XC6103A418ML [TOREX]

Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, SOT-25, 5 PIN;
XC6103A418ML
型号: XC6103A418ML
厂家: Torex Semiconductor    Torex Semiconductor
描述:

Power Supply Management Circuit, Fixed, 1 Channel, CMOS, PDSO5, SOT-25, 5 PIN

光电二极管
文件: 总27页 (文件大小:411K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
XC6101~XC6107, XC6111~XC6117 Series  
ETR0207_014a  
Voltage Detector (VDF=1.6V~5.0V)  
GENERAL DESCRIPTION  
The XC6101~XC6107, XC6111~XC6117 series are groups of high-precision, low current consumption voltage detectors with  
manual reset input and watchdog functions incorporating CMOS process technology. The series consist of a reference  
voltage source, delay circuit, comparator, and output driver. With the built-in delay circuit, the XC6101 ~ XC6107, XC6111 ~  
XC6117 series do not require any external components to output signals with release delay time. Moreover, with the manual  
reset function, reset can be asserted at any time. The ICs produce two types of output; VDFL (low when detected) and VDFH  
(high when detected). With the XC6101 ~ XC6105, XC6111 ~ XC6115 series, the WD pin can be left open if the watchdog  
function is not used. Whenever the watchdog pin is opened, the internal counter clears before the watchdog timeout occurs.  
Since the manual reset pin is internally pulled up to the VIN pin voltage level, the ICs can be used by leaving the manual reset  
pin unconnected if the pin is unused. The detect voltages are internally fixed 1.6V ~ 5.0V in increments of 0.1V, using laser  
trimming technology. Six watchdog timeout periods are available in a range from 6.25ms to 1.6s. Seven release delay times  
are available in a range from 3.13ms to 1.6s.  
FEATURES  
APPLICATIONS  
Detect Voltage Range  
Hysteresis Width  
: 1.6V ~ 5.0V, +2%  
(0.1V increments)  
: VDF x 5%, TYP.  
Microprocessor reset circuits  
Memory battery backup circuits  
System power-on reset circuits  
Power failure detection  
(XC6101~XC6107)  
V
DF x 0.1%, TYP.  
(XC6111~XC6117)  
Operating Voltage Range : 1.0V ~ 6.0V  
Detect Voltage Temperature: +100ppm/OC (TYP.)  
Coefficient  
Output Configuration  
: N-channel open drain,  
CMOS  
Reset Output Options  
: VDFL (Low when detected)  
VDFH (High when detected)  
Watchdog Function  
: Watchdog input WD;  
If it remains ether high or low for  
the duration of the watchdog  
timeout period,  
a
reset is  
asserted.  
Manual Reset Function  
Release Delay Time  
: Manual Reset Input MRB;  
When it changes from high to  
low, a reset is asserted.  
: 1.6s, 400ms, 200ms, 100ms,  
50ms, 25ms, 3.13ms (TYP.)  
Watchdog Timeout Period : 1.6s, 400ms, 200ms, 100ms,  
50ms, 6.25ms (TYP.)  
Packages  
: SOT-25, USP-6C  
Environmentally Friendly :EU RoHS Compliant, Pb Free  
TYPICAL APPLICATION CIRCUIT  
TYPICAL PERFORMANCE  
CHARACTERISTICS  
Supply Current vs. Input Voltage  
μP  
VIN  
XC61X1~XC61X5 (2.7V)  
30  
VIN  
XC6101/XC6102  
Rpull*  
25  
RESETB  
INPUT  
VIN  
RESETB  
20  
Ta=25  
MRB  
WD  
I/O  
Ta=85  
15  
10  
5
VSS  
VSS  
Ta=-40  
5
0
0
1
2
3
4
6
* Not necessary with CMOS output products.  
Input Voltage: VIN (V)  
* ‘x’ represents both ‘0’ and ‘1’. (ex. XC61x1XC6101 and XC6111)  
1/27  
XC6101~XC6107, XC6111~XC6117 Series  
PIN CONFIGURATION  
SOT-25  
XC6101, XC6102 Series  
XC6111, XC6112 Series  
XC6103 & XC6113 Series  
XC6104, XC6105 Series  
XC6114, XC6115 Series  
XC6106, XC6107 Series  
XC6116, XC6117 Series  
MRB  
V
IN  
WD  
WD  
4
V
IN  
V
IN  
WD  
4
V
IN  
4
5
4
5
5
5
1
2
3
1
2
3
1
2
3
1
2
3
RESETB  
V
SS RESET  
RESET  
V
SS  
MRB  
RESETB  
V
SS RESET  
RESETB  
V
SS  
MRB  
SOT-25 (TOP VIEW)  
SOT-25 (TOP VIEW)  
SOT-25 (TOP VIEW)  
SOT-25 (TOP VIEW)  
USP-6C  
XC6101, XC6102 Series  
XC6111, XC6112 Series  
XC6103 & XC6113 Series  
XC6104, XC6105 Series  
XC6114, XC6115 Series  
XC6106, XC6107 Series  
XC6116, XC6117 Series  
VIN  
1 MRB  
6
WD  
1
2
VIN  
1 WD  
VIN  
1 WD  
2 MRB  
3 NC  
V IN  
6
6
6
VSS 5  
VSS  
VSS 5  
V SS  
MRB  
2
2 RESET  
5
RESET  
NC  
3
5
4
3 NC  
RESETB 4  
4
RESETB  
3 NC  
4
RESETB  
RESET  
USP-6C (BOTTOM VIEW)  
USP-6C (BOTTOM VIEW)  
USP-6C (BOTTOM VIEW)  
USP-6C (BOTTOM VIEW)  
* The dissipation pad for the USP-6C package should be  
solder-plated in recommended mount pattern and metal  
masking so as to enhance mounting strength and heat  
release. If the pad needs to be connected to other pins, it  
should be connected to the VSS (No.5) pin.  
