XC6103A349ML
更新时间:2024-10-30 03:51:14
品牌:TOREX
描述:Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, SOT-25, 5 PIN
XC6103A349ML 概述
Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, SOT-25, 5 PIN 电源管理电路
XC6103A349ML 规格参数
是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | LSSOP, | Reach Compliance Code: | compliant |
风险等级: | 5.72 | 其他特性: | DETECT VOLTAGE IS 4.9 V |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT |
JESD-30 代码: | R-PDSO-G5 | 长度: | 2.9 mm |
湿度敏感等级: | 1 | 信道数量: | 1 |
功能数量: | 1 | 端子数量: | 5 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LSSOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 座面最大高度: | 1.3 mm |
最大供电电压 (Vsup): | 6 V | 最小供电电压 (Vsup): | 1 V |
标称供电电压 (Vsup): | 2 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | GULL WING | 端子节距: | 0.95 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 10 |
宽度: | 1.6 mm | Base Number Matches: | 1 |
XC6103A349ML 数据手册
通过下载XC6103A349ML数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载XC6101~XC6107, XC6111~XC6117 Series
ETR0207_014a
Voltage Detector (VDF=1.6V~5.0V)
■GENERAL DESCRIPTION
The XC6101~XC6107, XC6111~XC6117 series are groups of high-precision, low current consumption voltage detectors with
manual reset input and watchdog functions incorporating CMOS process technology. The series consist of a reference
voltage source, delay circuit, comparator, and output driver. With the built-in delay circuit, the XC6101 ~ XC6107, XC6111 ~
XC6117 series do not require any external components to output signals with release delay time. Moreover, with the manual
reset function, reset can be asserted at any time. The ICs produce two types of output; VDFL (low when detected) and VDFH
(high when detected). With the XC6101 ~ XC6105, XC6111 ~ XC6115 series, the WD pin can be left open if the watchdog
function is not used. Whenever the watchdog pin is opened, the internal counter clears before the watchdog timeout occurs.
Since the manual reset pin is internally pulled up to the VIN pin voltage level, the ICs can be used by leaving the manual reset
pin unconnected if the pin is unused. The detect voltages are internally fixed 1.6V ~ 5.0V in increments of 0.1V, using laser
trimming technology. Six watchdog timeout periods are available in a range from 6.25ms to 1.6s. Seven release delay times
are available in a range from 3.13ms to 1.6s.
■FEATURES
■APPLICATIONS
Detect Voltage Range
Hysteresis Width
: 1.6V ~ 5.0V, +2%
(0.1V increments)
: VDF x 5%, TYP.
●Microprocessor reset circuits
●Memory battery backup circuits
●System power-on reset circuits
●Power failure detection
(XC6101~XC6107)
V
DF x 0.1%, TYP.
(XC6111~XC6117)
Operating Voltage Range : 1.0V ~ 6.0V
Detect Voltage Temperature: +100ppm/OC (TYP.)
Coefficient
Output Configuration
: N-channel open drain,
CMOS
Reset Output Options
: VDFL (Low when detected)
VDFH (High when detected)
Watchdog Function
: Watchdog input WD;
If it remains ether high or low for
the duration of the watchdog
timeout period,
a
reset is
asserted.
Manual Reset Function
Release Delay Time
: Manual Reset Input MRB;
When it changes from high to
low, a reset is asserted.
: 1.6s, 400ms, 200ms, 100ms,
50ms, 25ms, 3.13ms (TYP.)
Watchdog Timeout Period : 1.6s, 400ms, 200ms, 100ms,
50ms, 6.25ms (TYP.)
Packages
: SOT-25, USP-6C
Environmentally Friendly :EU RoHS Compliant, Pb Free
■TYPICAL APPLICATION CIRCUIT
■TYPICAL PERFORMANCE
CHARACTERISTICS
●Supply Current vs. Input Voltage
μP
VIN
XC61X1~XC61X5 (2.7V)
30
VIN
XC6101/XC6102
Rpull*
25
RESETB
INPUT
VIN
RESETB
20
Ta=25
MRB
WD
I/O
℃
Ta=85
℃
15
10
5
VSS
VSS
Ta=-40
5
℃
0
0
1
2
3
4
6
* Not necessary with CMOS output products.
Input Voltage: VIN (V)
ꢀ
* ‘x’ represents both ‘0’ and ‘1’. (ex. XC61x1⇒XC6101 and XC6111)
1/27
XC6101~XC6107, XC6111~XC6117 Series
■PIN CONFIGURATION
●SOT-25
XC6101, XC6102 Series
XC6111, XC6112 Series
XC6103 & XC6113 Series
XC6104, XC6105 Series
XC6114, XC6115 Series
XC6106, XC6107 Series
XC6116, XC6117 Series
MRB
V
IN
WD
WD
4
V
IN
V
IN
WD
4
V
IN
4
5
4
5
5
5
1
2
3
1
2
3
1
2
3
1
2
3
RESETB
V
SS RESET
RESET
V
SS
MRB
RESETB
V
SS RESET
RESETB
V
SS
MRB
SOT-25 (TOP VIEW)
SOT-25 (TOP VIEW)
SOT-25 (TOP VIEW)
SOT-25 (TOP VIEW)
●USP-6C
XC6101, XC6102 Series
XC6111, XC6112 Series
XC6103 & XC6113 Series
XC6104, XC6105 Series
XC6114, XC6115 Series
XC6106, XC6107 Series
XC6116, XC6117 Series
VIN
1 MRB
6
WD
1
2
VIN
1 WD
VIN
1 WD
2 MRB
3 NC
V IN
6
6
6
VSS 5
VSS
VSS 5
V SS
MRB
2
2 RESET
5
RESET
NC
3
5
4
3 NC
RESETB 4
4
RESETB
3 NC
4
RESETB
RESET
USP-6C (BOTTOM VIEW)
USP-6C (BOTTOM VIEW)
USP-6C (BOTTOM VIEW)
USP-6C (BOTTOM VIEW)
* The dissipation pad for the USP-6C package should be
solder-plated in recommended mount pattern and metal
masking so as to enhance mounting strength and heat
release. If the pad needs to be connected to other pins, it
should be connected to the VSS (No.5) pin.
