XC61JN1202MR-G [TOREX]
Power Supply Support Circuit,;型号: | XC61JN1202MR-G |
厂家: | Torex Semiconductor |
描述: | Power Supply Support Circuit, |
文件: | 总15页 (文件大小:590K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XC61JSeries
ETR02033-002
Highly Accurate, Ultra Small, Low Power Consumption Voltage Detector
■GENERAL DESCRIPTION
The XC61J series is highly precise, low power consumption voltage detectors, manufactured using CMOS and laser trimming
technologies. With low power consumption and high accuracy, the series is suitable for precision mobile equipment.
The XC61J in ultra small package is ideally suited for high-density mounting. The XC61J is available in both CMOS and N-
channel open drain output configurations.
■APPLICATIONS
● Microprocessor reset circuitry
● Memory battery back-up circuits
● Power-on reset circuits
■FEATURES
Highly Accurate
: ± 2% (VDF≧1.5V)
± 30mV (VDF<1.5V)
: 0.6μA [VDF=2.7V, VIN=2.97V]
: 1.0V ~ 5.0V (0.1V increments)
Low Power Consumption
Detect Voltage Range
Operating Voltage Range Detect Voltage: 0.7V ~ 6.0V
Temperature Characteristics
Output Configuration
● Power failure detection
: ±100ppm/℃ (TYP.)
: CMOS (XC61JC)
N-channel open drain (XC61JN)
● System battery life and charge voltage monitors
Operating Temperature Range : -40℃~+85℃
Package
: SOT-25
Environmentally Friendly
: EU RoHS Compliant, Pb Free
■ TYPICAL PERFORMANCE
■TYPICAL APPLICATION CIRCUIT
CHARACTERISTICS
●Supply Current vs. Input Voltage
XC61Jx2702
Vpull-up
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
V
IN
Ta= 85℃
25℃
Rpull-up
(Unused for the CMOS
output products)
-40℃
VIN
V
OUT
VOUT
VSS
0
1
2
3
4
5
6
Input Voltage: VIN (V)
1/15
XC61J Series
■BLOCK DIAGRAMS
(1) XC61JC
(2) XC61JN
VIN
VIN
M
2
R
1
R
R
1
Comparator
Comparator
VOUT
VOUT
Vref
Vref
R2
2
M
1
M
1
VSS
VSS
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
2/15
XC61J
Series
■PRODUCT CLASSIFICATION
●Ordering Information
(
)
*1
XC61J①②③④⑤⑥⑦-⑧
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
C
N
CMOS output
①
②③
④⑤
Output Configuration
Detect Voltage
N-ch open drain output
e.g. 1.0V → ②=1, ③=0
±2% (1.5V≦VDF≦5.0V)
±30mV (1.0V≦VDF<1.5V)
10~50
Detect Accuracy
02
SOT-25(3,000pcs/Reel) (*3)
Standard feed
MR-G
ML-G
Package (Order Unit)
Taping Specification(*2)
⑥⑦-⑧
SOT-25(3,000pcs/Reel) (*3)
Reverse feed
(*1)
(*2)
(*3)
The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
Refer to the Taping Specification.
SOT-25 uses Cu wires.
●Taping Specification
・MR-G
・ML-G
direction of feed
direction of feed
3/15
XC61J Series
■PIN CONFIGURATION
VSS
5
VOUT
4
1
2
3
VIN
NC
NC
SOT-25
(TOP VIEW)
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
SOT-25
FUNCTION
1
2
3
4
5
NC
VIN
No Connection
Power Input
NC
No Connection
Signal Output (Active Low)
Ground
VOUT
VSS
4/15
XC61J
Series
Ta=25℃
■ABSOLUTE MAXIMUM RATINGS
PARAMETER
Input Voltage
Output Current
SYMBOL
RATING
-0.3~+7.0
10
UNITS
V
VIN
IOUT
mA
*
*
XC61JC ( 1)
-0.3~VIN+0.3 or +7.0 ( 3)
Output Voltage
Power Dissipation
VOUT
Pd
V
*
XC61JN ( 2)
-0.3~+7.0
250
600 (40mm x 40mm Standard board )(*4)
-40~+85
SOT-25
mW
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
℃
℃
-55~+125
*
( 1) CMOS Output
*
( 2) N-ch Open Drain Output
*
( 3) The maximum value should be either VIN+0.3 or +7.0 in the lowest
(*4) The power dissipation figure shown is PCB mounted and is for reference only.
