XC6193BANNER-G [TOREX]
Push Button Smart Load Switch with 140mΩ internal high-side switch;型号: | XC6193BANNER-G |
厂家: | Torex Semiconductor |
描述: | Push Button Smart Load Switch with 140mΩ internal high-side switch |
文件: | 总28页 (文件大小:1056K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XC6193 Series
Push Button Smart Load Switch with 140mΩ internal high-side switch
ETR33013-002
and external Pch MOSFET control pin(GATE pin).
■FEATURES
Input Voltage Range
Stand-by Current
■GENERAL DESCRIPTION
:
:
:
:
1.8V ~ 6.0V
The XC6193 series are the Push Button load switch with
functions best suitable for battery operated devices.
0.001μA (TYP.) / Turn-Off state
0.13μA (TYP.) / Turn-On state
Only Internal FET - 1000mA (VIN=2.0V)
Quiescent Current
Output Current
The built-in high side switch is turned on by the Push Button
(Turning off is also possible on the type.) and turned off by
the "L" level signal into the SHDN pin from the MCU or the
like.
The high side switch is turned on and latched by inputting
"L" signal from the Push Button of the device to the SW pin.
It is possible to shut down (OFF) by inputting a 1-pulse
signal of "H" level from the MCU or the like to the SHDN pin.
External FET
- Depend on FET
Turn-On Delay Time
Turn-Off Method
:
:
0.2s, 1.0s, 3.0s or 5.0s
Type A
Type B
・By inputting “H” voltage to
the SHDN pin.
・By inputting “L” voltage
during the TOFFD to the SW pin.
・By inputting “H” voltage to
the SHDN pin.
This realizes a main switch of battery operated devices
(*1)
easily.
(The XC6193 series are possible to control not
only the built-in high side switch but also the external Pch
MOSFET.)
Turn-Off Delay Time
Added function
:
:
3s, 5s, 10s or 15s
External MOSFET Control function
(The GATE pin)
The leak current at shutdown is so small, which is
1nA(TYP.), that this IC will contribute to reducing the
discharge of the battery and making shelf life longer of the
devices after shipping as well as functioning as a main
switch.
Shutdown function (the SHDN pin)
Output capacitor inrush current limit soft-start
Output capacitor discharge
Output short circuit protection
Thermal shutdown
Protective function
:
For the A type, it is possible to turn off forcibly in case of
emergency by Push Button signal. This enables a freezed
device to be turned off. For the B type, turn-off is available
only with SHDN pin.
Operating Ambient Temperature
:
:
-40℃ ~ 85℃
Package
USP-8B06 (2.0 x 2.0 x h0.33mm)
In addition to the built-in high side switch, the XC6193
series has the GATE pin for driving an external Pch
MOSFET.
In addition to these functions, this IC is equipped with
output capacitor inrush current limiting function and short-
circuit protection function, realizing an intelligent load switch.
■APPLICATIONS
● Wearable devices
● Smart card devices
● Wireless headphones / Earphones
● IoT devices
● Applications with ON/OFF switch function
● Various applications equipped with buttons
● Various applications equipped with mechanical switches
● The devices with waterproof function.
(*1) Please be sure to complete the preparation for shutting down
safely before inputting the signal to SHDN pin from the MCU or the
likes.
■TYPICAL APPLICATION CIRCUIT
Q1
R2
GATE
Battery
CIN=0.1μ F
VOUT
Other
VOUT
VDD
VIN
CL=0.1μ F
PMIC or LDO
or
R1
R4
VIN
DC/DC
XC6193
EN
SBD
MCU
I/O
I/O
SW
SHDN
VSS
R3
C1
Push Button
1/28
XC6193 Series
■BLOCK DIAGRAM
XC6193A
VIN
VOUT
PM1
SW Circuit
SW
R1
VREF
POR
NM2
Type Select
GATE
TEST
From SHDN Circuit
UVLO
IREF
Short Circuit Protect
R2
Turn-On Delay
Counter
Thermal Shut Down
OSC
NM1
Soft Start
(Inrush Current Limit)
Turn-Off Delay
Counter
To various circuit
From SHDN Circuit
SHDN Circuit
SHDN
TEST Circuit
VSS
XC6193B
VIN
VOUT
PM1
SW Circuit
SW
R1
VREF
POR
NM2
Type Select
GATE
TEST
From SHDN Circuit
UVLO
IREF
Short Circuit Protect
Thermal Shut Down
R2
Turn-On Delay
Counter
OSC
NM1
Soft Start
(Inrush Current Limit)
Turn-Off Delay
Counter
To various circuit
From SHDN Circuit
SHDN Circuit
SHDN
TEST Circuit
VSS
*Diodes inside the circuit are an ESD protection diodes and a parasitic diodes.
