XCC3301ENJARSBR [TI]
SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC | RSB | 40 | -40 to 105;
| 型号： | XCC3301ENJARSBR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SimpleLink™ Wi-Fi 6 and Bluetooth® Low Energy companion IC | RSB | 40 | -40 to 105 |
| 文件： | 总12页 (文件大小：892K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CC3301, CC3300
ZHCSRV2A –MARCH 2023 –REVISED APRIL 2023
CC330x SimpleLink™ Wi-Fi 6 和低功耗Bluetooth® 配套IC
1 特性
2 应用
关键特性
• 电网基础设施
– 电量计
– 串式逆变器
• Wi-Fi 6 (802.11ax)
• CC33x1 器件中的低功耗蓝牙5.3
• 能够运行TCP/IP 堆栈的任何处理器或MCU 主机的
配套IC
• 集成2.4GHz PA，适用于输出功率高达+20dBm 的
完整无线解决方案。
– 微型逆变器
– 能量存储电源转换系统(PCS)
– 电动汽车充电基础设施
• 楼宇和家居自动化
– HVAC 控制器
– HVAC 网关
• 工作温度：-40°C 至+105°C
• 应用吞吐量高达50Mbps
– 恒温器
– 楼宇安全网关
– 车库门系统
扩展特性
• Wi-Fi 6
– IP 网络摄像头/可视门铃
– 无线安防摄像头
• 电器
– 2.4GHz、20MHz、单空间流
– 支持IEEE 802.11 b/g/n/ax 的MAC、基带和射
频收发器
– 目标唤醒时间(TWT)、OFDMA、MU-MIMO
（下行链路）、基本服务集着色和触发帧，可提
高效率
– 冰箱和冷冻柜
– 烤箱
– 洗衣机和烘干机
– 住宅热水器和供暖系统
– 空气净化器和加湿器
– 咖啡机
– 基于硬件的加密和解密，支持WPA2 和WPA3
– 出色的互操作性
– 支持4 位SDIO 或SPI 主机接口
– 空调室内机
– 扫地机器人
– 割草机器人
• 低功耗蓝牙5.3
– LE 编码PHY（远距离）、LE 2M PHY（高速）
和广播扩展
• 医疗
– 输液泵
– 主机控制器接口(HCI) 传输，具有UART 或共
享SDIO 的选项
– 电子病床和床控制器
– 多参数患者监护仪
– 血压监护仪
– CPAP 呼吸机
– 远程保健系统
– 超声波扫描仪
– 超声波智能探头
– 电动牙刷
• 增强的安全性
– 安全主机接口
– 固件身份验证
– 防回滚保护
• 多角色支持（例如，并发STA 和AP），可连接不
同射频通道（Wi-Fi 网络）上的Wi-Fi 设备
• 可选天线分集或选择
• 零售自动化和支付
• 打印机
• 3 线或1 线PTA，用于与额外2.4GHz 无线电（例
如Thread 或Zigbee）在外部共存
• 电源管理
– VMAIN、VIO、Vpp：1.8V
– VPA：3.0 V 至4.2 V
• 时钟源
– 40MHz XTAL 快速时钟
– 内部LFOSC 或外部32.768kHz 慢速时钟
• 小封装尺寸
– 易于设计，采用40 引脚5mm x 5mm 四方扁平
无引线(QFN) 封装，间距为0.4mm
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SWRS310
CC3301, CC3300
ZHCSRV2A –MARCH 2023 –REVISED APRIL 2023
www.ti.com.cn
3 说明
SimpleLink™ Wi-Fi CC33xx 系列器件兼具经济性和可靠性，可支持工程师放心地连接更多应用。CC33xx 是单芯
片Wi-Fi 6 和低功耗蓝牙5.3 器件。CC3300 和CC3301 是此引脚对引脚兼容系列中的首批器件。
• CC3300：2.4GHz Wi-Fi 6 配套IC。
• CC3301：2.4GHz Wi-Fi 6 和低功耗蓝牙5.3 配套IC。
CC330x 提供 Wi-Fi 和 BLE 的最新标准，同时与 Wi-Fi 4 (802.11 b/g/n) 和 Wi-Fi 5 (802.11ac) 保持兼容。这些
CC330x 器件是德州仪器 (TI) 的第 10 代连接组合芯片。因此，CC330x 基于成熟的技术设计而成。这些器件非常
适合用在通过 Linux 或RTOS 主机运行 TCP/IP 的成本敏感型嵌入式应用中，CC330x 为物联网 (IoT) 的嵌入式设
备应用带来了Wi-Fi 6 的效率，并具有较小的PCB 尺寸和高度优化的物料清单。
器件信息
Wi-Fi 2.4GHz SISO
器件型号
蓝牙低耗能
CC3300ENJARSBR
CC3301ENJARSBR
✔
✔
✔
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SWRS310
2
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Product Folder Links: CC3301 CC3300
CC3301, CC3300
ZHCSRV2A –MARCH 2023 –REVISED APRIL 2023
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4 系统图
图4-1 显示了CC3301 的基本系统图。
CC330x Wi-Fi and BLE Companion IC
Wi-Fi & BLE Core
Interfaces
SDIO / SPI
DMA
Crypto
ELP
UART
Wi-Fi
MAC / Modem
BLE
MAC / Modem
Coexistence
2.4 GHz Wi-Fi / BLE RF
Antenna Diversity
2.4 GHz
ANT
nReset
System
Power
Clock
Execution / Data
RAM
Packet RAM
User OTP
CC3301 only
图4-1. CC3301 系统简图
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: CC3301 CC3300
English Data Sheet: SWRS310
CC3301, CC3300
ZHCSRV2A –MARCH 2023 –REVISED APRIL 2023
www.ti.com.cn
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 2
4 系统图................................................................................3
