N measured at output of the  
EADC(3)  
–10  
mV  
VRefAcc  
Setpoint reference accuracy over  
temperature  
–55°C to 115°C  
–40  
–4  
40  
4
mV  
mV  
AFEgain = 4 compared to  
AFEgain = 1, 2, or 8  
VDiffOffset  
Differential offset between gain settings  
Digital compensator delay  
240 + 1  
switching  
cycle  
tDelay  
FSW  
240  
ns  
Switching frequency  
Accuracy  
15.260  
–5%  
0%  
2000  
5%  
kHz  
Duty  
Maximum and minimum duty cycle  
100%  
V33 slew rate between 2.3V and 2.9V,TJ = -40°C  
to 115°C  
V33Slew  
tretention  
Minimum V33 slew rate  
0.25  
V/ms  
Retention of configuration parameters(4)  
TJ = 25 °C  
100  
20  
Years  
Write_Cycles Number of nonvolatile erase/write cycles  
TJ = 25 °C  
K cycles  
All rails configured to accept 4-bit VID messages(5)  
All rails configured to accept 6-bit VID messages(5)  
All rails configured to accept 8-bit VID messages(6)  
1
4
4
RateVID  
Max VID message rate  
msg/msec  
(1) The maximum IOL, for all outputs combined, should not exceed 12 mA to hold the maximum voltage drop specified.  
(2) The maximum IOH, for all outputs combined, should not exceed 48 mA to hold the maximum voltage drop specified.  
(3) With default device calibration. PMBus calibration can be used to improve the regulation tolerance.  
(4) The data retention specification is based on accelerated stress testing at 170°C for 420 hours and using an Arrhenius model with  
activation energy of 0.6 eV.  
(5) VID message rate on each interface. Measured over a 1.0 msec interval  
(6) VID message rate on PMBus interface.  
4
Copyright © 2013, Texas Instruments Incorporated  
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
ADC MONITORING INTERVALS AND RESPONSE TIMES  
The ADC operates in a continuous conversion sequence that measures each rail's output voltage and output  
current, plus six other variables (input voltage, input current, internal temperature, tracking source, and two  
external temperature sensors). The length of the sequence is determined by the number of output rails  
(NumRails) configured for use. The time to complete the monitoring sampling sequence is give by the formula:  
tADC_SEQ = tADC × (2 × NumRAILS + 6)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
tADC  
ADC single-sample time  
3.84  
µs  
tADC_SEQ  
ADC sequencer interval Min = 2 × 1 Rail + 6 = 8 samples  
Max = 2 × 2 Rails + 6 = 10 samples  
30.72  
38.40  
µs  
The most recent ADC conversion results are periodically converted into the proper measurement units (volts,  
amperes, degrees), and each measurement is compared to its corresponding fault and warning limits. The  
monitoring operates asynchronously to the ADC, at intervals shown in the table below.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
tVout  
tIout  
Output voltage monitoring interval  
Output current monitoring interval  
Input voltage monitoring interval  
Input current monitoring interval  
Temperature monitoring interval  
Auxiliary ADC monitoring interval  
200  
µs  
µs  
200×NRails  
tVin  
1
1
ms  
ms  
ms  
ms  
tIin  
tTEMP  
tAUXADC  
100  
100  
Because the ADC sequencer and the monitoring comparisons are asynchronous to each other, the response  
time to a fault condition depends on where the event occurs within the monitoring interval and within the ADC  
sequence interval. Once a fault condition is detected, some additional time is required to determine the correct  
action based on the FAULT_RESPONSE code, and then to perform the appropriate response. The following  
table lists the worse-case fault response times.  
MAX  
no VID /w VID  
MAX  
(1)  
PARAMETER  
TEST CONDITIONS  
TYP  
UNIT  
tOVF  
tUVF  
,
,
,
Over-/under-voltage fault response time  
during normal operation  
Normal regulation, no PMBus activity,  
4 stages enabled  
250  
800  
400  
800  
µs  
tOVF  
tUVF  
Over-/under-voltage fault response time, During data logging to nonvolatile  
during data logging  
memory(2)  
1000  
µs  
µs  
µs  
tOVF  
tUVF  
Over-/under-voltage fault response time, During tracking and soft-start ramp.  
when tracking or sequencing enable  
tOCF  
tUCF  
,
Over-/under-current fault response time  
during normal operation  
Normal regulation, no PMBus activity,  
100 +  
(600 × NRails)  
5000  
5000  
4 stages enabled 75% to 125% current  
step(3)  
tOCF  
tUCF  
,
Over-/under-current fault response time, During data logging to nonvolatile  
during data logging  
600 +  
(600 × NRails)  
µs  
sec  
µs  
memory 75% to 125% current step  
tOTF  
Over-temperature fault response time  
Temperature rise of 10°C/sec, at OT  
threshold  
1.60  
5.5  
t3-State Time to tristate the PWM output after a  
shutdown is initiated  
DRIVER_CONFIG = 0x01  
(1) Controller receiving VID commands at a rate of 4000 msg/sec.  
(2) During a STORE_DEFAULT_ALL command, which stores the entire configuration to nonvolatile memory, the fault detection latency can  
be up to 10 ms.  
(3) Because the current measurement is averaged with a smoothing filter, the response time to an over-current condition depends on a  
combination of the time constant (τ) from Table 3, the recent measurement history, and how much the measured value exceeds the  
over-current limit.  
Copyright © 2013, Texas Instruments Incorporated  
5
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
HARDWARE FAULT DETECTION LATENCY  
The controller contains hardware fault detection circuits that are independent of the ADC monitoring sequencer.  
PARAMETER  
TEST CONDITIONS  
High level on FAULT pin  
Step change in CS voltage from 0V to 2.5V  
MAX TIME  
UNIT  
Time to disable DPWM output base on active FAULT pin  
signal  
tFAULT  
tCLF  
18  
µs  
Time to disable the DPWM A output based on internal  
analog comparator  
Switch  
Cycles  
4
PMBUS/SMBUS/I2C  
The timing characteristics and timing diagram for the communications interface that supports I2C, SMBus and  
PMBus are shown below.  
Figure 1. I2C/SMBus/PMBus Timing in Extended Mode Diagram  
I2C/SMBus/PMBus TIMING REQUIREMENTS  
TJ = –55°C to 115°C, 3 V < V33 < 3.6 V, typical values at TJ = 25°C  
PARAMETER  
TEST CONDITIONS  
Slave mode; SMBC 50% duty cycle  
Slave mode; SCL 50% duty cycle  
MIN TYP  
MAX UNIT  
fSMB  
SMBus/PMBus operating frequency  
I C operating frequency  
Bus free time between start and stop  
Hold time after (repeated) start  
Repeated start setup time  
Stop setup time  
10  
10  
5
1000  
1000  
kHz  
kHz  
µs  
fI2C  
t(BUF)  
t(HD:STA)  
t(SU:STA)  
t(SU:STO)  
t(HD:DAT)  
t(SU:DAT)  
t(TIMEOUT)  
t(LOW)  
0.3  
0.3  
0.3  
0
µs  
µs  
µs  
Data hold time  
Receive mode  
ns  
Data setup time  
55  
ns  
(1)  
Error signal/detect  
See  
35  
ms  
µs  
Clock low period  
0.55  
0.3  
(2)  
t(HIGH)  
Clock high period  
See  
50  
25  
µs  
(3)  
t(LOW:SEXT) Cumulative clock low slave extend time See  
tFALL Clock/data fall time  
ms  
ns  
Rise time tRISE = VILMAX – 0.15) to (VIHMIN + 0.15) ,  
TJ = -40°C to 115°C  
1000  
(1) The UCD9222 times out when any clock low exceeds t(TIMEOUT)  
.
(2) t(HIGH) , max, is the minimum bus idle time. SMBC = SMBD = 1 for t > 50 ms causes reset of any transaction involving UCD9222 that is  
in progress.  
(3) t(LOW:SEXT) is the cumulative time a slave device is allowed to extend the clock cycles in one message from initial start to the stop.  
6
Copyright © 2013, Texas Instruments Incorporated  
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
I2C/SMBus/PMBus TIMING REQUIREMENTS (continued)  
TJ = –55°C to 115°C, 3 V < V33 < 3.6 V, typical values at TJ = 25°C  
PARAMETER  
TEST CONDITIONS  
MIN TYP  
MAX UNIT  
tRISE  
CIN  
Clock/data rise time  
Fall time tFALL = 0.9 V33 to (VILMAX – 0.15) , TJ = -  
40°C to 115°C  
1000  
ns  
FUNCTIONAL BLOCK DIAGRAM  
Fusion Power Peripheral 2  
Digital  
High Res  
PWM  
DPWM2A  
FLT2A  
EAp2  
Analog Front End  
(AFE)  
Compensator  
3P/3Z IIR  
EAn2  
Fusion Power Peripheral 1  
Analog Front End  
Compensator  
EAp1  
EAn1  
Diff  
Amp  
Digital  
High Res  
PWM  
DPWM1A  
FLT1A  
Err  
Amp  
ADC  
6 bit  
IIR  
3P/3Z  
Ref  
Coeff.  
Regs  
SyncIn/JTAG_TDI  
SyncOut/JTAG_TDO  
5
6
VID1A  
VID1B  
VID1C  
VID1S  
VID2A  
VID2B  
VID2C  
VID2S  
V33x  
xGnd  
3.3V reg.  
controller  
& 1.8V  
regulator  
Analog Comparators  
BPCap  
VID  
1 - 2  
OC  
Ref 1  
Ref 2  
DPWM1  
ARM-7 core  
Addr0  
Addr1  
OC  
DPWM2  
CS1A  
TCK  
TDI  
Flash  
Memory with  
ECC  
12-bit  
ADC  
260 ksps  
CS2A  
TDO  
TMS  
RCK  
nTRST  
JTAG  
Osc  
VinMon  
IinMon/AuxADC4  
Vtrack/AuxADC3  
Temp2/AuxADC2  
Temp1/AuxADC1  
POR/BOR  
PowerGood  
PG1  
GPIO  
PG2  
EN1  
EN2  
Internal  
Temp Sense  
PMBus_Clk  
PMBus_Data  
PMBus_Alert  
PMBus_Cntrl  
nRESET  
PMBus  
Copyright © 2013, Texas Instruments Incorporated  
7
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
36  
AGND2  
1
IinMon/AuxADC4  
35  
34  
BPCap  
V33A  
2
3
Temp2/AuxADC2  
CS2A  
33  
32  
31  
30  
29  
28  
27  
26  
25  
V33DIO  
DGND3  
4
5
VinMon  
nRESET  
FLT1A  
6
JTAG_nTRST  
JTAG_TMS  
7
VID1S  
SyncIn/JTAG_TDI  
SyncOut/JTAG_TDO  
JTAG_TCK  
EN2  
8
FLT2A  
9
VID2S  
10  
11  
12  
PMBus_CLK  
PMBus_Data  
DPWM1A  
EN1  
(1) In case of conflict between Figure 2 and Table 1 the table shall take precedence  
(2) Preliminary versions of this data sheet prior to June 14, 2010 had a different definition for pins 17, 18, and 21. Board  
designs made with that earlier pinout should be updated.  
Figure 2. Pin Assignment Diagram  
8
Copyright © 2013, Texas Instruments Incorporated  
 