The mounting condition is please refer to PACKAGING INFORMATION.
5/15
XC61J Series
■ELECTRICAL CHARACTERISTICS
XC61J Series
Ta=25℃
PARAMETER
SYMBOL
VIN
CONDITION
MIN.
0.7
TYP.
-
MAX.
6.0
UNITS CIRCUIT
Operating Voltage
VDF(T)=1.0~5.0V (*1)
V
V
-
Detect Voltage
VDF
VDF(T)=1.0V~5.0V
VDF(T)=1.0V~5.0V
E-1
①
VDF
×0.03
VDF
×0.05
VDF
×0.07
Hysteresis Width
VHYS
V
①
Quiescent Current 1
Quiescent Current 2
ISS1
ISS2
VIN=VDF(T)×1.1
VIN= VDF(T)×0.9
E-2
E-3
μA
μA
②
②
VOUT=0.5V
VOUT=0.3V
VOUT=0.1V
0.09
0.08
0.05
0.57
0.56
0.30
-
-
-
VIN=0.7
V
VIN=1.0
VOUT=0.1V, VDF(T)>1.0V
VOUT=0.1V, VDF(T)>2.0V
VOUT=0.1V, VDF(T)>3.0V
VOUT=0.1V, VDF(T)>4.0V
VOUT=5.5V
0.46
1.15
1.44
1.61
0.71
1.41
1.77
1.96
-
-
-
-
V
VIN=2.0
V
IOUTN
mA
③
Output Current
VIN=3.0
V
VIN=4.0
V
VIN=6.0
V
(*2)
IOUTP
-
-
-
-0.95
-0.001
0.001
-0.60
-
mA
③
③
CMOS Outpu
N-ch Open
Drain Output
t
ILEAK
VIN=VDF×0.9V, VOUT=0V
Leakage
Current
μA
VIN=6.0V, VOUT=6.0V
0.10
Temperature
Characteristics
ΔVDF/
(ΔTopr・VDF)
-40 oC≦Topr≦85 oC
-
-
-
±100
30
-
ppm/oC
μs
①
④
④
VIN=6.0V→0.7V
VIN=VDF to VOUT=0.5V
VIN=0.7V→6.0V
Detect Delay Time (*3)
tDF
100
100
Release Delay Time (*5)
tDR
20
μs
(*4)
VIN=VDR to VOUT=VDR
*1: VDF (T): Nominal detect voltage
*2: For XC61JC only.
*3: A time taking from the time at VIN = VDF to the time at VOUT=0.5V when VIN falls from 6.0V to 0.7V.
*4: VDR: Release voltage (VDR = VDF + VHYS
)
*5: A time taking from the time at VIN = VDR to the time at VOUT = VDR when VIN rise from 0.7V to 6.0V.
●XC61JN recommended pull-up resistance
Input Voltage Range
Pull-up Resistance
0.7V~6.0V
0.8V~6.0V
1.0V~6.0V
≧ 220kΩ
≧ 100kΩ
≧
33kΩ
6/15
XC61J
Series
■ELECTRICAL CHARACTERISTICS (Continued)
● DETECT VOLTAGE ACCURACY AND QUIESCENT CURRENT SPECIFICATIONS
SYMBOL
E-1
E-2
E-3
DETECT VOLTAGE
(V)
QUIESCENT CURRENT1
QUIESCENT CURRENT2
NOMINAL DETECT
VOLTAGE
(μA)
(μA)
VDF
ISS1
ISS2
VDF(T)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
MIN.
MAX.
1.030
1.130
1.230
1.330
1.430
1.530
1.632
1.734
1.836
1.938
2.040
2.142
2.244
2.346
2.448
2.550
2.652
2.754
2.856
2.958
3.060
3.162
3.264
3.366
3.468
3.570
3.672
3.774
3.876
3.978
4.080
4.182
4.284
4.386
4.488
4.590
4.692
4.794
4.896
4.998
5.100
TYP.
MAX.
TYP.
MAX.
