XC6223C371GR-G [TOREX]
Fixed Positive LDO Regulator, 3.7V, 0.305V Dropout, PDSO4, ANTIMONY AND HALOGEN FREE, ROHS COMPLIANT, PLASTIC, USP-4;型号: | XC6223C371GR-G |
厂家: | Torex Semiconductor |
描述: | Fixed Positive LDO Regulator, 3.7V, 0.305V Dropout, PDSO4, ANTIMONY AND HALOGEN FREE, ROHS COMPLIANT, PLASTIC, USP-4 光电二极管 输出元件 调节器 |
文件: | 总37页 (文件大小:1016K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XC6223Series
ETR0339-009
Built-in Inrush Current Protection, 300mA High Speed LDO Voltage Regulator
■GENERAL DESCRIPTION
The XC6223 series is a high speed LDO regulator that features high accurate, low noise, high ripple rejection, low dropout
and low power consumption. The series consists of a voltage reference, an error amplifier, a driver transistor, a current limiter, a
phase compensation circuit, a thermal shutdown circuit and an inrush current protection circuit.
The CE function enables the circuit to be in stand-by mode by inputting low level signal. In the stand-by mode, the series
enables the electric charge at the output capacitor CL to be discharged via the internal switch, and as a result the VOUT pin
quickly returns to the VSS level. The output stabilization capacitor CL is also compatible with low ESR ceramic capacitors.
The output voltage is selectable in 0.05V increments within the range of 1.2V to 4.0V which fixed by laser trimming
technologies. The over current protection circuit and the thermal shutdown circuit are built-in. These two protection circuits
will operate when the output current reaches current limit level or the junction temperature reaches temperature limit level.
■FEATURES
Maximum Output Current
Input Voltage Range
Output Voltages
■APPLICATIONS
●Digital still cameras
●Smart phones / Mobile phones
●Portable game consoles
●Modules (wireless, cameras, etc. )
●IC recorders
: 300mA
: 1.6~5.5V
: 2.0~4.0V (Accuracy ±1%)
1.2~1.95V (Accuracy ±20mV)
0.05V increments
: 200mV@IOUT=300mA (VOUT=3.0V)
: 100μA
: 0.1μA
Dropout Voltage
Low Power Consumption
Stand-by Current
High Ripple Rejection
Protection Circuits
●Mobile devices / terminals
●Bluetooth
: 80dB@f=1kHz
: Current Limit(400mA)
Short Circuit Protection
Over Heat Protection
Inrush Current Protection
: CIN =1.0μF, CL=1.0μF
: Active High
●Wireless LAN
●Digital TV tuners
Low ESR Capacitors
CE Function
CL High Speed Discharge
Operating Ambient Temperature : -40℃~+105℃
Packages
: USPQ-4B03
USP-4
SSOT-24
SOT-25
SOT-89-5
: EU RoHS Compliant, Pb Free
Environmentally Friendly
■TYPICAL PERFORMANCE
■TYPICAL APPLICATION CIRCUIT
CHARACTERISTICS
XC6223x251
tr = tf = 0.5μs, Ta = 25℃, IOUT = 1⇔150mA
V
IN = 3.5V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
2.60
2.55
2.50
2.45
2.40
2.35
2.30
2.25
2.20
400
350
300
250
200
150
100
50
Output Voltage
Output Current
0
Time [20μs/div]
1/37
XC6223 Series
■PIN CONFIGURATION
*The dissipation pad for the USPQ-4B03,USP-4 packages should be solder-plated in reference mount pattern and metal masking so as to
enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS (No. 2) pin.
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTIONS
USPQ-4B03
USP-4
SSOT-24
SOT-25
SOT-89-5
4
1
2
3
-
4
1
2
3
-
4
3
2
1
-
1
5
2
3
4
4
5
2
3
1
VIN
VOUT
VSS
CE
Power Input
Output
Ground
ON/OFF Control
No Connection
NC
■LOGIC CONDITION FOR THE PIN
PIN NAME
DESIGNATOR
CONDITION
L
H
0V≦VCE≦0.3V
1.0V≦VCE≦5.5V
CE=OPEN
CE
OPEN
2/37
XC6223
Series
■PIN FUNCTION ASSIGNMENT
CE LOGIC
IC OPERATION
CONDITION
H
L
Operation ON
Operation OFF(Stand-by)
*
OPEN
* Undefined state in XC6223 A/B/E/F/J/K/P/Q. On the other hand, Operation OFF states in XC6223C/D/G/H/M/N/R/T because
that an internal pull-down resister maintains the CE pin voltage to be low.
■PRODUCT CLASSIFICATION
●Ordering Information
(
)
*1
XC6223①②③④⑤⑥-⑦
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
A/J(*3)
B/K(*3)
C/M(*3)
D/N(*3)
E/P(*3)
F/Q(*3)
G/R(*3)
H/T(*3)
Without Inrush Current Protection, Without CE Pull-down, Without CL discharge (Semi-Custom)
Without Inrush Current Protection, Without CE Pull-down, With CL discharge (Semi-Custom)
Without Inrush Current Protection, With CE Pull-down(*2), Without CL discharge (Semi-Custom)
Without Inrush Current Protection, With CE Pull-down(*2), With CL discharge
Type of
Regulator
①
With Inrush Current Protection, Without CE Pull-down, Without CL discharge (Semi-Custom)
With Inrush Current Protection, Without CE Pull-down, With CL discharge (Semi-Custom)
With Inrush Current Protection, With CE Pull-down(*2), Without CL discharge (Semi-Custom)
With Inrush Current Protection, With CE Pull-down(*2), With CL discharge
②③
④
Output Voltage
12~40
ex.) 2.80V → ②=2, ③=8, ④=please see down below.
±1% (VOUT≧2.0V)
1
±0.02V (VOUT<2.0V)
In case of 2nd decimal place 0 (ex.2.80V → ④=1)
±1% (VOUT≧2.0V)
Output Accuracy
B
±0.02V (VOUT<2.0V)
In case of 2nd decimal place 5 (ex.2.85V → ④=B)
USPQ-4B03 (5,000/Reel)
USP-4 (3,000/Reel)
9R-G
GR-G
NR-G
MR-G
PR-G
Packages
(*1)
⑤⑥-⑦
SSOT-24 (3,000/Reel)
(Order Unit)
SOT-25 (3,000/Reel)
SOT-89-5 (1,000/Reel)
(*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
(*2) With CE pin pull-down resistor.
(*3) Product types A/B/C/D/E/F/G/H are for pre-existing customers who were or are already using these types of products.
For customers who intend to adopt this product newly, please select from types J/K/M/N/P/Q/R/T which have been extended the operating
temperature range (105℃compliance).