PIN ASSIGNMENT  
PIN NUMBER  
XC6101, XC6102  
XC6111, XC6112  
XC6103  
XC6113  
XC6104, XC6105 XC6106, XC6107  
XC6114, XC6115 XC6116, XC6117  
PIN NAME  
FUNCTION  
SOT-25 USP-6C SOT-25 USP-6C SOT-25 USP-6C SOT-25 USP-6C  
Reset Output  
RESETB  
VSS  
1
4
-
-
1
4
1
4
(VDFL: Low Level When Detected)  
Ground  
2
3
4
5
5
2
1
6
2
3
4
5
5
2
1
6
2
-
5
-
2
4
-
5
1
-
MRB  
WD  
VIN  
Manual Reset  
Watchdog  
4
5
1
6
5
6
Power Input  
Reset Output  
-
-
1
4
3
2
3
2
RESET  
(VDFH: High Level When Detected)  
2/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
PRODUCT CLASSIFICATION  
Selection Guide  
MANUAL  
RESET  
RESET OUTPUT  
SERIES  
WATCHDOG  
VDFL (RESETB)  
CMOS  
VDFH (RESET)  
XC6101  
XC6102  
XC6103  
XC6104  
XC6105  
XC6106  
XC6107  
XC6111  
XC6112  
XC6113  
XC6114  
XC6115  
XC6116  
XC6117  
Available  
Available  
Available  
-
Available  
N-channel open drain  
-
-
Available  
Available  
CMOS  
CMOS  
CMOS  
CMOS  
CMOS  
Available  
Not Available  
Not Available  
Available  
CMOS  
Available  
N-channel open drain  
CMOS  
Not Available  
Not Available  
Available  
N-channel open drain  
Ordering Information  
*1  
(
)
XC61①②③④⑤⑥⑦⑧-⑨  
DESIGNATOR  
DESCRIPTION  
Hysteresis Width  
SYMBOL  
DESCRIPTION  
VDF x 5% (TYP.) with hysteresis  
DF x 0.1% (TYP.) without hysteresis  
0
1
V
Watchdog and manual functions, and reset  
Functions and  
1 ~ 7  
output type as per Selection Guide in the above  
Type of Reset Output  
chart  
A
B
C
D
E
F
3.13ms (TYP.)  
25ms (TYP.)  
50ms (TYP.)  
Release Delay Time *  
100ms (TYP.)  
200ms (TYP.)  
400ms (TYP.)  
1.6s (TYP.)  
H
No WD timeout period for  
XC6106, XC6107, XC6116, XC6117 Series  
6.25ms (TYP.)  
50ms (TYP.)  
0
1
2
3
4
5
6
Watchdog Timeout Period  
100ms (TYP.)  
200ms (TYP.)  
400ms (TYP.)  
1.6s (TYP.)  
Detect voltage  
ex.) 4.5V: ⑤⇒4, ⑥⇒5  
SOT-25  
⑤⑥  
Detect Voltage  
16 ~ 50  
MR  
MR-G  
ER  
Packages  
Taping Type (*2)  
SOT-25  
⑦⑧-⑨  
USP-6C  
ER-G  
USP-6C  
* Please set the release delay time shorter than or equal to the watchdog timeout period.  
ex.) XC6101D427MR or XC6101D327MR  
(*1)  
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.  
The device orientation is fixed in its embossed tape pocket. For reverse orientation, please contact your local Torex sales office or  
(*2)  
representative. (Standard orientation: R-, Reverse orientation: L-)  
3/27  
XC6101~XC6107, XC6111~XC6117 Series  
BLOCK DIAGRAMS  
XC6101, XC6111 Series  
XC6102, XC6112 Series  
XC6103, XC6113 Series  
4/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
BLOCK DIAGRAMS (Continued)  
XC6104, XC6114 Series  
XC6105, XC6115 Series  
XC6106, XC6116 Series  
XC6107, XC6117 Series  
5/27  
XC6101~XC6107, XC6111~XC6117 Series  
ABSOLUTE MAXIMUM RATINGS  
Ta = 25OC  
UNITS  
V
PARAMETER  
SYMBOL  
VIN  
RATINGS  
VSS -0.3 ~ 7.0  
V
SS-0.3VIN+0.37.0  
VSS -0.3 ~ 7.0  
20  
Input Voltage  
MRB  
WD  
V
V
Output Current  
IOUT  
mA  
V
SS-0.3VIN+0.37.0  
VSS -0.3 ~ 7.0  
250  
CMOS Output  
RESETB/RESET  
RESETB  
Output Voltage  
V
N-ch Open Drain Output  
SOT-25  
Power Dissipation  
Pd  
mW  
USP-6C  
100  
Operational Temperature Range  
Storage Temperature Range  
Ta  
-40 ~ +85  
OC  
OC  
Tstg  
-40 ~ +125  
6/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
ELECTRICAL CHARACTERISTICS  
XC6101~XC6107, XC6111~XC6117 Series  
Ta = 25 OC  
PARAMETER  
Detect Voltage  
SYMBOL  
VDFL  
CONDITIONS  
MIN.  
VDF(T)  
× 0.98  
VDF  
TYP.  
VDF(T)  
VDF  
MAX.  
VDF(T)  
× 1.02  
VDF  
UNITS CIRCUIT  
V
V
V
VDFH  
Hysteresis Width  
XC6101~XC6107 (*1)  
Hysteresis Width  
VHYS  
× 0.02 × 0.05 × 0.08  
VDF  
VDF  
XC6111~XC6117 (*2)  
× 0.001 x 0.01  
VHYS  
0
XC61X1/XC61X2/XC61X3  
XC61X4/XC61X5 (*3)  
(The MRB & the WD Pin:  
No connection)  
VIN=VDF(T)×0.9V  
VIN=VDF(T)×1.1V  
VIN=6.0V  
-
-
-
-
-
5
10  
12  
4
11  
16  
18  
10  
14  
Supply Current  
ISS  
VIN  
μA  
V
XC61X6/XC61X7 (*3)  
(The MRB Pin:  
VIN=VDF(T)×0.9V  
VIN=VDF(T)×1.1V  
VIN=6.0V  
8
No connection)  
-
10  
-
0.5  
16  
6.0  
-
Operating Voltage  
1.0  
0.15  
VIN=1.0V  
VIN=2.0V (VDFL(T)> 2.0V)  
VIN=3.0V (VDFL(T) >3.0V)  
VIN=4.0V (VDFL(T) >4.0V)  
2.0  
3.0  
3.5  
2.5  
3.5  
4.0  
-
-
-
N-ch.  