2/28
XC6193
Series
■PRODUCT CLASSIFICATION
●Ordering Information
(*1)
XC6193①②③④⑤⑥-⑦
DESIGNATOR
DESCRIPTION
SYMBOL
A
DESCRIPTION
: By the SW pin
Shut-down : By the SW pin or the SHDN pin
Turn-on
①
TYPE
Turn-on
: By the SW pin
B
Shut-down : By the SHDN pin
A
1
3
5
0.2s.
1s. option (*2)
②
Turn-On delay time
3s. option (*2)
5s. option (*2)
It does not have “Turn-Off function by the SW pin”.
NN
Applies to XC6193B only.
03
05
3s. option (*2)
③④
Turn-Off delay time
5s.
10
10s.
15
15s. option (*2)
⑤⑥-⑦
Package and Taping Type
ER-G
USP-8B06 (5,000pcs/Reel)
(*1)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(*2) For option products, please contact your local Torex sales office or representative.
●Selection Guide
Parts No.
Turn-On Delay Time
0.2s
Turn-Off Delay Time
Package
XC6193AA05ER-G
XC6193AA10ER-G
XC6193BANNER-G
5s
10s
USP-8B06
Not applicable
XC6193 Series
■PIN CONFIGURATION
8.VOUT
1.VIN
7.SHDN
2.NC
6.TEST
3.SW
5.VSS
4.GATE
USP-8B06
(BOTTOM VIEW)
*The dissipation pad for the USP-8B06 package should be solder-plated in recommended
mount pattern and metal masking so as to enhance mounting strength and heat release.
When taking out a potential of the heat-sink, connect with VSS pin (#5 pin).
■PIN ASSIGNMENT
PIN NUMBER
USP-8B06
1
PIN NAME
FUNCTION
VIN
NC
Power Supply Input
No connection pin
2
(The NC pin should be connected the VSS pin or be floated.)
3
4
5
6
7
8
SW
GATE
VSS
Push Button Signal input pin
External Pch MOSFET Control pin
Ground Pin
TEST
SHDN
VOUT
The TEST pin must be connected the VSS pin.
Forced Shutdown pin
Output pin
■PIN FUNCTIOS ASSIGNMENT
PIN NAME
SIGNAL
STATUS
L
Active
SW
H
Keep the current state
Undefined State (*1)
Keep the current state
Shut down
OPEN
L
SHDN
GATE
H
OPEN
Undefined State (*1)
Low impedance
High impedance
VOUT=”H” Level
VOUT=”L” Level
(*1) Please do not leave the SW pin and the SHDN pin open. Each should have a certain voltage
4/28
XC6193
Series
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
VIN Pin Voltage
SYMBOL
RATINGS
-0.3 ~ 6.6
UNITS
VIN
VOUT
IOUT
V
V
VOUT Pin Voltage
VOUT Pin Output Current
SW Pin Voltage
-0.3 ~ VIN + 0.3 or 6.6(*1)
1500
mA
V
VSW
-0.3 ~ 6.6
SHDN Pin Voltage
GATE Pin Voltage
TEST Pin Voltage
VSHDN
VGATE
VTEST
-0.3 ~ 6.6
V
-0.3 ~ 6.6
-0.3 ~ VIN + 0.3 or 6.6(*1)
1240 (JESD51-7 board) (*2)
1800 (High heat dissipation board) (*2)
-40 ~ 85
V
Power Dissipation
(Ta=25℃)
USP-8B06
(DAF)
Pd
mW
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
℃
℃
-55 ~ 125
Each rating voltage is based on the VSS
(*1) Either of lower one, VIN+0.3V or 6.6V, is applicable.
(*2) The power dissipation figure shown is PCB mounted and is for reference only.
Please refer to PACKAGING INFORMATION for the mounting condition.
XC6193 Series
■ELECTRICAL CHARACTERISTICS
Ta=25℃
XC6193 Series
PARAMETER
Input Voltage Range
Stand-by Current(*1)
Operation Current(*2)
Quiescent Current(*3)
UVLO Detect Voltage
UVLO Detect Delay Time
SYMBOL
VIN
CONDITIONS
MIN
1.8
TYP
-
MAX UNIT
CIRCUIT
6.0
0.10
91
V
(1)
(1)
(1)
(1)
(1)
(1)
ISTB
VIN=6.0V, VSW=VIN
-0.10 0.001
μA
μA
μA
V
IOP
Turn-Off states, VIN=6.0V, VSW=0V,
Turn-On keeps, VIN=6.0V, VSW=VIN
Turn-On States, VIN condition
After UVLO detected
-
48
0.13
1.2
-
IQ
-
0.42
1.37
-
VUVLO
tUVLO
1.1
100
μs
XC6193xAxx
0.18
0.90
2.70
4.50
2.70
4.50
9.0
0.20
1.00
3.00
5.00
3.00
5.00
10.0
15.0
125
0.22
1.10
3.30
5.50
3.30
5.50
11.0
16.5
-
Change the VSW from VIN to 0V.