3/37
XC6223 Series
■BLOCK DIAGRAMS
XC6223A/J series
XC6223B/K series
XC6223C/M series
XC6223D/N series
XC6223E/P series
XC6223F/Q series
XC6223G/R series
XC6223H/T series
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
4/37
XC6223
Series
■ABSOLUTE MAXIMUM RATINGS
●XC6223A/B/C/D/E/F/G/H Series
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
Output Current
Output Voltage
CE Input Voltage
VIN
IOUT
VOUT
VCE
VSS-0.3~+7.0
V
mA
V
(*1)
500
VSS-0.3~VIN+0.3
VSS-0.3~+7.0
100
V
USPQ-4B03
550 (PCB mounted)(*2)
120
USP-4
SSOT-24
SOT-25
1000 (PCB mounted)(*2)
150
500 (PCB mounted)(*2)
Power Dissipation
Pd
mW
250
600 (PCB mounted)(*2)
500
1300 (PCB mounted) (*2)
SOT-89-5
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
-40~+85
℃
℃
-55~+125
(*1) : IOUT≦Pd / (VIN-VOUT
)
(*2) : The power dissipation figure shown is PCB mounted. Please refer to page 29~33 for details.
●XC6223J/K/M/N/P/Q/R/T Series
Ta=25℃
PARAMETER
SYMBOL
RATINGS
UNITS
Input Voltage
Output Current
Output Voltage
CE Input Voltage
VIN
IOUT
VOUT
VCE
VSS-0.3~+7.0
V
mA
V
(*1)
500
VSS-0.3~VIN+0.3
VSS-0.3~+7.0
100
V
USPQ-4B03
550 (PCB mounted)(*2)
120
USP-4
SSOT-24
SOT-25
1000 (PCB mounted)(*2)
150
500 (PCB mounted)(*2)
Power Dissipation
Pd
mW
250
600 (PCB mounted)(*2)
500
1300 (PCB mounted) (*2)
SOT-89-5
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
-40~+105
℃
℃
-55~+125
(*1) : IOUT≦Pd / (VIN-VOUT
)
(*2) : The power dissipation figure shown is PCB mounted. Please refer to page 29~33 for details.
5/37
XC6223 Series
■ELECTRICAL CHARACTERISTICS
●XC6223A/B/C/D/E/F/G/H/J/K/M/N/P/Q/R/T Series
Ta=25℃
PARAMETER
Output Voltage
SYMBOL
CONDITIONS
OUT(T)≧2.0V,
CE=VIN, IOUT=10mA
MIN.
TYP.
MAX.
UNITS
V
CIRCUITS
V
V
VOUT(T)×0.99
VOUT(T)
(*2)
VOUT(T)×1.01
(*2)
(*2)
VOUT(E)
(*1)
①
VOUT(T)<2.0V,VCE=VIN,
OUT =10mA(*3)
VOUT(T)-20mV
VOUT(T)
(*2)
VOUT(T)+20mV
V
(*2)
(*2)
I
Maximum Output Current
Load Regulation
IOUTMAX
VCE=VIN
300
-
-
-
mA
mV
①
①
∆VOUT
VCE=VIN, 0.1mA≦IOUT≦300mA
25
45
Vdif
(*4)
Dropout Voltage
VCE=VIN, IOUT=300mA
E-1
mV
①
Supply Current
Stand-by Current
ISS
VCE=VIN
VCE=VSS
-
-
100
220
0.4
μA
μA
②
②
ISTB
0.01
∆VOUT
/
VOUT(T)+0.5V≦VIN≦5.5V
Line Regulation
Input Voltage
-
0.01
-
0.1
5.5
%/V
V
①
①
(∆VIN・VOUT
)
VCE=VIN, IOUT=50mA
-
VIN
1.6
Output Voltage
Temperature Characteristics
(A/B/C/D/E/F/G/H Type)
Output Voltage
∆VOUT
/
VCE=VIN, IOUT=10mA
-
-
±100
±100
-
-
ppm /
ppm /
℃
℃
①
①
(∆Ta VOUT
・
)
)
-40℃≦Ta≦85℃
∆VOUT
/
VCE=VIN, IOUT=10mA
Temperature Characteristics
(J/K/M/N/P/Q/R/T Type)
(∆Ta VOUT
・
-40℃≦Ta≦105℃
VOUT(T)<2.5V
VIN=3.0VDC+0.5Vp-pAC
VCE=VOUT(T)+1.0V
IOUT=30mA、f=1kHz
Power Supply Rejection
Ratio
PSRR
-
80
-
dB
③
V
OUT(T)≧2.5V
VIN={VOUT(T)+1.0}
DC+0.5Vp-pAC
VCE=VOUT(T)+1.0V
OUT=30mA、f=1kHz
V
I
Current Limit
Short Current
ILIM
ISHORT
VCEH
VCEL
VCE=VIN
310
400
-
mA
mA
V
①
①
④
④
VCE=VIN, VOUT=VSS
-
1.0
-
50
-
-
CE High Level Voltage
CE Low Level Voltage
-
-
5.5
0.3
-
V
CE High Level Current
(A/B/E/F/J/K/P/Q Type)
CE High Level Current
(C/D/G/H/M/N/R/T Type)
ICEH
VCE=VIN=5.5V
-0.1
-
0.1
μA
④
ICEH
ICEL
VCE=VIN=5.5V
3.0
-0.1
-
5.5
-
9.0
0.1
-
μA
μA
Ω
④
④
①
CE Low Level Current
VCE=VSS
CL Discharge Resistance
(Only B/D/F/H/K/N/Q/T Type)
Inrush Current
RDCHG
VIN=5.5V, VOUT=2.0V, VCE=VSS
300
Irush
TTSD
TTSR
VIN=VCE=5.5V
-
-
-
-
150
150
120
30
-
-
-
-
mA
℃
⑤
(Only E/F/G/H/P/Q/R/T Type)
Thermal Shutdown Detect
Temperature
Junction Temperature
Junction Temperature
Junction Temperature
Thermal Shutdown Release
Temperature
℃
①
Thermal Shutdown
TTSD - TTSR
℃
Hysteresis Width
NOTE:
*1: VOUT(E): Effective output voltage
(i.e. the output voltage when “VOUT(T)+1.0V” is provided at the VIN pin while maintaining a certain IOUT value.)
*2: VOUT(T): Nominal output voltage
*3: The standard output voltage is specified in VOUT(T)±20mV where VOUT(T)<2.0V.
*4: Vdif={VIN1{*5}-VOUT1{*6}} (VIN1≧1.6V)
*5: VIN1=The input voltage when VOUT1 appears as input voltage is gradually decreased.
*6: VOUT1=A voltage equal to 98% of the output voltage whenever an amply stabilized IOUT {VOUT(T)+1.0V} is input
*7: Unless otherwise stated regarding input voltage conditions, VIN=VOUT(T)+1.0V.