VDS = 0.5V  
VDFL  
Output Current  
(RESETB)  
IRBOUT  
mA  
CMOS,  
P-ch  
VIN=6.0V  
-
- 1.1  
-0.8  
VDS = 0.5V  
N-ch  
VIN=6.0V  
4.4  
4.9  
-
VDS = 0.5V  
VIN=1.0V  
VIN=2.0V (VDFH(T)> 2.0V)  
VIN=3.0V (VDFH(T)>3.0V)  
VIN=4.0V (VDFH(T)>4.0V)  
-
-
-
-
- 0.08  
- 0.50  
- 0.75  
- 0.95  
- 0.02  
- 0.30  
- 0.55  
- 0.75  
VDFH  
Output Current  
(RESET)  
IROUT  
mA  
P-ch.  
VDS = 0.5V  
Temperature  
Coefficient  
VDF /  
(TaVDF)  
-40OC < Topr < 85 OC  
-
+100  
-
ppm/ OC  
2
3.13  
25  
5
18  
31  
Time until VIN is increased from  
1.0V to 2.0V  
and attains to the release time level,  
and the Reset output pin inverts.  
37  
50  
63  
Release Delay Time  
(VDF<1.8V)  
TD R  
ms  
75  
100  
200  
400  
125  
250  
500  
150  
300  
1200  
2
1600  
3.13  
2000  
5
18  
37  
25  
50  
31  
63  
Time until VIN is increased from  
1.0V to (VDFx1.1V)  
and attains to the release time level,  
and the Reset output pin inverts.  
Release Delay Time  
(VDF>1.9V)  
TD R  
ms  
75  
100  
200  
400  
1600  
125  
250  
500  
2000  
150  
300  
1200  
Time until VIN is decreased from 6.0V to  
1.0V and attains to the detect voltage  
level, and the Reset output pin detects  
while the WD pin left opened.  
Detect Delay Time  
TD F  
-
3
30  
μs  
VDFL/VDFH  
CMOS Output  
Leak Current  
VDFL N-ch Open Drain  
Output  
VIN=6.0V, RESETB=6.0V (VDFL)  
VIN=6.0V, RESET=0V (VDFH)  
ILEAK  
ILEAK  
-
-
0.01  
0.01  
-
μA  
μA  
VIN=6.0V, RESETB=6.0V  
0.10  
Leak Current  
NOTE:  
*1: XC6101~XC6107 (with hysteresis)  
*2: XC6111~XC6117 (without hysteresis)  
*3: ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1XC6101 and XC6111)  
*4: VDF(T): Setting detect voltage  
*5: If only “VDF” is indicated, it represents both VDFL (low when detected) and VDFH (high when detected).  
7/27  
XC6101~XC6107, XC6111~XC6117 Series  
ELECTRICAL CHARACTERISTICS (Continued)  
XC6101~XC6105, XC6111~XC6115 Series  
Ta = 25 OC  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN.  
4.25  
37  
TYP.  
6.25  
50  
MAX. UNITS CIRCUIT  
8.25  
63  
Time until VIN increases form  
1.0V to 2.0V and  
the Reset output pin is released to go into  
Watchdog  
Timeout Period  
(VDF<1.8V)  
75  
100  
200  
400  
1600  
6.25  
50  
125  
TW D  
ms  
150  
300  
1200  
4.25  
37  
250  
500  
2000  
8.25  
63  
the detection state. (WD=VSS)  
Time until VIN increases form  
1.0V to (VDFx1.1V)  
and the Reset output pin is released to go  
Watchdog  
Timeout Period  
(VDF>1.9V)  
75  
100  
200  
400  
1600  
125  
250  
500  
2000  
TW D  
ms  
ns  
150  
300  
1200  
into the detection state. (WD=VSS)  
VIN=6.0V,  
Apply pulse from 6.0V to 0V  
to the WD pin.  
Watchdog  
Minimum Pulse Width  
TWDIN  
300  
-
-
Watchdog  
High Level Voltage  
Watchdog  
VWDH  
VWDL  
VIN=VDF x 1.1V ~ 6.0V  
VIN=VDF x 1.1V ~ 6.0V  
VIN x 0.7  
0
-
-
6
V
V
VIN x 0.3  
Low Level Voltage  
VIN=6.0V, VWD=6.0V (Avg. when peak )  
VIN=6.0V, VWD=0V (Avg. when peak)  
-
12  
19  
-
Watchdog  
Input Current  
IWD  
μA  
kΩ  
- 19  
-12  
Watchdog  
Input Resistance  
RWD  
VIN=6.0V, VWD=0V, RWD=VIN/ |IWD|  
315  
500  
880  
XC6101 ~ XC6103, XC6106 ~ XC6107, XC6111 ~ XC6113, XC6116 ~ XC6117 Series  
O
Ta = 25 C  
PARAMETER  
MRB  
High Level Voltage  
MRB  
Low Level Voltage  
MRB  
Pull-up Resistance  
MRB Minimum  
Pulse Width (*3)  
XC6101~XC6105  
XC6111~XC6115  
MRB Minimum  
Pulse Width (*4)  
XC6106, XC6107  
XC6116, XC6117  
SYMBOL  
VMRH  
CONDITIONS  
MIN.  
1.4  
TYP.  
