XC9142B33DMR-G [TOREX]
IC REG BST 3.3V 0.8A SYNC SOT25;
| 型号： | XC9142B33DMR-G |
| 厂家： | 
Torex Semiconductor |
| 描述： | IC REG BST 3.3V 0.8A SYNC SOT25 |
| 文件： | 总34页 (文件大小：2432K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
XC9141/XC9142 Series
ETR04018-002
Load Disconnection Function, 0.8A Step-up DC/DC Converters
☆GreenOperation-compatible
■GENERAL DESCRIPTION
XC9141/XC9142 series are synchronous step-up DC/DC converters with a 0.3Ω(TYP.) N-channel driver transistor and a
0.3Ω(TYP.) synchronous P-channel switching transistor built-in. A highly efficient and stable current can be supplied up to 0.8A
by reducing ON resistance of the built-in transistors.
The series are able to start operation under the condition which has 0.9V input voltage to generate 3.3V output voltage with a
100Ω load resistor, suitable for mobile equipment using only one Alkaline battery or one Nickel metal hydride battery.
The output voltage can be set from 1.8V to 5.5V (±2.0%) in steps of 0.1V.With the built-in oscillator, either 1.2MHz or 3.0MHz can
be selected for suiting to your particular application.
During the devices enter stand-by mode, A, D types prevent the application malfunction by CL Discharge Function which can
quickly discharge the electric charge at the output capacitor (CL). B, E types is able to drive RTC etc. by Bypass Switch Function
to maintain continuity between the input and output. C, F types is able to connect in parallel with other power supplies by Load
Disconnection Function which breaks continuity between the input and output.
■APPLICATIONS
●Portable equipment
●Beauty & health equipment
●Wearable devices
■FEATURES
Input Voltage Range
Fixed Output Voltage
Oscillation Frequency
Input Current
: 0.65V～6.0V
: 1.8V～5.5V (0.1V increments)
: 1.2MHz (±15%), 3.0MHz (±20%)
: 0.8A
●Game & Hobby
Output Current
: 500mA @VOUT=5.0V, VBAT=3.3V (TYP.)
350mA @VOUT=3.3V, VBAT =1.8V (TYP.)
: PWM (XC9141 Series) or
Auto PWM/PFM (XC9142 Series)
: 100mV@VOUT=3.3V, VBAT =1.8V,
●PC Peripherals
●Devices with 1~3 Alkaline,
1~3 Nickel Hydride, 1 Lithium and 1 Li-ion
Control Mode Selection
Load Transient Response
Protection Circuits
I
OUT=1mA→200mA(tr=5μs)
: Over-current limit
Integral latch method (D,E,F type)
Output short-circuit protection (D,E,F type)
: Soft-start
Functions
Load Disconnection Function (A,C,D,F type)
CL Auto Discharge Function (A,D type)
Bypass Switch Function (B,E type)
: Ceramic Capacitor
Output Capacitor
Operating Ambient Temperature
Package
Environmentally Friendly
: -40℃～+85℃
: SOT-25,USP-6C,WLP-6-01
: EU RoHS Compliant, Pb Free
■
TYPICAL APPLICATION CIRCUIT
■TYPICAL PERFORMANCE
CHARACTERISTICS
XC9141A33C / XC9142A33C
L=4.7μH(LQH5BPN4R7NT0L)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
IN
100
90
L=4.7μH
VOUT
Lx
VOUT
80
70
CL=10μF
CE
60
CE
BAT
VBAT=0.9V
V
V
V
BAT=1.2V
BAT=1.8V
BAT=2.5V
50
40
30
20
10
0
VBAT
GND
C
IN =10μF
solid line : XC9141
dotted line : XC9142
0.1
1
10
100
1000
Output Current : IOUT [mA]
1/34
XC9141/XC9142 Series
■BLOCK DIAGRAM
●XC9141A/XC9142A type
Lx
Load disconnect
Controller
VOUT
Phase
Compensation
CFB
RFB1
Current sense
VOUT
Error Amp.
PWM
comparator
FB
CL
Discharge
PWM/PFM
Controller Logic
RFB2
Buffer
Driver
GND
Vref with
Soft Start
RAMP Wave
Generator
OSC
CE Controller
Logic
CE
VDD
VDD MAX
VOUT
BAT
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
* XC9141 series chooses only PWM control.
●XC9141B/XC9142B type
Lx
Load disconnect
Controller
VOUT
Phase
Compensation
CFB
RFB1
Current sense
VOUT
Error Amp.
PWM
comparator
FB
PWM/PFM
Controller Logic
RFB2
Buffer
Driver
GND
Vref with
Soft Start
RAMP Wave
Generator
OSC
CE Controller
Logic
Bypass SW
CE
VDD
VOUT
VDD MAX
BAT
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
* XC9141 series chooses only PWM control.
●XC9142C type
Lx
Load disconnect
Controller
VOUT
Phase
Compensation
CFB
RFB1
Current sense
VOUT
Error Amp.
PWM
comparator
FB
PWM/PFM
Controller Logic
RFB2
Buffer
Driver
GND
Vref with
Soft Start
RAMP Wave
Generator
OSC
CE Controller
Logic
CE
VDD
VDD MAX
VOUT
BAT
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
2/34
XC9141/XC9142
Series
■BLOCK DIAGRAM (Continued)
●XC9141D/XC9142D type
Lx
Load disconnect
Controller
VOUT
Current sense
Short-circuit protection
Latch Timer
Phase
Compensation
CFB
RFB1
VOUT
Error Amp.
PWM
comparator
FB
CL
Discharge
PWM/PFM
Controller Logic
RFB2
Buffer
Driver
GND
Vref with
Soft Start
RAMP Wave
Generator
OSC
CE Controller
Logic
CE
VDD
VDD MAX
VOUT
BAT
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
* XC9141 series chooses only PWM control.
●XC9141E/XC9142E type
Lx
Load disconnect
Controller
VOUT
Current sense
Short-circuit protection
Latch Timer
Phase
Compensation
CFB
RFB1
VOUT
Error Amp.
PWM
comparator
FB
PWM/PFM
Controller Logic
RFB2
Buffer
Driver
GND
Vref with
Soft Start
RAMP Wave
Generator
OSC
CE Controller
Logic
Bypass SW
CE
VDD
VOUT
VDD MAX
BAT
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
* XC9141 series chooses only PWM control.
●XC9142F type
Lx
Load disconnect
Controller
VOUT
Current sense
Short-circuit protection
Latch Timer
Phase
Compensation
CFB
RFB1
VOUT
Error Amp.
PWM
comparator
FB
PWM/PFM
Controller Logic
RFB2
Buffer
Driver
GND
Vref with
Soft Start
RAMP Wave
Generator
OSC
CE Controller
Logic
CE
VDD
VDD MAX
VOUT
BAT
* Diodes inside the circuits are ESD protection diodes and parasitic diodes
3/34
XC9141/XC9142 Series
■PRODUCT CLASSIFICATION
●Ordering Information
XC9141①②③④⑤⑥-⑦ PWM control
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
A
B
D
E
①
Type
Refer to Selection Guide
Output Voltage
(XC9141A,B Type)
Output Voltage
18～55
22～55
Output voltage options e.g. 1.8V → ②=1, ③=8
Output voltage options e.g. 2.2V → ②=2, ③=2
②③
④
(XC9141D,E Type)
C
1.2MHz
Oscillation Frequency
Packages (Order Unit)
D
3.0MHz
MR-G
ER-G
0R-G
SOT-25 (3,000pcs/Reel)
USP-6C (3,000pcs/Reel)
WLP-6-01 (5,000pcs/Reel)
(*1)
⑤⑥-⑦
(*1) The ”-G” suffix indicates that the products are Halogen and Antimony free as well as being fully EU RoHS compliant.