6/37
XC6223
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●Voltage Chart 1
SYMBOL
E-0
E-1
PARAMETER
OUTPUT VOLTAGE
(V)
DROPOUT VOLTAGE
(mV)
NOMINAL
OUTPUT
VOLTAGE (V)
VOUT(E)
Vdif
VOUT(T)
MIN
MAX
TYP
MAX
1.20
1.25
1.30
1.35
1.40
1.45
1.50
1.55
1.60
1.65
1.70
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
2.45
2.50
2.55
2.60
1.1800
1.2300
1.2800
1.3300
1.3800
1.4300
1.4800
1.5300
1.5800
1.6300
1.6800
1.7300
1.7800
1.8300
1.8800
1.9300
1.9800
2.0295
2.0790
2.1285
2.1780
2.2275
2.2770
2.3265
2.3760
2.4255
2.4750
2.5245
2.5740
1.2200
1.2700
1.3200
1.3700
1.4200
1.4700
1.5200
1.5700
1.6200
1.6700
1.7200
1.7700
1.8200
1.8700
1.9200
1.9700
2.0200
2.0705
2.1210
2.1715
2.2220
2.2725
2.3230
2.3735
2.4240
2.4745
2.5250
2.5755
2.6260
480
440
630
580
420
400
300
520
440
410
270
380
240
350
2.65
2.70
2.75
2.6235
2.6730
2.7225
2.6765
2.7270
2.7775
7/37
XC6223 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●Voltage Chart2
SYMBOL
E-0
E-1
PARAMETER
OUTPUT VOLTAGE
(V)
DROPOUT VOLTAGE
(mV)
NOMINAL
OUTPUT
VOLTAGE (V)
VOUT(E)
Vdif
VOUT(T)
MIN.
MAX.
MAX.
TYP.
240
2.80
2.85
2.90
2.95
3.00
3.05
3.10
3.15
3.20
3.25
3.30
3.35
3.40
3.45
3.50
3.55
3.60
3.65
3.70
3.75
3.80
3.85
3.90
3.95
4.00
2.7720
2.8215
2.8710
2.9205
2.9700
3.0195
3.0690
3.1185
3.1680
3.2175
3.2670
3.3165
3.3660
3.4155
3.4650
3.5145
3.5640
3.6135
3.6630
3.7125
3.7620
3.8115
3.8610
3.9105
3.9600
2.8280
2.8785
2.9290
2.9795
3.0300
3.0805
3.1310
3.1815
3.2320
3.2825
3.3330
3.3835
3.4340
3.4845
3.5350
3.5855
3.6360
3.6865
3.7370
3.7875
3.8380
3.8885
3.9390
3.9895
4.0400
350
200
305
8/37
XC6223
Series
■OPERATIONAL EXPLANATION
The voltage divided by resistors R1 & R2 is compared with the
internal reference voltage by the error amplifier. The P-channel
MOSFET which is connected to the Output pin (VOUT) is then driven
by the subsequent control signal. The output voltage at the Output
pin (VOUT) is controlled and stabilized by a system of negative
feedback. The current limit circuit and short circuit protection
operate in relation to the level of output current and heat dissipation.
Further, the IC’s internal circuitry can be shutdown via the CE pin
(CE) signal.
<Low ESR Capacitor>
The XC6223 series needs an output capacitor CL for phase compensation. In order to ensure the stable phase
compensation, please place an output capacitor of 1.0μF or bigger at the VOUT pin and VSS pin as close as possible. For a
stable power input, please connect an input capacitor (CIN) of 1.0μF between the input pin (VIN) and the ground pin (VSS).
<Current Limiter, Short-Circuit Protection>
The protection circuit operates as a combination of an output current limiter and fold-back short circuit protection. When
load current reaches the current limit level, the output voltage drops. As a result, the load current starts to reduce with
showing fold-back curve. The output current finally falls at the level of 50mA when the output pin is short-circuited.
<CE Pin>
The IC's internal circuitry can be shutdown via the signal from the CE pin (CE). In shutdown mode, the XC6223B/D/F/H/
K/N/Q/T series enables the electric charge at the output capacitor (CL) to be discharged via the internal auto-discharge
switch, and as a result the output pin (VOUT) quickly returns to the ground pin (VSS) level. When the CE pin (CE) is open, the
output voltage becomes undefined state in the XC6223A/B/E/F/J/K/P/Q series because of a high active and no pull-down.
On the other hand, the XC6223C/D/G/H/M/N/R/T series has a pull-down resistor at the CE pin (CE) inside, so that the CE pin
(CE) input current flows.
<Thermal Shutdown>
When the junction temperature of the built-in driver transistor reaches the temperature limit, the thermal shutdown circuit
operates and the driver transistor will be set to OFF. The IC resumes its operation when the thermal shutdown function is
released and the IC’s operation is automatically restored because the junction temperature drops to the level of the thermal
shutdown release voltage.
<Inrush Current Protection>
The inrush current protection circuit is built in the XC6223 series.
When the IC starts to operate, the protection circuit limits the inrush current from input pin (VIN) to output pin (VOUT) to charge
CL capacitor. This function is built in the XC6223E/F/G/H/P/Q/R/T series.
9/37
XC6223 Series
■NOTES ON USE
1. Where wiring impedance is high, operations may become unstable due to the noise and/or phase lag depending on output
current. Please strengthen input pin (VIN) and output pin (VOUT) wiring in particular.
2. The input capacitor CIN and the output capacitor CL should be placed to the as close as possible with a shorter wiring.
3. The IC is controlled with constant current start-up. Start-up sequence control is requested to draw a load current after
even nominal output voltage rising up the output voltage.
4. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be
exceeded.
5. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
10/37
XC6223
Series
■TEST CIRCUITS
●Circuit①
A
VIN
VOUT
IOUT
CE
VSS
V
V
CIN
(ceramic)
CL
(ceramic)
●Circuit ②
A
VIN
CE
VOUT
VSS
CIN
(ceramic)
●Circuit ③
IOUT=30mA
A
VIN
CE
VOUT
CIN=0.1μF
(ceramic)
V
V
VSS
CL
(ceramic)
11/37
XC6223 Series
■TEST CIRCUITS (Continued)
●Circuit ④
VIN
CE
VOUT
A
VSS
CIN
(ceramic)
V
CL
(ceramic)
V
●Circuit ⑤
A
VIN
CE
VOUT
VSS
CL=1μF
(ceramic)
CIN
(ceramic)
12/37
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Output Voltage vs. Output Current
XC6223x121
XC6223x121
VIN = 2.2V
Ta = 25℃
CIN = 1.0μF (ceramic)
CIN = 1.0μF (ceramic)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=105℃
VIN=1.6V
VIN=2.2V
VIN=2.7V
VIN=5.5V
0
100
200
300
400
500
0
100
200
300
400
500
Output Current:IOUT[mA]
Output Current:IOUT[mA]
XC6223x181
XC6223x181
VIN = 2.8V
CIN = 1.0μF (ceramic)
Ta = 25℃
IN = 1.0μF (ceramic)
C
2.0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=105℃
VIN=1.9V
VIN=2.3V
VIN=2.8V
VIN=3.3V
VIN=5.5V
0
100
200
300
400
500
0
100
200
300
400
500
Output Current:IOUT [mA]
Output Current:IOUT [mA]
XC6223x251
XC6223x251
VIN = 3.5V
CIN = 1.0μF (ceramic)
Ta = 25℃
IN = 1.0μF (ceramic)
C
3.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.5
2.0
1.5
1.0
0.5
0.0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=105℃
VIN=2.6V
VIN=3.0V
VIN=3.5V
VIN=4.0V
VIN=5.5V
0
100
200
300
400
500
0
100
200
300
400
500
Output Current:IOUT [mA]
Output Current:IOUT [mA]
13/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(1) Output Voltage vs. Output Current (Continued)
XC6223x401
XC6223x401
VIN = 5.0V
Ta = 25℃
CIN = 1.0μF (ceramic)
CIN = 1.0μF (ceramic)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Ta=-40℃
Ta=25℃
Ta=85℃
Ta=105℃
VIN=4.1V
VIN=4.5V
VIN=5.0V
VIN=5.5V
0
100
200
300
400
500
0
100
200
300
400
500
Output Current:IOUT [mA]
(2) Output Voltage vs. Input Voltage
Output Current:IOUT [mA]
XC6223x121
XC6223x121
Ta = 25℃
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
CIN = 1μF (ceramic), CL = 1μF (ceramic)
1.4
1.2
1.0
0.8
0.6
0.4
1.212
1.208
1.204
1.200
1.196
1.192
1.188
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=50mA
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=50mA
0.5
1.0
1.5
2.0
2.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage: VIN [V]
Input Voltage: VIN [V]
XC6223x181
XC6223x181
Ta = 25℃
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
CIN = 1μF (ceramic), CL = 1μF (ceramic)
2.0
1.8
1.6
1.4
1.2
1.0
1.820
1.815
1.810
1.805
1.800
1.795
1.790
1.785
1.780
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=50mA
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=50mA
0.5
1.0
1.5
2.0
2.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage: VIN [V]
Input Voltage: VIN [V]
14/37
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Input Voltage (Continued)
XC6223x251
XC6223x251
Ta = 25℃
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
CIN = 1μF (ceramic), CL = 1μF (ceramic)
2.7
2.5
2.3
2.1
1.9
1.7
2.530
2.520
2.510
2.500
2.490
2.480
2.470
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=50mA
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=50mA
1.5
2.0
2.5
3.0
3.5
3.0
3.5
4.0
4.5
5.0
5.5
Input Voltage: VIN [V]
Input Voltage: VIN [V]
XC6223x401
XC6223x401
Ta = 25℃
Ta = 25℃
CIN = 1μF (ceramic), CL = 1μF (ceramic)
CIN = 1μF (ceramic), CL = 1μF (ceramic)
4.2
4.0
3.8
3.6
3.4
3.2
4.040
4.030
4.020
4.010
4.000
3.990
3.980
3.970
3.960
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=50mA
IOUT=1mA
IOUT=10mA
IOUT=30mA
IOUT=50mA
3.0
3.5
4.0
4.5
5.0
4.5
4.7
4.9
5.1
5.3
5.5
Input Voltage: VIN [V]
Input Voltage: VIN [V]
(3) Dropout Voltage vs. Output Current
XC6223x121
XC6223x181
CIN = 1μF (ceramic), CL = 1μF (ceramic)
CIN = 1μF (ceramic), CL = 1μF (ceramic)
0.5
0.4
0.3
0.2
0.1
0.0
0.5
0.4
0.3
0.2
0.1
0.0
Ta = -40℃
Ta = 25℃
Ta = 85℃
Ta = 105℃
Below the minimum operating voltage
Ta = -40℃
Ta = 25℃
Ta = 85℃
Ta = 105℃
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Output Current:IOUT [mA]
Output Current:IOUT [mA]
15/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3) Dropout Voltage vs. Output Current (Continued)
XC6223x251
XC6223x401
CIN = 1μF (ceramic), CL = 1μF (ceramic)
CIN = 1μF (ceramic), CL = 1μF (ceramic)
0.5
0.4
0.3
0.2
0.1
0.0
0.5
0.4
0.3
0.2
0.1
0.0
Ta = -40℃
Ta = 25℃
Ta = 85℃
Ta = 105℃
Ta = -40℃
Ta = 25℃
Ta = 85℃
Ta = 105℃
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Output Current:IOUT [mA]
Output Current:IOUT [mA]
(4) Supply Current vs. Input Voltage
XC6223x121
XC6223x181
160
140
120
100
80
160
140
120
100
80
60
60
Ta = -40℃
Ta = 25℃
Ta = 85℃
Ta = 105℃
Ta = -40℃
Ta = 25℃
Ta = 85℃
Ta = 105℃
40
40
20
20
0
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage:VIN [V]
Input Voltage:VIN [V]
XC6223x401
XC6223x251
160
140
120
100
80
300
250
200
150
100
50
Ta = -40℃
Ta = 25℃
Ta = 85℃
Ta = 105℃
60
Ta = -40℃
Ta = 25℃
Ta = 85℃
Ta = 105℃
40
20
0
0
0
0.5
1
1.5
2 2.5 3 3.5 4 4.5 5 5.5
0
0.5
1
1.5
2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage:VIN [V]
Input Voltage:VIN [V]
16/37
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(5) Output Voltage vs. Ambient Temperature
XC6223x121
XC6223x181
VIN = 2.2V
VIN = 2.8V
CIN = 1μF (ceramic), CL = 1μF (ceramic)
CIN = 1μF (ceramic), CL = 1μF (ceramic)
1.22
1.21
1.20
1.19
1.18
1.84
1.83
1.82
1.81
1.80
1.79
1.78
1.77
1.76
IOUT= 1mA
IOUT=10mA
IOUT=30mA
IOUT=50mA
IOUT= 1mA
IOUT=10mA
IOUT=30mA
IOUT=100mA
-50 -25
0
25
50
75
100 125
-50 -25
0
25
50
75
100 125
Ambient Temperature:Ta[℃]
Ambient Temperature:Ta[℃]
XC6223x251