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
Table 1. PIN FUNCTIONS  
PIN NO.  
1
PIN LABEL  
IinMon/AuxADC4  
Temp2/AuxADC2  
CS2A  
DESCRIPTION  
Input current monitor, or Auxiliary ADC input 4  
Temperature sense input for Rail 2, or Auxiliary ADC input 2  
Power stage 2A current sense input and input to analog comparator 2  
Input voltage monitor  
2
3
4
VinMon  
5
nRESET  
FLT1A  
Active low device reset input. Pull up to 3.3V with a 10k ohm resistor  
Fault indicator for stage 1A  
6
7
VID1S  
VID Select pin for Rail 1  
8
FLT2A  
Fault indicator for stage 2A  
9
VID2S  
VID Select pin for Rail 2  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
PMBus_Clk  
PMBus_Data  
DPWM1A  
PG1  
PMBus Clock. Pull up to 3.3V with a 2k ohm resistor  
PMBus Data. Pull up to 3.3V with a 2k ohm resistor  
Digital Pulse Width Modulator output 1A  
Rail 1 Power Good Indicator  
DPWM2A  
PG2  
Digital Pulse Width Modulator output 2A  
Rail 2 Power Good Indicator  
VID1A  
VID input pin for Rail 1 – least significant bit  
Power Good Indication  
PowerGood  
VID1B  
VID input pin for Rail 1  
PMBus_Alert  
PMBus_Cntrl  
VID1C  
PMBus Alert. Pull up to 3.3V with a 10k ohm resistor  
PMBus Control. Pull up to 3.3V with a 10k ohm resistor  
VID input pin for Rail 1 – most significant bit  
VID input pin for Rail 2 – least significant bit  
VID input pin for Rail 2  
VID2A  
VID2B  
VID2C  
VID input pin for Rail 2 – most significant bit  
Rail 1 Enable  
EN1  
EN2  
Rail 2 Enable  
JTAG_TCK  
SyncOut/JTAG_TDO  
SyncIn/JTAG_TDI  
JTAG_TMS  
(JTAG) nTRST  
Dgnd3  
JTAG Test Clock  
Mux'ed pin JTAG Test Data Output, DPWM Sync Output  
Mux'ed pin – JTAG Test Data In, DPWM Sync Input  
JTAG Test mode select. Pull up to 3.3V with a 10k ohm resistor  
JTAG Test Reset – Tie to ground with a 10k ohm resistor  
Digital Ground  
V33DIO  
3.3V supply for Digital I/O and Core  
V33A  
Analog 3.3V supply  
BPCap  
1.8V Bypass Capacitor – tie 0.1 µF cap to analog ground  
Analog ground  
Agnd2  
EAp1  
Error analog, differential voltage, Positive channel 1 input  
Error analog, differential voltage, Negative channel 1 input  
Error analog, differential voltage, Positive channel 2 input  
Error analog, differential voltage, Negative channel 2 input  
EAn1  
EAp2  
EAn2  
V33FB  
Connection to the base of 3.3V linear regulator transistor (no connect if unused)  
Power stage 1A current sense input and input to analog comparator 1  
PMBus Address sense. Channel 1.  
CS1A  
Addr1  
Addr0  
PMBus Address sense. Channel 0.  
Vtrack/AuxADC3  
Temp1/AuxADC1  
Agnd3  
Tracking voltage input, or Auxiliary ADC input 3  
Temperature sense input for Rail 1, or Auxiliary ADC input 1  
Analog ground  
Copyright © 2013, Texas Instruments Incorporated  
9
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
Table 1. PIN FUNCTIONS (continued)  
PIN NO.  
48  
PIN LABEL  
DESCRIPTION  
ADC_Ref  
ADC Reference. Tie to analog ground through 0.1µF capacitor  
It is recommended that this pad be connected to analog ground  
PowerPad  
TYPICAL APPLICATION SCHEMATIC  
Figure 3 shows the UCD9222 power supply controller as part of a system that provides the regulation of two  
independent power supplies. The loop for each power supply is created by the respective voltage outputs feeding  
into the differential voltage error ADC (EADC) inputs, and completed by DPWM outputs feeding into the gate  
drivers for each power stage.  
The ±Vsense rail signals must be routed to the EAp/EAn input that matches the DPWM number that controls the  
output power stage. For example, the power stage driven by DPWM1A must have its feedback routed to EAP1  
and EAN1.  
UCD7242  
UCD9222  
Figure 3. Typical Application Schematic  
10  
Copyright © 2013, Texas Instruments Incorporated  
 