XC9142①②③④⑤⑥-⑦ PWM/PFM automatic switching control
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
A
B
C
D
E
F
①
Type
Refer to Selection Guide
Output Voltage
(XC9142A,B,C Type)
Output Voltage
18～55
22～55
Output voltage options e.g. 1.8V → ②=1, ③=8
Output voltage options e.g. 2.2V → ②=2, ③=2
②③
④
(XC9142D,E,F Type)
C
1.2MHz
Oscillation Frequency
Packages (Order Unit)
D
3.0MHz
MR-G
ER-G
0R-G
SOT-25 (3,000pcs/Reel)
USP-6C (3,000pcs/Reel)
WLP-6-01 (5,000pcs/Reel)
(*1)
⑤⑥-⑦
(*1) The ”-G” suffix indicates that the products are Halogen and Antimony free as well as being fully EU RoHS compliant.
4/34
XC9141/XC9142
Series
■PRODUCT CLASSIFICATION (Continued)
●Selection guides
SHORT
SHUTDOWN
OPTIONS
AT CE=L
OUTPUT
CHIP
SOFT-
START
CURRENT
LIMIT
C AUTO-
L
TYPE
PROTECTION
WITH LATCH
VOLTAGE
ENABLE
DISCHARGE
Yes
(without latch )
Yes
Complete Output
Disconnect(*2)
Input-to-Output
Bypass(*2)
Fixed
Fixed
Fixed
Fixed
Fixed
Fixed
Yes
Yes
Yes
Yes
Yes
Yes
Fixed
Fixed
Fixed
Fixed
Fixed
Fixed
No
No
Yes
No
No
Yes
No
No
A
B
(without latch )
Yes
Complete Output
Disconnect(*3)
Complete Output
Disconnect(*2)
Input-to-Output
Bypass(*2)
C(*1)
D
No
(without latch )
Yes
Yes
Yes
Yes
(with integral latch)
Yes
E
(with integral latch)
Yes
Complete Output
Disconnect(*3)
F(*1)
(with integral latch)
(*1) Type C,F is available for the XC9142 series only.
(*2)
V
V
pin can not be connected to the different output pin such as another supply (AC adaptor).
pin can be connected to the different output pin such as another supply (AC adaptor).
OUT
(*3)
OUT
5/34
XC9141/XC9142 Series
■PIN CONFIGURATION
VOUT
4
Lx
5
1 BAT
VOUT
6
3 CE
4
GND
Lx 5
VOUT
2 GND
1 BAT
2 GND
3 CE
Lx 5
6
4
GND
1
2
3
CE
GND BAT
SOT-25
WLP-6-01
（BOTTOM VIEW）
USP-6C
（BOTTOM VIEW）
（TOP VIEW）
*The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and
metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to
other pins, it should be connected to the GND (No.2, 4) pin.
■PIN ASSIGNMENT
PIN NUMBER
USP-6C
PIN NAME
FUNCTIONS
SOT-25
WLP-6-01
1
2
3
4
5
-
3
2
1
6
5
4
3
2
1
6
5
4
CE
GND
BAT
VOUT
Lx
Chip Enable
Ground
Power Input
Output Voltage
Switching
GND
Ground
■FUNCTION CHART
PIN NAME
SIGNAL
STATUS
L
Stand-by
Active
CE
H
* Do not leave the CE pin open.
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
SYMBOL
VBAT
RATINGS
UNITS
BAT Pin Voltage
-0.3～+7.0
V
V
Lx Pin Voltage
VLx
-0.3～+7.0
-0.3～+7.0
VOUT Pin Voltage
CE Pin Voltage
VOUT
VCE
V
V
-0.3～+7.0
SOT-25
600 (PCB mounted)
1000 (PCB mounted)
700 (PCB mounted)
USP-6C
Power Dissipation
Pd
mW
WLP-6-01
Operating Ambient Temperature
Storage Temperature
Topr
Tstg
-40～+85
℃
℃
-55～+125
*GND are standard voltage for all of the voltage.
6/34
XC9141/XC9142
Series
■ELECTRICAL CHARACTERISTICS
●XC9141/XC9142 Series
Ta=25℃
PARAMETER
Input Voltage
SYMBOL
VBAT
CONDITIONS
MIN.
-
TYP.
-
MAX.
UNITS CIRCUIT
6.0
V
V
①
⑤
Voltage to start oscillation while
Output Voltage
VOUT
<E-1>
<E-2>
<E-3>
VOUT=VOUT(T) ×1.03→VOUT(T) ×0.97
Operation Start Voltage
Operation Hold Voltage
VST1
VHLD
RL=1kΩ
RL=1kΩ
-
-
-
0.90
-
V
V
①
①
0.65
fOSC=1.2MHz
-
-
17.0
26.0
30.0
40.0
Quiescent Current
(XC9142)
Iq
VOUT=VBAT= VOUT(T)+0.5V
VOUT=VBAT= VOUT(T)-0.2V
μA
③
fOSC=3.0MHz
fOSC=1.2MHz
fOSC=3.0MHz
fOSC=1.2MHz
fOSC=3.0MHz
fOSC=1.2MHz
fOSC=3.0MHz
-
-
<E-4>
<E-5>
1.20
3.00
93
1.500
3.000
1.38
3.60
98
Supply Current
IDD
fOSC
DMAX
mA
MHz
%
③
①
⑤
1.02
2.40
85
88
-
VBAT= VOUT(T)×0.5
IOUT=100mA
Oscillation Frequency
Maximum Duty Cycle
VBAT=1.2V,
VOUT= VOUT(T)-0.2V
93
98
Minimum Duty Cycle
DMIN
IPFM
VOUT=VBAT= VOUT(T)+0.5V
VBAT=1.5V,
-
0
%
⑤
①
PFM Switching Current
-
165
230
mA
RL is selected with VOUT(T), Refer to Table 1.
VBAT= VOUT(T)×0.6,
Efficiency
EFFI
EFFI
-
-
-
86(*3)
90(*3)
0.0
-
-
①
①
⑦
（XC9142）
RL is selected with VOUT(T), Refer to Table 1.