XC6223x401
VIN = 3.5V
VIN = 5.0V
CIN = 1μF (ceramic), CL = 1μF (ceramic)
CIN = 1μF (ceramic), CL = 1μF (ceramic)
2.56
2.54
2.52
2.50
2.48
2.46
2.44
4.08
4.06
4.04
4.02
4.00
3.98
3.96
3.94
3.92
IOUT= 1mA
IOUT=10mA
IOUT=30mA
IOUT=100mA
IOUT= 1mA
IOUT=10mA
IOUT=30mA
IOUT=100mA
-50 -25
0
25
50
75
100 125
-50 -25
0
25
50
75
100 125
Ambient Temperature:Ta[℃]
Ambient Temperature:Ta[℃]
(6) Rising Response Time
XC6223x121
XC6223x181
tr = 5μs, Ta = 25℃,VIN = 0→2.2V
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
tr = 5μs, Ta = 25℃,VIN = 0→2.8V
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
6.0
3.0
3
6.0
3.0
2.4
2
2.5
2
Input Voltage
Input Voltage
0.0
0.0
1.6
1.2
0.8
0.4
0
-3.0
-6.0
-9.0
1.5
1
-3.0
-6.0
-9.0
-12.0
Output Voltage
Output Voltage
IOUT=0.1mA
IOUT=0.1mA
IOUT=30mA
IOUT=30mA
0.5
0
IOUT=100mA
IOUT=100mA
-12.0
Time [50μs/div]
Time [50μs/div]
17/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(6) Rising Response Time (Continued)
XC6223x251
tr = 5μs, Ta = 25℃,VIN = 0→3.5V
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
XC6223x401
tr = 5μs, Ta = 25℃,VIN = 0→5.0V
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
6.0
3.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
6.0
3.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
Input Voltage
Input Voltage
0.0
0.0
Output Voltage
-3.0
-6.0
-9.0
-12.0
-3.0
-6.0
-9.0
-12.0
Output Voltage
IOUT=0.1mA
IOUT=30mA
IOUT=100mA
IOUT=0.1mA
IOUT=30mA
IOUT=100mA
Time [50μs/div]
Time [50μs/div]
(7) Input Transient Response
XC6223x181
XC6223x121
tr = tf = 5μs, Ta = 25℃, VIN = 2.2V⇔3.2V
IN = 0.1μF (ceramic), CL = 1.0μF (ceramic)
tr = tf = 5μs, Ta = 25℃, VIN = 2.8V⇔3.8V
CIN = 0.1μF (ceramic), CL = 1.0μF (ceramic)
C
5.0
1.85
5.0
4.0
1.24
1.23
1.22
1.21
1.2
4.0
3.0
1.84
1.83
1.82
1.81
1.8
Input Voltage
3.0
Input Voltage
IOUT=0.1mA
IOUT=30mA
IOUT=100mA
2.0
2.0
IOUT=0.1mA
IOUT=30mA
IOUT=100mA
1.0
1.0
0.0
1.19
1.18
0.0
Output Voltage
Output Voltage
-1.0
-1.0
1.79
Time [100μs/div]
Time [100μs/div]
XC6223x251
XC6223x401
tr = tf = 5μs, Ta = 25℃, VIN = 3.5V⇔4.5V
IN = 0.1μF (ceramic), CL = 1.0μF (ceramic)
tr = tf = 5μs, Ta = 25℃, VIN = 4.5V⇔5.5V
CIN = 0.1μF (ceramic), CL = 1.0μF (ceramic)
C
6.0
4.04
4.03
4.02
4.01
4
6.0
2.54
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
2.53
2.52
2.51
2.5
Input Voltage
Input Voltage
IOUT=10mA
IOUT=30mA
IOUT=100mA
IOUT=0.1mA
IOUT=30mA
IOUT=100mA
3.99
3.98
2.49
2.48
Output Voltage
Output Voltage
Time [100μs/div]
Time [100μs/div]
18/37
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Load Transient Response (tr=tf=0.5μs)
XC6223x121
XC6223x121
tr = tf = 0.5μs, Ta = 25℃, IOUT = 1⇔150mA
tr = tf = 0.5μs, Ta = 25℃, IOUT = 50⇔100mA
V
V
V
IN = 2.2V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
V
V
V
IN = 2.2V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
1.22
1.21
1.20
1.19
1.18
1.17
1.16
1.15
1.14
400
1.30
1.25
1.20
1.15
1.10
1.05
1.00
0.95
0.90
400
350
300
250
200
150
100
50
350
300
250
200
150
100
50
Output Voltage
Output Voltage
Output Current
Output Current
0
0
Time [20μs/div]
Time [20μs/div]
XC6223x181
XC6223x181
tr = tf = 0.5μs, Ta = 25℃, IOUT = 1⇔150mA
tr = tf = 0.5μs, Ta = 25℃, IOUT = 50⇔100mA
IN = 2.8V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
IN = 2.8V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
1.90
1.85
1.80
1.75
1.70
1.65
1.60
1.55
1.50
400
350
300
250
200
150
100
50
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
1.74
400
350
300
250
200
150
100
50
Output Voltage
Output Voltage
Output Current
Output Current
0
0
Time [20μs/div]
Time [20μs/div]
XC6223x251
XC6223x251
tr = tf = 0.5μs, Ta = 25℃, IOUT = 1⇔150mA
tr = tf = 0.5μs, Ta = 25℃, IOUT = 50⇔100mA
IN = 3.5V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
IN = 3.5V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
2.60
2.55
2.50
2.45
2.40
2.35
2.30
2.25
2.20
400
350
300
250
200
150
100
50
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45
2.44
400
350
300
250
200
150
100
50
Output Voltage
Output Voltage
Output Current
Output Current
0
0
Time [20μs/div]
Time [20μs/div]
19/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Load Transient Response (tr=tf=0.5μs) (Continued)
XC6223x401
tr = tf = 0.5μs, Ta = 25℃, IOUT = 1⇔150mA
XC6223x401
tr = tf = 0.5μs, Ta = 25℃, IOUT =50⇔100mA
V
IN = 5.0V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
V
IN = 5.0V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
4.10
4.05
4.00
3.95
3.90
3.85
3.80
3.75
3.70
400
350
300
250
200
150
100
50
4.02
4.01
4.00
3.99
3.98
3.97
3.96
3.95
3.94
500
450
400
350
300
250
200
150
100
50
Output Voltage
Output Current
Output Voltage
Output Current
0
0
Time [20μs/div]
Time [20μs/div]
(8) Load Transient Response (tr=tf=5μs) (Continued)
XC6223x121
XC6223x121
tr = tf = 5μs, Ta = 25℃, IOUT = 1⇔150mA
tr = tf = 5μs, Ta = 25℃, IOUT = 50⇔100mA
V
IN = 2.2V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
V
IN = 2.2V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
1.22
1.21
1.20
1.19
1.18
1.17
1.16
1.15
1.14
400
1.22
1.21
1.20
1.19
1.18
1.17
1.16
1.15
1.14
400
350
300
250
200
150
100
50
350
300
250
200
150
100
50
Output Voltage
Output Voltage
Output Current
Output Current
0
0
Time [50μs/div]
Time [50μs/div]
XC6223x181
tr = tf = 5μs, Ta = 25℃, IOUT = 50⇔100mA
XC6223x181
tr = tf = 5μs, Ta = 25℃, IOUT = 1⇔150mA
V
IN = 2.8V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
V
IN = 2.8V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
1.74
400
1.82
1.81
1.80
1.79
1.78
1.77
1.76
1.75
1.74
400
350
300
250
200
150
100
50
350
300
250
200
150
100
50
Output Voltage