1.35
0.970
1.070
1.170
1.270
1.370
1.470
1.568
1.666
1.764
1.862
1.960
2.058
2.156
2.254
2.352
2.450
2.548
2.646
2.744
2.842
2.940
3.038
3.136
3.234
3.332
3.430
3.528
3.626
3.724
3.822
3.920
4.018
4.116
4.214
4.312
4.410
4.508
4.606
4.704
4.802
4.900
0.5
1.4
0.4
0.6
1.7
0.5
1.60
0.7
1.9
0.6
1.80
7/15
XC61J Series
■TEST CIRCUITS
Circuit ①
RPULL=100kΩ
VIN
(Unused for the CMOS output products)
VIN
V
VOUT
V
VSS
Circuit ②
Circuit ③
Circuit ④
RPULL=100kΩ
V
IN
(Unused for the CMOS output products)
V
OUT
Measurement of waveform
V
SS
8/15
XC61J
Series
■OPERATIONAL EXPLANATION
●Typical Application Circuit
RPULL
VIN
(Unused for the CMOS output products)
VIN
VOUT
V
OUT
V
SS
●Timing Chart
Release Voltage (VDR
)
⑥
⑤
Detect Voltage (VDF
)
Input Voltage
(VIN)
Minimum Operating Voltage (VMIN
)
Ground Voltage (VSS
)
①
②
④
③
Output
Voltage
(VOUT
)
Ground Voltage (VSS
)
Note: The above timing chart omits the tDF and tDR
.
The following explains the operation of the typical application circuit along number symbols shown in the timing chart.
①
When input voltage (VIN) is higher than detect voltage (VDF), output voltage (VOUT) will be equal to input voltage (VIN).
(A condition of high impedance exists with N-ch open drain output configurations.)
②
③
When input voltage (VIN) falls below detect voltage (VDF), output voltage (VOUT) will be equal to the ground voltage
(VSS) level.
When input voltage (VIN) falls to a level below that of the minimum operating voltage (VMIN), output will become
unstable. If In this condition, VIN will equal the pulled-up output (should output be pulled-up.) (Input voltage, VIN, in the
typical application circuit.)
④
⑤
When input voltage (VIN) rises above the minimum operating voltage (VMIN) level until it achieves a release voltage
(VDR), output keeps the ground voltage level (VSS).
When the input voltage (VIN) rises above the release voltage (VDR), output voltage (VOUT will be equal to input voltage
(VIN). (A condition of high impedance exists with N-ch open drain output configurations.)
⑥
The difference between VDR and VDF represents the hysteresis width.
9/15
XC61J Series
■NOTE ON USE
1. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising
phenomenon, the IC is liable to malfunction should the ratings be exceeded.
2. In order to stabilize the IC's operations, please ensure that VIN pin's input frequency's rise and fall times are more than
several μs / V.
3. With a resistor connected between the VIN pin and the power supply VDD some errors may be observed from the input
voltage at the detect and release voltage. Those errors are not constant because of the fluctuation of the supply current.
4. When a resistor is connected between the VIN pin and the power supply VDD, oscillation may occur as a result of through
current and voltage drop at the RIN at the time of voltage release. (refer to the Oscillation Description (1) below ) Especially
in the CMOS output configurations, oscillation may occur regardless of detect/release operation if load current (IOUT) exists.
(refer to the Oscillation Description (2) below)
5. Please use N-ch open drains configuration, when a resistor RIN is connected between the VIN pin and the power supply VDD
power source. In such cases, please ensure that RIN is less than 10kΩ and that C is more than 0.1μF.
6. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
RIN
V
PULL
V
IN
RPULL
XC61JN
V
DD
C
V
OUT
VOUT
V
SS
[Figure 1: Circuit connected with the input resistor]
●
Oscillation Description
(1) Oscillation as a result of through current
Since the XC61J series are CMOS ICs, transient through current will flow when the IC's internal circuit switching operates
regardless of output configuration. Consequently, oscillation is liable to occur as a result of the similar operations as in (1) above.
This oscillation does not occur during the detect operation.
(2) Output current oscillation with the CMOS output configuration
As shown in figure 2, when the voltage applied at the power supply (VDD) rises from below detect voltage to above release voltage,
the IC commence release operations and the internal P-ch driver transistor will be on. The output current (IOUT) flows the input
resistor (RIN) via the P-ch driver transistor. Because of the input resistor (RIN) and the output current (IOUT), an input pin voltage
drops RIN x IOUT. If the voltage drop level is larger than the IC’s hysteresis width (VHYS), the input pin voltage will falls below the
VDF and detect operations will commerce so that the internal P-ch driver transistor will be off. The voltage drop will stop because
the output current (IOUT) which was flowing the P-ch driver transistor will run down. The input pin voltage will become the same
voltage level as the input voltage (VIN). For this, the input pin voltage will rise above the release voltage (VDR), therefore, the
release operations will begin over again. Oscillation may occur with this repetition. Further, this condition will also appear via
means of a similar mechanism during detect operations.
