XC612D3850ML [TOREX]
CMOS Low Power Consumption; CMOS低功耗
| 型号： | XC612D3850ML |
| 厂家： | 
Torex Semiconductor |
| 描述： | CMOS Low Power Consumption |
| 文件： | 总13页 (文件大小：210K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
02S_05XC612 02.09.12 14:15 ページ 169
Series
2 Channel Voltage Detectors
ꢁCMOS Low Power Consumption
ꢁ2 Voltage Detectors Built-in
ꢁDetect Voltage Accuracy : 2%
■Applications
ꢀMemory battery back-up circuitry
ꢀMicroprocessor reset circuits
ꢀPower failure detection
2
ꢁDetect Voltage Range
ꢁSOT-25 Package
: 1.5V ~ 5.0V
ꢀSystem power-on reset circuits
ꢀSystem battery life monitors and re-charge voltage monitors
ꢀDelay circuitry
■General Description
■Features
The XC612 series consist of 2 voltage detectors, in 1 mini-molded, SOT-
25 package.
Highly accurate
: Set-up voltage accuracy 2ꢀ
Low-power consumption
Detect voltage
: Typ.2.0µA (VIN1=VIN2=2.0V, quiescent state)
The series provides accuracy and low power consumption through
CMOS processing and laser trimming and consists of a highly accurate
voltage reference source, 2 comparators, hysteresis and output driver
circuits.
: 1.5V ~ 5.0V programmable in
0.1V steps. Detector’s voltages
can be set-up independently
Conditionaly,
The input (VIN1) for voltage detector 1 (VD1) dually functions as the power
supply pin for both detector 1 (VD1) and detector 2 (VD2).
XC612N : VDET1>VDET2
XC612D, XC612E : VDET1≥VDET2,
VDET1<VDET2
Operating Voltage Range
: 1.0V ~ 10.0V
Temperature characteristics: 100ppmꢁ/C
Output configuration
Small package
: N-channel open drain
: SOT-25 (150mW) mini-mold
* CMOS Output is under development
■Typical Application Circuit
■Typical Performance
Characteristic
SUPPLY CURRENT vs. INPUT VOLTAGE
R
VIN1 VIN2
VDET1
ＸＣ６１２Ｎ３６３２�
(VIN1＝VIN2
)
6.0
5.0
4.0
3.0
2.0
1.0
0
VIN
VDET2
VSS
Ta=80℃�
-30℃�
25℃�
R=100k�
VDET1：CMOS, VDET2：N-ch Open drain
0
2
4
6
8
10
Input Voltage: VIN1 (V)
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02S_05XC612 02.09.12 14:15 ページ 170
XC612 Series
■Pin Configuration
■Pin Assignment
VDET2
5
ＶIN2
4
PIN NUMBER
PIN NAME
FUNCTION
Voltage Detector 1 output
1
V
DET1
Detector 1 input,
Power Supply.
2
VIN1
1
2
3
3
4
5
V
SS
Ground
VDET1 VIN1 VSS
V
IN2
Voltage Detector 2 Input
Voltage Detector 2 Output
SOT-25�
V
DET2
（TOP VIEW）�
2
■Product Classification
ꢀSelection Guide
Type
VDET1
VDET2
XC612N
XC612D
XC612E
N-ch Open drain
N-ch Open drain
CMOS
N-ch Open drain
CMOS
N-ch Open drain
ꢀOrdering Information
XC612 x x xx x x x
↑ ↑ ↑↑↑�
a
b c d e
DESIGNATOR
a
DESCRIPTION
DESIGNATOR
d
DESCRIPTION
Output Configuration:
N=N-Channel Open Drain
D=VDET1 N-ch Open Drain, VDET2 CMOS
E=VDET1 CMOS, VDET2 N-ch Open Drain
Package Type:
M=SOT-25
Detect Voltage (VDET1
)
b
c
e.g.25
=
=
2.5V
3.8V
38
Device Orientation
e
Detect Voltage (VDET2
)
R=Embossed Tape (Orientation of Device: Right)
L=Embossed Tape (Orientation of Device: Left)
e.g.33
=
=
3.3V
5.0V
50
170
02S_05XC612 02.09.12 14:15 ページ 171
XC612
Series
■Packaging Information
ꢀSOT-25
+0.1�
-0.05
0.15
+0.1�
-0.05
0.4
0～0.1
2
（0.95）�
1.1±0.1
1.9±0.2
2.9±0.2
■Marking
① ② ③ ④�
SOT-25
(TOP VIEW)
q
Represents the output configuration
CONFIGURATION
�
DESIGNATOR
PRODUCT NAME
�
VDET1�
VDET2�
N
D
E
N-ch Open drain�
N-ch Open drain�
CMOS�
N-ch Open drain�
CMOS�
XC612N****M*�
XC612D****M*�
XC612E****M*
N-ch Open drain�
�
we Represents the entry order.