XC6193x1xx
Change the VSW from VIN to 0V.
XC6193x3xx
Turn-On Delay Time(*4)
tOND
s
(1)
Change the VSW from VIN to 0V.
XC6193x5xx
Change the VSW from VIN to 0V.
XC6193Ax03
Change the VSW from VIN to 0V.
XC6193Ax05
Change the VSW from VIN to 0V.
XC6193Ax10
Turn-Off Delay Time(*5)(*6)
tOFFD
s
(1)
(1)
Change the VSW from VIN to 0V.
XC6193Ax15
13.5
-
Change the VSW from VIN to 0V.
Thermal shutdown Detect
Temperature
TTSDD
After detected the voltage drop due to
the ON resistance of the driver
transistor.
℃
Thermal shutdown Release
Temperature
TTSDR
-
105
-
VIN
–
VIN
-
VIN –
Short Circuit Detect Voltage
VSHORT
VOUT condition
V
(1)
(1)
0.85
0.55
0.25
After short detected,
VSW=VIN
Short Circuit Detect Delay Time
tSHORT
80
-
-
μs
Unless otherwise stated, VSS common, VIN=6.0V, VSW=6.0V, VSHDN=0V, VPG=Open, IOUT=0mA, CIN=0.1μF, CL=0.1μF
(*1) Self-supply current when VOUT is in the Turn-off state and VIN level is input into the VSW pin.
(*2) Self-supply current when VOUT is in the Turn-off state and “L” level is input into the VSW pin.
(*3) Self-supply current when VOUT is in the Turn-on state and VIN level is input into the VSW pin.
(*4) Time from SW pin “L” level until VOUT pin ”H” level(*7) pin in the Turn-off state.
(*5) Time from SW pin “L” level until VOUT pin ”L” level(*8) pin in the Turn-on state.
(*6) Type B does not have this function.
SW Pin Voltage
0V
0V
(*7) VOUT Pin ”H” Voltage : VIN × 0.9
VOUT Pin Voltage
(*8) VOUT Pin ”L” Voltage : VIN × 0.1
VOUT Pin Voltage
0V
0V
VOUT pin “H” Voltage
VOUT pin “L” Voltage
6/28
XC6193
Series
■ELECTRICAL CHARACTERISTICS (Continued)
Ta=25℃
XC6193 Series
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX UNIT
0.46
CIRCUIT
Turn-On states, VIN=1.8V
Turn-On states, VIN=2.0V
Turn-On states, VIN=3.0V
Turn-On states, VIN=6.0V
0.145
0.135
0.110
0.085
1.1
0.19
0.18
0.14
0.11
-
0.40
Ω
0.26
Main Driver On Resistor
RON
(1)
0.20
SW pin "H" Voltage
SW pin "L" Voltage
VSWH
VSWL
6.0
0.4
0.10
0.10
6.0
0.4
0.10
0.10
-
V
V
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
0
-
SW pin "H" Current
ISWH
VSW=6.0V
VSW=0V
-0.10
-0.10
1.1
0.01
0.01
-
μA
μA
V
SW pin "L" Current
ISWL
SHDN pin "H" Voltage
SHDN pin "L" Voltage
SHDN pin "H" Current
SHDN pin "L" Current
GATE pin On Resistor1
GATE pin On Resistor2
GATE pin Leak Current
CL Discharge Current
VSHDNH
VSHDNL
ISHDNH
ISHDNL
RGATE1
RGATE2
IGATEL
IDCG
0
-
V
VSHDN=6.0V
-0.10
-0.10
95
0.01
0.01
-
μA
μA
Ω
VSHDN=0V
Turn-On states, VIN=6.0V, VGATE=0.3V
Turn-On states, VIN=1.8V, VGATE=0.3V
Turn-Off states, VIN=6.0V, VGATE=6.0V
Turn-Off states, VIN=1.8V, VOUT=0.3V
-
-
300
0.10
-
Ω
-0.10
1
0.01
-
μA
mA
Unless otherwise stated, VSS common, VIN=6.0V, VSW=6.0V, VSHDN=0V, VPG=Open, IOUT=0mA, CIN=0.1μF, CL=0.1μF
XC6193 Series
■TEST CIRCUITS
Test Circuit (1)
Waveform check
A
A
Waveform check
VIN
VOUT
N.C.