■PIN ASSIGNMENT
PIN NUMBER
XC6101, XC6102
XC6111, XC6112
XC6103
XC6113
XC6104, XC6105 XC6106, XC6107
XC6114, XC6115 XC6116, XC6117
PIN NAME
FUNCTION
SOT-25 USP-6C SOT-25 USP-6C SOT-25 USP-6C SOT-25 USP-6C
Reset Output
RESETB
VSS
1
4
-
-
1
4
1
4
(VDFL: Low Level When Detected)
Ground
2
3
4
5
5
2
1
6
2
3
4
5
5
2
1
6
2
-
5
-
2
4
-
5
1
-
MRB
WD
VIN
Manual Reset
Watchdog
4
5
1
6
5
6
Power Input
Reset Output
-
-
1
4
3
2
3
2
RESET
(VDFH: High Level When Detected)
2/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■PRODUCT CLASSIFICATION
●Selection Guide
MANUAL
RESET
RESET OUTPUT
SERIES
WATCHDOG
VDFL (RESETB)
CMOS
VDFH (RESET)
XC6101
XC6102
XC6103
XC6104
XC6105
XC6106
XC6107
XC6111
XC6112
XC6113
XC6114
XC6115
XC6116
XC6117
Available
Available
Available
-
Available
N-channel open drain
-
-
Available
Available
CMOS
CMOS
CMOS
CMOS
CMOS
Available
Not Available
Not Available
Available
CMOS
Available
N-channel open drain
CMOS
Not Available
Not Available
Available
N-channel open drain
●Ordering Information
*1
(
)
XC61①②③④⑤⑥⑦⑧-⑨
DESIGNATOR
DESCRIPTION
Hysteresis Width
SYMBOL
DESCRIPTION
VDF x 5% (TYP.) with hysteresis
DF x 0.1% (TYP.) without hysteresis
0
1
①
V
Watchdog and manual functions, and reset
Functions and
②
③
1 ~ 7
output type as per Selection Guide in the above
Type of Reset Output
chart
A
B
C
D
E
F
3.13ms (TYP.)
25ms (TYP.)
50ms (TYP.)
Release Delay Time *
100ms (TYP.)
200ms (TYP.)
400ms (TYP.)
1.6s (TYP.)
H
No WD timeout period for
XC6106, XC6107, XC6116, XC6117 Series
6.25ms (TYP.)
50ms (TYP.)
0
1
2
3
4
5
6
④
Watchdog Timeout Period
100ms (TYP.)
200ms (TYP.)
400ms (TYP.)
1.6s (TYP.)
Detect voltage
ex.) 4.5V: ⑤⇒4, ⑥⇒5
SOT-25
⑤⑥
Detect Voltage
16 ~ 50
MR
MR-G
ER
Packages
Taping Type (*2)
SOT-25
⑦⑧-⑨
USP-6C
ER-G
USP-6C
* Please set the release delay time shorter than or equal to the watchdog timeout period.
ex.) XC6101D427MR or XC6101D327MR
(*1)
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or
(*2)
representative. (Standard orientation: ⑦R-⑨, Reverse orientation: ⑦L-⑨)
3/27
XC6101~XC6107, XC6111~XC6117 Series
■BLOCK DIAGRAMS
●XC6101, XC6111 Series
●XC6102, XC6112 Series
●XC6103, XC6113 Series
4/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■BLOCK DIAGRAMS (Continued)
●XC6104, XC6114 Series
●XC6105, XC6115 Series
●XC6106, XC6116 Series
●XC6107, XC6117 Series
5/27
XC6101~XC6107, XC6111~XC6117 Series
■ABSOLUTE MAXIMUM RATINGS
Ta = 25OC
UNITS
V
PARAMETER
SYMBOL
VIN
RATINGS
VSS -0.3 ~ 7.0
V
SS-0.3~VIN+0.3≦7.0
VSS -0.3 ~ 7.0
20
Input Voltage
MRB
WD
V
V
Output Current
IOUT
mA
V
SS-0.3~VIN+0.3≦7.0
VSS -0.3 ~ 7.0
250
CMOS Output
RESETB/RESET
RESETB
Output Voltage
V
N-ch Open Drain Output
SOT-25
Power Dissipation
Pd
mW
USP-6C
100
Operational Temperature Range
Storage Temperature Range
Ta
-40 ~ +85
OC
OC
Tstg
-40 ~ +125
6/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■ELECTRICAL CHARACTERISTICS
●XC6101~XC6107, XC6111~XC6117 Series
Ta = 25 OC
PARAMETER
Detect Voltage
SYMBOL
VDFL
CONDITIONS
MIN.
VDF(T)
× 0.98
VDF
TYP.
VDF(T)
VDF
MAX.