Output Voltage
Output Current
Output Current
0
0
Time [50μs/div]
Time [50μs/div]
20/37
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Load Transient Response (tr=tf=5μs) (Continued)
XC6223x251
tr = tf = 5μs, Ta = 25℃, IOUT = 1⇔150mA
XC6223x251
tr = tf = 5μs, Ta = 25℃, IOUT = 50⇔100mA
V
IN = 3.5V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
V
IN = 3.5V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45
2.44
400
350
300
250
200
150
100
50
2.52
2.51
2.50
2.49
2.48
2.47
2.46
2.45
2.44
400
350
300
250
200
150
100
50
Output Voltage
Output Current
Output Voltage
Output Current
0
0
Time [50μs/div]
Time [50μs/div]
XC6223x401
tr = tf = 5μs, Ta = 25℃, IOUT = 1⇔150mA
XC6223x401
tr = tf = 5μs, Ta = 25℃, IOUT = 50⇔100mA
V
IN = 5.0V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
V
IN = 5.0V, CIN = 1μF (ceramic), CL = 1μF (ceramic)
4.02
4.01
4.00
3.99
3.98
3.97
3.96
3.95
3.94
400
350
300
250
200
150
100
50
4.02
4.01
4.00
3.99
3.98
3.97
3.96
3.95
3.94
400
350
300
250
200
150
100
50
Output Voltage
Output Current
Output Voltage
Output Current
0
0
Time [50μs/div]
Time [50μs/div]
(9) CE Rising Response Time (A,B,C,D J,K,M,N Type)
XC6223x121
XC6223x181
VIN = 2.2V, tr = 5μs, Ta = 25℃
VIN = 2.8V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
3.0
2.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0
2.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
CE Input Voltage
Output Voltage
1.0
0.0
CE Input Voltage
Output Voltage
1.0
0.0
-1.0
-2.0
-3.0
-1.0
-2.0
-3.0
IOUT=0mA
IOUT=0mA
IOUT=30mA
IOUT=100mA
IOUT=30mA
IOUT=100mA
Time [20μs/div]
Time [20μs/div]
21/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(9) CE Rising Response Time (A,B,C,D,J,K,M,N Type) (Continued)
XC6223x251
XC6223x401
VIN = 3.5V, tr = 5μs, Ta = 25℃
VIN = 5.0V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
6.0
4.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
6.0
4.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
CE Input Voltage
2.0
CE Input Voltage
2.0
Output Voltage
0.0
0.0
-2.0
-4.0
-6.0
-2.0
-4.0
-6.0
IOUT=0mA
IOUT=0mA
Output Voltage
IOUT=30mA
IOUT=100mA
IOUT=30mA
IOUT=100mA
Time [20μs/div]
Time [20μs/div]
(9) CE Rising Response Time (E,F,G,H,P,Q,R,T Type) (Continued)
XC6223x181
XC6223x121
VIN = 2.2V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
V
IN = 2.8V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
3.0
2.0
3
3.0
2.0
3
CE Input Voltage
2.5
2
2.5
2
CE Input Voltage
Output Voltage
1.0
1.0
0.0
1.5
1
0.0
1.5
1
Output Voltage
-1.0
-2.0
-3.0
-1.0
-2.0
-3.0
IOUT=0mA
IOUT=0mA
0.5
0
IOUT=30mA
IOUT=100mA
IOUT=30mA
IOUT=100mA
0.5
0
Time [20μs/div]
Time [50μs/div]
XC6223x251
XC6223x401
VIN = 3.5V, tr = 5μs, Ta = 25℃
V
IN = 5.0V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
6.0
4.0
6.0
6.0
4.0
6.0
5.0
4.0
3.0
2.0
1.0
0.0
5.0
4.0
3.0
2.0
1.0
0.0
CE Input Voltage
CE Input Voltage
2.0
2.0
Output Voltage
0.0
0.0
-2.0
-4.0
-6.0
-2.0
-4.0
-6.0
IOUT=0mA
Output Voltage
IOUT=0mA
IOUT=30mA
IOUT=100mA
IOUT=30mA
IOUT=100mA
Time [50μs/div]
Time [50μs/div]
22/37
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(10) Inrush Current Response Time (E,F,G,H,P,Q,R,T Type)
XC6223x121
XC6223x181
VIN = 2.2V, tr = 5μs, Ta = 25℃
VIN = 2.8V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
V
CE = 0→VIN, CIN = CL = 1.0μF (ceramic)
4.0
3.0
400
350
300
250
200
150
100
50
4.0
3.0
400
CE Input Voltage
350
300
250
200
150
100
50
CE Input Voltage
2.0
2.0
1.0
1.0
Output Voltage
Output Voltage
0.0
0.0
-1.0
-2.0
-3.0
-4.0
-1.0
-2.0
-3.0
-4.0
Rush Current
Rush Current
0
0
Time [20μs/div]
Time [50μs/div]
XC6223x251
XC6223x401
V
IN = 3.5V, tr = 5μs, Ta = 25℃
VIN = 5.0V, tr = 5μs, Ta = 25℃
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
VCE = 0→VIN, CIN = CL = 1.0μF (ceramic)
6.0
5.0
400
350
300
250
200
150
100
50
6.0
5.0
400
350
300
250
200
150
100
50
CE Input Voltage
4.0
4.0
CE Input Voltage
Output Voltage
3.0
3.0
2.0
2.0
Output Voltage
1.0
1.0
Rush Current
Rush Current
0.0
0.0
-1.0
-2.0
-1.0
-2.0
0
0
Time [50μs/div]
Time [50μs/div]
23/37
XC6223 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(11) Ripple Rejection Rate
XC6223x121
Ta = 25℃, VIN = 3.0VDC+0.5Vp-pAC
XC6223x181
Ta = 25℃, VIN = 3.0VDC+0.5Vp-pAC
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
100
80
60
40
20
0
100
80
60
40
20
0
IOUT=0.1mA
IOUT=1mA
IOUT=30mA
IOUT=0.1mA
IOUT=1mA
IOUT=30mA
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Ripple Frequency: f [kHz]
Ripple Frequency: f [kHz]
XC6223x251
Ta = 25℃, VIN = 3.5VDC+0.5Vp-pAC
XC6223x331
Ta = 25℃, VIN = 4.3VDC+0.5Vp-pAC
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
CIN = 0.1μF (ceramic), CL = 1μF (ceramic)
100
80
60
40
20
0
100
80
60
40
20
0
IOUT=0.1mA
IOUT=1mA
IOUT=30mA
IOUT=0.1mA
IOUT=1mA
IOUT=30mA
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Ripple Frequency: f [kHz]
Ripple Frequency: f [kHz]
24/37
XC6223
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(12) Output Noise Density
XC6223x121
XC6223x181
VIN=2.8, Ta=25℃
VIN=2.2V, Ta=25℃
CIN=CL=1.0μF(ceramic)
CIN=CL=1.0μF(ceramic)
100
10
100
10
Frequency-Range : 0.1~100kHz
Output Noise : 32.60μVrms
Frequency-Range : 0.1~100kHz
Output Noise : 49.74μVrms
IOUT=30mA
IOUT=30mA
1
1
0.1
0.01
0.1
0.01
0.1
1
10
100
0.1
1
10
100
Frequency : f [kHz]
Frequency : f [kHz]
XC6223x331
VIN=5.0V, Ta=25℃
CIN=CL=1.0μF(ceramic)
100
10
Frequency-Range : 0.1~100kHz
Output Noise : 81.52μVrms
IOUT=30mA
1
0.1
0.01
0.1
1
10
100
Frequency : f [kHz]
25/37
XC6223 Series
■PACKAGING INFORMATION
*The package don’t have filet because
side of lead is no plating.
