XC8108_13_技术文档

XC8108Series

ETR33004-005a

85mΩ High Function Power Switch

■GENERAL DESCRIPTION

The XC8108 series is a P-channel MOSFET power switch IC with a low ON resistance. A current limit, reverse current

prevention (prevents reverse current from V_OUTto V_IN), soft start, thermal shutdown, and an under voltage lockout (UVLO) are

incorporated as protective functions. A flag function monitors the power switch status. The flag output has N-channel open

drain structure, and outputs Low level signal while over-current or overheating is detected, or while the reverse current

prevention is operated.

A variable current limiting function is integrated, allowing the current limit value to be set, using an external resistor.

The voltage level which is fed to CE pin determines the status of XC8108. The logic level of CE pin is selectable between

either one of active high or active low.

■APPLICATIONS

●Set Top Boxes

●Digital TVs

■FEATURES

Input Voltage

Output Current

ON Resistance

Supply Current

Stand-by Current

Flag Delay Time

: 2.5V～5.5V

: 2A

: 85mΩ@V_IN=5.0V (TYP.)

: 40μA@ V_IN=5.0V

: 0.1μA (TYP.)

●PCs

●USB Ports/USB Hubs

●HDMI

: 7.5ms (TYP.)

* At over-current detection

: 4ms (TYP.)

* At reverse voltage detection

: Reverse Current Prevention

0.9A～2.4A(TYP.)

Thermal Shutdown

Under Voltage Lockout(UVLO）

Soft-start

Protection Circuit

Functions

: Flag Output

CE Pin Input Logic Selectable

Current Limit Response Time

: 2μs (TYP.)

*Reference value

Operating Ambient Temperature : -40℃～+105℃

Packages

: USP-6C

: EU RoHS Compliant, Pb Free

Environmentally Friendly

■

TYPICAL APPLICATION CIRCUIT

■TYPICAL PERFORMANCE

CHARACTERISTICS

XC8108xC20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

6.0

5.0

4.0

3.0

2.0

1.0

0.0

RILIM=39.2kΩ

RILIM=18.4kΩ

RILIM=5.76kΩ

RILIM=0kΩ

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Output Current : I_OUT[A]

1/25

XC8108 Series

■BLOCK DIAGRAM

XC8108 Series

* Diodes inside the circuit are an ESD protection diode and a parasitic diode.

2/25

XC8108

Series

■PRODUCT CLASSIFICATION

●Ordering Information

XC8108①②③④⑤⑥-⑦

DESIGNATOR

ITEM

SYMBOL

DESCRIPTION

A

B

C

D

①

CE Logic

Refer to Selection Guide

②

Protection Circuits Type

2.0A

③④

Maximum Output Current

Package (Order Unit)

20

(Adjustable current limit range:

900mA～2400mA)

(*1)

⑤⑥-⑦

ER-G

USP-6C (3,000/Reel)

^(*1)The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant.

●Selection Guide

CURRENT LIMIT

ADJUSTABLE

TYPE

CE LOGIC SELECTABLE

SOFT-START

AC

AD

BC

BD

Active High

Active Low

Yes

REVERSE CURRENT

PREVENTION

TYPE

UVLO

FLG OUTPUT

AC

AD

BC

BD

Yes

THERMAL

LATCH

TYPE

SHUT DOWN

PROTECTION

AC

AD

BC

BD

Yes

No

Yes

No

Yes

3/25

XC8108 Series

■PIN CONFIGURATION

3

2

1

CE

4

FLG

I_LIM

5 V_SS

6

V_IN

V_OUT

USP-6C

(BOTTOM VIEW)

* The dissipation pad for the USP-6C packages should be solder-plated for mounting strength and heat dissipation.

Please refer to the reference mount pattern and metal masking. The dissipation pad should be connected to the V_SS(No. 5) pin.

■PIN ASSIGNMENT

PIN NUMBER

USP-6C

PIN NAME

FUNCTIONS

1

2

3

4

5

6

V_OUT

I_LIM

Output

Current Limit Adjustment

Fault Report

FLG

CE

ON/OFF Control

Ground

V_SS

V_IN

Power Input

■FUNCTION

TYPE

A

PIN NAME

SIGNAL

STATUS

Active

H

L

Stand-by

OPEN

H

Undefined State ^(*1)

CE

Stand-by

B

L

Active

OPEN

Undefined State ^(*1)

* Avoid leaving the CE pin open; set to any fixed voltage.

