XC61JN1202MR-G [TOREX]

Power Supply Support Circuit,;
XC61JN1202MR-G
型号: XC61JN1202MR-G
厂家: Torex Semiconductor    Torex Semiconductor
描述:

Power Supply Support Circuit,

文件: 总15页 (文件大小:590K)
中文:  中文翻译
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XC61JSeries  
ETR02033-002  
Highly Accurate, Ultra Small, Low Power Consumption Voltage Detector  
GENERAL DESCRIPTION  
The XC61J series is highly precise, low power consumption voltage detectors, manufactured using CMOS and laser trimming  
technologies. With low power consumption and high accuracy, the series is suitable for precision mobile equipment.  
The XC61J in ultra small package is ideally suited for high-density mounting. The XC61J is available in both CMOS and N-  
channel open drain output configurations.  
APPLICATIONS  
Microprocessor reset circuitry  
Memory battery back-up circuits  
Power-on reset circuits  
FEATURES  
Highly Accurate  
: ± 2% (VDF1.5V)  
± 30mV (VDF<1.5V)  
: 0.6μA [VDF=2.7V, VIN=2.97V]  
: 1.0V ~ 5.0V (0.1V increments)  
Low Power Consumption  
Detect Voltage Range  
Operating Voltage Range Detect Voltage: 0.7V ~ 6.0V  
Temperature Characteristics  
Output Configuration  
Power failure detection  
: ±100ppm/(TYP.)  
: CMOS (XC61JC)  
N-channel open drain (XC61JN)  
System battery life and charge voltage monitors  
Operating Temperature Range : -40~+85℃  
Package  
: SOT-25  
Environmentally Friendly  
: EU RoHS Compliant, Pb Free  
TYPICAL PERFORMANCE  
TYPICAL APPLICATION CIRCUIT  
CHARACTERISTICS  
Supply Current vs. Input Voltage  
XC61Jx2702  
Vpull-up  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
V
IN  
Ta= 85℃  
25℃  
Rpull-up  
(Unused for the CMOS  
output products)  
-40℃  
VIN  
V
OUT  
VOUT  
VSS  
0
1
2
3
4
5
6
Input Voltage: VIN (V)  
1/15  
XC61J Series  
BLOCK DIAGRAMS  
(1) XC61JC  
(2) XC61JN  
VIN  
VIN  
M
2
R
1
R
R
1
Comparator  
Comparator  
VOUT  
VOUT  
Vref  
Vref  
R2  
2
M
1
M
1
VSS  
VSS  
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.  
2/15  
XC61J  
Series  
PRODUCT CLASSIFICATION  
Ordering Information  
(
)
*1  
XC61J①②③④⑤⑥⑦-⑧  
DESIGNATOR  
ITEM  
SYMBOL  
DESCRIPTION  
C
N
CMOS output  
②③  
④⑤  
Output Configuration  
Detect Voltage  
N-ch open drain output  
e.g. 1.0V → ②=1, =0  
±2% (1.5VVDF5.0V)  
±30mV (1.0VVDF1.5V)  
10~50  
Detect Accuracy  
02  
SOT-25(3,000pcs/Reel) (*3)  
Standard feed  
MR-G  
ML-G  
Package (Order Unit)  
Taping Specification(*2)  
⑥⑦-⑧  
SOT-25(3,000pcs/Reel) (*3)  
Reverse feed  
(*1)  
(*2)  
(*3)  
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.  
Refer to the Taping Specification.  
SOT-25 uses Cu wires.  
Taping Specification  
MR-G  
ML-G  
direction of feed  
direction of feed  
3/15  
XC61J Series  
PIN CONFIGURATION  
VSS  
5
VOUT  
4
1
2
3
VIN  
NC  
NC  
SOT-25  
(TOP VIEW)  
PIN ASSIGNMENT  
PIN NUMBER  
PIN NAME  
SOT-25  
FUNCTION  
1
2
3
4
5
NC  
VIN  
No Connection  
Power Input  
NC  
No Connection  
Signal Output (Active Low)  
Ground  
VOUT  
VSS  
4/15  
XC61J  
Series  
Ta=25  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
Input Voltage  
Output Current  
SYMBOL  
RATING  
-0.3~+7.0  
10  
UNITS  
V
VIN  
IOUT  
mA  
*
*
XC61JC ( 1)  
-0.3~VIN+0.3 or +7.0 ( 3)  
Output Voltage  
Power Dissipation  
VOUT  
Pd  
V
*
XC61JN ( 2)  
-0.3~+7.0  
250  
600 (40mm x 40mm Standard board )(*4)  
-40~+85  
SOT-25  
mW  
Operating Temperature Range  
Storage Temperature Range  
Topr  
Tstg  
-55~+125  
*
( 1) CMOS Output  
*
( 2) N-ch Open Drain Output  
*
( 3) The maximum value should be either VIN+0.3 or +7.0 in the lowest  
(*4) The power dissipation figure shown is PCB mounted and is for reference only.  