VDF(T)
× 1.02
VDF
UNITS CIRCUIT
V
V
V
①
①
①
VDFH
Hysteresis Width
XC6101~XC6107 (*1)
Hysteresis Width
VHYS
× 0.02 × 0.05 × 0.08
VDF
VDF
XC6111~XC6117 (*2)
× 0.001 x 0.01
VHYS
0
XC61X1/XC61X2/XC61X3
XC61X4/XC61X5 (*3)
(The MRB & the WD Pin:
No connection)
VIN=VDF(T)×0.9V
VIN=VDF(T)×1.1V
VIN=6.0V
-
-
-
-
-
5
10
12
4
11
16
18
10
14
Supply Current
ISS
VIN
μA
V
②
XC61X6/XC61X7 (*3)
(The MRB Pin:
VIN=VDF(T)×0.9V
VIN=VDF(T)×1.1V
VIN=6.0V
8
No connection)
-
10
-
0.5
16
6.0
-
Operating Voltage
1.0
0.15
①
③
VIN=1.0V
VIN=2.0V (VDFL(T)> 2.0V)
VIN=3.0V (VDFL(T) >3.0V)
VIN=4.0V (VDFL(T) >4.0V)
2.0
3.0
3.5
2.5
3.5
4.0
-
-
-
N-ch.
VDS = 0.5V
VDFL
Output Current
(RESETB)
IRBOUT
mA
CMOS,
P-ch
VIN=6.0V
-
- 1.1
-0.8
④
③
VDS = 0.5V
N-ch
VIN=6.0V
4.4
4.9
-
VDS = 0.5V
VIN=1.0V
VIN=2.0V (VDFH(T)> 2.0V)
VIN=3.0V (VDFH(T)>3.0V)
VIN=4.0V (VDFH(T)>4.0V)
-
-
-
-
- 0.08
- 0.50
- 0.75
- 0.95
- 0.02
- 0.30
- 0.55
- 0.75
VDFH
Output Current
(RESET)
IROUT
mA
P-ch.
VDS = 0.5V
④
①
Temperature
Coefficient
△VDF /
(△Ta・VDF)
-40OC < Topr < 85 OC
-
+100
-
ppm/ OC
2
3.13
25
5
18
31
Time until VIN is increased from
1.0V to 2.0V
and attains to the release time level,
and the Reset output pin inverts.
37
50
63
Release Delay Time
(VDF<1.8V)
TD R
ms
⑤
75
100
200
400
125
250
500
150
300
1200
2
1600
3.13
2000
5
18
37
25
50
31
63
Time until VIN is increased from
1.0V to (VDFx1.1V)
and attains to the release time level,
and the Reset output pin inverts.
Release Delay Time
(VDF>1.9V)
TD R
ms
⑤
⑤
75
100
200
400
1600
125
250
500
2000
150
300
1200
Time until VIN is decreased from 6.0V to
1.0V and attains to the detect voltage
level, and the Reset output pin detects
while the WD pin left opened.
Detect Delay Time
TD F
-
3
30
μs
VDFL/VDFH
CMOS Output
Leak Current
VDFL N-ch Open Drain
Output
VIN=6.0V, RESETB=6.0V (VDFL)
VIN=6.0V, RESET=0V (VDFH)
ILEAK
ILEAK
-
-
0.01
0.01
-
μA
μA
③
③
VIN=6.0V, RESETB=6.0V
0.10
Leak Current
NOTE:
*1: XC6101~XC6107 (with hysteresis)
*2: XC6111~XC6117 (without hysteresis)
*3: ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)
*4: VDF(T): Setting detect voltage
*5: If only “VDF” is indicated, it represents both VDFL (low when detected) and VDFH (high when detected).
7/27
XC6101~XC6107, XC6111~XC6117 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC6101~XC6105, XC6111~XC6115 Series
Ta = 25 OC
PARAMETER
SYMBOL
CONDITIONS
MIN.
4.25
37
TYP.
6.25
50
MAX. UNITS CIRCUIT
8.25
63
Time until VIN increases form
1.0V to 2.0V and
the Reset output pin is released to go into
Watchdog
Timeout Period
(VDF<1.8V)
75
100
200
400
1600
6.25
50
125
TW D
ms
⑥
150
300
1200
4.25
37
250
500
2000
8.25
63
the detection state. (WD=VSS)
Time until VIN increases form
1.0V to (VDFx1.1V)
and the Reset output pin is released to go
Watchdog
Timeout Period
(VDF>1.9V)
75
100
200
400
1600
125
250
500
2000
TW D
ms
ns
⑥
⑦
150
300
1200
into the detection state. (WD=VSS)
VIN=6.0V,
Apply pulse from 6.0V to 0V
to the WD pin.
Watchdog
Minimum Pulse Width
TWDIN
300
-
-
Watchdog
High Level Voltage
Watchdog
VWDH
VWDL
VIN=VDF x 1.1V ~ 6.0V
VIN=VDF x 1.1V ~ 6.0V
VIN x 0.7
0
-
-
6
V
V
⑦
⑦
VIN x 0.3
Low Level Voltage
VIN=6.0V, VWD=6.0V (Avg. when peak )
VIN=6.0V, VWD=0V (Avg. when peak)
-
12
19
-
Watchdog
Input Current
IWD
μA
kΩ
⑧
⑧
- 19
-12
Watchdog
Input Resistance
RWD
VIN=6.0V, VWD=0V, RWD=VIN/ |IWD|
315
500
880
●XC6101 ~ XC6103, XC6106 ~ XC6107, XC6111 ~ XC6113, XC6116 ~ XC6117 Series
O
Ta = 25 C
PARAMETER
MRB
High Level Voltage
MRB
Low Level Voltage
MRB
Pull-up Resistance
MRB Minimum
Pulse Width (*3)
XC6101~XC6105
XC6111~XC6115
MRB Minimum
Pulse Width (*4)
XC6106, XC6107
XC6116, XC6117
SYMBOL
VMRH
CONDITIONS
MIN.