SW
A
SHDN
A
XC6193
GATE
TEST
A
VSS
V
V
V
V
V
8/28
XC6193
Series
■TYPICAL APPLICATION CIRCUIT
Q1
R2
GATE
Battery
CIN=0.1μ F
VOUT
Other
VOUT
VDD
VIN
CL=0.1μ F
PMIC or LDO
R1
R4
VIN
or
DC/DC
XC6193
EN
SBD
MCU
I/O
I/O
SW
SHDN
VSS
R3
C1
Push Button
·
Example of R2’s value selection
(1) Consideration of voltage drop due to the GATE pin leakage current at turn-off states.
1) GATE pin Leak Current = 0.1μA (MAX.)
2) Cut-off threshold of the Q1 (VGS_cut of) = 0.3 V. (Please check the actual Q1’s data-sheet.)
R2 x 0.1μA < VGS_cut off
R2 < 3MΩ
(2) Consideration of VGS of the Q1 at turn-on states.
1) GATE pin On Resistor2 (RGATE2) = 300Ω (MAX.)
2) Turn-on threshold of the Q1 (VGS) = -1.5V (VG = VIN + VGS = 0.3V), (Please check the actual Q1’s data-sheet.)
3) VIN =1.8V
R2 > (VIN – VG) / VG x RGATE2
R2 > 1.5kΩ
③ Consideration of current flowing between R2 and Vss at turn-on states.
1) GATE pin On Resistor1 (RGATE1) = 95Ω (MIN.)
2) The current flowing through to R2 = IR2.
IR2 = VIN / (R2 + RGATE1
)
【Typical Examples】
VALUE
MANUFACTURER
Panjit
PRODUCT NUMBER
RB751S40
SBD(*1)
CIN
VF = 0.37V
0.1μF / 10V (Ceramic)
0.1μF / 10V (Ceramic)
Set it as necessary.
CL
C1
( Example: 0.1μF~ 1μF)
R1
R2
R3
R4
Q1
200kΩ
1.5kΩ~ 3MΩ-
5kΩ
47kΩ
Rds=112mΩ@VGS=-1.8V
ON Semiconductor
FDZ375P
(*1) Please select freely according to the threshold of the MCU's I/O.
XC6193 Series
■OPERATIONAL EXPLANATION
The XC6193 series type-A fixes VOUT at “H” voltage (same level as the VIN pin voltage) when “L” voltage is input for the
required time into the SW pin, and shuts down VOUT(same level as GND) when “L” voltage is subsequently input for the required
time into the SW pin, thereby realizing alternating ON/OFF control(*). Two shutdown methods are available: inputting “H” voltage
into the SHDN pin, and inputting “L” voltage the required time into the SW pin.
* Alternating ON/OFF control on this IC is a system that alternates between VOUT “H” voltage and shutdown each time “L” voltage is input for
the required time into the SW pin.
The type-B fixes VOUT at “H” voltage when “L” voltage is input for the required time into the SW pin. After VOUT is fixed at “H”
voltage, the signal is not accepted if “L” voltage is subsequently input into the SW pin. The shutdown method is inputting “H”
voltage into the SHDN pin.
The XC6193 series have be equiped the GATE pin, so it can handle an output current of 1A or more by connecting a Pch
MOSFET (Q1) as shown in the typical application circuit.
As protective functions, the XC6193 series are equipped with the inrush current limiting soft-start circuit, the output short
protection circuit and the thermal shutdown circuit.
VIN
VOUT
PM1
SW Circuit
SW
R1
VREF
POR
NM2
Type Select
GATE
TEST
From SHDN Circuit
UVLO
IREF
Short Circuit Protect
R2
Turn-On Delay
Counter
Thermal Shut Down
OSC
NM1
Soft Start
(Inrush Current Limit)
Turn-Off Delay
Counter
To various circuit
From SHDN Circuit
SHDN Circuit
SHDN
TEST Circuit
VSS
Fig.1 XC6193A Block diagram
Q1
R2
GATE
Battery
CIN=0.1μ F
VOUT
Other
VOUT
VDD
VIN
CL=0.1μ F
PMIC or LDO
R1
R4
VIN
or
DC/DC
XC6193
EN
SBD
MCU
I/O
I/O
SW
SHDN
VSS
R3
C1
Push Button
Fig.2 Typical application circuit
10/28
XC6193
Series
■OPERATIONAL EXPLANATION (Continued)
[Turn-On sequence: Fig.3]
If Voltage “Low” is input over the duration of TOND to the SW pin while VOUT is fixed at Voltage “Low”, VOUT will begin to rise while
the output current is being suppressed by the inrush current limit soft-start function, which will gradually turns on the Pch driver
transistor PM1 (refer to Fig.1).
Even if the SW pin voltage changes to the Voltage “High” while VOUT is rising, VOUT will ultimately be fixed at Voltage “High”.