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
FUNCTIONAL OVERVIEW  
The UCD9222 contains two Fusion Power Peripherals (FPP). Each FPP consists of:  
A differential input error voltage amplifier.  
A 10-bit DAC used to set the output regulation reference voltage.  
A fast ADC with programmable input gain to digitally measure the error voltage.  
A dedicated 3-pole/3-zero digital filter to compensate the error voltage  
A digital PWM (DPWM) engine that generates the PWM pulse width based on the compensator output.  
Each controller is configurable through the PMBus serial interface.  
PMBus Interface  
The PMBus is a serial interface specifically designed to support power management. It is based on the SMBus  
interface that is built on the I2C physical specification. The UCD9222 supports revision 1.2 of the PMBus  
standard. Wherever possible, standard PMBus commands are used to support the function of the device. For  
unique features of the UCD9222, MFR_SPECIFIC commands are defined to configure or activate those features.  
These commands are defined in the UCD92xx PMBUS Command Reference.  
The UCD9222 is PMBus compliant, in accordance with the "Compliance" section of the PMBus specification. The  
firmware is also compliant with the SMBus 2.0 specification, including support for the SMBus ALERT function.  
The hardware can support 100 kHz, 400 kHz, or 1 MHz PMBus operation.  
Resistor Programmed PMBus Address Decode  
The PMBus Address is selected using resistors attached to the ADDR0 and ADDR1 pins. At power-up, the  
device applies a bias current to each address detect pin. The measured voltage on each pin determines the  
PMBus address as defined in Table 2. For example, a 133kΩ resistor on ADDR1 and a 75kΩ on ADDR0 will  
select PMBus address = 100. Resistors are chosen from the standard EIA-E96 series, and should have accuracy  
of 1% or better.  
V33  
UCD9222  
ADDR - 0,  
ADDR - 1 pins  
10 mA  
IBIAS  
Resistor to  
set PMBus  
Address  
To 12 -bit ADC  
Figure 4. PMBus Address Detection Method  
A short or open on either address pin causes the PMBus address to default to address 126. To avoid potential  
conflicts between multiple devices, it is best to avoid using address 126.  
Some addresses should be avoided; see Table 2 for details.  
Copyright © 2013, Texas Instruments Incorporated  
11  
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
Table 2. PMBus Address Bins(1)  
ADDR0  
(short)  
< 36.5k  
(open)  
> 237k  
42.2k 48.7k 56.2k 64.9k  
75k  
86.6k 100k 115k 133k 154k 178k 205k  
< 36.5k  
(short)  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
42.2k  
48.7k  
56.2k  
64.9k  
75k  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126(2)  
126(2)  
24  
1
2
3
4
5
6
18  
7
19  
8
20  
9
10  
22  
11(3)  
33  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
13  
14  
15  
16  
17  
21  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
86.6k  
100k  
115k  
133k  
154k  
178k  
205k  
60  
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
76  
77  
78  
79  
80  
81  
82  
83  
84  
85  
86  
87  
88  
89  
90  
91  
92  
93  
94  
95  
96  
97  
98  
99  
100  
112  
124  
126  
101  
113  
125  
126  
102  
114  
103  
115  
104  
116  
105  
117  
126  
126  
106  
118  
126  
126  
107  
119  
126  
126  
108  
120  
126  
109  
121  
126  
110  
122  
126  
111  
123  
126  
126 126(2) 126  
126  
126  
126  
> 237k  
(open)  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
126  
(1) Shaded addresses are not recommended as they will cause conflict when multiple devices are used.  
(2) Reserved. Do not use.  
(3) Conflicts with ROM. Do not use.  
VID Interface  
The UCD9222 supports VID (Voltage Identification) inputs from up to two external VID enabled devices. The VID  
codes may be 4-, 6-, or 8-bit values; the format is selected using the VID_CONFIG PMBus command. In 4- and  
6-bit mode, each host uses four VID input signals (VID_A, VID_B, VID_C, and VID_S) to send VID codes to the  
UCD9222. In 8-bit mode, the PMBus input is used to receive VID commands from the VID devices’ I2C  
interfaces.  
VID Device #1  
VCNTL[0]  
VCNTL[1]  
VCNTL[2]  
VCNTL[3]  
VID Device #2  
VCNTL[0]  
VCNTL[1]  
VCNTL[2]  
VCNTL[3]  
UCD9222  
VID2A  
VID1A  
VID1B  
VID1C  
VID1S  
VID2B  
VID2C  
VID2S  
Figure 5. One UCD9222 Controlled by Two DSP/ASICs Using 4-bit or 6-bit VID Format  
Regardless of which VID mode is used, the commanded output voltage reference is set according to this formula:  
Vref_cmd = (VID_CODE × VID_Slope) + VID_Offset,  
where  
VID_Slope = (VID_Vout_High – VID_Vout_Low) / ((2^VID_Format) -1),  
and  
VID_Offset = VID_Vout_Low.  
12  
Copyright © 2013, Texas Instruments Incorporated  
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
The VID_Vout_High, VID_Vout_Low, and VID_Format values are set using the VID_CONFIG PMBus command.  
The same command is used to set the initial VID code that will be used at power-up. In addition, the  
VID_CONFIG command also sets the initial voltage that the device ramps to at the end of the soft start; and  
defines a lockout interval over which the VID is ignored during the soft start.  
VID Lockout Interval: Because the VID signals may be originating from a device that is being powered by the  
UCD9222, the voltage levels on the VID signal may not be valid logic levels until the supply voltage at the  
powered device has stabilized. For this reason a configurable lockout interval is applied each time the regulated  
output voltage is turned on. The lockout interval timer starts when the output voltage reaches the top of the soft-  
start ramp. Positive values range from 1 to 32767 ms, with 1 ms resolution. A value of 0 will enable the VID  
inputs immediately at the top of the start ramp. Negative values disable the lockout, allowing the VID inputs to  
remain active all the time regardless of the output voltage state. The default value is 0.  
4-Bit VID Mode: In 4-bit VID mode, the four VID input signals are used to provide the four bits of VID data, as  
shown in the table below. The VID lines are level-sensitive, and are periodically polled every 400µs. When the  
VID lines are changed to command a new voltage, there may be a delay of 500 to 600µs while the UCD9222  
confirms that the VID signal levels are stable. The output voltage will then slew to the new setpoint voltage at the  
rate specified by the PMBus VOUT_TRANSITION_RATE command.  
PIN  
PURPOSE  
RAIL 1  
VID1A  
VID1B  
VID1C  
VID1S  
RAIL 2  
VID2A  
VID2B  
VID2C  
VID2S  
VID_A  
VID_B  
VID_C  
VID_S  
Data bit 0 (least significant bit)  
Data bit 1  
Data bit 2  
Data bit 3 (most significant bit)  
6-Bit VID Mode: In 6-bit VID mode, the four VID input signals are used to provide the six bits of VID data, as  
shown in the table below. Each of the three data lines (VID_A, VID_B, and VID_C) carries two bits of data per  
VID code. The bits are clocked and selected by the VID_S select line.  
PIN  
PURPOSE  
RAIL 1  
RAIL 2  
VID_A  
Data bit 0 when VID_S is low,  
Data bit 3 when VID_S is high  
VID1A  
VID2A  
VID_B  
VID_C  
VID_S  
Data bit 1 when VID_S is low,  
Data bit 4 when VID_S is high  
VID1B  
VID1C  
VID1S  
VID2B  
VID2C  
VID2S  
Data bit 2 when VID_S is low,  
Data bit 5 when VID_S is high  
Select Line:  
Low= LSB, High = MSB  
Copyright © 2013, Texas Instruments Incorporated  
13  
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
The falling edge of the VID_S line triggers the UCD9222 to read bits 2:0 on the three VID data lines. The rising  
edge of VID_S triggers the UCD9222 to read bits 5:3 on the three VID data lines and calculate a new VOUT  
setpoint. This calculation takes from 35 to 135µs. The output voltage will then slew to the new setpoint voltage at  
the rate specified by the VOUT_TRANSITION_RATE PMBus command.  
VID_S  
Lower Half  
VID_A = bit 0  
VID_B = bit 1  
UpperHalf  
VID_A = bit 3  
VID_B = bit 4  
Lower Half  
VID_A = bit 0  
VID_B = bit 1  
Upper Half  
VID_A = bit 3  
VID_B = bit 4  
VID_A  
VID_B  
VID_C  
VID_C = bit 2 VID_C = bit 5  
VID_C = bit 2 VID_C = bit 5  
VOUT  
Figure 6. 6-Bit VID Data Transfer  
The set-up time on the data lines is 0 µs. All four VID lines must hold at the same level for some time after a  
change in the VID_S line to allow the UCD9222 to read and validate the data signals and perform necessary  
voltage calculations. The UCD9222 can tolerate single hold times as short as 70µs, but does not have sufficient  
computation power to sustain continuous VID messaging that quickly. It is expected that the hold time will be at  
least 125µs for sustained operations. It is recommended that the DSP only send VID messages when the  
regulated voltage needs to change; sending the same VID code repeatedly and continuously provides no benefit.  
Figure 7 and Table 3 illustrate the critical timing measurements as they apply to the 6-bit VID interface.  
Tsu  
Thd  
Tchi  
Tclo  
VID_S  
VID_A,  
VID_B,  
VID_C  
Tr  
Tf  
Tvo  
VOUT  
Figure 7. 6-bit VID Timing  
14  
Copyright © 2013, Texas Instruments Incorporated  
 