%
Efficiency
VBAT= VOUT(T)×0.6, IOUT= 100mA
A,B,D,E
1.0
Stand-by Current
ISTB
VBAT=VLx=6.0V,VCE=0.0V(*1)
Type
μA
C,F Type
-
-
1.0
2.4
-
⑧
④
Lx SW "Pch" ON
Resistance
RLXP
VBAT=VLx= 6.0V, IOUT=200mA
0.3(*2)
Ω
Ω
Lx SW "Nch" ON
Resistance
RLXN
-
-
-
0.3(*3)
0.0
-
①
A,B,D,E
⑦
⑧
②
Lx SW”H” Leakage
Current
V
BAT=6.0V,VCE=0.0V,
Type
ILXLH
1.0
μA
VLx=6.0V(*1)
C,F Type
Lx SW”L” Leakage
ILXLL
ILIM
VBAT=0.0V,VCE=0.0V,VLx=0.0V,VOUT=6.0V
0.0
1.0
μA
Current （XC9142C/F）
Current Limit
VBAT= VOUT(T)-0.2V, RLx=1Ω
VBAT= VOUT(T)-0.2V, RLx=1Ω,
<E-6>
45
<E-7>
300
<E-8>
725
A
⑥
⑥
f
OSC=1.2MHz
μs
Integral Latch Time
(D,E,F Type)
tLAT
Time from current limit start
to stop Lx oscillation
fOSC=3.0MHz
25
100
1.2
365
1.5
μs
⑥
①
After the integral latch was operated,
Latch Release Voltage
(D,E,F Type)
VLAT_R
RL is selected with VOUT(T), Refer to Table 1
0.9
V
V
V
BAT=VOUT(T)-0.2V→0.9V
BAT=VOUT(T)-0.2V, RL=0Ω
Short-circuit Protection
Threshold Voltage
(D,E,F Type)
(*3)
VSHORT
-
VBAT
-
V
①
7/34
XC9141/XC9142 Series
■ELECTRICAL CHARACTERISTICS (Continued)
PARAMETER
SYMBOL
CONDITIONS
MIN. TYP. MAX. UNITS CIRCUIT
V
V
BAT= VOUT(T)×0.6,
OUT=VOUT(T)× 0.9,
f
OSC=1.2MHz
0.6
0.2
1.0
0.5
2.5
1.0
Soft-Start Time
tSS
After "H" is fed to CE,
the time by when clocks are
generated at Lx pin.
ms
⑤
fOSC=3.0MHz
CL Discharge Resistance
(A Type)
RDCHG
VBAT= 3.3V,VOUT=3.3V,VCE=0.0V
VBAT= 3.3V,VOUT=0.0V,VCE=0.0V
100
100
180
180
400
400
Ω
Ω
②
②
Bypass SW Resistance
(B Type)
RBSW
V
OUT= VOUT(T)-0.15V, Applied voltage to VCE
,
CE ”H” Voltage
VCEH
0.80
-
-
6.00
0.20
V
V
⑤
⑤
Voltage changes Lx to be generated.
V
OUT= VOUT(T)-0.15V, Applied voltage to VCE
,
CE ”L” Voltage
CE ”H” Current
VCEL
GND
Voltage changes Lx to“H” level.
ICEH
ICEL
VBAT=6.0V,VOUT=6.0V, VLx=6.0V, VCE=6.0V
VBAT=6.0V,VOUT=6.0V, VLx=6.0V, VCE=0.0V
-0.1
-0.1
-
-
0.1
0.1
μA
μA
②
②
CE ”L” Current
VOUT(T) = Target voltage
Test Conditions: unless otherwise stated, VBAT=1.5V, Vce=3.3V, Lx: OPEN, RLx=56Ω
(*1)
XC9141A/D,XC9142A/D,XC9142C/F type: VOUT=0V,
XC9141B/E,XC9142B/E type: VOUT=OPEN
(*2)
Design value for the XC9142C/F type.
(*3)
Designed value
Table 1. External Components RL Table
VOUT(T)
RL
UNITS:V
UNITS：Ω
1.8≦VOUT(T)<2.1
2.1≦VOUT(T)<3.1
3.1≦VOUT(T)<4.3
4.3≦VOUT(T)≦5.5
150
220
330
470
8/34
XC9141/XC9142
Series
■ELECTRICAL CHARACTERISTICS (Continued)
Table 2: SPEC Table
IDD
NOMINAL
OUTPUT
VOLTAGE
UNITS
VOUT
ILIM
fOSC=1.2MHz fOSC=3.0MHz
<E-1>
V
<E-2>
V
<E-3>
V
<E-4>
mA
<E-5>
mA
<E-6>
A
<E-7>
A
<E-8>
A
VOUT(T)
MIN.
TYP.
MAX.
TYP.
TYP.
MIN.
TYP.
MAX.
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
1.764
1.862
1.960
2.058
2.156
2.254
2.352
2.450
2.548
2.646
2.744
2.842
2.940
3.038
3.136
3.234
3.332
3.430
3.528
3.626
3.724
3.822
3.920
4.018
4.116
4.214
4.312
4.410
4.508
4.606
4.704
4.802
4.900
4.998
5.096
5.194
5.292
5.390
1.800
1.900
2.000
2.100
2.200
2.300
2.400
2.500
2.600
2.700
2.800
2.900
3.000
3.100
3.200
3.300
3.400
3.500
3.600
3.700
3.800
3.900
4.000
4.100
4.200
4.300
4.400
4.500
4.600
4.700
4.800
4.900
5.000
5.100
5.200
5.300
5.400
5.500
1.836
1.938
2.040
2.142
2.244
2.346
2.448
2.550
2.652
2.754
2.856
2.958
3.060
3.162
3.264
3.366
3.468
3.570
3.672
3.774
3.876
3.978
4.080
4.182
4.284
4.386
4.488
4.590
4.692
4.794
4.896
4.998
5.100
5.202
5.304
5.406
5.508
5.610
0.263
0.279
0.296
0.312
0.328
0.344
0.360
0.376
0.393
0.409
0.425
0.441
0.457
0.474
0.490
0.506
0.522
0.538
0.554
0.571
0.587
0.603
0.619
0.635
0.652
0.668
0.684
0.700
0.716
0.732
0.749
0.765
0.781
0.797
0.813
0.829
0.846
0.862
0.583
0.614
0.644
0.675
0.705
0.736
0.767
0.797
0.828
0.858
0.889
0.919
0.950
0.981
1.011
1.042
1.072
1.103
1.134
1.164
1.195
1.225
1.256
1.286
1.317
1.348
1.378
1.409
1.439
1.470
1.501
1.531
1.562
1.592
1.623
1.653
1.684
1.715
-
0.96
1.00
1.04
1.07
1.11
1.14
1.17
1.19
1.22
1.24
1.26
1.28
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
1.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
2.30
-
-
-
-
-
-
-
-
-
-
-
0.96
0.97
0.97
0.98
0.98
0.99
0.99
1.00
1.00
1.01
1.01
1.02
1.02
1.03
1.03
1.04
1.04
1.05
1.06
1.06
1.07
1.07
1.08
1.08
1.09
1.09
9/34
XC9141/XC9142 Series
■TEST CIRCUITS
<
Circuit No.①
>
<
Circuit No.②
>
Wave Form Measure Point
IOUT
VOUT
Lx
A
VOUT
Lx
A
ILXLL
ICEH
L
A
BAT
CE
A
A
V
BAT
RL
CE
A
CL
GND
GND
ICEL
V
CIN
※External Components
ꢀCIN : 10μF( ceramic )
ꢀCL : 10μF( ceramic )
XC914xxxxC (fOSC = 1.2MHz)
ꢀL : 4.7μH
XC914xxxxD (fOSC = 3.0MHz)
ꢀL : 2.2μH
<
Circuit No.③
>
<
Circuit No.④ >
V
VOUT
VOUT
Lx
Lx
A
BAT
BAT
IOUT
CE
CE
A
GND
GND
<
Circuit No.⑤
>
<
Circuit No.⑥ >
Wave Form Measure Point
Wave Form Measure Point
Wave Form Measure Point
VOUT
VOUT
Lx
Lx
RLx=1Ω
RLx=56Ω
BAT
BAT
CE
CE
GND
GND
<
Circuit No.⑦
>
<
Circuit No.⑧
>
VOUT
VOUT
Lx
Lx
IST B
IST B
A
A
BAT
BAT
CE
ILXLH
CE
A
A
ILXLH
GND
GND
10/34
XC9141/XC9142
Series
■TYPICAL APPLICATION CIRCUIT
L
VOUT
VOUT
Lx
VBA T
BAT
CE
CL
CE
GND
CIN
【Typical Examples】fOSC=1.2MHz
MANUFACTURER
PRODUCT NUMBER
VALUE
murata
LQH5BPN4R7NT0L
LTF5022T-4R7N2R0-LC
XFL4020-472MEC
4.7μH
4.7μH
4.7μH
L
TDK
Coilcraft
murata
murata
GRM188R60J106ME84
GRM188D71A106MA73
10μF/6.3V(*2)
10μF/10V(*2)
(*1)
CL
【Typical Examples】fOSC=3.0MHz
MANUFACTURER
PRODUCT NUMBER
LTF5022T-2R2N3R2-LC
XFL4020-222MEC
VALUE
2.2μH
2.2μH
TDK
L
Coilcraft
murata
GRM188R60J106ME84
GRM188D71A106MA73
10μF/6.3V(*2)
10μF/10V(*2)
(*1)
CL
murata
【Typical Examples】fOSC=1.2MHz, fOSC=3.0MHz
MANUFACTURER
murata
PRODUCT NUMBER
VALUE
10μF/6.3V
10μF/10V
GRM188R60J106ME84
GRM188D71A106MA73
(*1)
CIN
murata
(*1)
(*2)
Select components appropriate to the usage conditions (ambient temperature, input & output voltage).