5 Revision History.............................................................. 4
6 Mechanical, Packaging, and Orderable Information....5
5 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from March 16, 2023 to April 24, 2023 (from Revision * (*) to Revision A (April 2023))
Page
• 更新了特性列表。更新了整个文档中的表格、图和交叉参考的编号格式。........................................................ 1
• 更新了系统图。.................................................................................................................................................. 3
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SWRS310
4
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Product Folder Links: CC3301 CC3300
CC3301, CC3300
ZHCSRV2A –MARCH 2023 –REVISED APRIL 2023
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6 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: CC3301 CC3300
English Data Sheet: SWRS310
CC3301, CC3300
ZHCSRV2A –MARCH 2023 –REVISED APRIL 2023
www.ti.com.cn
PACKAGE OUTLINE
RSB0040B
WQFN - 0.8 mm max height
S
C
A
L
E
3
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
5.15
4.85
B
A
PIN 1 INDEX AREA
5.15
4.85
0.8
0.7
C
SEATING PLANE
0.08 C
0.05
0.00
2X 3.6
SYMM
(0.2) TYP
EXPOSED
THERMAL PAD
11
20
10
21
SYMM
2X 3.6
41
3.5 0.1
30
1
36X 0.4
0.25
40X
40
31
0.15
PIN 1 ID
0.1
C A B
0.5
0.3
40X
0.05
4219094/A 11/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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Product Folder Links: CC3301 CC3300
English Data Sheet: SWRS310
CC3301, CC3300
ZHCSRV2A –MARCH 2023 –REVISED APRIL 2023
www.ti.com.cn
EXAMPLE BOARD LAYOUT
RSB0040B
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
3.5)
SYMM
31
40
SEE SOLDER MASK
DETAIL
40X (0.6)
40X (0.2)
30
1
36X (0.4)
(0.9) TYP
(R0.05) TYP
SYMM
(0.6) TYP
41
(4.8)
(
0.2) TYP
VIA
10
21
11
20
(0.6) TYP
(0.9) TYP
(4.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
METAL UNDER
SOLDER MASK
METAL EDGE
EXPOSED METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DEFINED
SOLDER MASK DETAILS
4219094/A 11/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: CC3301 CC3300
English Data Sheet: SWRS310
CC3301, CC3300
ZHCSRV2A –MARCH 2023 –REVISED APRIL 2023
www.ti.com.cn
EXAMPLE STENCIL DESIGN
RSB0040B
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(1.2) TYP
40
31
40X (0.6)
40X (0.2)
1
30
36X (0.4)
(1.2) TYP
(R0.05) TYP
SYMM
41
(4.8)
METAL
TYP
10
21
20
11
SYMM
9X (1)
(4.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 20X
EXPOSED PAD 41
73% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
4219094/A 11/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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Copyright © 2023 Texas Instruments Incorporated
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Product Folder Links: CC3301 CC3300
English Data Sheet: SWRS310
PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
XCC3300ENJARSBR
XCC3301ENJARSBR
ACTIVE
ACTIVE
WQFN
WQFN
RSB
RSB
40
40
3000
3000
TBD
TBD
Call TI
Call TI
Call TI
-40 to 105
-40 to 105
Samples
Samples
Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Apr-2023
Addendum-Page 2
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