4/25

XC8108

Series

■ABSOLUTE MAXIMUM RATINGS

Ta=25℃

PARAMETER

SYMBOL

RATINGS

UNITS

Input Voltage

Output Voltage

Output Current

CE Input Voltage

FLG Pin Voltage

FLG Pin Current

I_LIMPin Voltage

I_LIMPin Current

V_IN

V_OUT

I_OUT

V_CE

-0.3～+6.0

2.8

V

A

-0.3～+6.0

15

V

V_FLG

I_FLG

V_ILIM

I_ILIM

V

mA

V

-0.3～+6.0

±1

mA

120

Power Dissipation

USP-6C

Pd

mW

1000 ^(*2)

-40～+105

-55～+125

Operating Ambient Temperature

Storage Temperature

Topr

Tstg

℃

* All voltages are described based on the V_SS

.

^(*1)Use with I_OUTless than Pd/（V_IN-V_OUT）.

^(*2)This is a reference data taken by using the test board. Please refer to page 23 for details.

5/25

XC8108 Series

■ELECTRICAL CHARACTERISTICS

Ta=25℃

PARAMETER

Input Voltage

SYMBOL

V_IN

CONDITIONS

MIN.

TYP.

MAX.

UNITS CIRCUIT

-

2.5

-

5.5

110

104

75

V

①

②

V_IN=3.3V, I_OUT=1.0A

V_IN=5.0V, I_OUT=1.0A

V_OUT=OPEN

-

100

85

40

mΩ

μA

On Resistance

Supply Current

R_ON

I_SS

I_STBY

V_IN=5.5V, V_OUT=OPEN

V_CE=V_SS(XC8108A series)

V_CE=V_IN(XC8108B series)

Stand-by Current

-

0.01

1.0

μA

②

V_IN=5.5V, V_OUT=0V

Switch Leakage Current

I_LEAK

V_CE=V_SS(XC8108A series)

V_CE=V_IN(XC8108B series)

V_OUT=V_IN-0.3V

2.16

2.40

1.34

1.20

0.67

2.64

I

_LIMshorted to V_SS

_OUT=V_IN-0.3V

_ILIM=18.4kΩ

Current Limit

I_LIMT

I_SHORT

t_CLR

A

①

V

1.16

1.52

R

V_OUT=0V

_LIMshorted to V_SS

V_OUT=0V

_ILIM=18.4kΩ

-

I

Short-Circuit Current

R

V_IN=5.0V, V_OUT: OPEN→0V

Measure from V_OUT=0V

to when current falls below

a certain I_LIMTvalue

Current Limit Circuit

Response Time ^(*2)

-

2.0

-

μs

V_IN=5.5V, XC8108A series

V_IN=5.5V, XC8108B series

V_IN=5.5V, XC8108A series

V_IN=5.5V, XC8108B series

V_IN=5.5V, V_CE=5.5V

1.5

-

5.5

0.8

5.5

0.1

CE "H" Level Voltage

CE "L" Level Voltage

V_CEH

V_CEL

V

①

-

1.5

-0.1

CE "H" Level Current

CE "L" Level Current

I_CEH

I_CEL

μA

①

V_IN=5.5V, V_CE=0V

UVLO Detected Voltage

V_UVLOD

V_IN: 2.2V→1.7V

1.8

1.9

2.0

V

①

UVLO Released Voltage

UVLO Hysteresis

V_UVLOR

V_UHYS

V_IN: 1.7V→2.2V

1.9

-

2.0

0.1

2.1

-

V

①

-

NOTE:

Unless otherwise stated, V_IN=5.0V, I_OUT=1mA, I_LIM=V_SS, V_CE=V_IN(XC8108A series) or V_CE=V_SS(XC8108B series)

^(*2)Design reference value. This parameter is provided only for reference.

6/25

XC8108

Series

■ELECTRICAL CHARACTERISTICS (Continued)

Ta=25℃

PARAMETER

turn-on time

SYMBOL

t_DLY(ON)

CONDITIONS

MIN.

-

TYP.

0.60

MAX.

1.00

UNITS CIRCUIT

R_LOAD=10Ω, V_CE=0V→2.2V

ms

Ω

①

③

①

turn-off time

t_DLY(OFF)

R_FLG

I_FOFF

t_FD1

R_LOAD=10Ω, V_CE=2.2V→0V

I_FLG=10mA, V_OUT=5.5V

-

0.08

15

0.13

20

FLG output FET

On-resistance

FLG output FET

Leakage Current

V_IN=5.5V, V_FLG=5.5V, V_OUT=OPEN

over-current condition

-

0.01

7.5

0.1

8.5

4.7

μA

ms

6.5

2.7

FLG delay time

t_FD2

reverse-voltage condition

4.0

V_IN=0V, V_OUT=5.5V

Reverse Current

I_REV

V_CE=5.0V (XC8108A series)

V_CE=V_SS(XC8108B series)