The mounting condition is please refer to PACKAGING INFORMATION.  
5/15  
XC61J Series  
ELECTRICAL CHARACTERISTICS  
XC61J Series  
Ta=25℃  
PARAMETER  
SYMBOL  
VIN  
CONDITION  
MIN.  
0.7  
TYP.  
-
MAX.  
6.0  
UNITS CIRCUIT  
Operating Voltage  
VDF(T)=1.05.0V (*1)  
V
V
-
Detect Voltage  
VDF  
VDF(T)=1.0V5.0V  
VDF(T)=1.0V5.0V  
E-1  
VDF  
×0.03  
VDF  
×0.05  
VDF  
×0.07  
Hysteresis Width  
VHYS  
V
Quiescent Current 1  
Quiescent Current 2  
ISS1  
ISS2  
VIN=VDF(T)×1.1  
VIN= VDF(T)×0.9  
E-2  
E-3  
μA  
μA  
VOUT=0.5V  
VOUT=0.3V  
VOUT=0.1V  
0.09  
0.08  
0.05  
0.57  
0.56  
0.30  
-
-
-
VIN=0.7  
V
VIN=1.0  
VOUT=0.1V, VDF(T)1.0V  
VOUT=0.1V, VDF(T)2.0V  
VOUT=0.1V, VDF(T)3.0V  
VOUT=0.1V, VDF(T)4.0V  
VOUT=5.5V  
0.46  
1.15  
1.44  
1.61  
0.71  
1.41  
1.77  
1.96  
-
-
-
-
V
VIN=2.0  
V
IOUTN  
mA  
Output Current  
VIN=3.0  
V
VIN=4.0  
V
VIN=6.0  
V
(*2)  
IOUTP  
-
-
-
-0.95  
-0.001  
0.001  
-0.60  
-
mA  
CMOS Outpu  
N-ch Open  
Drain Output  
t
ILEAK  
VIN=VDF×0.9V, VOUT=0V  
Leakage  
Current  
μA  
VIN=6.0V, VOUT=6.0V  
0.10  
Temperature  
Characteristics  
ΔVDF/  
(ΔToprVDF)  
-40 oCTopr85 oC  
-
-
-
±100  
30  
-
ppm/oC  
μs  
VIN=6.0V0.7V  
VIN=VDF to VOUT=0.5V  
VIN=0.7V6.0V  
Detect Delay Time (*3)  
tDF  
100  
100  
Release Delay Time (*5)  
tDR  
20  
μs  
(*4)  
VIN=VDR to VOUT=VDR  
*1: VDF (T): Nominal detect voltage  
*2: For XC61JC only.  
*3: A time taking from the time at VIN = VDF to the time at VOUT=0.5V when VIN falls from 6.0V to 0.7V.  
*4: VDR: Release voltage (VDR = VDF + VHYS  
)
*5: A time taking from the time at VIN = VDR to the time at VOUT = VDR when VIN rise from 0.7V to 6.0V.  
XC61JN recommended pull-up resistance  
Input Voltage Range  
Pull-up Resistance  
0.7V~6.0V  
0.8V~6.0V  
1.0V~6.0V  
220kΩ  
100kΩ  
33kΩ  
6/15  
XC61J  
Series  
ELECTRICAL CHARACTERISTICS (Continued)  
DETECT VOLTAGE ACCURACY AND QUIESCENT CURRENT SPECIFICATIONS  
SYMBOL  
E-1  
E-2  
E-3  
DETECT VOLTAGE  
(V)  
QUIESCENT CURRENT1  
QUIESCENT CURRENT2  
NOMINAL DETECT  
VOLTAGE  
(μA)  
(μA)  
VDF  
ISS1  
ISS2  
VDF(T)  
1.0  
1.1  
1.2  
1.3  
1.4  
1.5  
1.6  
1.7  
1.8  
1.9  
2.0  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
3.7  
3.8  
3.9  
4.0  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
5.0  
MIN.  