Denotes the production lot number�
0 to 9, A to Z repeated. (G.I.J.O.Q.W excepted)
r
171
02S_05XC612 02.09.12 14:15 ページ 172
XC612 Series
■Block Diagram
XC612N Series
XC612D Series
VIN1
VIN1
VDET1
VDET1
2
VIN2
VIN2
VDET2
VSS
VDET2
VSS
Vref
Vref
XC612E Series
VIN1
VDET1
VIN2
VDET2
VSS
Vref
172
02S_05XC612 02.09.12 14:15 ページ 173
XC612
Series
■Absolute Maximum Ratings
Ta＝25℃�
PARAMETER�
Input Voltage VIN1�
SYMBOL�
VIN1�
CONDITIONS�
12�
UNITS�
V�
Input Voltage VIN2�
VIN2�
12�
V�
Output Voltage VDET1(N-ch Open drain)�
Output Voltage VDET1(CMOS)�
Output Current VDET1�
VVDET1�
VVDET1�
IVDET1�
VVDET2�
VVDET2�
IVDET2�
Pd�
VSS－0.3～12�
VSS－0.3～VIN1＋0.3�
50�
V�
V�
mA�
V�
Output Voltage VDET2(N-ch Open drain)�
Output Voltage VDET2(CMOS)�
Output Current VDET2�
VSS－0.3～12�
VSS－0.3～VIN1＋0.3�
50�
V�
2
mA�
mW�
℃�
℃�
Power Dissipation�
150�
Operating Ambient Temperature�
Storage Temperature
Topr�
－30～＋80�
－40～＋125
Tstg
173
02S_05XC612 02.09.12 14:15 ページ 174
XC612 Series
■Electrical Characteristics
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS CIRCUIT
Voltage when VDET1 changes from
H to L following a reduction of VIN1
V
DF1
VDF1
x 1.02
Detect Voltage
V
DF1
DF2
V
DF1
V
V
V
1
1
1
1
x 0.98
VDET1
Voltage when VDET2 changes from
H to L following a reduction of VIN2
V
DF1
V
DF2
Detect Voltage
V
V
DF2
x 1.02
x 0.98
V
DET2
Voltage (VDR1) - VDF1 when VDET1 changes
from L to H following an increase of VIN1
VDF1(T)
V
DF1(T)
VDF1(T)
Hysteresis Range 1
Hysteresis Range 2
V
V
HYS1
HYS2
x 0.02
x 0.05
x 0.08
Voltage (VDR2) - VDF2 when VDET2 changes
from L to H following an increase of VIN2
VDF2(T)
V
DF2(T)
x 0.05
V
DF2(T)
2
x 0.02
x 0.08
V
V
IN1=1.5V
2.0V
1.35
1.50
1.95
2.40
3.00
0.45
0.50
0.65
0.80
1.00
3.90
4.50
5.10
5.70
6.30
1.30
1.50
1.70
1.90
2.10
Supply Current
(Input Current VIN1
I
SS
µA
2
3.0V
)
4.0V
5.0V
IN1=1.5V
2.0V
Input Current VIN2
IIN2
µA
2
3.0V
4.0V
5.0V
Operating Voltage
V
IN1
VDF (T) = 1.5V to 6.0V
1.5
10
V
-
N-ch
P-ch
VDS = 0.5V
V
IN1=1.0V
IN1=2.0V
IN1=3.0V
IN1=4.0V
IN1=5.0V
0.3
3.0
5.0
6.0
7.0
2.2
7.7
10.1
11.5
13.0
V
V
V
V
mA
3
Output Current
*
IVDET
VDS = -2.1V
V
IN1=8.0V
(CMOS)
-10.0
100
-2.0
∆VDF
Temperature Characteristics
*
–30: ≤ Topr
≤
80:
-
ppm/:
-
∆Topr
•
V
DF
Transient Delay Time
(Release Voltage
Output Conversion)
*
tDLY
(VDR→
VOUT conversion)