-

0.1

1.0

-

μA

①

Reverse Current

Prevention

V_IN: 5.0V→4.7V

V_{REV_D}

140

mV

V_OUT=5.0V

Detect Voltage

Thermal Shutdown

Detect Temperature

Thermal Shutdown

Release Temperature

Thermal Shutdown

Hysteresis Width

T_TSD

T_TSR

T_HYS

Junction Temperature

-

150

130

20

-

℃

①

NOTE:

Unless otherwise stated, V_IN=5.0V, I_OUT=1mA, I_LIM=V_SS, V_CE=V_IN(XC8108A series) or V_CE=V_SS(XC8108B series)

■TIMING CHART

●turn-on time, turn-off time

XC8108 Series, Type A

XC8108 Series, Type B

7/25

XC8108 Series

■TEST CIRCUITS

C_IN=1.0μF, C_L=1.0μF

1) CIRCUIT①

2) CIRCUIT②

3) CIRCUIT③

8/25

XC8108

Series

■OPERATIONAL EXPLANATION

The XC8108 series is a P-channel MOSFET power switch IC.

The XC8108 series consists of a CE circuit, UVLO circuit, thermal shutdown circuit, current limiter circuit, reverse current

prevention circuit, control block and others. The gate voltage of the power switch transistor is controlled with control block.

The current limiter circuit and reverse current prevention circuit will operate based on the output voltage and output current.

(See the BLOCK DIAGRAM below)

BLOCK DIAGRAM (XC8108 Series)

The voltage level which is fed to CE pin controls the status of this IC. If either “H” level or “L” level which is defined as the

electrical specification is fed to CE pin, then XC8108 can operate in standard manner. However, if the middle voltage which is

neither “H” level nor “L” level is fed to CE pin, the consumption current will increase due to the shoot-through current at internal

circuits. Also if CE pin is open, the status of XC8108 cannot be fixed and the behavior will be unstable.

For protection against heat damage of the ICs, thermal shutdown function is built in. When the internal junction temperature

reaches the temperature limit, the thermal shutdown circuit operates and the power switch transistor will turn OFF. The IC

resumes its operation when the thermal shutdown function is released and the IC’s operation is automatically restored because

the junction temperature drops to the level of the thermal shutdown release temperature. When the thermal shutdown circuit

detects higher junction temperature than the detect temperature, the voltage level of FLG pin is low level. When the thermal

shutdown circuit detects lower junction temperature than the release temperature, the thermal shutdown function is released

and the voltage level of FLG pin is high level.

When the V_INpin voltage goes down to lower voltage than UVLO detected voltage, the power switch transistor turns OFF by

UVLO function in order to prevent false output caused by unstable operation of the internal circuitry. When the V_INpin voltage

goes up to higher voltage than UVLO released voltage, the UVLO function is released and the power switch transistor can turn

ON.

<Soft-start Function>

The soft-start circuit can reduce the in-rush current charged on the output capacitor when IC starts up. Additionally, due to the

reduction of the in-rush current, the circuit can reduce the fluctuation of the input voltage as well. The soft-start time is optimized

internally and defined as turn-on time. (TYP: 0.6ms)

9/25

XC8108 Series

■OPERATIONAL EXPLANATION (Continued)

When the output current reaches the current limit value, the constant current limit circuit activates and as a result, the output

voltage goes down.

If the short circuit comes at the V_OUTpin, the output current is limited to the current which is specified as the short-circuit

current value. If the over-current state lasts for 7.5ms (TYP.), the FLG pin changes to Low level output.

Two types are available for the current limiter circuit: an auto recovery type (product type C) and a latch off type (product type

D). After the current limiter circuit activates and the FLG pin outputs low level, the operation is different between these two

types.

The auto recovery type continuously limits the output current by the current limit value.

When the over-current status finishes and the status of that the output current is less than the current limit value continues for

7.5ms (TYP.) or more, the voltage of FLG pin goes up “H” level again.

The latch off type turns off the power switch transistor after the FLG pin outputs Low level. The off state is maintained

regardless of whether the over-current state is released.

Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage

below the UVLO detected voltage once and after that raising it higher than UVLO released voltage.

By connecting a resistor to the current limit external adjustment pin（I_LIMpin）, the current limit can be set to any value.

By the following equation, the current limit value can be set to any value within a range of 900mA to 2400mA. When the I_LIM

pin is open, the switch transistor is forcibly turned off.