MAX.  
1.030  
1.130  
1.230  
1.330  
1.430  
1.530  
1.632  
1.734  
1.836  
1.938  
2.040  
2.142  
2.244  
2.346  
2.448  
2.550  
2.652  
2.754  
2.856  
2.958  
3.060  
3.162  
3.264  
3.366  
3.468  
3.570  
3.672  
3.774  
3.876  
3.978  
4.080  
4.182  
4.284  
4.386  
4.488  
4.590  
4.692  
4.794  
4.896  
4.998  
5.100  
TYP.  
MAX.  
TYP.  
MAX.  
1.35  
0.970  
1.070  
1.170  
1.270  
1.370  
1.470  
1.568  
1.666  
1.764  
1.862  
1.960  
2.058  
2.156  
2.254  
2.352  
2.450  
2.548  
2.646  
2.744  
2.842  
2.940  
3.038  
3.136  
3.234  
3.332  
3.430  
3.528  
3.626  
3.724  
3.822  
3.920  
4.018  
4.116  
4.214  
4.312  
4.410  
4.508  
4.606  
4.704  
4.802  
4.900  
0.5  
1.4  
0.4  
0.6  
1.7  
0.5  
1.60  
0.7  
1.9  
0.6  
1.80  
7/15  
XC61J Series  
TEST CIRCUITS  
Circuit ①  
RPULL=100kΩ  
VIN  
(Unused for the CMOS output products)  
VIN  
V
VOUT  
V
VSS  
Circuit ②  
Circuit ③  
Circuit ④  
RPULL=100kΩ  
V
IN  
(Unused for the CMOS output products)  
V
OUT  
Measurement of waveform  
V
SS  
8/15  
XC61J  
Series  
OPERATIONAL EXPLANATION  
Typical Application Circuit  
RPULL  
VIN  
(Unused for the CMOS output products)  
VIN  
VOUT  
V
OUT  
V
SS  
Timing Chart  
Release Voltage (VDR  
)
Detect Voltage (VDF  
)
Input Voltage  
(VIN)  
Minimum Operating Voltage (VMIN  
)
Ground Voltage (VSS  
)
Output  
Voltage  
(VOUT  
)
Ground Voltage (VSS  
)
Note: The above timing chart omits the tDF and tDR  
.
The following explains the operation of the typical application circuit along number symbols shown in the timing chart.  
When input voltage (VIN) is higher than detect voltage (VDF), output voltage (VOUT) will be equal to input voltage (VIN).  
(A condition of high impedance exists with N-ch open drain output configurations.)  
When input voltage (VIN) falls below detect voltage (VDF), output voltage (VOUT) will be equal to the ground voltage  
(VSS) level.  
When input voltage (VIN) falls to a level below that of the minimum operating voltage (VMIN), output will become  
unstable. If In this condition, VIN will equal the pulled-up output (should output be pulled-up.) (Input voltage, VIN, in the  
typical application circuit.)  
When input voltage (VIN) rises above the minimum operating voltage (VMIN) level until it achieves a release voltage  
(VDR), output keeps the ground voltage level (VSS).  
When the input voltage (VIN) rises above the release voltage (VDR), output voltage (VOUT will be equal to input voltage  
(VIN). (A condition of high impedance exists with N-ch open drain output configurations.)  
The difference between VDR and VDF represents the hysteresis width.  
9/15  
XC61J Series  
NOTE ON USE  
1. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising  
phenomenon, the IC is liable to malfunction should the ratings be exceeded.  
2. In order to stabilize the IC's operations, please ensure that VIN pin's input frequency's rise and fall times are more than  
several μs / V.  
3. With a resistor connected between the VIN pin and the power supply VDD some errors may be observed from the input  
voltage at the detect and release voltage. Those errors are not constant because of the fluctuation of the supply current.  