When the gate voltage of the PM1 has dropped sufficiently, the Nch transistor: NM1 (refer to Fig.1) connected to the GATE pin
will turns on, and the GATE pin will have a low-impedance.
tOND
SW Pin Voltage
VOUT Pin Voltage
GATE Pin Voltage
Inrush Current
Fig.3 Turn-On sequence
XC6193 Series
■OPERATIONAL EXPLANATION (Continued)
[Shutdown sequence: Fig.4]
In the XC6193 series, when one pulse of “H” voltage (at least 100μs as a guideline) is input into the SHDN pin with VOUT fixed at
“H” voltage, VOUT changes to the shutdown state and the IC enters the standby state.
SHDN Pin Voltage
VOUT Pin Voltage
GATE Pin Voltage
Fig.4 Shutdown sequence
[Turn-Off sequence: Fig.5]
On the A type, when “L” voltage is input into the SW pin for the duration tOFFD with VOUT fixed at “H” voltage, VOUT shuts down.
After shutdown, returning the SW pin to “H” voltage reduces the supply current to the standby current while holding the IC’s
logic. The B type does not have this function.
tOFFD
SW Pin Voltage
VOUT Pin Voltage
GATE Pin Voltage
Fig.5 Turn-Off sequence
12/28
XC6193
Series
■OPERATIONAL EXPLANATION (Continued)
[Operation after Turn-On: Fig.6]
On the A type, when “L” voltage is input into the SW pin for the duration tOND and VOUT is fixed at “H” voltage, and then “L”
voltage is input into the SW pin for the duration tOFFD, the Turn-Off sequence cannot be initiated.
To initiate the Turn-Off sequence, “H” voltage must be input into the SW pin, and then “L” voltage must again be input for the
duration tOFFD
.
The B type does not have a Turn-Off sequence by SW pin.
tOFFD
tOND
tOFFD
SW Pin Voltage
VOUT Pin Voltage
GATE Pin Voltage
Fig.6 Operation after Turn-On
[Operation after Turn-Off: Fig.7]
On the A type, when “L” voltage is input into the SW pin for the duration tOFFD and VOUT is shut down, and then “L” voltage is
input into the SW pin for the duration tOND, the Turn-On sequence cannot be initiated.
To initiate the Turn-On sequence, “H” voltage must be input into the SW pin, and then “L” voltage must again be input for the
duration tOND
.
The B type does not have a Turn-Off sequence by SW pin.
tOND
tOFFD
tOND
SW Pin Voltage
VOUT Pin Voltage
GATE Pin Voltage
Fig.7 Operation after Turn-Off
XC6193 Series
■OPERATIONAL EXPLANATION (Continued)
[Operation after shutdown: Fig.8]
In the XC6193 series, in order to initiate the Turn-On sequence after “H” voltage is input into the SHDN pin and VOUT is shut
down, “H” voltage must be input into the SW pin and then “L” voltage must again be input for the duration tOND
.
tOND
tOND
SHDN pin Voltage
SW Pin Voltage
VOUT Pin Voltage
GATE Pin Voltage
Fig.8 Operation after shutdown
14/28
XC6193
Series
■OPERATIONAL EXPLANATION (Continued)
[Thermal shutdown function: Fig.9]
The XC6193 series are equipped with thermal shutdown functions.
If a load current causes the VOUT pin voltage to drop by roughly 50mV (TYP.) compared to the VIN pin voltage, the overheat
protection circuit will be activated and begin monitoring the IC heat generation.
If the IC temperature is equal to or greater than the Thermal Shutdown Detect Temperature (TTSDD : refer to Electrical
Characteristics), the function will turn PM1 OFF and stop the supply of load current.
Also, if the discontinuation of the load current supply causes the IC temperature is equal to or less than the Thermal Shutdown
Release Temperature (TTSDR: refer to Electrical Characteristics), the IC operation will automatically be restored. The inrush current
limit soft start function also operates during automatic restoration.
However, if the VOUT pin voltage is equal to or less than the Short Circuit Detect Voltage (VSHORT: refer to Electrical Characteristics)
before the IC temperature is equal to or less than TTSDR, the IC will shut down.
Then, by performing turn-on sequence (refer to Fig.3: Turn-On Sequence), VOUT is turned on again.
Temperature
Thermal ShutDown
monitoring area
operation
Normal operation
Normal operation
GATE Pin Voltage
VOUT Pin Voltage
Vout Voltage Detect
TSD Detect Temperature
TSD Release Temperature
Tj
Output Current
Fig.9 Thermal shutdown function
XC6193 Series
■OPERATIONAL EXPLANATION (Continued)
[Inrush current limit and output short circuit protection: Fig.10]
The XC6193 series are equipped with the inrush current limiting soft-start function and the function of shutting down the output
when output short circuit is detected.