While selecting a part, please concern about capacitance reduction and voltage durability.
In the case of fosc=1.2MHz: If VOUT(T)≧3.5V and the load current rises above 200mA, use two or more in a parallel connection.
In the case of fosc=3.0MHz: If VBAT≧2V, VOUT(T)≧3.5V and the load current rises above 200mA, use two or more in a parallel connection.
For the actual load capacitance, use a ceramic capacitor that ensures a capacitance equivalent to or greater than the GRM188R60J106ME84
(Murata).
If using tantalum or low ESR electrolytic capacitors please be aware that ripple voltage will be higher due to the larger ESR (Equivalent Series
Resistance) values of those types of capacitors. Please also note that the IC’s operation may become unstable with such capacitors so that
we recommend to test on the board before usage.
If using electrolytic capacitor for the CL, please connect a ceramic capacitor in parallel.
11/34
XC9141/XC9142 Series
■OPERATIONAL EXPLANATION
The XC9141/XC9142 series consists of a reference voltage source, ramp wave circuit, error amplifier, PWM comparator, phase compensation
circuit, N-channel driver transistor, P-channel synchronous rectification switching transistor and current limiter circuit.
Lx
Load disconnect
Controller
VOUT
Phase
Compensation
CFB
RFB1
Current sense
VOUT
Error Amp.
PWM
comparator
FB
CL
Discharge
PWM/PFM
Controller Logic
RFB2
Buffer
Driver
GND
Vref with
Soft Start
RAMP Wave
Generator
OSC
CE Controller
Logic
Bypass SW
CE
VDD
VDD MAX
VOUT
BAT
BLOCK DIAGRAM
The error amplifier compares the internal reference voltage with the resistors RFB1 and RFB2. Phase compensation is performed on the
resulting error amplifier output, to input a signal to the PWM comparator to determine the turn-on time of the N-channel driver transistor during
PWM operation. The PWM comparator compares, in terms of voltage level, the signal from the error amplifier with the ramp wave from the ramp
wave circuit, and delivers the resulting output to the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is
continuously performed to ensure stable output voltage. The current feedback circuit monitors the N-channel driver transistor’s turn-on current
for each switching operation, and modulates the error amplifier output signal to provide multiple feedback signals. This enables a stable feedback
loop even when a low ESR capacitor, such as a ceramic capacitor, is used, ensuring stable output voltage.
<Reference voltage source, soft start function>
The reference voltage forms a reference that is used to stabilize the output voltage of the IC.
After “H” level is fed to CE pin, the reference voltage connected to the error amp increases linearly during the soft start interval. This allows the
voltage divided by the internal RFB1 and RFB2 resistors and the reference voltage to be controlled in a balanced manner, and the output voltage
rises in proportion to the rise in the reference voltage. This operation prevents rush input current and enables the output voltage to rise smoothly.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally at 1.2MHz/3.0MHz. The Clock generated is
used to produce ramp waveforms needed for PWM operation, and to synchronize all the internal circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by
the internal resistors (RFB1 and RFB2). When the FB is lower than the reference voltage, output voltage of the error amplifier increases. The
gain and frequency characteristics of the error amplifier are optimized internally.
<VDDMAX
>
V
DD MAX circuit compares the input voltage and the output voltage then it will select the higher one as the power supply for the IC.
<Shutdown function, load disconnection function>
The IC enters chip disable state by applying low level voltage to the CE pin. At this time, the N-channel and P-channel synchronous switching
transistors are turned OFF. With XC9142C type, the load disconnection function activates even during shutdown, and because the input voltage
VBAT and output voltage VOUT are compared to optimally control the orientation of the parasitic diode of the P-channel synchronous switching
transistor, a parallel connection with other power supplies is possible. With the XC9141 series and XC9142A/B types, the orientation of the
parasitic diode of the P-channel synchronous switching transistor is fixed at anode: VOUT and cathode: Lx during shutdown to break conduction
from the input side to the output side by the parasitic diode of the P-channel synchronous switching transistor.
<PWM/PFM control circuit>
When PFM operates, the N-channel driver transistor turns on at the timing of the signal sent from the PWM comparator. The N-channel driver
transistor remains on until the current in the coil reaches a constant current (IPFM). The PWM/PFM control circuit compares the signal sent from
the PWM comparator to the time it takes the current in the coil to reach a constant current (IPFM), and outputs the pulse that results in a longer on-
time of the N-channel driver transistor. This enables smooth switching between PWM and PFM. The XC9141 series directly outputs the signal
that is sent from the PWM comparator.
12/34
XC9141/XC9142
Series
■OPERATIONAL EXPLANATION (Continued)
<Maximum current limit function, short-circuit protection>
The maximum current limit function of XC9141A/B types and XC9142A/B/C types constantly monitors the current flowing in the N-channel driver
transistor connected to the Lx pin, and if the current in the N-channel driver transistor exceeds the current limit, the function turns off the N-channel
driver transistor. (Please refer to Fig. ILIM①)
①
If the current flowing in the N-channel driver transistor exceeds the current limit value (equivalent to the peak coil current), the N-channel
driver transistor turns off, and remains off during the clock interval.
②
At the next clock, the N-channel driver transistor turns on.
If overcurrent continues, ① and ② are repeated.
Note that the current in the internal N-channel driver transistor is not the same as the output current IOUT
.
tSS
VOUT(T)
VBAT
VOUT
ILIM
ILx
RL
CE
①②
①②
Fig. ILIM
The maximum current limit function of XC9141D/E and XC9142D/E/F types monitors the current that flows in the N-channel driver transistor
connected to the Lx pin, and consists of both maximum current limiting and a latch function. (Please refer to Fig.ILIM②)
Short-circuit protection is a latch-stop function that activates when the output voltage drops below the short-circuit protection threshold voltage in
the overcurrent state. (Please refer to Fig.ILIM③)
①
②
③
If the current flowing in the N-channel driver transistor exceeds the current limit value (equivalent to the peak coil current), the N-channel
driver transistor turns off, and remains off during the clock interval. In addition, an integral latch timer starts the count.