R_ILIM(kΩ) = 57207 / I_LIMIT(T)(mA) - 24.32(kΩ)

R_ILIM: External resistance value I_LIMIT(T): Current limit set value

Table1. Current limit set value

Current limit value

E96 External

when use E96

resistance value

external resistance

(kΩ)

I_LIMIT(T)

(mA)

R_ILIM

(kΩ)

(mA)

900

39.24

32.89

27.69

23.35

19.69

16.54

13.82

11.43

9.33

39.2

33.2

28.0

23.2

19.6

16.5

13.7

11.5

9.31

7.5

901

1000

1100

1200

1300

1400

1500

1600

1700

1800

1900

2000

2100

2200

2300

2400

995

1093

1204

1303

1401

1505

1597

1701

1798

1902

1997

2099

2199

2300

2400

7.46

5.79

5.76

4.32

2.94

1.69

0.549

4.28

2.92

1.68

0.55

I_LIMshorted to V_SS

10/25

XC8108

Series

■OPERATIONAL EXPLANATION (Continued)

<Current limit external adjustment function> (Continued)

Fig1. Current limit set value

XC8108 電流制限設定値－外部抵抗値

XC8108 Current limit set value vs. External resistor

2500

2400

2300

2200

2100

2000

1900

1800

1700

1600

1500

1400

1300

1200

1100

1000

900

800

0

5

10

15

20

25

30

35

40

R_ILIM(kΩ): External resistor

R_ILIM(kΩ) ：外部抵抗値

An internal circuit is built in that prevents reverse current from the V_OUTpin to the V_INpin.

When the difference between input voltage and V_OUTpin voltage is higher than the detect voltage set internally, the reverse

current prevention circuit activates, and the power switch transistor turns off, then the reverse current from the V_OUTpin to the

V_INpin is reduced to 0.1μA (TYP.).

If the reverse-voltage state lasts for 4ms (TYP.), the FLG pin changes to Low level output.

Two types are available for the reverse current prevention circuit: the auto recovery type (product type C) and the latch off

type (product type D). After the reverse current prevention circuit activates and the FLG pin outputs low level, the operation is

different between these two types.

On the auto recovery type, when the output voltage drops below the input voltage, the reverse current prevention circuit stops

immediately, and the power switch transistor turns on again. If the output voltage remains lower than the input voltage for 4ms

(TYP.), the FLG pin returns to High level output.

On the latch off type, the power switch transistor remains in the off state even if the reverse voltage state is released.

Latch operation is released by turning off the IC with the CE pin signal and then restarting, or by lowering the input voltage

below the UVLO detected voltage once and after that raising it higher than UVLO released voltage.

11/25

XC8108 Series

■OPERATIONAL EXPLANATION (Continued)

The flag circuit is built in which monitors the state of the power switch.

The FLG pin outputs Low level when the reverse current prevention function is operating. A resistance of 10kΩ to 100kΩ

is recommended for the FLG pin pull-up resistance.

Auto recovery type (product type C)

Protective function

FLG pin Low level output

Return to FLG pin High level output

Current limiter

Reverse current prevention

Thermal shutdown

7.5ms after over-current detection

4.0ms after reverse voltage detection

Same time as overheat state is detected

7.5ms after over-current release

4.0ms after reverse voltage release

Same time as overheat state is released

Latch off type (product type D)

Protective function

FLG pin Low level output

Return to FLG pin High level output

Current limiter

Reverse current prevention

Thermal shutdown

7.5ms after over-current detection

4.0ms after reverse voltage detection

Same time as overheat state is detected

When latch operation is released

Same time as overheat state is released

12/25

XC8108

Series

■NOTES ON USE

1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or

deteriorated if IC is used beyond the absolute MAX. specifications.

2. Where wiring impedance is high, operations may become unstable due to noise depending on output current.

Please keep the resistance low between V_INand V_SSwiring in particular.

3. Please place the input capacitor (C^IN) and the output capacitor (CL) as close to the IC as possible.

For the input or output capacitor, a capacitance of 1.0μF or higher is recommended.

4. When the voltage which is higher than the maximum input voltage is fed to the V_INpin, and V_OUTis shorted to the V_SSlevel, in

this case the short circuit may cause a fatal impact to operation for the IC. Please use within the operational voltage range.

5. The current limit value can be adjusted by external resistor (R_LIM). The characteristic of the resistor influence the current limit

value, please choose the resistor with small tolerance and temperature coefficient.

6. 80％ of current limit set value is the recommended value of maximum output current.

7. Torex places an importance on improving our products and its reliability.

However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.