RIN
Voltage Drop
(RIN×IOUT
V
IN
)
I
OUT
XC61JC
V
DD(≧VDR)
V
OUT
V
SS
R
L
[Figure 2: Oscillation caused by the input resistor of the CMOS output product and the output current]
10/15
XC61J
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Supply Current vs. Input Voltage
XC61Jx1002
XC61Jx5002
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Ta= 85℃
25℃
-40℃
Ta= 85℃
25℃
-40℃
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
(2) Output Voltage vs. Input Voltage
XC61JN2002
XC61JC2002
Ta= 25℃
Vpull-up=6V Rpull-up=100kΩ
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
Ta= 85℃
25℃
-50℃
0
1
2
3
4
5
6
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Input Voltage: VIN (V)
Input Voltage: VIN (V)
(3) Detect Voltage, Release Voltage vs. Ambient Temperature
XC61Jx2002
XC61Jx1002
2.4
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.20
1.15
1.10
1.05
1.00
0.95
0.90
1.20
1.15
1.10
1.05
1.00
0.95
0.90
2.3
2.2
2.1
2.0
1.9
1.8
V
DR
V
V
DR
V
DF
DF
-50
-25
0
25
50
75
100
-50 -25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
11/15
XC61J Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Output Current (Nch Driver) vs. Input Voltage
XC61Jx5002
XC61Jx5002
V
OUT=0.3V
V
OUT=0.5V
10
8
10
8
Ta= -40℃
Ta= -40℃
25℃
85℃
25℃
85℃
6
6
4
4
2
2
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN [V]
Input Voltage: VIN (V)
(5) Output Current (Pch Driver) vs. Input Voltage
XC61Jx5002
XC61JC1002
V
OUT=0.1V
V
OUT=VIN-0.5V
6
0.00
-0.25
-0.50
-0.75
-1.00
-1.25
-1.50
Ta= 85℃
25℃
-40℃
5
4
3
2
1
0
Ta= -40℃
25℃
85℃
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
XC61JC1002
XC61JC1002
V
OUT=VIN-0.1V
V
OUT=VIN-0.3V
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
0.00
-0.20
-0.40
-0.60
-0.80
-1.00
Ta= 85℃
25℃
-40℃
Ta= 85℃
25℃
-40℃
1
2
3
4
5
6
1
2
3
4
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
12/15
XC61J
Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
SOT-25
OUTLINE / LAND PATTERN
SOT-25 PKG
THERMAL CHARACTERISTICS
Standard Board SOT-25 Power Dissipation
13/15
XC61J Series
■MARKING RULE
●SOT-25
SOT-25(Under dot)
① represents product series
5
4
MARK
PRODUCT SERIES
H
XC61J*******-G
①
②
③
④
⑤
* SOT-25 with the under-dot marking is used.
Magnified
1
2
3
② represents output configuration
MARK
DESCRIPTION
DETECT VOLTAGE RANGE (V)
PRODUCT SERIES
XC61JC******-G
C
D
N
P
1.0~3.9
4.0~5.0
1.0~3.9
4.0~5.0
CMOS output
N-ch open drain output
XC61JN******-G
③ represents detect voltage
MARK
VOLTAGE (V)
MARK
VOLTAGE (V)
MARK
VOLTAGE (V)
MARK
VOLTAGE (V)
0
1
2
3
4
5
6
7
8
9
A
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
0
1
2
3
4
5
6
7
8
9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
A
B
C
D
E
F
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
N
P
R
S
T
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
U
V
X
Y
Z
H
N
L
M
④⑤ represents production lot number. 01~09, 0A~0Z, 11~9Z, A1~A9, AA~AZ、B1~ZZ repeated.
(G, I, J, O, Q, W excluded.)
* No character inversion used.
14/15
XC61J
Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
15/15
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TOREX
XC61N0801PR
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XC61N0802MR-G
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XC61N0802NR
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XC61N0802NR-G
Low Voltage Detectors Standard Voltage DetectorsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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XC61N0901MR
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XC61N0901MR-G
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XC61N0901NR
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