The N-channel driver transistor turns on at the next pulse. If in the overcurrent state at this time, the N-channel driver transistor turns off as
in (1). The integral latch timer continues the count.
If the count of the integral latch timer continues for 300μs typ.(@fosc=1.2MHz), a function that latches the N-channel driver transistor and P-
channel synchronous switching transistor to the off state activates.
④
If no longer in the overcurrent state at the next pulse, normal operation resumes. The integral latch timer stops the count.
⑤
⑥
⑦
If the output voltage VOUT drops below the shrt-circuprotectiothhold voltge VSHORT during the count of the integral latch timer, a
function that latches the N-channel driver transistor and P-channl sychronous switching transistor in the off state activates. The short-
circuit protection threshold voltage VSHORT is a threshold voltage that is linked to the input voltage VBAT
.
In the latched state, either restart by shutting down once with the CE pin, or resume operation by lowering the input voltage VBAT below the
latch release voltage VLAT_R(1.2V typ.). The soft start function operates during restart. During the soft-start interval tSS, the integral latch timer
and latch function are stopped.
When the input voltage VBAT is below the latch release voltage VLAT_R(1.2V typ.), the integral latch timer and latch function stop, but the current
limiting function continues operating.
* Note that the current in the internal N-channel driver transistor is not the same as the output current IOUT
.
Limit<300μs Typ.
(@fosc=1.2MHz)
VOUT
VBAT
VSHORT=VBAT
VLAT_R
ILIM
ILx
RL
0Ω
Latch
Timer
Latch
②
⑦
①
⑤
⑥
Fig. ILIM
③
13/34
XC9141/XC9142 Series
■OPERATIONAL EXPLANATION (Continued)
<CL Discharge>
The XC9141A/D type and XC9142A/D type can discharge the electric charge at the output capacitor (CL) when a low signal to the CE pin which
enables a whole IC circuit put into OFF state, is inputted via the N-channel transistor located between the VOUT pin and the GND pin. When the IC
is disabled, electric charge at the output capacitor (CL) is quickly discharged so that it may avoid application malfunction. Discharge time of the
output capacitor (CL) is set by the CL auto-discharge resistance (R) and the output capacitor (CL). By setting time constant of a CL auto-discharge
resistance value [RDCHG] and an output capacitor value (CL) as τ(τ= CL x RDCHG), discharge time of the output voltage after discharge via the N
channel transistor is calculated by the following formulas. However, the CL discharge resistance [RDCHG] is depends on the VBAT or VOUT. We
recommend that you fully check actual performance.
V = VOUT x e -t / τ or t = τ x ln (VOUT / V)
V
: Output voltage after discharge
VOUT(T) : Target voltage
t
: Discharge time
: CL×RDCHG
τ
CL : Capacitance of Output capacitor (CL)
RDCHG : CL Discharge resistance, it depends on supply voltage
Output Voltage Discharge characteristics
RDCHG = 180Ω(TYP) CL=10μF
VOUT(T) = 5.5V,VBAT=2.0V
VOUT(T) = 3.3V,VBAT=2.0V
VOUT(T) = 1.8V,VBAT=1.0V
<Bypass switch>
At shutdown, XC9141B/E type and XC9142B/E type conduct between the BAT pin and VOUT pin by means of a bypass switch. If the output is
shorted to ground, the current is limited by the resistance (RBSW) of the bypass switch.
14/34
XC9141/XC9142
Series
■NOTE ON USE
1)
For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated if IC is used
beyond the absolute maximum ratings.
2)
Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by external component
selection, such as the coil inductance, capacitance values, and board layout of external components. Once the design has been completed,
verification with actual components should be done.
3)
The DC/DC converter performance is greatly influenced by not only the ICs' characteristics, but also by those of the external components.
Care must be taken when selecting the external components. Especially for CL load capacitor, it is recommended to use type B capacitors
(JIS regulation) or X7R, X5R capacitors (EIA regulation).
4)
5)
6)
7)
Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause the IC
operation to become unstable, so reinforce the area around the GND pin of the IC in particular.
Please mount each external component as close to the IC as possible. Also, please make traces thick and short to reduce the circuit
impedance.
With regard to the current limiting value (ILIM), the actual coil current may at times exceed the electrical characteristics due to propagation
delay inside the product.
The CE pin is a CMOS input pin. Do not use with the pin open. If connecting to the BAT pin or ground pin, use the resistor which is 1MΩ or
less. To prevent malfunctioning of the device connected to this product or the input/output due to short circuiting between pins, it is
recommended that a resistor be connected.
8)
9)
In case of connecting to another power supply as shown in below circuit diagram, please use the XC9142C/F type. Connecting another
external power supply to the output of any other type may destroy the IC.
The maximum current limiter controls the limit of the N-channel driver transistor by monitoring current flow. This function does not limit the
current flow of the P-channel synchronous transistor. When used with the condition VBAT > VOUT (input voltage higher than the output voltage),
the IC may be destroyed if overcurrent flows to the P-channel synchronous switching transistor due to short-circuiting of the load or other
reason.
10) When the device is used in high step-up ratio, the current limit function may not work during excessive load current. In this case, the
maximum duty cycle limits maximum current. In this event, latching may not take place on XC9141D/E types and XC9142D/E/F types (“latch
types” below) because the maximum current limit cannot be detected.
11) On latch types, some board conditions may cause release from the maximum current limit, and the integrated latch time may become longer
or latching may not take place.
12) If the status heavy load and large output capacitor is connected or the input voltage is low, the output voltage may overshoot, on XC9141A/B
types and XC9142A/B/C types(“non-latch types” below). On a latch type, the maximum current limit may be detected, and this will cause
the latch function to activate and stop operation after the soft start time elapses. In particular, note that the soft start time becomes shorter
when the IC is used at high temperatures.
13) When the step-up voltage difference is small, the XC9141 series for PWM control may oscillate intermittently.
14) When the voltage boost difference is small, the current limiting function may not operate if the on time of the N-channel driver transistor is
shorter than the propagation delay time of the current limit circuit. In this case, latching may not take place on a latch type because the
maximum current limit is not detected.
15) When an XC9142C/F type is used with VBAT > VOUT(T) (input voltage higher than the set output voltage), the P-channel synchronous switching
transistor turns off but current flows to the parasitic diode. This causes excessive heat generation in the IC. Test using the actual equipment
and note the power dissipation and heat dissipation of the package. During voltage boosting with a voltage drop due to VF of the parasitic
diode, the output voltage may become unstable. On the XC9141 series and XC9142A/B/D/E types, the P-channel synchronous switching
transistor turns on and the output voltage becomes equal to the input voltage. In environments where VBAT > VOUT（T）, the XC9141 series and
XC9142A/B/D/E types are recommended.
16) When input voltage and output voltage are low, integral latch function and short-circuit protection may not operate.
We recommend that you fully check actual performance.
17) TOREX places an importance on improving our products and its reliability. However, by any possibility, we would request user fail-safe
design and post-aging treatment on system or equipment.