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
Table 3. 6-bit VID Timing  
SYMBO  
L
PARAMETER  
MIN  
TYP  
MAX  
UNITS  
Tr  
Data and clock rise time  
2.5  
0.3  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
Tf  
Data and clock fall time  
Data setup before changing clock  
Data hold until next clock change  
Clock high time  
Tsu  
Thd  
Tchi  
Tclo  
Tvo  
0
70  
70  
70  
35  
125  
125  
Clock low time  
Response time from rising edge of VID_S to start of  
Vout slewing to new setpoint  
135  
8-Bit VID Mode: In 8-bit VID mode, the four VID input signals are not used. Instead, an 8-bit VID code is  
transmitted to the UCD9222 through the PMBus / I2C port using one of the VID_CODE_RAILn commands,  
where n is the rail number from 1 to 2.  
NAME  
DESCRIPTION(1)  
CODE  
0xBB  
0xBC  
0xBD  
VID_CONFIG  
Selects the VID mode, sets the upper and lower voltage limits, and the starting voltage code at power-up.  
VID_CODE_RAIL1 Selects the VID code used to set the output voltage for Rail 1.  
VID_CODE_RAIL2 Selects the VID code used to set the output voltage for Rail 2.  
(1) For a complete description of the serial VID commands, see the UCD92xx PMBus Command Reference (SLUU337)  
Copyright © 2013, Texas Instruments Incorporated  
15  
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
VOUT  
TMSGVO  
TMSG  
TVO  
Addr  
Cmd  
Data  
PEC  
Start  
Stop  
PMBus Clock  
PMBus Data  
ACK  
ACK  
ACK  
ACK  
Figure 8. PMBus Timing for VID_CODE_RAILn Command  
Table 4. Typical PMBus Timing for VID_CODE_RAILn Command @ 400kHz  
SYMBOL  
PARAMETER  
CONDITIONS  
TYP  
UNITS  
TmsgPEC  
Message Transmit Time, with PEC  
Message Transmit Time, without PEC  
End of message until Vout starts changing  
Start of message until Vout start changing  
400 kHz clock, PEC enabled  
400 kHz clock, PEC enabled  
162 – 256  
126 – 221  
28 – 140  
169 – 314  
µs  
Tvo  
µs  
µs  
Tmsgvo  
400 kHz clock, PEC disabled  
The total time to transmit the serial VID command will vary depending on the other tasks that the UCD92xx  
processor is performing. Typical packet times varied from 162 to 256µs when the PMBus is configured for a 400  
kb/s transfer rate running and the optional PEC byte is enabled. Disabling the PEC byte saves about 35µs and  
the transfer times are from 126 to 221µs. Note that these are not specified best-case/worst-case timings, but  
indicate a range given the typical acknowledge overhead in the host and controller.  
After the VID packet has been received by the controller there is a delay before the set-point reference DAC is  
updated. This delay time varies from ~28µs to 140µs (typical ) depending on the existing priority of updating set-  
point reference DAC when the command is received.  
With a 221µs packet transfer time, it would seem possible to send 4500 VID messages per second to the device.  
Very short bursts at this rate might be acceptable, but doing so for sustained periods could overwhelm the  
available processing resources in the UCD92xx, causing it to be delayed in performing its other monitoring and  
fault response tasks. In addition, if multiple hosts are trying to talk on the PMBus at such high rates then bus  
contention will occur with great regularity.  
To prevent these issues, it is prudent to limit the total VID messaging rate to less than 4 messages per  
millisecond. In a system with four independent hosts, each host might need to be limited to less than 1 message  
per millisecond. Therefore, to minimize PMBus traffic, it is best to only issue the VID command when a voltage  
change is required. There is no benefit to sending the same VID code continuously and repeatedly.  
JTAG Interface  
The JTAG interface can provide an alternate interface for programming the device. Two of the JTAG pins (TDI  
and TDO) are shared with the SyncIn and SyncOut function. JTAG is disabled by default. There are three  
conditions under which the JTAG interface is enabled:  
1. When the ROM_MODE PMBus command is issued.  
2. On power-up if the Data Flash is blank. This allows JTAG to be used for writing the configuration parameters  
to a programmed device with no PMBus interaction.  
3. When an invalid address is detected at power-up. By opening or shorting one of the address pins to ground,  
an invalid address can be generated that enables JTAG.  
When the JTAG port is enabled the shared pins are not available for use as Sync pins.  
If JTAG is to be used, an external mechanism such as jumpers or a mux must be used to prevent conflict  
between JTAG and the Sync pins.  
16  
Copyright © 2013, Texas Instruments Incorporated  
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
Bias Supply Generator (Shunt Regulator Controller)  
The I/O and analog circuits in the UCD9222 require 3.3V to operate. This can be provided using a stand-alone  
external 3.3V supply, or it can be generated from the main input supply using an internal shunt regulator and an  
external transistor. Regardless of which method is used to generate the 3.3V supply, bypass capacitors of 0.1 µF  
and 4.7 µF should be connected from V33A and V33D to ground near the device. An additional bypass capacitor  
from 0.1 to 1 µF must be connected from the BPCap pin to ground for the internal 1.8V supply to the device’s  
logic circuits.  
Figure 9 shows a typical application using the external transistor. The base of the transistor is driven by a resistor  
R1 to Vin and a transconductance amplifier whose output is on the V33FB pin. The NPN emitter becomes the  
3.3V supply for the chip.  
To Power Stage  
Vin  
FCX491A  
+3.3V  
4.7μ  
0.1μ  
R1  
+1.8V  
0.1μ  
0.1μ  
UCD9222  
Figure 9. 3.3V Shunt Regulator Controller I/O  
In order to generate the correct voltage on the base of the external pass transistor, the internal transconductance  
amplifier sinks current into the V33FB pin and a voltage is produced across R1. This resistor value should be  
chosen so that ISINK is in the range from 0.2 to 0.4mA. R1 is defined as  
V - 3.3 - Vbe  
in  
R1 =  
IE  
+ISINK  
b +1  
( )  
(1)  
Where ISINK is the current into the V33FB pin; Vin is the power supply input voltage, typically 12V; IE is the current  
draw of the device and any pull up resistors tied to the 3.3V supply; and β is the beta of the pass transistor. For  
ISINK = 0.3 mA, Vin=12V, β=99, Vbe = 0.7V and IE=50mA, this formula selects R1 = 10kΩ. Weaker transistors or  
larger current loads will require less resistance to maintain the desired ISINK current. For example, lowering β to  
40 would require R1 = 5.23 kΩ; likewise, an input voltage of 5V requires a value of 1.24 kΩ for R1.  
Power-On Reset  
The UCD9222 has an integrated power-on reset (POR) circuit that monitors the supply voltage. At power-up, the  
POR circuit detects the V33D rise. When V33D is greater than VRESET, the device initiates an internal startup  
sequence. At the end of the startup sequence, the device begins normal operation, as defined by the  
downloaded device PMBus configuration.  
External Reset  
The device can be forced into the reset state by an external circuit connected to the nRESET pin. A logic low  
voltage on this pin holds the device in reset. To avoid an erroneous trigger caused by noise, a 10kΩ pull up  
resistor to 3.3V is recommended.  
Copyright © 2013, Texas Instruments Incorporated  
17  
 
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
ON_OFF_CONFIG  
The ON_OFF_CONFIG command is used to select the method of turning rails on and off. It can be configured so  
that the rail:  
stays off,  
turns on automatically,  
responds to the PMBus_Cntrl pin,  
responds to OPERATION command, or  
responds to logical-AND of the PMBus_Cntrl pin and the OPERATION command.  
The ON_OFF_CONFIG command also sets the active polarity of the PMBus_Cntrl pin.  
EN1/EN2  
In addition to the PMBus_Cntrl pin supported by all UCD92xx products, the UCD9222 also supports separate  
Enable pins for each rail. The polarity of the EN1/EN2 pin is user-configurable, and will be the same as the  
polarity chosen for the PMBus_Cntrl pin by the ON_OFF_CONFIG command. When the ON_OFF_CONFIG  
setting is configured to respond the PMBus_Cntrl pin, the PMBus_Cntrl pin signal will be logically ANDed with  
the rail’s EN pin signal.  
PG1/PG2  
In addition to the PowerGood output signal supported by all UCD92xx products, the UCD9222 also supports  
separate PG indicators for each rail. The PowerGood signal is the logical-AND of all rails, while PG1 and PG2  
indicate the status of a single rail. All three of these indicators are open-drain outputs, so they require pull-up  
resistors. When driving external circuits with logic voltages less than 3.3V, the pull-ups may be tied to that lower  
supply voltage, thus avoiding the need for level-shifters.  
Output Voltage Adjustment  
The output voltage may be set to maintain a steady voltage or it may be controlled dynamically by the VID  
interface, depending on the VID_CONFIG setting. When not being commanded by the VID interface, the nominal  
output voltage is programmed by a combination of PMBus settings: VOUT_COMMAND, VOUT_CAL_OFFSET,  
VOUT_SCALE_LOOP, and VOUT_MAX. Their relationship is shown in Figure 10. These PMBus parameters  
need to be set such that the resulting Vref DAC value does not exceed the maximum value of Vref.  
Output voltage margining is configured by the VOUT_MARGIN_HIGH and VOUT_MARGIN_LOW commands.  
The OPERATION command selects between the nominal output voltage and either of the margin voltages. The  
OPERATION command also includes an option to suppress certain voltage faults and warnings while operating  
at the margin settings.  
OPERATION Command  
VOUT  
VOUT_CAL_OFFSET  
VOUT_MARGIN_HIGH  
R1  
VSense  
3:1  
Mux  
VOUT_COMMAND  
VOUT_MARGIN_LOW  
VID_CODE_RAILx  
4-wire VID interface  
VOUT_MAX  
R2  
VOUT_  
SCALE_  
LOOP  
3:1  
Mux  
Limiter  
Vref DAC  
eADC  
+
+
VOUT_OV_FAULT_LIMIT  
VOUT_OV_WARN_LIMIT  
VOUT_UV_WARN_LIMIT  
VOUT_UV_FAULT_LIMIT  
digital  
compensator  
VID_CONFIG  
Figure 10. PMBus Voltage Adjustment Mechanisms  
18  
Copyright © 2013, Texas Instruments Incorporated  
 