13/25

XC8108 Series

■TYPICAL PERFORMANCE CHARACTERISTICS

(1) UVLO detect Voltage vs. Input Voltage

XC8108xx20ER

(2) UVLO release Voltage vs. Input Voltage

XC8108xx20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

3.0

2.5

2.0

1.5

1.0

0.5

0.0

3.0

2.5

2.0

1.5

1.0

0.5

0.0

Ta=105℃

Ta=25℃

Ta=-40℃

Ta=105℃

Ta=25℃

Ta=-40℃

1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10

Input Voltage : V_IN[V]

1.70 1.75 1.80 1.85 1.90 1.95 2.00 2.05 2.10

Input Voltage : V_IN[V]

(3) UVLO threshold Voltage vs. Ambient Temperature

XC8108xx20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

3.0

2.5

2.0

1.5

1.0

UVLO detect

UVLO release

0.5

0.0

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

(4)ꢀStand-by Current vs. Input Voltage

(5)ꢀStand-by Current vs. Ambient Temperature

XC8108xx20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

3.0

Ta=105℃

Istby

2.5

Ta=25℃

2.5

Ta=-40℃

2.0

1.5

1.0

0.5

0.0

1.5

1.0

0.5

0.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

Input Voltage : V_IN[V]

14/25

XC8108

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(6)ꢀSupply Current vs. Input Voltage（sweep up）

(7)ꢀSupply Current vs. Ambient Temperature

XC8108xx20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

V_IN=5.0V, C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

50

45

40

35

30

25

45

40

35

30

25

20

Ta=105℃

15

Ta=25℃

15

10

5

VIN=5.0V

10

Ta=-40℃

5

0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5

0

-50 -25

0

25

50

75 100 125

Input Voltage : V_IN[V]

Ambient Temperature : Ta [℃]

(8)ꢀCE "H" Level Voltage vs. Input Voltage

XC8108xx20ER

(9)ꢀCE "L" Level Voltage vs. Input Voltage

XC8108xx20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

3.0

2.5

2.0

1.5

1.0

0.5

0.0

2.5

2.0

1.5

1.0

Ta=105℃

0.5

Ta=105℃

Ta=25℃

0.0

Ta=-40℃

2.0

0.0

0.5

1.0

1.5

2.0

2.5

0.0

0.5

1.0

1.5

2.5

Input Voltage : V_IN[V]

(10)ꢀCE threshold Voltage vs. Ambient Temperature

XC8108xx20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

3.0

2.5

CE"H"Level

2.0

CE"L"Level

1.5

1.0

0.5

0.0

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

15/25

XC8108 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(11)ꢀOn Resistance vs. Input Voltage

XC8108xx20ER

(12)ꢀOn Resistance vs. Ambient Temperature

XC8108xx20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

180

160

140

120

100

80

180

160

140

120

100

80

VIN=2.5V

60

VIN=3.5V

Ta=105℃

Ta=25℃

Ta=-40℃

40

VIN=4.5V

40

VIN=5.0V

20

VIN=5.5V

0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Voltage : V_IN[V]

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

(13)ꢀturn-on time vs. Input Voltage

XC8108xx20ER

(14)ꢀturn-on time vs. Ambient Temperature

XC8108xx20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.6

0.5

0.4

0.3

VIN=2.5V

Ta=105℃

Ta=25℃

Ta=-40℃

0.2

VIN=3.5V

VIN=4.5V

0.1

VIN=5.0V

VIN=5.5V

0.0

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Voltage : V_IN[V]

-50 -25

0

25 50 75 100 125

Ambient Temperature : Ta [℃]

(15)ꢀturn-off time vs. Input Voltage

XC8108xx20ER

(16)ꢀturn-off time vs. Ambient Temperature

XC8108xx20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

V_IN=4.3V, C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

0.09

0.08

0.07

0.06

0.05

0.04

0.03

0.02

0.01

0.00

0.08

0.07

0.06

0.05

VIN=2.5V

0.04

VIN=3.5V

Ta=105℃

Ta=25℃

Ta=-40℃

VIN=4.5V

VIN=5.0V

VIN=5.5V

0.03

0.02

0.01

0.00

2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0

Input Voltage : V_IN[V]

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

16/25

XC8108

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(17)ꢀFLG delay time over-current

vs. Ambient Temperature

(18)ꢀFLG delay time reverse-voltage

vs. Ambient Temperature

XC8108xx20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

9.0

8.5

8.0

7.5

7.0

6.5

6.0

5.5

5.0

4.5

4.0

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

VIN=2.5V

VIN=3.5V

VIN=4.5V

VIN=5.0V

VIN=5.5V

VIN=2.5V

VIN=3.5V

VIN=4.5V

VIN=5.0V

-50 -25

0

25

50

75 100 125

-50 -25

0

25

50

75 100 125

Ambient Temperature : Ta [℃]

(19)ꢀOutput Voltage vs. Output Current

XC8108xC20ER

XC8108xD20ER

C_IN=1.0μF(ceramic), C_L=1.0μF(ceramic)