15/34
XC9141/XC9142 Series
■NOTE ON USE (Continued)
Instructions for pattern layouts
1.
In order to stabilize VBAT voltage level, we recommend that a by-pass capacitor CIN is connected as close as possible to the BAT and
GND pins.
2.
3.
4.
Please mount each external component as close to the IC as possible.
Place external components as close to the IC as possible and use thick and short traces to reduce the circuit impedance.
Make sure that the PCB GND traces are thick and wide as possible. GND voltage level fluctuation created by high ground current at
the time of switching may cause instability of the IC.
5.
The internal driver transistors bring on heat because of the IIN current and ON resistance of the driver transistors.
＜Example of pattern layout＞
SOT-25
PCB mounted
1st layer
1st layer
1st layer
2nd layer
2nd layer
2nd layer
USP-6C
PCB mounted
WLP-6-01
PCB mounted
6.
Note on mounting (WLP-6-01)
6-1. Mount pad design should be optimized for user's conditions.
6-2. Sn-AG-Cu is used for the package terminals. If eutectic solder is used, mounting reliability is decreased. Please do not
use eutectic solder paste.
6-3. When underfill agent is used to increase interfacial bonding strength, please take enough evaluation for selection. Some
underfill materials and applied conditions may decrease bonding reliability.
6-4. The IC has exposed surface of silicon material in the top marking face and sides so that it is weak against mechanical
damages. Please take care of handling to avoid cracks and breaks.
6-5. The IC has exposed surface of silicon material in the top marking face and sides. Please use the IC with keeping the circuit
open (avoiding short-circuit from the out).
6-6. Semi-transparent resin is coated on the circuit face of the package. Please be noted that the usage under strong lights may
affects device performance.
16/34
XC9141/XC9142
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
ꢀ
ꢀ
XC9141x18C / XC9142x18C
L=4.7μH(LQH5BPN4R7NT0L)
XC9141x18D / XC9142x18D
L=2.2μH(LQH5BPN2R2NT0L)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
IN
IN
100
90
80
70
60
100
90
80
70
60
VBAT=0.9V
BAT=1.2V
VBAT=1.5V
VBAT=0.9V
50
50
V
VBAT=1.2V
VBAT=1.5V
40
30
20
10
0
40
30
20
solid line : XC9141
dotted line : XC9142
solid line : XC9141
dotted line : XC9142
10
0
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current : IOUT [mA]
Output Current : IOUT [mA]
XC9141x33C / XC9142x33C
XC9141x33D / XC9142x33D
L=4.7μH(LQH5BPN4R7NT0L)
L=2.2μH(LTF5022T2R2)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
IN
IN
100
90
100
90
80
80
70
70
60
60
VBAT=0.9V
VBAT=1.2V
VBAT=1.8V
VBAT=2.5V
VBAT=0.9V
VBAT=1.2V
50
50
40
30
20
10
0
V
BAT=1.8V
40
30
20
10
0
VBAT=2.5V
solid line : XC9141
dotted line : XC9142
solid line : XC9141
dotted line : XC9142
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current : IOUT [mA]
Output Current : IOUT [mA]
XC9141x50C / XC9142x50C
XC9141x50D / XC9142x50D
L=4.7μH(LTF5022T4R7)
L=2.2μH(LTF5022T2R2)
C =10μF(GRM188R60J106M),CL=20μF(GRM188R60J106M x 2)
C =10μF(GRM188R60J106M),CL=20μF(GRM188R60J106M x 2)
IN
IN
100
90
100
90
80
80
70
70
60
60
VBAT=1.2V
VBAT=1.8V
VBAT=1.2V
VBAT=1.8V
50
40
30
20
10
0
50
40
30
20
10
0
VBAT=2.5V
V
BAT=2.5V
V
BAT=3.7V
VBAT=4.2V
V
BAT=3.7V
VBAT=4.2V
solid line : XC9141
dotted line : XC9142
solid line : XC9141
dotted line : XC9142
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current : IOUT [mA]
Output Current : IOUT [mA]
17/34
XC9141/XC9142 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Output Current
ꢀ
ꢀ
XC9141x18C / XC9142x18C
L=4.7μH(LQH5BPN4R7NT0L)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
XC9141x18D / XC9142x18D
L=2.2μH(LQH5BPN2R2NT0L)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
IN
IN
1.90
1.90
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
VBAT=0.9, 1.2, 1.5V
VBAT=0.9, 1.2, 1.5V
solid line : XC9141
dotted line : XC9142
solid line : XC9141
dotted line : XC9142
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current : IOUT [mA]
Output Current : IOUT [mA]
XC9141x33C / XC9142x33C
XC9141x33D / XC9142x33D
L=4.7μH(LQH5BPN4R7NT0L)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
L=2.2μH(LTF5022T2R2)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
IN
IN
3.40
3.40
3.38
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.22
3.20
3.38
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.22
3.20
VBAT=0.9, 1.2, 1.8, 2.5V
VBAT=0.9, 1.2, 1.8, 2.5V
solid line : XC9141
dotted line : XC9142
solid line : XC9141
dotted line : XC9142
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current : IOUT [mA]
Output Current : IOUT [mA]
XC9141x50C / XC9142x50C
XC9141x50D / XC9142x50D
L=4.7μH(LTF5022T4R7)
L=2.2μH(LTF5022T2R2)
C =10μF(GRM188R60J106M),CL=20μF(GRM188R60J106M x 2)
C =10μF(GRM188R60J106M),CL=20μF(GRM188R60J106M x 2)
IN
IN
5.10
5.08
5.06
5.10
5.08
5.06
VBAT=1.2, 1.8, 2.5, 3.7V
5.04
5.02
5.00
4.98
4.96
4.94
4.92
4.90
5.04
5.02
5.00
4.98
4.96
4.94
4.92
4.90
VBAT=1.2, 1.8, 2.5, 3.7V
solid line : XC9141
dotted line : XC9142
solid line : XC9141
dotted line : XC9142
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current : IOUT [mA]
Output Current : IOUT [mA]
18/34
XC9141/XC9142
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3) Ripple Voltage vs. Output Current
XC9141x18C / XC9142x18C
L=4.7μH(LQH5BPN4R7NT0L)
XC9141x18D / XC9142x18D
L=2.2μH(LQH5BPN2R2NT0L)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
IN
IN
100
100
solid line : XC9141
90
solid line : XC9141
dotted line : XC9142
90
80
70
60
50
40
30
20
10
0
dotted line : XC9142
80
70
60
VBAT=1.5V
VBAT=1.2V