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
For a complete description of the commands supported by the UCD9222 see the UCD92xx PMBUS Command  
Reference (SLUU337). Each of these commands can also be issued from the Texas Instruments Fusion Digital  
Power™ Designer program. This Graphical User Interface (GUI) PC program issues the appropriate commands  
to configure the UCD9222 device.  
Calibration  
To optimize the operation of the UCD9222, PMBus commands are supplied to enable fine calibration of output  
voltage, output current, and temperature measurements. The supported commands and related calibration  
formulas may be found in the UCD92xx PMBUS Command Reference (SLUU337).  
Analog Front End (AFE)  
GAFE = 1, 2, 4, or 8  
Vead  
VEAP  
VEAN  
VEA  
6-bit  
result  
EADC  
GeADC = 8mV/LSB  
Vref DAC  
CPU  
Vref = 1.563 mV/LSB  
PMBus  
Figure 11. Analog Front End Block Diagram  
The UCD9222 senses the power supply output voltage differentially through the EAP and EAN pins. The error  
amplifier utilizes a switched capacitor topology that provides a wide common mode range for the output voltage  
sense signals. The fully differential nature of the error amplifier also ensures low offset performance.  
The output voltage is sampled at a programmable time (set by the EADC_SAMPLE_TRIGGER PMBus  
command). When the differential input voltage is sampled, the voltage is captured in internal capacitors and then  
transferred to the error amplifier where the value is subtracted from the set-point reference which is generated by  
the 10-bit Vref DAC as shown in Figure 11. The resulting error voltage is then amplified by a programmable gain  
circuit before the error voltage is converted to a digital value by the error ADC (EADC). This programmable gain  
is configured through the PMBus and affects the dynamic range and resolution of the sensed error voltage as  
shown in Table 5. The internal reference gains and offsets are factory-trimmed at the 4x gain setting, so it is  
recommended that this setting be used whenever possible.  
Table 5. Analog Front End Resolution  
AFE_GAIN for  
PMBus Command  
EFFECTIVE ADC  
RESOLUTION (mV)  
DIGITAL ERROR VOLTAGE  
DYNAMIC RANGE (mV)  
AFE Gain  
0
1x  
2x  
4x  
8x  
8
4
2
1
–256 to 248  
–128 to 124  
–64 to 62  
1
2 (Recommended)  
3
–32 to 31  
The AFE variable gain is one of the compensation coefficients that are stored when the device is configured by  
issuing the CLA_GAINS PMBus command. Compensator coefficients are arranged in several banks: one bank  
for start/stop ramp or tracking, one bank for normal regulation mode and one bank for light load mode. This  
allows the user to trade-off resolution and dynamic range for each operational mode.  
The EADC, which samples the error voltage, has high accuracy, high resolution, and a fast conversion time.  
However, its range is limited as shown in Table 5. If the output voltage is different from the reference by more  
than this, the EADC repoºrts a saturated value at –32 LSBs or 31 LSBs. The UCD9222 overcomes this limitation  
by adjusting the Vref DAC up or down in order to bring the error voltage out of saturation. In this way, the  
effective range of the ADC is extended. When the EADC saturates, the Vref DAC is slewed at a rate of 0.156  
V/ms, referred to the EA differential inputs.  
Copyright © 2013, Texas Instruments Incorporated  
19  
 
 
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
The differential feedback error voltage is defined as VEA = VEAP – VEAN. An attenuator network using resistors R1  
and R2 (Figure 12) should be used to ensure that VEA does not exceed the maximum value of Vref when  
operating at the commanded voltage level. The commanded voltage level is determined by the PMBus settings  
described in the Output Voltage Adjustment section.  
R1  
EAP  
+Vout  
-Vout  
C2  
R2  
Rin  
Ioff  
EAN  
Figure 12. Input Offset Equivalent Circuit  
Voltage Sense Filtering  
Conditioning should be provided on the EAP and EAN signals. Figure 12 shows a divider network between the  
output voltage and the voltage sense input to the controller. The resistor divider is used to bring the output  
voltage within the dynamic range of the controller. When no attenuation is needed, R2 can be left open and the  
signal conditioned by the low-pass filter formed by R1 and C2.  
As with any power supply system, maximize the accuracy of the output voltage by sensing the voltage directly  
across an output capacitor as close to the load as possible. Route the positive and negative differential sense  
signals as a balanced pair of traces or as a twisted pair cable back to the controller. Put the divider network close  
to the controller. This ensures that there is low impedance driving the differential voltage sense signal from the  
voltage rail output back to the controller. The resistance of the divider network is a trade-off between power loss  
and minimizing interference susceptibility. A parallel resistance (Rp) of 1kΩ to 4kis a good compromise. Once  
RP is chosen, R1 and R2 can be determined from the following formulas.  
RP  
R1 =  
K
RP  
R2 =  
1-K  
VEA  
where K =  
@ VOUT_SCALE_LOOP  
VOUT  
(2)  
It is recommended that a capacitor be placed across the lower resistor of the divider network. This acts as an  
additional pole in the compensation and as an anti-alias filter for the EADC. To be effective as an anti-alias filter,  
the corner frequency should be 35% to 40% of the switching frequency. Then the capacitor is calculated as:  
1
C2 =  
2p´0.35´FSW ´RP  
(3)  
To obtain the best possible accuracy, the input resistance and offset current on the device should be considered  
when calculating the gain of a voltage divider between the output voltage and the EA sense inputs of the  
UCD9222. The input resistance and input offset current are specified in the parametric tables in this datasheet.  
VEA = VEAP – VEAN in the equation below.  
R2  
R1R2  
VEA  
=
VOUT  
+
IOFFSET  
æ
ç
ö
÷
ø
æ
ç
ö
÷
ø
R1R2  
REA  
R1R2  
REA  
R + R +  
R + R +  
1
2
1
2
è
è
(4)  
The effect of the offset current can be reduced by making the resistance of the divider network low.  
20  
Copyright © 2013, Texas Instruments Incorporated  
 
