XC61FN1642PR [TOREX]
Voltage Detectors, Delay Circuit Built-In; 电压检测器,延时电路内置型号: | XC61FN1642PR |
厂家: | Torex Semiconductor |
描述: | Voltage Detectors, Delay Circuit Built-In |
文件: | 总12页 (文件大小:741K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XC61FSeries
ETR0202_001
Voltage Detectors, Delay Circuit Built-In
■GENERAL DESCRIPTION
The XC61F series are highly accurate, low power consumption voltage detectors, manufactured using CMOS and laser
trimming technologies. A delay circuit is built-in to each detector.
Detect voltage is extremely accurate with minimal temperature drift.
Both CMOS and N-channel open drain output configurations are available.
Since the delay circuit is built-in, peripherals are unnecessary and high density mounting is possible.
■APPLICATIONS
■FEATURES
Highly Accurate
Low Power Consumption : 1.0μA(TYP.)[ VIN=2.0V ]
Detect Voltage Range 1.6V ~ 6.0V in 100mV increments
: ± 2%
●Microprocessor reset circuitry
●Memory battery back-up circuits
●Power-on reset circuits
:
Operating Voltage Range : 0.7V ~ 10.0V
Detect Voltage Temperature Characteristics
:±100ppm/℃(TYP.)
●Power failure detection
●System battery life and charge voltage monitors
●Delay circuitry
Built-In Delay Circuit
: ① 1ms ~ 50ms
② 50ms ~ 200ms
③ 80ms ~ 400ms
Output Configuration
CMOS
: N-channel open drain or CMOS
Mini Mold Package
Ultra Small Packages
:
SOT-23 (150mW) mini-mold
: SOT-89 (500mW) mini-power mold
: TO-92 (300mW)
* No parts are available with an accuracy of ± 1%
■TYPICAL PERFORMANCE
■TYPICAL APPLICATION CIRCUITS
CHARACTERISTICS
Ambient Temperature:Ta(℃)
1/12
XC61F Series
■PIN CONFIGURATION
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTION
SOT-23
SOT-89
TO-92 (T) TO-92 (L)
3
2
1
2
3
1
2
3
1
1
2
3
VIN
VSS
Supply Voltage Input
Ground
VOUT
Output
■PRODUCT CLASSIFICATION
●Ordering Information
XC61F ①②③④⑤⑥⑦
DESIGNATOR
DESCRIPTION
SYMBOL
DESCRIPTION
C
N
: CMOS output
①
Output Configuration
: N-ch open drain output
: e.g. 2.5V → ②2 , ③5
: e.g. 3.8V → ②3, ③8
: 50ms ~ 200ms
② ③
Detect Voltage
16 ~ 60
1
4
④
⑤
Output Delay
: 80ms ~ 400ms
5
: 1ms ~ 50ms
Detect Accuracy
2
: Within ±2.0%
M
P
T
L
: SOT-23
: SOT-89
⑥
⑦
Package
: TO-92 (Standard)
: TO-92 (Custom pin configuration)
: Embossed tape, standard feed
: Embossed tape, reverse feed
: Paper type (TO-92)
: Bag (TO-92)
R
L
Device Orientation
H
B
2/12
XC61F
Series
■BLOCK DIAGRAMS
(1) CMOS output
(2) N-channel open drain output
■
Ta = 25℃
UNITS
V
PARAMETER
Input Voltage
SYMBOL
VIN
RATINGS
12.0
Output Current
IOUT
50
VSS -0.3 ~ VIN + 0.3
VSS -0.3 ~ 9
150
mA
V
CMOS
Output Voltage
VOUT
N-ch open drain
SOT-23
Power Dissipation
Pd
mW
SOT-89
500
TO-92
300
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
-30~+85
-40~+125
℃
℃
■ELECTRICAL CHARACTERISTICS
Ta=25℃
PARAMETER
Detect Voltage
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
VDF(T)
VDF(T)
VDF(T)
VDF
V
V
x 0.98
x 1.02
VDF
VDF
x 0.05
0.9
VDF
Hysteresis Range
VHYS
x 0.02
x 0.08
VIN = 1.5V
VIN = 2.0V
VIN = 3.0V
VIN = 4.0V
VIN = 5.0V
-
2.6
-
1.0
3.0
Supply Current
ISS
VIN
μA
-
1.3
3.4
-
1.6
3.8
-
2.0
4.2
Operating Voltage
VDF= 1.6V to 6.0V
0.7
-
10.0
V
VIN = 1.0V
VIN = 2.0V
VIN = 3.0V
VIN = 4.0V
VIN = 5.0V
-
-
-
-
-
-
2.2
-
-
-
-
-
-
7.7
N-ch VDF =0.5V
10.1
11.5
13.0
-10.0
Output Current