After the Turn-On sequence (refer to Fig.3: Turn-On Sequence), if the VOUT pin voltage is equal to or less than the Short Circuit
Detect Voltage (VSHORT: refer to Electrical Characteristics) for a duration equal to or longer than the Short Circuit Detect Delay
Time (TSHORT: refer to Electrical Characteristics), it will be identified as output short. And the PM1 is latched off-state, causes VOUT
to shut down.
The relation between the output current (ISHORT) and VSHORT when output short is given by the equation below.
ISHORT = (VIN - VSHORT) / RON (A)
* RON_min is interlocked with VSHORT_max, and RON_max is interlocked with RON_min
* It is limited to the case of using IC alone.
During the Turn-On sequence, if the VOUT pin voltage is equal to or less than the VSHORT voltage, the output short-circuit protection
function will not operate.
Once the VOUT pin voltage is greater than the VSHORT voltage, the output short-circuit protection function will begin to operate.
The equation for the maximum output current is as follows.
IOUT (Min.) = (VIN - VSHORT_max) / RON_min (A)
* It is limited to the case of using IC alone.
Short Circuit
operation
Inrush Current
Limit operation
Normal
operation
TOND
SW Pin Voltage
VOUT Pin Voltage
GATE Pin Voltage
TSHORT
Short Circuit Detect Voltage
Inrush Current
(CL Charge Current)
Short Current
Output Current
Fig.10 Inrush current limit and short circuit protection
16/28
XC6193
Series
■OPERATIONAL EXPLANATION (Continued)
[SW pin]
When “L” voltage is input into the SW pin for the duration tOND with the IC in the standby state, the pin fixes VOUT at “H” voltage.
On the A type, when VOUT is fixed at “H” voltage, “L” voltage can be input for the duration tOFFD to shut down VOUT
.
[SHDN pin]
This pin shuts down VOUT when one pulse of “H” voltage (100μs or more as a guideline) is input into the SHDN pin with VOUT fixed at “H” voltage.
[GATE pin]
GATE pin are connected with NM1 and R2(Fig.1).
Since NM1 is the N-ch MOSFET and it is synchronized with the GATE signal of PM1, if PM1 turns ON at the GATE pin, NM1 will turn ON, and if
PM1 turns OFF, NM1 will turn OFF.
[VOUT pin]
VOUT pin is connected with PM1, R1 (Fig.1) and CL discharge transistor NM2 (Fig.1).
PM1 is a Pch MOSFET and functions as the main driver.
NM2 is an Nch MOSFET, and is synchronized with the GATE signal of PM1. Therefore, when PM1 turns ON, NM2 turns OFF.
[SW Circuit]
This circuit transmits the signal input into the SW pin to the internal circuitry.
[SHDN Circuit]
This circuit transmits the signal input into the SHDN pin to the internal circuitry.
[VREF & POR]
This circuit supplies the internal circuit with reference voltage as well as a reset signal to the logic circuitry.
[Type Select]
This circuit selects the product type.
[Turn-On Delay Counter]
This circuit count-controls the time until VOUT is fixed at “H” voltage after “L” voltage is input into the SW pin.
During the time until the count is completed, the counter circuit can be returned to the initial state by inputting “H” voltage into the SW pin.
[Turn-Off Delay Counter]
This circuit only operates on the A type.
When VOUT is fixed at “H” voltage, this circuit count-controls the time from input of “L” voltage into the SW pin until VOUT shuts down.
During the time until the count is completed, the counter circuit can be returned to the initial state by inputting “H” voltage into the SW pin.
[UVLO]
It is Under Voltage Lock Out circuit. VOUT will shut down if the input voltage is less than VUVLO
.
[IREF]
It is internal circuit reference current source.
[Soft Start (Inrush Current Limit)]
A circuit which slowly switches the PM1 gate voltage from Voltage “High” to Voltage “Low”, and limits the inrush current.
[Short Circuit Protect]
This circuit outputs a signal to shut down if the VOUT pin voltage reaches VSHORT
.
Also, this function will stop until VOUT turns ON and reaches VSHORT. Until then, only the Thermal Shutdown circuit will operate as a protection
function.
[Thermal Shutdown]
If a load current causes the VOUT pin voltage to drop by roughly 50mV (TYP.) compared to the VIN pin voltage, this function will begin monitoring
the IC heat generation. If the IC temperature is equal to or greater than TTSDD, it will turn off the PM1 and stop the supply of load current.
XC6193 Series
■NOTES ON USE
1) For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
2) Please use this IC within the specified operating ranges.
3) In some cases, power supply noise may cause malfunctioning of the internal counter circuit. Sufficiently reinforce the VIN,
VOUT, and GND lines, and connect 0.1μF or higher capacitors near the IC between VIN and GND (VSS), and between VOUT
and GND (VSS).
