XC612N3621MR-G [TOREX]
Power Management Circuit;型号: | XC612N3621MR-G |
厂家: | Torex Semiconductor |
描述: | Power Management Circuit 光电二极管 |
文件: | 总15页 (文件大小:536K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XC612Series
ETR0204_002
2-Channel Voltage Detectors
■GENERAL DESCRIPTION
The XC612 series consist of 2 voltage detectors, in 1 mini-molded, SOT-25 package.
The series provides accuracy and low power consumption through CMOS processing and laser trimming and consists of a
highly accurate voltage reference source, 2 comparators, hysteresis and output driver circuits.
The input (VIN1) for voltage detector 1 (VD1) dually functions as the power supply pin for both detector 1 (VD1) and detector 2
(VD2).
■APPLICATIONS
■FEATURES
Detect voltage accuracy
Low Power Consumption
:
:
±2%
2.0μA(TYP.)
(VIN1=VIN2=2.0V, Static state)
●Microprocessor reset circuitry
●Memory battery back-up circuits
●Power-on reset circuits
Detect Voltage
: 1.5V ~ 5.0V programmable in
100mV steps. Detector’s voltages can
be set-up independently
●Power failure detection
●System battery life and charge voltage monitors
●Delay circuitry
Conditionaly;
XC612N : VDET1>VDET2
>
XC612D, XC612E : VDET1 VDET2,
VDET1<VDET2
Operating Voltage Range : 1.5V ~ 10.0V
Temperature Characteristics
Output Configuration
Operating Ambient Temperature
Packages
:
±
100ppm/
℃ (TYP.)
: N-channel open drain,CMOS
:
: SOT-25, USP-6B
-40℃~+85℃
Environmentally Friendly : EU RoHS Compliant, Pb Free
■TYPICAL APPLICATION CRICUIT
■TYPICAL PERFORMANCE
CHARACTERISTICS
1/15
XC612 Series
■PIN CONFIGURATION
●SOT-25
●USP-6B
VSS
VIN1
VIN2
NC
* The dissipation pad for the USP-6B package should be
VDET2
VDET1 solder-plated in recommended mount pattern and metal
masking to enhance mounting strength and heat release. If the
pad needs to be connected to other pins, it should be connected
to the VIN level.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTION
SOT-25
USP-6B
1
2
3
4
5
3
2
1
6
4
VDET1
VIN1
Voltage Detector 1 Output
Detector 1 Input, Power Supply
Ground
VSS
VIN2
Voltage Detector 2 Input
Voltage Detector 2 Output
VDET2
-
5
NC
No Connect
■PRODUCT CLASSIFICATION
●Selection Guide
TYPE
VDET1
VDET2
XC612N
N-ch Open Drain
N-ch Open Drain
XC612D
XC612E
N-ch Open Drain
CMOS
CMOS
N-ch Open Drain
●Ordering Information
XC612①②③④⑤⑥⑦
DESIGNATOR
ITEM
Type
SYMBOL
DESCRIPTION
N
D
E
①
Refer to selection guide
Detect voltage
(VDET1
Detect Voltage
(VDET2
②③
④⑤
15~50
15~50
VDET1 e.g. 2.5V→②2, ③5
VDET2 e.g. 3.3V→②3, ③3
)
)
MR
MR-G
DR
SOT-25(3,000/Reel)
SOT-25(3,000/Reel)
USP-6B(3,000/Reel)
USP-6B(3,000/Reel)
Packages
⑥⑦-⑧
(Order Unit)
DR-G
(*1) The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully RoHS compliant.