-
MAX. UNITS CIRCUIT  
VIN=VDFx1.1V ~ 6.0V  
VIN  
0.35  
3.0  
V
VMRL  
RMR  
VIN=VDFx1.1V ~ 6.0V  
0
-
VIN=6.0V, MRB=0V, RMR=VIN/ |IMRB|  
1.6  
2.4  
MΩ  
VIN=6.0V,  
Apply pulse from 6.0V to 0V to  
the MRB pin  
TMRIN  
TMRIN  
2.8  
1.2  
-
-
-
-
μs  
VIN=6.0V,  
Apply pulse from 6.0V to 0V to  
the MRB pin  
NOTE:  
*1: VDF(T): Setting detect voltage  
*2: If only “VDF” is indicated, it represents both VDFL (low when detected) and VDFH (high when detected).  
*3: Watchdog function is available.  
*4: Watchdog function is not available.  
8/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
OPERATIONAL EXPLANATION  
The XC6101~XC6107, XC6111~XC6117 series compare, using the amplifier, the voltage of the internal voltage reference  
source with the voltage divided by R1, R2 and R3 connected to the VIN pin. The resulting output signal from the error  
amplifier activates the watchdog logic, manual reset logic, delay circuit and the output driver. When the VIN pin voltage  
gradually falls and finally reaches the detect voltage, the RESETB pin output goes from high to low in the case of the VDFL type  
ICs, and the RESET pin output goes from low to high in the case of the VDFH type ICs.  
<RESETB / RESET Pin Output Signal>  
* VDFL (RESETB) type - output signal: Low when detected.  
The RESETB pin output goes from high to low whenever the VIN pin voltage falls below the detect voltage, or whenever the  
MRB pin is driven from high to low. The RESETB pin remains low for the release delay time (TDR) after the VIN pin voltage  
reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period,  
the RESETB pin output remains low for the release delay time (TDR), and thereafter the RESET pin outputs high level signal.  
* VDFH (RESET) type – output signal: High when detected.  
The RESET pin output goes from low to high whenever the VIN pin voltage falls below the detect voltage, or whenever the  
MRB pin is driven from high to low. The RESET pin remains high for the release delay time (TDR) after the VIN pin voltage  
reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period,  
the VOUT pin output remains high for the release delay time (TDR), and thereafter the RESET pin outputs low level signal.  
<Hysteresis>  
When the internal comparator output is high, the N-Channel transistor connected in parallel to R3 is turned ON, activating the  
hysteresis circuit. The difference between the release and detect voltages represents the hysteresis width, as shown by the  
following calculations:  
VDF (detect voltage) = (R1+R2+R3) x Vref(R2+R3)  
VDR (release voltage) = (R1+R2) x Vref(R2)  
VHYS (hysteresis width)=VDR-VDF (V)  
VDR > VDF  
* Detect voltage (VDF) includes conditions of both VDFL (low when detected) and VDFH (high when detected).  
* Please refer to the block diagrams for R1, R2, R3 and Vref.  
Hysteresis width is selectable from VDF x 0.05V (XC6101~XC6107) or VDF x 0.001V (XC6111~XC6117).  
<Watchdog (WD) Pin>  
The XC6101~XC6107, XC6111~XC6117 series use a watchdog timer to detect malfunction or “runaway” of the  
microprocessor. If neither rising nor falling signals are applied from the microprocessor within the watchdog timeout period,  
the RESETB/RESET pin output maintains the detection state for the release delay time (TDR), and thereafter the  
RESET/RESETB pin output returns to the release state (Please refer to the FUNCTION CHART). The timer in the watchdog  
is then restarted. Six watchdog timeout period settings are available in 1.6s, 400ms, 200ms, 100ms, 50ms, 6.25ms.  
<MRB Pin>  
Using the MRB voltage pin input, the RESET/RESETB pin signal can be forced to the detection state. When the MRB pin is  
driven from high to low, the RESETB pin output goes from high to low level signal in the case of the VDFL type ICs, and the  
RESET pin output goes from low to high in the case of the VDFH type. Even after the MRB pin is driven back high, the  
RESET/RESETB pin output maintains the detection state for the release delay time (TDR). Since the MRB pin is internally  
pulled up to the VIN pin voltage level, leave the MRB pin open if unused (Please refer to the FUNCTION CHART). A diode,  
which is an input protection element, is connected between the MRB pin and VIN pin. Therefore, if the MRB pin is applied  
voltage that exceeds VIN, the current will flow to VIN through the diode. Please use this IC within the stated maximum ratings  
(VSS-0.3VIN+0.37.0V) on the MRB pin.  
<Release Delay Time>  
Release delay time (TDR) is the time that elapses from when the VIN pin reaches the release voltage, or when the watchdog  
timeout period expires with no rising signal applied to the WD pin, until the RESET/RESETB pin output is released from the  
detection state. Seven release delay time (TDR) watchdog timeout period settings are available in 1.6s, 400ms, 200ms,  
100ms, 50ms, 25ms, 3.13ms.  
<Detect Delay Time>  
Detect Delay Time (TDF) is the time that elapses from when the VIN pin voltage falls to the detect voltage until the RESET/  
RESETB pin output goes into the detection state.  
9/27  
XC6101~XC6107, XC6111~XC6117 Series  
TIMING CHARTS  
CMOS Output  
TD F (CMOS Output)  
VIN  
6.0V  
VIN Pin Wave Form  
VDFL Level  
1.0V  
GND  
TDF  
VIN Level  
VDFL Level  
RESETB Pin Wave Form (VDFL)  
VIN x 0.1V  
GND  
0.6V  
10/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
NOTES ON USE  
1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent  
damage to the device.  
2. When a resistor is connected between the VIN pin and the input, the VIN voltage drops while the IC is operating and a  
malfunction may occur as a result of the IC’s through current. For the CMOS output products, the VIN voltage drops while  
the IC is operating and malfunction may occur as a result of the IC’s output current. Please be careful with using the  
XC6111~XC6117 series (without hysteresis).  