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
Digital Compensator  
Each voltage rail controller in the UCD9222 includes a digital compensator. The compensator consists of a  
nonlinear gain stage, followed by a digital filter consisting of a second order infinite impulse response (IIR) filter  
section cascaded with a first order IIR filter section.  
The Texas Instruments Fusion Digital Power™ Designer development tool can be used to assist in defining the  
compensator coefficients. The design tool allows the compensator to be described in terms of the pole  
frequencies, zero frequencies and gain desired for the control loop. In addition, the Fusion Digital Power™  
Designer can be used to characterize the power stage so that the compensator coefficients can be chosen based  
on the total loop gain for each feedback system. The coefficients of the filter sections are generated through  
modeling the power stage and load.  
Additionally, the UCD9222 has three banks of filter coefficients: Bank-0 is used during the soft start/stop ramp or  
tracking; Bank-1 is used while in regulation mode; and Bank-2 is used when the measured output current is  
below the configured light load threshold.  
Figure 13. Digital Compensator  
To calculate the values of the digital compensation filter continuous-time design parameters KDC, FZ ands QZ are  
entered into the Fusion Digital Power Designer software (or it calculates them automatically). Where the  
compensating filter transfer function is  
S2  
s
+
+1  
2
w
w QZ  
Z
Z
H s = K  
( )  
DC  
æ
ö
÷
ø
s
s
+1  
ç
w
è
P2  
(5)  
There are approximate limits the design parameters KDC, FZ ands QZ. Though design parameters beyond these  
upper a lower bounds can be used to calculate the discrete-time filter coefficients, there will be significant round-  
off error when the continuous-time floating-point design parameters are converted to the discrete-time fixed-point  
integer coefficients to be downloaded to the controller.  
Copyright © 2013, Texas Instruments Incorporated  
21  
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
APPROXIMATE  
DESIGN PARAMETER  
UNITS  
LOWER BOUND  
UPPER BOUND  
KDC  
FZ  
60  
3 kHz  
0.1  
103  
Fsw/5  
5.0  
dB  
kHz  
n/a  
QZ  
The nonlinear gain block allows a different gain to be applied to the system when the error voltage deviates from  
zero. Typically Limit 0 and Limit 1 would be configured with negative values between –1 and –32 and Limit 2 and  
Limit 3 would be configured with positive values between 1 and 31. However, the gain thresholds do not have to  
be symmetrical. For example, the four limit registers could all be set to positive values causing the Gain 0 value  
to set the gain for all negative errors and a nonlinear gain profile would be applied to only positive error voltages.  
The cascaded 1st order filter section is used to generate the third zero and third pole.  
DPWM Engine  
The output of the compensator feeds the high resolution DPWM engine. The DPWM engine produces the pulse  
width modulated gate drive output from the device. In operation, the compensator calculates the necessary duty  
cycle as a digital number representing a percentage from 0 to 100%. The duty cycle value is multiplied by the  
configured period to generate a comparator threshold value. This threshold is compared against the high speed  
switching period counter to generate the desired DPWM pulse width. This is shown in Figure 14.  
Each DPWM engine can be synchronized to another DPWM engine or to an external sync signal via the SyncIn  
and SyncOut pins. Configuration of the synchronization function is done through a MFR_SPECIFIC PMBus  
command. See the DPWM Synchronization section for more details.  
DPWM Engine (1 of 2)  
Clk  
SysClk  
SyncIn  
high res  
ramp  
reset counter  
PWM gate drive output  
S
R
Switch period  
Current balance adj  
Compensator output  
EADC trigger  
SyncOut  
(Calculated duty cycle)  
EADC trigger  
threshold  
Figure 14. DPWM Engine  
Rail/Power Stage Configuration  
Unlike many other products in the UCD92xx family, the UCD9222 does not support assigning power stages to  
arbitrary rails, or combining multiple power stages on the same rail. The UCD9222 supports up to two single-  
phase rails, and the channel number of each rail’s DPWM output must match that of its EAP/EAN feedback  
inputs.  
22  
Copyright © 2013, Texas Instruments Incorporated  
 
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
DPWM Phase Synchronization  
DPWM synchronization provides a method to link the timing between voltage rails controlled by the UCD92xx  
device--either internally or between devices. The configuration of the synchronization between rails is performed  
by the issuing the SYNC_CONFIG command. For details of issuing this command, see the UCD92xx PMBUS  
Command Reference (SLUU337). The synchronization behavior can also be configured using the Fusion Digital  
Power Designer software. Below is a summary of the function.  
Each digital pulse width modulator (PWM) engine in the UCD92xx controller can accept a sync signal that resets  
the PWM ramp generator. The ramp generator can be set to free-run, accept a reset signal from another internal  
PWM engine, or accept a reset signal from the external SyncIn pin (UCD9222 only). In addition, each digital  
PWM engine can generate a phase delayed sync signal that can be directed to another PWM reset input or  
directed to the external SyncOut pin. In this way the PWM timers can be "daisy-chained" to set up the desired  
phase relationship between power stages.  
The PWM engine reset input can accept the following inputs  
Table 6. Sync Trigger Inputs  
None (free run)  
DPWM 1  
DPWM 2  
SyncIn Pin  
When configuring a PWM engine to run synchronous to another internal PWM output, set the switching  
frequency of each PWM output to the same value using the FREQUENCY_SWITCH PMBus command. Set the  
time point where the controller samples the voltage to be regulated by setting the EADC_SAMPLE_TRIGGER  
value to the minimum value (228-240 nsec before the end of the switching period).  
When configuring a PWM engine to run synchronous to run an external sync signal, the switching period must be  
set to be longer than the period of the sync signal by setting the value of the FREQUENCY_SWITCH command  
to be lower than the frequency of the sync signal. This way the external sync signal will reset the PWM ramp  
counter before it is internally reset. In this operating condition, the error ADC sample trigger time must be set to:  
1
0.95  
EADC_SAMPLE_TRIGGER ³  
-
+ 248ns  
F
F
SW  
sync  
(6)  
where FSW is the switching frequency set by FREQUENCY_SWITCH and Fsync is the minimum synchronization  
frequency. The factor of 0.95 is due to the 5% tolerance on the internal clock in the controller. This will ensure  
that the regulation voltage is sampled "just in time" to calculate the appropriate control effort for each switching  
period. This is shown in Figure 15.  
ADC sample = Period-EADC trigger  
Early sync  
Sync-in  
EADC Threshold  
Convert ADC  
sample and  
insufficient time  
to convert ADC  
sample  
calculate  
compensated  
error  
Compensated error  
previous  
control  
effort  
PWM pulse  
Figure 15. Relationship of EADC Trigger to external Sync  
Copyright © 2013, Texas Instruments Incorporated  
23  
 
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
If two rails share a common sync source other than the SyncIn pin, they must have the same delay. When the  
SyncIn pin is used as a sync source, the delay is applied using a different register (EV1) than when using the  
other sources (which use the PhaseTrig registers). Using the EV1 register introduces delay in the control loop  
calculation that will introduce phase loss that must be taken into consideration when calculating the loop  
compensation. Therefore, under most conditions it will be desirable to set the delay to zero for the PWM signal  
synchronized by the SyncIn pin.  
Output Current Measurement  
Pins CS1A and CS2A are used to measure either output current or inductor current in each of the controlled  
power stages. PMBus commands IOUT_CAL_GAIN and IOUT_CAL_OFFSET are used to calibrate each  
measurement. See the UCD92xx PMBus Command Reference (SLUU337) for specifics on configuring this  
voltage to current conversion.  
When the measured current is outside the range of either the over-current or under-current fault threshold, a  
current limit fault is declared and the UCD9222 performs the PMBus configured fault recovery. ADC current  
measurements are digitally averaged before they are compared against the over-current and under-current  
warning and fault thresholds. The output current is measured at a rate of one output rail per tIout microseconds.  
The current measurements are then passed through a digital smoothing filter to reduce noise on the signal and  
prevent false errors. The output of the smoothing filter asymptotically approaches the input value with a time  
constant that is approximately 3.5 times the sampling interval.  
Table 7. Output Current Filter Time Constants  
NUMBER OF  
OUTPUT CURRENT  
FILTER  
OUTPUT RAILS  
SAMPLING INTERVALS (µs)  
TIME CONSTANT τ (ms)  
1
2
200  
400  
0.7  
1.4  
This smoothed current measurement is used for output current fault detection; see the Over-current Detection  
section. The smoothed current measurement is also reported in response to a PMBus request for a current  
reading.  
Current Sense Input Filtering  
Each power stage current is monitored by the device at the CS pins. The device monitors the current with a 12-  
bit ADC and also monitors the current with a digitally programmable analog comparator. The comparator can be  
disabled by writing a zero to the FAST_OC_FAULT_LIMIT.  
Because the current sense signal is both digitally sampled and compared to the programmable over-current  
threshold, it should be conditioned with an RC network acting as an anti-alias filter. If the comparator is disabled,  
the CS input should be filtered at 35% of the sampling rate. An RC network with this characteristic can be  
calculated as  
NrailsT  
Iout  
R = 0.45  
C
(7)  
where Nrails is the number of rails configured and TIout is the sample period for the current sense inputs.  
Therefore, when the comparator is not used, the recommended component values for the RC network are C = 10  
nF and R = 35.7 kΩ.  
When the fast over-current comparator is used, the filter corner frequency based on the ADC sample rate may  
be too slow and a corner frequency that is a compromise between the requirements of fast over-current detection  
and attenuating aliased content in the sampled current must be sought. In this case, the filter corner frequency  
can be calculated based on the time to cross the over-current threshold.  
VOC_thres = VCS_nom + DVImon(1- e-t t  
)
(8)  
where VOC_thres is the programmed OC comparator threshold, VCS_nom is the nominal CS voltage, ΔVImon is the  
change in CS voltage due to an over-current fault and τ is the filter time constant. Using the equation for the  
comparator voltage above, the RC network values can be calculated as  
24  
Copyright © 2013, Texas Instruments Incorporated  
 