1.4
TYP.
-
MAX. UNITS CIRCUIT
VIN=VDFx1.1V ~ 6.0V
VIN
0.35
3.0
⑨
⑨
⑩
V
VMRL
RMR
VIN=VDFx1.1V ~ 6.0V
0
-
VIN=6.0V, MRB=0V, RMR=VIN/ |IMRB|
1.6
2.4
MΩ
VIN=6.0V,
Apply pulse from 6.0V to 0V to
the MRB pin
TMRIN
TMRIN
2.8
1.2
-
-
-
-
μs
⑪
VIN=6.0V,
Apply pulse from 6.0V to 0V to
the MRB pin
NOTE:
*1: VDF(T): Setting detect voltage
*2: If only “VDF” is indicated, it represents both VDFL (low when detected) and VDFH (high when detected).
*3: Watchdog function is available.
*4: Watchdog function is not available.
8/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■OPERATIONAL EXPLANATION
The XC6101~XC6107, XC6111~XC6117 series compare, using the amplifier, the voltage of the internal voltage reference
source with the voltage divided by R1, R2 and R3 connected to the VIN pin. The resulting output signal from the error
amplifier activates the watchdog logic, manual reset logic, delay circuit and the output driver. When the VIN pin voltage
gradually falls and finally reaches the detect voltage, the RESETB pin output goes from high to low in the case of the VDFL type
ICs, and the RESET pin output goes from low to high in the case of the VDFH type ICs.
<RESETB / RESET Pin Output Signal>
* VDFL (RESETB) type - output signal: Low when detected.
The RESETB pin output goes from high to low whenever the VIN pin voltage falls below the detect voltage, or whenever the
MRB pin is driven from high to low. The RESETB pin remains low for the release delay time (TDR) after the VIN pin voltage
reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period,
the RESETB pin output remains low for the release delay time (TDR), and thereafter the RESET pin outputs high level signal.
* VDFH (RESET) type – output signal: High when detected.
The RESET pin output goes from low to high whenever the VIN pin voltage falls below the detect voltage, or whenever the
MRB pin is driven from high to low. The RESET pin remains high for the release delay time (TDR) after the VIN pin voltage
reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period,
the VOUT pin output remains high for the release delay time (TDR), and thereafter the RESET pin outputs low level signal.
<Hysteresis>
When the internal comparator output is high, the N-Channel transistor connected in parallel to R3 is turned ON, activating the
hysteresis circuit. The difference between the release and detect voltages represents the hysteresis width, as shown by the
following calculations:
VDF (detect voltage) = (R1+R2+R3) x Vref(R2+R3)
VDR (release voltage) = (R1+R2) x Vref(R2)
VHYS (hysteresis width)=VDR-VDF (V)
VDR > VDF
* Detect voltage (VDF) includes conditions of both VDFL (low when detected) and VDFH (high when detected).
* Please refer to the block diagrams for R1, R2, R3 and Vref.
Hysteresis width is selectable from VDF x 0.05V (XC6101~XC6107) or VDF x 0.001V (XC6111~XC6117).
<Watchdog (WD) Pin>
The XC6101~XC6107, XC6111~XC6117 series use a watchdog timer to detect malfunction or “runaway” of the
microprocessor. If neither rising nor falling signals are applied from the microprocessor within the watchdog timeout period,
the RESETB/RESET pin output maintains the detection state for the release delay time (TDR), and thereafter the
RESET/RESETB pin output returns to the release state (Please refer to the FUNCTION CHART). The timer in the watchdog
is then restarted. Six watchdog timeout period settings are available in 1.6s, 400ms, 200ms, 100ms, 50ms, 6.25ms.
<MRB Pin>
Using the MRB voltage pin input, the RESET/RESETB pin signal can be forced to the detection state. When the MRB pin is
driven from high to low, the RESETB pin output goes from high to low level signal in the case of the VDFL type ICs, and the
RESET pin output goes from low to high in the case of the VDFH type. Even after the MRB pin is driven back high, the
RESET/RESETB pin output maintains the detection state for the release delay time (TDR). Since the MRB pin is internally
pulled up to the VIN pin voltage level, leave the MRB pin open if unused (Please refer to the FUNCTION CHART). A diode,
which is an input protection element, is connected between the MRB pin and VIN pin. Therefore, if the MRB pin is applied
voltage that exceeds VIN, the current will flow to VIN through the diode. Please use this IC within the stated maximum ratings
(VSS-0.3~VIN+0.3≦7.0V) on the MRB pin.
<Release Delay Time>
Release delay time (TDR) is the time that elapses from when the VIN pin reaches the release voltage, or when the watchdog
timeout period expires with no rising signal applied to the WD pin, until the RESET/RESETB pin output is released from the
detection state. Seven release delay time (TDR) watchdog timeout period settings are available in 1.6s, 400ms, 200ms,
100ms, 50ms, 25ms, 3.13ms.
<Detect Delay Time>
Detect Delay Time (TDF) is the time that elapses from when the VIN pin voltage falls to the detect voltage until the RESET/
RESETB pin output goes into the detection state.
9/27
XC6101~XC6107, XC6111~XC6117 Series
■TIMING CHARTS
●CMOS Output
●TD F (CMOS Output)
VIN
6.0V
VIN Pin Wave Form
VDFL Level
1.0V
GND
TDF
VIN Level
VDFL Level
RESETB Pin Wave Form (VDFL)
VIN x 0.1V
GND
0.6V
10/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■NOTES ON USE
1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent
damage to the device.