2/15
XC612
Series
■BLOCK DIAGRAMS
XC612N Series
XC612D Series
XC612E Series
3/15
XC612 Series
■ABSOLUTE MAXIMUM RATINGS
Ta = 25℃
PARAMETER
SYMBOL
VIN1
RATINGS
VSS-0.3~VSS+12
VSS-0.3~VIN1+0.3
VSS-0.3~VSS+12
VSS-0.3~VSS+12
VSS-0.3~VIN1+0.3≦VSS+12
VSS-0.3~VSS+12
VSS-0.3~VIN1+0.3≦VSS+12
50
UNITS
V
VIN1
VIN2
N
Input Voltage
VIN2
V
VIN2 D/E
VDET1(Nch open drain
VDET1(CMOS)
VDET2(Nch open drain
VDET2(CMOS)
VDET1
)
)
VDET1
VDET1
VDET2
VDET2
IDET1
V
V
Output Voltage
Output Current
V
V
mA
mA
VDET2
IDET2
50
SOT-25
250
120
Power
Pd
mW
Dissipation
USP-6B
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
-40~+85
-55~+125
℃
℃
4/15
XC612
Series
■ELECTRICAL CHARACTERISTICS
Ta=25℃
PARAMETER
SYMBOL
VDF1
CONDITIONS
MIN.
TYP.
MAX. UNITS CIRCUITS
Detect Voltage
(VDET1)
Voltage when VDET1 changes from
H to L following a reduction of VIN1
VDF1(T)
x 0.98
VDF1(T)
VDF1(T)
V
V
①
①
x 1.02
Detect Voltage
(VDET2)
Voltage when VDET2 changes from
H to L following a reduction of VIN2
VDF2(T)
x 0.98
VDF2(T)
x 1.02
VDF2
VHYS1
VHYS2
VDF2(T)
VDF1
Voltage (VDR1) - VDF1 when VDET1 changes
from L to H following an increase of VIN1
VDF1
VDF1
Hysteresis Range 1
Hysteresis Range 2
V
V
①
①
x 0.02 x 0.05 x 0.08
Voltage (VDR2) - VDF2 when VDET2 changes
from L to H following an increase of VIN2
VDF2
VDF2
VDF2
x 0.02 x 0.05 x 0.08
VIN1 = 1.5V
=2.0V
-
1.35
1.50
1.95
2.40
3.00
0.45
0.50
0.65
0.80
1.00
-
3.90
4.50
5.10
5.70
6.30
1.30
1.50
1.70
1.90
2.10
10
-
-
Supply Current
(VIN1 Input
Current)
ISS
VIN=VIN1
μA
②
=3.0V
=4.0V
-
=5.0V
-
VIN2 = 1.5V
=2.0V
-
-
VIN2 Input Current
Operating Voltage
IIN2
VIN=VIN1=VIN2
μA
②
=3.0V
-
=4.0V
-
=5.0V
-
VIN1
VDF(T) = 1.5V to 5.0V
1.0
0.3
3.0
5.0
6.0
7.0
V
-
VIN1 =1.0V
=2.0V
2.2
-
7.7
-
N-ch,VDS=0.5V
=3.0V
10.1
11.5
13.0
-
Output Current (*1)
IDET
mA
③
=4.0V
-
=5.0V
-
P-ch (CMOS)
VDS=-2.1V
=8.0V
-
-
-10.0
±100
-2.0
-
ΔVDF
(ΔTopr・
VDF
/
Temperature
-40℃ ≦ Topr ≦ 85℃
ppm/℃
①
④
Characteristics (*1)
)
Delay Time (*1)
(Release Voltage
→
tDLY
(VDR → VDET inversion)
-
-
0.2
ms
Output inversion)
(*1) The Features of output current, temperature characteristics and delay time are common between VDET1 and VDET2
Note:
VDF1(T), VDF2(T) : Nominal detect voltage.
Release voltage (VDR) = VDF +VHYS
N type Input Voltage : please ensure that VIN1 > VIN2
>
(Input voltage of XC612D and XC612E series : please ensure that VIN1 VIN2, VIN1 < VIN2.)
VIN1 pin serve both ISS and power supply pin so that VIN2 operates VIN1 as a power supply source. For normal operation of VIN2,
operating voltage higher than the minimum is needed to be applied to power supply pin VIN1.
For CMOS output products, high level output voltage which is generated when the transient response is released becomes input
voltage of VIN.