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
Tdet  
1
R =  
´
C
ln DV  
(
- ln DVImon - VOC_thres + VCS_nom  
(
)
)
Imon  
(9)  
where Tdet is the time to cross the over-current comparator threshold. For Tdet = 10 µs, ΔVImon = 1.5V, VOC_thres  
=
2.0V and VCS_nom = 1.5V, the corner frequency is 6.4 kHz and the recommended RC network component values  
are C = 10 nF and R = 2.49 kΩ.  
Over-Current Detection  
Several mechanisms are provided to sense output current fault conditions. This allows for the design of power  
systems with multiple layers of protection.  
1. Integrated gate drivers such as the UCD72xx family can be used to generate the FLT signal. The driver  
monitors the voltage drop across the high side FET and if it exceeds a resistor/voltage programmed  
threshold, the driver activates its fault output. A logic high signal on the FLT input causes a hardware  
interrupt to the internal CPU, which then disables the DPWM output. This process takes about 14  
microseconds.  
2. Inputs CS1A and CS2A each drive an internal analog comparator. These comparators can be used to detect  
the voltage output of a current sense circuit. Each comparator has a separate threshold that can be set by  
the FAST_OC_FAULT_LIMIT PMBus command. Though the command is specified in amperes, the  
hardware threshold is programmed with a value between 31mV and 2V in 64 steps. The relationship  
between amperes to sensed volts is configured by the IOUT_CAL_GAIN command. When the current sense  
voltage exceeds the threshold, the corresponding DPWM output is driven low on the voltage rail with the  
fault.  
3. Each Current Sense input to the UCD9222 is also monitored by the 12-bit ADC. Each measured value is  
scaled using the IOUT_CAL_GAIN and IOUT_CAL_OFFSET commands and then passed through a digital  
smoothing filter. The smoothed current measurements are compared to fault and warning limits set by the  
IOUT_OC_FAULT_LIMIT and IOUT_OC_WARN_LIMIT commands. The action taken when an OC fault is  
detected is defined by the IOUT_OC_FAULT_RESPONSE command.  
Because the current measurement is averaged with a smoothing filter, the response time to an over-current  
condition depends on a combination of the time constant (τ) from Table 7, the recent measurement history, and  
how much the measured value exceeds the over-current limit. When the current steps from a current (I1) that is  
less than the limit to a higher current (I2) that is greater than the limit, the output of the smoothing filter is  
Ismoothed t = I + I -I 1- e-t t  
( )  
(
)
(
)
1
2
1
(10)  
At the point when Ismoothed exceeds the limit, the smoothing filter lags time, tlag is  
æ
ç
è
ö
÷
ø
I2 -I1  
I2 -I  
tlag = tln  
limit  
(11)  
The worst case response time to an over-current condition is the sum of the sampling interval (Table 7) and the  
smoothing filter lag, tlag from Equation 11.  
Current Foldback Mode  
When the measured output current exceeds the value specified by the IOUT_OC_FAULT_LIMIT command, the  
UCD9222 attempts to continue to operate by reducing the output voltage in order to maintain the output current  
at the value set by IOUT_OC_FAULT_LIMIT. This continues indefinitely as long as the output voltage remains  
above the minimum value specified by IOUT_OC_LV_FAULT_LIMIT. If the output voltage is pulled down to less  
than that value, the device responds as programmed by the IOUT_OC_LV_FAULT_RESPONSE command.  
Input Voltage Monitoring  
The VinMon pin on the UCD9222 monitors the input voltage. The VinMon pin is monitored using the internal 12-  
bit ADC which has a dynamic range of 0 to 2.5V. The fault thresholds for the input voltage are set using the  
VIN_OV_FAULT_LIMIT and VIN_UV_FAULT_LIMIT commands. The scaling for Vin is set using the  
VIN_SCALE_MONITOR command.  
Copyright © 2013, Texas Instruments Incorporated  
25  
 