2. When a resistor is connected between the VIN pin and the input, the VIN voltage drops while the IC is operating and a
malfunction may occur as a result of the IC’s through current. For the CMOS output products, the VIN voltage drops while
the IC is operating and malfunction may occur as a result of the IC’s output current. Please be careful with using the
XC6111~XC6117 series (without hysteresis).
3. In order to stabilize the IC’s operations, please ensure that the VIN pin’s input frequency’s rise and fall times are more than
some μs/V.
4. Noise at the power supply may cause a malfunction of the watchdog operation or the circuit. In such case, please
strength the line between VIN and the GND pin and connect about 0.22μF of a capacitor between the VIN pin and the GND
pin.
5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise
and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900μs at maximum.
6. The watchdog function can be disabled by connecting a three-state device to the WDI pin as a result of the high impedance
state of the WDI pin. This is effective when the watchdog function is not required, for example, during data loading to the
CPU. The WDI input is internally driven through a buffer (LOGIC) and series resistor (RWD) from the watchdog counter as
showed in the block diagrams of page 4 and 5. The WDI input is designed for minimizing the input current by placing the
series resistor (RWD) in the maximum resistance of 880kΩ. A voltage drop occurs in proportion to the leakage current of the
three-state device multiplied by the resistance value of the series resistor (RWD) when the three-state device is in the state
of high impedance. The voltage level must be reaching the threshold level of the WD so that a three-state device with small
leakage current should be selected.
The other series is available in the name of XC6121~XC6124 with the ON/OFF control pin for the watchdog function.
When these series is used, external parts such as the three-state device is not required.
● No Reaction Time
No reaction time
No reaction time
(MAX 900μs)
(MAX 900μs)
11/27
XC6101~XC6107, XC6111~XC6117 Series
■PIN LOGIC CONDITIONS
PIN NAME
LOGIC
CONDITIONS
NOTE:
H
VIN>VDF+VHYS
*1: If only “VDF” is indicated, it represents both VDFL (low when
detected) and VDFH (high when detected).
*2: For the details of each parameter, please see the electrical
characteristics.
VIN
L
VIN<VDF
H
MRB>1.40V
MRB
WD
L
H
MRB<0.35V
VDF: Detect Voltage
VHYS: Hysteresis Width
When keeping WD>VWDH more than tWD
When keeping WD<VWDL more than tWD
VWDL → VWDH, TWDIN>300ns
VWDH →VWDH, TWDIN>300ns
VWDH: WD High Level Voltage
VWDL: WD Low Level Voltage
TWDIN: WD Pulse Width
L
L → H
H → L
tW D : WD Timeout Period
■FUNCTION CHART
●XC6101/XC61111, XC6102/6112 Series
VIN
H
H
H
H
H
H
L
MRB
WD
H
RESETB (*2)
Repeat detect and release (H→L→H)
L
H or Open
Open
L → H
H → L
H
L
L
*1
●XC6103/XC61113 Series
VIN
H
H
H
H
H
H
L
MRB
WD
H
RESETB (*3)
Repeat detect and release (L→H→L)
L
H or Open
Open
L → H
H → L
L
L
*1
H
●XC6104/XC61114, XC6105/XC6115 Series
VIN
H
WD
H
RESETB (*2)
RESET (*3)
Repeat detect and release (H→L→H)
Repeat detect and release (L→H→L)
H
L
H
Open
L → H
H → L
*1
H
L
L
H
H
L
H
●XC6106/XC61116, XC6107/XC6117 Series
VIN
H
MRB
RESETB (*2)
RESET (*3)
L
H or Open
H
H
L
L
H
L
*1: Including all logic of WD (WD=H, L, L→H, H→L, OPEN).
*2: When the RESETB is High, the circuit is in the release state.
When the RESETB is Low, the circuit is in the detection state.
*3: When the RESET is High, the circuit is in the release state.
When the RESET is Low, the circuit is in the detection state.
*4: VIN=L and MRB=H can not be combined for the rated input voltage of the MRB pin is Vss-0.3V to VIN+0.3V.
*5: The RESET/RESETB pin becomes indefinite operation while 0.35V<MRB<1.4V.
12/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■TEST CIRCUITS
Circuit 1
Circuit 2
Circuit 3
Circuit 4
13/27
XC6101~XC6107, XC6111~XC6117 Series
■TEST CIRCUITS (Continued)
Circuit 5
Circuit 6
Circuit 7
14/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■TEST CIRCUITS (Continued)
Circuit 8
Circuit 9
100kΩ
(Not used when the CMOS
Output products selected.)