0.2
ms
5
→
1. VDF1(T), VDF2(T) : User specified detect voltage.
2. Release voltage (VDR) = VDF +VHYS
3. Those parameters marked with an asterisk apply to both VDET1 and VDET2
.
4. Input Voltage : please ensure that VIN1 > VIN2
(Input voltage of XC612D and XC612E series : please ensure that VIN1 ≥ VIN2, VIN1< VIN2.)
5. VIN1 pin serve both ISS and power supply pin so that VIN2 operates VIN1 as a power supply source. For normal operation of VIN2, operating voltage
higher than the minimum is needed to be applied to power supply pin VIN1
6. For CMOS output products, high level output voltage which is generated when the transient response is released becomes input voltage of VIN
.
.
174
02S_05XC612 02.09.12 14:15 ページ 175
XC612
Series
■Operating Explanation
ꢀTiming Chart (Pull up voltage =Input voltage VIN1)
Input Voltage（VIN1）�
Release Voltage（VDR1）�
Detect Voltage（VDF1）�
�
6
6
6
6
Min. Operating Voltage（VMIN）�
Ground Voltage（VSS）�
2
Input Voltage（VIN2）�
Release Voltage（VDR2）�
Detect Voltage（VDF2）�
Min. Operating Voltage（VMIN）�
Ground Voltage（VSS）�
Output Voltage（VDET1）�
Min. Operating Voltage（VMIN）�
Ground Voltage（VSS）�
Output Voltage（VDET2）�
Min. Operating Voltage（VMIN）�
Ground Voltage（VSS）�
2
2
1
4
5
1
3
5
3
4
条件A A
条件B B
ꢀOperational Notes (N-ch Open drain)
Timing Chart A (VIN1=voltages above release voltage, VIN2=sweep voltage)
Because a voltage higher than the minimum operating voltage is applied to the voltage input pin (VIN), ground voltage will be output at the
output pin (VDET) during stage 3. (Stages 1, 2, 4, 5 are the same as in B below).
Timing Chart B (VIN1=VIN2)
q
When a voltage greater than the release voltage (VDR) is applied to the voltage input pin (VIN1, VIN2), input voltage (VIN1, VIN2) will gradually
fall.
When a voltage greater than the detect voltage (VDF) is applied to the voltage input pin (VIN1, VIN2), a state of high impedance will exist at
the output pin (VDET1, VDET2), so should the pin be pulled up, voltage will be equal to pull up voltage.
When input voltage (VIN1, VIN2) falls below detect voltage (VDF), output voltage (VDET1, VDET2) will be equal to ground level (VSS).
Should input voltage (VIN1, VIN2) fall below the minimum operational voltage (VMIN), output will become unstable. Should VIN2 fall below VMIN,
voltage at the output pin (VDET2) will be equal to ground level (VSS) if the power supply (VIN1) is within the operating voltage range.
*In general the output pin is pulled up so output will be equal to pull up voltage.
w
e
r
t
Should input voltage (VIN1, VIN2) rise above ground voltage (VSS), output voltage (VDET1, VDET2) will equal ground level until the release
voltage level (VDR) is reached.
When input voltage (VIN1, VIN2) rises above release voltage, the output pin's (VDET1, VDET2) voltage will be equal to the voltage dependent on
pull up.
Note : The difference between release voltage (VDR) and detect voltage (VDF) is the Hysteresis Range y.