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
Input UV Lockout  
The input supply lock-out voltage thresholds are configured with the VIN_ON and VIN_OFF commands. When  
input supply voltage drops below the value set by VIN_OFF, the device starts a normal soft stop ramp. When the  
input supply voltage drops below the voltage set by VIN_UV_FAULT_LIMIT, the device performs as configured  
by the VIN_UV_FAULT_RESPONSE command. For example, when the bias supply for the controller is derived  
from another source, the response code can be set to "Continue" or "Continue with delay," and the controller  
attempts to finish the soft stop ramp. If the bias voltages for the controller and gate driver are uncertain below  
some voltage, the user can set the UV fault limit to that voltage and specify the response code to be "shut down  
immediately," disabling all DPWM outputs. VIN_OFF sets the voltage at which the output voltage soft-stop ramp  
is initiated, and VIN_UV_FAULT_LIMIT sets the voltage where power conversion is stopped.  
Temperature Monitoring  
The UCD9222 monitors temperature using the 12-bit ADC. The ADC12 is read every 100us and combined into a  
running sum. At the end of each 100ms monitoring interval, the ~1000 sample in the running sum are averaged  
together and the running sum is restarted. These averaged values are used to calculate the temperature from  
external temperature sensors. These same values may be read directly using the READ_AUX_ADCS PMBus  
command.  
The averaged values are passed through an additional digital smoothing filter to further reduce the chance of  
reporting false over-temperature events. The smoothing filter has a time constant of 1.55 seconds.  
Auxiliary ADC Input Monitoring  
Unused external temperature sensor inputs may be used for general-purpose analog monitoring. The  
READ_AUX_ADCS PMBus command returns a block of four 16-bit values, each of which is the average of  
multiple raw measurements from the AuxADC inputs. These AuxADC inputs share usage with other signals such  
as Temp1, Temp2, Vtrack, and IinMon. A value of 0 corresponds to 0.00V and a value of 65535 corresponds to  
2.50V. Unlike many other variables that can be monitored via PMBus, no mechanism is provided for adjusting  
the gain or offset of the Aux ADC measurements.  
When using the temperature sensor inputs as Auxiliary ADCs, the temperature warning and faults should be  
disabled to prevent shut-downs due to non-existent over-temperature conditions.  
Soft Start, Soft Stop Ramp Sequence  
The UCD9222 performs soft start and soft stop ramps under closed-loop control.  
Performing a start or stop ramp or tracking is considered a separate operational mode. The other operational  
modes are normal regulation and light load regulation. Each operational mode can be configured to have an  
independent loop gain and compensation. Each set of loop gain coefficients is called a "bank" and is configured  
using the CLA_GAINS PMBus command.  
Start ramps are performed by waiting for the configured start delay TON_DELAY and then ramping the internal  
reference toward the commanded reference voltage at the rate specified by the TON_RISE time and  
VOUT_COMMAND. The DPWM outputs are enabled when the internal ramp reference equals the preexisting  
voltage (pre-bias) on the output and the calculated DPWM pulse width exceeds the pulse width specified by  
DRIVER_MIN_PULSE. This ensures that a constant ramp rate is maintained, and that the ramp is completed at  
the same time it would be if there had not been a pre-bias condition.  
Figure 16 shows the operation of soft-start ramps and soft-stop ramps.  
26  
Copyright © 2013, Texas Instruments Incorporated  
UCD9222-EP  
www.ti.com.cn  
ZHCSBS2 OCTOBER 2013  
Figure 16. Start and Stop Ramps  
When a voltage rail is in its idle state, the DPWM outputs are disabled, and the differential voltage on the  
EAP/EAN pins are monitored by the controller. During idle the Vref DAC is adjusted to match the feedback  
voltage. If there is a pre-bias (that is, a non-zero voltage on the regulated output), then the device can begin the  
start ramp from that voltage with a minimum of disturbance. This is done by calculating the duty cycle that is  
required to match the measured voltage on the rail. Nominally this is calculated as Vout / Vin. If the pre-bias  
voltage on the output requires a smaller pulse width than the driver can deliver, as defined by the  
DRIVER_MIN_PULSE PMBus command, then the start ramp is delayed until the internal ramp reference voltage  
has increased to the point where the required duty cycle exceeds the specified minimum duty.  
Once a soft start/stop ramp has begun, the output is controlled by adjusting the Vref DAC at a fixed rate and  
allowing the digital compensator control engine to generate a duty cycle based on the error. The Vref DAC  
adjustments are made at a rate of 10 kHz and are based on the TON_RISE or TOFF_FALL PMBus configuration  
parameters.  
Although the presence of a pre-bias voltage or a specified minimum DPWM pulse width affects the time when  
the DPWM signals become active, the time from when the controller starts processing the turn-on command to  
the time when it reaches regulation is TON_DELAY plus TON_RISE, regardless of the pre-bias or minimum duty  
cycle.  
During a normal ramp (i.e. no tracking, no current limiting events and no EADC saturation), the set point slews at  
a pre-calculated rate based on the commanded output voltage and TON_RISE. Under closed loop control, the  
compensator follows this ramp up to the regulation point.  
Because the EADC in the controller has a limited range, it may saturate due to a large transient during a  
start/stop ramp. If this occurs, the controller overrides the calculated set point ramp value, and adjusts the Vref  
DAC in the direction to minimize the error. It continues to step the Vref DAC in this direction until the EADC  
comes out of saturation. Once it is out of saturation, the start ramp continues, but from this new set point voltage;  
and therefore, has an impact on the ramp time.  
Non-volatile Memory Error Correction Coding  
The UCD9222 uses Error Correcting Code (ECC) to improve data integrity and provide high reliability storage of  
Data Flash contents. ECC uses dedicated hardware to generate extra check bits for the user data as it is written  
into the Flash memory. This adds an additional six bits to each 32-bit memory word stored into the Flash array.  
These extra check bits, along with the hardware ECC algorithm, allow for any single bit error to be detected and  
corrected when the Data Flash is read.  
Copyright © 2013, Texas Instruments Incorporated  
27  
UCD9222-EP  
ZHCSBS2 OCTOBER 2013  
www.ti.com.cn  
APPLICATION INFORMATION  
Automatic System Identification ( Auto-ID™)  
By using digital circuits to create the control function for a switch-mode power supply, additional features can be  
implemented. One of those features is the measurement of the open loop gain and stability margin of the power  
supply without the use of external test equipment. This capability is called automatic system identification or  
Auto-ID™. To identify the frequency response, the UCD9222 internally synthesizes a sine wave signal and  
injects it into the loop at the Vref DAC. This signal excites the system, and the closed-loop response to that  
excitation can be measured at another point in the loop. The UCD9222 measures the response to the excitation  
at the output of the digital compensator. From the closed-loop response, the open-loop transfer function is  
calculated. The open-loop transfer function may be calculated from the closed-loop response.  
Note that since the compensator and DPWM are digital, their transfer functions are known exactly and can be  
divided out of the measured open-loop gain. In this way the UCD9222 can accurately measure the power  
stage/load plant transfer function in situ (in place), on the factory floor or in an end equipment application and  
send the measurement data back to a host through the PMBus interface without the need for external test  
equipment. Details of the Auto-ID™ PMBus measurement commands can be found in the UCD92xx PMBus  
Command Reference (SLUU337).  
Data Logging  
The UCD9222 maintains a data log in non-volatile memory. This log tracks the peak internal and external  
temperature sensor measurements, peak current measurements and fault history. The PMBus commands and  
data format for the Data Logging can be found in the UCD92xx PMBus Command Reference (SLUU337).  
28  
Copyright © 2013, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
UCD9222WRGZREP  
V62/13622-01XE  
ACTIVE  
ACTIVE  
VQFN  
VQFN  
RGZ  
RGZ  
48  
48  
2500 RoHS & Green  
2500 RoHS & Green  
NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
-55 to 115  
-55 to 115  
UCD9222EP  
UCD9222EP  
NIPDAU  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
Addendum-Page 2  
GENERIC PACKAGE VIEW  
RGZ 48  
7 x 7, 0.5 mm pitch  
VQFN - 1 mm max height  
PLASTIC QUADFLAT PACK- NO LEAD  
Images above are just a representation of the package family, actual package may vary.  
Refer to the product data sheet for package details.  
4224671/A  
www.ti.com  
PACKAGE OUTLINE  
VQFN - 1 mm max height  
RGZ0048A  
PLASTIC QUADFLAT PACK- NO LEAD  
A
7.1  
6.9  
B
(0.1) TYP  
7.1  
6.9  
SIDE WALL DETAIL  
OPTIONAL METAL THICKNESS  
PIN 1 INDEX AREA  
(0.45) TYP  
CHAMFERED LEAD  
CORNER LEAD OPTION  
1 MAX  
C
SEATING PLANE  
0.08 C  
0.05  
0.00  
2X 5.5  
5.15±0.1  
(0.2) TYP  
13  
24  
44X 0.5  
12  
25  
SEE SIDE WALL  
DETAIL  
SYMM  
2X  
5.5  
1
36  
0.30  
0.18  
PIN1 ID  
(OPTIONAL)  
48X  
48  
37  
SYMM  
0.1  
C A B  
C
0.5  
0.3  
48X  
0.05  
SEE LEAD OPTION  
4219044/D 02/2022  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
VQFN - 1 mm max height  
RGZ0048A  
PLASTIC QUADFLAT PACK- NO LEAD  
2X (6.8)  
5.15)  
SYMM  
(
48X (0.6)  
37  
48  
48X (0.24)  
44X (0.5)  
1
36  
SYMM  
2X  
2X  
(5.5)  
(6.8)  
2X  
(1.26)  
2X  
(1.065)  
(R0.05)  
TYP  
25  
12  
21X (Ø0.2) VIA  
TYP  
24  
13  
2X (1.065)  
2X (1.26)  
2X (5.5)  
LAND PATTERN EXAMPLE  
SCALE: 15X  
SOLDER MASK  
OPENING  
0.07 MIN  
ALL AROUND  
0.07 MAX  
ALL AROUND  
EXPOSED METAL  
EXPOSED METAL  
METAL  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
NON SOLDER MASK  
DEFINED  
(PREFERRED)  
SOLDER MASK  
DEFINED  
SOLDER MASK DETAILS  
4219044/D 02/2022  
NOTES: (continued)  
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature  
number SLUA271 (www.ti.com/lit/slua271).  
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown  
on this view. It is recommended that vias under paste be filled, plugged or tented.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
VQFN - 1 mm max height  
RGZ0048A  
PLASTIC QUADFLAT PACK- NO LEAD  
2X (6.8)  
SYMM  
(
1.06)  
37  
48X (0.6)  
48  
48X (0.24)  
44X (0.5)  
1
36  
SYMM  
2X  
2X  
(5.5)  
(6.8)  
2X  
(0.63)  
2X  
(1.26)  
(R0.05)  
TYP  
25  
12  
24  
13  
2X  
(1.26)  
2X (0.63)  
2X (5.5)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
EXPOSED PAD  
67% PRINTED COVERAGE BY AREA  
SCALE: 15X  
4219044/D 02/2022  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
www.ti.com  
重要声明和免责声明  
TI“按原样提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,  
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担  
保。  
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验  
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。  
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。  
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成  
本、损失和债务,TI 对此概不负责。  
TI 提供的产品受 TI 的销售条款ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改  
TI 针对 TI 产品发布的适用的担保或担保免责声明。  
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE  
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2022,德州仪器 (TI) 公司  

相关型号:

V62/13623-02XE

四路 RS-485 差分线路接收器,SN65LBC173A-EP | D | 16 | -55 to 125
TI

V62/13624-01XE

增强型产品 16 位超低功耗微控制器、8KB 闪存、512B RAM、10 位 ADC、1 个 USCI | RHB | 32 | -40 to 125
TI

V62/13624-01XE-R

增强型产品 16 位超低功耗微控制器、8KB 闪存、512B RAM、10 位 ADC、1 个 USCI | RHB | 32 | -40 to 125
TI

V62/13628-01XE

混合信号微控制器,MSP430F5328-EP | RGC | 64 | -40 to 105
TI

V62/13629-01XE

增强型产品 16/32 位 RISC 闪存 Arm Cortex-R4F、EMAC、FlexRay | GWT | 337 | -40 to 125
TI

V62/13629-02XE

增强型产品 16/32 位 RISC 闪存 Arm Cortex-R4F、EMAC、FlexRay | GWT | 337 | -55 to 125
TI

V62/14601-01XE

数字双路同步降压功率驱动器,UCD7242-EP | RSJ | 32 | -55 to 125
TI

V62/14602-01XE

具有 2A 开关电流的高输入电压降压/升压转换器 | DSC | 10 | -55 to 125
TI

V62/14603-01XE

支持 4 位、6 位或 8 位 VID 的数字 PWM 系统控制器 | RGC | 64 | -55 to 125
TI

V62/14604-01XE

具有三态输出的增强型产品 2 通道、1.65V 至 5.5V 缓冲器 | DCU | 8 | -55 to 125
TI

V62/14605-01XE

具有三态输出的增强型产品单路 2V 至 5.5V 缓冲器 | DCK | 5 | -55 to 125
TI

V62/14606-01XE

双路 FET 总线开关、2.5V/3.3V、低压高带宽总线开关 | PW | 8 | -55 to 125
TI