Circuit 10
Circuit 11
15/27
XC6101~XC6107, XC6111~XC6117 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1.1) Supply Current vs. Input Voltage
XC61X1~XC61X5 (1.6V)
XC61X1~XC61X5 (2.7V)
30
25
20
15
10
5
30
25
20
15
10
5
Ta=25
℃
Ta=25
Ta=85
℃
℃
Ta=85
℃
Ta=-40
5
℃
Ta=-40
5
℃
0
0
0
1
2
3
4
6
0
1
2
3
4
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
XC61X1~XC61X5 (5.0V)
30
25
20
15
10
5
Ta=85
℃
Ta=25
℃
Ta=-40
5
℃
0
0
1
2
3
4
6
Input Voltage: VIN (V)
(1.2) Supply Current vs. Input Voltage
XC61X6~XC61X7 (1.6V)
30
XC61X6~XC61X7 (2.7V)
30
25
20
15
10
5
25
20
15
Ta=25
℃
Ta=25
℃
Ta=85
℃
Ta=85
℃
10
5
Ta=-40
5
Ta=-40
5
℃
℃
0
0
0
1
2
3
4
6
0
1
2
3
4
6
I
Input Voltage: VIN (V)
Input Voltage: VIN (V)
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)
16/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(1.2) Supply Current vs. Input Voltage (Continued)
XC61X6~XC61X7 (5.0V)
30
25
20
15
Ta=25
Ta=85
℃
℃
10
5
Ta=-40
5
℃
0
0
1
2
3
4
6
Input Voltage: VIN (V)
(2) Detect, Release Voltage vs. Ambient Temperature
XC61X1~XC61X7 (1.6V)
1.70
XC61X1~XC61X7 (2.7V)
2.90
2.80
2.70
2.60
VDR
1.65
VDR
1.60
VDF
VDF
1.55
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
XC61X1~XC61X7 (5.0V)
5.30
5.20
5.10
5.00
4.90
VDR
VDF
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (℃)
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)
17/27
XC6101~XC6107, XC6111~XC6117 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3.1) Detect, ReleaseVoltagevs.InputVoltage (VDFL)
XC6101~XC6107 (1.6V)
Rpull:100kΩ
XC6101~XC6107 (2.7V)
2.0
1.5
1.0
0.5
0.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Rpull:100kΩ
Ta=-40
℃
℃
℃
Ta=-40
℃
℃
℃
25
85
ꢀꢀ
ꢀꢀ
↓:
↑:
25
85
ꢀꢀ
ꢀꢀ
↓:
↑:
VDF
VDR
VDF
VDR
0
1
2
0
1
2
3
Input Voltage: VIN (V)
Input Voltage: VIN (V)
XC6101~XC6107 (5.0V)
6.0
Rpull:100kΩ
5.0
4.0
3.0
2.0
1.0
0.0
Ta=-40
℃
℃
℃
25
85
ꢀꢀ
ꢀꢀ
↓:
↑:
VDF
VDR
0
1
2
3
4
5
6
Input Voltage: VIN (V)
(3.2) Detect, Release Voltage vs. Input Voltage (VDFH)
XC6103~XC6107 (1.6V)
XC6103~XC6107 (2.7V)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.0
Rpull:100kΩ
Rpull:100kΩ
Ta=-40
Ta=-40
℃
℃
25
85
VDF
VDR
25
85
VDF
VDR
ꢀꢀ
ꢀꢀ
↑:
↓:
℃
℃
ꢀꢀ
ꢀꢀ
↑:
↓:
℃
℃
1.5
1.0
0.5
0.0
0
1
2
0
1
2
3
Input Voltage: VIN(V)
Input Voltage: VIN (V)
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)
18/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3.2) Detect, Release Voltage vs. Input Voltage (VDFH) (Continued)
XC6103~XC6107 (5.0V)
6.0
Rpull:100kΩ
Ta=-40
℃
℃
℃
5.0
4.0
3.0
2.0
1.0
0.0
25
85
ꢀꢀ
ꢀꢀ
↑:
↓:
VDF
VDR
0
1
2
3
4
5
6
)
Input Voltage: VIN (V)
(4) N-ch Driver Output Current vs. VDS
XC61X1~XC61X7
6
XC61X1~XC61X7
20
16
12
8
Ta=25
Ta=25
℃
℃
VIN=4.0V
VIN=2.0V
5
4
3
2
1
0
VIN=3.0V
4
VIN=1.0V
0
0
1
2
3
0
1
2
3
4
5
6
VDS (V)
VDS (V)
(5) N-ch Driver Output Current vs. Input Voltage
XC61X1~XC61X7
6.0
VDS=0.5V
Ta=-40
℃
5.0
4.0
3.0
2.0
1.0
0.0
Ta=25
℃
Ta=85
℃
0
1
2
3
4
5
6
Input Voltage: VIN (V)
ꢀ
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)
19/27
XC6101~XC6107, XC6111~XC6117 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(6) P-ch Driver Output Current vs. Input Voltage 1
(7) P-ch Driver Output Current vs. Input Voltage 2
XC61X1, XC61X3~XC61X7
6.0
XC61X1, XC61X3~XC61X7
2.0
VDS=0.5V
Ta=25
℃
5.0
4.0
3.0
2.0
1.0
0.0
1.6
VDS=2.0V
1.5V
Ta=-40
℃
1.2
0.8
0.4
0.0
Ta=25
℃
1.0V
0.5V
Ta=85
℃
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
ꢀ
ꢀ
(8) Release Delay Time vs. Ambient Temperature
XC61X1~XC61X7
6.0
XC61X1~XC61X7
300
TDR=3.13ms
TDR=100ms
5.0
4.0
3.0
2.0
1.0
0.0
250
200
150
100
50
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (
)
Ambient Temperature: Ta (
)
℃
℃
XC61X1~XC61X7
3000
2500
2000
1500
1000
500
TDR=1.6s
0
-50 -25
0
25
50
75
100
Ambient Temperature: Ta (
)
℃
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)