4. When a resistor is connected between the VIN pin and the power supply VDD, oscillation may occur as a result of through  
current and voltage drop at the RIN at the time of voltage release. (refer to the Oscillation Description (1) below ) Especially  
in the CMOS output configurations, oscillation may occur regardless of detect/release operation if load current (IOUT) exists.  
(refer to the Oscillation Description (2) below)  
5. Please use N-ch open drains configuration, when a resistor RIN is connected between the VIN pin and the power supply VDD  
power source. In such cases, please ensure that RIN is less than 10kΩ and that C is more than 0.1μF.  
6. Torex places an importance on improving our products and its reliability.  
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.  
RIN  
V
PULL
V
IN  
RPULL  
XC61JN  
V
DD  
C
V
OUT  
VOUT  
V
SS  
[Figure 1: Circuit connected with the input resistor]  
Oscillation Description  
(1) Oscillation as a result of through current  
Since the XC61J series are CMOS ICs, transient through current will flow when the IC's internal circuit switching operates  
regardless of output configuration. Consequently, oscillation is liable to occur as a result of the similar operations as in (1) above.  
This oscillation does not occur during the detect operation.  
(2) Output current oscillation with the CMOS output configuration  
As shown in figure 2, when the voltage applied at the power supply (VDD) rises from below detect voltage to above release voltage,  
the IC commence release operations and the internal P-ch driver transistor will be on. The output current (IOUT) flows the input  
resistor (RIN) via the P-ch driver transistor. Because of the input resistor (RIN) and the output current (IOUT), an input pin voltage  
drops RIN x IOUT. If the voltage drop level is larger than the IC’s hysteresis width (VHYS), the input pin voltage will falls below the  
VDF and detect operations will commerce so that the internal P-ch driver transistor will be off. The voltage drop will stop because  
the output current (IOUT) which was flowing the P-ch driver transistor will run down. The input pin voltage will become the same  
voltage level as the input voltage (VIN). For this, the input pin voltage will rise above the release voltage (VDR), therefore, the  
release operations will begin over again. Oscillation may occur with this repetition. Further, this condition will also appear via  
means of a similar mechanism during detect operations.  
RIN  
Voltage Drop  
(RIN×IOUT  
V
IN  
)
I
OUT  
XC61JC  
V
DD(≧VDR)  
V
OUT  
V
SS  
R
L
[Figure 2: Oscillation caused by the input resistor of the CMOS output product and the output current]  
10/15  
XC61J  
Series  
TYPICAL PERFORMANCE CHARACTERISTICS  
(1) Supply Current vs. Input Voltage  
XC61Jx1002  
XC61Jx5002  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
Ta= 85℃  
25℃  
-40℃  
Ta= 85℃  
25℃  
-40℃  
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN (V)  
Input Voltage: VIN (V)  
(2) Output Voltage vs. Input Voltage  
XC61JN2002  
XC61JC2002  
Ta= 25℃  
Vpull-up=6V Rpull-up=100kΩ  
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
Ta= 85℃  
25℃  
-50℃  
0
1
2
3
4
5
6
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
Input Voltage: VIN (V)  
Input Voltage: VIN (V)  
(3) Detect Voltage, Release Voltage vs. Ambient Temperature  
XC61Jx2002  
XC61Jx1002  
2.4  
2.4  
2.3  
2.2  
2.1  
2.0  
1.9  
1.8  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
1.20  
1.15  
1.10  
1.05  
1.00  
0.95  
0.90  
2.3  
2.2  
2.1  
2.0  
1.9  
1.8  
V
DR  
V
V
DR  
V
DF  
DF  
-50  
-25  
0
25  
50  
75  
100  
-50 -25  
0
25  
50  
75  
100  
Ambient Temperature: Ta (℃)  
Ambient Temperature: Ta (℃)  
11/15  
XC61J Series  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(4) Output Current (Nch Driver) vs. Input Voltage  
XC61Jx5002  
XC61Jx5002  
V
OUT=0.3V  
V
OUT=0.5V  
10  
8
10  
8
Ta= -40℃  
Ta= -40℃  
25℃  
85℃  
25℃  
85℃  
6
6
4
4
2
2
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN [V]  