3. In order to stabilize the IC’s operations, please ensure that the VIN pin’s input frequency’s rise and fall times are more than  
some μs/V.  
4. Noise at the power supply may cause a malfunction of the watchdog operation or the circuit. In such case, please  
strength the line between VIN and the GND pin and connect about 0.22μF of a capacitor between the VIN pin and the GND  
pin.  
5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise  
and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900μs at maximum.  
6. The watchdog function can be disabled by connecting a three-state device to the WDI pin as a result of the high impedance  
state of the WDI pin. This is effective when the watchdog function is not required, for example, during data loading to the  
CPU. The WDI input is internally driven through a buffer (LOGIC) and series resistor (RWD) from the watchdog counter as  
showed in the block diagrams of page 4 and 5. The WDI input is designed for minimizing the input current by placing the  
series resistor (RWD) in the maximum resistance of 880kΩ. A voltage drop occurs in proportion to the leakage current of the  
three-state device multiplied by the resistance value of the series resistor (RWD) when the three-state device is in the state  
of high impedance. The voltage level must be reaching the threshold level of the WD so that a three-state device with small  
leakage current should be selected.  
The other series is available in the name of XC6121~XC6124 with the ON/OFF control pin for the watchdog function.  
When these series is used, external parts such as the three-state device is not required.  
No Reaction Time  
No reaction time  
No reaction time  
(MAX 900μs)  
(MAX 900μs)  
11/27  
XC6101~XC6107, XC6111~XC6117 Series  
PIN LOGIC CONDITIONS  
PIN NAME  
LOGIC  
CONDITIONS  
NOTE:  
H
VIN>VDF+VHYS  
*1: If only “VDF” is indicated, it represents both VDFL (low when  
detected) and VDFH (high when detected).  
*2: For the details of each parameter, please see the electrical  
characteristics.  
VIN  
L
VIN<VDF  
H
MRB>1.40V  
MRB  
WD  
L
H
MRB<0.35V  
VDF: Detect Voltage  
VHYS: Hysteresis Width  
When keeping WD>VWDH more than tWD  
When keeping WD<VWDL more than tWD  
VWDL VWDH, TWDIN>300ns  
VWDH VWDH, TWDIN>300ns  
VWDH: WD High Level Voltage  
VWDL: WD Low Level Voltage  
TWDIN: WD Pulse Width  
L
L H  
H L  
tW D : WD Timeout Period  
FUNCTION CHART  
XC6101/XC61111, XC6102/6112 Series  
VIN  
H
H
H
H
H
H
L
MRB  
WD  
H
RESETB (*2)  
Repeat detect and release (HLH)  
L
H or Open  
Open  
L H  
H L  
H
L
L
*1  
XC6103/XC61113 Series  
VIN  
H
H
H
H
H
H
L
MRB  
WD  
H
RESETB (*3)  
Repeat detect and release (LHL)  
L
H or Open  
Open  
L H  
H L  
L
L
*1  
H
XC6104/XC61114, XC6105/XC6115 Series  
VIN  
H
WD  
H
RESETB (*2)  
RESET (*3)  
Repeat detect and release (HLH)  
Repeat detect and release (LHL)  
H
L
H
Open  
L H  
H L  
*1  
H
L
L
H
H
L
H
XC6106/XC61116, XC6107/XC6117 Series  
VIN  
H
MRB  
RESETB (*2)  
RESET (*3)  
L
H or Open  
H
H
L
L
H
L
*1: Including all logic of WD (WD=H, L, LH, HL, OPEN).  
*2: When the RESETB is High, the circuit is in the release state.  
When the RESETB is Low, the circuit is in the detection state.  
*3: When the RESET is High, the circuit is in the release state.  
When the RESET is Low, the circuit is in the detection state.  
*4: VIN=L and MRB=H can not be combined for the rated input voltage of the MRB pin is Vss-0.3V to VIN+0.3V.  
*5: The RESET/RESETB pin becomes indefinite operation while 0.35V<MRB<1.4V.  
12/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
TEST CIRCUITS  
Circuit 1  
Circuit 2  
Circuit 3  
Circuit 4  
13/27  
XC6101~XC6107, XC6111~XC6117 Series  
TEST CIRCUITS (Continued)  
Circuit 5  
Circuit 6  
Circuit 7  
14/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
TEST CIRCUITS (Continued)  
Circuit 8  
Circuit 9  
100kΩ  
(Not used when the CMOS  
Output products selected.)  