20/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) Watchdog Timeout Period vs. Ambient Temperature
XC61X1~XC61X5
XC61X1~XC61X5
300
250
200
150
100
50
12
TWD=100ms
TWD=6.25ms
10
8
6
4
2
0
0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (
)
℃
Ambient Temperature: Ta (
)
℃
XC61X1~XC61X5
3000
2500
2000
1500
1000
500
TWD=1.6s
0
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (
)
℃
(10) Release Delay Time vs. Input Voltage
(11) Watchdog Timeout Period vs. Input Voltage
XC61x1~XC61x5
120
XC61x1~XC61x7
120
Ta=25℃
Ta=25℃
TWD=100ms
TWD=100ms
110
100
90
110
100
90
80
80
70
70
60
60
1
2
3
4
5
6
7
1
2
3
4
5
6
7
Input Voltage: VIN (V)
Input Voltage: VIN (V)
ꢀ
ꢀ
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)
21/27
XC6101~XC6107, XC6111~XC6117 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) Watchdog Low Level Voltage vs. Ambient Temperature
(13) Watchdog High Level Voltage vs. Ambient Temperature
XC61X1~XC61X5
6.0
XC61X1~XC61X5
6.0
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
VIN=6.0V
3.0
2.0
1.0
0.0
VIN=6.0V
VIN=3.0V
VIN=3.0V
VIN=1.76V
VIN=1.76V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature: Ta (
)
℃
Ambient Temperature: Ta (
)
℃
(14) MRB Low Level Voltage vs. Ambient Temperature
(15) MRB High Level Voltage vs. Ambient Temperature
XC61X1~XC61X3, XC61X6~XC61X7
1.10
XC61X1~XC61X3, XC61X6~XC61X7
1.10
1.00
1.00
0.90
0.90
VIN=6.0V
VIN=3.0V
0.80
0.80
VIN=6.0V
VIN=3.0V
0.70
0.70
VIN=1.76V
0.60
0.60
VIN=1.76V
0.50
0.50
-50
-25
0
25
50
75
100
-50 -25
0
25
50
75 100
Ambient Temperature: Ta (
)
℃
Ambient Temperature: Ta (
)
℃
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)
22/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■PACKAGING INFORMATION
●SOT-25
●USP-6C
●USP-6C Reference Metal Mask Design
●USP-6C Reference Pattern Layout
23/27
XC6101~XC6107, XC6111~XC6117 Series
■MARKING RULE
●SOT-25
① represents product series
MARK
PRODUCT SERIES
MARK
PRODUCT SERIES
XC6111xxxxxx
XC6112xxxxxx
XC6113xxxxxx
XC6114xxxxxx
XC6115xxxxxx
XC6116xxxxxx
XC6117xxxxxx
0
1
2
3
4
5
6
XC6101xxxxxx
XC6102xxxxxx
XC6103xxxxxx
XC6104xxxxxx
XC6105xxxxxx
XC6106xxxxxx
XC6107xxxxxx
7
8
9
A
B
C
D
①
②
③ ④
SOT-25
(TOP VIEW)
② represents release delay time and watchdog timeout period
RELEASE
DELAY
TIME
RELEASE
DELAY
TIME
WATCH DOG
TIMEOUT PERIOD
PRODUCT
SERIES
WATCH DOG
TIMEOUT PERIOD
PRODUCT
SERIES
MARK
MARK
A
0
1
2
3
4
5
B
6
7
3.13ms XC61X6, XC61X7 series XC61xxA0xxxx
E
F
D
H
K
L
M
E
P
R
S
F
50ms
50ms
400ms
1.6s
XC61xxC5xxxx
XC61xxC6xxxx
3.13ms
3.13ms
3.13ms
3.13ms
3.13ms
3.13ms
25ms
6.25ms
50ms
100ms
200ms
400ms
1.6s
XC61xxA1xxxx
XC61xxA2xxxx
XC61xxA3xxxx
XC61xxA4xxxx
XC61xxA5xxxx
XC61xxA6xxxx
100ms
100ms
100ms
100ms
100ms
200ms
200ms
200ms
200ms
400ms
400ms
400ms
1.6s
XC61X6, XC61X7 series XC61xxD0xxxx
100ms
200ms
400ms
1.6s
XC61xxD3xxxx
XC61xxD4xxxx
XC61xxD5xxxx
XC61xxD6xxxx
XC61X6, XC61X7 series XC61xxB0xxxx
XC61X6, XC61X7 series XC61xxE0xxxx
25ms
25ms
25ms
25ms
50ms
100ms
200ms
400ms
1.6s
XC61xxB2xxxx
XC61xxB3xxxx
XC61xxB4xxxx
XC61xxB5xxxx
XC61xxB6xxxx
200ms
400ms
1.6s
XC61xxE4xxxx
XC61xxE5xxxx
XC61xxE6xxxx
8
9
XC61X6, XC61X7 series XC61xxF0xxxx
A
C
B
C
D
25ms
T
400ms
1.6s
XC61xxF5xxxx
XC61xxF6xxxx
50ms
XC61X6, XC61X7 series XC61xxC0xxxx
U
H
V
50ms
50ms
50ms
50ms
100ms
200ms
XC61xxC2xxxx
XC61xxC3xxxx
XC61xxC4xxxx
XC61X6, XC61X7 series XC61xxH0xxxx
1.6s
1.6s
XC61xxH6xxxx
③ represents detect voltage
XC6101/11/02/12/03/13/04/14/15/06/16/07/17Series
MARK
DETECT VOLTAGE
PRODUCT SERIES
XC61Xxxx16xx
XC61Xxxx17xx
XC61Xxxx18xx
XC61Xxxx19xx
XC61Xxxx20xx
XC61Xxxx21xx
XC61Xxxx22xx
XC61Xxxx23xx
XC61Xxxx24xx
XC61Xxxx25xx
XC61Xxxx26xx
XC61Xxxx27xx
XC61Xxxx28xx
XC61Xxxx29xx
XC61Xxxx30xx
XC61Xxxx31xx
XC61Xxxx32xx
XC61Xxxx33xx
MARK