Input Voltage: VIN (V)  
(5) Output Current (Pch Driver) vs. Input Voltage  
XC61Jx5002  
XC61JC1002  
V
OUT=0.1V  
V
OUT=VIN-0.5V  
6
0.00  
-0.25  
-0.50  
-0.75  
-1.00  
-1.25  
-1.50  
Ta= 85℃  
25℃  
-40℃  
5
4
3
2
1
0
Ta= -40℃  
25℃  
85℃  
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN (V)  
Input Voltage: VIN (V)  
XC61JC1002  
XC61JC1002  
V
OUT=VIN-0.1V  
V
OUT=VIN-0.3V  
0.00  
-0.05  
-0.10  
-0.15  
-0.20  
-0.25  
-0.30  
0.00  
-0.20  
-0.40  
-0.60  
-0.80  
-1.00  
Ta= 85℃  
25℃  
-40℃  
Ta= 85℃  
25℃  
-40℃  
1
2
3
4
5
6
1
2
3
4
5
6
Input Voltage: VIN (V)  
Input Voltage: VIN (V)  
12/15  
XC61J  
Series  
PACKAGING INFORMATION  
For the latest package information go to, www.torexsemi.com/technical-support/packages  
PACKAGE  
SOT-25  
OUTLINE / LAND PATTERN  
SOT-25 PKG  
THERMAL CHARACTERISTICS  
Standard Board SOT-25 Power Dissipation  
13/15  
XC61J Series  
MARKING RULE  
SOT-25  
SOT-25(Under dot)  
represents product series  
5
4
MARK  
PRODUCT SERIES  
H
XC61J*******-G  
* SOT-25 with the under-dot marking is used.  
Magnified  
1
2
3
represents output configuration  
MARK  
DESCRIPTION  
DETECT VOLTAGE RANGE (V)  
PRODUCT SERIES  
XC61JC******-G  
C
D
N
P
1.03.9  
4.05.0  
1.03.9  
4.05.0  
CMOS output  
N-ch open drain output  
XC61JN******-G  
represents detect voltage  
MARK  
VOLTAGE (V)  
MARK  
VOLTAGE (V)  
MARK  
VOLTAGE (V)  
MARK  
VOLTAGE (V)  
0
1
2
3
4
5
6
7
8
9
A
4.0  
4.1  
4.2  
4.3  
4.4  
4.5  
4.6  
4.7  
4.8  
4.9  
5.0  
0
1
2
3
4
5
6
7
8
9
1.0  
1.1  
1.2  
1.3  
1.4  
1.5  
1.6  
1.7  
1.8  
1.9  
A
B
C
D
E
F
2.0  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
N
P
R
S
T
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
3.7  
3.8  
3.9  
U
V
X
Y
Z
H
N
L
M
④⑤ represents production lot number. 0109, 0A0Z, 119Z, A1A9, AAAZB1ZZ repeated.  
(G, I, J, O, Q, W excluded.)  
* No character inversion used.  
14/15  
XC61J  
Series  
1. The product and product specifications contained herein are subject to change without notice to  
improve performance characteristics. Consult us, or our representatives before use, to confirm that  
the information in this datasheet is up to date.  
2. The information in this datasheet is intended to illustrate the operation and characteristics of our  
products. We neither make warranties or representations with respect to the accuracy or  
completeness of the information contained in this datasheet nor grant any license to any intellectual  
property rights of ours or any third party concerning with the information in this datasheet.  
3. Applicable export control laws and regulations should be complied and the procedures required by  
such laws and regulations should also be followed, when the product or any information contained in  
this datasheet is exported.  
4. The product is neither intended nor warranted for use in equipment of systems which require  
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss  
of human life, bodily injury, serious property damage including but not limited to devices or equipment  
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and  
other transportation industry and 5) safety devices and safety equipment to control combustions and  
explosions. Do not use the product for the above use unless agreed by us in writing in advance.  
5. Although we make continuous efforts to improve the quality and reliability of our products;  
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal  
injury and/or property damage resulting from such failure, customers are required to incorporate  
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention  
features.  
6. Our products are not designed to be Radiation-resistant.  
7. Please use the product listed in this datasheet within the specified ranges.  
8. We assume no responsibility for damage or loss due to abnormal use.  
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex  
Semiconductor Ltd in writing in advance.  
TOREX SEMICONDUCTOR LTD.  
15/15  

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