175
02S_05XC612 02.09.12 14:15 ページ 176
XC612 Series
■Directions for use
ꢀNotes on Use
1. Please use this IC within the specified maximum absolute ratings.�
�
2. Please ensure that input voltage VIN2 is less than VIN1 + 0.3V. (refer to N.B. 1 below)�
3. With a resistor connected between the VIN1 pin and the input, oscillation is liable to occur as a result of through current at
the time of release. (refer to N.B. 2 below)�
4. With a resistor connected between the VIN1 pin and the input, detect and release voltage will rise as a result of the IC's sup-
ply current flowing through the VIN1 pin.�
5. In order to stabilise the IC's operations, please ensure that the VIN1 pin's input frequency's rise and fall times are more than
5 µ sec/V.�
2
6. Should the power supply voltage VIN1 exceed 6V, voltage detector 2's detect voltage (VDF2) and the release voltage (VDR2)
�
will shift somewhat.�
7. For CMOS output products, high level output voltage which is generated when the transient response is released becomes
input voltage of VIN.
ꢀN.B.
1. Voltage detector 2's input voltage (VIN2)�
An input protect diode is connected from input detector 2's input (VIN2) to input detector 1's input. Therefore, should
the voltage applied to VIN2 exceed VIN1, current will flow through VIN1 via the diode. (refer to diagram1)�
2. Oscillation as a result of through current�
Since the XC612 series are CMOS ICs, through current will flow when the IC's internal circuit switching operates
(during release and detect operations). Consequently, oscillation is liable to occur as a result of drops in voltage at
the through current's resistor (RIN) during release voltage operations. (refer to diagram 2)�
Since hysteresis exists during detect operations, oscillation is unlikely to occur.
IN
RIN
XC612N Series
XC612N Series
RIN×ISS*
voltage drop
VIN1
VIN2
VDET1
VDET2
VIN1
VIN2
VSS
ISS*
(includes through current)
Diagram 1. Voltage detector 2's input voltage VIN2
Diagram 2. Through current oscillation
176
02S_05XC612 02.09.12 14:15 ページ 177
XC612
Series
■Test Circuits
Circuit 1.
R�
100k�
＊�
VIN1
VIN2
VDET1
VIN
V
VDF1,VDF2�
VHYS1,VHYS2
VDET2
V
VSS
VDF1,VDF2�
VHYS1,VHYS2
2
* A resistor is not needed if the product is CMOS output type.
Circuit 2.
A
A
IIN2�
ISS
VIN1
VIN2
VIN
VDET1
VDET2
VSS
Circuit 3.
XC612N Series
VIN1 VIN2
VDET1
IVDET
Ａ�
VIN
VDET2
VSS
VDS
XC612D Series
VDS
VDS
VIN1 VIN2
VDET1
IVDET
Ａ�
VIN
IVDET
Ａ�
VDET2
VSS
177
02S_05XC612 02.09.12 14:15 ページ 178
XC612 Series
XC612E Series
VDS
VDS
VIN1 VIN2
VDET1
IVDET
Ａ�
VIN
IVDET
Ａ�
VDET2
VSS
2
Circuit 4.
VIN
waveform�
measurement
VDR
Time
Time
＊�
100k� R�
VIN1
VIN2
VDET
�
VDET1
waveform�
measurement
VDET2
VSS
tDLY
178
02S_05XC612 02.09.12 14:15 ページ 179
XC612
Series
■Typical Performance Characteristics
( )
1 SUPPLY CURRENT vs. INPUT VOLTAGE
ＸＣ６１２Ｎ３６３２�
ＸＣ６１２Ｎ３６３２�
(VIN1＝VIN2
)
(VIN1＝10V)
6.0
5.0
4.0
3.0
2.0
1.0
0
6.0
5.0
4.0
3.0
2.0
1.0
0
Ta=80℃�
-30℃�
25℃�
Ta=80℃�
-30℃�
25℃�
2
0
2
4
6
8
10
0
2
4
6
8
10
Input Voltage: VIN1 (V)
Input Voltage: VIN2 (V)
( )
2 DETECT & RELEASE VOLTAGE vs. AMBIENT TEMPERATURE
ＸＣ６１２Ｎ３６３２
ＸＣ６１２Ｎ３６３２
(VDF1＝3.6V)
(VDF2＝3.2V)
3.9
3.5
3.4
3.3
3.2
3.1
3.0
V
DR
3.8
3.7
3.6
3.5
3.4
V
DR
VDF
V
DF
-40 -20
0
20
40
60
80
-40 -20
0
20
40
60
80
Ambient Temp.: Topr (:)
Ambient Temp.: Topr (:)
Note : Unless otherwise stated, pull up resistance = 100kΩ with N-ch open drain output types.