Circuit 10  
Circuit 11  
15/27  
XC6101~XC6107, XC6111~XC6117 Series  
TYPICAL PERFORMANCE CHARACTERISTICS  
(1.1) Supply Current vs. Input Voltage  
XC61X1~XC61X5 (1.6V)  
XC61X1~XC61X5 (2.7V)  
30  
25  
20  
15  
10  
5
30  
25  
20  
15  
10  
5
Ta=25  
Ta=25  
Ta=85  
Ta=85  
Ta=-40  
5
Ta=-40  
5
0
0
0
1
2
3
4
6
0
1
2
3
4
6
Input Voltage: VIN (V)  
Input Voltage: VIN (V)  
XC61X1~XC61X5 (5.0V)  
30  
25  
20  
15  
10  
5
Ta=85  
Ta=25  
Ta=-40  
5
0
0
1
2
3
4
6
Input Voltage: VIN (V)  
(1.2) Supply Current vs. Input Voltage  
XC61X6~XC61X7 (1.6V)  
30  
XC61X6~XC61X7 (2.7V)  
30  
25  
20  
15  
10  
5
25  
20  
15  
Ta=25  
Ta=25  
Ta=85  
Ta=85  
10  
5
Ta=-40  
5
Ta=-40  
5
0
0
0
1
2
3
4
6
0
1
2
3
4
6
I
Input Voltage: VIN (V)  
Input Voltage: VIN (V)  
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1XC6101 and XC6111)  
16/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(1.2) Supply Current vs. Input Voltage (Continued)  
XC61X6~XC61X7 (5.0V)  
30  
25  
20  
15  
Ta=25  
Ta=85  
10  
5
Ta=-40  
5
0
0
1
2
3
4
6
Input Voltage: VIN (V)  
(2) Detect, Release Voltage vs. Ambient Temperature  
XC61X1~XC61X7 (1.6V)  
1.70  
XC61X1~XC61X7 (2.7V)  
2.90  
2.80  
2.70  
2.60  
VDR  
1.65  
VDR  
1.60  
VDF  
VDF  
1.55  
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta ()  
Ambient Temperature: Ta ()  
XC61X1~XC61X7 (5.0V)  
5.30  
5.20  
5.10  
5.00  
4.90  
VDR  
VDF  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta ()  
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1XC6101 and XC6111)  
17/27  
XC6101~XC6107, XC6111~XC6117 Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(3.1) Detect, ReleaseVoltagevs.InputVoltage (VDFL)  
XC6101~XC6107 (1.6V)  
Rpull:100k  
XC6101~XC6107 (2.7V)  
2.0  
1.5  
1.0  
0.5  
0.0  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Rpull:100kΩ  
Ta=-40  
Ta=-40  
25  
85  
ꢀꢀ  
ꢀꢀ  
↓:  
↑:  
25  
85  
ꢀꢀ  
ꢀꢀ  
↓:  
↑:  
VDF  
VDR  
VDF  
VDR  
0
1
2
0
1
2
3
Input Voltage: VIN (V)  
Input Voltage: VIN (V)  
XC6101~XC6107 (5.0V)  
6.0  
Rpull:100k  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
Ta=-40  
25  
85  
ꢀꢀ  
ꢀꢀ  
↓:  
↑:  
VDF  
VDR  
0
1
2
3
4
5
6
Input Voltage: VIN (V)  
(3.2) Detect, Release Voltage vs. Input Voltage (VDFH)  
XC6103~XC6107 (1.6V)  
XC6103~XC6107 (2.7V)  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
2.0  
Rpull:100kΩ  
Rpull:100kΩ  
Ta=-40  
Ta=-40  
25  
85  
VDF  
VDR  
25  
85  
VDF  
VDR  
ꢀꢀ  
ꢀꢀ  
↑:  
↓:  
ꢀꢀ  
ꢀꢀ  
↑:  
↓:  
1.5  
1.0  
0.5  
0.0  
0
1
2
0
1
2
3
Input Voltage: VIN(V)  
Input Voltage: VIN (V)  
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1XC6101 and XC6111)  
18/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(3.2) Detect, Release Voltage vs. Input Voltage (VDFH) (Continued)  
XC6103~XC6107 (5.0V)  
6.0  
Rpull:100kΩ  
Ta=-40  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
25  
85  
ꢀꢀ  
ꢀꢀ  
↑:  
↓:  
VDF  
VDR  
0
1
2
3
4
5
6
)  
Input Voltage: VIN (V)  
(4) N-ch Driver Output Current vs. VDS  
XC61X1~XC61X7  
6
XC61X1~XC61X7  
20  
16  
12  
8
Ta=25  
Ta=25  
VIN=4.0V  
VIN=2.0V  
5
4
3
2
1
0
VIN=3.0V  
4
VIN=1.0V  
0
0
1
2
3
0
1
2
3
4
5
6
VDS (V)  
VDS (V)  
(5) N-ch Driver Output Current vs. Input Voltage  
XC61X1~XC61X7  
6.0  
VDS=0.5V  
Ta=-40  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
Ta=25  
Ta=85  
0
1
2
3
4
5
6
Input Voltage: VIN (V)  
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1XC6101 and XC6111)  
19/27  
XC6101~XC6107, XC6111~XC6117 Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(6) P-ch Driver Output Current vs. Input Voltage 1  
(7) P-ch Driver Output Current vs. Input Voltage 2  
XC61X1, XC61X3~XC61X7  
6.0  
XC61X1, XC61X3~XC61X7  
2.0  
VDS=0.5V  
Ta=25  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
1.6  
VDS=2.0V  
1.5V  
Ta=-40  
1.2  
0.8  
0.4  
0.0  
Ta=25  
1.0V  
0.5V  
Ta=85  
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN (V)  
Input Voltage: VIN (V)  
(8) Release Delay Time vs. Ambient Temperature  
XC61X1~XC61X7  
6.0  
XC61X1~XC61X7  
300  
TDR=3.13ms  
TDR=100ms  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
250  
200  
150  
100  
50  
0
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (  
)
Ambient Temperature: Ta (  
)
XC61X1~XC61X7  
3000  
2500  
2000  
1500  
1000  
500  
TDR=1.6s  
0
-50 -25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (  
)