26/37
XC6223
Series
■PACKAGING INFORMATION (Continued)
●SOT-25
●SOT-89-5
27/37
XC6223 Series
■PACKAGING INFORMATION (Continued)
●USPQ-4B03 Reference Metal Mask Design
●USPQ-4B03 Reference Pattern Layout
●USP-4 Reference Pattern Layout
●USP-4 Reference Metal Mask Design
28/37
XC6223
Series
■PACKAGING INFORMATION (Continued)
●
USPQ-4B03 Power Dissipation
Power dissipation data for the USPQ-4B03 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition
: Mount on a board
Ambient
: Natural convection
Soldering
Board Dimensions
Board Structure
: Lead (Pb) free
: 40 x 40 mm (1600mm2)
: 4 Copper Layers
Each layer is connected to the package
heat-sink and terminal pin No.1.
Each layer has approximately 800mm2 copper
area.
Material
: Glass Epoxy (FR-4)
Thickness
Through-hole
: 1.6 mm
: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature (85℃)
Board Mount (Tjmax=125℃)
Pd vs. Ta
Ambient
Temperature
Thermal
Resistance
Power
Dissipation
Pd (mW)
(℃)
(℃/W)
25
85
550
220
181.82
Ambient Temperature Ta(℃)
3. Power Dissipation vs. Ambient Temperature (105℃)
Board Mount (Tjmax=125℃)
Pd vs. Ta
Ambient
Temperature
Thermal
Resistance
Power
Dissipation
Pd (mW)
(℃)
(℃/W)
25
105
550
110
181.82
Ambient Temperature Ta(℃)
29/37
XC6223 Series
■PACKAGING INFORMATION (Continued)
●
USP-4 Power Dissipation
Power dissipation data for the USP-4 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature (85℃)
Board Mount (Tjmax=125℃)
Ambient
Temperature
Thermal
Resistance
Power
Dissipation
Pd (mW)
(℃)
(℃/W)
25
85
1000
400
100.00
Pd vs. Ta
3. Power Dissipation vs. Ambient Temperature (105℃)
Board Mount (Tjmax=125℃)
Ambient
Temperature
Thermal
Resistance
Power
Dissipation
Pd (mW)
(℃)
(℃/W)
25
105
1000
200
100.00
Ambient Temperature Ta(℃)
30/37
XC6223
Series
■PACKAGING INFORMATION (Continued)
●
SSOT-24 Power Dissipation
Power dissipation data for the SSOT-24 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following
condition.
1. Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature (85℃)
Board Mount (Tjmax=125℃)
Pd vs. Ta
Ambient
Temperature
Thermal
Resistance
Power
Dissipation
Pd (mW)
(℃)
(℃/W)
25
85
500
200
200.00
Ambient Temperature Ta(℃)
3. Power Dissipation vs. Ambient Temperature (105℃)
Board Mount (Tjmax=125℃)
Pd vs. Ta
Ambient
Temperature
Thermal
Resistance
Power
Dissipation
Pd (mW)
(℃)
(℃/W)
25
105
500
100
200.00
Ambient Temperature Ta(℃)
31/37
XC6223 Series
■PACKAGING INFORMATION (Continued)
●
SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following
condition.
1. Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature(85℃)
Board Mount ( Tjmax=125℃)
Pd vs Ta
700
600
500
400
300
200
100
0
Ambient
Temperature
Thermal
Resistance
Power
Dissipation
Pd (mW)
(℃)
(℃/W)
25
85
600
240
166.67
25
45
65
85
105
125
Ambient Temperature Ta(℃)
3. Power Dissipation vs. Ambient temperature(105℃)
Board Mount ( Tjmax=125℃)
Pd vs Ta
Ambient
Temperature
Thermal
Resistance
700
600
500
400
300
200
100
0
Power
Dissipation
Pd (mW)
(℃)
(℃/W)
25
105
600
120
166.67
25
45
65
85
105
125
Ambient Temparature Ta(℃)
32/37
XC6223
Series
■PACKAGING INFORMATION (Continued)
●
SOT-89-5 Power Dissipation
Power dissipation data for the SOT-89-5 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
て
1. Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 5 x 0.8 Diameter
EvaluaioBoard (Unit: mm)
2. Power Dissipation vs. Ambient temperature(85℃)
Board Mount (Tj max = 125℃)
Pd vs. Ta
Ambient
Temperature
(℃)
Power
Dissipation Pd
(mW)
Thermal
Resistance
(℃/W)
1400
1200
1000
800
600
400
200
0
25
85
1300
520
76.92
25
45
65
85
105
125
Ambient Temperature Ta (℃)
3. Power Dissipation vs. Ambient temperature(105℃)
Board Mount (Tj max = 125℃)
Pd vs. Ta
Ambient
Temperature
(℃)
Power
Dissipation Pd
(mW)
Thermal
Resistance
(℃/W)
1400
1200
1000
800
600
400
200
0
25
1300
260
76.92
105
25
45
65
85
105
125
Ambient Temperature Ta(℃)
33/37
XC6223 Series
■MARKING RULE
●USPQ-4B03
① represents type of regulator and output voltage range.