IOUT
mA
CMOS, P-ch VDF=2.1V
VIN = 8.0V
Detect Voltage
Temperature
ΔVDF
ΔTopr・
VDF
-
±100
-
ppm/℃
Characteristics
Transient Delay Time
(VDR → VOUT inversion)
TDLY*
VIN changes from 0.6V to 10V
50
-
200
ms
VDF (T): Setting detect voltage value
Release Voltage: VDR = VDF + VHYS
* Transient Delay Time: 1ms to 50ms & 80ms to 400ms versions are also available.
Note: The power consumption during power-start to output being stable (release operation) is 2μA greater than it is after that period
(completion of release operation) because of delay circuit through current.
3/12
XC61F Series
■OPERATIONAL EXPLANATION
●CMOS output
①
When a voltage higher than the release voltage (VDR) is applied to the voltage input pin (VIN), the voltage will
gradually fall. When a voltage higher than the detect voltage (VDF) is applied to VIN, output (VOUT) will be equal to the
input at VIN.
Note that high impedance exists at VOUT with the N-channel open drain configuration. If the pin is pulled up, VOUT will
be equal to the pull up voltage.
②
③
④
When VIN falls below VDF, VOUT will be equal to the ground voltage (VSS) level (detect state). Note that this also
applies to N-channel open drain configurations.
When VIN falls to a level below that of the minimum operating voltage (VMIN ) output will become unstable. Because
the output pin is generally pulled up with N-channel open drain configurations, output will be equal to pull up voltage.
When VIN rises above the VSS level (excepting levels lower than minimum operating voltage), VOUT will be equal to
VSS until VIN reaches the VDR level.
⑤
⑥
Although VIN will rise to a level higher than VDR, VOUT maintains ground voltage level via the delay circuit.
Following transient delay time, VIN will be output at VOUT. Note that high impedance exists with the N-channel open
drain configuration and that voltage will be dependent on pull up.
Notes:
1. The difference between VDR and VDF represents the hysteresis range.
2. Propagation delay time (tDLY) represents the time it takes for VIN to appear at VOUT once the said voltage has
exceeded the VDR level.
●Timing Chart
4/12
XC61F
Series
■DIRECTIONS FOR USE
●Notes on Use
1. Please use this IC within the stated maximum ratings. The IC is liable to malfunction should the ratings be exceeded.
2. When a resistor is connected between the VIN pin and the input with CMOS output configurations, oscillation may
occur as a result of voltage drops at RIN if load current (IOUT) exists. It is therefore recommend that no resistor be added.
(refer to Oscillation Description (1) below)
3. When a resistor is connected between the VIN pin and the input with CMOS output configurations, irrespective of N-ch
output configurations, oscillation may occur as a result of through current at the time of voltage release even if load
current (IOUT) does not exist. (refer to Oscillation Description (2) below)
4. With a resistor connected between the VIN pin and the input, detect and release voltage will rise as a result of the IC's
supply current flowing through the VIN pin.
5. If a resistor (RIN) must be used, then please use with as small a level of input impedance as possible in order to control
the occurrences of oscillation as described above.