VBAT=1.5V
VBAT=1.2V
50
V
BAT=0.9V
V
BAT=0.9V
40
30
20
10
0
VBAT=0.9, 1.2, 1.5V
VBAT=0.9, 1.2, 1.5V
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current : IOUT [mA]
Output Current : IOUT [mA]
XC9141x33C / XC9142x33C
XC9141x33D / XC9142x33D
L=4.7μH(LQH5BPN4R7NT0L)
L=2.2μH(LTF5022T2R2)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
IN
IN
100
100
solid line : XC9141
dotted line : XC9142
80
solid line : XC9141
dotted line : XC9142
90
90
80
70
70
60
60
VBAT=2.5V
VBAT=1.8V
VBAT=2.5V
50
VBAT=1.8V
VBAT=1.2V
VBAT=0.9V
50
40
30
20
10
0
V
BAT=1.2V
VBAT=0.9V
40
30
20
10
0
VBAT=0.9, 1.2, 1.8, 2.5V
V
BAT=0.9, 1.2, 1.8, 2.5V
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current : IOUT [mA]
Output Current : IOUT [mA]
XC9141x50C / XC9142x50C
L=4.7μH(LTF5022T4R7)
XC9141x50D / XC9142x50D
L=2.2μH(LTF5022T2R2)
C =10μF(GRM188R60J106M),CL=20μF(GRM188R60J106M x 2)
C =10μF(GRM188R60J106M),CL=20μF(GRM188R60J106M x 2)
IN
IN
100
100
solid line : XC9141
90
solid line : XC9141
dotted line : XC9142
90
dotted line : XC9142
80
80
70
70
VBAT=4.2V
VBAT=3.7V
VBAT=4.2V
60
60
VBAT=3.7V
50
50
40
30
20
10
0
VBAT=2.5V
VBAT=1.8V
V
BAT=2.5V
VBAT=1.8V
40
V
BAT=1.2V
VBAT=1.2, 1.8, 2.5, 3.7, 4.2V
V
BAT=1.2V
VBAT=1.2, 1.8, 2.5, 3.7, 4.2V
30
20
10
0
0.1
1
10
100
1000
0.1
1
10
100
1000
Output Current : IOUT [mA]
Output Current : IOUT [mA]
19/34
XC9141/XC9142 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Output Voltage vs. Ambient Temperature
XC9141x18C/XC9142x18C
L=4.7μH(LQH5BPN4R7NT0L)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
XC9141x33C/XC9142x33C
L=4.7μH(LQH5BPN4R7NT0L)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
IN
IN
1.90
3.40
1.88
1.86
1.84
1.82
1.80
1.78
1.76
1.74
1.72
1.70
3.38
3.36
3.34
3.32
3.30
3.28
3.26
3.24
3.22
3.20
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
(5) Quiescent Current vs. Output Voltage
XC9142x18C
XC9142x18D
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
5
Ta=-40℃
Ta= 25℃
Ta= 85℃
Ta=-40℃
Ta= 25℃
Ta= 85℃
0
0
1
2
3
4
5
6
1
2
3
4
5
6
Output Voltage : VOUT [V]
Output Voltage : VOUT[V]
(6) Supply Current vs. Output voltage
XC9141x50C / XC9142x50C
XC9141x50D / XC9142x50D
3.0
2.5
2.0
1.5
1.0
0.5
0.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Ta=-40℃
Ta= 25℃
Ta= 85℃
Ta=-40, 25, 85℃
1
2
3
4
5
6
1
2
3
4
5
6
Output Voltage : VOUT [V]
Output Voltage : VOUT [V]
20/34
XC9141/XC9142
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(7) Stand-byCurrent vs. Ambient Temperature
XC9141A / XC9142A
XC9141B / XC9142B
XC9142C / XC9142F
XC9141D / XC9142D
XC9141E/ XC9142E
5.0
4.0
3.0
5.0
4.0
3.0
2.0
1.0
0.0
VBAT=5.0V
V
BAT=3.3V
V
BAT=1.8V
VBAT=5.0V
2.0
VBAT=3.3V
VBAT=1.8V
1.0
0.0
-50
-25
0
25
50
75
100
100
6
-50
-25
0
25
50
75
100
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
(8) CL Discharge Resistance vs. Ambient Temperature
(9) Bypass SW Resistance vs. Ambient Temperature
XC9141A / XC9142A
XC9141D / XC9142D
XC9141B / XC9142B
XC9141E / XC9142E
400
350
400
VBAT=1.8V
350
300
250
200
150
100
50
VBAT=1.8V
300
250
200
150
VBAT=5.0V
VBAT=3.3V
100
50
VBAT=5.0V
BAT=3.3V
V
0
0
-50
-25
0
25
50
75
-50
-25
0
25
50
75
100
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
(10) Lx SW "Pch" ON Resistance vs. Ambient Temperature
(11) Lx SW "Nch" ON Resistance vs. Output Voltage
XC9141 / XC9142
XC9141 / XC9142
1.0
0.9
0.8
0.7
1.0
0.9
0.8
0.7
VBAT=1.8V
0.6
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Ta=-40℃
Ta= 25℃
Ta= 85℃
0.5
0.4
0.3
0.2
VBAT=5.0V
VBAT=3.3V
0.1
0.0
0
1
2
3
4
5
-50
-25
0
25
50
75 100
Output Voltage : VOUT(V)
Ambient Temperature : Ta[℃]
21/34
XC9141/XC9142 Series
■TYPICAL PERFO RMANCE CHARACTERISTICS (Continued)
(12) CE "H" Voltage vs. Ambient Temperature
(13) CE "L" Voltage vs. Ambient Temperature
XC9141 / XC9142
XC9141 / XC9142
0.8
0.7
0.6
0.8
0.7
0.6
0.5
0.5
VOUT =1.0, 1.8, 3.0, 5.0V
VOUT =1.0, 1.8, 3.0, 5.0V
0.4
0.3
0.2
0.4
0.3
0.2
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature : Ta(℃)
Ambient Temperature : Ta(℃)
(14) Lx SW "H" Leakage Current vs . Ambient temperture
(15) LxSW "L" Leakage Current vs . Ambient temperture
ꢀ ꢀ
ꢀ
ꢀ
XC9141A / XC9142A
XC9141B / XC9142B
XC9141D / XC9142D
XC9141E/ XC9142E
XC9142C / XC9142F
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
VLx=6.0V
VLx=6.0V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
(16) Oscillation Frequencyvs. Ambient temperture
XC9141xxxC / XC9142xxxC
XC9141xxxD / XC9142xxxD
L=2.2μH(LQH5BPN2R2NT0L)
L=4.7μH(LQH5BPN4R7NT0L)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
IN
IN
1.7
1.6
1.5
1.4
1.3
1.2
1.1
3.8
3.6
3.4
3.2
3.0
2.8
2.6
1.0
0.9
0.8
0.7
VOUT =5.0V
2.4
2.2
2.0
1.8
VOUT =5.0V
V
OUT =3.3V
V
OUT =3.3V
VOUT =1.8V
VOUT =1.8V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
22/34
XC9141/XC9142
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(17) Maximum Duty Cycle vs. Ambient temperture
XC9141xxxC / XC9142xxxC
XC9141xxxD / XC9142xxxD
100
95
100
95
90
90
VOUT =5.0V
OUT =3.3V
V
VOUT =5.0V
VOUT =3.3V
VOUT =1.8V
85
80
VOUT=1.8V
85
80
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
(18) Soft-Start Time vs. Ambient temperture
XC9141xxxC / XC9142xxxC
XC9141xxxD / XC9142xxxD
3.0
2.5
2.0
3.0
2.5
2.0
1.5
1.0
0.5
0.0
VOUT =1.8, 5.0V
1.5
VOUT =5.0V
OUT =1.8V
V
1.0
0.5
0.0
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
(19) PFM Switching Current vs. Input Voltage
XC9142x50C
XC9142x50D
L=4.7μH(LQH5BPN4R7NT0L)
L=2.2μH(LQH5BPN2R2NT0L)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
C =10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
IN
IN
250
225
200
175
250
225
200
175
Ta= -40℃
150
125
100
150
Ta= 25℃