6.0

5.0

4.0

3.0

2.0

1.0

0.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

RILIM=39.2kΩ

RILIM=18.4kΩ

RILIM=5.76kΩ

RILIM=0kΩ

RILIM=39.2kΩ

RILIM=18.4kΩ

RILIM=5.76kΩ

RILIM=0kΩ

If the over-current state lasts for 7.5ms,

the latch off type turns off the power switch

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Output Current : I_OUT[A]

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Output Current : I_OUT[A]

(20)ꢀturn-on Delay vs. Rise Time (C_L=1.0μF)

XC8108xx20ER

(21)ꢀturn-oｆｆ Delay vs. Fall Time (C_L=1.0μF)

XC8108xx20ER

V

_CE=5.0V→0V, tf=5μs, R_L=10Ω, Ta=25℃

V

_CE=0V→5.0V, tr=5μs, R_L=10Ω, Ta=25℃

V

_IN=5.0V, C_IN=C_L=1.0μF(ceramic), R_ILIM=18.4kΩ

V_IN=5.0V, C_IN=C_L=1.0μF(ceramic), R_ILIM=18.4kΩ

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

CE Input Voltage

Output Voltage

4.0

2.0

Output Voltage

0.0

CE Input Voltage

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [100μs/div]

17/25

XC8108 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(22)ꢀturn-on Delay vs. Rise Time (C_L=120μF)

(23)ꢀturn-oｆｆ Delay vs. Fall Time (C_L=120μF)

XC8108xx20ER

V_CE=5.0V→0V, tf=5μs, R_L=10Ω, Ta=25℃

V_CE=0V→5.0V, tr=5μs, R_L=10Ω, Ta=25℃

V

_IN=5.0V, C_IN=1.0μF, C_L=120μF(ceramic), R_ILIM=18.4kΩ

V

_IN=5.0V, C_IN=1.0μF, C_L=120μF(ceramic), R_ILIM=18.4kΩ

8.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

6.0

CE Input Voltage

6.0

4.0

Output Voltage

4.0

Output Voltage

2.0

0.0

CE Input Voltage

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [500μs/div]

(24)ꢀShort Circuit Current, Device Enabled Into Short

XC8108xx20ER

V_CE=5.0V→0V, tf=5μs, Ta=25℃

V_CE=0V→5.0V, tr=5μs, Ta=25℃

V

_IN=5.0V, C_IN=1.0μF, C_L=120μF(ceramic), R_ILIM=18.4kΩ

V

_IN=5.0V, C_IN=C_L=1.0μF(ceramic), R_ILIM=18.4kΩ

8.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

CE Input Voltage

6.0

4.0

CE Input Voltage

4.0

2.0

0.0

Output Voltage

Supply Current

Output Voltage

Supply Current

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

-0.5

Time [40μs/div]

（25）ꢀShort-Curcuit Transient Response

(V_OUT=5.0Ω→short, C_L=1.0μF)

（26）ꢀShort-Curcuit Transient Response

(V_OUT=short→5.0Ω, C_L=1.0μF)

XC8108xC20ER

V_IN=5.0V, tf=100μs, Ta=25℃

V_IN=5.0V, tr=100μs, Ta=25℃

FLG=100kΩ, C_IN=C_L=1.0μF(ceramic), R_ILIM=18.4kΩ

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

V_OUT= Removed Short circuit

V_OUT= Short circuit to Vss

4.0

Output Voltage

FLG Voltage

2.0

FLG Voltage

0.0

Output Voltage

Supply Current

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [2ms/div]

18/25

XC8108

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

（27）ꢀShort-Curcuit Transient Response

(V_OUT=open→short, C_L=1.0μF)

（28）ꢀShort-Curcuit Transient Response

(V_OUT=short→open, C_L=1.0μF)

XC8108xC20ER

V_IN=5.0V, tr=100μs, Ta=25℃

V_IN=5.0V, tf=100μs, Ta=25℃

FLG=100kΩ, C_IN=C_L=1.0μF(ceramic), R_ILIM=18.4kΩ

8.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

V_OUT= Removed Short circuit

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

6.0

V_OUT= Short circuit to Vss

4.0

Output Voltage

4.0

FLG Voltage

2.0

FLG Voltage

0.0

Output Voltage

-2.0

-4.0

-2.0

-4.0

-6.0

-8.0

-6.0

Supply Current

-8.0

Time [2ms/div]

（29）ꢀShort-Curcuit Transient Response

(V_OUT=5.0Ω→short, C_L=120μF)

（30）ꢀShort-Curcuit Transient Response

(V_OUT=short→5.0Ω, C_L=120μF)