DETECT VOLTAGE
PRODUCT SERIES
XC61Xxxx34xx
XC61Xxxx35xx
XC61Xxxx36xx
XC61Xxxx37xx
XC61Xxxx38xx
XC61Xxxx39xx
XC61Xxxx40xx
XC61Xxxx41xx
XC61Xxxx42xx
XC61Xxxx43xx
XC61Xxxx44xx
XC61Xxxx45xx
XC61Xxxx46xx
XC61Xxxx47xx
XC61Xxxx48xx
XC61Xxxx49xx
XC61Xxxx50xx
F
H
K
L
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3
4
5
6
7
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
M
N
P
R
S
T
U
V
X
Y
Z
0
8
9
A
B
C
D
E
F
H
K
L
1
2
M
24/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
■MARKING RULE (Continued)
③ represents detect voltage
XC6105 Series
MARK
DETECT VOLTAGE
PRODUCT SERIES
XC6105XX16XX
MARK
DETECT VOLTAGE
PRODUCT SERIES
XC6105XX34XX
F
H
K
L
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3
4
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
XC6105XX17XX
XC6105XX18XX
XC6105XX19XX
XC6105XX20XX
XC6105XX21XX
XC6105XX22XX
XC6105XX23XX
XC6105XX24XX
XC6105XX25XX
XC6105XX26XX
XC6105XX27XX
XC6105XX28XX
XC6105XX29XX
XC6105XX30XX
XC6105XX31XX
XC6105XX32XX
XC6105XX33XX
XC6105XX35XX
XC6105XX36XX
XC6105XX37XX
XC6105XX38XX
XC6105XX39XX
XC6105XX40XX
XC6105XX41XX
XC6105XX42XX
XC6105XX43XX
XC6105XX44XX
XC6105XX45XX
XC6105XX46XX
XC6105XX47XX
XC6105XX48XX
XC6105XX49XX
XC6105XX50XX
5
6
M
N
P
R
S
T
U
V
X
Y
Z
0
7
8
9
A
B
C
D
E
F
H
K
L
1
M
2
④ represents production lot number
0 to 9 and A to Z and inverted 0 to 9 and A to Z repeated. (G, I, J, O, Q, W excluded.)
25/27
XC6101~XC6107, XC6111~XC6117 Series
■MARKING RULE (Continued)
●USP-6C
① represents product series
MARK
PRODUCT SERIES
MARK
PRODUCT SERIES
XC6111xxxxxx
XC6112xxxxxx
XC6113xxxxxx
XC6114xxxxxx
XC6115xxxxxx
XC6116xxxxxx
XC6117xxxxxx
3
4
5
6
7
3
4
XC6101xxxxxx
XC6102xxxxxx
XC6103xxxxxx
XC6104xxxxxx
XC6105xxxxxx
XC6106xxxxxx
XC6107xxxxxx
8
9
A
B
C
8
USP-6C
9
(TOP VIEW)
② represents release delay time
MARK
RELEASE DELAY TIME
PRODUCT SERIES
XC61XxAxxxxx
XC61XxBxxxxx
XC61XxCxxxxx
XC61XxDxxxxx
XC61XxExxxxx
XC61XxFxxxxx
XC61XxHxxxxx
A
B
C
D
E
F
3.13ms
25ms
50ms
100ms
200ms
400ms
1.6s
H
③ represents watchdog timeout period
MARK
WATCHDOG TIMEOUT PERIOD
PRODUCT SERIES
XC61Xxx0xxxx
XC61Xxx1xxxx
XC61Xxx2xxxx
XC61Xxx3xxxx
XC61Xxx4xxxx
XC61Xxx5xxxx
XC61Xxx6xxxx
0
1
2
3
4
5
6
XC61X6, XC61X7 series
6.25ms
50ms
100ms
200ms
400ms
1.6s
④⑤ represents detect voltage
MARK
DETECT VOLTAGE (V)
PRODUCT SERIES
④
3
⑤
3
3.3
5.0
XC61Xxxx33xx
XC61Xxxx50xx
5
0
⑥ represents production lot number
0 to 9 and A to Z repeated. (G, I, J, O, Q, W excluded.)
X No character inversion used.
XX ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)
26/27
XC6101 ~ XC6107, XC6111~ XC6117
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
27/27
XC6103A349ML 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
XC6103A349ML-G | TOREX | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, SOT-25, 5 PIN | 获取价格 | |
XC6103A349MR-G | TOREX | XC6103系列是采用CMOS工艺生产的,带有手动复位控制端和看门狗(Watch Dog)功能,具有高精度,低功耗特点的电压检测器,内部电路包括参考电压源电路,延迟电路,比较器电路和输出驱动电路。 | 获取价格 | |
XC6103A350 | TOREX | CMOS Voltage Detector | 获取价格 | |
XC6103A350EL | TOREX | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO6, USP-6 | 获取价格 | |
XC6103A350EL-G | TOREX | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO6, USP-6 | 获取价格 | |
XC6103A350ER-G | TOREX | XC6103系列是采用CMOS工艺生产的,带有手动复位控制端和看门狗(Watch Dog)功能,具有高精度,低功耗特点的电压检测器,内部电路包括参考电压源电路,延迟电路,比较器电路和输出驱动电路。 | 获取价格 | |
XC6103A350ML | TOREX | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, SOT-25, 5 PIN | 获取价格 | |
XC6103A350MR-G | TOREX | XC6103系列是采用CMOS工艺生产的,带有手动复位控制端和看门狗(Watch Dog)功能,具有高精度,低功耗特点的电压检测器,内部电路包括参考电压源电路,延迟电路,比较器电路和输出驱动电路。 | 获取价格 | |
XC6103A416 | TOREX | CMOS Voltage Detector | 获取价格 | |
XC6103A416EL | TOREX | Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO6, USP-6 | 获取价格 |
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