( )
3 OUTPUT VOLTAGE vs. INPUT VOLTAGE
ＸＣ６１２Ｎ３６３２ꢀ�
ＸＣ６１２Ｎ３６３２�
(VDF1＝3.6V)
(VDF2＝3.2V)
5
4
3
2
1
0
5
4
3
2
1
0
Topr = 80℃�
25℃�
Topr = 80℃�
25℃�
-30℃�
-30℃�
0
1
2
3
4
5
0
1
2
3
4
5
Input Voltage: VIN1 (V)
Input Voltage: VIN2 (V)
179
02S_05XC612 02.09.12 14:15 ページ 180
XC612 Series
( )
4 N-CH DRIVER OUTPUT CURRENT vs. VDS
ＸＣ６１２Ｎ３６３２�
ＸＣ６１２Ｎ３６３２�
(VDF1＝3.6V)
(VDF2＝3.2V)
45
40
35
30
25
20
15
10
5
45
40
35
30
25
20
15
10
5
VIN =3.5V
3.0
IN
V
=3.0V
2.5V
2.5V
2.0V
2.0V
1.5V
1.5V
2
0
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5
VDS (V)
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5
VDS (V)
ＸＣ６１２Ｎ３６３２�
ＸＣ６１２Ｎ３６３２�
(VDF1＝3.6V)
(VDF2 ＝3.2V )
700
600
500
400
300
200
100
0
700
600
500
400
300
200
100
0
VIN =0.8V
VIN =0.8V
0.7V
0.7V
0
0.2
0.4
0.6
0.8
1.0
0
0.2
0.4
0.6
0.8
1.0
VDS (V)
VDS (V)
( )
5 N-CH DRIVER OUTPUT CURRENT vs. INPUT VOLTAGE
ＸＣ６１２Ｎ３６３２�
ＸＣ６１２Ｎ３６３２�
(VDF1＝3.6V)
(VDF2＝3.2V)
20
18
16
14
12
10
8
20
18
16
14
12
10
8
VDS=0.5V
VDS=0.5V
Topr=-30℃�
25℃�
Topr=-30℃�
25℃�
80℃�
6
6
80℃�
4
4
2
2
0
0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
0
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Input Voltage: VIN1 (V)
Input Voltage: VIN2 (V)
180
02S_05XC612 02.09.12 14:15 ページ 181
XC612
Series
■Typical Application Circuits
ꢀWindow comparator circuit (Example covers N-channel open drain product's circuits.)
VIN
VIN
VDF1
VDF2
R
R
VOUT
VSS
VOUT
VIN1
VIN2
VDET1
VDET2
Time
2
VSS
VSS
VSS
VSS
Time
ꢀDetect voltages above respective established voltages circuit (Example covers N-channel open drain product's circuits.)
VDD
VIN
R
VIN1
VIN2
VDET1
VDET2
R1
R2
VOUT
VSS
VSS
VSS
Notes on resistors R1 and R2's (1), (2) functions :�
Detect voltage = { (R1 + R2) ÷ R2} × VDF2
N.B. VDF2 = detect voltage VD2�
Please set-up so that�
(1)�
(2)�
Hysteresis (VHYS2) = { (R1 + R2) ÷ } × VHYS2
�
Note : Please ensure that input voltage 2 (VIN2) is less than VIN1 + 0.3V
ꢀVoltage detect circuit with delay built-in (Example covers N-channel open drain product's circuits.)
VDD
R
D
VIN1
VIN2
VDET1
VDET2
RD
VSS
CD
VSS
VSS
Note : Delay operates at both times of release �
and detect operations.
181
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