XC8108xC20ER

V_IN=5.0V, tr=100μs, Ta=25℃

V_IN=5.0V, tf=100μs, Ta=25℃

FLG=100kΩ, C_IN=1.0μF, C_L=120μF(ceramic), R_ILIM=18.4kΩ

8.0

FLG=100kΩ, C_IN=1.0μF, C_L=120μF(ceramic), R_ILIM=18.4kΩ

8.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

V_OUT= Short circuit to Vss

V_OUT= Removed Short circuit

6.0

4.0

2.0

FLG Voltage

Output Voltage

2.0

FLG Voltage

0.0

Output Voltage

Supply Current

-2.0

-4.0

-6.0

-8.0

-4.0

Supply Current

-6.0

-8.0

Time [2ms/div]

（31）ꢀShort-Curcuit Transient Response

(V_OUT=open→short, C_L=120μF)

（32）ꢀShort-Curcuit Transient Response

(V_OUT=short→open, C_L=120μF)

XC8108xC20ER

V_IN=5.0V, tf=100μs, Ta=25℃

V_IN=5.0V, tr=100μs, Ta=25℃

FLG=100kΩ, C_IN=1.0μF, C_L=120μF(ceramic), R_ILIM=18.4kΩ

8.0

3.5

8.0

3.5

V_OUT= Removed Short circuit

V_OUT= Short circuit to Vss

6.0

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

6.0

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

4.0

FLG Voltage

4.0

Output Voltage

2.0

Output Voltage

FLG Voltage

0.0

-2.0

-4.0

-2.0

-4.0

-6.0

Supply Current

-8.0

Time [2ms/div]

19/25

XC8108 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(33)ꢀUVLO Transient Response (C_L=1.0μF)

XC8108xx20ER

V

_IN=5.0V→0V, tf=3ms, Ta=25℃

V_IN=0V→5.0V, tr=3ms, Ta=25℃

R_L=5Ω, C_IN=C_L=1.0μF(ceramic), R_ILIM=18.4kΩ

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

Input Voltage

4.0

2.0

Output Voltage

0.0

Output Voltage

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [500μs/div]

(34)ꢀUVLO Transient Response (C_L=120μF)

XC8108xx20ER

V

_IN=0V→5.0V, tr=3ms, Ta=25℃

V

_IN=5.0V→0V, tf=3ms, Ta=25℃

R_L=5Ω, C_IN=1.0μF, C_L=120μF(ceramic), R_ILIM=18.4kΩ

8.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

8.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

Output Voltage

6.0

4.0

6.0

4.0

Input Voltage

2.0

Output Voltage

0.0

Input Voltage

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [500μs/div]

(35)ꢀReverse Voltage Detected Voltage (C_L=1.0μF)

(36)ꢀReverse Voltage Released Voltage (C_L=1.0μF)

XC8108xC20ER

VIN=5.0V, R_L=5Ω, Ta=25℃

V_IN=5.0V, R_L=5Ω, Ta=25℃

C_IN=C_L=1.0μF(ceramic), R_ILIM=18.4kΩ

8.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

-1.0

-2.0

8.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

-1.0

-2.0

V_OUT=5.5V forced

V_OUT= 5.5V Removed

Output Voltage

Input Voltage

4.0

Input Voltage

2.0

FLG Voltage

0.0

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [500μs/div]

20/25

XC8108

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(37)ꢀReverse Voltage Detected Voltage (C_L=120μF)

(38)ꢀReverse Voltage Released Voltage (C_L=120μF)

XC8108xC20ER

V

_IN=5.0V, Ta=25℃

V

_IN=5.0V, Ta=25℃

C

_IN=1.0μF, C_L=120μF(ceramic), R_ILIM=18.4kΩ

C_IN=1.0μF, C_L=120μF(ceramic), R_ILIM=18.4kΩ

8.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

-1.0

-2.0

8.0

6.0

5.0

4.0

3.0

2.0

1.0

0.0

-1.0

-2.0

V_OUT= 5.5V Removed

Output Voltage

V_OUT=5.5V forced

Output Voltage

Input Voltage

4.0

Input Voltage

2.0

FLG Voltage

0.0

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

Supply Current

Time [500μs/div]

（39）ꢀCE Transient Response

XC8108xx20ER

V_CE=0→5.0V, tr=5μs, Ta=25℃

V

_CE=0→5.0V, tr=5μs, Ta=25℃

V

_IN=5.0V, C_IN=1.0μF, C_L=120μF(ceramic)

V

_IN=5.0V, C_IN=C_L=1.0μF(ceramic)