4) When using the capacitor larger than 100μF for CL, it is possible that Inrush Current becomes large. Please sufficiently test
actual operation before use.
5) When “L” level is input into the SW pin, Operation Current flows. Sufficiently test actual operation before designing peripheral
circuits.
6) The SW pin and SHDN pin are connected to the gate of a CMOS inverter. If a voltage lower than the VIN pin voltage or
a voltage higher than the VSS pin voltage is input into each pin, the flow-through current of the CMOS inverter may appear as
supply current.
7) If an intermediate voltage between “L” voltage and “H” voltage is input into the SW pin or SHDN pin,
starting and stopping of the IC may become unstable. Sufficiently test peripheral components and other
parts to ensure that an intermediate voltage between “L” voltage and “H” voltage is not continuously input
for an excessive time into the SW pin and the SHDN pin.
8) Since electromagnetic wave may cause unexpected malfunction, please reinforce the shielding of the equipment and connect
a filter to each terminal as necessary and fully check with actual equipment before using.
9) The TEST pin must be connected to GND (VSS).
10) When transiently varying the input voltage, please make sure to set the slew rate under 1V/us.
11) When using for an application other than a push-button application, please design the timing to include
deviations and test sufficiently with the actual device before use.
12) Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using
Torex products in their systems.
18/28
XC6193
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Standby Current vs. Input Voltage
(2) Standby Current vs. Ambient Temperature
XC6193 Series
XC6193 Series
Turn-Off State,VSW=VIN
CIN=0.1μF,CL=0.1μF
Turn-Off State,VSW=VIN
CIN=0.1μF,CL=0.1μF
1.00
0.80
0.60
0.40
0.20
0.00
1.00
0.80
0.60
0.40
0.20
0.00
Ta=-40℃
Ta=25℃
Ta=85℃
-50
-25
0
25
50
75
100
125
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Ambient Temperature : Ta[℃]
Input Voltage : VIN[V]
(4) Quiescent Current vs. Ambient Temperature
(3) Quiescent Current vs. Input Voltage
XC6193 Series
XC6193 Series
Turn-On State,VSW=VIN
CIN=0.1μF,CL=0.1μF
Turn-On State,VSW=VIN
CIN=0.1μF,CL=0.1μF
1.00
0.80
0.60
0.40
0.20
0.00
1.00
0.80
0.60
0.40
0.20
0.00
Ta=-40℃
Ta=25℃
Ta=85℃
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
-50
-25
0
25
50
75
100
125
Input Voltage : VIN[V]
Ambient Temperature : Ta[℃]
(5) Operation Current vs. Input Voltage
XC6193 Series
(6) Operation Current vs. Ambient Temperature
XC6193 Series
Turn-Off State,VSW=0V
CIN=0.1μF,CL=0.1μF
Turn-Off State,VSW=0V
CIN=0.1μF,CL=0.1μF
70.00
60.00
50.00
40.00
30.00
20.00
70.00
60.00
50.00
40.00
30.00
20.00
Ta=-40℃
Ta=25℃
Ta=85℃
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
-50
-25
0
25
50
75
100
125
Input Voltage : VIN[V]
Ambient Temperature : Ta[℃]
XC6193 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) Turn-On Delay Time vs. Ambient Temperature
XC6193xAxx
XC6193x1xx
VIN=3.0V,VSW=VIN->0V
CIN=0.1μF,CL=0.1μF
VIN=3.0V,VSW=VIN->0V
CIN=0.1μF,CL=0.1μF
0.24
0.22
0.20
0.18
0.16
1.20
1.10
1.00
0.90
0.80
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
XC6193x3xx
XC6193x5xx
VIN=3.0V,VSW=VIN->0V
VIN=3.0V,VSW=VIN->0V
CIN=0.1μF,CL=0.1μF
CIN=0.1μF,CL=0.1μF
3.60
3.30
3.00
2.70
2.40
6.00
5.50
5.00
4.50
4.00
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
20/28
XC6193
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Turn-Off Delay Time vs. Ambient Temperature
XC6193Ax03
XC6193Ax05
VIN=3.0V,VSW=VIN->0V
CIN=0.1μF,CL=0.1μF
VIN=3.0V,VSW=VIN->0V
CIN=0.1μF,CL=0.1μF
3.60
3.30
3.00
2.70
2.40
6.00
5.50
5.00
4.50
4.00
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
XC6193Ax10
XC6193Ax15
VIN=3.0V,VSW=VIN->0V
VIN=3.0V,VSW=VIN->0V
CIN=0.1μF,CL=0.1μF
CIN=0.1μF,CL=0.1μF
12.00
11.00
10.00
9.00
18.00
16.50
15.00
13.50
12.00
8.00
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