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1XC6101 and XC6111)  
20/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(9) Watchdog Timeout Period vs. Ambient Temperature  
XC61X1~XC61X5  
XC61X1~XC61X5  
300  
250  
200  
150  
100  
50  
12  
TWD=100ms  
TWD=6.25ms  
10  
8
6
4
2
0
0
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (  
)
Ambient Temperature: Ta (  
)
XC61X1~XC61X5  
3000  
2500  
2000  
1500  
1000  
500  
TWD=1.6s  
0
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (  
)
(10) Release Delay Time vs. Input Voltage  
(11) Watchdog Timeout Period vs. Input Voltage  
XC61x1~XC61x5  
120  
XC61x1~XC61x7  
120  
Ta=25℃  
Ta=25℃  
TWD=100ms  
TWD=100ms  
110  
100  
90  
110  
100  
90  
80  
80  
70  
70  
60  
60  
1
2
3
4
5
6
7
1
2
3
4
5
6
7
Input Voltage: VIN (V)  
Input Voltage: VIN (V)  
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1XC6101 and XC6111)  
21/27  
XC6101~XC6107, XC6111~XC6117 Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(12) Watchdog Low Level Voltage vs. Ambient Temperature  
(13) Watchdog High Level Voltage vs. Ambient Temperature  
XC61X1~XC61X5  
6.0  
XC61X1~XC61X5  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
5.0  
4.0  
VIN=6.0V  
3.0  
2.0  
1.0  
0.0  
VIN=6.0V  
VIN=3.0V  
VIN=3.0V  
VIN=1.76V  
VIN=1.76V  
-50  
-25  
0
25  
50  
75  
100  
-50  
-25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (  
)
Ambient Temperature: Ta (  
)
(14) MRB Low Level Voltage vs. Ambient Temperature  
(15) MRB High Level Voltage vs. Ambient Temperature  
XC61X1~XC61X3, XC61X6~XC61X7  
1.10  
XC61X1~XC61X3, XC61X6~XC61X7  
1.10  
1.00  
1.00  
0.90  
0.90  
VIN=6.0V  
VIN=3.0V  
0.80  
0.80  
VIN=6.0V  
VIN=3.0V  
0.70  
0.70  
VIN=1.76V  
0.60  
0.60  
VIN=1.76V  
0.50  
0.50  
-50  
-25  
0
25  
50  
75  
100  
-50 -25  
0
25  
50  
75 100  
Ambient Temperature: Ta (  
)
Ambient Temperature: Ta (  
)
* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1XC6101 and XC6111)  
22/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
PACKAGING INFORMATION  
SOT-25  
USP-6C  
USP-6C Reference Metal Mask Design  
USP-6C Reference Pattern Layout  
23/27  
XC6101~XC6107, XC6111~XC6117 Series  
MARKING RULE  
SOT-25  
represents product series  
MARK  
PRODUCT SERIES  
MARK  
PRODUCT SERIES  
XC6111xxxxxx  
XC6112xxxxxx  
XC6113xxxxxx  
XC6114xxxxxx  
XC6115xxxxxx  
XC6116xxxxxx  
XC6117xxxxxx  
0
1
2
3
4
5
6
XC6101xxxxxx  
XC6102xxxxxx  
XC6103xxxxxx  
XC6104xxxxxx  
XC6105xxxxxx  
XC6106xxxxxx  
XC6107xxxxxx  
7
8
9
A
B
C
D
③ ④  
SOT-25  
(TOP VIEW)  
represents release delay time and watchdog timeout period  
RELEASE  
DELAY  
TIME  
RELEASE  
DELAY  
TIME  
WATCH DOG  
TIMEOUT PERIOD  
PRODUCT  
SERIES  
WATCH DOG  
TIMEOUT PERIOD  
PRODUCT  
SERIES  
MARK  
MARK  
A
0
1
2
3
4
5
B
6
7
3.13ms XC61X6, XC61X7 series XC61xxA0xxxx  
E
F
D
H
K
L
M
E
P
R
S
F
50ms  
50ms  
400ms  
1.6s  
XC61xxC5xxxx  
XC61xxC6xxxx  
3.13ms  
3.13ms  
3.13ms  
3.13ms  
3.13ms  
3.13ms  
25ms  
6.25ms  
50ms  
100ms  
200ms  
400ms  
1.6s  
XC61xxA1xxxx  
XC61xxA2xxxx  
XC61xxA3xxxx  
XC61xxA4xxxx  
XC61xxA5xxxx  
XC61xxA6xxxx  
100ms  
100ms  
100ms  
100ms  
100ms  
200ms  
200ms  
200ms  
200ms  
400ms  
400ms  
400ms  
1.6s  
XC61X6, XC61X7 series XC61xxD0xxxx  
100ms  
200ms  
400ms  
1.6s  
XC61xxD3xxxx  
XC61xxD4xxxx  
XC61xxD5xxxx  
XC61xxD6xxxx  
XC61X6, XC61X7 series XC61xxB0xxxx  
XC61X6, XC61X7 series XC61xxE0xxxx  
25ms  
25ms  
25ms  
25ms  
50ms  
100ms  
200ms  
400ms  
1.6s  
XC61xxB2xxxx  
XC61xxB3xxxx  
XC61xxB4xxxx  
XC61xxB5xxxx  
XC61xxB6xxxx  
200ms  
400ms  
1.6s  
XC61xxE4xxxx  
XC61xxE5xxxx  
XC61xxE6xxxx  
8
9
XC61X6, XC61X7 series XC61xxF0xxxx  
A
C
B
C
D
25ms  
T
400ms  
1.6s  
XC61xxF5xxxx  
XC61xxF6xxxx  
50ms  
XC61X6, XC61X7 series XC61xxC0xxxx  
U
H
V
50ms  
50ms  
50ms  
50ms  
100ms  
200ms  
XC61xxC2xxxx  
XC61xxC3xxxx  
XC61xxC4xxxx  
XC61X6, XC61X7 series XC61xxH0xxxx  
1.6s  
1.6s  
XC61xxH6xxxx  
represents detect voltage  
XC6101/11/02/12/03/13/04/14/15/06/16/07/17Series  
MARK  
DETECT VOLTAGE  
PRODUCT SERIES  
XC61Xxxx16xx  
XC61Xxxx17xx  
XC61Xxxx18xx  
XC61Xxxx19xx  
XC61Xxxx20xx  
XC61Xxxx21xx  
XC61Xxxx22xx  
XC61Xxxx23xx  
XC61Xxxx24xx  
XC61Xxxx25xx  
XC61Xxxx26xx  
XC61Xxxx27xx  
XC61Xxxx28xx  
XC61Xxxx29xx  
XC61Xxxx30xx  
XC61Xxxx31xx  
XC61Xxxx32xx  
XC61Xxxx33xx  
MARK  
DETECT VOLTAGE  
PRODUCT SERIES  