8.0

6.0

0.035

0.030

0.025

0.020

0.015

0.010

0.005

0.000

-0.005

8.0

6.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-0.5

CE Voltage

4.0

RILIM=39.2kΩ

RILIM=18.4kΩ

RILIM=5.76kΩ

RILIM=0kΩ

2.0

RILIM=39.2kΩ

RILIM=18.4kΩ

RILIM=5.76kΩ

RILIM=0kΩ

2.0

0.0

-2.0

-4.0

-6.0

-8.0

-2.0

-4.0

-6.0

-8.0

In Rush Current

Time [500μs/div]

(40)ꢀShort Applied

(41)ꢀCurrent Limit adapted time

XC8108xx20ER

V_IN=5.0V, Ta=25℃

C_L=open, R_ILIM=18.4kΩ

8.0

14.0

12.0

10.0

8.0

15

14

13

12

11

10

9

V_OUT= Short circuit to Vss

6.0

4.0

2.0

Output Voltage

8

7

0.0

6.0

6

5

4

3

2

1

0

-2.0

-4.0

-6.0

-8.0

4.0

2.0

In Rush Current

0.0

-2.0

0.0

1.0

2.0

3.0

4.0

5.0

6.0

Time [2μs/div]

Peak Limit Current [A]

21/25

XC8108 Series

■PACKAGING INFORMATION

●USP-6C (unit:mm)

1.8±0.05

1pin INDENT

0.05

0.30±0.05

(0.1)

(0.50)

0.20±0.05

0.10±0.05

1.4±0.05

●USP-6C Reference Pattern Layout (unit: mm)

●USP-6C Reference Metal Mask Design (unit: mm)

22/25

XC8108

Series

■PACKAGING INFORMATION (Continued)

●

USP-6C Power Dissipation

Power dissipation data for the USP-6C is shown in this page.

The value of power dissipation varies with the mount board conditions.

Please use this data as the reference data taken in the following condition.

1. Measurement Condition

Condition: Mount on a board

Ambient: Natural convection

Soldering: Lead (Pb) free

Board: Dimensions 40 x 40 mm (1600 mm²in one side)

Copper (Cu) traces occupy 50% of the board area

In top and back faces

Package heat-sink is tied to the copper traces

Material: Glass Epoxy (FR-4)

Thickness: 1.6mm

Through-hole 4 x 0.8 Diameter

Evaluation Board (Unit: mm)

2. Power Dissipation vs. Ambient Temperature (105℃)

Board Mount (Tjmax=125℃)

Ambient Temperature (℃)

Power Dissipation Pd (mW)

Thermal Resistance (℃/W)

25

1000

200

100.00

105

Pd vs. Ta

Pd-Ta特性グラフ

1200

1000

800

600

400

200

0

25

45

65

85

105

125

周囲温度Ta（℃）

Ambient Temperature: Ta (℃)

23/25

XC8108 Series

■MARKING RULE

① represents products series

USP-6C

MARK

Z

PRODUCT SERIES

XC8108******-G

1

2

3

6

② represents product type

5

4

PROTECTION CIRCUIT TYPE

PRODUCT

MARK

CE LOGIC

Active High

Active Low

1

2

3

4

Auto-recovery

Latch-off

XC8108AC****-G

XC8108AD****-G

XC8108BC****-G

XC8108BD****-G

Auto-recovery

Latch-off

③ represents maximum output current

MARK

5

CURRENT (A)

2.0

PRODUCT SERIES

XC8108**20**-G

④⑤ represents production lot number

01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.

(G, I, J, O, Q, W excluded)

* No character inversion used.

24/25

XC8108

Series

1. The products and product specifications contained herein are subject to change without

notice to improve performance characteristics. Consult us, or our representatives

before use, to confirm that the information in this datasheet is up to date.

2. We assume no responsibility for any infringement of patents, patent rights, or other

rights arising from the use of any information and circuitry in this datasheet.

3. Please ensure suitable shipping controls (including fail-safe designs and aging

protection) are in force for equipment employing products listed in this datasheet.

4. The products in this datasheet are not developed, designed, or approved for use with

such equipment whose failure of malfunction can be reasonably expected to directly

endanger the life of, or cause significant injury to, the user.

(e.g. Atomic energy; aerospace; transport; combustion and associated safety

equipment thereof.)

5. Please use the products listed in this datasheet within the specified ranges.

Should you wish to use the products under conditions exceeding the specifications,

please consult us or our representatives.

6. We assume no responsibility for damage or loss due to abnormal use.

prior permission of TOREX SEMICONDUCTOR LTD.

25/25


型号：	XC8108_13
厂家：	Torex Semiconductor
描述：	85mÎ© High Function Power Switch 85mÎ ©高功能电源开关开关电源开关
文件：	总25页 (文件大小：660K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

XC8108_13 [TOREX]

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