Ta= 85℃
Ta= -40℃
Ta= 25℃
Ta= 85℃
125
100
0.0
1.0
2.0
3.0
4.0
5.0
6.0
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Input Voltage : VBAT[V]
Input Voltage : VBAT[V]
23/34
XC9141/XC9142 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(20) Operation Start Voltage vs. Ambient temperture
(21) Operation Hold Voltage vs. Ambient temperture
ꢀ
ꢀ
XC9141 / XC9142
XC9141 / XC9142
1.0
0.8
1.0
VOUT =5.0V
0.8
0.6
VOUT =1.8, 3.3V
0.6
0.4
0.2
0.0
VOUT =5.0V
0.4
0.2
VOUT =3.3V
V
OUT =1.8V
0.0
-50
-25
0
25
50
75 100
-50
-25
0
25
50
75
100
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
(22) Current Limit vs. Ambient temperture
XC9141xxxC / XC9142xxxC
XC9141xxxD / XC9142xxxD
2.2
2.0
2.2
2.0
1.8
1.6
1.4
1.2
1.0
VOUT =5.0V
1.8
1.6
1.4
1.2
1.0
VOUT =5.0V
VOUT=3.3V
VOUT=3.3V
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
24/34
XC9141/XC9142
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(23) Integral Latch Time vs. Ambient temperature
XC9141DxxC / XC9142DxxC
XC9141ExxC / XC9142ExxC
XC9142FxxC
XC9141DxxC / XC9142DxxC
XC9141ExxC / XC9142ExxC
XC9142FxxC
L=4.7μH(LTF5022T4R7)
L=4.7μH(LTF5022T4R7)
CIN=10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
CIN=10μF(GRM188R60J106M),CL=10μF(GRM188R60J106M)
180
400
150
360
VOUT=3.3V
VOUT=3.3V
120
90
320
280
VOUT=5.0V
VOUT=5.0V
240
60
200
30
‐50
‐25
0
25
50
75
100
‐50
‐25
0
25
50
75
100
Ambient Temperature : Ta[℃]
Ambient Temperature : Ta[℃]
(24) Latch Release Voltage vs. Ambient temperature
XC9141D / XC9142D
XC9141E / XC9142E
XC9142F
1.5
1.4
1.3
1.2
1.1
1.0
0.9
‐50
‐25
0
25
50
75
100
Ambient Temperture : Ta[℃]
25/34
XC9141/XC9142 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(25) Load Transient Response
26/34
XC9141/XC9142
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(25) Load Transient Response
27/34
XC9141/XC9142 Series
■PACKAGING INFORMATION
●SOT-25 (unit: mm)
●USP-6C (unit: mm)
2.9±0.2
+0.1
-0.05
0.4
5
1
4
3
0～0.1
2
+0.1
-0.05
0.15
(0.95)
1.9±0.2
●WLP-6-01 (unit: mm)
1.08±0.03
1pin INDENT
(0.290)
1
6
5
4
2
3
(0.5)
28/34
XC9141/XC9142
Series
■PACKAGING INFORMATION (Continued)
●USP-6C Reference Pattern Layout (unit: mm)
●USP-6C Reference Metal Mask Design (unit: mm)
●WLP-6-01 Reference Pattern Layout / Reference Pattern Layout detail (unit: mm)
PCB
0.20
(0.5)
0.32
resist
●WLP-6-01 Reference Metal Mask Design (unit: mm)
29/34
XC9141/XC9142 Series
●SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient:
Natural convection
Soldering: Lead (Pb) free
Board:
Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
in top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material:
Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
Power Dissipation Pd（mW）
Thermal Resistance (℃/W)
166.67
25
85
600
240
Pd vs. Ta
700
600
500
400
300
200
100
0
25
45
65
85
105
125
Ambient Temperature Ta (℃)
30/34
XC9141/XC9142
Series
●USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition:
Ambient:
Soldering:
Board:
Mount on a board
Natural convection
Lead (Pb) free
Dimensions 40mm×40mm (1600mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
in top and back faces
Package heat-sink is tied to the copper traces
Glass Epoxy (FR-4)
Material:
Thickness:
1.6mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max=125℃)
Ambient Temperature (℃)
Power Dissipation Pd (mW)
Thermal Resistance (℃/W)
25
85
1000
400
100.00
Pd vs. Ta
1200
1000
800
600
400
200
0
25
45
65
85
105
125
Ambient Temperature Ta (℃)
31/34
XC9141/XC9142 Series
●WLP-6-01 Power Dissipation
Power dissipation data for the WLP-6-01 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described condition.
1. Measurement Condition (Reference data)
Condition:
Ambient:
Soldering:
Board:
Mount on a board
Natural convection
Lead (Pb) free
40mm×40mm (1600mm2 in one side
1st Metal Layer about 50%
2nd Inner Metal Layer about 50%
3rd Inner Metal Layer about 50%
4th Metal Layer about 50%
Glass Epoxy (FR-4)
Metal Area:
Material:
Thickness:
1.6mm
Through-hole: 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max=125℃)
Ambient Temperature (℃)
Power Dissipation Pd (mW)
Thermal Resistance (℃/W)
25
85
700
280
142.86
Pd vs. Ta
Ambient Temperature Ta (℃)
32/34
XC9141/XC9142
Series
■MARKING RULE
SOT-25 (Under dot)
USP-6C
WLP-6-01
1
2
3
4
1
2
3
6
5
4
6
5
Enlarge
① represents products series
MARK
PRODUCT SERIES
Y
Z
XC9141/42A/B/C/D/Sxxxxx-G
XC9141/42E/Fxxxxx-G
② represents products series, Oscillation Frequency, and output voltage range
OUTPUT VOLTAGE RANGE [V]
OSCILLATION
FREQUENCY
PRODUCT SERIES
SERIES
1.8～3.7
3.8～5.5
XC9141A
XC9141B
XC9141D
XC9141E
XC9141A
XC9141B
XC9141D
XC9141E
XC9142A
XC9142B
XC9142C
XC9142D
XC9142E
XC9142F
XC9142A
XC9142B
XC9142C
XC9142D
XC9142E
XC9142F
0
2
1
3
XC9141AxxCxx-G
XC9141BxxCxx-G
XC9141DxxCxx-G
XC9141ExxCxx-G
XC9141AxxDxx-G
XC9141BxxDxx-G
XC9141DxxDxx-G
XC9141ExxDxx-G
XC9142AxxCxx-G
XC9142BxxCxx-G
XC9142CxxCxx-G
XC9142DxxCxx-G
XC9142ExxCxx-G
XC9142FxxCxx-G
XC9142AxxDxx-G
XC9142BxxDxx-G
XC9142CxxDxx-G
XC9142DxxDxx-G
XC9142ExxDxx-G
XC9142FxxDxx-G
1.2MHz
3.0MHz
8
9
A
4
B
5
6
7
R
C
A
C
E
V
E
H
H
L
U
D
B
D
F
X
F
K
K
M
P
Z
M
P
1.2MHz
3.0MHz
N
Y
L
N
③ represents output voltage
MARK
OUTPUT VOLTAGE [V]
MARK
OUTPUT VOLTAGE [V]
0
1
2
3
4
5
6
7
8
9
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
A
B
C
D
E
F
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
-
H
K
L
M
-
④,⑤ represents production lot number
01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
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XC9141/XC9142 Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
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