Further, please ensure that RIN is less than 10kΩ and that CIN is more than 0.1μF (Figure 1). In such cases, detect
and release voltages will rise due to voltage drops at RIN brought about by the IC's supply current.
●Oscillation Description
(1) Oscillation as a result of output current with the CMOS output configuration:
When the voltage applied at IN rises, release operations commence and the detector's output voltage increases. Load
current (IOUT) will flow through RL. Because a voltage drop (RIN x IOUT) is produced at the RIN resistor, located
between the input (IN) and the VIN pin, the load current will flow via the IC's VIN pin. The voltage drop will also lead to
a fall in the voltage level at the VIN pin. When the VIN pin voltage level falls below the detect voltage level, detect
operations will commence. Following detect operations, load current flow will cease and since voltage drop at RIN will
disappear, the voltage level at the VIN pin will rise and release operations will begin over again.
Oscillation may occur with this " release - detect - release " repetition.
Further, this condition will also appear via means of a similar mechanism during detect operations.
(2) Oscillation as a result of through current:
Since the XC61F series are CMOS ICS, through current will flow when the IC's internal circuit switching operates
(during release and detect operations). Consequently, oscillation is liable to occur during release voltage operations
as a result of output current which is influenced by this through current (Figure 3).
Since hysteresis exists during detect operations, oscillation is unlikely to occur.
Figure 1. When using an input resistor
5/12
XC61F Series
■DIRECTIONS FOR USE (Continued)
●Oscillation Description (Continued)
6/12
XC61F
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
7/12
XC61F Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
8/12
XC61F
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
9/12
XC61F Series
■PACKAGING INFORMATION
●SOT-23
●SOT-89
●TO-92
10/12
XC61F
Series
■MARKING RULE
●SOT-23, SOT-89
①Represents integer of detect voltage and output configuration
CMOS output (XC61FC series)
3
MARK
CONFIGURATION
CMOS
VOLTAGE (V)
A
B
C
D
E
F
0.x
1.x
2.x
3.x
4.x
5.x
6.x
CMOS
①
1
②
③
④
2
CMOS
CMOS
CMOS
CMOS
H
CMOS
N-channel open drain (XC61FN series)
MARK
CONFIGURATION
VOLTAGE (V)
K
L
N-ch
N-ch
N-ch
N-ch
N-ch
N-ch
N-ch
0.x
1.x
2.x
3.x
4.x
5.x
6.x
M
N
P
R
S
1
2
3
②Represents decimal number of detect voltage
MARK
VOLTAGE (V)
MARK
VOLTAGE (V)
0
1
2
3
4
x.0
x.1
x.2
x.3
x.4
5
6
7
8
9
x.5
x.6
x.7
x.8
x.9
③Represents delay time
VOLTAGE (V)
DELAY TIME
5
6
7
50 ~ 200ms
80 ~ 400ms
1 ~ 50ms
④Represents assembly lot number (Based on internal standards)
●TO-92
①Represents output configuration
MARK
OUTPUT CONFIGURATION
C
N
CMOS
N-ch
②, ③Represents detect voltage
MARK
VOLTAGE (V)
②
3
5
③
3
0
3.3
5.0
④Represents delay time
MARK
DELAY TIME
1
4
5
50ms ~ 200ms
80ms ~ 400ms
1ms ~ 50ms
⑤Represents detect voltage accuracy
MARK
2
DETECT VOLTAGE ACCURACY
Within +2%
⑥Represents a least significant digit of the production year (ex.)
MARK
PRODUCTION YEAR
3
4
2003
2004
⑦Represents production lot number
0 to 9, A to Z repeated (G, I, J, O, Q, W expected)
11/12
XC61F Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this catalog is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this catalog.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this catalog.
4. The products in this catalog are not developed, designed, or approved for use with such
equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this catalog within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this catalog may be copied or reproduced without the
prior permission of Torex Semiconductor Ltd.
12/12
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