VSP2262Y [TI]
适用于 CCD 传感器的 12 位 20MSPS 单通道 AFE | PT | 48 | -25 to 85;
| 型号： | VSP2262Y |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 适用于 CCD 传感器的 12 位 20MSPS 单通道 AFE | PT | 48 | -25 to 85 CD 商用集成电路 传感器 |
| 文件： | 总7页 (文件大小：774K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VSP2262
VSP2262
www.ti.com
CCD SIGNAL PROCESSOR for
DIGITAL CAMERAS
FEATURES
DESCRIPTION
● CCD SIGNAL PROCESSING:
The VSP2262 is a complete mixed-signal processing
IC for digital cameras, providing signal conditioning
and Analog-to-Digital (A/D) conversion for the output
of a CCD array. The primary CCD channel provides
Correlated Double Sampling (CDS) to extract video
information from the pixels, –6dB to +42dB gain
range with digital control for varying illumination
conditions, and black level clamping for an accurate
black level reference. Input signal clamping and offset
correction of the input CDS are also performed. The
stable gain control is linear in dB. Additionally, the
black level is quickly recovered after gain change. The
VSP2262Y is available in an LQFP-48 package and
operates from a single +3V/+3.3V supply.
Correlated Double Sampling (CDS)
Programmable Black Level Clamping
● PROGRAMMABLE GAIN AMPLIFIER (PGA):
–6dB to +42dB Gain Ranging
● 12-BIT DIGITAL DATA OUTPUT:
Up to 20MHz Conversion Rate
No Missing Codes
● 79dB SIGNAL-TO-NOISE RATIO
● PORTABLE OPERATION:
Low Voltage: 2.7V to 3.6V
Low Power: 83mW (typ) at 3.0V
Stand-By Mode: 6mW
RESET
VCC
CLPDM
SHP SHD
SLOAD SCLK SDATA
ADCCK
DRVDD
Serial Interface
Input
Clamp
Timing
Control
Correlated
Double
Sampling
(CDS)
Programmable
Gain
Amplifier
(PGA)
Analog-
to-
Digital
B[11:0]
12-Bit
Digital
Output
CCDIN
–6dB
to
+42dB
Output
Latch
Converter
CCD
Output
Signal
Optical Black (OB)
Level Clamping
Reference Voltage Generator
Preblanking
COB
BYPP2
BYP
BYPM
REFN
CM
REFP
DRVGND
GNDA
CLPOB
PBLK
Copyright © 2000, Texas Instruments Incorporated
SBMS011
Printed in U.S.A. November, 2000
PACKAGE OPTION ADDENDUM
www.ti.com
10-Nov-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
VSP2262Y
ACTIVE
ACTIVE
LQFP
LQFP
PT
PT
48
48
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-25 to 85
-25 to 85
VSP2262Y
VSP2262Y
Samples
Samples
VSP2262Y/2K
2000 RoHS & Green
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Nov-2022
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
VSP2262Y/2K
LQFP
PT
48
2000
330.0
17.4
9.5
9.5
2.0
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
*All dimensions are nominal
Device
Package Type Package Drawing Pins
LQFP PT 48
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 38.0
VSP2262Y/2K
2000
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Jan-2022
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device
Package Package Pins SPQ Unit array
Max
matrix temperature
(°C)
L (mm)
W
K0
P1
CL
CW
Name
Type
(mm) (µm) (mm) (mm) (mm)
VSP2262Y
PT
LQFP
48
250
10x25
150
315 135.9 7.62
12.2
11.1 11.25
Pack Materials-Page 3
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