5/15
XC612 Series
■OPERATONAL EXPLANATION
●Timing Chart (Pull up voltage =Input voltage VIN1)
Input Voltage(VIN1
Release Voltage(VDR1
Detect Voltage(VDF1
)
)
⑥
⑥
⑥
⑥
)
Ground Voltage(V
Min. OperatingVoltage(VMIN
)
)
SS
Input Voltage(VIN2
)
Release Voltage(VDR2
)
Detect Voltage(VDF2
)
Min. Operating Voltage(VMIN
)
)
)
Ground Voltage(VSS
)
Output Voltage(VDET1
)
Min. Operating Voltage(VMIN
Ground Voltage(VSS
)
Output Voltage(VDET2
)
Min. Operating Voltage(V
MIN
GroundVoltage(VSS
)
①
②
③
④
⑤
①
②
③
④
⑤
A
B
●Operational Notes (N-ch Open drain)
Timing Chart A (VIN1=voltages above release voltage, VIN2=sweep voltage)
Because a voltage higher than the minimum operating voltage is applied to the voltage input pin (VIN), ground voltage will be
output at the output pin (VDET) during stage 3. (Stages 1, 2, 4, 5 are the same as in B below).
Timing Chart B (VIN1=VIN2)
① When a voltage greater than the release voltage (VDR) is applied to the voltage input pin (VIN1, VIN2), input voltage (VIN1,
VIN2) will gradually fall.
When a voltage greater than the detect voltage (VDF) is applied to the voltage input pin (VIN1, VIN2), a state of high
impedance will exist at the output pin (VDET1, VDET2), so should the pin be pulled up, voltage will be equal to pull up
voltage.
② When input voltage (VIN1, VIN2) falls below detect voltage (VDF), output voltage (VDET1, VDET2) will be equal to ground
level (VSS).
③ Should input voltage (VIN1, VIN2) fall below the minimum operational voltage (VMIN), output will become unstable. Should
VIN2 fall below VMIN, voltage at the output pin (VDET2) will be equal to ground level (VSS) if the power supply (VIN1) is
within the operating voltage range.
*In general the output pin is pulled up so output will be equal to pull up voltage.
④ Should input voltage (VIN1, VIN2) rise above ground voltage (VSS), output voltage (VDET1, VDET2) will equal ground level
until the release voltage level (VDR) is reached.
⑤ When input voltage (VIN1, VIN2) rises above release voltage, the output pin's (VDET1, VDET2) voltage will be equal to the
voltage dependent on pull up.
Note : The difference between release voltage (VDR) and detect voltage (VDF) is the Hysteresis Range ⑥.
6/15
XC612
Series
■NOTES ON USE
1. Please use this IC within the specified maximum absolute ratings, for temporary, transitional voltage drop or voltage
rising phenomenon, the IC is liable to malfunction should the
ratings be exceeded.
2. When use N type, please ensure that input voltage VIN2 is less than VIN1 + 0.3V. (refer to N.B. 1 below)
3. With a resistor RIN connected between the VIN1 pin and the power supply, oscillation is liable to occur as a result of
through current at the time of release. (refer to N.B. 2 below)
4. With a resistor RIN connected between the VIN1 pin and the power supply, VIN1 pin voltage will fall as a result of the IC's
supply current flowing through the VIN1 pin.
5. In order to stabilize the IC's operations, please ensure that the VIN1 pin's input frequency's rise and fall times are more
than 5 msec/V.
6. Should the power supply voltage VIN1 exceed 6V, voltage detector 2's detect voltage (VDF2) and the release voltage
(VDR2) will shift somewhat.
7. For CMOS output products, high level output voltage which is generated when the transient response is released
becomes input voltage of VIN.
8. Torex places an importance on improving our products and its reliability. However, by any possibility, we would request
user fail-safe design and post-aging treatment on system or equipment.
●N.B.