XC6193 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) Main driver On Resistor vs. Ambient Temperature
XC6193 Series
XC6193 Series
Turn-On State,VIN=1.8V
CIN=0.1μF,CL=0.1μF
Turn-On State,VIN=2.0V
CIN=0.1μF,CL=0.1μF
0.30
0.25
0.20
0.15
0.10
0.30
0.25
0.20
0.15
0.10
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
XC6193 Series
XC6193 Series
Turn-On State,VIN=3.0V
Turn-On State,VIN=6.0V
CIN=0.1μF,CL=0.1μF
CIN=0.1μF,CL=0.1μF
0.25
0.20
0.15
0.10
0.05
0.20
0.15
0.10
0.05
0.00
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
22/28
XC6193
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(10) SW pin "H" "L" Voltage vs. Ambient Temperature
XC6193 Series
XC6193 Series
VIN=1.8V
VIN=3.0V
CIN=0.1μF,CL=0.1μF
CIN=0.1μF,CL=0.1μF
0.90
0.80
0.70
0.60
0.50
0.40
0.90
0.80
0.70
0.60
0.50
0.40
VSW "H" Voltage
VSW "L" Voltage
VSW "H" Voltage
VSW "L" Voltage
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
XC6193 Series
VIN=6.0V
CIN=0.1μF,CL=0.1μF
0.90
0.80
0.70
0.60
0.50
0.40
VSW "H" Voltage
VSW "L" Voltage
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
XC6193 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(11) SHDN pin "H" "L" Voltage vs. Ambient Temperature
XC6193 Series
XC6193 Series
VIN=1.8V
VIN=3.0V
CIN=0.1μF,CL=0.1μF
CIN=0.1μF,CL=0.1μF
0.90
0.80
0.70
0.60
0.50
0.40
0.90
0.80
0.70
0.60
0.50
0.40
VSHDN "H" Voltage
VSHDN "L" Voltage
VSHDN "H" Voltage
VSHDN "L" Voltage
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
(12) GATE pin Resistance vs. Ambient Temperature
XC6193 Series
XC6193 Series
VIN=6.0V
Turn-On State,VGATE=0.3V
CIN=0.1μF,CL=0.1μF
CIN=0.1μF,CL=0.1μF
0.90
0.80
0.70
0.60
0.50
0.40
200
VSHDN "H" Voltage
VSHDN "L" Voltage
VIN=1.8V
VIN=6.0V
180
160
140
120
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
(13) CL Discharge Current vs. Ambient Temperature
XC6193 Series
Turn-Off State,VOUT=0.3V
CIN=0.1μF,CL=0.1μF
2.20
2.10
2.00
1.90
1.80
1.70
1.60
1.50
-50
-25
0
25
50
75
100
125
Ambient Temperature : Ta[℃]
24/28
XC6193
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(14) Inrush Current caused by load capacitance
XC6193 Series
VIN=6.0V
SW=6.0V→0V
↓CL = 47uF
↓CL = 22uF
↓CL = 10uF
Inrush Current
100mA/ div
↑CL = 1uF
VOUT
2.0V / div
Time
400 μsec / div
XC6193 Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
USP-8B06
OUTLINE / LAND PATTERN
USP-8B06 PKG
THERMAL CHARACTERISTICS
High heat
dissipation Board
USP-8B06 Power Dissipation
JESD51-7 Board
26/28
XC6193
Series
■MARKING RULE
●USP-8B06
1
8
7
6
5
2
3
4
①
represents product series.
MARK
3
PRODUCT SERIE
XC6193******-G
② represents Type and Turn-On delay time
MARK
Type
Turn-On delay time
PRODUCT SERIE
XC6193AA****-G
XC6193A1****-G
XC6193A3****-G
XC6193A5****-G
XC6193BA****-G
XC6193B1****-G
XC6193B3****-G
XC6193B5****-G
0
1
2
3
4
5
6
7
0.2s.
1s.
Turn-on: By the SW pin
Shut-down: By the SW pin
or the SHDN pin
3s.
5s.
0.2s.
1s.
Turn-on: By the SW pin
Shut-down: By the SHDN
pin
3s.
5s.
③ represents Turn-Off delay time.
MARK
Turn-Off delay time
PRODUCT SERIE
XC6193**03**-G
XC6193**05**-G
XC6193**10**-G
XC6193**15**-G
XC6193B*NN**-G
A
B
C
D
0
3s.
5s.
10s.
15s.
-
④,⑤ represents production lot number
01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ, B1~ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
XC6193 Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or
equipment used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile
industry and other transportation industry and 5) safety devices and safety equipment to control
combustions and explosions. Do not use the product for the above use unless agreed by us in
writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent
personal injury and/or property damage resulting from such failure, customers are required to
incorporate adequate safety measures in their designs, such as system fail safes, redundancy and
fire prevention features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
28/28
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