4
3
MARK
②
④
2
①
③
OUTPUT VOLTAGE
0.1V INCREMENTS
OUTPUT VOLTAGE
0.05V INCREMENTS
PRODUCT SERIES
VOLTAGE=1.2~3.9V
VOLTAGE =4.0V VOLTAGE =1.25~3.95V
0
1
2
3
4
5
6
7
8
9
A
XC6223A/J*****
XC6223B/K*****
XC6223C/M*****
XC6223D/N*****
XC6223E/P*****
XC6223F/Q*****
XC6223G/R*****
XC6223H/T*****
1
USPQ-4B03
(TOP VIEW)
B
H
C
D
E
F
② represents output voltage.
VOLTAGE=1.2~3.95[V]
VOLTAGE=4.0[V]
PRODUCT SERIES MARK
MARK OUTPUT VOLTAGE (V) MARK OUTPUT VOLTAGE (V)
XC6223A/J*****
XC6223B/K*****
XC6223C/M*****
XC6223D/N*****
XC6223E/P*****
XC6223F/Q*****
XC6223G/R*****
XC6223H/T*****
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
-
-
F
H
K
L
2.50
2.60
2.70
2.80
2.90
3.00
3.10
3.20
3.30
3.40
3.50
3.60
3.70
3.80
3.90
2.55
2.65
2.75
2.85
2.95
3.05
3.15
3.25
3.35
3.45
3.55
3.65
3.75
3.85
3.95
-
-
1.20
1.30
1.40
1.50
1.60
1.70
1.80
1.90
2.00
2.10
2.20
2.30
2.40
1.25
1.35
1.45
1.55
1.65
1.75
1.85
1.95
2.05
2.15
2.25
2.35
2.45
M
N
P
R
S
T
U
V
X
Y
Z
③④ represents production lot number.
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order.
(G, I, J, O, Q, W excepted)
*No character inversion used.
34/37
XC6223
Series
■MARKING RULE (Continued)
●SSOT-24 (with bar)
① represents type of regulator and output voltage range.
3
2
4
1
MARK
OUTPUT VOLTAGE
OUTPUT VOLTAGE
0.05V INCREMENTS
PRODUCT SERIES
0.1V INCREMENTS
VOLTAGE =1.2~2.9V VOLTAGE =3.0~4.0V VOLTAGE =1.25~3.95V
B
C
D
E
K
L
3
5
8
9
XC6223A/J*****
XC6223B/K*****
XC6223C/M*****
XC6223D/N*****
XC6223E/P*****
XC6223F/Q*****
XC6223G/R*****
XC6223H/T*****
7
S
T
U
V
X
Y
A
F
H
P
Z
SSOT-24(with bar)
(TOP VIEW)
M
N
② represents output voltage.
MARK
OUTPUT VOLTAGE (V)
MARK
OUTPUT VOLTAGE (V)
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
F
H
K
L
2.50
3.20
3.30
3.40
3.50
3.60
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
2.55
2.65
2.75
2.85
2.95
3.05
3.15
3.25
3.35
3.45
3.55
3.65
3.75
3.85
3.95
-
-
-
2.60
1.20
1.30
1.40
1.50
1.60
1.70
1.80
1.90
2.00
2.10
2.20
2.30
2.40
-
1.25
1.35
1.45
1.55
1.65
1.75
1.85
1.95
2.05
2.15
2.25
2.35
2.45
2.70
-
2.80
-
M
N
P
R
S
T
2.90
-
-
-
-
-
-
-
-
-
-
-
-
3.70
3.80
3.90
4.00
-
-
-
-
-
-
U
V
X
Y
Z
-
-
-
3.00
3.10
-
-
③④ represents production lot number.
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order.
(G, I, J, O, Q, W excepted)
*No character inversion used.
35/37
XC6223 Series
■MARKING RULE (Continued)
5
4
●SOT-25, SOT-89-5,USP-4
①
②
③
④
⑤
① represents product series
1
2
3
MARK
9
PRODUCT SERIES
XC6223******
SOT-25
(TOP VIEW)
② represents type of regulator.
5
2
4
MARK
OUTPUT VOLTAGE
0.1V INCREMENTS
OUTPUT VOLTAGE
0.05V INCREMENTS
VOLTAGE =1.25~3.95V
PRODUCT SERIES
VOLTAGE =1.2~3.9V VOLTAGE =4.0V
C
F
L
D
H
M
R
U
Y
1
E
K
N
S
V
Z
2
XC6223A/J*****
XC6223B/K*****
XC6223C/M*****
XC6223D/N*****
XC6223E/P*****
XC6223F/Q*****
XC6223G/R*****
XC6223H/T*****
1
2
3
P
T
X
0
SOT-89-5
(TOP VIEW)
3
4
5
1
2
4
③ represents output voltage.
3
MARK
OUTPUT VOLTAGE (V)
MARK
OUTPUT VOLTAGE (V)
USP-4
(TOP VIEW)
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
-
4.00
-
F
H
K
L
2.50
2.60
2.70
2.80
2.90
3.00
3.10
3.20
3.30
3.40
3.50
3.60
3.70
3.80
3.90
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
2.55
2.65
2.75
2.85
2.95
3.05
3.15
3.25
3.35
3.45
3.55
3.65
3.75
3.85
3.95
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.20
1.30
1.40
1.50
1.60
1.70
1.80
1.90
2.00
2.10
2.20
2.30
2.40
1.25
1.35
1.45
1.55
1.65
1.75
1.85
1.95
2.05
2.15
2.25
2.35
2.45
-
-
-
-
-
-
-
-
-
-
-
-
-
M
N
P
R
S
T
U
V
X
Y
Z
④⑤ represents production lot number.
01 to 09, 0A to 0Z, 11 to 9Z, A1 to A9, AA to Z9, ZA to ZZ in order.
(G, I, J, O, Q, W excepted)
*No character inversion used.
36/37
XC6223
Series
1. The products and product specifications contained herein are subject to change without
notice to improve performance characteristics. Consult us, or our representatives
before use, to confirm that the information in this datasheet is up to date.
2. We assume no responsibility for any infringement of patents, patent rights, or other
rights arising from the use of any information and circuitry in this datasheet.
3. Please ensure suitable shipping controls (including fail-safe designs and aging
protection) are in force for equipment employing products listed in this datasheet.
4. The products in this datasheet are not developed, designed, or approved for use with
such equipment whose failure of malfunction can be reasonably expected to directly
endanger the life of, or cause significant injury to, the user.
(e.g. Atomic energy; aerospace; transport; combustion and associated safety
equipment thereof.)
5. Please use the products listed in this datasheet within the specified ranges.
Should you wish to use the products under conditions exceeding the specifications,
please consult us or our representatives.
6. We assume no responsibility for damage or loss due to abnormal use.
7. All rights reserved. No part of this datasheet may be copied or reproduced without the
prior permission of TOREX SEMICONDUCTOR LTD.
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