1. Voltage detector 2's input voltage (VIN2) N Type.
An input protect diode is connected from input detector 2's input (VIN2) to input detector 1's input. Therefore, should the
voltage applied to VIN2 exceed VIN1, current will flow through VIN1 via the diode. (refer to diagram1)
2. Oscillation as a result of through current
Since the XC612 series are CMOS ICs, through current will flow when the IC's internal circuit switching operates
(during release and detect operations). Consequently, oscillation is liable to occur as a result of drops in voltage at the
through current's resistor (RIN) during release voltage operations. (refer to diagram 2)
Since hysteresis exists during detect operations, oscillation is unlikely to occur.
Diagram 1. Voltage detector 2's input voltage VIN2
Diagram 2. Through current oscillation
7/15
XC612 Series
■TEST CIRCUITS
Circuit 1
* A resistor is not needed for CMOS output type.
Circuit 2
Circuit 3
V
IN1
V
IN2
IDET
VDET1
V
IN
A
VDET2
VSS
VDS
XC612N Type
XC612E Type
XC612D Type
8/15
XC612
Series
■TEST CIRCUITS (Continued)
Circuit 4
Waveform
measurmen
Waveform
measurmen
* A resistor is not needed for CMOS output type.
9/15
XC612 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
Ambient Temperature Topr (℃)
Ambient Temperature Topr (℃)
Note: Unless otherwise stated, pull up resistance = 100kΩwith N-ch open drain output type.
10/15
XC612
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
11/15
XC612 Series
■APPLICATION CIRCUITS EXAMPLE *Example covers N-channel open drain product's circuits
●Window comparator circuit
●Detect voltages above respective established voltages circuit
On resistors R1 and R2 equation (1) and (2)
Detect voltage = { (R1 + R2) ÷ R2} × VDF2
N.B. VDF2 = detect voltage VD2
(1)
Hysteresis (VHYS2) = { (R1 + R2) ÷R2 } × VHYS2
(2)
Note: Please ensure that input voltage 2 (VIN2) is less than VIN1 + 0.3V
●Detect voltage circuit with delay built-in
Note: Delay operates at both times of release and
detect operations.
12/15
XC612
Series
■PACKAGING INFORMATION
●SOT-25
●USP-6B
1.8±0.05
1PIN INDENT
0.2±0.05
1
0.2±0.05
3
2
6
5
4
0.1±0.03
0.5±0.05 0.5±0.05
1.6±0.05
13/15
XC612 Series
■MARKING RULE
●SOT-25
①Represents output configuration
CONFIGURATION
MARK
PRODUCT SERIES
VDET1
N-ch Open Drain
N-ch Open Drain
CMOS
VDET2
N-ch Open Drain
CMOS
5
4
N
D
E
XC612NxxxxMx
XC612DxxxxMx
XC612ExxxxMx
①
②
③
④
N-ch Open Drain
1
2
3
②, ③Represents sequence number
④Represents production lot number
0 to 9, A to Z repeated. (G, I, J, O, Q, W excepted.)
●USP-6B
0.5±0.1
(0.05)
(0.45)(0.45)
1
2
3
6
5
4
(0.45)
USP-6B
① represents output configuration
CONFIGURATION
MARK
PRODUCT SERIES
VDET1
VDET2
N
D
E
N-ch open drain
N-ch open drain
CMOS
N-ch open drain
CMOS
XC612N****D*
XC612D****D*
XC612E****D*
N-ch open drain
②,③ represent detect voltage(VDET1)
④,⑤ represent detect voltage(VDET2)
SYMBOL
SYMBOL
PRODUCT SERIES
VOLTAGE(V
)
PRODUCT SERIES
VOLTAGE(V
)
②
3
③
3
④
3
⑤
3
3.3
5.0
XC612*33**D*
XC612*50**D*
3.3
5.0
XC612***33D*
XC612***50D*
5
0
5
0
⑥ represents production lot number
0~9、A~Z repeated. (G、I、J、O、Q、W excluded.)
*No character inversion used.
14/15
XC612
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this catalog is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this catalog.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this catalog.
4. The products in this catalog are not developed, designed, or approved for use with such
equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this catalog within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this catalog may be copied or reproduced without the
prior permission of Torex Semiconductor Ltd.
15/15
相关型号:
©2020 ICPDF网 联系我们和版权申明