XC61Xxxx34xx  
XC61Xxxx35xx  
XC61Xxxx36xx  
XC61Xxxx37xx  
XC61Xxxx38xx  
XC61Xxxx39xx  
XC61Xxxx40xx  
XC61Xxxx41xx  
XC61Xxxx42xx  
XC61Xxxx43xx  
XC61Xxxx44xx  
XC61Xxxx45xx  
XC61Xxxx46xx  
XC61Xxxx47xx  
XC61Xxxx48xx  
XC61Xxxx49xx  
XC61Xxxx50xx  
F
H
K
L
1.6  
1.7  
1.8  
1.9  
2.0  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
3.3  
3
4
5
6
7
3.4  
3.5  
3.6  
3.7  
3.8  
3.9  
4.0  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
5.0  
M
N
P
R
S
T
U
V
X
Y
Z
0
8
9
A
B
C
D
E
F
H
K
L
1
2
M
24/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
MARKING RULE (Continued)  
represents detect voltage  
XC6105 Series  
MARK  
DETECT VOLTAGE  
PRODUCT SERIES  
XC6105XX16XX  
MARK  
DETECT VOLTAGE  
PRODUCT SERIES  
XC6105XX34XX  
F
H
K
L
1.6  
1.7  
1.8  
1.9  
2.0  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
3.3  
3
4
3.4  
3.5  
3.6  
3.7  
3.8  
3.9  
4.0  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
5.0  
XC6105XX17XX  
XC6105XX18XX  
XC6105XX19XX  
XC6105XX20XX  
XC6105XX21XX  
XC6105XX22XX  
XC6105XX23XX  
XC6105XX24XX  
XC6105XX25XX  
XC6105XX26XX  
XC6105XX27XX  
XC6105XX28XX  
XC6105XX29XX  
XC6105XX30XX  
XC6105XX31XX  
XC6105XX32XX  
XC6105XX33XX  
XC6105XX35XX  
XC6105XX36XX  
XC6105XX37XX  
XC6105XX38XX  
XC6105XX39XX  
XC6105XX40XX  
XC6105XX41XX  
XC6105XX42XX  
XC6105XX43XX  
XC6105XX44XX  
XC6105XX45XX  
XC6105XX46XX  
XC6105XX47XX  
XC6105XX48XX  
XC6105XX49XX  
XC6105XX50XX  
5
6
M
N
P
R
S
T
U
V
X
Y
Z
0
7
8
9
A
B
C
D
E
F
H
K
L
1
M
2
represents production lot number  
0 to 9 and A to Z and inverted 0 to 9 and A to Z repeated. (G, I, J, O, Q, W excluded.)  
25/27  
XC6101~XC6107, XC6111~XC6117 Series  
MARKING RULE (Continued)  
USP-6C  
represents product series  
MARK  
PRODUCT SERIES  
MARK  
PRODUCT SERIES  
XC6111xxxxxx  
XC6112xxxxxx  
XC6113xxxxxx  
XC6114xxxxxx  
XC6115xxxxxx  
XC6116xxxxxx  
XC6117xxxxxx  
3
4
5
6
7
3
4
XC6101xxxxxx  
XC6102xxxxxx  
XC6103xxxxxx  
XC6104xxxxxx  
XC6105xxxxxx  
XC6106xxxxxx  
XC6107xxxxxx  
8
9
A
B
C
8
USP-6C  
9
(TOP VIEW)  
represents release delay time  
MARK  
RELEASE DELAY TIME  
PRODUCT SERIES  
XC61XxAxxxxx  
XC61XxBxxxxx  
XC61XxCxxxxx  
XC61XxDxxxxx  
XC61XxExxxxx  
XC61XxFxxxxx  
XC61XxHxxxxx  
A
B
C
D
E
F
3.13ms  
25ms  
50ms  
100ms  
200ms  
400ms  
1.6s  
H
represents watchdog timeout period  
MARK  
WATCHDOG TIMEOUT PERIOD  
PRODUCT SERIES  
XC61Xxx0xxxx  
XC61Xxx1xxxx  
XC61Xxx2xxxx  
XC61Xxx3xxxx  
XC61Xxx4xxxx  
XC61Xxx5xxxx  
XC61Xxx6xxxx  
0
1
2
3
4
5
6
XC61X6, XC61X7 series  
6.25ms  
50ms  
100ms  
200ms  
400ms  
1.6s  
④⑤ represents detect voltage  
MARK  
DETECT VOLTAGE (V)  
PRODUCT SERIES  
3
3
3.3  
5.0  
XC61Xxxx33xx  
XC61Xxxx50xx  
5
0
represents production lot number  
0 to 9 and A to Z repeated. (G, I, J, O, Q, W excluded.)  
X No character inversion used.  
XX ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1XC6101 and XC6111)  
26/27  
XC6101 ~ XC6107, XC6111~ XC6117  
Series  
1. The products and product specifications contained herein are subject to change without  
notice to improve performance characteristics. Consult us, or our representatives  
before use, to confirm that the information in this datasheet is up to date.  
2. We assume no responsibility for any infringement of patents, patent rights, or other  
rights arising from the use of any information and circuitry in this datasheet.  
3. Please ensure suitable shipping controls (including fail-safe designs and aging  
protection) are in force for equipment employing products listed in this datasheet.  
4. The products in this datasheet are not developed, designed, or approved for use with  
such equipment whose failure of malfunction can be reasonably expected to directly  
endanger the life of, or cause significant injury to, the user.  
(e.g. Atomic energy; aerospace; transport; combustion and associated safety  
equipment thereof.)  
5. Please use the products listed in this datasheet within the specified ranges.  
Should you wish to use the products under conditions exceeding the specifications,  
please consult us or our representatives.  
6. We assume no responsibility for damage or loss due to abnormal use.  
7. All rights reserved. No part of this datasheet may be copied or reproduced without the  
prior permission of TOREX SEMICONDUCTOR LTD.  
27/27  

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